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FR2763343B1 - Procede de depot d'une couche de matiere sur un substrat a l'aide d'un systeme de placage - Google Patents

Procede de depot d'une couche de matiere sur un substrat a l'aide d'un systeme de placage

Info

Publication number
FR2763343B1
FR2763343B1 FR9806021A FR9806021A FR2763343B1 FR 2763343 B1 FR2763343 B1 FR 2763343B1 FR 9806021 A FR9806021 A FR 9806021A FR 9806021 A FR9806021 A FR 9806021A FR 2763343 B1 FR2763343 B1 FR 2763343B1
Authority
FR
France
Prior art keywords
depositing
substrate
material layer
plating system
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9806021A
Other languages
English (en)
Other versions
FR2763343A1 (fr
Inventor
Cindy Reidsema Simpson
Matthew T Herrick
Gregory S Etherington
James Derek Legg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of FR2763343A1 publication Critical patent/FR2763343A1/fr
Application granted granted Critical
Publication of FR2763343B1 publication Critical patent/FR2763343B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/66—Electroplating: Baths therefor from melts
    • C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/07—Current distribution within the bath

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
FR9806021A 1997-05-14 1998-05-13 Procede de depot d'une couche de matiere sur un substrat a l'aide d'un systeme de placage Expired - Fee Related FR2763343B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/856,459 US6174425B1 (en) 1997-05-14 1997-05-14 Process for depositing a layer of material over a substrate

Publications (2)

Publication Number Publication Date
FR2763343A1 FR2763343A1 (fr) 1998-11-20
FR2763343B1 true FR2763343B1 (fr) 2000-11-24

Family

ID=25323684

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9806021A Expired - Fee Related FR2763343B1 (fr) 1997-05-14 1998-05-13 Procede de depot d'une couche de matiere sur un substrat a l'aide d'un systeme de placage

Country Status (13)

Country Link
US (3) US6174425B1 (fr)
JP (1) JP3326112B2 (fr)
KR (1) KR100329454B1 (fr)
CN (1) CN1143906C (fr)
BR (1) BR9801617A (fr)
DE (1) DE19820878B4 (fr)
FR (1) FR2763343B1 (fr)
GB (2) GB2325242A (fr)
IT (1) IT1299444B1 (fr)
MY (1) MY126502A (fr)
NL (1) NL1009157C2 (fr)
SG (1) SG71111A1 (fr)
TW (1) TW372330B (fr)

Families Citing this family (96)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6599412B1 (en) * 1997-09-30 2003-07-29 Semitool, Inc. In-situ cleaning processes for semiconductor electroplating electrodes
US6174425B1 (en) 1997-05-14 2001-01-16 Motorola, Inc. Process for depositing a layer of material over a substrate
WO1999016936A1 (fr) * 1997-09-30 1999-04-08 Semitool, Inc. Systeme d'electrodeposition pourvu d'une electrode auxiliaire exterieure a la chambre de reaction principale et destinee au nettoyage par contact
US6921468B2 (en) * 1997-09-30 2005-07-26 Semitool, Inc. Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
US6936153B1 (en) * 1997-09-30 2005-08-30 Semitool, Inc. Semiconductor plating system workpiece support having workpiece-engaging electrode with pre-conditioned contact face
US6126798A (en) * 1997-11-13 2000-10-03 Novellus Systems, Inc. Electroplating anode including membrane partition system and method of preventing passivation of same
TWI223678B (en) * 1998-03-20 2004-11-11 Semitool Inc Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
US6565729B2 (en) * 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
DE69929967T2 (de) 1998-04-21 2007-05-24 Applied Materials, Inc., Santa Clara Elektroplattierungssystem und verfahren zur elektroplattierung auf substraten
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US6251235B1 (en) * 1999-03-30 2001-06-26 Nutool, Inc. Apparatus for forming an electrical contact with a semiconductor substrate
US7427337B2 (en) 1998-12-01 2008-09-23 Novellus Systems, Inc. System for electropolishing and electrochemical mechanical polishing
US6585876B2 (en) * 1999-04-08 2003-07-01 Applied Materials Inc. Flow diffuser to be used in electro-chemical plating system and method
US6551484B2 (en) * 1999-04-08 2003-04-22 Applied Materials, Inc. Reverse voltage bias for electro-chemical plating system and method
US20030038035A1 (en) * 2001-05-30 2003-02-27 Wilson Gregory J. Methods and systems for controlling current in electrochemical processing of microelectronic workpieces
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7438788B2 (en) * 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
EP1194613A4 (fr) * 1999-04-13 2006-08-23 Semitool Inc Processeur de pieces comportant une chambre de traitement a ecoulement de fluide de traitement ameliore
US7264698B2 (en) * 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7020537B2 (en) * 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7585398B2 (en) * 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US6368475B1 (en) * 2000-03-21 2002-04-09 Semitool, Inc. Apparatus for electrochemically processing a microelectronic workpiece
US6297155B1 (en) * 1999-05-03 2001-10-02 Motorola Inc. Method for forming a copper layer over a semiconductor wafer
US6413858B1 (en) * 1999-08-27 2002-07-02 Micron Technology, Inc. Barrier and electroplating seed layer
US6217727B1 (en) * 1999-08-30 2001-04-17 Micron Technology, Inc. Electroplating apparatus and method
US20020000380A1 (en) * 1999-10-28 2002-01-03 Lyndon W. Graham Method, chemistry, and apparatus for noble metal electroplating on a microelectronic workpiece
US6547937B1 (en) * 2000-01-03 2003-04-15 Semitool, Inc. Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece
US6231743B1 (en) 2000-01-03 2001-05-15 Motorola, Inc. Method for forming a semiconductor device
US6454916B1 (en) * 2000-01-05 2002-09-24 Advanced Micro Devices, Inc. Selective electroplating with direct contact chemical polishing
US8475636B2 (en) * 2008-11-07 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US8308931B2 (en) * 2006-08-16 2012-11-13 Novellus Systems, Inc. Method and apparatus for electroplating
US20050183959A1 (en) * 2000-04-13 2005-08-25 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectric workpiece
US6913680B1 (en) * 2000-05-02 2005-07-05 Applied Materials, Inc. Method of application of electrical biasing to enhance metal deposition
JP2001316887A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd メッキ処理装置
US6808612B2 (en) 2000-05-23 2004-10-26 Applied Materials, Inc. Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
WO2001090434A2 (fr) * 2000-05-24 2001-11-29 Semitool, Inc. Reglage d'electrodes utilisees dans un reacteur pour le traitement electrochimique d'une piece micro-electronique
JP3379755B2 (ja) * 2000-05-24 2003-02-24 インターナショナル・ビジネス・マシーンズ・コーポレーション 金属めっき装置
US6436267B1 (en) * 2000-08-29 2002-08-20 Applied Materials, Inc. Method for achieving copper fill of high aspect ratio interconnect features
US7074113B1 (en) * 2000-08-30 2006-07-11 Micron Technology, Inc. Methods and apparatus for removing conductive material from a microelectronic substrate
US7220166B2 (en) * 2000-08-30 2007-05-22 Micron Technology, Inc. Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
US7078308B2 (en) * 2002-08-29 2006-07-18 Micron Technology, Inc. Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate
US7160176B2 (en) 2000-08-30 2007-01-09 Micron Technology, Inc. Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
US7153410B2 (en) * 2000-08-30 2006-12-26 Micron Technology, Inc. Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
US7134934B2 (en) * 2000-08-30 2006-11-14 Micron Technology, Inc. Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium
US7153195B2 (en) * 2000-08-30 2006-12-26 Micron Technology, Inc. Methods and apparatus for selectively removing conductive material from a microelectronic substrate
US7094131B2 (en) 2000-08-30 2006-08-22 Micron Technology, Inc. Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material
US7129160B2 (en) * 2002-08-29 2006-10-31 Micron Technology, Inc. Method for simultaneously removing multiple conductive materials from microelectronic substrates
US7112121B2 (en) * 2000-08-30 2006-09-26 Micron Technology, Inc. Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
US7192335B2 (en) 2002-08-29 2007-03-20 Micron Technology, Inc. Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
EP1470268A2 (fr) * 2000-10-03 2004-10-27 Applied Materials, Inc. Technique et dispositif connexe permettant d'incliner un substrat avant electrodeposition
JP2002173794A (ja) * 2000-12-05 2002-06-21 Electroplating Eng Of Japan Co カップ式めっき装置
US20040020780A1 (en) * 2001-01-18 2004-02-05 Hey H. Peter W. Immersion bias for use in electro-chemical plating system
US6932896B2 (en) * 2001-03-30 2005-08-23 Nutool, Inc. Method and apparatus for avoiding particle accumulation in electrodeposition
DE10134680A1 (de) * 2001-07-20 2003-02-06 Endress & Hauser Gmbh & Co Kg Schaltungsanrdnung für einen kapazitiven Sensor
US6751391B2 (en) * 2001-07-24 2004-06-15 Agilent Technologies, Inc. Optical systems incorporating waveguides and methods of manufacture
US6630360B2 (en) 2002-01-10 2003-10-07 Advanced Micro Devices, Inc. Advanced process control (APC) of copper thickness for chemical mechanical planarization (CMP) optimization
US7854828B2 (en) * 2006-08-16 2010-12-21 Novellus Systems, Inc. Method and apparatus for electroplating including remotely positioned second cathode
US6911136B2 (en) * 2002-04-29 2005-06-28 Applied Materials, Inc. Method for regulating the electrical power applied to a substrate during an immersion process
US7247223B2 (en) * 2002-05-29 2007-07-24 Semitool, Inc. Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces
US20040108212A1 (en) * 2002-12-06 2004-06-10 Lyndon Graham Apparatus and methods for transferring heat during chemical processing of microelectronic workpieces
TW200422443A (en) * 2003-02-18 2004-11-01 Applied Materials Inc Method for immersing a substrate
US20040206628A1 (en) * 2003-04-18 2004-10-21 Applied Materials, Inc. Electrical bias during wafer exit from electrolyte bath
US20040222101A1 (en) * 2003-04-18 2004-11-11 Applied Materials, Inc. Contact ring spin during idle time and deplate for defect reduction
US20050026416A1 (en) * 2003-07-31 2005-02-03 International Business Machines Corporation Encapsulated pin structure for improved reliability of wafer
US7112122B2 (en) * 2003-09-17 2006-09-26 Micron Technology, Inc. Methods and apparatus for removing conductive material from a microelectronic substrate
US7150820B2 (en) * 2003-09-22 2006-12-19 Semitool, Inc. Thiourea- and cyanide-free bath and process for electrolytic etching of gold
US20050067274A1 (en) * 2003-09-30 2005-03-31 Shao-Yu Ting [electroplating apparatus]
US7135357B2 (en) * 2003-10-06 2006-11-14 E. I. Du Pont De Nemours And Company Process for making an organic electronic device having a roughened surface heat sink
US7153777B2 (en) * 2004-02-20 2006-12-26 Micron Technology, Inc. Methods and apparatuses for electrochemical-mechanical polishing
US20060043534A1 (en) * 2004-08-26 2006-03-02 Kirby Kyle K Microfeature dies with porous regions, and associated methods and systems
US7566391B2 (en) 2004-09-01 2009-07-28 Micron Technology, Inc. Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media
US20060175201A1 (en) * 2005-02-07 2006-08-10 Hooman Hafezi Immersion process for electroplating applications
TW200641189A (en) * 2005-02-25 2006-12-01 Applied Materials Inc Counter electrode encased in cation exchange membrane tube for electroplating cell
FR2883889B1 (fr) * 2005-04-04 2007-06-08 Commissariat Energie Atomique Electrode de reduction pour depot de metal par oxydoreduction.
US20060276024A1 (en) * 2005-06-03 2006-12-07 Jian Wang Process for forming an electronic device including workpieces and a conductive member therebetween
US9822461B2 (en) 2006-08-16 2017-11-21 Novellus Systems, Inc. Dynamic current distribution control apparatus and method for wafer electroplating
US20090114542A1 (en) * 2007-11-06 2009-05-07 Spansion Llc Process of forming an electronic device including depositing a conductive layer over a seed layer
CN101457379B (zh) * 2007-12-14 2012-05-30 盛美半导体设备（上海）有限公司 在半导体工件上电镀金属的电镀装置
US7749884B2 (en) * 2008-05-06 2010-07-06 Astrowatt, Inc. Method of forming an electronic device using a separation-enhancing species
WO2009143026A2 (fr) * 2008-05-17 2009-11-26 Astrowatt, Inc. Procédé permettant de fabriquer un dispositif électronique grâce à une technique de séparation
US8858774B2 (en) 2008-11-07 2014-10-14 Novellus Systems, Inc. Electroplating apparatus for tailored uniformity profile
DE102009023768A1 (de) * 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum Steuern von elektrochemischen Oberflächenprozessen
CN101724869B (zh) * 2009-12-18 2011-06-22 北京有色金属研究总院 一种离子液体添加剂在瓦特电镀镍溶液中的应用
EP2434591A3 (fr) * 2010-09-28 2012-05-02 Tyco Electronics France SAS Connecteur électrique protégé contre la corrosion
TWI404833B (zh) * 2011-01-26 2013-08-11 Zhen Ding Technology Co Ltd 電鍍系統及電鍍方法
US8575025B2 (en) 2011-07-28 2013-11-05 Hewlett-Packard Development Company, L.P. Templated circuitry fabrication
US9909228B2 (en) 2012-11-27 2018-03-06 Lam Research Corporation Method and apparatus for dynamic current distribution control during electroplating
US9752248B2 (en) 2014-12-19 2017-09-05 Lam Research Corporation Methods and apparatuses for dynamically tunable wafer-edge electroplating
US9567685B2 (en) 2015-01-22 2017-02-14 Lam Research Corporation Apparatus and method for dynamic control of plated uniformity with the use of remote electric current
US9689082B2 (en) 2015-04-14 2017-06-27 Applied Materials, Inc. Electroplating wafers having a notch
US9988733B2 (en) 2015-06-09 2018-06-05 Lam Research Corporation Apparatus and method for modulating azimuthal uniformity in electroplating
WO2017037480A1 (fr) * 2015-09-03 2017-03-09 Mccormack Brian James Dispositif de collecte de selles et dispositif d'échantillonnage des selles
CN110168145B (zh) 2016-07-13 2021-08-06 英奥创公司 电化学方法、组件和组成
CN106531626A (zh) * 2016-11-08 2017-03-22 湖南文理学院 一种改善多孔硅径向物理微结构均匀性的新方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2751340A (en) 1952-10-17 1956-06-19 Clevite Corp Method of plating
US2859166A (en) 1955-09-15 1958-11-04 Pennsalt Chemicals Corp Shielding means for effecting uniform plating of lead dioxide in the formation of lead dioxide electrodes
US3880725A (en) * 1974-04-10 1975-04-29 Rca Corp Predetermined thickness profiles through electroplating
JPS5412845A (en) 1977-06-30 1979-01-30 Ricoh Co Ltd Multicolor copier
US4148707A (en) 1977-07-08 1979-04-10 Heritage Silversmiths Limited Electrochemical finishing of stainless steel
JPS54128945A (en) 1978-03-30 1979-10-05 Sumitomo Metal Ind Ltd Electroplating method
US4420382A (en) 1980-01-18 1983-12-13 Alcan International Limited Method for controlling end effect on anodes used for cathodic protection and other applications
US4304641A (en) 1980-11-24 1981-12-08 International Business Machines Corporation Rotary electroplating cell with controlled current distribution
GB2089838A (en) 1980-12-22 1982-06-30 Alcan Int Ltd Jigs for electrochemical treatment of elongated workpieces
US4421627A (en) 1982-05-24 1983-12-20 Lincoln Plating Company Article holder for electroplating process
US4466864A (en) * 1983-12-16 1984-08-21 At&T Technologies, Inc. Methods of and apparatus for electroplating preselected surface regions of electrical articles
US4720329A (en) 1984-09-17 1988-01-19 Microsurface Technology Corp. Apparatus and method for the electrolytic plating of layers onto computer memory hard discs
US4678545A (en) 1986-06-12 1987-07-07 Galik George M Printed circuit board fine line plating
GB8809750D0 (en) 1988-04-25 1988-06-02 Beckswift Ltd Electrical apparatus
US5230743A (en) 1988-05-25 1993-07-27 Semitool, Inc. Method for single wafer processing in which a semiconductor wafer is contacted with a fluid
US4879007B1 (en) 1988-12-12 1999-05-25 Process Automation Int L Ltd Shield for plating bath
US5368711A (en) * 1990-08-01 1994-11-29 Poris; Jaime Selective metal electrodeposition process and apparatus
US5135636A (en) * 1990-10-12 1992-08-04 Microelectronics And Computer Technology Corporation Electroplating method
SE467976B (sv) 1991-02-20 1992-10-12 Dcm Innovation Ab Anordning foer elektroplaetering, vid framstaellning av matriser foer tillverkning av t ex cd-skivor samt foerfarande foer tillverkning av matriser medelst anordningen
US5149419A (en) 1991-07-18 1992-09-22 Eastman Kodak Company Method for fabricating long array orifice plates
US5312532A (en) 1993-01-15 1994-05-17 International Business Machines Corporation Multi-compartment eletroplating system
US5332487A (en) 1993-04-22 1994-07-26 Digital Equipment Corporation Method and plating apparatus
GB9325297D0 (en) 1993-12-10 1994-02-16 Process Automation Internation Improvements in or relating to clamps and the use thereof
FR2725215B1 (fr) 1994-09-29 1996-11-22 Lorraine Laminage Cellule d'electrodeposition en continu d'alliages metalliques
US5620581A (en) * 1995-11-29 1997-04-15 Aiwa Research And Development, Inc. Apparatus for electroplating metal films including a cathode ring, insulator ring and thief ring
DE19547948C1 (de) 1995-12-21 1996-11-21 Atotech Deutschland Gmbh Verfahren und Schaltungsanordnung zur Erzeugung von Strompulsen zur elektrolytischen Metallabscheidung
US5662788A (en) * 1996-06-03 1997-09-02 Micron Technology, Inc. Method for forming a metallization layer
US5980706A (en) * 1996-07-15 1999-11-09 Semitool, Inc. Electrode semiconductor workpiece holder
US6174425B1 (en) 1997-05-14 2001-01-16 Motorola, Inc. Process for depositing a layer of material over a substrate

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US7323094B2 (en) 2008-01-29
KR19980087024A (ko) 1998-12-05
ITRM980277A1 (it) 1999-10-29
MY126502A (en) 2006-10-31
ITRM980277A0 (it) 1998-04-29
CN1143906C (zh) 2004-03-31
MX9803339A (es) 1998-12-31
CN1204702A (zh) 1999-01-13
FR2763343A1 (fr) 1998-11-20
GB2325242A (en) 1998-11-18
BR9801617A (pt) 1999-06-08
SG71111A1 (en) 2000-03-21
TW372330B (en) 1999-10-21
IT1299444B1 (it) 2000-03-16
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US6500324B1 (en) 2002-12-31
US20020195347A1 (en) 2002-12-26
US6174425B1 (en) 2001-01-16
DE19820878B4 (de) 2011-03-03
GB9809856D0 (en) 1998-07-08
GB0111315D0 (en) 2001-07-04
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NL1009157A1 (nl) 1998-11-17
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