FR2617668A1 - Device comprising an electronic circuit mounted on a flexible support and flexible board comprising it - Google Patents
Device comprising an electronic circuit mounted on a flexible support and flexible board comprising it Download PDFInfo
- Publication number
- FR2617668A1 FR2617668A1 FR8709445A FR8709445A FR2617668A1 FR 2617668 A1 FR2617668 A1 FR 2617668A1 FR 8709445 A FR8709445 A FR 8709445A FR 8709445 A FR8709445 A FR 8709445A FR 2617668 A1 FR2617668 A1 FR 2617668A1
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- Prior art keywords
- circuit
- resin
- flexible
- support
- electronic circuit
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83909—Post-treatment of the layer connector or bonding area
- H01L2224/83951—Forming additional members, e.g. for reinforcing, fillet sealant
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
'DISPOSITIF COMPORTANT UN CIRCUIT ELECTRONIQUE MONTE SUR UN
SUPPORT SOUPLE ET CARTE SOUPLE LE COMPRENANT".'DEVICE COMPRISING AN ELECTRONIC CIRCUIT MOUNTED ON A
FLEXIBLE SUPPORT AND FLEXIBLE CARD INCLUDING SAME ".
Le présente invention a pour objet un dispositif comportant un circuit électronique monté solidairement sur un support souple comportant au moins une piste conductrice à laquelle une face supérieure dudit circuit est reliée par au moins un fil conducteur, ledit montage étant obtenu d'une part par solidarisation d'une face inférieure du circuit électronique et du support souple et d'autre part par adjonction d'une résine. The present invention relates to a device comprising an electronic circuit mounted integrally on a flexible support comprising at least one conductive track to which an upper face of said circuit is connected by at least one conductive wire, said assembly being obtained on the one hand by securing of a lower face of the electronic circuit and of the flexible support and on the other hand by the addition of a resin.
Un tel dispositif est connu de la demande de brevet français n0 2 583 574 (Société EUROTECHNIQUE). Dans celui-ci, ladite résine enrobe complètement le circuit et les fils de conduction. Such a device is known from French patent application No. 2,583,574 (EUROTECHNIQUE company). In it, said resin completely coats the circuit and the conduction wires.
Un tel enrobage présente l'inconvénient que la reproductibilité du contour de l'enrobage est difficile à ossu: rer, ce qui conduit à des problèmes de montage lorsque le dispositif est dans un logement d'une carte souple, telle qu'une carte à mémoire et/ou à microprocesseur. Such a coating has the disadvantage that the reproducibility of the contour of the coating is difficult to ossu: rer, which leads to mounting problems when the device is in a housing of a flexible card, such as a card to memory and / or microprocessor.
D'une manière générale, la solidarisation de la face inférieure du circuit électronique et du support souple, est réalisée à l'aide d'un matériau adhésif et conducteur, par exemple une résine époxy chargée à l'argent. In general, the attachment of the underside of the electronic circuit and the flexible support is carried out using an adhesive and conductive material, for example an epoxy resin loaded with silver.
Un tel matériau ne peut assurer à lui seul la tenue mécanique du circuit sur son support lors des tests mécaniques normalisés de flexion et de torsion auxquels doivent satisfaire lesdites cartes souples. Such a material cannot by itself ensure the mechanical strength of the circuit on its support during standardized mechanical bending and twisting tests which said flexible cards must satisfy.
L'invention se propose donc d'assurer la bonne tenue mécanique du circuit sur son support sans toutefois perturber le montage ultérieur du dispositif dans un logement tel que celui d'une carte souple, tout en étant en outre obtenu avec une bien moins grande quantité de résine. The invention therefore proposes to ensure the good mechanical strength of the circuit on its support without, however, disturbing the subsequent mounting of the device in a housing such as that of a flexible card, while also being obtained with a much smaller quantity. resin.
Dans ce but, l'invention est caractérisée en ce que ladite résine est disposée sur au moins deux bords latéraux opposés du circuit à savoir un premier et un deuxième bord latéral et déborde au moins partiellement sur une troisième et un quatrième bord latéral ces derniers étant adjacents auxdits premier et deuxième bords latéraux de manière à solidariser les premier, deuxième, troisième et quatrième bords latéraux et le support sans enrober aucun fil conducteur. For this purpose, the invention is characterized in that the said resin is placed on at least two opposite lateral edges of the circuit, namely a first and a second lateral edge and extends at least partially over a third and a fourth lateral edge, the latter being adjacent to said first and second side edges so as to secure the first, second, third and fourth side edges and the support without coating any conductive wire.
Selon un mode de réalisation avantageux, la résine est disposée sur tout le pourtour des bords latéraux du circuit. According to an advantageous embodiment, the resin is arranged around the entire periphery of the lateral edges of the circuit.
Selon un mode de réalisation préféré, au moins lesdits troisième et quatrième bords latéraux sont adjacents à une couche revêtant le support, de manière à produire des camaux facilitant l'écoulement de la, résine par capillarité après sa dépose. According to a preferred embodiment, at least said third and fourth lateral edges are adjacent to a layer coating the support, so as to produce camals facilitating the flow of the resin by capillary action after its removal.
L'invention sera mieux comprise à la lecture de la description qui va suivre donnée à titre d'exemple non limitatif en liaison avec les dessins qui représentent - la figure 1 un dispositif selon l'art antérieur précité - les figures 2a et 2b, 3a et 3b, 4a et 4b illustrent, en vue, de dessus, et en coupe verticale suivant AA' des étapes du procédé de réalisation d'un dispositif selon l'invention - la figure 5 montre une variante du dispositif selon l'invention - la figure 6 montre un dispositif selon l'invention après insertion dans un logement d'une carte souple. The invention will be better understood on reading the description which follows given by way of nonlimiting example in connection with the drawings which represent - FIG. 1 a device according to the aforementioned prior art - FIGS. 2a and 2b, 3a and 3b, 4a and 4b illustrate, in top view, and in vertical section along AA ′, steps of the method for producing a device according to the invention - FIG. 5 shows a variant of the device according to the invention - the Figure 6 shows a device according to the invention after insertion into a housing of a flexible card.
A la figure 1, un dispositif selon l'art antérieur comporte une pastille de circuit intégré 1 fixée de manière conductrice à un film métallique 2 collé sur la face externe d'un film plastique 5. Ce film plastique 5 présente une ouverture 6 correspondant à la pastille 1 et des ouvertures 7 correspondant au passage de fils de connexion 4 soudés à la face supérieure de la pastille 1 et au fil métallique 2. La bande métallique 2 est gravée de manière à séparer électriquement par des bandes 3 la partie centrale où est disposée la pastille et les parties latérales recevant les extrémités des con nexions 4. In FIG. 1, a device according to the prior art comprises an integrated circuit patch 1 fixed in a conductive manner to a metal film 2 bonded to the external face of a plastic film 5. This plastic film 5 has an opening 6 corresponding to the patch 1 and openings 7 corresponding to the passage of connection wires 4 welded to the upper face of the patch 1 and to the metal wire 2. The metal strip 2 is etched so as to electrically separate the central part by strips 3 arranged the patch and the lateral parts receiving the ends of the connections 4.
A la fin du montage, la face supérieure du dispositif est noyée dans une résine de protection 8 déposée à chaud, par exemple du chlorure de polyvinyle (PVC). At the end of assembly, the upper face of the device is embedded in a protective resin 8 hot deposited, for example polyvinyl chloride (PVC).
Cette résine de protection 8 forme un dôme dont le contour n'est pas reproductible et qui doit en outre être suffisamment haut pour que les fils 4 soient entièrement enrobés, faute de quoi il y aurait une grande fragilité mécanique. This protective resin 8 forms a dome whose outline is not reproducible and which must also be high enough for the wires 4 to be fully coated, otherwise there would be great mechanical fragility.
Cette hauteur n'est pas reproductible.This height is not reproducible.
Selon les figures 2a et 2b, un circuit électronique, par exenple une pastille semi-conductrice 10 est collé de manière conductrice sur une couche conductrice 40, en l'espèce une feuille de cuivre sur laquelle sont déposées électrolytiquement une couche de nickel, puis une couche d'or, disposée à la face inférieure d'une couche isolante, en l'espèce un film polyester 20. La-couche isolante 20 et la couche conductrice 40 forment un support souple. La couche de colle conductrice peut être une résine époxy chargée à l'argent. Cette colle adhère en 30 à la surface inférieure de la pastille 10 et en 31 aux faces latérales de la pastille 10. La couche 40 présente des ouvertures 41 la séparant électriquement en différentes zones 42 permettant d'isoler les prises de contact électrique. According to FIGS. 2a and 2b, an electronic circuit, for example a semiconductor wafer 10 is bonded in a conductive manner to a conductive layer 40, in this case a copper sheet on which an nickel layer is electrolytically deposited, then a gold layer, disposed on the underside of an insulating layer, in this case a polyester film 20. The insulating layer 20 and the conductive layer 40 form a flexible support. The layer of conductive adhesive can be a silver-charged epoxy resin. This adhesive adheres at 30 to the lower surface of the patch 10 and at 31 to the lateral faces of the patch 10. The layer 40 has openings 41 electrically separating it into different zones 42 making it possible to isolate the electrical contact sockets.
Des puits 21 traversent la couche isolante 20 de manière à permettre la mise en place par soudure ultra-sonsde fils de connexion 60 entre la face supérieure de la pastille 10 et les zones correspondantes 42 (voir fig. 3a et 3b).Wells 21 pass through the insulating layer 20 so as to allow the establishment, by ultrasonic welding, of connection wires 60 between the upper face of the patch 10 and the corresponding zones 42 (see FIGS. 3a and 3b).
On trouvera une description plus détaillée d'un exemple de mise en oeuvre dans la demande de brevet français
FR 2 580 416 déposée par la Demanderesse le 12 avril 1985 et intitulée "Procédé et dispositif pour fabriquer une carte d'identification électronique".A more detailed description of an example of implementation can be found in the French patent application.
FR 2 580 416 filed by the Applicant on April 12, 1985 and entitled "Method and device for manufacturing an electronic identification card".
Selon les figures 4a et 4b, une résine polyérisa- ble, par exemple une résine époxy, est déposée en 70 le long de deux bords opposés de la pastille semiconductrice 10. La résine est dosée de manière que, après un palier de température suffisant pour ramollir la résine sans le polymériser, celle-ci flue le long de canaux 11 entre deux autres cotés op posés de la pastille 10 et les bords adjacents de la couche isolante 20, de manière à former deux zones 71 de résine rejoignant les régions 31 de la colle conductrice. Du fait de ce fluage , la forme des zones 71 revêt latéralement (fig.4b) un profil progressif qui d'une part augmente la surface d'adhérence et d'autre part évite toute rupture de section qui serait favorable à des ruptures mécaniques lors de l'utilisation.En outre, dans l'exemple représenté, les zones 71 sont situées en dessous des fils conducteurs 60 qui restent donc non enrobés. Ceci évite d'avoir à les enrober complètement car aucun enrobage partiel n'est mécaniquement sur En outre, les zones 70 et 71 de résine ne débordent pas en hauteur au dessus de la face supérieure de la pastille 10, ce qui n'introduit aucun inconvénient lors du montage ultérieur dans le logement d'une carte. According to FIGS. 4a and 4b, a polyerisable resin, for example an epoxy resin, is deposited at 70 along two opposite edges of the semiconductor wafer 10. The resin is dosed so that, after a temperature plateau sufficient for soften the resin without polymerizing it, it flows along channels 11 between two other opposite sides of the patch 10 and the adjacent edges of the insulating layer 20, so as to form two zones 71 of resin joining the regions 31 of conductive glue. Due to this creep, the shape of the zones 71 laterally takes on a progressive profile (FIG. 4b) which on the one hand increases the adhesion surface and on the other hand avoids any break in section which would be favorable to mechanical breaks during In addition, in the example shown, the zones 71 are located below the conductive wires 60 which therefore remain uncoated. This avoids having to coat them completely because no partial coating is mechanically on. In addition, the zones 70 and 71 of resin do not project in height above the upper face of the patch 10, which does not introduce any disadvantage during subsequent mounting in the card slot.
Selon le mode de réalisation de la figure 5, le fluage de la zone 70 produit quatre zones 72 qui ne se rejoi gnent pas. Du point de vue mécanique, la qualité de l'adhéren- ce est pratiquement la même que dans le cas précédent, car le point le plus important est que la résine polymérisable entoure les coins de la pastille semiconductrice 10. According to the embodiment of FIG. 5, the creep of the zone 70 produces four zones 72 which do not join. From the mechanical point of view, the quality of adhesion is practically the same as in the previous case, since the most important point is that the polymerizable resin surrounds the corners of the semiconductor wafer 10.
La mise en oeuvre d'une colle conductrice pour la face inférieure de la pastille 10 et d'une résine polymérisable pour les côté de celle-ci permet en outre d'améliorer le contact électrique de la face inférieure avec la couche 40. En effet, il est possible d'utiliser des résines très fortement chargées en particules métalliques, en l'espèce Ag, et qui présentent intrinsèquement de moins bonnes performances mécaniques, étant donné que la fonction d'adhérence est remplie par la résine polymérisable. The use of a conductive adhesive for the underside of the patch 10 and a polymerizable resin for the sides thereof further improves the electrical contact of the underside with the layer 40. Indeed , it is possible to use resins very highly charged with metallic particles, in this case Ag, and which intrinsically have poorer mechanical performance, since the adhesion function is fulfilled by the polymerizable resin.
Selon la figure 6, le dispositif, en l'espèce celui des figures 4a et 4b est, après découpe, retourné et collé en 102 par la face supérieure de la pastille 10 dans un logement 101 d'une carte 100 ainsi qu'en 90 par la face supérieure de la couche isolante 20 dans un embrèvement périphérique 103 du logement 101. Le collage en 102 peut être réalisé par une couche de résine polyuréthane, alors qu'en 90, celui-ci peut être réalisé par un adhésif double face pelable 50 selon la technique décrite dans la demande de brevet français FR 2 580 416 précitée. Dans ce cas, la couche pelable 51 de l'adhésif 50 sert de masque à un vernis de protection 80. According to Figure 6, the device, in this case that of Figures 4a and 4b is, after cutting, turned and glued at 102 by the upper face of the patch 10 in a housing 101 of a card 100 as well as 90 by the upper face of the insulating layer 20 in a peripheral recess 103 of the housing 101. The bonding in 102 can be carried out by a layer of polyurethane resin, while in 90, this can be carried out by a peelable double-sided adhesive 50 according to the technique described in the above-mentioned French patent application FR 2 580 416. In this case, the peelable layer 51 of the adhesive 50 serves as a mask for a protective varnish 80.
Des dispositifs tels que montrés à la figure 6 ont été expérimentés par la Demanderesse et ont donné satisfaction dans des tests de flexion et de torsion mis en oeuvre pour les cartes souples, alors que des dispositifs pourvus de la seule colle conductrice (30, 31) ne permettaient pas de satisfaire à ce test. Devices as shown in FIG. 6 have been tested by the Applicant and have given satisfaction in bending and torsion tests implemented for flexible cards, while devices provided with the only conductive adhesive (30, 31) did not meet this test.
L'invention ne se limite pas aux modes de réalisation représentés. Par exemple, la présence de canaux 11 n'est pas nécessaire au fluage de la'résine, un tel fluage pouvant s'opérer le long des bords de la pastille. En outre, l'invention s'applique à tous les cas où une pastille doit être fixée sur un support souple tel que celui convenant au montage sur une carte souple. The invention is not limited to the embodiments shown. For example, the presence of channels 11 is not necessary for the creep of the resin, such creep can take place along the edges of the pellet. In addition, the invention applies to all cases where a patch must be fixed on a flexible support such as that suitable for mounting on a flexible card.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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FR8709445A FR2617668B1 (en) | 1987-07-03 | 1987-07-03 | DEVICE COMPRISING AN ELECTRONIC CIRCUIT MOUNTED ON A FLEXIBLE SUPPORT AND FLEXIBLE CARD INCLUDING THE SAME |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8709445A FR2617668B1 (en) | 1987-07-03 | 1987-07-03 | DEVICE COMPRISING AN ELECTRONIC CIRCUIT MOUNTED ON A FLEXIBLE SUPPORT AND FLEXIBLE CARD INCLUDING THE SAME |
Publications (2)
Publication Number | Publication Date |
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FR2617668A1 true FR2617668A1 (en) | 1989-01-06 |
FR2617668B1 FR2617668B1 (en) | 1995-07-07 |
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FR8709445A Expired - Fee Related FR2617668B1 (en) | 1987-07-03 | 1987-07-03 | DEVICE COMPRISING AN ELECTRONIC CIRCUIT MOUNTED ON A FLEXIBLE SUPPORT AND FLEXIBLE CARD INCLUDING THE SAME |
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Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0456323A1 (en) * | 1990-05-11 | 1991-11-13 | Philips Cartes Et Systemes | Microcircuit card |
FR2673042A1 (en) * | 1991-02-18 | 1992-08-21 | Em Microelectronic Marin Sa | Electronic module resisting mechanical deformation, for a microcircuit card |
FR2673039A1 (en) * | 1991-02-18 | 1992-08-21 | Em Microelectronic Marin Sa | Protected module for a card with microcircuits |
EP0503730A1 (en) * | 1991-03-15 | 1992-09-16 | Philips Cartes Et Systemes | Microcircuit card |
US5438750A (en) * | 1991-06-17 | 1995-08-08 | U.S. Philips Corporation | Method of manufacturing a chip card |
WO1997012341A1 (en) * | 1995-09-27 | 1997-04-03 | Siemens Aktiengesellschaft | Chip module |
WO1997042599A1 (en) * | 1996-05-07 | 1997-11-13 | Solaic | Integrated circuit card comprising conductive tracks distant from the integrated circuit corners |
WO1997044823A1 (en) * | 1996-05-17 | 1997-11-27 | Siemens Aktiengesellschaft | Substrate for a semiconductor chip |
WO1998039732A2 (en) * | 1997-03-03 | 1998-09-11 | Siemens Aktiengesellschaft | Chip card module and chip card comprising the latter |
WO2000007239A1 (en) * | 1998-07-28 | 2000-02-10 | Infineon Technologies Ag | Integrated component, composite body consisting of an integrated component and a conductive structure, chip card and method for producing the integrated component |
US6072698A (en) * | 1995-09-27 | 2000-06-06 | Siemens Aktiengesellschaft | Chip module with heat insulation for incorporation into a chip card |
EP2779232A3 (en) * | 2013-03-15 | 2014-12-03 | Renesas Electronics Corporation | Semiconductor device with a chip bonded to a lead frame with a sintered Ag layer, wherein a resin fillet covers the sintered Ag layer and a part of a side surface of the chip and wherein chip electrodes are bonded to leads, as well as method of manufacturing the same |
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EP0075351A1 (en) * | 1981-09-11 | 1983-03-30 | Rtc-Compelec | Method of making an identity card, and identity card produced, for example, by means of this method |
JPS5867050A (en) * | 1981-10-16 | 1983-04-21 | Nec Corp | Resin seal type semiconductor device |
FR2580416A1 (en) * | 1985-04-12 | 1986-10-17 | Radiotechnique Compelec | METHOD AND DEVICE FOR MANUFACTURING AN ELECTRONIC IDENTIFICATION CARD |
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Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0456323A1 (en) * | 1990-05-11 | 1991-11-13 | Philips Cartes Et Systemes | Microcircuit card |
FR2662000A1 (en) * | 1990-05-11 | 1991-11-15 | Philips Composants | MICROCIRCUIT CARD. |
US5264990A (en) * | 1990-05-11 | 1993-11-23 | U.S. Philips Corporation | Integrated circuit card that aids in reducing stress on an integrated circuit |
FR2673042A1 (en) * | 1991-02-18 | 1992-08-21 | Em Microelectronic Marin Sa | Electronic module resisting mechanical deformation, for a microcircuit card |
FR2673039A1 (en) * | 1991-02-18 | 1992-08-21 | Em Microelectronic Marin Sa | Protected module for a card with microcircuits |
EP0503730A1 (en) * | 1991-03-15 | 1992-09-16 | Philips Cartes Et Systemes | Microcircuit card |
FR2674052A1 (en) * | 1991-03-15 | 1992-09-18 | Philips Composants | MICROCIRCUIT CARD. |
US5283423A (en) * | 1991-03-15 | 1994-02-01 | U.S. Philips Corporation | Contactless microcircuit card |
US5438750A (en) * | 1991-06-17 | 1995-08-08 | U.S. Philips Corporation | Method of manufacturing a chip card |
US5585669A (en) * | 1991-06-17 | 1996-12-17 | U.S. Philips Corporation | Semiconductor chip card having selective encapsulation |
WO1997012341A1 (en) * | 1995-09-27 | 1997-04-03 | Siemens Aktiengesellschaft | Chip module |
US6072698A (en) * | 1995-09-27 | 2000-06-06 | Siemens Aktiengesellschaft | Chip module with heat insulation for incorporation into a chip card |
WO1997042599A1 (en) * | 1996-05-07 | 1997-11-13 | Solaic | Integrated circuit card comprising conductive tracks distant from the integrated circuit corners |
FR2748589A1 (en) * | 1996-05-07 | 1997-11-14 | Solaic Sa | INTEGRATED CIRCUIT CARD COMPRISING CONDUCTIVE LINES REMOTE FROM THE CORNERS OF THE INTEGRATED CIRCUIT |
WO1997044823A1 (en) * | 1996-05-17 | 1997-11-27 | Siemens Aktiengesellschaft | Substrate for a semiconductor chip |
US6326683B1 (en) * | 1996-05-17 | 2001-12-04 | Siemens Aktiengesellschaft | Carrier element for a semiconductor chip |
WO1998039732A2 (en) * | 1997-03-03 | 1998-09-11 | Siemens Aktiengesellschaft | Chip card module and chip card comprising the latter |
WO1998039732A3 (en) * | 1997-03-03 | 1998-12-17 | Siemens Ag | Chip card module and chip card comprising the latter |
WO2000007239A1 (en) * | 1998-07-28 | 2000-02-10 | Infineon Technologies Ag | Integrated component, composite body consisting of an integrated component and a conductive structure, chip card and method for producing the integrated component |
US6400006B2 (en) | 1998-07-28 | 2002-06-04 | Infineon Technologies Ag | Integrated component, composite element comprising an integrated component and a conductor structure, chip card, and method of producing the integrated component |
EP2779232A3 (en) * | 2013-03-15 | 2014-12-03 | Renesas Electronics Corporation | Semiconductor device with a chip bonded to a lead frame with a sintered Ag layer, wherein a resin fillet covers the sintered Ag layer and a part of a side surface of the chip and wherein chip electrodes are bonded to leads, as well as method of manufacturing the same |
Also Published As
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