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FR2617668A1 - Device comprising an electronic circuit mounted on a flexible support and flexible board comprising it - Google Patents

Device comprising an electronic circuit mounted on a flexible support and flexible board comprising it Download PDF

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Publication number
FR2617668A1
FR2617668A1 FR8709445A FR8709445A FR2617668A1 FR 2617668 A1 FR2617668 A1 FR 2617668A1 FR 8709445 A FR8709445 A FR 8709445A FR 8709445 A FR8709445 A FR 8709445A FR 2617668 A1 FR2617668 A1 FR 2617668A1
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FR
France
Prior art keywords
circuit
resin
flexible
support
electronic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8709445A
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French (fr)
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FR2617668B1 (en
Inventor
Jacques Le Carpentier
Jacques Venambre
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
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Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR8709445A priority Critical patent/FR2617668B1/en
Publication of FR2617668A1 publication Critical patent/FR2617668A1/en
Application granted granted Critical
Publication of FR2617668B1 publication Critical patent/FR2617668B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • G06K19/07747Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83909Post-treatment of the layer connector or bonding area
    • H01L2224/83951Forming additional members, e.g. for reinforcing, fillet sealant
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909Post-treatment of the connector or wire bonding area
    • H01L2224/8592Applying permanent coating, e.g. protective coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06Polymers
    • H01L2924/078Adhesive characteristics other than chemical
    • H01L2924/0781Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811Extrinsic, i.e. with electrical conductive fillers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

An electronic circuit 10 is firmly mounted onto a flexible support 20, 40 comprising at least one conducting track 40 to which an upper side of the circuit 10 is connected via at least one conducting wire 60. A so-called lower side of the circuit 10 is firmly attached 30, 31 to the flexible support 20, 40 by means of a conductive adhesive 30, 31. A resin 71 is placed on at least two opposite lateral edges of the circuit 10 and projects, at least partially, over the lateral edges adjacent to the said lateral edges so as to be firmly attached to the lateral edges of the circuit 10 and to the support 20, 40 without covering any conducting wire 60. A flexible board comprises a housing 101 in which the device can be adhesively bonded.

Description

'DISPOSITIF COMPORTANT UN CIRCUIT ELECTRONIQUE MONTE SUR UN
SUPPORT SOUPLE ET CARTE SOUPLE LE COMPRENANT".
'DEVICE COMPRISING AN ELECTRONIC CIRCUIT MOUNTED ON A
FLEXIBLE SUPPORT AND FLEXIBLE CARD INCLUDING SAME ".

Le présente invention a pour objet un dispositif comportant un circuit électronique monté solidairement sur un support souple comportant au moins une piste conductrice à laquelle une face supérieure dudit circuit est reliée par au moins un fil conducteur, ledit montage étant obtenu d'une part par solidarisation d'une face inférieure du circuit électronique et du support souple et d'autre part par adjonction d'une résine. The present invention relates to a device comprising an electronic circuit mounted integrally on a flexible support comprising at least one conductive track to which an upper face of said circuit is connected by at least one conductive wire, said assembly being obtained on the one hand by securing of a lower face of the electronic circuit and of the flexible support and on the other hand by the addition of a resin.

Un tel dispositif est connu de la demande de brevet français n0 2 583 574 (Société EUROTECHNIQUE). Dans celui-ci, ladite résine enrobe complètement le circuit et les fils de conduction. Such a device is known from French patent application No. 2,583,574 (EUROTECHNIQUE company). In it, said resin completely coats the circuit and the conduction wires.

Un tel enrobage présente l'inconvénient que la reproductibilité du contour de l'enrobage est difficile à ossu: rer, ce qui conduit à des problèmes de montage lorsque le dispositif est dans un logement d'une carte souple, telle qu'une carte à mémoire et/ou à microprocesseur. Such a coating has the disadvantage that the reproducibility of the contour of the coating is difficult to ossu: rer, which leads to mounting problems when the device is in a housing of a flexible card, such as a card to memory and / or microprocessor.

D'une manière générale, la solidarisation de la face inférieure du circuit électronique et du support souple, est réalisée à l'aide d'un matériau adhésif et conducteur, par exemple une résine époxy chargée à l'argent. In general, the attachment of the underside of the electronic circuit and the flexible support is carried out using an adhesive and conductive material, for example an epoxy resin loaded with silver.

Un tel matériau ne peut assurer à lui seul la tenue mécanique du circuit sur son support lors des tests mécaniques normalisés de flexion et de torsion auxquels doivent satisfaire lesdites cartes souples. Such a material cannot by itself ensure the mechanical strength of the circuit on its support during standardized mechanical bending and twisting tests which said flexible cards must satisfy.

L'invention se propose donc d'assurer la bonne tenue mécanique du circuit sur son support sans toutefois perturber le montage ultérieur du dispositif dans un logement tel que celui d'une carte souple, tout en étant en outre obtenu avec une bien moins grande quantité de résine.  The invention therefore proposes to ensure the good mechanical strength of the circuit on its support without, however, disturbing the subsequent mounting of the device in a housing such as that of a flexible card, while also being obtained with a much smaller quantity. resin.

Dans ce but, l'invention est caractérisée en ce que ladite résine est disposée sur au moins deux bords latéraux opposés du circuit à savoir un premier et un deuxième bord latéral et déborde au moins partiellement sur une troisième et un quatrième bord latéral ces derniers étant adjacents auxdits premier et deuxième bords latéraux de manière à solidariser les premier, deuxième, troisième et quatrième bords latéraux et le support sans enrober aucun fil conducteur. For this purpose, the invention is characterized in that the said resin is placed on at least two opposite lateral edges of the circuit, namely a first and a second lateral edge and extends at least partially over a third and a fourth lateral edge, the latter being adjacent to said first and second side edges so as to secure the first, second, third and fourth side edges and the support without coating any conductive wire.

Selon un mode de réalisation avantageux, la résine est disposée sur tout le pourtour des bords latéraux du circuit. According to an advantageous embodiment, the resin is arranged around the entire periphery of the lateral edges of the circuit.

Selon un mode de réalisation préféré, au moins lesdits troisième et quatrième bords latéraux sont adjacents à une couche revêtant le support, de manière à produire des camaux facilitant l'écoulement de la, résine par capillarité après sa dépose. According to a preferred embodiment, at least said third and fourth lateral edges are adjacent to a layer coating the support, so as to produce camals facilitating the flow of the resin by capillary action after its removal.

L'invention sera mieux comprise à la lecture de la description qui va suivre donnée à titre d'exemple non limitatif en liaison avec les dessins qui représentent - la figure 1 un dispositif selon l'art antérieur précité - les figures 2a et 2b, 3a et 3b, 4a et 4b illustrent, en vue, de dessus, et en coupe verticale suivant AA' des étapes du procédé de réalisation d'un dispositif selon l'invention - la figure 5 montre une variante du dispositif selon l'invention - la figure 6 montre un dispositif selon l'invention après insertion dans un logement d'une carte souple. The invention will be better understood on reading the description which follows given by way of nonlimiting example in connection with the drawings which represent - FIG. 1 a device according to the aforementioned prior art - FIGS. 2a and 2b, 3a and 3b, 4a and 4b illustrate, in top view, and in vertical section along AA ′, steps of the method for producing a device according to the invention - FIG. 5 shows a variant of the device according to the invention - the Figure 6 shows a device according to the invention after insertion into a housing of a flexible card.

A la figure 1, un dispositif selon l'art antérieur comporte une pastille de circuit intégré 1 fixée de manière conductrice à un film métallique 2 collé sur la face externe d'un film plastique 5. Ce film plastique 5 présente une ouverture 6 correspondant à la pastille 1 et des ouvertures 7 correspondant au passage de fils de connexion 4 soudés à la face supérieure de la pastille 1 et au fil métallique 2. La bande métallique 2 est gravée de manière à séparer électriquement par des bandes 3 la partie centrale où est disposée la pastille et les parties latérales recevant les extrémités des con nexions 4. In FIG. 1, a device according to the prior art comprises an integrated circuit patch 1 fixed in a conductive manner to a metal film 2 bonded to the external face of a plastic film 5. This plastic film 5 has an opening 6 corresponding to the patch 1 and openings 7 corresponding to the passage of connection wires 4 welded to the upper face of the patch 1 and to the metal wire 2. The metal strip 2 is etched so as to electrically separate the central part by strips 3 arranged the patch and the lateral parts receiving the ends of the connections 4.

A la fin du montage, la face supérieure du dispositif est noyée dans une résine de protection 8 déposée à chaud, par exemple du chlorure de polyvinyle (PVC). At the end of assembly, the upper face of the device is embedded in a protective resin 8 hot deposited, for example polyvinyl chloride (PVC).

Cette résine de protection 8 forme un dôme dont le contour n'est pas reproductible et qui doit en outre être suffisamment haut pour que les fils 4 soient entièrement enrobés, faute de quoi il y aurait une grande fragilité mécanique. This protective resin 8 forms a dome whose outline is not reproducible and which must also be high enough for the wires 4 to be fully coated, otherwise there would be great mechanical fragility.

Cette hauteur n'est pas reproductible.This height is not reproducible.

Selon les figures 2a et 2b, un circuit électronique, par exenple une pastille semi-conductrice 10 est collé de manière conductrice sur une couche conductrice 40, en l'espèce une feuille de cuivre sur laquelle sont déposées électrolytiquement une couche de nickel, puis une couche d'or, disposée à la face inférieure d'une couche isolante, en l'espèce un film polyester 20. La-couche isolante 20 et la couche conductrice 40 forment un support souple. La couche de colle conductrice peut être une résine époxy chargée à l'argent. Cette colle adhère en 30 à la surface inférieure de la pastille 10 et en 31 aux faces latérales de la pastille 10. La couche 40 présente des ouvertures 41 la séparant électriquement en différentes zones 42 permettant d'isoler les prises de contact électrique. According to FIGS. 2a and 2b, an electronic circuit, for example a semiconductor wafer 10 is bonded in a conductive manner to a conductive layer 40, in this case a copper sheet on which an nickel layer is electrolytically deposited, then a gold layer, disposed on the underside of an insulating layer, in this case a polyester film 20. The insulating layer 20 and the conductive layer 40 form a flexible support. The layer of conductive adhesive can be a silver-charged epoxy resin. This adhesive adheres at 30 to the lower surface of the patch 10 and at 31 to the lateral faces of the patch 10. The layer 40 has openings 41 electrically separating it into different zones 42 making it possible to isolate the electrical contact sockets.

Des puits 21 traversent la couche isolante 20 de manière à permettre la mise en place par soudure ultra-sonsde fils de connexion 60 entre la face supérieure de la pastille 10 et les zones correspondantes 42 (voir fig. 3a et 3b).Wells 21 pass through the insulating layer 20 so as to allow the establishment, by ultrasonic welding, of connection wires 60 between the upper face of the patch 10 and the corresponding zones 42 (see FIGS. 3a and 3b).

On trouvera une description plus détaillée d'un exemple de mise en oeuvre dans la demande de brevet français
FR 2 580 416 déposée par la Demanderesse le 12 avril 1985 et intitulée "Procédé et dispositif pour fabriquer une carte d'identification électronique".
A more detailed description of an example of implementation can be found in the French patent application.
FR 2 580 416 filed by the Applicant on April 12, 1985 and entitled "Method and device for manufacturing an electronic identification card".

Selon les figures 4a et 4b, une résine polyérisa- ble, par exemple une résine époxy, est déposée en 70 le long de deux bords opposés de la pastille semiconductrice 10. La résine est dosée de manière que, après un palier de température suffisant pour ramollir la résine sans le polymériser, celle-ci flue le long de canaux 11 entre deux autres cotés op posés de la pastille 10 et les bords adjacents de la couche isolante 20, de manière à former deux zones 71 de résine rejoignant les régions 31 de la colle conductrice. Du fait de ce fluage , la forme des zones 71 revêt latéralement (fig.4b) un profil progressif qui d'une part augmente la surface d'adhérence et d'autre part évite toute rupture de section qui serait favorable à des ruptures mécaniques lors de l'utilisation.En outre, dans l'exemple représenté, les zones 71 sont situées en dessous des fils conducteurs 60 qui restent donc non enrobés. Ceci évite d'avoir à les enrober complètement car aucun enrobage partiel n'est mécaniquement sur En outre, les zones 70 et 71 de résine ne débordent pas en hauteur au dessus de la face supérieure de la pastille 10, ce qui n'introduit aucun inconvénient lors du montage ultérieur dans le logement d'une carte. According to FIGS. 4a and 4b, a polyerisable resin, for example an epoxy resin, is deposited at 70 along two opposite edges of the semiconductor wafer 10. The resin is dosed so that, after a temperature plateau sufficient for soften the resin without polymerizing it, it flows along channels 11 between two other opposite sides of the patch 10 and the adjacent edges of the insulating layer 20, so as to form two zones 71 of resin joining the regions 31 of conductive glue. Due to this creep, the shape of the zones 71 laterally takes on a progressive profile (FIG. 4b) which on the one hand increases the adhesion surface and on the other hand avoids any break in section which would be favorable to mechanical breaks during In addition, in the example shown, the zones 71 are located below the conductive wires 60 which therefore remain uncoated. This avoids having to coat them completely because no partial coating is mechanically on. In addition, the zones 70 and 71 of resin do not project in height above the upper face of the patch 10, which does not introduce any disadvantage during subsequent mounting in the card slot.

Selon le mode de réalisation de la figure 5, le fluage de la zone 70 produit quatre zones 72 qui ne se rejoi gnent pas. Du point de vue mécanique, la qualité de l'adhéren- ce est pratiquement la même que dans le cas précédent, car le point le plus important est que la résine polymérisable entoure les coins de la pastille semiconductrice 10. According to the embodiment of FIG. 5, the creep of the zone 70 produces four zones 72 which do not join. From the mechanical point of view, the quality of adhesion is practically the same as in the previous case, since the most important point is that the polymerizable resin surrounds the corners of the semiconductor wafer 10.

La mise en oeuvre d'une colle conductrice pour la face inférieure de la pastille 10 et d'une résine polymérisable pour les côté de celle-ci permet en outre d'améliorer le contact électrique de la face inférieure avec la couche 40. En effet, il est possible d'utiliser des résines très fortement chargées en particules métalliques, en l'espèce Ag, et qui présentent intrinsèquement de moins bonnes performances mécaniques, étant donné que la fonction d'adhérence est remplie par la résine polymérisable. The use of a conductive adhesive for the underside of the patch 10 and a polymerizable resin for the sides thereof further improves the electrical contact of the underside with the layer 40. Indeed , it is possible to use resins very highly charged with metallic particles, in this case Ag, and which intrinsically have poorer mechanical performance, since the adhesion function is fulfilled by the polymerizable resin.

Selon la figure 6, le dispositif, en l'espèce celui des figures 4a et 4b est, après découpe, retourné et collé en 102 par la face supérieure de la pastille 10 dans un logement 101 d'une carte 100 ainsi qu'en 90 par la face supérieure de la couche isolante 20 dans un embrèvement périphérique 103 du logement 101. Le collage en 102 peut être réalisé par une couche de résine polyuréthane, alors qu'en 90, celui-ci peut être réalisé par un adhésif double face pelable 50 selon la technique décrite dans la demande de brevet français FR 2 580 416 précitée. Dans ce cas, la couche pelable 51 de l'adhésif 50 sert de masque à un vernis de protection 80. According to Figure 6, the device, in this case that of Figures 4a and 4b is, after cutting, turned and glued at 102 by the upper face of the patch 10 in a housing 101 of a card 100 as well as 90 by the upper face of the insulating layer 20 in a peripheral recess 103 of the housing 101. The bonding in 102 can be carried out by a layer of polyurethane resin, while in 90, this can be carried out by a peelable double-sided adhesive 50 according to the technique described in the above-mentioned French patent application FR 2 580 416. In this case, the peelable layer 51 of the adhesive 50 serves as a mask for a protective varnish 80.

Des dispositifs tels que montrés à la figure 6 ont été expérimentés par la Demanderesse et ont donné satisfaction dans des tests de flexion et de torsion mis en oeuvre pour les cartes souples, alors que des dispositifs pourvus de la seule colle conductrice (30, 31) ne permettaient pas de satisfaire à ce test. Devices as shown in FIG. 6 have been tested by the Applicant and have given satisfaction in bending and torsion tests implemented for flexible cards, while devices provided with the only conductive adhesive (30, 31) did not meet this test.

L'invention ne se limite pas aux modes de réalisation représentés. Par exemple, la présence de canaux 11 n'est pas nécessaire au fluage de la'résine, un tel fluage pouvant s'opérer le long des bords de la pastille. En outre, l'invention s'applique à tous les cas où une pastille doit être fixée sur un support souple tel que celui convenant au montage sur une carte souple.  The invention is not limited to the embodiments shown. For example, the presence of channels 11 is not necessary for the creep of the resin, such creep can take place along the edges of the pellet. In addition, the invention applies to all cases where a patch must be fixed on a flexible support such as that suitable for mounting on a flexible card.

Claims (4)

REVENDICATIONS 1. Dispositif comportant un circuit électronique monté solidairement sur un support souple comportant au moins une piste conductrice à laquelle une face supérieure dudit circuit est reliée par au moins un fil conducteur, ledit montage solidaire étant obtenu d'une part par solidarisation d'une face inférieure du circuit électronique et du support souple et d'autre part par adjonction d'une résine, caractérisé en ce que ladite résine est disposée sur au moins deux bords latéraux opposées du circuit (10) à savoir un premier et un deuxième bord latéral et déborde au moins partiellement sur un troisième et un quatrième bord latéral, ces derniers étant adjacents auxdits premier et deuxième bords latéraux, de manière à solidariser les premier, deuxième, troisième et quatrième bords latéraux et le support (20, 40) sans enrober aucun fil conducteur (60).1. Device comprising an electronic circuit mounted integrally on a flexible support comprising at least one conductive track to which an upper face of said circuit is connected by at least one conductive wire, said integral assembly being obtained on the one hand by securing a face bottom of the electronic circuit and of the flexible support and on the other hand by the addition of a resin, characterized in that said resin is arranged on at least two opposite lateral edges of the circuit (10), namely a first and a second lateral edge and extends at least partially over a third and a fourth side edge, the latter being adjacent to said first and second side edges, so as to secure the first, second, third and fourth side edges and the support (20, 40) without coating any wire conductor (60). 2. Dispositif selon la revendication 1 caractérisé en ce que la résine est disposée sur tout le pourtour des bords latéraux du circuit (10). 2. Device according to claim 1 characterized in that the resin is arranged around the entire periphery of the lateral edges of the circuit (10). 3. Dispositif selon une des revendications 1 Ou 2 ca ractérisé en ce qu'au moins lesdits troisième et quatrième bords latéraux sont adjacents à une couche (20) revêtant le support, de manière à produire deux canaux (11) facilitant l'écoulement de la résine par capillarité après sa dépose.3. Device according to one of claims 1 or 2 ca characterized in that at least said third and fourth side edges are adjacent to a layer (20) coating the support, so as to produce two channels (11) facilitating the flow of the resin by capillary action after its removal. 4. Carte souple comportant un logement caractérisé en ce qu'un dispositif selon une des revendications précédentes est collé dans ledit logement (101). 4. Flexible card comprising a housing characterized in that a device according to one of the preceding claims is stuck in said housing (101).
FR8709445A 1987-07-03 1987-07-03 DEVICE COMPRISING AN ELECTRONIC CIRCUIT MOUNTED ON A FLEXIBLE SUPPORT AND FLEXIBLE CARD INCLUDING THE SAME Expired - Fee Related FR2617668B1 (en)

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FR2673042A1 (en) * 1991-02-18 1992-08-21 Em Microelectronic Marin Sa Electronic module resisting mechanical deformation, for a microcircuit card
FR2673039A1 (en) * 1991-02-18 1992-08-21 Em Microelectronic Marin Sa Protected module for a card with microcircuits
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WO1997012341A1 (en) * 1995-09-27 1997-04-03 Siemens Aktiengesellschaft Chip module
WO1997042599A1 (en) * 1996-05-07 1997-11-13 Solaic Integrated circuit card comprising conductive tracks distant from the integrated circuit corners
WO1997044823A1 (en) * 1996-05-17 1997-11-27 Siemens Aktiengesellschaft Substrate for a semiconductor chip
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EP0456323A1 (en) * 1990-05-11 1991-11-13 Philips Cartes Et Systemes Microcircuit card
FR2662000A1 (en) * 1990-05-11 1991-11-15 Philips Composants MICROCIRCUIT CARD.
US5264990A (en) * 1990-05-11 1993-11-23 U.S. Philips Corporation Integrated circuit card that aids in reducing stress on an integrated circuit
FR2673042A1 (en) * 1991-02-18 1992-08-21 Em Microelectronic Marin Sa Electronic module resisting mechanical deformation, for a microcircuit card
FR2673039A1 (en) * 1991-02-18 1992-08-21 Em Microelectronic Marin Sa Protected module for a card with microcircuits
EP0503730A1 (en) * 1991-03-15 1992-09-16 Philips Cartes Et Systemes Microcircuit card
FR2674052A1 (en) * 1991-03-15 1992-09-18 Philips Composants MICROCIRCUIT CARD.
US5283423A (en) * 1991-03-15 1994-02-01 U.S. Philips Corporation Contactless microcircuit card
US5438750A (en) * 1991-06-17 1995-08-08 U.S. Philips Corporation Method of manufacturing a chip card
US5585669A (en) * 1991-06-17 1996-12-17 U.S. Philips Corporation Semiconductor chip card having selective encapsulation
WO1997012341A1 (en) * 1995-09-27 1997-04-03 Siemens Aktiengesellschaft Chip module
US6072698A (en) * 1995-09-27 2000-06-06 Siemens Aktiengesellschaft Chip module with heat insulation for incorporation into a chip card
WO1997042599A1 (en) * 1996-05-07 1997-11-13 Solaic Integrated circuit card comprising conductive tracks distant from the integrated circuit corners
FR2748589A1 (en) * 1996-05-07 1997-11-14 Solaic Sa INTEGRATED CIRCUIT CARD COMPRISING CONDUCTIVE LINES REMOTE FROM THE CORNERS OF THE INTEGRATED CIRCUIT
WO1997044823A1 (en) * 1996-05-17 1997-11-27 Siemens Aktiengesellschaft Substrate for a semiconductor chip
US6326683B1 (en) * 1996-05-17 2001-12-04 Siemens Aktiengesellschaft Carrier element for a semiconductor chip
WO1998039732A2 (en) * 1997-03-03 1998-09-11 Siemens Aktiengesellschaft Chip card module and chip card comprising the latter
WO1998039732A3 (en) * 1997-03-03 1998-12-17 Siemens Ag Chip card module and chip card comprising the latter
WO2000007239A1 (en) * 1998-07-28 2000-02-10 Infineon Technologies Ag Integrated component, composite body consisting of an integrated component and a conductive structure, chip card and method for producing the integrated component
US6400006B2 (en) 1998-07-28 2002-06-04 Infineon Technologies Ag Integrated component, composite element comprising an integrated component and a conductor structure, chip card, and method of producing the integrated component
EP2779232A3 (en) * 2013-03-15 2014-12-03 Renesas Electronics Corporation Semiconductor device with a chip bonded to a lead frame with a sintered Ag layer, wherein a resin fillet covers the sintered Ag layer and a part of a side surface of the chip and wherein chip electrodes are bonded to leads, as well as method of manufacturing the same

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