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FR2656494B1 - Dispositif de blindage et d'isolation d'une carte de circuit electronique. - Google Patents

Dispositif de blindage et d'isolation d'une carte de circuit electronique.

Info

Publication number
FR2656494B1
FR2656494B1 FR8916986A FR8916986A FR2656494B1 FR 2656494 B1 FR2656494 B1 FR 2656494B1 FR 8916986 A FR8916986 A FR 8916986A FR 8916986 A FR8916986 A FR 8916986A FR 2656494 B1 FR2656494 B1 FR 2656494B1
Authority
FR
France
Prior art keywords
shielding
circuit board
electronic circuit
insulation device
insulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR8916986A
Other languages
English (en)
Other versions
FR2656494A1 (fr
Inventor
Brisac Claude
Pichereau Rodolphe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telemecanique SA
Original Assignee
La Telemecanique Electrique SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by La Telemecanique Electrique SA filed Critical La Telemecanique Electrique SA
Priority to FR8916986A priority Critical patent/FR2656494B1/fr
Priority to DE4041071A priority patent/DE4041071A1/de
Priority to IT68055A priority patent/IT1241370B/it
Priority to SG1995903902A priority patent/SG30552G/en
Priority to GB9106487A priority patent/GB2254193B/en
Publication of FR2656494A1 publication Critical patent/FR2656494A1/fr
Application granted granted Critical
Publication of FR2656494B1 publication Critical patent/FR2656494B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
FR8916986A 1989-12-21 1989-12-21 Dispositif de blindage et d'isolation d'une carte de circuit electronique. Expired - Lifetime FR2656494B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR8916986A FR2656494B1 (fr) 1989-12-21 1989-12-21 Dispositif de blindage et d'isolation d'une carte de circuit electronique.
DE4041071A DE4041071A1 (de) 1989-12-21 1990-12-20 Vorrichtung zur abschirmung und isolierung einer elektronischen schaltungskarte
IT68055A IT1241370B (it) 1989-12-21 1990-12-21 Dispositivo di schermatura ed isolamento di una scheda di circuito elettronico.
SG1995903902A SG30552G (en) 1989-12-21 1991-03-27 Device for the screening and insulation of an electronic circuit board
GB9106487A GB2254193B (en) 1989-12-21 1991-03-27 Device for the screening and insulation of an electronic circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8916986A FR2656494B1 (fr) 1989-12-21 1989-12-21 Dispositif de blindage et d'isolation d'une carte de circuit electronique.

Publications (2)

Publication Number Publication Date
FR2656494A1 FR2656494A1 (fr) 1991-06-28
FR2656494B1 true FR2656494B1 (fr) 1992-04-30

Family

ID=9388817

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8916986A Expired - Lifetime FR2656494B1 (fr) 1989-12-21 1989-12-21 Dispositif de blindage et d'isolation d'une carte de circuit electronique.

Country Status (5)

Country Link
DE (1) DE4041071A1 (fr)
FR (1) FR2656494B1 (fr)
GB (1) GB2254193B (fr)
IT (1) IT1241370B (fr)
SG (1) SG30552G (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05189084A (ja) * 1992-01-10 1993-07-30 Toshiba Corp 小形電子機器
US5519585A (en) * 1993-04-12 1996-05-21 Dell Usa, L.P. Sandwiched insulative/conductive layer EMI shield structure for printed circuit board
WO1995027341A1 (fr) * 1994-04-04 1995-10-12 Motorola Inc. Ensemble circuit blinde et procede de fabrication
US5597979A (en) * 1995-05-12 1997-01-28 Schlegel Corporation EMI shielding having flexible condustive sheet and I/O Gasket
FR2737068B1 (fr) * 1995-07-18 1997-10-03 Alcatel Mobile Comm France Appareil de communication avec protection electrostatique
FR2753335B1 (fr) * 1996-09-11 1998-11-27 Siemens Automotive Sa Dispositif de blindage d'un circuit electronique
US5867371A (en) * 1997-09-29 1999-02-02 Ericsson Inc. Cover member for sealed circuit board assembly
DE10142655A1 (de) * 2001-08-31 2003-04-03 Epcos Ag Bauelementanordnung
JP4096605B2 (ja) * 2002-04-23 2008-06-04 日本電気株式会社 半導体装置および半導体装置のシールド形成方法
DE10247676A1 (de) * 2002-10-12 2004-07-15 Hella Kg Hueck & Co. Elektrisches oder elektronisches Gerät mit einer Leiterplatte
JP4690908B2 (ja) * 2006-02-22 2011-06-01 ポリマテック株式会社 コネクタシート及び携帯型電子機器
WO2018008657A1 (fr) * 2016-07-08 2018-01-11 住友ベークライト株式会社 Film d'étanchéité, procédé d'étanchéité de substrat monté sur un composant électronique, et substrat monté sur un composant électronique recouvert d'un film d'étanchéité
JP2018060991A (ja) * 2016-09-28 2018-04-12 住友ベークライト株式会社 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板
TWI669991B (zh) * 2018-01-11 2019-08-21 和碩聯合科技股份有限公司 具靜電放電保護機制的電路板及具有此電路板的電子裝置
JP2021086985A (ja) * 2019-11-29 2021-06-03 日立Astemo株式会社 電子制御装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3895267A (en) * 1974-03-11 1975-07-15 Analogic Corp Electronic circuit module with printed circuit board and grounding means
US4218578A (en) * 1978-08-04 1980-08-19 Burr-Brown Research Corp. RF Shield for an electronic component

Also Published As

Publication number Publication date
DE4041071A1 (de) 1991-06-27
GB2254193B (en) 1994-11-30
IT9068055A0 (it) 1990-12-21
SG30552G (en) 1995-09-18
IT1241370B (it) 1994-01-10
IT9068055A1 (it) 1991-06-22
GB2254193A (en) 1992-09-30
GB9106487D0 (en) 1991-05-15
FR2656494A1 (fr) 1991-06-28

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Legal Events

Date Code Title Description
ST Notification of lapse