FR2572218B1 - Procede de decoupe de composants electroniques sur un substrat semi-conducteur - Google Patents
Procede de decoupe de composants electroniques sur un substrat semi-conducteurInfo
- Publication number
- FR2572218B1 FR2572218B1 FR8416176A FR8416176A FR2572218B1 FR 2572218 B1 FR2572218 B1 FR 2572218B1 FR 8416176 A FR8416176 A FR 8416176A FR 8416176 A FR8416176 A FR 8416176A FR 2572218 B1 FR2572218 B1 FR 2572218B1
- Authority
- FR
- France
- Prior art keywords
- semiconductor substrate
- electronic components
- cutting electronic
- cutting
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8416176A FR2572218B1 (fr) | 1984-10-23 | 1984-10-23 | Procede de decoupe de composants electroniques sur un substrat semi-conducteur |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8416176A FR2572218B1 (fr) | 1984-10-23 | 1984-10-23 | Procede de decoupe de composants electroniques sur un substrat semi-conducteur |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2572218A1 FR2572218A1 (fr) | 1986-04-25 |
| FR2572218B1 true FR2572218B1 (fr) | 1987-06-05 |
Family
ID=9308902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8416176A Expired FR2572218B1 (fr) | 1984-10-23 | 1984-10-23 | Procede de decoupe de composants electroniques sur un substrat semi-conducteur |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2572218B1 (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5157001A (en) * | 1989-09-18 | 1992-10-20 | Matsushita Electric Industrial Co., Ltd. | Method of dicing semiconductor wafer along protective film formed on scribe lines |
| DE19725445A1 (de) * | 1997-06-16 | 1998-12-17 | Siemens Ag | Bauteilträger für Multi-Chip-Module |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4033027A (en) * | 1975-09-26 | 1977-07-05 | Bell Telephone Laboratories, Incorporated | Dividing metal plated semiconductor wafers |
| DE2730130C2 (de) * | 1976-09-14 | 1987-11-12 | Mitsubishi Denki K.K., Tokyo | Verfahren zum Herstellen von Halbleiterbauelementen |
| JPS58137228A (ja) * | 1982-02-09 | 1983-08-15 | Toshiba Corp | 半導体装置の製造方法 |
-
1984
- 1984-10-23 FR FR8416176A patent/FR2572218B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2572218A1 (fr) | 1986-04-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0242626A3 (en) | Method for mounting electronic components on a substrate | |
| DE3275789D1 (en) | Substrate for mounting integrated circuit chips | |
| KR920003834A (ko) | 반도체 집적회로 장치의 제어방법 | |
| FR2578099B1 (fr) | Substrat monolithique pour composant electronique de puissance, et procede pour sa fabrication | |
| FR2567684B1 (fr) | Module ayant un substrat ceramique multicouche et un circuit multicouche sur ce substrat et procede pour sa fabrication | |
| IT8349330A0 (it) | Metodo per fabbricare un sostrato composito di semiconduttore su isolante, con profilo controllato perdensita' di difetti | |
| FR2483127B1 (fr) | Procede de fabrication d'un dispositif semi-conducteur | |
| EP0074605A3 (en) | Method for manufacturing multilayer circuit substrate | |
| FR2457912B1 (fr) | Procede d'electro-deposition d'un metal sur un substrat | |
| KR850004353A (ko) | 반도체 집적회로 장치의 제조방법 | |
| FR2537607B1 (fr) | Procede de fabrication d'une couche semi-conductrice monocristalline sur une couche isolante | |
| KR840009181A (ko) | 반도체 장치의 제조방법 | |
| KR840005928A (ko) | 반도체 장치의 제조방법 | |
| FR2528657B1 (fr) | Ensemble electrique comprenant un motif de conducteurs lie a un substrat non metallique et procede de fabrication de cet ensemble | |
| ES550422A0 (es) | Metodo para fabricar un sustrato revestido. | |
| IT8323707A0 (it) | Substrato di cablaggio, procedimento per la sua fabbricazione, e dispositivo a semiconduttore utilizzante il substrato stesso. | |
| KR940009174B1 (en) | Lift-off process for forming wiring on a substrate | |
| KR850005729A (ko) | 반도체 장치의 제조방법 | |
| FR2572219B1 (fr) | Procede de fabrication de circuits integres sur substrat isolant | |
| DE3565441D1 (en) | Method for manufacturing a semiconductor device | |
| FR2630617B1 (fr) | Procede de fabrication d'un substrat conducteur multicouche | |
| FR2643192B1 (fr) | Procede de fabrication d'un dispositif semi-conducteur comprenant une electrode en metal refractaire sur un substrat semi-isolant | |
| FR2616272B1 (fr) | Dispositif en materiaux semiconducteurs realise sur un substrat de parametre de maille different, application a un laser et procede de realisation | |
| FR2572218B1 (fr) | Procede de decoupe de composants electroniques sur un substrat semi-conducteur | |
| GB2150098B (en) | Machine for placing electronic components on a substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |