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FR2469467B1 - METHOD FOR METALLIZING SEMICONDUCTOR DEVICES - Google Patents

METHOD FOR METALLIZING SEMICONDUCTOR DEVICES

Info

Publication number
FR2469467B1
FR2469467B1 FR8023792A FR8023792A FR2469467B1 FR 2469467 B1 FR2469467 B1 FR 2469467B1 FR 8023792 A FR8023792 A FR 8023792A FR 8023792 A FR8023792 A FR 8023792A FR 2469467 B1 FR2469467 B1 FR 2469467B1
Authority
FR
France
Prior art keywords
semiconductor devices
metallizing
metallizing semiconductor
devices
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8023792A
Other languages
French (fr)
Other versions
FR2469467A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
ITT Inc
Original Assignee
Deutsche ITT Industries GmbH
ITT Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB7938793A external-priority patent/GB2038883B/en
Application filed by Deutsche ITT Industries GmbH, ITT Industries Inc filed Critical Deutsche ITT Industries GmbH
Publication of FR2469467A1 publication Critical patent/FR2469467A1/en
Application granted granted Critical
Publication of FR2469467B1 publication Critical patent/FR2469467B1/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/28556Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/18Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/42Silicides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
FR8023792A 1979-11-08 1980-11-07 METHOD FOR METALLIZING SEMICONDUCTOR DEVICES Expired FR2469467B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB7938793A GB2038883B (en) 1978-11-09 1979-11-08 Metallizing semiconductor devices

Publications (2)

Publication Number Publication Date
FR2469467A1 FR2469467A1 (en) 1981-05-22
FR2469467B1 true FR2469467B1 (en) 1985-06-28

Family

ID=10509073

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8023792A Expired FR2469467B1 (en) 1979-11-08 1980-11-07 METHOD FOR METALLIZING SEMICONDUCTOR DEVICES

Country Status (3)

Country Link
JP (1) JPS5683026A (en)
DE (1) DE3040693A1 (en)
FR (1) FR2469467B1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4488506A (en) * 1981-06-18 1984-12-18 Itt Industries, Inc. Metallization plant
DE3141567C2 (en) * 1981-10-20 1986-02-06 Siemens AG, 1000 Berlin und 8000 München Process for producing layers consisting of tantalum, tungsten or molybdenum at low temperatures and using these layers
DE3142586A1 (en) * 1981-10-27 1983-05-11 Siemens AG, 1000 Berlin und 8000 München Apparatus for the high-temperature treatment of layers consisting of silicon, metal and metal/silicon on substrates in an extremely dry gas atmosphere
GB2111809B (en) * 1981-12-14 1985-08-21 Atomic Energy Authority Uk An improved fluid permeable porous electric heating element
DE3211752C2 (en) * 1982-03-30 1985-09-26 Siemens AG, 1000 Berlin und 8000 München Process for the selective deposition of layer structures consisting of silicides of refractory metals on substrates consisting essentially of silicon and their use
JPS61245523A (en) * 1985-04-23 1986-10-31 Fujitsu Ltd Method for growth of aluminum film
JPS62105422A (en) * 1985-11-01 1987-05-15 Hitachi Ltd Manufacture of semiconductor device
JP2559703B2 (en) * 1986-04-11 1996-12-04 富士通株式会社 Method for epitaxial growth of wiring film
JP2538607B2 (en) * 1987-08-24 1996-09-25 富士通株式会社 Vapor growth method
DE3830720A1 (en) * 1988-09-09 1990-03-22 Philips Nv METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2772985A (en) * 1951-08-08 1956-12-04 Thompson Prod Inc Coating of molybdenum with binary coatings containing aluminum
US3382568A (en) * 1965-07-22 1968-05-14 Ibm Method for providing electrical connections to semiconductor devices
DE2025779C3 (en) * 1970-05-26 1980-11-06 Siemens Ag, 1000 Berlin Und 8000 Muenchen Process for depositing a layer of a binary compound on the surface of a semiconductor crystal
SE393967B (en) * 1974-11-29 1977-05-31 Sateko Oy PROCEDURE AND PERFORMANCE OF LAYING BETWEEN THE STORAGE IN A LABOR PACKAGE
US3974003A (en) * 1975-08-25 1976-08-10 Ibm Chemical vapor deposition of dielectric films containing Al, N, and Si
GB2041983B (en) * 1978-11-09 1982-12-01 Standard Telephones Cables Ltd Metallising semiconductor devices

Also Published As

Publication number Publication date
FR2469467A1 (en) 1981-05-22
DE3040693A1 (en) 1981-05-27
JPS5683026A (en) 1981-07-07

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Legal Events

Date Code Title Description
ST Notification of lapse