FR2366697A1 - Liquid cooled semiconductor power rectifier - has refrigerant channels in semiconductor electrode interfaces to minimise thermal distortion and increase current capacity - Google Patents
Liquid cooled semiconductor power rectifier - has refrigerant channels in semiconductor electrode interfaces to minimise thermal distortion and increase current capacityInfo
- Publication number
- FR2366697A1 FR2366697A1 FR7533171A FR7533171A FR2366697A1 FR 2366697 A1 FR2366697 A1 FR 2366697A1 FR 7533171 A FR7533171 A FR 7533171A FR 7533171 A FR7533171 A FR 7533171A FR 2366697 A1 FR2366697 A1 FR 2366697A1
- Authority
- FR
- France
- Prior art keywords
- rectifier
- semi
- conductor
- current capacity
- power rectifier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 239000007788 liquid Substances 0.000 title abstract 2
- 239000003507 refrigerant Substances 0.000 title abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Rectifiers (AREA)
Abstract
A semi-conductor power rectifier is esp. for use in the control circuitry of electrically powered trains. The rectifier is cooled using a refrigerant liquid such that distortion effects are minimised as is the need for pressure on the semi-conductor disc to maintain adequate electrical contact. The system allows an increase in the rectifier current capacity. The semi-conductor is in the form of the disc of passivated silicon held between two copper blocks. The blocks (3) are drilled out providing cooling channels (13, 14) across the semi-conductor-copper interface and axially (15, 16) through the blocks. The axial channels turns through an angle to emerge (17) from the block sides to connect with the surrounding volume of the rectifier.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7533171A FR2366697A1 (en) | 1975-10-30 | 1975-10-30 | Liquid cooled semiconductor power rectifier - has refrigerant channels in semiconductor electrode interfaces to minimise thermal distortion and increase current capacity |
FR7703185A FR2379911A2 (en) | 1975-10-30 | 1977-02-04 | Non-encapsulated semiconductor device - having epoxy! protective layer over non-ohmic areas of silicon substrate surface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7533171A FR2366697A1 (en) | 1975-10-30 | 1975-10-30 | Liquid cooled semiconductor power rectifier - has refrigerant channels in semiconductor electrode interfaces to minimise thermal distortion and increase current capacity |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2366697A1 true FR2366697A1 (en) | 1978-04-28 |
FR2366697B1 FR2366697B1 (en) | 1979-03-02 |
Family
ID=9161825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7533171A Granted FR2366697A1 (en) | 1975-10-30 | 1975-10-30 | Liquid cooled semiconductor power rectifier - has refrigerant channels in semiconductor electrode interfaces to minimise thermal distortion and increase current capacity |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2366697A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2907780A1 (en) * | 1979-02-28 | 1980-09-11 | Alsthom Atlantique | Support box for cooled power semiconductor - has cylindrical anode and cathode held together by polygonal plates with three parallel holding bolts |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2883591A (en) * | 1954-10-04 | 1959-04-21 | Westinghouse Electric Corp | Semiconductor rectifier device |
US3573574A (en) * | 1969-08-12 | 1971-04-06 | Gen Motors Corp | Controlled rectifier mounting assembly |
-
1975
- 1975-10-30 FR FR7533171A patent/FR2366697A1/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2883591A (en) * | 1954-10-04 | 1959-04-21 | Westinghouse Electric Corp | Semiconductor rectifier device |
US3573574A (en) * | 1969-08-12 | 1971-04-06 | Gen Motors Corp | Controlled rectifier mounting assembly |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2907780A1 (en) * | 1979-02-28 | 1980-09-11 | Alsthom Atlantique | Support box for cooled power semiconductor - has cylindrical anode and cathode held together by polygonal plates with three parallel holding bolts |
Also Published As
Publication number | Publication date |
---|---|
FR2366697B1 (en) | 1979-03-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |