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FR2204940B1 - - Google Patents

Info

Publication number
FR2204940B1
FR2204940B1 FR7238200A FR7238200A FR2204940B1 FR 2204940 B1 FR2204940 B1 FR 2204940B1 FR 7238200 A FR7238200 A FR 7238200A FR 7238200 A FR7238200 A FR 7238200A FR 2204940 B1 FR2204940 B1 FR 2204940B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7238200A
Other versions
FR2204940A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR7238200A priority Critical patent/FR2204940B1/fr
Priority to DE19732353276 priority patent/DE2353276A1/de
Priority to GB4964273A priority patent/GB1445366A/en
Priority to US409295A priority patent/US3913223A/en
Priority to JP48120434A priority patent/JPS4977171A/ja
Publication of FR2204940A1 publication Critical patent/FR2204940A1/fr
Application granted granted Critical
Publication of FR2204940B1 publication Critical patent/FR2204940B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • H05K3/062Etching masks consisting of metals or alloys or metallic inorganic compounds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0302Properties and characteristics in general
    • H05K2201/0305Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0361Etched tri-metal structure, i.e. metal layers or metal patterns on both sides of a different central metal layer which is later at least partly etched
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0364Conductor shape
    • H05K2201/0367Metallic bump or raised conductor not used as solder bump
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09536Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09563Metal filled via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0376Etching temporary metallic carrier substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703Plating
    • H05K2203/0726Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49158Manufacturing circuit on or in base with molding of insulated base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR7238200A 1972-10-27 1972-10-27 Expired FR2204940B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR7238200A FR2204940B1 (fr) 1972-10-27 1972-10-27
DE19732353276 DE2353276A1 (de) 1972-10-27 1973-10-24 Doppelseitige schaltung fuer mehrschichtschaltungen und verfahren zu ihrer herstellung
GB4964273A GB1445366A (en) 1972-10-27 1973-10-24 Method of manufacturing a wafer holding conductor patterns upon two opposite faces electrochemical production of substituted pyridines
US409295A US3913223A (en) 1972-10-27 1973-10-24 Method of manufacturing a double-sided circuit
JP48120434A JPS4977171A (fr) 1972-10-27 1973-10-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7238200A FR2204940B1 (fr) 1972-10-27 1972-10-27

Publications (2)

Publication Number Publication Date
FR2204940A1 FR2204940A1 (fr) 1974-05-24
FR2204940B1 true FR2204940B1 (fr) 1976-01-30

Family

ID=9106333

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7238200A Expired FR2204940B1 (fr) 1972-10-27 1972-10-27

Country Status (5)

Country Link
US (1) US3913223A (fr)
JP (1) JPS4977171A (fr)
DE (1) DE2353276A1 (fr)
FR (1) FR2204940B1 (fr)
GB (1) GB1445366A (fr)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4030190A (en) * 1976-03-30 1977-06-21 International Business Machines Corporation Method for forming a multilayer printed circuit board
US4205428A (en) * 1978-02-23 1980-06-03 The United States Of America As Represented By The Secretary Of The Air Force Planar liquid crystal matrix array chip
US4307179A (en) * 1980-07-03 1981-12-22 International Business Machines Corporation Planar metal interconnection system and process
IT1158136B (it) * 1982-08-27 1987-02-18 Seima Italiana Spa Perfezionamenti ai connettori di collegamento per fanali per autoveicoli
DE3315615A1 (de) * 1983-04-29 1984-10-31 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zur herstellung einer multilayer-schaltung
US4648179A (en) * 1983-06-30 1987-03-10 International Business Machines Corporation Process of making interconnection structure for semiconductor device
US4562513A (en) * 1984-05-21 1985-12-31 International Business Machines Corporation Process for forming a high density metallurgy system on a substrate and structure thereof
US4564423A (en) * 1984-11-28 1986-01-14 General Dynamics Pomona Division Permanent mandrel for making bumped tapes and methods of forming
US4912020A (en) * 1986-10-21 1990-03-27 Westinghouse Electric Corp. Printed circuit boards and method for manufacturing printed circuit boards
US4795861A (en) * 1987-11-17 1989-01-03 W. H. Brady Co. Membrane switch element with coated spacer layer
KR900702758A (ko) * 1988-09-02 1990-12-08 알렉스마이크 쥬니어 다층 인쇄회로기판의 제조방법
US4985990A (en) * 1988-12-14 1991-01-22 International Business Machines Corporation Method of forming conductors within an insulating substrate
US5136124A (en) * 1988-12-14 1992-08-04 International Business Machines Corporation Method of forming conductors within an insulating substrate
JPH02265243A (ja) * 1989-04-05 1990-10-30 Nec Corp 多層配線およびその形成方法
DE4312976A1 (de) * 1993-04-21 1994-10-27 Bosch Gmbh Robert Kontaktierung von elektrisch leitenden Schichten eines Schichtsystems
US5401913A (en) * 1993-06-08 1995-03-28 Minnesota Mining And Manufacturing Company Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
US6182359B1 (en) * 1997-01-31 2001-02-06 Lear Automotive Dearborn, Inc. Manufacturing process for printed circuits
US6222136B1 (en) * 1997-11-12 2001-04-24 International Business Machines Corporation Printed circuit board with continuous connective bumps
US6063647A (en) * 1997-12-08 2000-05-16 3M Innovative Properties Company Method for making circuit elements for a z-axis interconnect
JP3197540B2 (ja) * 1999-02-05 2001-08-13 ソニーケミカル株式会社 基板素片、及びフレキシブル基板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1126370A (en) * 1965-12-29 1968-09-05 British Aircraft Corp Ltd Improvements relating to printed circuits
FR1537780A (fr) * 1967-07-04 1968-08-30 Csf Nouveaux éléments de circuits magnétiques
FR1541719A (fr) * 1967-07-17 1968-10-11 Csf éléments magnétiques intégrés à structure feuilletée
US3681134A (en) * 1968-05-31 1972-08-01 Westinghouse Electric Corp Microelectronic conductor configurations and methods of making the same
FR1601312A (fr) * 1968-07-25 1970-08-17
US3673680A (en) * 1970-12-14 1972-07-04 California Computer Products Method of circuit board with solder coated pattern
US3700443A (en) * 1971-04-01 1972-10-24 Litton Systems Inc Flatpack lead positioning device
GB1400394A (en) * 1971-07-14 1975-07-16 Lucas Industries Ltd Method of producing electric wiring arrangement

Also Published As

Publication number Publication date
JPS4977171A (fr) 1974-07-25
FR2204940A1 (fr) 1974-05-24
GB1445366A (en) 1976-08-11
DE2353276A1 (de) 1974-05-09
US3913223A (en) 1975-10-21

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Legal Events

Date Code Title Description
ST Notification of lapse