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FR2266427A1 - Heat sink for printed circuit board - has liquid filled container with corrugated heat transfer wall - Google Patents

Heat sink for printed circuit board - has liquid filled container with corrugated heat transfer wall

Info

Publication number
FR2266427A1
FR2266427A1 FR7346456A FR7346456A FR2266427A1 FR 2266427 A1 FR2266427 A1 FR 2266427A1 FR 7346456 A FR7346456 A FR 7346456A FR 7346456 A FR7346456 A FR 7346456A FR 2266427 A1 FR2266427 A1 FR 2266427A1
Authority
FR
France
Prior art keywords
printed circuit
circuit board
liquid filled
filled container
transfer wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7346456A
Other languages
French (fr)
Other versions
FR2266427B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INFORMATIQUE CIE INTERNATIONALE FR
Original Assignee
INFORMATIQUE CIE INTERNATIONALE FR
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by INFORMATIQUE CIE INTERNATIONALE FR filed Critical INFORMATIQUE CIE INTERNATIONALE FR
Priority to FR7346456A priority Critical patent/FR2266427A1/en
Publication of FR2266427A1 publication Critical patent/FR2266427A1/en
Application granted granted Critical
Publication of FR2266427B1 publication Critical patent/FR2266427B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A sealed recipient contains a low boiling point liquid and in the interior of this is mounted the integrated circuit support which is adjacent to a corrugated wall of the recipient which is cooled by an external liquid. The corrugations have a depth appreciably greater than their distance apart. The integrated circuit support is mounted in the recipient so that its two faces are in contact with the low boiling point liquid. The support is held close to a wall which has sealed passages for the conductors soldered to the terminals of the printed circuit.
FR7346456A 1973-12-27 1973-12-27 Heat sink for printed circuit board - has liquid filled container with corrugated heat transfer wall Granted FR2266427A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7346456A FR2266427A1 (en) 1973-12-27 1973-12-27 Heat sink for printed circuit board - has liquid filled container with corrugated heat transfer wall

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7346456A FR2266427A1 (en) 1973-12-27 1973-12-27 Heat sink for printed circuit board - has liquid filled container with corrugated heat transfer wall

Publications (2)

Publication Number Publication Date
FR2266427A1 true FR2266427A1 (en) 1975-10-24
FR2266427B1 FR2266427B1 (en) 1979-08-31

Family

ID=9129734

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7346456A Granted FR2266427A1 (en) 1973-12-27 1973-12-27 Heat sink for printed circuit board - has liquid filled container with corrugated heat transfer wall

Country Status (1)

Country Link
FR (1) FR2266427A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0201652A1 (en) * 1985-05-10 1986-11-20 BBC Aktiengesellschaft Brown, Boveri & Cie. Boiler cooling for semiconductors, particularly for power rectifiers
WO1992022089A1 (en) * 1991-06-03 1992-12-10 Vlsi Technology, Inc. Semiconductor chip cooling apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0201652A1 (en) * 1985-05-10 1986-11-20 BBC Aktiengesellschaft Brown, Boveri & Cie. Boiler cooling for semiconductors, particularly for power rectifiers
WO1992022089A1 (en) * 1991-06-03 1992-12-10 Vlsi Technology, Inc. Semiconductor chip cooling apparatus

Also Published As

Publication number Publication date
FR2266427B1 (en) 1979-08-31

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Legal Events

Date Code Title Description
CD Change of name or company name
TP Transmission of property
ST Notification of lapse