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FR2143733B1 - - Google Patents

Info

Publication number
FR2143733B1
FR2143733B1 FR727222677A FR7222677A FR2143733B1 FR 2143733 B1 FR2143733 B1 FR 2143733B1 FR 727222677 A FR727222677 A FR 727222677A FR 7222677 A FR7222677 A FR 7222677A FR 2143733 B1 FR2143733 B1 FR 2143733B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR727222677A
Other versions
FR2143733A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2143733A1 publication Critical patent/FR2143733A1/fr
Application granted granted Critical
Publication of FR2143733B1 publication Critical patent/FR2143733B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Rectifiers (AREA)
FR727222677A 1971-06-30 1972-06-20 Expired FR2143733B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15831871A 1971-06-30 1971-06-30

Publications (2)

Publication Number Publication Date
FR2143733A1 FR2143733A1 (fr) 1973-02-09
FR2143733B1 true FR2143733B1 (fr) 1974-07-26

Family

ID=22567570

Family Applications (1)

Application Number Title Priority Date Filing Date
FR727222677A Expired FR2143733B1 (fr) 1971-06-30 1972-06-20

Country Status (7)

Country Link
US (1) US3741292A (fr)
JP (1) JPS5215358B1 (fr)
CA (1) CA961149A (fr)
DE (1) DE2231597C3 (fr)
FR (1) FR2143733B1 (fr)
GB (1) GB1319937A (fr)
IT (1) IT953761B (fr)

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US5083194A (en) * 1990-01-16 1992-01-21 Cray Research, Inc. Air jet impingement on miniature pin-fin heat sinks for cooling electronic components
US5014904A (en) * 1990-01-16 1991-05-14 Cray Research, Inc. Board-mounted thermal path connector and cold plate
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US5305184A (en) * 1992-12-16 1994-04-19 Ibm Corporation Method and apparatus for immersion cooling or an electronic board
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
FR2701625B1 (fr) * 1993-02-15 1995-05-24 Advanced Computer Assemblage de cartes d'un système informatique rapide.
US5704416A (en) * 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
US5458189A (en) * 1993-09-10 1995-10-17 Aavid Laboratories Two-phase component cooler
US5485671A (en) * 1993-09-10 1996-01-23 Aavid Laboratories, Inc. Method of making a two-phase thermal bag component cooler
US5411077A (en) * 1994-04-11 1995-05-02 Minnesota Mining And Manufacturing Company Flexible thermal transfer apparatus for cooling electronic components
JP3525498B2 (ja) * 1994-07-13 2004-05-10 株式会社デンソー 沸騰冷却装置
US5513070A (en) * 1994-12-16 1996-04-30 Intel Corporation Dissipation of heat through keyboard using a heat pipe
US5587880A (en) * 1995-06-28 1996-12-24 Aavid Laboratories, Inc. Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation
USD387333S (en) * 1995-09-25 1997-12-09 Curtis Instruments, Inc. Heatsink enclosure for an electrical controller
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US6019167A (en) * 1997-12-19 2000-02-01 Nortel Networks Corporation Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments
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FR2827115B1 (fr) * 2001-07-06 2003-09-05 Alstom Coffre pour convertisseur de puissance
US6744136B2 (en) 2001-10-29 2004-06-01 International Rectifier Corporation Sealed liquid cooled electronic device
DE10156085A1 (de) * 2001-11-16 2003-05-28 Sig Cantec Gmbh & Co Kg Vorrichtung und Verfahren zum Aufweiten und Formen von Dosenrümpfen
US6695039B1 (en) 2003-02-25 2004-02-24 Delphi Technologies, Inc. Orientation insensitive thermosiphon assembly for cooling electronic components
US20050039888A1 (en) * 2003-08-21 2005-02-24 Pfahnl Andreas C. Two-phase cooling apparatus and method for automatic test equipment
JP4573525B2 (ja) * 2003-12-24 2010-11-04 本田技研工業株式会社 固体高分子電解質型燃料電池
JP4394946B2 (ja) * 2003-12-24 2010-01-06 本田技研工業株式会社 燃料電池車
US7581585B2 (en) * 2004-10-29 2009-09-01 3M Innovative Properties Company Variable position cooling apparatus
US20060090881A1 (en) * 2004-10-29 2006-05-04 3M Innovative Properties Company Immersion cooling apparatus
DE102004059180B4 (de) * 2004-12-08 2008-08-21 Siemens Ag Widerstand mit Kühlung und Verwendung des Widerstands und Verfahren zur Widerstandskühlung
US20060162899A1 (en) * 2005-01-26 2006-07-27 Huang Wei C Structure of liquid cooled waterblock with thermal conductivities
US20070034360A1 (en) * 2005-06-08 2007-02-15 Hall Jack P High performance cooling assembly for electronics
US8240359B2 (en) * 2006-04-17 2012-08-14 Gerald Garrett Liquid storage and cooling computer case
US20080017355A1 (en) * 2006-05-16 2008-01-24 Hardcore Computer, Inc. Case for a liquid submersion cooled electronic device
US20130056178A1 (en) * 2010-05-19 2013-03-07 Nec Corporation Ebullient cooling device
TWI488562B (zh) * 2010-08-30 2015-06-11 Liquidcool Solutions Inc 擠製伺服器殼體
JP2013007501A (ja) * 2011-06-22 2013-01-10 Nec Corp 冷却装置
US8619425B2 (en) 2011-10-26 2013-12-31 International Business Machines Corporation Multi-fluid, two-phase immersion-cooling of electronic component(s)
USD698074S1 (en) 2012-04-17 2014-01-21 Ip Holdings, Llc External ballast frame
US8953320B2 (en) * 2012-09-13 2015-02-10 Levi A. Campbell Coolant drip facilitating partial immersion-cooling of electronic components
US9606587B2 (en) * 2012-10-26 2017-03-28 Google Inc. Insulator module having structure enclosing atomspheric pressure gas
US9430006B1 (en) 2013-09-30 2016-08-30 Google Inc. Computing device with heat spreader
US8861191B1 (en) 2013-09-30 2014-10-14 Google Inc. Apparatus related to a structure of a base portion of a computing device
US9332674B2 (en) * 2013-10-21 2016-05-03 International Business Machines Corporation Field-replaceable bank of immersion-cooled electronic components
US9282678B2 (en) 2013-10-21 2016-03-08 International Business Machines Corporation Field-replaceable bank of immersion-cooled electronic components and separable heat sinks
DE102014201483B4 (de) * 2014-01-28 2016-04-07 Wago Verwaltungsgesellschaft Mbh Quaderförmiges Gehäuse für ein Elektronikmodul, Elektronikmodul und Anordnung zur Kühlung wenigstens eines Elektronikmoduls
SG11201609166WA (en) * 2014-05-02 2016-12-29 Univ Singapore Device and method for a two phase heat transfer
US9442514B1 (en) 2014-07-23 2016-09-13 Google Inc. Graphite layer between carbon layers
USD757344S1 (en) 2014-08-26 2016-05-24 Ip Holdings, Llc Ballast housing
USD761481S1 (en) 2014-08-26 2016-07-12 Ip Holdings, Llc Ballast housing
USD780691S1 (en) 2015-05-20 2017-03-07 Ip Holdings, Llc Remote ballast
USD855238S1 (en) 2017-10-27 2019-07-30 Hgci, Inc. Ballast
USD871654S1 (en) 2017-10-30 2019-12-31 Hgci, Inc. Light fixture
TWI669479B (zh) 2018-08-22 2019-08-21 威剛科技股份有限公司 具有散熱功能的儲存裝置及硬碟
US11178789B2 (en) * 2020-03-31 2021-11-16 Advanced Energy Industries, Inc. Combination air-water cooling device
US12120847B1 (en) 2021-03-23 2024-10-15 Engendren LLC Container for one or more electronic devices and methods of use thereof

Also Published As

Publication number Publication date
JPS4817275A (fr) 1973-03-05
DE2231597C3 (de) 1980-12-04
JPS5215358B1 (fr) 1977-04-28
DE2231597A1 (de) 1973-01-18
GB1319937A (en) 1973-06-13
DE2231597B2 (de) 1980-04-17
FR2143733A1 (fr) 1973-02-09
US3741292A (en) 1973-06-26
IT953761B (it) 1973-08-10
CA961149A (en) 1975-01-14

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Legal Events

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