FR1233270A - Method of making semiconductor bodies - Google Patents
Method of making semiconductor bodiesInfo
- Publication number
- FR1233270A FR1233270A FR801882A FR801882A FR1233270A FR 1233270 A FR1233270 A FR 1233270A FR 801882 A FR801882 A FR 801882A FR 801882 A FR801882 A FR 801882A FR 1233270 A FR1233270 A FR 1233270A
- Authority
- FR
- France
- Prior art keywords
- semiconductor bodies
- making semiconductor
- making
- bodies
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bipolar Transistors (AREA)
- Junction Field-Effect Transistors (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL230223 | 1958-08-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1233270A true FR1233270A (en) | 1960-10-12 |
Family
ID=19751299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR801882A Expired FR1233270A (en) | 1958-08-04 | 1959-08-03 | Method of making semiconductor bodies |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE1095952B (en) |
FR (1) | FR1233270A (en) |
GB (1) | GB922150A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1100124A (en) * | 1964-02-13 | 1968-01-24 | Hitachi Ltd | Semiconductor devices and methods for producing the same |
JPH0624199B2 (en) * | 1982-07-30 | 1994-03-30 | 株式会社日立製作所 | Wafer processing method |
US5230747A (en) * | 1982-07-30 | 1993-07-27 | Hitachi, Ltd. | Wafer having chamfered bend portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer |
US5279992A (en) * | 1982-07-30 | 1994-01-18 | Hitachi, Ltd. | Method of producing a wafer having a curved notch |
DE102011088054A1 (en) * | 2011-12-08 | 2013-06-13 | Solarworld Innovations Gmbh | Method for manufacturing silicon wafer used in solar module, involves introducing parallel saw sections into silicon crystal so as to manufacture silicon discs and aligning saw sections parallel to longitudinal axis of silicon crystal |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2402839A (en) * | 1941-03-27 | 1946-06-25 | Bell Telephone Labor Inc | Electrical translating device utilizing silicon |
US2840770A (en) * | 1955-03-14 | 1958-06-24 | Texas Instruments Inc | Semiconductor device and method of manufacture |
-
1959
- 1959-07-31 GB GB2635259A patent/GB922150A/en not_active Expired
- 1959-07-31 DE DE1959N0017042 patent/DE1095952B/en active Pending
- 1959-08-03 FR FR801882A patent/FR1233270A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE1095952B (en) | 1960-12-29 |
GB922150A (en) | 1963-03-27 |
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