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FI109960B - Elektroninen laite - Google Patents

Elektroninen laite Download PDF

Info

Publication number
FI109960B
FI109960B FI914416A FI914416A FI109960B FI 109960 B FI109960 B FI 109960B FI 914416 A FI914416 A FI 914416A FI 914416 A FI914416 A FI 914416A FI 109960 B FI109960 B FI 109960B
Authority
FI
Finland
Prior art keywords
circuit board
housing
electronic
electronic device
inter
Prior art date
Application number
FI914416A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI914416A0 (fi
FI914416A (fi
Inventor
Ari Leman
Jari Olkkola
Timo Hirvonen
Veli-Matti Vaelimaa
Petri Hossi
Lasse Uronen
Original Assignee
Nokia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Corp filed Critical Nokia Corp
Priority to FI914416A priority Critical patent/FI109960B/fi
Publication of FI914416A0 publication Critical patent/FI914416A0/fi
Priority to DE69202405T priority patent/DE69202405T2/de
Priority to EP92308478A priority patent/EP0519767B1/de
Priority to AT92308478T priority patent/ATE122532T1/de
Publication of FI914416A publication Critical patent/FI914416A/fi
Priority to US08/183,577 priority patent/US5400949A/en
Priority to US08/345,610 priority patent/US5442521A/en
Application granted granted Critical
Publication of FI109960B publication Critical patent/FI109960B/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H05K9/0028—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet with retainers or specific soldering features
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S174/00—Electricity: conductors and insulators
    • Y10S174/35—Box or housing mounted on substrate or PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Pyrane Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
FI914416A 1991-09-19 1991-09-19 Elektroninen laite FI109960B (fi)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FI914416A FI109960B (fi) 1991-09-19 1991-09-19 Elektroninen laite
DE69202405T DE69202405T2 (de) 1991-09-19 1992-09-17 Eine Leiterplattenanordnung.
EP92308478A EP0519767B1 (de) 1991-09-19 1992-09-17 Eine Leiterplattenanordnung
AT92308478T ATE122532T1 (de) 1991-09-19 1992-09-17 Eine leiterplattenanordnung.
US08/183,577 US5400949A (en) 1991-09-19 1994-01-18 Circuit board assembly
US08/345,610 US5442521A (en) 1991-09-19 1994-11-28 Circuit board assembly

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI914416A FI109960B (fi) 1991-09-19 1991-09-19 Elektroninen laite
FI914416 1991-09-19

Publications (3)

Publication Number Publication Date
FI914416A0 FI914416A0 (fi) 1991-09-19
FI914416A FI914416A (fi) 1993-03-20
FI109960B true FI109960B (fi) 2002-10-31

Family

ID=8533160

Family Applications (1)

Application Number Title Priority Date Filing Date
FI914416A FI109960B (fi) 1991-09-19 1991-09-19 Elektroninen laite

Country Status (5)

Country Link
US (2) US5400949A (de)
EP (1) EP0519767B1 (de)
AT (1) ATE122532T1 (de)
DE (1) DE69202405T2 (de)
FI (1) FI109960B (de)

Families Citing this family (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI109960B (fi) * 1991-09-19 2002-10-31 Nokia Corp Elektroninen laite
DE4236593A1 (de) * 1992-10-29 1994-05-05 Siemens Ag Rückwandleiterplatte für einen Baugruppenrahmen
FI102805B (fi) * 1993-11-26 1999-02-15 Nokia Mobile Phones Ltd Matkapuhelimen rakenneratkaisu
FI103632B (fi) * 1994-06-16 1999-07-30 Nokia Mobile Phones Ltd Rf-suoja
FI103935B (fi) * 1994-09-07 1999-10-15 Nokia Mobile Phones Ltd Menetelmä EMC-suojakotelon kiinnittämiseksi piirilevyyn ja EMC-suojakotelo
US5621363A (en) * 1994-10-03 1997-04-15 Motorola, Inc. Modem having an electromagnetic shield for a controller
KR0175000B1 (ko) * 1994-12-14 1999-02-01 윤종용 전자파 억제구조를 갖는 반도체 소자
GB2297868B (en) * 1995-02-07 1999-04-28 Nokia Mobile Phones Ltd A shielding device
DE29505327U1 (de) * 1995-03-29 1995-08-03 Siemens AG, 80333 München Abschirmung für Logik- und Hochfrequenzschaltkreise
GB2300761B (en) * 1995-05-12 1999-11-17 Nokia Mobile Phones Ltd Electromagnetic shield assembly
DE19522455A1 (de) * 1995-06-21 1997-01-02 Telefunken Microelectron EMV-Abschirmung bei elektronischen Bauelementen
FI956226A (fi) * 1995-12-22 1997-06-23 Nokia Mobile Phones Ltd Menetelmä ja järjestely elektronisen väliaineen sähkömagneettiseksi suojaamiseksi
US5761053A (en) * 1996-05-08 1998-06-02 W. L. Gore & Associates, Inc. Faraday cage
DE29612557U1 (de) * 1996-07-19 1996-09-12 Nokia Mobile Phones Ltd., Salo Abschirmeinrichtung gegen elektromagnetische Strahlung
US5838551A (en) * 1996-08-01 1998-11-17 Northern Telecom Limited Electronic package carrying an electronic component and assembly of mother board and electronic package
TW486238U (en) * 1996-08-18 2002-05-01 Helmut Kahl Shielding cap
US5911356A (en) * 1996-08-19 1999-06-15 Sony Corporation Method for attaching lead parts and shield case to printed circuit board, and method for attaching chip parts, lead parts and shield case to printed circuit board
SE511426C2 (sv) 1996-10-28 1999-09-27 Ericsson Telefon Ab L M Anordning och förfarande vid avskärmning av elektronik
US6084530A (en) * 1996-12-30 2000-07-04 Lucent Technologies Inc. Modulated backscatter sensor system
US5952922A (en) * 1996-12-31 1999-09-14 Lucent Technologies Inc. In-building modulated backscatter system
US6046683A (en) * 1996-12-31 2000-04-04 Lucent Technologies Inc. Modulated backscatter location system
US6456668B1 (en) 1996-12-31 2002-09-24 Lucent Technologies Inc. QPSK modulated backscatter system
US6130623A (en) * 1996-12-31 2000-10-10 Lucent Technologies Inc. Encryption for modulated backscatter systems
US6184841B1 (en) 1996-12-31 2001-02-06 Lucent Technologies Inc. Antenna array in an RFID system
FI970409A (fi) 1997-01-31 1998-08-01 Nokia Mobile Phones Ltd Menetelmä mikrofonin suojaamiseksi ulkoisilta häiriötekijäiltä ja mikrofonin häiriösuojus
GB2322012B (en) 1997-02-05 2001-07-11 Nokia Mobile Phones Ltd Self securing RF screened housing
GB2327537B (en) 1997-07-18 2002-05-22 Nokia Mobile Phones Ltd Electronic device
FI115108B (fi) 1997-10-06 2005-02-28 Nokia Corp Menetelmä ja järjestely kuulokkeen vuotosiedon parantamiseksi radiolaitteessa
GB2330964B (en) 1997-11-04 2001-11-07 Nokia Mobile Phones Ltd A communication terminal with a partition wall
US6235985B1 (en) * 1998-04-13 2001-05-22 Lucent Technologies, Inc. Low profile printed circuit board RF shield for radiating pin
US6491528B1 (en) * 1998-12-24 2002-12-10 At&T Wireless Services, Inc. Method and apparatus for vibration and temperature isolation
US6178097B1 (en) 1999-01-22 2001-01-23 Dial Tool Industries, Inc. RF shield having removable cover
US6052045A (en) * 1999-03-12 2000-04-18 Kearney-National, Inc. Electromechanical switching device package with controlled impedance environment
US6191360B1 (en) * 1999-04-26 2001-02-20 Advanced Semiconductor Engineering, Inc. Thermally enhanced BGA package
US6369710B1 (en) 2000-03-27 2002-04-09 Lucent Technologies Inc. Wireless security system
DE10026353A1 (de) * 2000-05-27 2001-11-29 Mannesmann Vdo Ag Abgeschirmte, elektronische Schaltung
JP2002094689A (ja) * 2000-06-07 2002-03-29 Sony Computer Entertainment Inc プログラム実行システム、プログラム実行装置、中継装置、および記録媒体
US6499215B1 (en) * 2000-06-29 2002-12-31 International Business Machines Corporation Processing of circuit boards with protective, adhesive-less covers on area array bonding sites
USRE38381E1 (en) 2000-07-21 2004-01-13 Kearney-National Inc. Inverted board mounted electromechanical device
US8629005B1 (en) 2000-11-28 2014-01-14 Knowles Electronics, Llc Methods of manufacture of bottom port surface mount silicon condenser microphone packages
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US7130198B2 (en) * 2001-12-06 2006-10-31 Rohm Co., Ltd. Resin-packaged protection circuit module for rechargeable batteries and method of making the same
DE10164526A1 (de) * 2001-12-15 2003-06-18 Francotyp Postalia Ag Sicherheitschassis
EP1483769B1 (de) * 2002-03-08 2007-09-19 Kearney-National, Inc. Relaisformgehäuse zur oberflächenanbringung und verfahren zu seiner herstellung
TW519375U (en) * 2002-05-30 2003-01-21 Hannstar Display Corp Fixing structure of blocking mask
TW565009U (en) * 2003-01-20 2003-12-01 Benq Corp Electronic module having ball grid array
US20040147169A1 (en) 2003-01-28 2004-07-29 Allison Jeffrey W. Power connector with safety feature
US7326862B2 (en) * 2003-02-13 2008-02-05 Parker-Hannifin Corporation Combination metal and plastic EMI shield
US7005573B2 (en) 2003-02-13 2006-02-28 Parker-Hannifin Corporation Composite EMI shield
JP4090928B2 (ja) * 2003-03-31 2008-05-28 信越ポリマー株式会社 シールドボックス
KR20060118567A (ko) * 2003-12-31 2006-11-23 에프씨아이 전력 접점과 이를 포함하는 커넥터
US7458839B2 (en) * 2006-02-21 2008-12-02 Fci Americas Technology, Inc. Electrical connectors having power contacts with alignment and/or restraining features
JP4286871B2 (ja) * 2004-01-27 2009-07-01 エックスオー、ケア、アクティーゼルスカブ 歯科診療施術システム
TWI351918B (en) * 2004-01-29 2011-11-01 Laird Technologies Inc Ultra-low height electromagnetic interference shie
US7476108B2 (en) * 2004-12-22 2009-01-13 Fci Americas Technology, Inc. Electrical power connectors with cooling features
US7384289B2 (en) * 2005-01-31 2008-06-10 Fci Americas Technology, Inc. Surface-mount connector
US7303427B2 (en) * 2005-04-05 2007-12-04 Fci Americas Technology, Inc. Electrical connector with air-circulation features
EP1826867A1 (de) * 2006-02-22 2007-08-29 Alps Electric Co., Ltd. Antennenintegriertes Modul
US7425145B2 (en) * 2006-05-26 2008-09-16 Fci Americas Technology, Inc. Connectors and contacts for transmitting electrical power
US7726982B2 (en) 2006-06-15 2010-06-01 Fci Americas Technology, Inc. Electrical connectors with air-circulation features
US20080002384A1 (en) * 2006-06-30 2008-01-03 Motorola, Inc. Apparatus for providing radio frequency shielding and heat dissipation for electronic components
US20080143608A1 (en) * 2006-12-13 2008-06-19 Alps Electric Co., Ltd. Antenna-integrated module
US7641500B2 (en) * 2007-04-04 2010-01-05 Fci Americas Technology, Inc. Power cable connector system
US7905731B2 (en) * 2007-05-21 2011-03-15 Fci Americas Technology, Inc. Electrical connector with stress-distribution features
JP2008288523A (ja) * 2007-05-21 2008-11-27 Fujitsu Media Device Kk 電子部品，及びその製造方法
US7762857B2 (en) 2007-10-01 2010-07-27 Fci Americas Technology, Inc. Power connectors with contact-retention features
US8062051B2 (en) * 2008-07-29 2011-11-22 Fci Americas Technology Llc Electrical communication system having latching and strain relief features
FR2934749B1 (fr) 2008-07-31 2010-08-27 Wavecom Dispositif de blindage electromagnetique et de dissipation de chaleur degagee par un composant electronique et circuit electronique correspondant.
EP2197258A1 (de) * 2008-12-12 2010-06-16 BAE Systems PLC Abschirmung
AU2009326201B2 (en) * 2008-12-12 2014-02-27 Bae Systems Plc Shield
USD664096S1 (en) 2009-01-16 2012-07-24 Fci Americas Technology Llc Vertical electrical connector
USD608293S1 (en) 2009-01-16 2010-01-19 Fci Americas Technology, Inc. Vertical electrical connector
USD606497S1 (en) 2009-01-16 2009-12-22 Fci Americas Technology, Inc. Vertical electrical connector
USD610548S1 (en) 2009-01-16 2010-02-23 Fci Americas Technology, Inc. Right-angle electrical connector
USD640637S1 (en) 2009-01-16 2011-06-28 Fci Americas Technology Llc Vertical electrical connector
US8323049B2 (en) * 2009-01-30 2012-12-04 Fci Americas Technology Llc Electrical connector having power contacts
USD619099S1 (en) 2009-01-30 2010-07-06 Fci Americas Technology, Inc. Electrical connector
US8366485B2 (en) 2009-03-19 2013-02-05 Fci Americas Technology Llc Electrical connector having ribbed ground plate
USD618181S1 (en) 2009-04-03 2010-06-22 Fci Americas Technology, Inc. Asymmetrical electrical connector
USD618180S1 (en) 2009-04-03 2010-06-22 Fci Americas Technology, Inc. Asymmetrical electrical connector
DE102009033258B4 (de) * 2009-07-14 2019-01-10 Sew-Eurodrive Gmbh & Co Kg Gehäuse
JP2012256654A (ja) * 2011-06-07 2012-12-27 Sony Corp 回路基板及び電子機器
EP2774390A4 (de) 2011-11-04 2015-07-22 Knowles Electronics Llc Eingebettetes dielektrikum als barriere bei einer akustischen vorrichtung und herstellungsverfahren
EP2624034A1 (de) 2012-01-31 2013-08-07 Fci Abbaubare optische Kupplungsvorrichtung
USD718253S1 (en) 2012-04-13 2014-11-25 Fci Americas Technology Llc Electrical cable connector
US8944831B2 (en) 2012-04-13 2015-02-03 Fci Americas Technology Llc Electrical connector having ribbed ground plate with engagement members
USD727268S1 (en) 2012-04-13 2015-04-21 Fci Americas Technology Llc Vertical electrical connector
USD727852S1 (en) 2012-04-13 2015-04-28 Fci Americas Technology Llc Ground shield for a right angle electrical connector
US9257778B2 (en) 2012-04-13 2016-02-09 Fci Americas Technology High speed electrical connector
USD751507S1 (en) 2012-07-11 2016-03-15 Fci Americas Technology Llc Electrical connector
US9543703B2 (en) 2012-07-11 2017-01-10 Fci Americas Technology Llc Electrical connector with reduced stack height
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
USD745852S1 (en) 2013-01-25 2015-12-22 Fci Americas Technology Llc Electrical connector
USD720698S1 (en) 2013-03-15 2015-01-06 Fci Americas Technology Llc Electrical cable connector
US9794661B2 (en) 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
US9980368B2 (en) 2015-08-18 2018-05-22 Foxcomm Interconnect Technology Limited Detachable shielding device
US20170215305A1 (en) * 2016-01-27 2017-07-27 Raymond Kirk Price Emi shield for an electronic optical device
DE102016001617A1 (de) 2016-02-14 2017-08-17 Efkon Ag Abschirmvorrichtung für eine Antennenanordnung eines Fahrzeug-Mauterfassungsgerätes
DE102017208076A1 (de) * 2017-05-12 2018-11-15 Magna Powertrain Bad Homburg GmbH Bauteil mit EMV Schutz für elektronische Platine
CN112020907A (zh) * 2018-06-15 2020-12-01 惠普发展公司，有限责任合伙企业 电路板组装件
CN214901942U (zh) 2018-10-03 2021-11-26 怡得乐工业有限公司 用于安装到基板的emc屏蔽罩
DE112019007104T5 (de) * 2019-03-28 2021-12-09 Mitsubishi Electric Corporation Abschirmgehäuse
JP7523928B2 (ja) * 2020-03-27 2024-07-29 ラピスセミコンダクタ株式会社 シールドケース

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4410874A (en) * 1975-03-03 1983-10-18 Hughes Aircraft Company Large area hybrid microcircuit assembly
US4370515A (en) * 1979-12-26 1983-01-25 Rockwell International Corporation Electromagnetic interference
JPS58186951A (ja) * 1982-04-24 1983-11-01 Toshiba Corp 電子部品のパッケ−ジング方法
JPS60148158A (ja) * 1984-01-12 1985-08-05 Nec Corp 混成集積回路
US4626963A (en) * 1985-02-28 1986-12-02 Rca Corporation Wave solderable RF shield member for a printed circuit board
DK385587A (da) * 1986-08-01 1988-02-02 Siemens Ag Kredsloebsplade til anvendelse inden for kommunikationsteknikken
US4838475A (en) * 1987-08-28 1989-06-13 Motorola, Inc. Method and apparatus for EMI/RFI shielding an infrared energy reflow soldered device
US4839774A (en) * 1988-01-25 1989-06-13 Digital Equipment Corporation Apparatus and method for cooling electronic component packages using an array of directed nozzles fabricated in the circuit board
DE3811313A1 (de) * 1988-04-02 1989-10-19 Messerschmitt Boelkow Blohm Gehaeuse fuer hybrid-schaltungen
JPH03195094A (ja) * 1989-12-25 1991-08-26 Nippon Chemicon Corp 回路装置のシールド構造
JPH03206691A (ja) * 1990-01-08 1991-09-10 Nec Corp 混成集積回路
JPH04179256A (ja) * 1990-11-13 1992-06-25 Mitsubishi Electric Corp 半導体装置
FR2676853B1 (fr) * 1991-05-21 1993-12-03 Thomson Csf Procede d'ecriture et de lecture optique sur support d'informations a stockage haute densite.
FI109960B (fi) * 1991-09-19 2002-10-31 Nokia Corp Elektroninen laite

Also Published As

Publication number Publication date
FI914416A0 (fi) 1991-09-19
ATE122532T1 (de) 1995-05-15
FI914416A (fi) 1993-03-20
DE69202405T2 (de) 1996-01-18
EP0519767A2 (de) 1992-12-23
EP0519767A3 (en) 1993-01-20
US5400949A (en) 1995-03-28
DE69202405D1 (de) 1995-06-14
US5442521A (en) 1995-08-15
EP0519767B1 (de) 1995-05-10

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