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ES367823A1 - Printed circuits - Google Patents

Printed circuits

Info

Publication number
ES367823A1
ES367823A1 ES367823A ES367823A ES367823A1 ES 367823 A1 ES367823 A1 ES 367823A1 ES 367823 A ES367823 A ES 367823A ES 367823 A ES367823 A ES 367823A ES 367823 A1 ES367823 A1 ES 367823A1
Authority
ES
Spain
Prior art keywords
insulating material
conductors
copper
layer
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES367823A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF International UK Ltd
Original Assignee
Lucas Industries Ltd
Joseph Lucas Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Industries Ltd, Joseph Lucas Industries Ltd filed Critical Lucas Industries Ltd
Publication of ES367823A1 publication Critical patent/ES367823A1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

In the manufacture of a flexible printed circuit a sheet of conductive foil, e.g. copper, is coated on one side with a layer of insulating material, e.g. PVC, which is then set or cured, the foil is formed into a pattern of conductors by an etch-resist process, a layer of insulating material, e.g. PVC, is printed on to the conductors so that the conductors are exposed at predetermined points, and the printed layer is set or cured. The insulating material may contain additives and the copper conductor may be provided with a coating of dendritic copper oxide to enhance bonding of the insulating material to the copper foil.
ES367823A 1968-05-22 1969-05-21 Printed circuits Expired ES367823A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2440168A GB1254281A (en) 1968-05-22 1968-05-22 Printed circuits

Publications (1)

Publication Number Publication Date
ES367823A1 true ES367823A1 (en) 1971-04-16

Family

ID=10211162

Family Applications (1)

Application Number Title Priority Date Filing Date
ES367823A Expired ES367823A1 (en) 1968-05-22 1969-05-21 Printed circuits

Country Status (4)

Country Link
BE (1) BE733380A (en)
ES (1) ES367823A1 (en)
FR (1) FR2009162A1 (en)
GB (1) GB1254281A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05327192A (en) * 1992-05-15 1993-12-10 Cmk Corp Manufacture of flexible printed circuit board
DE102006033269B4 (en) 2006-07-18 2010-10-28 Continental Automotive Gmbh Method for producing an arrangement with a flexible conductor carrier, a base plate and a sealing body
ES2322737B1 (en) * 2007-02-20 2010-04-20 Agotek, S.L. PROXIMITY DETECTOR SYSTEM.

Also Published As

Publication number Publication date
GB1254281A (en) 1971-11-17
BE733380A (en) 1969-11-03
DE1925745B2 (en) 1972-10-12
FR2009162A1 (en) 1970-01-30
DE1925745A1 (en) 1970-01-15

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