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EP4288234A1 - Dispositif et procédé pour l'usinage laser d'une pièce - Google Patents

Dispositif et procédé pour l'usinage laser d'une pièce

Info

Publication number
EP4288234A1
EP4288234A1 EP22701611.0A EP22701611A EP4288234A1 EP 4288234 A1 EP4288234 A1 EP 4288234A1 EP 22701611 A EP22701611 A EP 22701611A EP 4288234 A1 EP4288234 A1 EP 4288234A1
Authority
EP
European Patent Office
Prior art keywords
zone
processing unit
laser processing
workpiece
focal zone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22701611.0A
Other languages
German (de)
English (en)
Inventor
Tim Hesse
Daniel FLAMM
Myriam Kaiser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Trumpf Laser und Systemtechnik Se
Original Assignee
Trumpf Laser und Systemtechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trumpf Laser und Systemtechnik GmbH filed Critical Trumpf Laser und Systemtechnik GmbH
Publication of EP4288234A1 publication Critical patent/EP4288234A1/fr
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

Definitions

  • the invention relates to a device for laser processing a workpiece in a processing plane.
  • the invention relates to a method for laser machining a workpiece in a machining plane.
  • the invention is based on the object of providing a method as mentioned at the outset, by means of which a plurality of beveled modification regions can be formed on a workpiece with a reduced number of work steps and/or with a reduced processing time.
  • the device comprises a first laser processing unit for forming a first focus zone extending in a first main direction of extent and at least one further laser processing unit for forming at least one further focus zone which extends in a direction relative to the first main extent transversely oriented additional main extension direction, wherein the first focus zone and the at least one additional focus zone are spaced apart parallel to the processing plane by a working distance, the first laser processing unit with the first focus zone and the at least one additional laser processing unit with the at least one additional focus zone each along a line parallel to the processing plane oriented feed direction are movable and the workpiece from a for a laser beam, from which the first focus zone and the at least one other Fo kuszone are each formed, transparent material is made.
  • modification areas can be produced at one processing point of the workpiece, which are oriented transversely and in particular perpendicularly to the processing plane and at which the material of the workpiece can in particular be separated. It can thereby, for example, separate workpiece segments from the workpiece, which a separating area have a plurality of separating surfaces oriented transversely and in particular perpendicularly to the processing plane. In particular, these separating surfaces have a geometry that corresponds to the focus zones.
  • first laser processing unit and the at least one additional laser processing unit are spaced apart by a working distance, it is possible in particular to achieve quasi-simultaneous processing and/or time-delayed processing of the workpiece with the first focus zone and the at least one additional focus zone. In particular, it is then no longer necessary to use different devices for forming material modifications along processing lines oriented transversely to one another.
  • the working distance is greater than or equal to a length or a width of a workpiece segment to be separated from the workpiece in the machining plane.
  • each further focal zone is then assigned in particular a further main extension direction.
  • the at least one further laser processing unit is to be understood, for example, as a second laser processing unit and/or a third laser processing unit.
  • the at least one further focus zone should be understood to mean, for example, a second focus zone and/or a third focus zone.
  • the first focal zone and the at least one further focal zone are not necessarily formed in a straight line, but can also have a curved shape, for example.
  • the main extension direction of a focal zone is to be understood as meaning a direction of a straight line which runs through a start and end point of the focal zone.
  • the working distance is at least 1 mm and/or at most 100 cm.
  • first laser processing unit and the at least one further laser processing unit are arranged facing the same outside of the workpiece. In this way, in particular, a technically simple construction of the device can be implemented.
  • the first focal zone and the at least one further focal zone are coupled into the workpiece through the same outside of the workpiece or can be coupled into the workpiece through the same outside of the workpiece.
  • first focal zone and the at least one further focal zone are coupled into the workpiece from the same direction.
  • laser machining of the workpiece in a machining plane means that the workpiece is machined parallel and/or along the machining plane in the feed direction.
  • first main direction of extent and/or the further main direction of extent are each oriented transversely or perpendicularly to the processing plane.
  • material modifications are formed which extend transversely or perpendicularly to the processing plane, i.e. which extend in particular with a directional component in the depth direction of the workpiece.
  • the workpiece extends parallel to the processing plane.
  • a length direction and/or width direction of the workpiece is oriented parallel to the processing plane.
  • a depth direction of the workpiece is oriented perpendicular to the machining plane.
  • the first main extension direction is oriented parallel or transverse to a depth direction of the workpiece.
  • the processing plane is oriented parallel or at least approximately parallel to an outside of the workpiece facing the first laser processing unit and/or the second laser processing unit.
  • the first laser processing unit and the at least one further laser processing unit are arranged parallel to the processing plane at a distance from one another.
  • the first laser processing unit and the first focus zone as well as the at least one additional laser processing unit and the at least one additional focus zone can be moved relative to the workpiece in the feed direction and/or relative to the workpiece parallel to the processing plane.
  • the workpiece is plate-shaped and/or flat.
  • first laser processing unit and the at least one further laser processing unit are coupled to one another mechanically and/or in terms of control technology in such a way that a movement of the first laser processing unit and the first focus zone on the one hand and the at least one further laser processing unit and the at least one further focus zone on the other hand along a common feed direction takes place. In this way, simultaneous and/or time-delayed processing of different local areas of the workpiece can be achieved.
  • the first laser processing unit and the at least one additional laser processing unit are coupled to one another mechanically and/or in terms of control technology such that a movement of the first laser processing unit and the first focus zone on the one hand and the at least one additional laser processing unit and at least one further focus zone, on the other hand, takes place along processing contours that are oriented parallel to one another and/or are offset parallel to one another.
  • the device comprises a holding device on which the first laser processing unit and the at least one additional laser processing unit are arranged, the first laser processing unit having the first focus zone and the at least one additional laser processing unit having the at least one additional focus zone by means of the holding device are movable in a common feed direction.
  • a mechanical coupling of the first laser processing unit and the at least one further laser processing unit can be achieved in a technically simple manner.
  • the first laser processing unit and the at least one additional laser processing unit each have a housing, by means of which the first laser processing unit and the at least one additional laser processing unit are arranged and/or attached to the holding device.
  • the further main extension direction is oriented at an angle of at least 1° and/or at most 89° to the first main extension direction.
  • first focal zone and the at least one further focal zone are arranged in sections at the same positions with respect to a depth direction perpendicular to the processing plane, and/or if the first focal zone and the at least one further focal zone are arranged in sections with respect to a depth direction perpendicular to the processing plane are placed in different positions.
  • material modifications can be produced along machining lines that are oriented differently to one another in different depth sections of the workpiece.
  • the first focal zone and the at least one further focal zone overlap in sections with respect to a depth direction oriented perpendicular to the processing plane.
  • the first focal zone and the at least one further focal zone adjoin one another with respect to a depth direction oriented perpendicular to the processing plane.
  • a smallest distance between the first focal zone and the at least one further focal zone in the depth direction is at most 10% of a length of the first focal zone.
  • the first focal zone and the at least one further focal zone extend in a common plane, which is oriented in particular perpendicularly to the processing plane.
  • the device comprises an adjustment device for adjusting the working distance, which is oriented parallel to the processing plane, between the first focus zone and the at least one additional focus zone and/or between the first laser processing unit and the at least one additional laser processing unit, with the working distance in particular being parallel to one to the processing plane parallel length direction and parallel to a processing plane parallel width direction.
  • the respective lengths of machining lines can be set on the material of the workpiece.
  • a respective length of a processing line and/or separating line generated by means of the at least one further focus zone can be adjusted with respect to a length of a processing line and/or separating line generated by means of the first focus zone at a specific processing point of the workpiece.
  • the working distance/the working distances are selected in such a way that a desired geometry is produced in a processing point and/or in a parting area of the workpiece.
  • an (imagined) shift of the first focal zone in the direction of the at least one further focal zone by the working distance at least one of the following applies:
  • the at least one further focal zone or all further focal zones extend completely on a certain side or more than 60% on a certain side with respect to a plane in which the first focal zone lies;
  • the first focal zone and the at least one further focal zone border one another and/or overlap at least in sections;
  • the first focal zone and the at least one further focal zone form a spatially contiguous area.
  • the device comprises an adjustment device for the respective adjustment of a working position of the first focus zone and the at least one further focus zone with respect to a depth direction oriented perpendicularly to the processing plane.
  • the first focal zone and the at least one further focal zone can be adapted to the workpiece depth and/or workpiece thickness.
  • the first focus zone and the at least one further focus zone can thereby be positioned relative to one another parallel to the depth direction in order to set a target geometry.
  • a respective working position of the first focus zone and the at least one further focus zone is constant or at least approximately constant with respect to the depth direction during laser processing of the workpiece. It can be advantageous if the first focus zone formed by means of the first laser processing unit has a quasi-non-diffracting and/or a Bessel-like beam profile. As a result, a focus zone that is elongated parallel to the depth direction of the workpiece can be realized in a technically simple manner.
  • Quasi-non-diffracting rays and/or Bessel-like rays are to be understood in particular as rays in which a transverse intensity distribution is propagation-invariant.
  • the transverse intensity distribution is understood to mean, in particular, an intensity distribution in a cross-sectional plane oriented perpendicular to the main beam propagation direction.
  • the transverse intensity distribution is essentially constant along a longitudinal direction and/or beam propagation direction of the beams.
  • the first focus zone can be formed with an asymmetrical beam cross section.
  • the first focus zone formed by means of the first laser processing unit is asymmetrical and in particular elliptical in a cross section parallel to the processing plane. In this way, in particular, the formation of cracks in a material of the workpiece during the formation of material modifications by means of laser processing can be monitored.
  • the device has an adjustment device for rotating an alignment of a largest diameter of the cross section of the first focal zone in the processing plane, and in particular if the largest diameter can be aligned parallel to the feed direction by means of the adjustment device and in particular can be aligned automatically.
  • a controlled alignment of cracks during the laser processing of the material of the workpiece can be achieved essentially parallel to the feed direction.
  • This enables in particular an optimized separation of the material.
  • the largest diameter of the cross section of the first focus zone is rotated about an axis of rotation perpendicular to the processing plane.
  • the at least one additional focus zone formed by means of the at least one additional laser processing unit is formed by dividing a laser beam into a plurality of partial beams, with the partial beams being focused in adjacent partial areas of the at least one additional focus zone. In this way, a focal zone with a definable three-dimensional geometry can be realized in a technically simple manner.
  • the partial beams each have one of two different states of polarization, partial beams each having different states of polarization being focused in adjacent partial areas of the at least one further focus zone.
  • the feed direction is oriented perpendicularly to the at least one further focal zone.
  • the device has a coupling device for coupling an input laser beam into the first laser processing unit and into the at least one further laser processing unit, with the in-coupling device splits the input laser beam into a first partial beam for coupling into the first laser processing unit and into at least one further partial beam for coupling into the at least one further laser processing unit.
  • the device can be operated with a single laser source, for example.
  • the coupling device is a polarization beam splitting device for splitting the input laser beam into the first partial beam and the at least one further partial beam.
  • a division of the input laser beam can be implemented in a technically simple manner.
  • a respective polarization of the first partial beam and the at least one further partial beam can be set by means of the coupling device.
  • a respective intensity and/or a respective power of the first partial beam and the at least one further partial beam can be adjusted by means of the coupling device.
  • the at least one additional laser processing unit is used to form a second focus zone with a second main direction of extent and a third focus zone with a third main direction of extent, with the second main direction of extent and the third main direction of extent each being oriented transversely to the first main direction of extent.
  • two further focal zones are formed, namely a second focal zone and a third focal zone.
  • the second focal zone and the third focal zone are then arranged at a distance from one another with respect to a depth direction perpendicular to the processing plane and/or the first focal zone is arranged between the second focal zone and the third focal zone with respect to a depth direction perpendicular to the processing plane.
  • the second focal zone and the third focal zone each extend in the depth direction between an outer side of the workpiece and the first focal zone when the material of the workpiece is acted upon.
  • the first focus zone extends with respect to the depth direction between the second focus zone and the third focus zone and in particular completely between the second focus zone and the third focus zone.
  • a combination of the first focal zone and the at least one further focal zone extends from a first outer side of the workpiece to a second outer side of the workpiece, spaced apart from the first outer side in the depth direction.
  • the second focus zone and the third focus zone are arranged at least in sections at the same positions with respect to a width direction and/or length direction parallel to the processing plane. In this way, in particular, temporal processing of the material of the workpiece with the second focus zone and the third focus zone can be achieved.
  • the second focus zone and the third focus zone are arranged at a distance from one another with respect to a width direction and/or length direction parallel to the processing plane.
  • the first focus zone is then arranged between the second and the third focus zone.
  • the device comprises a single first laser processing unit and/or a single additional laser processing unit, with a second focus zone having a second main direction of extension and a third focus zone having a third main direction of extension being formed in particular by means of the additional laser processing unit, the second main direction of extension and the third main direction of extension being formed are each oriented transversely to the first main direction of extent and wherein the second focus zone and the third focus zone are arranged at least in sections at the same positions with respect to a width direction and/or length direction parallel to the processing plane.
  • two further focal zones are formed, for example by means of the further laser processing unit, namely a second focal zone and a third focal zone.
  • the second focal zone and the third focal zone overlap when projected onto the processing plane.
  • the device comprises a single first laser processing unit and/or a second laser processing unit and a third laser processing unit, with a second focus zone being formed in particular by means of the second laser processing unit and a third focus zone being formed by means of the third laser processing unit, with the second focus zone and the third Focus zones are each oriented transversely to the first focus zone and the second focus zone and the third focus zone are spaced apart with respect to a width direction and/or length direction parallel to the processing plane.
  • two additional laser processing units and two additional focus zones are present.
  • a method for laser processing a workpiece in which a first focus zone extending in a first main direction of extent is formed using a first laser processing unit and at least one further focus zone is formed using at least one further laser processing unit, which extends into one direction relative to the first main extension direction transversely oriented additional main extension direction, wherein the first focus zone and the at least one additional focus zone are spaced apart parallel to the processing plane by a working distance, the workpiece is subjected to the first focus zone and the at least one additional focus zone, the first laser processing unit with the first focus zone and the at least one additional laser processing unit with the at least one additional focus zone can be moved relative to the workpiece along a feed direction oriented parallel to the processing plane, and wherein the workpiece consists of a laser beam from which the first focus zone and the at least one additional focus zone are each formed, transparent material is made.
  • the method according to the invention has in particular one or more features and/or advantages of the device according to the invention.
  • the method according to the invention can be carried out using the device according to the invention.
  • the device according to the invention carries out the method according to the invention.
  • the workpiece is acted upon at a specific processing point with the first focus zone and with the at least one further focus zone at a different time.
  • this allows material modifications to be produced at a specific machining point along machining lines oriented transversely to the machining plane with a time offset relative to a machining line oriented perpendicularly to the machining plane.
  • the workpiece is acted upon first with the at least one further focus zone and then with the first focus zone, or vice versa.
  • the at least one further laser processing unit is used to form a second focus zone and a third focus zone, which are each oriented transversely to the first focus zone, with the second focus zone and the third focus zone being spaced apart from one another with respect to a depth direction oriented perpendicularly to the processing plane are arranged and/or wherein the first focus zone is arranged between the second focus zone and the third focus zone with respect to a depth direction oriented perpendicularly to the processing plane.
  • the second focus zone and the third focus zone are applied to the workpiece at the same time at a specific processing point and the first focus zone is applied to the workpiece at this processing point with a time offset to the impact of the second focus zone and the workpiece on the workpiece third focal zone takes place.
  • a value of a time difference between an impact on the workpiece at a specific processing point with the first focus zone and with the at least one further focus zone corresponds to a quotient of the working distance and the feed rate (at constant feed rate and feed direction).
  • the workpiece is acted upon by the first focus zone, the second focus zone and the third focus zone at different times, in particular where the workpiece is acted upon by the first focus zone in terms of time between the workpiece being acted upon by the second focal zone and with the third focal zone.
  • the device according to the invention and/or the method according to the invention have one or more of the following features.
  • a movement of the first laser processing unit in the feed direction causes a corresponding movement of the first focus distribution in the feed direction.
  • a movement of the at least one further laser processing unit in the feed direction causes a corresponding movement of the at least one further focus distribution in the feed direction.
  • the first focus zone and/or the at least one further focus zone are each formed in a straight line and/or oblong and/or line-like and/or elongated.
  • the first focal zone and/or the at least one further focal zone each extend parallel to a straight line.
  • the first focus zone and the at least one further focus zone each form a spatially connected interaction area for laser processing of the workpiece, wherein in particular by impinging on a material of the workpiece with this interaction area, localized material modifications can be formed in the interaction area, by means of which in particular a separation of the material is made possible .
  • the first focal zone and/or the at least one further focal zone it is possible for the first focal zone and/or the at least one further focal zone to have zeros and/or interruptions, with these zeros and/or interruptions being compared in particular with a (total) length of the first focal zone and/or the at least one further focal zones are small.
  • relative movement of the workpiece with respect to the first focal zone and the at least one further focal zone in the material of the workpiece produces material modifications along a processing line and/or processing surface assigned to the first focal zone and the at least one further focal zone.
  • the workpiece can be separated or is separated by the formation of material modifications by means of the first focal zone and the at least one further focal zone along a machining line and/or machining surface.
  • the material of the workpiece can be separated along the processing line and/or processing surface by applying thermal stress and/or mechanical stress and/or by etching using at least one wet-chemical solution is separated.
  • the etching takes place in an ultrasonically assisted etching bath.
  • the input laser beam is a pulsed laser beam or an ultra-short pulsed laser beam.
  • the first focal zone and/or the at least one further focal zone are formed by means of a pulsed laser beam or ultra-short pulse laser beam.
  • control electronics for locally resolved pulse control in particular including pulse-on-demand, can be provided.
  • a workpiece holder is provided for the workpiece, which in particular has a non-reflective and/or highly scattering surface.
  • the device comprises a laser source for providing an input laser beam for coupling into the first laser processing unit and into the at least one further laser processing unit, with the laser source providing in particular a pulsed laser beam or an ultra-short pulse laser beam.
  • a wavelength of the input laser beam is at least 300 nm and/or at most 1500 nm.
  • the wavelength is 515 nm or 1030 nm.
  • the input laser beam has an average power of at least IW to 1kW.
  • the input laser beam includes pulses with a pulse energy of at least 10 pJ and/or at most 50 mJ. It can be provided that the input laser beam comprises individual pulses or bursts, the bursts having 2 to 20 sub-pulses and in particular a time interval of approximately 20 ns.
  • a transparent material is to be understood in particular a material through which at least 70% and in particular at least 80% and in particular at least 90% of a laser energy of the first focal zone and/or the at least one further focal zone are transmitted.
  • the first focal zone and/or the at least one further focal zone is considered in a modified intensity distribution, which only contains intensity values has, which are above a certain intensity threshold.
  • the intensity threshold is selected here, for example, in such a way that values lying below this intensity threshold have such a low intensity that they are no longer relevant for an interaction with the material for the formation of material modifications.
  • the intensity threshold is 50% of a global intensity maximum of the actual intensity distribution.
  • the first focal zone and/or the at least one further focal zone is to be understood in particular as a spatially connected range of intensities above the intensity threshold mentioned, with this range being interrupted with a spatial extent of at most 10% and in particular at most 5% of a maximum extent and/or or a maximum length of the first focal zone and/or the at least one further focal zone.
  • Such interruptions in the first focal zone and/or the at least one further focal zone arise, for example, when they are formed by dividing a laser beam into a plurality of partial beams and focusing the partial beams in adjacent partial areas. It comes from that for example, a formation of the focus zone by lining up spaced-apart focused points of light.
  • FIG. 1 shows a first exemplary embodiment of a device for laser processing of a workpiece with a first laser processing unit and a second laser processing unit;
  • FIG. 2 shows a further exemplary embodiment of a device for laser processing of a workpiece with a first laser processing unit, a second laser processing unit and a third laser processing unit;
  • 3a shows a cross-sectional representation of a simulated intensity distribution of an example of a first focus zone in an x-z plane oriented parallel to a main direction of extent of the first focus zone;
  • FIG. 3b shows a cross-sectional illustration of the intensity distribution of the first focal zone according to FIG. 3a in an xy plane oriented perpendicularly to the main direction of extent
  • FIG. 4a shows a cross-sectional illustration of a simulated intensity distribution of a further example of a first focus zone in an xz plane oriented parallel to a main direction of extension of the first focus zone;
  • FIG. 4b shows a cross-sectional illustration of the intensity distribution of the focal zone according to FIG. 4a in an x-y plane oriented perpendicularly to the main direction of extension;
  • 5a shows a cross-sectional representation of a simulated intensity distribution of an example of a second focal zone and a third focal zone in a y-z plane oriented parallel to a respective main extension direction of the second or third focal zone;
  • 5b shows a cross-sectional illustration of a simulated intensity distribution of an example of a second focus zone in a y-z plane oriented parallel to a main direction of extent of the second focus zone;
  • 5c shows a cross-sectional representation of a simulated intensity distribution of an example of a third focus zone in a y-z plane oriented parallel to a main direction of extent of the third focus zone;
  • Fig. 6 shows a schematic cross-sectional representation of a workpiece segment machined by means of the device and subsequently separated off in an x-y plane oriented parallel to the width direction and length direction of the workpiece;
  • FIG. 7 shows a schematic cross-sectional illustration of the workpiece segment according to FIG. 6 in a yz plane oriented parallel to the depth direction of the workpiece; 8 shows a schematic cross-sectional illustration of a section of a workpiece in the yz plane, which is modified by being acted on by means of a second and a third focal zone;
  • Fig. 9 shows a schematic cross-sectional representation of a section of a workpiece in the y-z plane, which is modified by means of a first focal zone at a machining point already modified by means of the second and third focal zones;
  • FIG. 10 shows a schematic cross-sectional illustration of the section of the workpiece according to FIG. 9, a beam path of partial beams for forming the first focal zone being shown;
  • Figure 11 is a schematic cross-sectional representation of a portion of a workpiece in the y-z plane on which material modifications are formed along curved machining lines by imparting curved focal zones to the material.
  • FIG. 1 A first exemplary embodiment of a device for laser machining a workpiece is shown in FIG. 1 and is denoted by 10 there.
  • the device 10 can be used to produce localized material modifications on a material 12 of a workpiece 14, such as flaws in the submicrometer range or at the atomic level, which result in a material weakening.
  • the workpiece 14 can be separated into workpiece segments that are different from one another, for example, in a subsequent step, or workpiece segments can be separated out of the workpiece 14, for example.
  • the device 10 comprises a laser source 16 (indicated in Fig.
  • the input laser beam 18 is in particular a pulsed laser beam and/or an ultra-short pulsed laser beam.
  • the input laser beam 18 is a Gaussian beam and/or has a diffractive beam profile.
  • the device 10 comprises a first laser processing unit 20 and a second laser processing unit 22 arranged at a distance from the first laser processing unit 20.
  • the device 10 For coupling the input laser beam 18 into the first laser processing unit 20 and into the second laser processing unit 22, the device 10 comprises, for example, a coupling device 24.
  • This coupling device 24 is used to convert the input laser beam 18 into a first partial beam 26 for coupling into the first laser processing unit 20 and into a second partial beam 28 for coupling into the second laser processing unit 22 divided.
  • first laser processing unit 20 and into the second laser processing unit 22 it would also be possible to couple different laser beams from different laser sources into the first laser processing unit 20 and into the second laser processing unit 22 .
  • a separate laser source would be provided for each of the first laser processing unit 20 and the second laser processing unit 22 .
  • the input laser beam 18 is split by polarization beam splitting.
  • the coupling device 24 includes a polarization element 30 for setting a polarization direction of the input laser beam 18.
  • the polarization element 30 is or includes a retardation plate, such as a lambda/2 or a lambda/4 plate.
  • This polarization element 30 is arranged in the beam path of the input laser beam 18 . After passing through the polarization element 30, the input laser beam has, for example, linear polarization with a defined direction of polarization. In principle, it is also possible for circularly or elliptically polarized light to be generated by means of the polarization element 30 .
  • the coupling device 24 also includes a polarization beam splitting element 32 for splitting the input laser beam 18 into the first partial beam 26 and the second partial beam 28.
  • This polarization beam splitting element 32 is arranged behind the polarization element 30 in relation to a beam propagation direction 34 of the input laser beam 18. For example, the polarization beam splitting element 32 is arranged on the first laser processing unit 20 .
  • the first partial beam 26 is formed by partial reflection of the input laser beam 18 at the polarization beam splitting element 32 and is deflected and/or coupled into the first laser processing unit 20 .
  • the second partial beam 28 is formed, for example, by partial transmission of the input laser beam 18 and passed through to the second laser processing unit 22 .
  • a mirror element 36 is provided in particular, which is arranged on the second laser processing unit 22, for example.
  • the first laser processing unit 20 has, for example, an axicon element (not shown).
  • the first focus zone 38 has a first main extension direction 40 along which the first focus zone 38 extends.
  • this first main extension direction 40 is oriented perpendicularly to a machining plane 42 (indicated in FIG. 1 ), in which the workpiece 14 can be machined by means of the device 10 .
  • the first focal zone 38 is to be understood in particular as a global maximum intensity distribution 50 which is in particular spatially coherent. In particular, only this global maximum intensity distribution 50 is relevant for an interaction with the material 12 of the workpiece 14 to be processed.
  • the maximum intensity distribution 50 is surrounded, for example, by secondary intensity distributions 52, which occur in particular in the practical implementation of the first focus zone 38. These secondary intensity distributions 52 are in particular arranged around the maximum intensity distribution 50 and/or arranged at a distance from the maximum intensity distribution 50 .
  • the secondary intensity distributions 52 are or include secondary maxima, for example.
  • FIG. 3b shows a cross section of the first focus zone 38 shown in FIG. 3a in an x-y plane oriented perpendicularly to the first main extension direction 40.
  • the first focal zone 38 has a symmetrical cross-section.
  • a diameter do of the first focal zone 38 is the same in any direction lying in the x-y plane.
  • the first focus zone 38 is circular in a cross-section oriented perpendicularly to the first main extension direction 40 .
  • the first focus zone 38 produced by means of the first laser processing unit 20 has an asymmetrical cross section in the x-y plane (FIGS. 4a and 4b).
  • the first focus zone 38 is formed by means of two parallel quasi-non-diffracting and/or Bessel-like beams (FIG. 4a).
  • the two beams are aligned with one another in such a way that they at least partially overlap, thereby forming a spatially coherent focal zone.
  • the first focus zone 38 is to be understood as the maximum intensity distribution 50, analogously to the example explained in FIGS. 3a and 3b.
  • the secondary intensity distributions 52 are negligible for an interaction with the material 12 of the workpiece 14 .
  • the first focal zone 38 has a largest diameter dmax, which is oriented parallel to the longitudinal direction x, for example.
  • a length I of the first focal zone 38 is, for example, in the range of micrometers, for example 300 ⁇ m to 2000 ⁇ m. In the example shown, this length I is oriented parallel to the first main extension direction 40 .
  • the diameter do or the maximum diameter dmax is in the micrometer range, for example.
  • the second partial beam 28 is imaged in a second focal zone 54 and a third focal zone 56 by means of the second laser processing unit 22 (FIGS. 5a, 5b and 5c).
  • the second focus zone 54 and the third focus zone 56 are formed by forming corresponding 3D focus distributions using the second laser processing unit 22 .
  • the second focus zone 54 has a second main direction of extension 58 and the third focus zone 56 has a third main direction of extension 60 .
  • the second focus zone 54 extends parallel to the second main direction of extent 58 and the third focus zone 56 extends parallel to the third main direction of extent 60.
  • the second direction of main extent 58 and the third direction of main extent 60 are each oriented transversely to the first direction of main extent 40 .
  • a respective orientation and/or a respective angle between the second main direction of extent 58 and the first main direction of extent 40 or between the third main direction of extent 60 and the first main direction of extent 40 can be adjusted.
  • the second main extension direction 58 and the third main extension direction 60 each enclose a smallest angle ⁇ of approximately 25° with the first main extension direction 40 .
  • the second focal zone 54 and the third focal zone 56 are in particular each formed from a plurality of partial beams which are focused in adjacent partial regions 62 of the second focal zone 54 and the third focal zone 56 .
  • partial regions 62 adjacent to one another, into which the partial beams are focused are arranged spatially so close to one another that a spatially coherent region results with regard to an interaction with the material 12 of the workpiece 14 .
  • a spatially contiguous area of material modifications can be formed on the material 12 of the workpiece 14 by means of the second focus zone 54 and the third focus zone 56, so that the latter can be separated in this contiguous area, in particular after the laser processing has been carried out.
  • the partial areas 62 lie on a straight line which is oriented parallel to the second main direction of extent 58 or to the third main direction of extent 60 .
  • the second partial beam 28 coupled into the second laser processing unit 22 is divided by the second laser processing unit 22 into a plurality of further partial beams, each of which has different states of polarization.
  • partial beams each having different states of polarization are then focused in adjacent partial regions 62 of the second focal zone 54 and the third focal zone 56 .
  • the second focal zone 54 has, for example, a length I2 in the micrometer range, for example a length I2 of 100 ⁇ m to 400 ⁇ m.
  • the third focal zone 56 has, for example, a length I3 in the micrometer range, for example a length I3 of 100 ⁇ m to 400 ⁇ m.
  • the workpiece 14 has, for example, a first outside 64 and a second outside 66 spaced apart from the first outside 64 parallel to the depth direction z.
  • the first laser processing unit 20 and the second laser processing unit 22 are each arranged to face the first outer side 64 .
  • the first focal zone 38, the second focal zone 54 and the third focal zone 56 can be coupled into the workpiece 14 coming from the same direction and/or through the same outside of the workpiece 14.
  • the first laser processing unit 20 and the second laser processing unit 22 are spaced apart from one another by a working distance A, with a distance direction being oriented parallel to the length direction x and/or to the width direction y.
  • a working distance A is oriented parallel to the length direction x and/or to the width direction y.
  • the device 10 includes in particular a setting device 68.
  • This setting device 68 can be used in particular to set and/or define the working distance A in a fixed manner during operation of the device 10.
  • the device 10 has an adjustment device
  • a respective Working position 72 (indicated in FIGS. 3a and 5a) of the first focus zone 38 and/or the second focus zone 54 and/or the third focus zone 56 can be adjusted.
  • first focus zone 38 and/or the second focus zone 54 and/or the third focus zone 56 can be displaced relative to one another with respect to the depth direction z by means of the adjustment device 70 .
  • the device 10 comprises an adjustment device 74, by means of which, in the case of an asymmetrical cross section of the first focal zone 38, an alignment 76 and/or an orientation (indicated in Fig. 4b) of the largest diameter d max in the processing plane 42 is adjustable.
  • the first laser processing unit 20 and the second laser processing unit 22 can each be moved parallel to an in particular common feed direction 78 relative to the workpiece 14 , this feed direction 78 being oriented parallel to the processing plane 42 .
  • the first laser processing unit 20 and the second laser processing unit 22 are coupled to one another in terms of control technology and/or mechanically in such a way that during operation of the device 10 they are moved relative to the workpiece along the common feed direction 78, with the working distance A between the first laser processing unit 20 and the second laser processing unit 22 is constant during operation of the device 10.
  • the device 10 includes a holding device 79 on which the first laser processing unit 20 and the second laser processing unit 22 are arranged.
  • a movement of the holding device 79 in the feed direction 78 leads to a corresponding movement of the first laser processing unit 20 and the second laser processing unit 22 in the feed direction.
  • the first laser processing unit 20 and the second laser processing unit 22 each have a housing 81, by means of which the first laser processing unit 20 and the second laser processing unit 22 are each arranged and/or attached to the holding device 79.
  • a movement of the first laser processing unit 20 in a specific feed direction 78 causes a corresponding movement of the associated first focus zone 38 in this feed direction 78 relative to the workpiece 14.
  • a movement of the second laser processing unit 22 in a specific feed direction 78 causes a corresponding movement of the associated second focus zone 54 and third focus zone 56 in this feed direction 78 relative to the workpiece 14.
  • the alignment 76 of the largest diameter d max is aligned parallel to the feed direction 78 by means of the adjustment device 74 and in particular is automatically aligned parallel to the feed direction 78 .
  • the device 10 has an adjustment device 80 by means of which the second focus zone 54 and the third focus zone 56 can each be rotated about an axis of rotation 82 oriented perpendicularly to the processing plane 42 .
  • This axis of rotation 82 is not necessarily arranged symmetrically to an extension of the second focal zone 54 or the third focal zone 56, but is assigned, for example, to a respective starting point 84 or an end point 86 of the second focal zone 54 or the third focal zone 56 (indicated in Fig. 5a).
  • the axis of rotation 82 may be oriented transversely or parallel to the working plane 42 .
  • An alignment 88 and/or orientation of the second focal zone 54 and the third focal zone 56 assigned to the axis of rotation 82 can be set during operation of the device 10 by means of the setting device 80 .
  • the second focus zone 54 and the third focus zone 56 is aligned at a fixed angle ⁇ to the feed direction 78 and, in particular, is automatically aligned (FIG. 8).
  • the angle ⁇ selected by means of the setting device 80 is ten 90° when the device is in operation.
  • the first focal zone 38, the second focal zone 54 and the third focal zone 56 are not necessarily formed in a straight line. In principle, it is also possible for the first focus zone 38 and/or the second focus zone 54 and/or the third focus zone 56 to have a curved shape and/or to have a curved longitudinal central axis (indicated in FIG. 11).
  • the respective main extension direction 40, 58, 60 of the focal zone 38, 54, 56 is to be understood, for example, as a direction of a straight line which runs through the starting point 84 and the end point 86 of the associated focal zone 38, 54, 56.
  • a further embodiment of a device 10' shown in FIG. 2 differs from the above-described embodiment of the device 10 according to FIG that a separate laser processing unit is provided to form the second focal zone 54 and the third focal zone 56 .
  • the device 10' has one or more features and/or advantages of the device 10 described above.
  • the device 10 ′ comprises the first laser processing unit 20 which is set up to form the first focus zone 38 .
  • Device 10' further comprises a second laser processing unit 90 and a third laser processing unit 92.
  • the second laser processing unit 90 and the third laser processing unit 92 are in particular of the same design and/or have in particular the same mode of operation as the second laser processing unit 22 described above, so that in this respect the above description is referred to.
  • the second laser processing unit 90 and the third laser processing unit 92 have a number of features and/or advantages of the second laser processing unit 22 described above.
  • the second focus zone 54 is formed using the second laser processing unit 90 and the third focus zone 56 is formed using the third laser processing unit 92 .
  • the second laser processing unit 90 is spaced apart from the first laser processing unit 20 by a first working distance Ai
  • the third laser processing unit 92 is spaced apart from the first laser processing unit 20 by a second working distance A2, with a respective spacing direction of the working distance Ai and of the Working distance A2 is oriented parallel to the processing plane 42.
  • the second focus zone 54 created by the second laser processing unit 90 is spaced from the first focus zone 38 created by the first laser processing unit 20 at the working distance Ai, and the third focus zone 56 created by the third laser processing unit 92 is spaced from the first focus zone 38 at the working distance A2.
  • the first laser processing unit 20 or the first focus zone 38 is arranged between the second laser processing unit 90 or the second focus zone 54 and the third laser processing unit 92 or the third focus zone 56 with respect to the length direction x and/or the width direction y.
  • the laser processing units 20, 90, 92 or the focus zones 38, 54, 56 with respect to the length direction x and/or the width direction y are positioned in any other order.
  • the first laser processing unit 20, the second laser processing unit 90 and the third laser processing unit 92 are arranged on the holding device 79 and can be moved by means of the holding device 79 parallel to the common feed direction 78 relative to the workpiece 14.
  • the first focus zone 38, the second focus zone 54 and the third focus zone 56 can be moved relative to the workpiece 14 parallel to the common feed direction 78.
  • the device 10′ includes a coupling device 24′, which basically has the same functionality as the coupling device 24 described above, so that in this respect reference is made to its description above.
  • the in-coupling device 24' has one or more features and/or advantages of the in-coupling device 24 described above.
  • the input laser beam 18 is divided by means of the coupling device 24' into a first partial beam 94 for coupling into the third laser processing unit 92, a second partial beam 96 for coupling into the first laser processing unit 20 and a third partial beam 98 for coupling into the second laser processing unit 90 and in particular divided by means of polarization beam splitting.
  • the in-coupling device 24′ comprises a first polarization element 30a and a second polarization element 30b arranged behind the first polarization element 30a in the beam propagation direction 34 .
  • a first polarization beam splitting element 32a for splitting the input laser beam 18 into the first partial beam 94 and a transmitted beam 100 is arranged between the first polarization element 30a and the second polarization element 30b.
  • This transmitted beam 100 strikes the second polarization element 30b and is then split into the second partial beam 96 and the third partial beam 98 by means of a second polarization beam splitting element 32b.
  • An intensity ratio and/or power ratio of the first partial beam 94, the second partial beam 96 and the third partial beam 98 can be adjusted by means of the first polarization beam splitting element 32a and the second polarization beam splitting element 32b.
  • the device 10 works as follows:
  • One or more workpiece segments 101 can be separated from the workpiece 14 by laser processing of the workpiece 14 using the device 10 .
  • the material 12 of the workpiece 14 is exposed to the first focus zone 38 , the second focus zone 54 and the third focus zone 56 .
  • the second focus zone 54 and the third focus zone 56 are arranged and formed by means of the second laser processing unit 22 in such a way that the second focus zone 54 is arranged at a distance from the third focus zone 56 in the depth direction z and/or that the second focus zone 54 and the third focus zone 56 are arranged at the same positions with respect to the length direction x and/or the width direction y.
  • the first focal zone 38 is arranged and formed in such a way that it extends between the second focal zone 54 and the third focal zone 56 and, in particular, completely between the second focal zone 54 and the third focal zone 56 with respect to the depth direction z.
  • the first focus zone 38 is here with the Working distance A to the second focal zone 54 and the third focal zone 56 spaced. In the situation shown in FIG. 1, this working distance A is oriented parallel to the feed direction 78, for example.
  • the third focal zone 56 extends within the material 12 with respect to the depth direction z between the second outer side 66 of the workpiece 14 and the first focal zone 38.
  • the second focal zone 54 extends with respect to the depth direction z between the first focal zone 38 and the first outer side 64 .
  • Respective positions of the first focal zone 38, the second focal zone 54 and the third focal zone 56 in the depth direction can be set, for example, by means of the setting device 70.
  • first focus zone 38, the second focus zone 54 and the third focus zone 56 for processing the workpiece 14 extend in a common plane, which is oriented in particular perpendicularly to the processing plane 42. This can be implemented, for example, by appropriate adjustment using the setting devices 68 and 80 .
  • the material modifications produced at the processing point 102 by means of the second focus zone 54 are arranged along a second processing line 104 .
  • material modifications are formed along a third processing line 106 at the processing point 102 by means of the third focus zone 56 .
  • material modifications are formed along a respective processing surface and/or processing plane, which, for example, is parallel to second processing line 104 and to Feed direction 78 or parallel to the third processing line 106 and to the feed direction 78 is oriented.
  • the first focus zone 38 hits the processing point 102 of the workpiece 14 under consideration after the second focus zone 54 or the third focus zone 56 (FIG. 9), with a time interval corresponding, for example, to a quotient of the working distance and the feed rate (at a constant feed rate and feed direction). .
  • material modifications are produced in the material 12 along a first processing line 108 by subjecting the material 12 to the first focal zone 38, with material modifications being formed along a corresponding processing surface and/or processing plane by moving the first focal zone 38 relative to the material 12, which is oriented parallel to the first processing line 108 and to the feed direction 78, for example.
  • a respective length and/or shape of the first processing line 108 or the second processing line 104 or the third processing line 106 corresponds in particular to a respective length and/or shape of the first focus zone 38 or the second focus zone 54 or the third focus zone 56 upon impingement of the workpiece 14 within the material 12.
  • the first processing line 108 has a length l' corresponding to the first focal zone 38
  • the second processing line 104 has a length l'2 corresponding to the second focal zone 54
  • the third processing line 106 has a length l' corresponding to the third focal zone 56. 3 on.
  • the workpiece 14 is laser machined by means of the device 10 along predetermined machining contours 110, the machining contours 110 being closed contours, for example.
  • material modifications are formed on the material 12 along the processing surfaces assigned to the processing lines 104, 106, 108, at which the material 12 can be separated.
  • workpiece segments 101 can be separated from the workpiece 14 and/or separated from the workpiece 14 .
  • a workpiece segment 101 is separated, for example, by thermal stress and/or by applying mechanical stress and/or by etching using at least one wet chemical solution, for example in an ultrasonically assisted etching bath.
  • a geometry of the workpiece segment 101 in a separation area 112 and/or edge area corresponds to a geometry of the first focus zone 38, the second focus zone 54 and the third focus zone 56, by means of which the workpiece 14 was previously acted upon.
  • the workpiece segment 101 has, in particular, beveled edges 114 (chamfers), which were produced by means of the second focus zone 54 and the third focus zone 56 .
  • the assigned second processing line 104 or third processing line 106 also have a correspondingly curved shape (FIG. 11). As a result, rounded edges can be formed in the separating area 112, for example.
  • the corresponding lengths I, I2 and I3 or I, 1'2 and 1 '3 define.
  • edge lengths in the separating region 112 can thereby be defined.
  • the alignment 76 of the largest diameter dmax is aligned parallel to the feed direction 78 by the adjustment device 74 in particular. This leads to the formation of cracks in the material 12, which are at least approximately parallel to the feed direction 74 and/or to the corresponding processing plane are aligned, which in particular enables improved material separation.
  • first focal zone 38 with an asymmetrical cross-section and the setting of the alignment 76 parallel to the preferred direction 78 is particularly relevant when, as in the case of the example described above, the processing point 102 is exposed to the first focal zone 38 after it has already been exposed to the second focal zone 54 was applied.
  • partial beams 116 are shielded, by means of which the first focus zone 38 is formed (indicated in FIG. 10).
  • This can, particularly in the case of a symmetrical cross-section of the first focal zone 38, disrupt the formation of cracks in the material 12 and, for example, disrupt it in such a way that cracks are formed at different angles to the preferred direction 78 and/or not essentially parallel to the feed direction 78, as desired.
  • a first focal zone 38 with an asymmetrical cross section and adjustment of the orientation 76 parallel to the feed direction 78 can also control crack formation in this situation such that cracks are formed essentially parallel to the feed direction 78 .
  • the device 10' shown in Fig. 2 basically has the same functionality as the device 10.
  • the second focus zone 54 is spaced from the first focus zone 38 by the working distance Ai and the third focus zone 56 is spaced from the first focus zone 38 by the working distance A2, with the first focus zone 38 located between the second focal zone 54 and the third focal zone 56 .
  • material modifications are first formed along the second processing line 104 at a specific processing point 102 of the workpiece 14, then along the first processing line 108 and then along the third processing line 106.
  • the order in which the first processing line 108, the second processing line 104 and the third processing line 106 are formed can be in any different order.
  • the devices 10, 10' can be appropriately adapted and/or set if necessary.
  • Alignment second laser processing unit third laser processing unit first partial beam second partial beam third partial beam transmitted beam

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne un dispositif pour l'usinage laser d'une pièce (14) dans un plan d'usinage (42), qui comprend une première unité d'usinage laser (20), destinée à former une première zone de focalisation (38) s'étendant dans une première direction d'étendue principale (40), et au moins une autre unité d'usinage laser (22 ; 90, 92), destinée à former au moins une autre zone de focalisation (54, 56) qui s'étend dans une autre direction d'étendue principale (58, 60) orientée perpendiculairement à la première direction d'étendue principale (40), la première zone de focalisation (38) et ladite au moins une autre zone de focalisation (54, 56) étant situées à une distance de travail (A ; A1, A2) l'une de l'autre parallèlement au plan d'usinage (42), la première unité d'usinage laser (20) avec la première zone de focalisation (38) et ladite au moins une autre unité d'usinage laser (22 ; 90, 92) avec ladite au moins une autre zone de focalisation (54, 56) pouvant se déplacer respectivement dans une direction d'avance (78) orientée parallèlement au plan d'usinage (42), et la pièce (14) étant fabriquée dans un matériau (12) transparent à un faisceau laser à partir duquel la première zone de focalisation (38) et ladite au moins une autre zone de focalisation (54, 56) sont respectivement réalisées.
EP22701611.0A 2021-02-02 2022-01-25 Dispositif et procédé pour l'usinage laser d'une pièce Pending EP4288234A1 (fr)

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DE102021102387.4A DE102021102387A1 (de) 2021-02-02 2021-02-02 Vorrichtung und Verfahren zur Laserbearbeitung eines Werkstücks
PCT/EP2022/051529 WO2022167252A1 (fr) 2021-02-02 2022-01-25 Dispositif et procédé pour l'usinage laser d'une pièce

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JP5446631B2 (ja) 2009-09-10 2014-03-19 アイシン精機株式会社 レーザ加工方法及びレーザ加工装置
KR20140024919A (ko) * 2011-06-15 2014-03-03 아사히 가라스 가부시키가이샤 유리판의 절단 방법
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WO2020254639A1 (fr) * 2019-06-21 2020-12-24 Trumpf Laser- Und Systemtechnik Gmbh Procédé et dispositif pour l'usinage d'une pièce avec composition du faisceau d'usinage à partir d'au moins deux profils de faisceau

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US11992897B2 (en) 2024-05-28
KR20230130138A (ko) 2023-09-11
CN116802009A (zh) 2023-09-22
US20240017352A1 (en) 2024-01-18
WO2022167252A1 (fr) 2022-08-11

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