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EP4179569A1 - Electronic power module, electrical system comprising such a module, corresponding manufacturing methods - Google Patents

Electronic power module, electrical system comprising such a module, corresponding manufacturing methods

Info

Publication number
EP4179569A1
EP4179569A1 EP21734841.6A EP21734841A EP4179569A1 EP 4179569 A1 EP4179569 A1 EP 4179569A1 EP 21734841 A EP21734841 A EP 21734841A EP 4179569 A1 EP4179569 A1 EP 4179569A1
Authority
EP
European Patent Office
Prior art keywords
projection
module
block
component
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21734841.6A
Other languages
German (de)
French (fr)
Inventor
Aurélien POUILLY
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
POUILLY, AURELIEN
Valeo Electrification
Original Assignee
Valeo eAutomotive France SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo eAutomotive France SAS filed Critical Valeo eAutomotive France SAS
Publication of EP4179569A1 publication Critical patent/EP4179569A1/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10166Transistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10568Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/10886Other details
    • H05K2201/10901Lead partly inserted in hole or via

Definitions

  • the present invention relates to an electronic power module, an electrical system comprising such a module and corresponding manufacturing methods. It will find its applications in particular in the automotive field.
  • power electronic modules comprising electronic chips are implemented in order to control electrical signals making it possible to control the operation of an electrical system, such as a rotating electrical machine.
  • the chips can be protected by an overmoulding, for example in epoxy resin, forming a rigid block coating the chips.
  • metal inserts can be provided in the molded block to allow the passage of card fixing screws. The inserts are for example molded at the same time as the chips and are flush with one face of the molded block facing the card.
  • the card is positioned against the face of the molded block and fixed by means of screws screwed into the inserts.
  • the presence of the inserts constitutes an additional cost.
  • these inserts are essential to prevent the screwing from cracking the overmolded block and compromising the protection of the chips.
  • an electronic power module comprising: at least one electronic chip; and an electrically insulating overmolded block at least partially encasing each chip; characterized in that it comprises at least one bearing projection of a component, such as an electronic control card for each chip, the projection comprising an electrically insulating material and extending from one face of the block .
  • the projection or projections it is possible to keep the component away from the block without requiring a plastic casing.
  • one or more of these projections can be used to fix the component by screwing and this without requiring a metal insert. Indeed, the screwing can be carried out in the material of the projection, so that the screw does not reach the block and therefore presents little risk of damaging the latter.
  • the projection has a free end defining a contact face of the component.
  • the contact face is flat.
  • At least one projection is designed to secure the component.
  • the contact face of the projection designed to fix the component has a screw hole.
  • the screw hole is either threaded or smooth and intended to cooperate with a self-forming or else self-tapping screw.
  • the contact face of the projection is designed to allow the component to move away from this contact face.
  • the contact face of the projection designed to allow the component to move away has no bore.
  • the projection has the shape of a truncated cone and/or a truncated pyramid.
  • the projection and the block are in one piece.
  • the projection and the block are in two separate parts. [0021] Also optionally, it comprises an electrical conductor and the projection is attached to the conductor.
  • the conductor has a light and the projection is attached to the conductor through the light.
  • the projection is fixed by riveting or riveting or overmolding on the conductor.
  • the block coats a base of the projection.
  • An electrical system comprising a module according to the invention and a component resting on each projection.
  • a method for manufacturing a module according to the invention comprising: obtaining the chip or chips; the overmolding of the chips by the block, for example by transfer molding or else by compression molding; and the realization of each support projection of the component.
  • the overmolding step is carried out using a mold comprising a main molding cavity corresponding to the block and at least one secondary molding cavity corresponding respectively to the projection or projections, this secondary cavity being in communication with the main cavity, so that each projection and the block are in one piece.
  • each projection is separate from the overmolding step, so that the projection(s) and the block are separate parts.
  • a method of manufacturing an electrical system according to the invention comprising: the manufacture of a module according to the invention; the displacement by a machine tool of the component in the direction of the face of the block until the component bears against each projection; the machine tool detecting an increase in a reaction to the displacement; and stopping by the machine tool of the movement of the component.
  • Figure 1 is an electrical circuit of an example of an electrical system implementing the invention
  • Figure 2 is a sectional view of an electronic power module of the system of Figure 1,
  • Figure 3 is a perspective view of a first example of the electronic power module of Figure 2,
  • Figure 4 illustrates the module of Figure 3, further equipped with an electronic card represented so as to be able to see the rest of the module by transparency,
  • Figure 5 is a block diagram illustrating the steps of a method of manufacturing an electrical system comprising the module of Figures 2 to 4,
  • FIG. 5 partially illustrates in perspective another example of an electronic power module according to the invention
  • Figure 7 repeats Figure 6, with an overmolded block of the module removed, and
  • Figure 8 illustrates in section the module of Figures 6 and 7.
  • the electrical system 100 is for example intended to be implemented in a motor vehicle (not shown).
  • the electrical system 100 firstly comprises a DC voltage source 102 comprising a positive terminal and a negative terminal, the latter being generally connected to an electrical ground, such as a chassis of the motor vehicle.
  • the DC voltage source 102 is designed to provide an input voltage denoted E.
  • the electrical system 100 further comprises a rotating electrical machine 104 comprising stator phases.
  • the rotating electrical machine 104 is part of an alternator-starter coupled to a heat engine (not shown) of the motor vehicle.
  • the rotating electric machine 104 is thus designed to operate alternately in engine mode in which it assists the heat engine and in alternator mode in which it transforms part of the mechanical energy generated by the heat engine into electrical energy to recharge the DC voltage source 102.
  • the electrical system 100 further comprises a voltage converter 106 connected, on the one hand, to the terminals of the DC voltage source 102 and, on the other hand, to the rotating electrical machine 104.
  • the voltage converter 106 comprises switching arms respectively associated with the stator phases. Each switch arm has a high side switch connected to the positive terminal of DC voltage source 102 and a low side switch connected to the negative terminal of DC voltage source 102. The high side switch and the low side switch are further connected to each other at a midpoint connected to the associated stator phase.
  • Each switching arm is intended to be controlled to switch between two configurations.
  • first called high configuration
  • the high side switch is closed and the low side switch is open so that the input voltage E is applied to the associated stator phase.
  • second known as the low configuration
  • the high side switch is open and the low side switch is closed so that zero voltage is applied to the associated stator phase.
  • the electrical system 100 further comprises electronic power modules 107 respectively implementing the switching arms.
  • the electrical system 100 further comprises a device 108 for controlling the modules 107, to cause each arm to switch between these two configurations.
  • the voltage converter 106 is controlled as an inverter so as to supply electrical energy to the rotating electrical machine 104 when it is desired that it operates in motor mode.
  • the voltage converter 106 is controlled as a rectifier to supply electrical energy to the DC voltage source 102 (for example, to recharge it) when it is desired that the rotating electrical machine 104 operates in alternator mode.
  • the switches are semiconductor switches comprising, for example, transistors.
  • the switches are for example insulated gate field effect transistors (from the English “Metal Oxide Semiconductor Field Effect Transistor” or MOSFET) or even insulated gate bipolar transistors (from the English “Insulated Gate Bipolar Transistor” or IGBT).
  • the various elements will be spatially identified according to an arbitrary orthogonal reference frame comprising a vertical direction V, a longitudinal direction L and a transverse direction T.
  • the module 107 first of all comprises one or more electronic chips 201 comprising, in the example described, each one of the semiconductor switches of the switching arms of the voltage converter 106.
  • each chip 201 has two opposite electrical connection faces, one upper and the other lower, as well as a control terminal.
  • the module 107 further comprises a substrate 202 on which the chips 201 are mounted.
  • the substrate 202 is in two parts each carrying one or more of the chips 201.
  • the substrate 202 is advantageously an electronic substrate, such as for example a metal plate or strip or a printed circuit board comprising electrical tracks for electrically connecting several chips 201 to each other and/or for electrically connecting a chip 201 with a electrical conductor such as those which will be described later.
  • the substrate 202 comprises a ceramic core coated on one or both of its faces with copper. This is for example a directly bonded copper substrate, from the English "Direct Bonded Copper substrate” or "DBG substrate”).
  • the substrate 202 may comprise a metal plate, such as an aluminum plate, covered with a layer of dielectric, itself covered with a layer of copper.
  • each chip 201 is electrically and/or mechanically coupled to the substrate 202, for example to at least one of its electrical tracks.
  • the lower faces of each electronic chip are coupled simultaneously mechanically and electrically to the substrate 202, preferably by soldering.
  • the module 107 also includes electrical conductors 204a-c intended to be placed at different electrical potentials. They are electrically connected to chips 201 according to the desired circuit, to implement a switching arm in the example described. Conductors 204a-c are configured to carry electrical signals to or from at least a portion of chips 201.
  • the conductors 204a-c advantageously comprise substantially planar rigid bars (called “lead frame” in English). These bars are, for example, metallic. They extend straight and/or are shaped and present bends and/or changes of plane if necessary depending on the desired topography.
  • the conductors 204a-c have connection ends 204'ac allowing electrical, or even mechanical, connection of the conductors 204a-c to the rest of the voltage converter 106, for example to bus bars connecting the module 107 to the source DC voltage 102 and the rotating electrical machine 104.
  • the conductors 204a-c comprises two conductors 204a, 204b whose respective connection ends 204'a, 204'b are connected respectively to the positive terminal and the negative terminal of the DC voltage source. 102, as well as a conductor 204c whose connection end 204'c is connected to a respective one of the phases of the rotating electrical machine 104.
  • each connection end 204'ac comprises a through opening 307 (visible in Figures 3 and 4) to allow easy coupling, for example by screwing through the through opening 307.
  • the coupling could be achieved by brazing.
  • each chip 201 is electrically and/or mechanically coupled to one of the electrical conductors 204a-c, for example at the level of a boss 206 of this conductor 204a-c.
  • the upper faces of the chips 201 are coupled simultaneously mechanically and electrically to the conductor 204a-c, preferably by soldering.
  • the module 107 further comprises vertical pins 210 for the electrical connection respectively of the chips 201 and or of the substrate 202 and/or or conductors 204.
  • These pins 210 present respective connection ends 210' to the card 208.
  • these connection ends 210' are inserted into corresponding openings of the card 208, and fixed to the latter by force-fitting (from the English “press-fit”) or else by welding.
  • the electrical system 100 preferably further comprises a support 212 on which the module 107 is mounted.
  • This support 212 comprises, for example, a metal plate and is designed, in particular, to promote thermal dissipation of heat emitted by the module 107.
  • the support 212 is common to the three modules 107.
  • the module 107 further comprises an overmolded block 214, which is electrically insulating, rigid and at least partially coats each chip 201.
  • the block 214 completely coats the chip or chips 201 of the module 107.
  • the block 214 includes by example an epoxy resin. It is, for example, produced using the technique of transfer molding or compression molding.
  • chip(s) 201 are bare chips embedded in block 214 so as to encapsulate them.
  • Block 214 advantageously wraps other components of module 107, as will be developed below.
  • each of the modules 107 here has a substantially parallelepipedal shape with two large opposite faces 216a, 216b, substantially parallel, respectively upper and lower. These large faces 216a, 216b are, for example, substantially rectangular.
  • block 214 coats not only chips 201 but also at least part of substrate 202, at least part of conductors 114 and/or at least part of pins 210.
  • the rigidity of block 214 makes it possible to maintain mechanically together the coated elements to achieve their encapsulation.
  • block 214 coats substrate 202 with the exception of an underside of the latter, left free to come into contact with support 212.
  • Block 214 also coats conductors 204a-c to the 'except for their connection ends 204'ac, as well as pins 210, except for their connection ends 210'.
  • the module 107 further comprises projections 218, 220 comprising an electrically insulating material and extending from one face of the block 214.
  • projections 218, 220 comprising an electrically insulating material and extending from one face of the block 214.
  • the faces 216a, 216b are connected by short sides having longitudinal faces 302a, 302b and transverse 310a, 310b.
  • the block 214 is substantially flat, that is to say that a width and a length of the faces 216a, 216b is much greater than a vertical distance separating them.
  • connection ends 204'a-c of the conductors 204a-c protrude laterally from the block 214 by its transverse faces 310a, 310b.
  • connection ends 210' of the terminals 210 protrude laterally from the block 214 by its longitudinal faces 302a, 302b.
  • the projections 218, 220 extend vertically upwards from the upper face 216a of the block 214. Still in the example described, they are located vertically to the substrate 202. These projections 218, 220 have a height, measured from the large upper face 6a, comprised, for example, between 3 mm and 5 cm.
  • the projections 218, 220 are here designed to receive the card 208, in order to support it and keep it at a distance from the face 216a of the block 214 which is opposite the card 208.
  • the projections 218, 220 each have, for example, an upper free end defining a contact face 306, in particular flat, against which the card 208 is designed to rest. Each contact face 306 thus forms a bearing surface or a stopper for the card 208.
  • the projections 218 also have the function of allowing the fixing of the card 222. They have for this a vertical screw hole 308 opening into the contact face 306. It is thus oriented along a vertical axis of the projection 218.
  • This screw hole 308 is advantageously tapped to form a bore to allow a screw 402 to be screwed in, or smooth and intended to cooperate with a self-forming or self-tapping screw. Said screws pass through, for example, holes 404 located in correspondence in the card 208.
  • four fixing projections 218 are provided, located at the corners of the upper face 216a of the block 214.
  • the projection 220 does not have the function of fixing the card 208, but only of providing a support surface or a stopper for the card 208. It will be called the “support projection” sequence.
  • the support projection 220 does not retain the card 208, that is to say it allows the card 208 to move away, upwards, from the upper face 216a of the block 214.
  • the contact face 306 of the bearing projection 220 has no bore.
  • the support projection 220 is located for example substantially in a central part of the upper face 216a and preferably equidistant from the fixing projections 218.
  • Each projection 218, 220 (and in particular the support projection 220) can be configured to dampen vibrations of the card 208.
  • the location of each projection provided for the damping may also depend on the configuration of the card 208. In general, each projection provided for the damping is located at the level of a vibration antinode of the card 208.
  • stops may also be provided opposite each projection provided for damping, on the other side of card 208.
  • the module 107 comprises at least one fixing projection, such as the projections 218, and/or at least one supporting projection, such as the projection 220.
  • the fixing projections 218 and or support 220 have substantially the same height.
  • Each projection may have, in particular, a truncated cone shape. This is for example the case of the fixing projections 218.
  • each projection may have the shape of a truncated pyramid, in particular with a square base. This is for example the case of support projections 220.
  • the module 107 may only include one or more fixing projections.
  • the module 107 may only comprise one or more support projections.
  • At least one contact face 306 is directly in contact with a lower face of the card 208.
  • a filling material is interposed between this contact face 306 and the card 208, so that the card 208 bears against the contact face 306 through the filling material.
  • This filling material is advantageously thermally conductive in order to allow heat circulation from the card 208 to block 214 to cool card 208 and/or electronic components (not shown) carried by the latter.
  • the filling material has a thermal conductivity of between 1 and 5 W nr 1 K 1 .
  • each projection 218, 220 is made from material of the block 214.
  • the block 214 and the projection(s) 218, 220 are formed in a single piece. This can be achieved in particular by providing a mold with a main molding cavity corresponding to the block 214 and at least one secondary molding cavity corresponding respectively to the projection(s).
  • Each projection 218, 220 is thus, for example, made of epoxy resin like block 214.
  • a step 502 the assembly of the chips 201, the substrate 202, the conductors 204a-c and the pins 210 is obtained.
  • the assembly obtained is overmolded using a mold comprising a main molding cavity corresponding to the block 214 and shapes corresponding to the projections 218, 220 in communication with the main cavity.
  • a single part is obtained by molding, this part comprising the block 214 and the projections 218, 220.
  • the technique of transfer molding or compression molding is used.
  • Step 504 thus provides one of the modules 107. Steps 502, 504 are repeated to obtain the other modules 107.
  • the modules 107 are attached against the support 212 and fixed to the latter.
  • a machine tool lowers the card 208 in the direction of the upper faces 216a of the modules 107.
  • the pins 210 are inserted into corresponding openings 406 of the card. 208 (visible in Figure 4).
  • the pins 210 are for example press-fit, so that their connection ends 210' have a larger diameter than the opening 406. Thus, these connection ends 210' are compressed radially during their insertion, which requires a significant insertion force of the machine tool.
  • the card 208 comes into contact with the projections 218, 220, which, on the one hand, makes it possible to control the vertical distance between the card 208 and the modules 107 by preventing the machine -tool does not lower the card 208 too much. On the other hand, this contact causes an increase in a reaction to the movement of the card 208, which can be used as a signal to stop the movement.
  • the machine tool detects the increase in the reaction to the displacement, which indicates that a downward movement for the installation of the card 208 is at the end of its travel. .
  • the machine tool stops the displacement of the card 208 during a step 514. It is thus possible to prevent too great a force from being exerted during the installation of the card 208.
  • the machine tool used for the installation of the card 208 advantageously comprises in this sense stops intended to come in vis-à-vis the support projection(s) 220, on the other side of map 208.
  • this module 601 is similar to module 107 of the previous figures, if it includes at least one projection, designated by the reference 602, which is a different part from block 214.
  • the projection(s) 602 replace the fixing projections 218, keeping their support and fixing functions.
  • this variant could apply equally well to the 220 support projections.
  • the projection 602 is preferably fixed on one of the conductors 204a-c of the module 107. It is located, in the example described, on a flat part 702 of the conductor 204c. Of course, projection 602 could be attached to one of the other conductors 204a, 204b.
  • the projection 602 extends from an upper face 704 of the flat part 702, opposite a lower face 706 located vis-à-vis the substrate 12.
  • the projection 602 is positioned here close to an edge 708 of the substrate 202 and/or of one of the connection ends 204'ac of the conductor 204a-c.
  • the conductor 204a-c advantageously has a slot 802 through which the projection 602 is fixed by a fixing element 804, in particular by riveting or hot riveting.
  • a lower face of the projection 602 is thus retained bearing against the upper face 704 of flat part 702 of conductor 204c, fixing element 804 resting against opposite lower face 706 passing through slot 802. Any other mode of fixing is of course possible.
  • the projection 602 can be produced by a first overmolding of the conductor 204c, either directly in its form illustrated in the figures or else followed by the riveting or riveting of the fastening element 804 to bring it into its illustrated form. .
  • the production of the block 214 then takes place, for example, after this first overmolding and, where appropriate, the riveting or riveting operation.
  • the block 214 coats a base 806 of the projection 602.
  • the base 806 is overmolded by the block 214.
  • the block 214 coats the projection 602 over a few tenths of a millimeter in height, for example between 0 2 and 1.5 mm, from the upper face 704 of the flat part 702 of the conductor 204c.
  • the projection 602 has sloped side walls, which allows the block 214 to cover them vertically and thus improve the fixing of the projection 602.
  • An advantage of using two separate parts for the projection 602 and the block 214 is to avoid the propagation of cracks between the projection 602 and the block 214.
  • the projection 602 can be made of the same material as the block 214, in particular epoxy resin.
  • the projections 218, 220, 602 could have different shapes, other than frustoconical or truncated pyramidal. They could also have different heights.
  • each chip may include a type of component other than a semiconductor switch, for example: a passive electronic component such as an electrical resistor and/or a capacitive component, and/or a semiconductor chip making it possible to carry out one or more logical functions in order to allow the electronic power module to shape electrical power signals.
  • a passive electronic component such as an electrical resistor and/or a capacitive component
  • a semiconductor chip making it possible to carry out one or more logical functions in order to allow the electronic power module to shape electrical power signals.
  • the projections 218, 220, 602 can be designed to cooperate with any component other than an electronic card such as the card 208, in particular a module fixing frame.
  • any component other than an electronic card such as the card 208, in particular a module fixing frame.
  • any component (the card 208 or any other component) is positioned at a distance from the face 216a of the block 214, this without having to use additional parts.
  • the system could be used in an air compressor.
  • the rotating electrical machine 104 could be provided to drive an air compression element, in particular with a view to generating a flow of supercharging air from an engine.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Credit Cards Or The Like (AREA)
  • Inverter Devices (AREA)

Abstract

The invention relates to an electronic power module (107) comprising: - at least one electronic chip (201); and - an electrically insulating overmoulded block (214) at least partially encasing each chip (201). Said module (107) comprises at least one projection (218, 220) for supporting a component, such as an electronic control board (208) for controlling each chip, the projection (218, 220) comprising an electrically insulating material and extending from a face (216a) of the block (214).

Description

MODULE ÉLECTRONIQUE DE PUISSANCE, SYSTÈME ÉLECTRIQUE COMPORTANT UN TEL MODULE, PROCÉDÉS DE FABRICATION POWER ELECTRONIC MODULE, ELECTRICAL SYSTEM COMPRISING SUCH A MODULE, MANUFACTURING METHODS
CORRESPONDANTS CORRESPONDENTS
[0001] La présente invention concerne un module électronique de puissance, un système électrique comportant un tel module et des procédés de fabrication correspondants. Elle trouvera en particulier ses applications dans le domaine automobile. The present invention relates to an electronic power module, an electrical system comprising such a module and corresponding manufacturing methods. It will find its applications in particular in the automotive field.
[0002] Dans de nombreuses applications industrielles, des modules électroniques de puissance comportant des puces électroniques sont mis en oeuvre afin de contrôler des signaux électriques permettant de piloter le fonctionnement d'un système électrique, tel qu’une machine électrique tournante. [0002] In many industrial applications, power electronic modules comprising electronic chips are implemented in order to control electrical signals making it possible to control the operation of an electrical system, such as a rotating electrical machine.
[0003] Pour protéger les puces, il est connu de les disposer au fond d’un boîtier plastique et de les noyer dans un gel isolant électrique coulé dans le boîtier. Des plots pourvus d’orifices de fixation peuvent alors être prévus dans des parois latérales du boîtier. La carte vient alors en appui contre ces plots et peut y être fixer au moyen de vis. [0003] To protect the chips, it is known to place them at the bottom of a plastic casing and to embed them in an electrical insulating gel poured into the casing. Studs provided with fixing holes can then be provided in the side walls of the case. The card then bears against these studs and can be fixed there by means of screws.
[0004] Une telle solution présente un encombrement important, notamment en raison de l’utilisation du boîtier. [0004] Such a solution presents a significant bulk, in particular due to the use of the case.
[0005] Alternativement, les puces peuvent être protégées par un surmoulage, par exemple en résine époxy, formant un bloc rigide enrobant les puces. Dans ce cas, des inserts métalliques peuvent être prévus dans le bloc surmoulé pour permettre le passage de vis de fixation de la carte. Les inserts sont par exemple surmoulés en même temps que les puces et affleurent une face du bloc surmoulé en vis-à-vis de la carte. [0005] Alternatively, the chips can be protected by an overmoulding, for example in epoxy resin, forming a rigid block coating the chips. In this case, metal inserts can be provided in the molded block to allow the passage of card fixing screws. The inserts are for example molded at the same time as the chips and are flush with one face of the molded block facing the card.
[0006] Dans cette solution, la carte est positionnée contre la face du bloc surmoulé et fixée au moyen de vis vissées dans les inserts. En outre, la présence des inserts constitue un surcoût. Or, ces inserts sont indispensables pour éviter que le vissage ne fissure le bloc surmoulé et compromette la protection des puces. [0006] In this solution, the card is positioned against the face of the molded block and fixed by means of screws screwed into the inserts. In addition, the presence of the inserts constitutes an additional cost. However, these inserts are essential to prevent the screwing from cracking the overmolded block and compromising the protection of the chips.
[0007] Ainsi, il n’existe pas de solution simple permettant de positionner la carte (ou tout autre composant souhaité) à distance du bloc surmoulé enrobant les puces. [0007] Thus, there is no simple solution making it possible to position the card (or any other desired component) at a distance from the overmolded block encasing the chips.
[0008] Il peut ainsi être souhaité de prévoir un module électronique de puissance qui permette de s’affranchir d’au moins une partie des problèmes et contraintes précités. [0009] Il est donc proposé un module électronique de puissance comportant : au moins une puce électronique ; et un bloc surmoulé isolant électrique enrobant au moins partiellement chaque puce ; caractérisé en ce qu’il comprend au moins une projection d’appui d’un composant, tel qu’une carte électronique de commande de chaque puce, la projection comportant un matériau isolant électrique et s’étendant à partir d’une face du bloc. [0008] It may thus be desirable to provide an electronic power module which makes it possible to overcome at least some of the aforementioned problems and constraints. [0009]There is therefore proposed an electronic power module comprising: at least one electronic chip; and an electrically insulating overmolded block at least partially encasing each chip; characterized in that it comprises at least one bearing projection of a component, such as an electronic control card for each chip, the projection comprising an electrically insulating material and extending from one face of the block .
[0010] Ainsi, grâce à la ou aux projections, il est possible de maintenir le composant à distance du bloc sans nécessiter de boîtier plastique. En outre, une ou plusieurs de ces projections peut être utilisées pour fixer par vissage le composant et cela sans nécessiter d’insert métallique. En effet, le vissage peut être réalisé dans la matière de la projection, de sorte que la vis n’atteint pas le bloc et présente donc peu de risque d’endommager ce dernier. [0010] Thus, thanks to the projection or projections, it is possible to keep the component away from the block without requiring a plastic casing. In addition, one or more of these projections can be used to fix the component by screwing and this without requiring a metal insert. Indeed, the screwing can be carried out in the material of the projection, so that the screw does not reach the block and therefore presents little risk of damaging the latter.
[0011] De façon optionnelle, la projection présente une extrémité libre définissant une face de contact du composant. [0011] Optionally, the projection has a free end defining a contact face of the component.
[0012] De façon optionnelle également, la face de contact est plane. [0012] Also optionally, the contact face is flat.
[0013] De façon optionnelle également, au moins une projection est conçue pour fixer le composant. [0013] Also optionally, at least one projection is designed to secure the component.
[0014] De façon optionnelle également, la face de contact de la projection conçue pour fixer le composant présente un trou de vissage. [0014] Also optionally, the contact face of the projection designed to fix the component has a screw hole.
[0015] De façon optionnelle également, le trou de vissage est soit taraudé, soit lisse et destiné à coopérer avec une vis autoformeuse ou bien auto-taraudeuse. [0015] Also optionally, the screw hole is either threaded or smooth and intended to cooperate with a self-forming or else self-tapping screw.
[0016] De façon optionnelle également, la face de contact de la projection est conçue pour laisser le composant s’éloigner de cette face de contact. [0016] Also optionally, the contact face of the projection is designed to allow the component to move away from this contact face.
[0017] De façon optionnelle également, la face de contact de la projection conçue pour laisser le composant s’éloigner est dépourvue d’alésage. [0017] Also optionally, the contact face of the projection designed to allow the component to move away has no bore.
[0018] De façon optionnelle également, la projection présente une forme de tronc de cône et/ou de pyramide tronquée. [0018] Also optionally, the projection has the shape of a truncated cone and/or a truncated pyramid.
[0019] De façon optionnelle également, la projection et le bloc sont en une seule pièce. [0019] Also optionally, the projection and the block are in one piece.
[0020] De façon optionnelle également, la projection et le bloc sont en deux pièces distinctes. [0021] De façon optionnelle également, il comprend un conducteur électrique et la projection est fixée au conducteur. [0020] Also optionally, the projection and the block are in two separate parts. [0021] Also optionally, it comprises an electrical conductor and the projection is attached to the conductor.
[0022] De façon optionnelle également, le conducteur présente une lumière et la projection est fixée au conducteur à travers la lumière. [0022] Also optionally, the conductor has a light and the projection is attached to the conductor through the light.
[0023] De façon optionnelle également, la projection est fixée par rivetage ou bouterollage ou surmoulage sur le conducteur. [0023] Also optionally, the projection is fixed by riveting or riveting or overmolding on the conductor.
[0024] De façon optionnelle également, le bloc enrobe une base de la projection. [0024] Also optionally, the block coats a base of the projection.
[0025] Il est également proposé un système électrique comportant un module selon l’invention et un composant en appui sur chaque projection. [0025] An electrical system is also proposed comprising a module according to the invention and a component resting on each projection.
[0026] Il est également proposé un procédé de fabrication d’un module selon l’invention comportant : l’obtention de la ou des puces ; le surmoulage des puces par le bloc, par exemple par moulage par transfert ou bien par moulage par compression ; et la réalisation de chaque projection d’appui du composant. [0026] A method for manufacturing a module according to the invention is also proposed, comprising: obtaining the chip or chips; the overmolding of the chips by the block, for example by transfer molding or else by compression molding; and the realization of each support projection of the component.
[0027] De façon optionnelle, l’étape de surmoulage est réalisée en utilisant un moule comportant une cavité principale de moulage correspondant au bloc et au moins une cavité secondaire de moulage correspondant respectivement à la ou les projections, cette cavité secondaire étant en communication avec la cavité principale, de sorte que chaque projection et le bloc sont en une seule pièce. [0027] Optionally, the overmolding step is carried out using a mold comprising a main molding cavity corresponding to the block and at least one secondary molding cavity corresponding respectively to the projection or projections, this secondary cavity being in communication with the main cavity, so that each projection and the block are in one piece.
[0028] De façon optionnelle également, la réalisation de chaque projection est distincte de l’étape de surmoulage, de sorte que la ou les projections et le bloc sont des pièces distinctes. [0028] Also optionally, the production of each projection is separate from the overmolding step, so that the projection(s) and the block are separate parts.
[0029] Il est également proposé un procédé de fabrication d’un système électrique selon l’invention, comportant : la fabrication d’un module selon l’invention ; le déplacement par une machine-outil du composant en direction de la face du bloc jusqu’à ce que le composant vienne en appui contre chaque projection ; la détection par la machine-outil d’une augmentation d’une réaction au déplacement ; et l’arrêt par la machine-outil du déplacement du composant. [0029] A method of manufacturing an electrical system according to the invention is also proposed, comprising: the manufacture of a module according to the invention; the displacement by a machine tool of the component in the direction of the face of the block until the component bears against each projection; the machine tool detecting an increase in a reaction to the displacement; and stopping by the machine tool of the movement of the component.
[0030] L’invention sera mieux comprise à l’aide de la description qui va suivre, donnée uniquement à titre d’exemple et faite en se référant aux dessins annexés dans lesquels : The invention will be better understood using the following description, given solely by way of example and made with reference to the accompanying drawings in which:
[0031] la figure 1 est un circuit électrique d’un exemple de système électrique mettant en œuvre l’invention, [0031] Figure 1 is an electrical circuit of an example of an electrical system implementing the invention,
[0032] la figure 2 est une vue en coupe d’un module électronique de puissance du système de la figure 1 , [0032] Figure 2 is a sectional view of an electronic power module of the system of Figure 1,
[0033] la figure 3 est une vue en perspective un premier exemple du module électronique de puissance de la figure 2, [0033] Figure 3 is a perspective view of a first example of the electronic power module of Figure 2,
[0034] la figure 4 illustre le module de la figure 3, équipé en outre d’une carte électronique représentée de façon à pouvoir voir le reste du module par transparence, [0034] Figure 4 illustrates the module of Figure 3, further equipped with an electronic card represented so as to be able to see the rest of the module by transparency,
[0035] la figure 5 est un schéma-bloc illustrant les étapes d’un procédé de fabrication d’un système électrique comportant le module des figures 2 à 4, [0035] Figure 5 is a block diagram illustrating the steps of a method of manufacturing an electrical system comprising the module of Figures 2 to 4,
[0036] la figure 5 illustre partiellement en perspective un autre exemple de module électronique de puissance selon l’invention, FIG. 5 partially illustrates in perspective another example of an electronic power module according to the invention,
[0037] la figure 7 reprend la figure 6, avec un bloc surmoulé du module enlevé, et[0037] Figure 7 repeats Figure 6, with an overmolded block of the module removed, and
[0038] la figure 8 illustre en coupe le module des figures 6 et 7. [0038] Figure 8 illustrates in section the module of Figures 6 and 7.
[0039] En référence à la figure 1, un exemple 100 de système électrique mettant en œuvre l’invention va à présent être décrit. Le système électrique 100 est par exemple destiné à être implémenté dans un véhicule automobile (non représenté). With reference to Figure 1, an example 100 of an electrical system implementing the invention will now be described. The electrical system 100 is for example intended to be implemented in a motor vehicle (not shown).
[0040] Le système électrique 100 comporte tout d’abord une source de tension continue 102 comportant une borne positive et une borne négative, cette dernière étant généralement connectée à une masse électrique, telle qu’un châssis du véhicule automobile. La source de tension continue 102 est conçue pour fournir une tension d’entrée notée E. The electrical system 100 firstly comprises a DC voltage source 102 comprising a positive terminal and a negative terminal, the latter being generally connected to an electrical ground, such as a chassis of the motor vehicle. The DC voltage source 102 is designed to provide an input voltage denoted E.
[0041] Le système électrique 100 comporte en outre une machine électrique tournante 104 comportant des phases statoriques. Dans l’exemple décrit, la machine électrique tournante 104 fait partie d’un alterno-démarreur couplé à un moteur thermique (non représenté) du véhicule automobile. La machine électrique tournante 104 est ainsi conçue pour fonctionner alternativement en mode moteur dans lequel elle assiste le moteur thermique et en mode alternateur dans lequel elle transforme une partie de l’énergie mécanique générée par le moteur thermique en énergie électrique pour recharger la source de tension continue 102. The electrical system 100 further comprises a rotating electrical machine 104 comprising stator phases. In the example described, the rotating electrical machine 104 is part of an alternator-starter coupled to a heat engine (not shown) of the motor vehicle. The rotating electric machine 104 is thus designed to operate alternately in engine mode in which it assists the heat engine and in alternator mode in which it transforms part of the mechanical energy generated by the heat engine into electrical energy to recharge the DC voltage source 102.
[0042] Le système électrique 100 comporte en outre un convertisseur de tension 106 connecté, d’une part, aux bornes de la source de tension continue 102 et, d’autre part, à la machine électrique tournante 104. The electrical system 100 further comprises a voltage converter 106 connected, on the one hand, to the terminals of the DC voltage source 102 and, on the other hand, to the rotating electrical machine 104.
[0043] Le convertisseur de tension 106 comporte des bras de commutation respectivement associés aux phases statoriques. Chaque bras de commutation comporte un interrupteur de côté haut connecté à la borne positive de la source de tension continue 102 et un interrupteur de côté bas connecté à la borne négative de la source de tension continue 102. L’interrupteur de côté haut et l’interrupteur de côté bas sont en outre connectés l’un à l’autre en un point milieu connecté à la phase statorique associée. The voltage converter 106 comprises switching arms respectively associated with the stator phases. Each switch arm has a high side switch connected to the positive terminal of DC voltage source 102 and a low side switch connected to the negative terminal of DC voltage source 102. The high side switch and the low side switch are further connected to each other at a midpoint connected to the associated stator phase.
[0044] Chaque bras de commutation est destiné à être commandé pour commuter entre deux configurations. Dans la première, dite configuration haute, l’interrupteur de côté haut est fermé et l’interrupteur de côté bas est ouvert de sorte que la tension d’entrée E est appliquée à la phase statorique associée. Dans la deuxième, dite configuration basse, l’interrupteur de côté haut est ouvert et l’interrupteur de côté bas est fermé de sorte qu’une tension nulle est appliquée à la phase statorique associée. Each switching arm is intended to be controlled to switch between two configurations. In the first, called high configuration, the high side switch is closed and the low side switch is open so that the input voltage E is applied to the associated stator phase. In the second, known as the low configuration, the high side switch is open and the low side switch is closed so that zero voltage is applied to the associated stator phase.
[0045] Le système électrique 100 comporte en outre des modules électroniques de puissance 107 implémentant respectivement les bras de commutation. The electrical system 100 further comprises electronic power modules 107 respectively implementing the switching arms.
[0046] Le système électrique 100 comporte en outre un dispositif 108 de commande des modules 107, pour faire commuter chaque bras entre ces deux configurations. Dans l’exemple décrit, le convertisseur de tension 106 est commandé en onduleur de manière à fournir de l’énergie électrique à la machine électrique tournante 104 lorsqu’il est souhaité qu’elle fonctionne en mode moteur. En outre, le convertisseur de tension 106 est commandé en redresseur pour fournir de l’énergie électrique à la source de tension continue 102 (par exemple, pour la recharger) lorsqu’il est souhaité que la machine électrique tournante 104 fonctionne en mode alternateur. The electrical system 100 further comprises a device 108 for controlling the modules 107, to cause each arm to switch between these two configurations. In the example described, the voltage converter 106 is controlled as an inverter so as to supply electrical energy to the rotating electrical machine 104 when it is desired that it operates in motor mode. In addition, the voltage converter 106 is controlled as a rectifier to supply electrical energy to the DC voltage source 102 (for example, to recharge it) when it is desired that the rotating electrical machine 104 operates in alternator mode.
[0047] Les interrupteurs sont des interrupteurs semi-conducteurs comportant par exemple des transistors. Les interrupteurs sont par exemple des transistors à effet de champ à grille isolée (de l’anglais « Métal Oxide Semiconductor Field Effect Transistor » ou MOSFET) ou bien des transistors bipolaires à grille isolée (de l’anglais « Insulated Gâte Bipolar Transistor » ou IGBT). The switches are semiconductor switches comprising, for example, transistors. The switches are for example insulated gate field effect transistors (from the English “Metal Oxide Semiconductor Field Effect Transistor” or MOSFET) or even insulated gate bipolar transistors (from the English “Insulated Gate Bipolar Transistor” or IGBT).
[0048] Dans la description qui va suivre, les différents éléments seront repérés spatialement selon un repère orthogonal arbitraire comportant une direction verticale V, une direction longitudinale L et une direction transversale T. In the following description, the various elements will be spatially identified according to an arbitrary orthogonal reference frame comprising a vertical direction V, a longitudinal direction L and a transverse direction T.
[0049] En référence à la figure 2, un des modules 107 va à présent être décrit plus en détails, les autres étant similaires. With reference to Figure 2, one of the modules 107 will now be described in more detail, the others being similar.
[0050] Le module 107 comporte tout d’abord une ou plusieurs puces électroniques 201 comprenant, dans l’exemple décrit, chacune un des interrupteurs semi- conducteurs des bras de commutation du convertisseur de tension 106. Dans l’exemple décrit, chaque puce 201 présente deux faces de connexion électrique opposées, l’une supérieure et l’autre inférieure, ainsi qu’une borne de commande. The module 107 first of all comprises one or more electronic chips 201 comprising, in the example described, each one of the semiconductor switches of the switching arms of the voltage converter 106. In the example described, each chip 201 has two opposite electrical connection faces, one upper and the other lower, as well as a control terminal.
[0051] Le module 107 comprend en outre un substrat 202 sur lequel sont montées les puces 201. Dans l’exemple décrit, le substrat 202 est en deux parties portant chacune une ou plusieurs des puces 201. The module 107 further comprises a substrate 202 on which the chips 201 are mounted. In the example described, the substrate 202 is in two parts each carrying one or more of the chips 201.
[0052] Le substrat 202 est avantageusement un substrat électronique, tel que par exemple une plaque ou lame métallique ou une carte de circuit imprimée comprenant des pistes électriques pour connecter électriquement plusieurs puces 201 entre elles et/ou pour connecter électriquement une puce 201 avec un conducteur électrique tel que ceux qui seront décrits plus loin. Par exemple, le substrat 202 comporte une âme en céramique revêtue sur une ou deux de ses faces de cuivre. Il s’agit par exemple d’un substrat à cuivre directement lié, de l’anglais « Direct Bonded Copper substrate » ou « DBG substrate »). Alternativement, le substrat 202 peut comporter une plaque métallique, telle qu’une plaque d’aluminium, recouverte d’une couche de diélectrique, elle-même recouvert d’une couche de cuivre. The substrate 202 is advantageously an electronic substrate, such as for example a metal plate or strip or a printed circuit board comprising electrical tracks for electrically connecting several chips 201 to each other and/or for electrically connecting a chip 201 with a electrical conductor such as those which will be described later. For example, the substrate 202 comprises a ceramic core coated on one or both of its faces with copper. This is for example a directly bonded copper substrate, from the English "Direct Bonded Copper substrate" or "DBG substrate"). Alternatively, the substrate 202 may comprise a metal plate, such as an aluminum plate, covered with a layer of dielectric, itself covered with a layer of copper.
[0053] En particulier, la face inférieure de chaque puce 201 est couplée électriquement et/ou mécaniquement au substrat 202, par exemple à au moins une de ses pistes électriques. De préférence, les faces inférieures de chaque puce électronique sont couplées simultanément mécaniquement et électriquement au substrat 202, préférentiellement par brasage. In particular, the lower face of each chip 201 is electrically and/or mechanically coupled to the substrate 202, for example to at least one of its electrical tracks. Preferably, the lower faces of each electronic chip are coupled simultaneously mechanically and electrically to the substrate 202, preferably by soldering.
[0054] Le module 107 comprend aussi des conducteurs électriques 204a-c destinés à être mis à différents potentiels électriques. Ils sont connectés électriquement aux puces 201 selon le circuit désiré, pour implémenter un bras de commutation dans l’exemple décrit. Les conducteurs 204a-c sont configurés pour transporter des signaux électriques vers ou depuis au moins une partie des puces 201 . The module 107 also includes electrical conductors 204a-c intended to be placed at different electrical potentials. They are electrically connected to chips 201 according to the desired circuit, to implement a switching arm in the example described. Conductors 204a-c are configured to carry electrical signals to or from at least a portion of chips 201.
[0055] Les conducteurs 204a-c comportent avantageusement des barres rigides sensiblement planes (appelées « lead frame » en anglais). Ces barres sont, par exemple, métalliques. Elles s’étendent de façon rectiligne et/ou sont conformées et présentent si nécessaire des coudes et ou changement de plan selon la topographie désirée. The conductors 204a-c advantageously comprise substantially planar rigid bars (called "lead frame" in English). These bars are, for example, metallic. They extend straight and/or are shaped and present bends and/or changes of plane if necessary depending on the desired topography.
[0056] Les conducteurs 204a-c présentent des extrémités de connexion 204’a-c permettant un raccordement électrique, voir mécanique, des conducteurs 204a-c au reste du convertisseur de tension 106, par exemple à des barres omnibus connectant le module 107 à la source de tension continue 102 et à la machine électrique tournante 104. [0056] The conductors 204a-c have connection ends 204'ac allowing electrical, or even mechanical, connection of the conductors 204a-c to the rest of the voltage converter 106, for example to bus bars connecting the module 107 to the source DC voltage 102 and the rotating electrical machine 104.
[0057] Dans l’exemple décrit, les conducteurs 204a-c comporte deux conducteurs 204a, 204b dont les extrémités de connexion 204’a, 204’b respectives sont connectées respectivement à la borne positive et la borne négative de la source de tension continue 102, ainsi qu’un conducteur 204c dont l’extrémité de connexion 204’c est connectée à l’une respective des phases de la machine électrique tournante 104. In the example described, the conductors 204a-c comprises two conductors 204a, 204b whose respective connection ends 204'a, 204'b are connected respectively to the positive terminal and the negative terminal of the DC voltage source. 102, as well as a conductor 204c whose connection end 204'c is connected to a respective one of the phases of the rotating electrical machine 104.
[0058] De manière avantageuse, chaque extrémité de connexion 204’a-c comprend une ouverture traversante 307 (visible sur les figures 3 et 4) afin de permettre un couplage facile, par exemple par vissage au travers de l’ouverture traversante 307. Alternativement, le couplage pourrait être réalisé par brasage. Advantageously, each connection end 204'ac comprises a through opening 307 (visible in Figures 3 and 4) to allow easy coupling, for example by screwing through the through opening 307. Alternatively, the coupling could be achieved by brazing.
[0059] Dans l’exemple décrit, la face supérieure de chaque puce 201 est couplée électriquement et/ou mécaniquement à l’un des conducteurs électriques 204a-c, par exemple au niveau d’un bossage 206 de ce conducteur 204a-c. De préférence, les faces supérieures des puces 201 sont couplées simultanément mécaniquement et électriquement au conducteur 204a-c, préférentiellement par brasage. In the example described, the upper face of each chip 201 is electrically and/or mechanically coupled to one of the electrical conductors 204a-c, for example at the level of a boss 206 of this conductor 204a-c. Preferably, the upper faces of the chips 201 are coupled simultaneously mechanically and electrically to the conductor 204a-c, preferably by soldering.
[0060] Pour raccorder le module 107 à une carte électronique 208 (visible sur la figure 4) du dispositif de commande 108, le module 107 comporte en outre des broches 210 verticales de connexion électrique respectivement des puces 201 et ou du substrat 202 et/ou des conducteurs 204. Ces broches 210 présentent des extrémités de connexion respectives 210’ à la carte 208. Par exemple, ces extrémités de connexion 210’ sont insérées dans des ouvertures correspondantes de la carte 208, et fixées à cette dernière par emmanchement en force (de l’anglais « press-fit ») ou bien par soudage. To connect the module 107 to an electronic card 208 (visible in Figure 4) of the control device 108, the module 107 further comprises vertical pins 210 for the electrical connection respectively of the chips 201 and or of the substrate 202 and/or or conductors 204. These pins 210 present respective connection ends 210' to the card 208. For example, these connection ends 210' are inserted into corresponding openings of the card 208, and fixed to the latter by force-fitting (from the English “press-fit”) or else by welding.
[0061] Le système électrique 100 comporte en outre de préférence un support 212 sur lequel le module 107 est monté. Ce support 212 comporte, par exemple, d’une plaque métallique et est conçu, notamment, pour favoriser une dissipation thermique d’une chaleur émise par le module 107. Dans l’exemple décrit, le support 212 est commun aux trois modules 107. The electrical system 100 preferably further comprises a support 212 on which the module 107 is mounted. This support 212 comprises, for example, a metal plate and is designed, in particular, to promote thermal dissipation of heat emitted by the module 107. In the example described, the support 212 is common to the three modules 107.
[0062] Le module 107 comporte en outre un bloc surmoulé 214, qui est isolant électrique, rigide et enrobe au moins partiellement chaque puce 201. Préférentiellement, le bloc 214 enrobe entièrement la ou les puces 201 du module 107. Le bloc 214 comporte par exemple une résine époxy. Il est par exemple réalisé selon la technique de moulage par transfert (de l’anglais « transfer molding ») ou bien de moulage par compression (de l’anglais « compression molding »). The module 107 further comprises an overmolded block 214, which is electrically insulating, rigid and at least partially coats each chip 201. Preferably, the block 214 completely coats the chip or chips 201 of the module 107. The block 214 includes by example an epoxy resin. It is, for example, produced using the technique of transfer molding or compression molding.
[0063] Par exemple, la ou les puces 201 sont des puces nues noyées dans le bloc 214 de manière à en réaliser l’encapsulation. Le bloc 214 enrobe avantageusement d’autres composants du module 107, comme cela sera développé dans la suite. For example, chip(s) 201 are bare chips embedded in block 214 so as to encapsulate them. Block 214 advantageously wraps other components of module 107, as will be developed below.
[0064] Le bloc 214 de chacun des modules 107 présente ici une forme sensiblement parallélépipédique avec deux grandes faces opposées 216a, 216b, sensiblement parallèles, respectivement supérieure et inférieure. Ces grandes faces 216a, 216b sont, par exemple, sensiblement rectangulaires. The block 214 of each of the modules 107 here has a substantially parallelepipedal shape with two large opposite faces 216a, 216b, substantially parallel, respectively upper and lower. These large faces 216a, 216b are, for example, substantially rectangular.
[0065] Préférentiellement, le bloc 214 enrobe non seulement les puces 201 mais également au moins une partie du substrat 202, au moins une partie des conducteurs 114 et/ou au moins une partie des broches 210. La rigidité du bloc 214 permet de maintenir mécaniquement ensemble les éléments enrobés pour réaliser leur encapsulation. Preferably, block 214 coats not only chips 201 but also at least part of substrate 202, at least part of conductors 114 and/or at least part of pins 210. The rigidity of block 214 makes it possible to maintain mechanically together the coated elements to achieve their encapsulation.
[0066] Plus précisément, ici, le bloc 214 enrobe le substrat 202 à l’exception d’une face inférieure de ce dernier, laissée libre pour venir au contact du support 212. Le bloc 214 enrobe également les conducteurs 204a-c à l’exception de leurs extrémités de connexion 204’a-c, ainsi que les broches 210, à l’exception de leurs extrémités de connexion 210’. More specifically, here, block 214 coats substrate 202 with the exception of an underside of the latter, left free to come into contact with support 212. Block 214 also coats conductors 204a-c to the 'except for their connection ends 204'ac, as well as pins 210, except for their connection ends 210'.
[0067] Le module 107 comprend en outre des projections 218, 220 comportant un matériau isolant électrique et s’étendant à partir d’une face du bloc 214. [0068] En référence aux figures 3 et 4, le bloc 214 et les projections 218, 220 vont être décrits plus en détail. The module 107 further comprises projections 218, 220 comprising an electrically insulating material and extending from one face of the block 214. With reference to Figures 3 and 4, block 214 and projections 218, 220 will be described in more detail.
[0069] Les faces 216a, 216b sont reliées par des petits côtés ayant des faces longitudinales 302a, 302b et transversales 310a, 310b. Le bloc 214 est sensiblement plat, c’est-à-dire qu’une largeur et une longueur des faces 216a, 216b est très supérieure à une distance verticale les séparant. The faces 216a, 216b are connected by short sides having longitudinal faces 302a, 302b and transverse 310a, 310b. The block 214 is substantially flat, that is to say that a width and a length of the faces 216a, 216b is much greater than a vertical distance separating them.
[0070] Dans l’exemple décrit, les extrémités de connexion 204’a-c des conducteurs 204a-c dépassent latéralement du bloc 214 par ses faces transversales 310a, 310b. Les extrémités de connexion 210’ des bornes 210 dépassent latéralement du bloc 214 par ses faces longitudinales 302a, 302b. In the example described, the connection ends 204'a-c of the conductors 204a-c protrude laterally from the block 214 by its transverse faces 310a, 310b. The connection ends 210' of the terminals 210 protrude laterally from the block 214 by its longitudinal faces 302a, 302b.
[0071] Dans l’exemple décrit, les projections 218, 220 s’étendent verticalement vers le haut à partir de la face supérieure 216a du bloc 214. T oujours dans l’exemple décrit, elles sont situés à la verticale du substrat 202. Ces projections 218, 220 présentent une hauteur, mesurée à partir de la grande face supérieure 6a, comprise, par exemple, entre 3 mm et 5 cm. In the example described, the projections 218, 220 extend vertically upwards from the upper face 216a of the block 214. Still in the example described, they are located vertically to the substrate 202. These projections 218, 220 have a height, measured from the large upper face 6a, comprised, for example, between 3 mm and 5 cm.
[0072] Les projections 218, 220 sont ici conçues pour recevoir la carte 208, afin de la supporter et de la maintenir à distance de la face 216a du bloc 214 qui se trouve en en vis-à-vis de la carte 208. The projections 218, 220 are here designed to receive the card 208, in order to support it and keep it at a distance from the face 216a of the block 214 which is opposite the card 208.
[0073] Les projections 218, 220 présentent, par exemple, chacune une extrémité libre supérieure définissant une face de contact 306, notamment plane, contre laquelle la carte 208 est conçue pour reposer. Chaque face de contact 306 forme ainsi une surface d’appui ou une butée d’arrêt pour la carte 208. The projections 218, 220 each have, for example, an upper free end defining a contact face 306, in particular flat, against which the card 208 is designed to rest. Each contact face 306 thus forms a bearing surface or a stopper for the card 208.
[0074] En revanche, les projections 218 ont en outre comme fonction de permettre la fixation de la carte 222. Elles présentent pour cela un trou de vissage vertical 308 débouchant dans la face de contact 306. Il est ainsi orienté selon un axe vertical de la projection 218. Ce trou de vissage 308 est avantageusement taraudé pour former un alésage pour permettre de visser une vis 402, ou bien lisse et destiné à coopérer avec une vis autoformeuse ou auto-taraudeuse. Lesdites vis traversent par exemple des orifices 404 situés en correspondance dans la carte 208. On the other hand, the projections 218 also have the function of allowing the fixing of the card 222. They have for this a vertical screw hole 308 opening into the contact face 306. It is thus oriented along a vertical axis of the projection 218. This screw hole 308 is advantageously tapped to form a bore to allow a screw 402 to be screwed in, or smooth and intended to cooperate with a self-forming or self-tapping screw. Said screws pass through, for example, holes 404 located in correspondence in the card 208.
[0075] Dans l’exemple décrit, quatre projections de fixation 218 sont prévues, situées au niveau de coins de la face supérieure 216a du bloc 214. In the example described, four fixing projections 218 are provided, located at the corners of the upper face 216a of the block 214.
[0076] Au contraire, la projection 220 n’a pas pour fonction de fixer la carte 208, mais seulement de fournir une surface d’appui ou une butée d’arrêt pour la carte 208. Elle sera appelée la suite « projection d’appui ». Ainsi, la projection d’appui 220 ne retient pas la carte 208, c’est-à-dire qu’elle permet à la carte 208 de s’éloigner, vers le haut, de la face supérieure 216a du bloc 214. Par exemple, la face de contact 306 de la projection d’appui 220 est dépourvue d’alésage. On the contrary, the projection 220 does not have the function of fixing the card 208, but only of providing a support surface or a stopper for the card 208. It will be called the “support projection” sequence. Thus, the support projection 220 does not retain the card 208, that is to say it allows the card 208 to move away, upwards, from the upper face 216a of the block 214. For example , the contact face 306 of the bearing projection 220 has no bore.
[0077] La projection d’appui 220 est située par exemple sensiblement dans une partie centrale de la face supérieure 216a et préférentiellement à équidistance des projections de fixation 218. The support projection 220 is located for example substantially in a central part of the upper face 216a and preferably equidistant from the fixing projections 218.
[0078] Chaque projection 218, 220 (et en particulier la projection d’appui 220) peut être configurée pour amortir des vibrations de la carte 208. L’emplacement de chaque projection prévue pour l’amortissement pourra également dépendre de la configuration de la carte 208. De manière générale, chaque projection prévue pour l’amortissement est située au niveau d’un ventre de vibration de la carte 208. Each projection 218, 220 (and in particular the support projection 220) can be configured to dampen vibrations of the card 208. The location of each projection provided for the damping may also depend on the configuration of the card 208. In general, each projection provided for the damping is located at the level of a vibration antinode of the card 208.
[0079] Pour limiter encore les vibrations, des butées pourront être également prévues en vis-à-vis chaque projection prévue pour l’amortissement, de l’autre côté de la carte 208. To further limit vibrations, stops may also be provided opposite each projection provided for damping, on the other side of card 208.
[0080] De manière générale, le module 107 comprend au moins une projection de fixation, comme les projections 218, et/ou au moins une projection d’appui, comme la projection 220. [0080] In general, the module 107 comprises at least one fixing projection, such as the projections 218, and/or at least one supporting projection, such as the projection 220.
[0081] De préférence, les projections de fixation 218 et ou d’appui 220 présentent sensiblement la même hauteur. [0081] Preferably, the fixing projections 218 and or support 220 have substantially the same height.
[0082] Chaque projection peut présenter, notamment, une forme de tronc de cône. Ceci est par exemple le cas des projections de fixation 218. Alternativement, chaque projection peut présenter une forme de pyramide tronquée, notamment à base carré. Ceci est par exemple le cas des projections d’appui 220. Each projection may have, in particular, a truncated cone shape. This is for example the case of the fixing projections 218. Alternatively, each projection may have the shape of a truncated pyramid, in particular with a square base. This is for example the case of support projections 220.
[0083] En variante, le module 107 pourra uniquement comprendre une ou des projections de fixation. En variante encore, le module 107 pourra uniquement comprendre une ou des projections d’appui. Alternatively, the module 107 may only include one or more fixing projections. As a further variant, the module 107 may only comprise one or more support projections.
[0084] Selon un mode de réalisation, au moins une face de contact 306 est directement au contact avec une face inférieure de la carte 208. En variante, un matériau de remplissage est intercalé entre cette face de contact 306 et la carte 208, de sorte que la carte 208 est en appui contre la face de contact 306 au travers du matériau de remplissage. Ce matériau de remplissage est avantageusement conducteur thermique afin de permettre une circulation de chaleur depuis la carte 208 vers le bloc 214 pour refroidir la carte 208 et/ou des composants électroniques (non représentés) portés par cette dernière. Par exemple, le matériau de remplissage présente une conductivité thermique comprise entre 1 et 5 W nr1 K 1. According to one embodiment, at least one contact face 306 is directly in contact with a lower face of the card 208. Alternatively, a filling material is interposed between this contact face 306 and the card 208, so that the card 208 bears against the contact face 306 through the filling material. This filling material is advantageously thermally conductive in order to allow heat circulation from the card 208 to block 214 to cool card 208 and/or electronic components (not shown) carried by the latter. For example, the filling material has a thermal conductivity of between 1 and 5 W nr 1 K 1 .
[0085] Selon le mode de réalisation des figures 2 à 4, chaque projection 218, 220 est issue de matière du bloc 214. Ainsi, le bloc 214 et la ou les projections 218, 220 sont formés en une seule pièce. Cela peut être réalisé notamment en prévoyant un moule avec une cavité principale de moulage correspondant au bloc 214 et au moins une cavité secondaire de moulage correspondant respectivement à la ou aux projections . Chaque projection 218, 220 est ainsi, par exemple, en résine époxy comme le bloc 214. According to the embodiment of Figures 2 to 4, each projection 218, 220 is made from material of the block 214. Thus, the block 214 and the projection(s) 218, 220 are formed in a single piece. This can be achieved in particular by providing a mold with a main molding cavity corresponding to the block 214 and at least one secondary molding cavity corresponding respectively to the projection(s). Each projection 218, 220 is thus, for example, made of epoxy resin like block 214.
[0086] En référence à la figure 5, un exemple 500 de procédé de fabrication du système électrique comportant les modules 107, le support 212 et la carte 208, va à présent être décrit. [0086] With reference to FIG. 5, an example 500 of the method for manufacturing the electrical system comprising the modules 107, the support 212 and the card 208 will now be described.
[0087] Au cours d’une étape 502, il est obtenu l’assemblage des puces 201 , du substrat 202, des conducteurs 204a-c et des broches 210. During a step 502, the assembly of the chips 201, the substrate 202, the conductors 204a-c and the pins 210 is obtained.
[0088] Au cours d’une étape 504, l’assemblage obtenu est surmoulé en utilisant un moule comportant une cavité principale de moulage correspondant au bloc 214 et des formes correspondant aux projections 218, 220 en communication avec la cavité principale. Ainsi, une seule pièce est obtenue par le moulage, cette pièce comportant le bloc 214 et les projections 218, 220. De préférence, la technique de moulage par transfert ou bien de moulage par compression est utilisée. L’étape 504 fournit ainsi un des modules 107. Les étapes 502, 504 sont répétées pour obtenir les autres modules 107. During a step 504, the assembly obtained is overmolded using a mold comprising a main molding cavity corresponding to the block 214 and shapes corresponding to the projections 218, 220 in communication with the main cavity. Thus, a single part is obtained by molding, this part comprising the block 214 and the projections 218, 220. Preferably, the technique of transfer molding or compression molding is used. Step 504 thus provides one of the modules 107. Steps 502, 504 are repeated to obtain the other modules 107.
[0089] Au cours d’une étape 506, les modules 107 sont rapportés contre le support 212 et fixés à ce dernier. [0089] During a step 506, the modules 107 are attached against the support 212 and fixed to the latter.
[0090] Au cours d’une étape 508, une machine-outil fait descendre la carte 208 en direction des faces supérieures 216a des modules 107. Lors de ce déplacement de descente, les broches 210 sont insérées dans des ouvertures 406 correspondantes de la carte 208 (visibles sur la figure 4). Les broches 210 sont par exemple à emmanchement en force (de l’anglais « press-fit »), de sorte que leurs extrémités de connexion 210’ présentent un diamètre plus grand que l’ouverture 406. Ainsi, ces extrémités de connexion 210’ sont compressées radialement lors de leur insertion, ce qui nécessite un effort d’insertion important de la machine-outil. [0091] Au cours d’une étape 510, la carte 208 arrive au contact des projections 218, 220, ce qui, d’une part, permet de contrôler la distance verticale entre la carte 208 et les modules 107 en évitant que la machine-outil ne descende trop la carte 208. D’autre part, ce contact entraîne une augmentation d’une réaction au déplacement de la carte 208, ce qui peut être utilisé comme signal pour arrêter le déplacement. During a step 508, a machine tool lowers the card 208 in the direction of the upper faces 216a of the modules 107. During this downward movement, the pins 210 are inserted into corresponding openings 406 of the card. 208 (visible in Figure 4). The pins 210 are for example press-fit, so that their connection ends 210' have a larger diameter than the opening 406. Thus, these connection ends 210' are compressed radially during their insertion, which requires a significant insertion force of the machine tool. [0091] During a step 510, the card 208 comes into contact with the projections 218, 220, which, on the one hand, makes it possible to control the vertical distance between the card 208 and the modules 107 by preventing the machine -tool does not lower the card 208 too much. On the other hand, this contact causes an increase in a reaction to the movement of the card 208, which can be used as a signal to stop the movement.
[0092] Ainsi, au cours d’une étape 512, la machine-outil détecte l’augmentation de la réaction au déplacement, ce qui indique qu’un mouvement de descente pour la mise en place de la carte 208 est en fin de course. [0092] Thus, during a step 512, the machine tool detects the increase in the reaction to the displacement, which indicates that a downward movement for the installation of the card 208 is at the end of its travel. .
[0093] En réponse à la détection d’augmentation de la réaction au déplacement, la machine-outil arrête le déplacement de la carte 208 au cours d’une étape 514. Il est ainsi possible d’éviter qu’un effort trop important soit exercé lors de la mise en place de la carte 208. La machine-outil servant à la mise en place de la carte 208 comprend avantageusement en ce sens des butées destinées à venir en vis-à-vis de la ou des projections d’appui 220, de l’autre côté de la carte 208. [0093] In response to the detection of an increase in the reaction to displacement, the machine tool stops the displacement of the card 208 during a step 514. It is thus possible to prevent too great a force from being exerted during the installation of the card 208. The machine tool used for the installation of the card 208 advantageously comprises in this sense stops intended to come in vis-à-vis the support projection(s) 220, on the other side of map 208.
[0094] Un autre exemple 601 de module selon l’invention va à présent être décrit. Another example 601 of a module according to the invention will now be described.
[0095] En référence aux figures 6 à 8, ce module 601 est similaire au module 107 des figures précédentes, si ce qu’il comporte au moins une projection, désignée par la référence 602, qui est une pièce différente du bloc 214. [0095] With reference to Figures 6 to 8, this module 601 is similar to module 107 of the previous figures, if it includes at least one projection, designated by the reference 602, which is a different part from block 214.
[0096] Dans l’exemple décrit, la ou les projections 602 remplacent les projections de fixation 218, en gardant leur fonctions d’appui et de fixation. Cependant, cette variante pourrait aussi bien s’appliquer aux projections d’appui 220. In the example described, the projection(s) 602 replace the fixing projections 218, keeping their support and fixing functions. However, this variant could apply equally well to the 220 support projections.
[0097] Comme cela ressort plus particulièrement aux figures 7 et 8, la projection 602 est préférentiellement fixée sur l’un des conducteurs 204a-c du module 107. Elle est située, dans l’exemple décrit, sur une partie plane 702 du conducteur 204c. Bien sûr, la projection 602 pourrait être fixée à un des autres conducteurs 204a, 204b. La projection 602 s’étend à partir d’une face supérieure 704 de la partie plane 702, opposée à une face inférieure 706 située en vis-à-vis du substrat 12. La projection 602 est positionnée ici à proximité d’un bord 708 du substrat 202 et/ou de l’une des extrémités de connexion 204’a-c du conducteur 204a-c. As is apparent more particularly in Figures 7 and 8, the projection 602 is preferably fixed on one of the conductors 204a-c of the module 107. It is located, in the example described, on a flat part 702 of the conductor 204c. Of course, projection 602 could be attached to one of the other conductors 204a, 204b. The projection 602 extends from an upper face 704 of the flat part 702, opposite a lower face 706 located vis-à-vis the substrate 12. The projection 602 is positioned here close to an edge 708 of the substrate 202 and/or of one of the connection ends 204'ac of the conductor 204a-c.
[0098] En référence à la figure 8, pour fixer la projection 602, le conducteur 204a-c présente avantageusement une lumière 802 à travers laquelle la projection 602 est fixée par un élément de fixation 804, notamment par rivetage ou bouterollage à chaud. Une face inférieure de la projection 602 est ainsi retenue en appui contre la face supérieure 704 de la partie plane 702 du conducteur 204c, l’élément de fixation 804 prenant appui contre la face inférieure 706 opposée en passant à travers la lumière 802. Tout autre mode de fixation est bien sûr possible. Referring to Figure 8, to fix the projection 602, the conductor 204a-c advantageously has a slot 802 through which the projection 602 is fixed by a fixing element 804, in particular by riveting or hot riveting. A lower face of the projection 602 is thus retained bearing against the upper face 704 of flat part 702 of conductor 204c, fixing element 804 resting against opposite lower face 706 passing through slot 802. Any other mode of fixing is of course possible.
[0099] La projection 602 peut être réalisée par un premier surmoulage du conducteur 204c, soit directement dans sa forme illustrée sur les figures ou bien suivi par le rivetage ou le bouterollage de l’élément de fixation 804 pour l’amener dans sa forme illustrée. La réalisation du bloc 214 intervient alors par exemple après ce premier surmoulage et, le cas échéant, l’opération de rivetage ou bouterollage. The projection 602 can be produced by a first overmolding of the conductor 204c, either directly in its form illustrated in the figures or else followed by the riveting or riveting of the fastening element 804 to bring it into its illustrated form. . The production of the block 214 then takes place, for example, after this first overmolding and, where appropriate, the riveting or riveting operation.
[0100] Le bloc 214 enrobe une base 806 de la projection 602. Autrement dit, la base 806 est surmoulée par le bloc 214. Par exemple, le bloc 214 enrobe la projection 602 sur quelques dixièmes de millimètres de hauteur, par exemple entre 0,2 et 1 ,5 mm, à partir de la face supérieure 704 de la partie plane 702 du conducteur 204c. Il sera apprécié que la projection 602 présente des parois latérales inclinées, ce qui permet au bloc 214 de les recouvrir verticalement et ainsi d’améliorer la fixation de la projection 602. The block 214 coats a base 806 of the projection 602. In other words, the base 806 is overmolded by the block 214. For example, the block 214 coats the projection 602 over a few tenths of a millimeter in height, for example between 0 2 and 1.5 mm, from the upper face 704 of the flat part 702 of the conductor 204c. It will be appreciated that the projection 602 has sloped side walls, which allows the block 214 to cover them vertically and thus improve the fixing of the projection 602.
[0101] Un avantage d’utiliser deux pièces distinctes pour la projection 602 et le bloc 214 est d’éviter la propagation de fissures entre la projection 602 et le bloc 214. [0101] An advantage of using two separate parts for the projection 602 and the block 214 is to avoid the propagation of cracks between the projection 602 and the block 214.
[0102] La projection 602 peut être dans le même matériau que le bloc 214, notamment en résine époxy. The projection 602 can be made of the same material as the block 214, in particular epoxy resin.
[0103] En variante, un matériau différent est utilisé. Ceci présente notamment l’avantage de permettre l’utilisation d’un matériau adapté à la réalisation d’un filetage destiné à des vis plus standards et/ou à l’amortissement de vibrations. Alternatively, a different material is used. This has the particular advantage of allowing the use of a material suitable for the production of a thread intended for more standard screws and/or for the damping of vibrations.
[0104] On notera par ailleurs que l’invention n’est pas limitée aux modes de réalisation décrits précédemment. Il apparaîtra en effet à l'homme de l'art que diverses modifications peuvent être apportées aux modes de réalisation décrits ci- dessus, à la lumière de l'enseignement qui vient de lui être divulgué. It will also be noted that the invention is not limited to the embodiments described above. It will indeed appear to those skilled in the art that various modifications can be made to the embodiments described above, in the light of the teaching which has just been disclosed to them.
[0105] En particulier, les projections 218, 220, 602 pourraient présenter des formes différentes, autre que tronconique ou pyramidale tronquée. Elles pourraient par ailleurs présenter des hauteurs différentes. [0105] In particular, the projections 218, 220, 602 could have different shapes, other than frustoconical or truncated pyramidal. They could also have different heights.
[0106] En outre, chaque puce peut comporter un autre type de composant qu’un interrupteur semi-conducteur, par exemple : un composant électronique passif tels qu'une résistance électrique et ou un composant capacitif, et/ou une puce semi- conductrice permettant de réaliser une ou plusieurs fonctions logiques afin de permettre au module électronique de puissance de mettre en forme des signaux électriques de puissance. [0106] In addition, each chip may include a type of component other than a semiconductor switch, for example: a passive electronic component such as an electrical resistor and/or a capacitive component, and/or a semiconductor chip making it possible to carry out one or more logical functions in order to allow the electronic power module to shape electrical power signals.
[0107] En outre, les projections 218, 220, 602 peuvent être conçues pour coopérer avec tout autre composant qu’une carte électronique comme la carte 208, notamment une armature de fixation du module. Ainsi, grâce aux projections 218,[0107] In addition, the projections 218, 220, 602 can be designed to cooperate with any component other than an electronic card such as the card 208, in particular a module fixing frame. Thus, thanks to projections 218,
220, 602, tout composant (la carte 208 ou tout autre composant), est positionnée à distance de la face 216a du bloc 214, ceci sans avoir à faire appel à des pièces supplémentaires. 220, 602, any component (the card 208 or any other component) is positioned at a distance from the face 216a of the block 214, this without having to use additional parts.
[0108] En outre, le système pourrait être utiliser dans un compresseur d’air. Ainsi, la machine électrique tournante 104 pourrait être prévue pour entraîner un élément de compression d’air, notamment en vue de générer un flux d’air de suralimentation d’un moteur. [0108] Furthermore, the system could be used in an air compressor. Thus, the rotating electrical machine 104 could be provided to drive an air compression element, in particular with a view to generating a flow of supercharging air from an engine.
[0109] Dans la présentation détaillée de l’invention qui est faite précédemment, les termes utilisés ne doivent pas être interprétés comme limitant l’invention aux modes de réalisation exposés dans la présente description, mais doivent être interprétés pour y inclure tous les équivalents dont la prévision est à la portée de l'homme de l'art en appliquant ses connaissances générales à la mise en oeuvre de l'enseignement qui vient de lui être divulgué. In the detailed presentation of the invention which is made above, the terms used must not be interpreted as limiting the invention to the embodiments set out in the present description, but must be interpreted to include therein all the equivalents of which the forecast is within the reach of those skilled in the art by applying their general knowledge to the implementation of the teaching which has just been disclosed to them.

Claims

Revendications Claims
[1 ] Module électronique de puissance (107 ; 601) comportant : au moins une puce électronique (201) ; et un bloc (214) surmoulé isolant électrique enrobant au moins partiellement chaque puce (201) ; caractérisé en ce qu’il comprend au moins une projection (218, 220, 602) d’appui d’un composant, tel qu’une carte électronique (208) de commande de chaque puce (201), la projection (218, 220, 602) comportant un matériau isolant électrique et s’étendant à partir d’une face (216a) du bloc (214). [1] Electronic power module (107; 601) comprising: at least one electronic chip (201); and an electrically insulating overmolded block (214) at least partially encasing each chip (201); characterized in that it comprises at least one projection (218, 220, 602) supporting a component, such as an electronic card (208) for controlling each chip (201), the projection (218, 220 , 602) comprising an electrically insulating material and extending from a face (216a) of the block (214).
[2] Module (107 ; 601) selon la revendication 1 , dans lequel la projection (218, 220, 602) présente une extrémité libre définissant une face de contact (306) du composant. [2] Module (107; 601) according to claim 1, wherein the projection (218, 220, 602) has a free end defining a contact face (306) of the component.
[3] Module (107 ; 601) selon la revendication 1 ou 2, dans lequel la face de contact (306) est plane. [3] Module (107; 601) according to claim 1 or 2, wherein the contact face (306) is planar.
[4] Module (107 ; 601) selon l’une quelconque des revendications 1 à 3, dans lequel au moins une projection (218, 602) est conçue pour fixer le composant. [4] Module (107; 601) according to any one of claims 1 to 3, wherein at least one projection (218, 602) is designed to fix the component.
[5] Module (107 ; 601) selon les revendications 2 et 4 prises ensemble, dans lequel la face de contact (306) de la projection (218, 602) conçue pour fixer le composant présente un trou de vissage (308). [5] Module (107; 601) according to claims 2 and 4 taken together, wherein the contact face (306) of the projection (218, 602) designed to fix the component has a screw hole (308).
[6] Module (107 ; 601) selon la revendication précédente dans lequel le trou de vissage (308) est soit taraudé, soit lisse et destiné à coopérer avec une vis autoformeuse ou bien auto-taraudeuse. [6] Module (107; 601) according to the preceding claim wherein the screw hole (308) is either threaded or smooth and intended to cooperate with a self-forming or self-tapping screw.
[7] Module (107 ; 601) selon la revendication 2 ou 3, dans lequel la face de contact (306) de la projection (218) est conçue pour laisser le composant s’éloigner de cette face de contact (306). [7] Module (107; 601) according to claim 2 or 3, wherein the contact face (306) of the projection (218) is designed to let the component move away from this contact face (306).
[8] Module (107 ; 601) selon la revendication 7, dans lequel la face de contact (306) de la projection (218, 602) conçue pour laisser le composant s’éloigner est dépourvue d’alésage. [8] Module (107; 601) according to claim 7, wherein the contact face (306) of the projection (218, 602) designed to let the component move away is devoid of bore.
[9] Module (107 ; 601) selon l’une quelconque des revendications 1 à 8, dans lequel la projection (218, 220, 602) présente une forme de tronc de cône et/ou de pyramide tronquée. [9] Module (107; 601) according to any one of claims 1 to 8, wherein the projection (218, 220, 602) has the shape of a truncated cone and / or truncated pyramid.
[10] Module (107) selon l’une quelconque des revendications 1 à 9, dans lequel la projection (218, 220) et le bloc (214) sont en une seule pièce. [10] Module (107) according to any one of claims 1 to 9, wherein the projection (218, 220) and the block (214) are in one piece.
[11] Module (601) selon l’une quelconque des revendications 1 à 9, dans lequel la projection (602) et le bloc (214) sont en deux pièces distinctes. [11] Module (601) according to any one of claims 1 to 9, wherein the projection (602) and the block (214) are in two separate parts.
[12] Module (601) selon la revendication 11 , comprenant un conducteur électrique (204c), et dans lequel la projection (602) est fixée au conducteur (204c). [12] Module (601) according to claim 11, comprising an electrical conductor (204c), and wherein the projection (602) is fixed to the conductor (204c).
[13] Module (601) selon la revendication 12, dans lequel le conducteur (204c) présente une lumière (802), et dans lequel la projection (602) est fixée au conducteur (204c) à travers la lumière (802). [13] Module (601) according to claim 12, wherein the conductor (204c) has a light (802), and wherein the projection (602) is attached to the conductor (204c) through the light (802).
[14] Module (601) selon la revendication 13, dans lequel la projection (602) est fixée par rivetage ou bouterollage ou surmoulage sur le conducteur (204c). [14] Module (601) according to claim 13, wherein the projection (602) is fixed by riveting or riveting or molding on the conductor (204c).
[15] Module (601) selon l’une quelconque des revendications 11 à 14, dans lequel le bloc (214) enrobe une base (806) de la projection (602). [15] Module (601) according to any one of claims 11 to 14, wherein the block (214) coats a base (806) of the projection (602).
[16] Système électrique (100) comportant un module selon l’une quelconque des revendications 1 à 15 et un composant en appui sur chaque projection (218, 220, 602). [16] Electrical system (100) comprising a module according to any one of claims 1 to 15 and a component bearing on each projection (218, 220, 602).
[17] Procédé (500) de fabrication d’un module (107 ; 601) selon l’une quelconque des revendications 1 à 15, comportant : l’obtention (502) de la ou des puces (201) ; le surmoulage (504) des puces (201) par le bloc (214), par exemple par moulage par transfert ou bien par moulage par compression ; et - la réalisation de chaque projection (218, 220, 602) d’appui du composant. [17] Method (500) for manufacturing a module (107; 601) according to any one of claims 1 to 15, comprising: obtaining (502) the chip(s) (201); the overmolding (504) of the chips (201) by the block (214), for example by transfer molding or else by compression molding; and - the realization of each projection (218, 220, 602) of support of the component.
[18] Procédé (500) selon la revendication 17, dans lequel l’étape de surmoulage (504) est réalisée en utilisant un moule comportant une cavité principale de moulage correspondant au bloc (214) et au moins une cavité secondaire de moulage correspondant respectivement à la ou les projections (218, 220), cette cavité secondaire étant en communication avec la cavité principale, de sorte que chaque projection (218, 220) et le bloc (214) sont en une seule pièce. [18] Method (500) according to claim 17, in which the overmolding step (504) is carried out using a mold comprising a main molding cavity corresponding to the block (214) and at least one secondary molding cavity corresponding respectively to the projection or projections (218, 220), this secondary cavity being in communication with the main cavity, so that each projection (218, 220) and the block (214) are in one piece.
[19] Procédé (500) selon la revendication 17, dans lequel la réalisation de chaque projection (602) est distincte de l’étape de surmoulage (504), de sorte que la ou les projections (602) et le bloc (214) sont des pièces distinctes. [19] Method (500) according to claim 17, in which the production of each projection (602) is separate from the overmolding step (504), so that the projection(s) (602) and the block (214) are separate parts.
[20] Procédé (500) de fabrication d’un système électrique (100) selon la revendication 16, comportant : la fabrication d’un module (107 ; 601) selon l’une quelconque des revendications 17 à 20 ; le déplacement (508) par une machine-outil du composant en direction de la face (216a) du bloc (214) jusqu’à ce que le composant vienne en appui contre chaque projection (218, 220, 602) ; la détection (512) par la machine-outil d’une augmentation d’une réaction au déplacement ; et l’arrêt (514) par la machine-outil du déplacement du composant. [20] A method (500) of manufacturing an electrical system (100) according to claim 16, comprising: manufacturing a module (107; 601) according to any one of claims 17 to 20; the displacement (508) by a machine tool of the component in the direction of the face (216a) of the block (214) until the component comes to rest against each projection (218, 220, 602); detecting (512) by the machine tool an increase in a reaction to the displacement; and stopping (514) by the machine tool the movement of the component.
EP21734841.6A 2020-07-10 2021-06-23 Electronic power module, electrical system comprising such a module, corresponding manufacturing methods Pending EP4179569A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2007367A FR3112424B1 (en) 2020-07-10 2020-07-10 Power electronic module, electrical system comprising such a module, corresponding manufacturing processes
PCT/EP2021/067106 WO2022008244A1 (en) 2020-07-10 2021-06-23 Electronic power module, electrical system comprising such a module, corresponding manufacturing methods

Publications (1)

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EP4179569A1 true EP4179569A1 (en) 2023-05-17

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US (1) US20230274994A1 (en)
EP (1) EP4179569A1 (en)
JP (1) JP2023533389A (en)
CN (1) CN116802778A (en)
FR (1) FR3112424B1 (en)
WO (1) WO2022008244A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085613A (en) * 1999-09-13 2001-03-30 Hitachi Ltd Transfer mold power module
JP4583122B2 (en) * 2004-09-28 2010-11-17 三菱電機株式会社 Semiconductor device and manufacturing method thereof
US9082766B2 (en) * 2013-08-06 2015-07-14 Google Technology Holdings LLC Method to enhance reliability of through mold via TMVA part on part POP devices

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FR3112424A1 (en) 2022-01-14
FR3112424B1 (en) 2023-05-12
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CN116802778A (en) 2023-09-22
US20230274994A1 (en) 2023-08-31

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