EP4179569A1 - Electronic power module, electrical system comprising such a module, corresponding manufacturing methods - Google Patents
Electronic power module, electrical system comprising such a module, corresponding manufacturing methodsInfo
- Publication number
- EP4179569A1 EP4179569A1 EP21734841.6A EP21734841A EP4179569A1 EP 4179569 A1 EP4179569 A1 EP 4179569A1 EP 21734841 A EP21734841 A EP 21734841A EP 4179569 A1 EP4179569 A1 EP 4179569A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- projection
- module
- block
- component
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000012777 electrically insulating material Substances 0.000 claims abstract description 4
- 239000004020 conductor Substances 0.000 claims description 35
- 238000000465 moulding Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000006073 displacement reaction Methods 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 238000000748 compression moulding Methods 0.000 claims description 4
- 238000001721 transfer moulding Methods 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 3
- 238000010079 rubber tapping Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000013016 damping Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000000284 resting effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10901—Lead partly inserted in hole or via
Definitions
- the present invention relates to an electronic power module, an electrical system comprising such a module and corresponding manufacturing methods. It will find its applications in particular in the automotive field.
- power electronic modules comprising electronic chips are implemented in order to control electrical signals making it possible to control the operation of an electrical system, such as a rotating electrical machine.
- the chips can be protected by an overmoulding, for example in epoxy resin, forming a rigid block coating the chips.
- metal inserts can be provided in the molded block to allow the passage of card fixing screws. The inserts are for example molded at the same time as the chips and are flush with one face of the molded block facing the card.
- the card is positioned against the face of the molded block and fixed by means of screws screwed into the inserts.
- the presence of the inserts constitutes an additional cost.
- these inserts are essential to prevent the screwing from cracking the overmolded block and compromising the protection of the chips.
- an electronic power module comprising: at least one electronic chip; and an electrically insulating overmolded block at least partially encasing each chip; characterized in that it comprises at least one bearing projection of a component, such as an electronic control card for each chip, the projection comprising an electrically insulating material and extending from one face of the block .
- the projection or projections it is possible to keep the component away from the block without requiring a plastic casing.
- one or more of these projections can be used to fix the component by screwing and this without requiring a metal insert. Indeed, the screwing can be carried out in the material of the projection, so that the screw does not reach the block and therefore presents little risk of damaging the latter.
- the projection has a free end defining a contact face of the component.
- the contact face is flat.
- At least one projection is designed to secure the component.
- the contact face of the projection designed to fix the component has a screw hole.
- the screw hole is either threaded or smooth and intended to cooperate with a self-forming or else self-tapping screw.
- the contact face of the projection is designed to allow the component to move away from this contact face.
- the contact face of the projection designed to allow the component to move away has no bore.
- the projection has the shape of a truncated cone and/or a truncated pyramid.
- the projection and the block are in one piece.
- the projection and the block are in two separate parts. [0021] Also optionally, it comprises an electrical conductor and the projection is attached to the conductor.
- the conductor has a light and the projection is attached to the conductor through the light.
- the projection is fixed by riveting or riveting or overmolding on the conductor.
- the block coats a base of the projection.
- An electrical system comprising a module according to the invention and a component resting on each projection.
- a method for manufacturing a module according to the invention comprising: obtaining the chip or chips; the overmolding of the chips by the block, for example by transfer molding or else by compression molding; and the realization of each support projection of the component.
- the overmolding step is carried out using a mold comprising a main molding cavity corresponding to the block and at least one secondary molding cavity corresponding respectively to the projection or projections, this secondary cavity being in communication with the main cavity, so that each projection and the block are in one piece.
- each projection is separate from the overmolding step, so that the projection(s) and the block are separate parts.
- a method of manufacturing an electrical system according to the invention comprising: the manufacture of a module according to the invention; the displacement by a machine tool of the component in the direction of the face of the block until the component bears against each projection; the machine tool detecting an increase in a reaction to the displacement; and stopping by the machine tool of the movement of the component.
- Figure 1 is an electrical circuit of an example of an electrical system implementing the invention
- Figure 2 is a sectional view of an electronic power module of the system of Figure 1,
- Figure 3 is a perspective view of a first example of the electronic power module of Figure 2,
- Figure 4 illustrates the module of Figure 3, further equipped with an electronic card represented so as to be able to see the rest of the module by transparency,
- Figure 5 is a block diagram illustrating the steps of a method of manufacturing an electrical system comprising the module of Figures 2 to 4,
- FIG. 5 partially illustrates in perspective another example of an electronic power module according to the invention
- Figure 7 repeats Figure 6, with an overmolded block of the module removed, and
- Figure 8 illustrates in section the module of Figures 6 and 7.
- the electrical system 100 is for example intended to be implemented in a motor vehicle (not shown).
- the electrical system 100 firstly comprises a DC voltage source 102 comprising a positive terminal and a negative terminal, the latter being generally connected to an electrical ground, such as a chassis of the motor vehicle.
- the DC voltage source 102 is designed to provide an input voltage denoted E.
- the electrical system 100 further comprises a rotating electrical machine 104 comprising stator phases.
- the rotating electrical machine 104 is part of an alternator-starter coupled to a heat engine (not shown) of the motor vehicle.
- the rotating electric machine 104 is thus designed to operate alternately in engine mode in which it assists the heat engine and in alternator mode in which it transforms part of the mechanical energy generated by the heat engine into electrical energy to recharge the DC voltage source 102.
- the electrical system 100 further comprises a voltage converter 106 connected, on the one hand, to the terminals of the DC voltage source 102 and, on the other hand, to the rotating electrical machine 104.
- the voltage converter 106 comprises switching arms respectively associated with the stator phases. Each switch arm has a high side switch connected to the positive terminal of DC voltage source 102 and a low side switch connected to the negative terminal of DC voltage source 102. The high side switch and the low side switch are further connected to each other at a midpoint connected to the associated stator phase.
- Each switching arm is intended to be controlled to switch between two configurations.
- first called high configuration
- the high side switch is closed and the low side switch is open so that the input voltage E is applied to the associated stator phase.
- second known as the low configuration
- the high side switch is open and the low side switch is closed so that zero voltage is applied to the associated stator phase.
- the electrical system 100 further comprises electronic power modules 107 respectively implementing the switching arms.
- the electrical system 100 further comprises a device 108 for controlling the modules 107, to cause each arm to switch between these two configurations.
- the voltage converter 106 is controlled as an inverter so as to supply electrical energy to the rotating electrical machine 104 when it is desired that it operates in motor mode.
- the voltage converter 106 is controlled as a rectifier to supply electrical energy to the DC voltage source 102 (for example, to recharge it) when it is desired that the rotating electrical machine 104 operates in alternator mode.
- the switches are semiconductor switches comprising, for example, transistors.
- the switches are for example insulated gate field effect transistors (from the English “Metal Oxide Semiconductor Field Effect Transistor” or MOSFET) or even insulated gate bipolar transistors (from the English “Insulated Gate Bipolar Transistor” or IGBT).
- the various elements will be spatially identified according to an arbitrary orthogonal reference frame comprising a vertical direction V, a longitudinal direction L and a transverse direction T.
- the module 107 first of all comprises one or more electronic chips 201 comprising, in the example described, each one of the semiconductor switches of the switching arms of the voltage converter 106.
- each chip 201 has two opposite electrical connection faces, one upper and the other lower, as well as a control terminal.
- the module 107 further comprises a substrate 202 on which the chips 201 are mounted.
- the substrate 202 is in two parts each carrying one or more of the chips 201.
- the substrate 202 is advantageously an electronic substrate, such as for example a metal plate or strip or a printed circuit board comprising electrical tracks for electrically connecting several chips 201 to each other and/or for electrically connecting a chip 201 with a electrical conductor such as those which will be described later.
- the substrate 202 comprises a ceramic core coated on one or both of its faces with copper. This is for example a directly bonded copper substrate, from the English "Direct Bonded Copper substrate” or "DBG substrate”).
- the substrate 202 may comprise a metal plate, such as an aluminum plate, covered with a layer of dielectric, itself covered with a layer of copper.
- each chip 201 is electrically and/or mechanically coupled to the substrate 202, for example to at least one of its electrical tracks.
- the lower faces of each electronic chip are coupled simultaneously mechanically and electrically to the substrate 202, preferably by soldering.
- the module 107 also includes electrical conductors 204a-c intended to be placed at different electrical potentials. They are electrically connected to chips 201 according to the desired circuit, to implement a switching arm in the example described. Conductors 204a-c are configured to carry electrical signals to or from at least a portion of chips 201.
- the conductors 204a-c advantageously comprise substantially planar rigid bars (called “lead frame” in English). These bars are, for example, metallic. They extend straight and/or are shaped and present bends and/or changes of plane if necessary depending on the desired topography.
- the conductors 204a-c have connection ends 204'ac allowing electrical, or even mechanical, connection of the conductors 204a-c to the rest of the voltage converter 106, for example to bus bars connecting the module 107 to the source DC voltage 102 and the rotating electrical machine 104.
- the conductors 204a-c comprises two conductors 204a, 204b whose respective connection ends 204'a, 204'b are connected respectively to the positive terminal and the negative terminal of the DC voltage source. 102, as well as a conductor 204c whose connection end 204'c is connected to a respective one of the phases of the rotating electrical machine 104.
- each connection end 204'ac comprises a through opening 307 (visible in Figures 3 and 4) to allow easy coupling, for example by screwing through the through opening 307.
- the coupling could be achieved by brazing.
- each chip 201 is electrically and/or mechanically coupled to one of the electrical conductors 204a-c, for example at the level of a boss 206 of this conductor 204a-c.
- the upper faces of the chips 201 are coupled simultaneously mechanically and electrically to the conductor 204a-c, preferably by soldering.
- the module 107 further comprises vertical pins 210 for the electrical connection respectively of the chips 201 and or of the substrate 202 and/or or conductors 204.
- These pins 210 present respective connection ends 210' to the card 208.
- these connection ends 210' are inserted into corresponding openings of the card 208, and fixed to the latter by force-fitting (from the English “press-fit”) or else by welding.
- the electrical system 100 preferably further comprises a support 212 on which the module 107 is mounted.
- This support 212 comprises, for example, a metal plate and is designed, in particular, to promote thermal dissipation of heat emitted by the module 107.
- the support 212 is common to the three modules 107.
- the module 107 further comprises an overmolded block 214, which is electrically insulating, rigid and at least partially coats each chip 201.
- the block 214 completely coats the chip or chips 201 of the module 107.
- the block 214 includes by example an epoxy resin. It is, for example, produced using the technique of transfer molding or compression molding.
- chip(s) 201 are bare chips embedded in block 214 so as to encapsulate them.
- Block 214 advantageously wraps other components of module 107, as will be developed below.
- each of the modules 107 here has a substantially parallelepipedal shape with two large opposite faces 216a, 216b, substantially parallel, respectively upper and lower. These large faces 216a, 216b are, for example, substantially rectangular.
- block 214 coats not only chips 201 but also at least part of substrate 202, at least part of conductors 114 and/or at least part of pins 210.
- the rigidity of block 214 makes it possible to maintain mechanically together the coated elements to achieve their encapsulation.
- block 214 coats substrate 202 with the exception of an underside of the latter, left free to come into contact with support 212.
- Block 214 also coats conductors 204a-c to the 'except for their connection ends 204'ac, as well as pins 210, except for their connection ends 210'.
- the module 107 further comprises projections 218, 220 comprising an electrically insulating material and extending from one face of the block 214.
- projections 218, 220 comprising an electrically insulating material and extending from one face of the block 214.
- the faces 216a, 216b are connected by short sides having longitudinal faces 302a, 302b and transverse 310a, 310b.
- the block 214 is substantially flat, that is to say that a width and a length of the faces 216a, 216b is much greater than a vertical distance separating them.
- connection ends 204'a-c of the conductors 204a-c protrude laterally from the block 214 by its transverse faces 310a, 310b.
- connection ends 210' of the terminals 210 protrude laterally from the block 214 by its longitudinal faces 302a, 302b.
- the projections 218, 220 extend vertically upwards from the upper face 216a of the block 214. Still in the example described, they are located vertically to the substrate 202. These projections 218, 220 have a height, measured from the large upper face 6a, comprised, for example, between 3 mm and 5 cm.
- the projections 218, 220 are here designed to receive the card 208, in order to support it and keep it at a distance from the face 216a of the block 214 which is opposite the card 208.
- the projections 218, 220 each have, for example, an upper free end defining a contact face 306, in particular flat, against which the card 208 is designed to rest. Each contact face 306 thus forms a bearing surface or a stopper for the card 208.
- the projections 218 also have the function of allowing the fixing of the card 222. They have for this a vertical screw hole 308 opening into the contact face 306. It is thus oriented along a vertical axis of the projection 218.
- This screw hole 308 is advantageously tapped to form a bore to allow a screw 402 to be screwed in, or smooth and intended to cooperate with a self-forming or self-tapping screw. Said screws pass through, for example, holes 404 located in correspondence in the card 208.
- four fixing projections 218 are provided, located at the corners of the upper face 216a of the block 214.
- the projection 220 does not have the function of fixing the card 208, but only of providing a support surface or a stopper for the card 208. It will be called the “support projection” sequence.
- the support projection 220 does not retain the card 208, that is to say it allows the card 208 to move away, upwards, from the upper face 216a of the block 214.
- the contact face 306 of the bearing projection 220 has no bore.
- the support projection 220 is located for example substantially in a central part of the upper face 216a and preferably equidistant from the fixing projections 218.
- Each projection 218, 220 (and in particular the support projection 220) can be configured to dampen vibrations of the card 208.
- the location of each projection provided for the damping may also depend on the configuration of the card 208. In general, each projection provided for the damping is located at the level of a vibration antinode of the card 208.
- stops may also be provided opposite each projection provided for damping, on the other side of card 208.
- the module 107 comprises at least one fixing projection, such as the projections 218, and/or at least one supporting projection, such as the projection 220.
- the fixing projections 218 and or support 220 have substantially the same height.
- Each projection may have, in particular, a truncated cone shape. This is for example the case of the fixing projections 218.
- each projection may have the shape of a truncated pyramid, in particular with a square base. This is for example the case of support projections 220.
- the module 107 may only include one or more fixing projections.
- the module 107 may only comprise one or more support projections.
- At least one contact face 306 is directly in contact with a lower face of the card 208.
- a filling material is interposed between this contact face 306 and the card 208, so that the card 208 bears against the contact face 306 through the filling material.
- This filling material is advantageously thermally conductive in order to allow heat circulation from the card 208 to block 214 to cool card 208 and/or electronic components (not shown) carried by the latter.
- the filling material has a thermal conductivity of between 1 and 5 W nr 1 K 1 .
- each projection 218, 220 is made from material of the block 214.
- the block 214 and the projection(s) 218, 220 are formed in a single piece. This can be achieved in particular by providing a mold with a main molding cavity corresponding to the block 214 and at least one secondary molding cavity corresponding respectively to the projection(s).
- Each projection 218, 220 is thus, for example, made of epoxy resin like block 214.
- a step 502 the assembly of the chips 201, the substrate 202, the conductors 204a-c and the pins 210 is obtained.
- the assembly obtained is overmolded using a mold comprising a main molding cavity corresponding to the block 214 and shapes corresponding to the projections 218, 220 in communication with the main cavity.
- a single part is obtained by molding, this part comprising the block 214 and the projections 218, 220.
- the technique of transfer molding or compression molding is used.
- Step 504 thus provides one of the modules 107. Steps 502, 504 are repeated to obtain the other modules 107.
- the modules 107 are attached against the support 212 and fixed to the latter.
- a machine tool lowers the card 208 in the direction of the upper faces 216a of the modules 107.
- the pins 210 are inserted into corresponding openings 406 of the card. 208 (visible in Figure 4).
- the pins 210 are for example press-fit, so that their connection ends 210' have a larger diameter than the opening 406. Thus, these connection ends 210' are compressed radially during their insertion, which requires a significant insertion force of the machine tool.
- the card 208 comes into contact with the projections 218, 220, which, on the one hand, makes it possible to control the vertical distance between the card 208 and the modules 107 by preventing the machine -tool does not lower the card 208 too much. On the other hand, this contact causes an increase in a reaction to the movement of the card 208, which can be used as a signal to stop the movement.
- the machine tool detects the increase in the reaction to the displacement, which indicates that a downward movement for the installation of the card 208 is at the end of its travel. .
- the machine tool stops the displacement of the card 208 during a step 514. It is thus possible to prevent too great a force from being exerted during the installation of the card 208.
- the machine tool used for the installation of the card 208 advantageously comprises in this sense stops intended to come in vis-à-vis the support projection(s) 220, on the other side of map 208.
- this module 601 is similar to module 107 of the previous figures, if it includes at least one projection, designated by the reference 602, which is a different part from block 214.
- the projection(s) 602 replace the fixing projections 218, keeping their support and fixing functions.
- this variant could apply equally well to the 220 support projections.
- the projection 602 is preferably fixed on one of the conductors 204a-c of the module 107. It is located, in the example described, on a flat part 702 of the conductor 204c. Of course, projection 602 could be attached to one of the other conductors 204a, 204b.
- the projection 602 extends from an upper face 704 of the flat part 702, opposite a lower face 706 located vis-à-vis the substrate 12.
- the projection 602 is positioned here close to an edge 708 of the substrate 202 and/or of one of the connection ends 204'ac of the conductor 204a-c.
- the conductor 204a-c advantageously has a slot 802 through which the projection 602 is fixed by a fixing element 804, in particular by riveting or hot riveting.
- a lower face of the projection 602 is thus retained bearing against the upper face 704 of flat part 702 of conductor 204c, fixing element 804 resting against opposite lower face 706 passing through slot 802. Any other mode of fixing is of course possible.
- the projection 602 can be produced by a first overmolding of the conductor 204c, either directly in its form illustrated in the figures or else followed by the riveting or riveting of the fastening element 804 to bring it into its illustrated form. .
- the production of the block 214 then takes place, for example, after this first overmolding and, where appropriate, the riveting or riveting operation.
- the block 214 coats a base 806 of the projection 602.
- the base 806 is overmolded by the block 214.
- the block 214 coats the projection 602 over a few tenths of a millimeter in height, for example between 0 2 and 1.5 mm, from the upper face 704 of the flat part 702 of the conductor 204c.
- the projection 602 has sloped side walls, which allows the block 214 to cover them vertically and thus improve the fixing of the projection 602.
- An advantage of using two separate parts for the projection 602 and the block 214 is to avoid the propagation of cracks between the projection 602 and the block 214.
- the projection 602 can be made of the same material as the block 214, in particular epoxy resin.
- the projections 218, 220, 602 could have different shapes, other than frustoconical or truncated pyramidal. They could also have different heights.
- each chip may include a type of component other than a semiconductor switch, for example: a passive electronic component such as an electrical resistor and/or a capacitive component, and/or a semiconductor chip making it possible to carry out one or more logical functions in order to allow the electronic power module to shape electrical power signals.
- a passive electronic component such as an electrical resistor and/or a capacitive component
- a semiconductor chip making it possible to carry out one or more logical functions in order to allow the electronic power module to shape electrical power signals.
- the projections 218, 220, 602 can be designed to cooperate with any component other than an electronic card such as the card 208, in particular a module fixing frame.
- any component other than an electronic card such as the card 208, in particular a module fixing frame.
- any component (the card 208 or any other component) is positioned at a distance from the face 216a of the block 214, this without having to use additional parts.
- the system could be used in an air compressor.
- the rotating electrical machine 104 could be provided to drive an air compression element, in particular with a view to generating a flow of supercharging air from an engine.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Credit Cards Or The Like (AREA)
- Inverter Devices (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR2007367A FR3112424B1 (en) | 2020-07-10 | 2020-07-10 | Power electronic module, electrical system comprising such a module, corresponding manufacturing processes |
PCT/EP2021/067106 WO2022008244A1 (en) | 2020-07-10 | 2021-06-23 | Electronic power module, electrical system comprising such a module, corresponding manufacturing methods |
Publications (1)
Publication Number | Publication Date |
---|---|
EP4179569A1 true EP4179569A1 (en) | 2023-05-17 |
Family
ID=73013589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP21734841.6A Pending EP4179569A1 (en) | 2020-07-10 | 2021-06-23 | Electronic power module, electrical system comprising such a module, corresponding manufacturing methods |
Country Status (6)
Country | Link |
---|---|
US (1) | US20230274994A1 (en) |
EP (1) | EP4179569A1 (en) |
JP (1) | JP2023533389A (en) |
CN (1) | CN116802778A (en) |
FR (1) | FR3112424B1 (en) |
WO (1) | WO2022008244A1 (en) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001085613A (en) * | 1999-09-13 | 2001-03-30 | Hitachi Ltd | Transfer mold power module |
JP4583122B2 (en) * | 2004-09-28 | 2010-11-17 | 三菱電機株式会社 | Semiconductor device and manufacturing method thereof |
US9082766B2 (en) * | 2013-08-06 | 2015-07-14 | Google Technology Holdings LLC | Method to enhance reliability of through mold via TMVA part on part POP devices |
-
2020
- 2020-07-10 FR FR2007367A patent/FR3112424B1/en active Active
-
2021
- 2021-06-23 US US18/005,021 patent/US20230274994A1/en active Pending
- 2021-06-23 CN CN202180054222.XA patent/CN116802778A/en active Pending
- 2021-06-23 EP EP21734841.6A patent/EP4179569A1/en active Pending
- 2021-06-23 JP JP2023524982A patent/JP2023533389A/en active Pending
- 2021-06-23 WO PCT/EP2021/067106 patent/WO2022008244A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2023533389A (en) | 2023-08-02 |
FR3112424A1 (en) | 2022-01-14 |
FR3112424B1 (en) | 2023-05-12 |
WO2022008244A1 (en) | 2022-01-13 |
CN116802778A (en) | 2023-09-22 |
US20230274994A1 (en) | 2023-08-31 |
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Owner name: POUILLY, AURELIEN Owner name: VALEO ELECTRIFICATION |