EP4036261A4 - Pure copper plate - Google Patents

Pure copper plate Download PDF

Info

Publication number: EP4036261A4
Authority: EP; European Patent Office
Prior art keywords: copper plate; pure copper; pure; plate; copper
Prior art date: 2019-09-27
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP20870402.3A

Other languages

German (de)

French (fr)

Other versions

EP4036261A1 (en

Inventor

Hiroyuki Mori

Hirotaka Matsunaga

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Mitsubishi Materials Corp

Original Assignee

Mitsubishi Materials Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2019-09-27

Filing date

2020-09-11

Publication date

2023-09-20

2020-09-11 Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp

2022-08-03 Publication of EP4036261A1 publication Critical patent/EP4036261A1/en

2023-09-20 Publication of EP4036261A4 publication Critical patent/EP4036261A4/en

Status Withdrawn legal-status Critical Current

Classifications

- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/46—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for sheet metals
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C22C1/03—Making non-ferrous alloys by melting using master alloys
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Crystallography & Structural Chemistry (AREA)
Conductive Materials (AREA)

EP20870402.3A 2019-09-27 2020-09-11 Pure copper plate Withdrawn EP4036261A4 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2019176835		2019-09-27
PCT/JP2020/034462 WO2021060023A1 (en)	2019-09-27	2020-09-11	Pure copper plate

Publications (2)

Publication Number	Publication Date
EP4036261A1 EP4036261A1 (en)	2022-08-03
EP4036261A4 true EP4036261A4 (en)	2023-09-20

Family

ID=75166681

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP20870402.3A Withdrawn EP4036261A4 (en)	2019-09-27	2020-09-11	Pure copper plate

Country Status (7)

Country	Link
US (1)	US20220403484A1 (en)
EP (1)	EP4036261A4 (en)
JP (1)	JP6973680B2 (en)
KR (1)	KR20220068985A (en)
CN (1)	CN114269957B (en)
TW (1)	TW202115264A (en)
WO (1)	WO2021060023A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR20220149679A (en) *	2020-03-06	2022-11-08	미쓰비시 마테리알 가부시키가이샤	Pure copper plate, copper/ceramic bonded body, insulated circuit board
TW202138574A (en)	2020-03-06	2021-10-16	日商三菱綜合材料股份有限公司	Pure copper plate, copper/ceramic bonded body, and insulated circuit board
TW202314741A (en) *	2021-07-02	2023-04-01	日商三菱綜合材料股份有限公司	Copper strip for edgewise bending, and electronic/electrical device component and busbar
JP7215627B2 (en) *	2021-07-02	2023-01-31	三菱マテリアル株式会社	Copper strips for edgewise bending, parts for electronic and electrical equipment, bus bars
JP7215626B2 (en) *	2021-07-02	2023-01-31	三菱マテリアル株式会社	Copper strips for edgewise bending, parts for electronic and electrical equipment, bus bars
JP7243903B2 (en) *	2021-07-02	2023-03-22	三菱マテリアル株式会社	Copper strips for edgewise bending, parts for electronic and electrical equipment, bus bars
JP7243904B2 (en) *	2021-07-02	2023-03-22	三菱マテリアル株式会社	Copper strips for edgewise bending, parts for electronic and electrical equipment, bus bars
TW202308768A (en) *	2021-07-02	2023-03-01	日商三菱綜合材料股份有限公司	Copper strip for edgewise bending, and electronic/electrical device component and busbar
WO2023277197A1 (en) *	2021-07-02	2023-01-05	三菱マテリアル株式会社	Copper strip for edgewise bending, and electronic/electrical device component and busbar
TW202319552A (en) *	2021-07-02	2023-05-16	日商三菱綜合材料股份有限公司	Copper strip for edgewise bending, and electronic/electrical device component and busbar
WO2024024909A1 (en) *	2022-07-29	2024-02-01	三菱マテリアル株式会社	Pure copper material, insulating substrate, and electronic device
JP7473066B2 (en)	2022-07-29	2024-04-23	三菱マテリアル株式会社	Pure copper materials, insulating substrates, electronic devices

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5143208B2 (en) *	2010-10-25	2013-02-13	Ｊｘ日鉱日石金属株式会社	Rolled copper foil, and negative electrode current collector, negative electrode plate and secondary battery using the same
KR20140037962A (en) *	2011-08-23	2014-03-27	제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤	Rolled copper foil
JP2015048521A (en) *	2013-09-03	2015-03-16	Jx日鉱日石金属株式会社	Copper alloy sheet excellent in conductivity and bending deflection coefficient

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH062058A (en)	1992-06-23	1994-01-11	Furukawa Electric Co Ltd:The	Crystal grain growth suppressing oxygen free copper
JP5499933B2 (en) *	2010-01-12	2014-05-21	三菱マテリアル株式会社	Phosphorous copper anode for electrolytic copper plating, method for producing the same, and electrolytic copper plating method
JP4869415B2 (en) *	2010-02-09	2012-02-08	三菱伸銅株式会社	Pure copper plate manufacturing method and pure copper plate
CN103732768B (en) *	2011-08-05	2016-08-17	古河电气工业株式会社	Secondary cell collector rolled copper foil and manufacture method thereof
JP5826160B2 (en) *	2012-04-10	2015-12-02	Jx日鉱日石金属株式会社	Rolled copper foil, copper-clad laminate, flexible printed wiring board and manufacturing method thereof
JP5752736B2 (en) *	2013-04-08	2015-07-22	三菱マテリアル株式会社	Sputtering target
JP6851963B2 (en) *	2015-04-01	2021-03-31	古河電気工業株式会社	Manufacturing method of flat rolled copper foil, flexible flat cable, rotary connector and flat rolled copper foil
JP2019176835A (en)	2018-03-30	2019-10-17	三井化学株式会社	Method for producing amide compound

2020
- 2020-09-11 EP EP20870402.3A patent/EP4036261A4/en not_active Withdrawn
- 2020-09-11 JP JP2021507700A patent/JP6973680B2/en active Active
- 2020-09-11 US US17/762,267 patent/US20220403484A1/en active Pending
- 2020-09-11 WO PCT/JP2020/034462 patent/WO2021060023A1/en active Application Filing
- 2020-09-11 KR KR1020227005974A patent/KR20220068985A/en unknown
- 2020-09-11 CN CN202080059341.XA patent/CN114269957B/en active Active
- 2020-09-24 TW TW109133046A patent/TW202115264A/en unknown

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5143208B2 (en) *	2010-10-25	2013-02-13	Ｊｘ日鉱日石金属株式会社	Rolled copper foil, and negative electrode current collector, negative electrode plate and secondary battery using the same
KR20140037962A (en) *	2011-08-23	2014-03-27	제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤	Rolled copper foil
JP2015048521A (en) *	2013-09-03	2015-03-16	Jx日鉱日石金属株式会社	Copper alloy sheet excellent in conductivity and bending deflection coefficient

Also Published As

Publication number	Publication date
JPWO2021060023A1 (en)	2021-11-04
EP4036261A1 (en)	2022-08-03
JP6973680B2 (en)	2021-12-01
TW202115264A (en)	2021-04-16
US20220403484A1 (en)	2022-12-22
WO2021060023A1 (en)	2021-04-01
CN114269957A (en)	2022-04-01
CN114269957B (en)	2022-07-29
KR20220068985A (en)	2022-05-26

Publication	Publication Date	Title
EP3896179A4 (en)	2022-10-19	Pure copper plate
EP4036261A4 (en)	2023-09-20	Pure copper plate
EP4116451A4 (en)	2024-03-27	Pure copper plate
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EP3780059A4 (en)	2021-10-06	Circuit breaker
EP3967787A4 (en)	2022-08-31	Mask plate
EP3916436A4 (en)	2022-11-02	Diffusion plate
EP4055566A4 (en)	2022-12-21	Rendering back plates
EP3783634A4 (en)	2021-05-19	Dc circuit breaker
EP3979292A4 (en)	2022-10-19	Direct-current circuit breaker
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EP4050123A4 (en)	2024-05-08	Composite copper member
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EP4013558A4 (en)	2023-12-20	Reformer assembly
EP3963280A4 (en)	2023-01-11	Plate carrier
EP4000063A4 (en)	2023-08-02	Speech-tracking listening device
EP4060712A4 (en)	2023-03-15	Circuit breaker
EP4054037A4 (en)	2022-12-14	Dc circuit breaker
EP4068326A4 (en)	2023-08-16	Direct-current circuit breaker

Legal Events

Date	Code	Title	Description
2021-04-03	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE
2022-07-01	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2022-07-01	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE
2022-08-03	17P	Request for examination filed	Effective date: 20220323
2022-08-03	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2023-01-04	DAV	Request for validation of the european patent (deleted)
2023-01-04	DAX	Request for extension of the european patent (deleted)
2023-09-20	A4	Supplementary search report drawn up and despatched	Effective date: 20230822
2023-09-20	RIC1	Information provided on ipc code assigned before grant	Ipc: C22C 1/02 20060101ALI20230816BHEP Ipc: C22C 1/03 20060101ALI20230816BHEP Ipc: C22F 1/08 20060101ALI20230816BHEP Ipc: C22C 9/00 20060101AFI20230816BHEP
2024-07-19	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN
2024-08-21	18D	Application deemed to be withdrawn	Effective date: 20240319