EP3994200B1 - Peek-peoek copolymer powder and method of preparing the powder - Google Patents
Peek-peoek copolymer powder and method of preparing the powder Download PDFInfo
- Publication number
- EP3994200B1 EP3994200B1 EP20730670.5A EP20730670A EP3994200B1 EP 3994200 B1 EP3994200 B1 EP 3994200B1 EP 20730670 A EP20730670 A EP 20730670A EP 3994200 B1 EP3994200 B1 EP 3994200B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- powder
- peek
- peoek
- copolymer
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000843 powder Substances 0.000 title claims description 171
- 229920001577 copolymer Polymers 0.000 title claims description 115
- 238000000034 method Methods 0.000 title claims description 48
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 48
- 238000002844 melting Methods 0.000 claims description 26
- 230000008018 melting Effects 0.000 claims description 26
- 239000003795 chemical substances by application Substances 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 20
- 238000000227 grinding Methods 0.000 claims description 13
- 239000000654 additive Substances 0.000 claims description 11
- 230000004927 fusion Effects 0.000 claims description 11
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 claims description 10
- 230000000996 additive effect Effects 0.000 claims description 9
- 238000000748 compression moulding Methods 0.000 claims description 9
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 8
- 238000005245 sintering Methods 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 229910052698 phosphorus Inorganic materials 0.000 claims description 6
- 239000011574 phosphorus Substances 0.000 claims description 6
- -1 alkaline earth metal sulfonate Chemical class 0.000 claims description 5
- 239000003063 flame retardant Substances 0.000 claims description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- 239000003513 alkali Substances 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 4
- 150000002367 halogens Chemical class 0.000 claims description 4
- 239000006057 Non-nutritive feed additive Substances 0.000 claims description 3
- 239000006096 absorbing agent Substances 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- 239000000975 dye Substances 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 3
- 239000012760 heat stabilizer Substances 0.000 claims description 3
- 239000004611 light stabiliser Substances 0.000 claims description 3
- 239000000314 lubricant Substances 0.000 claims description 3
- 239000000049 pigment Substances 0.000 claims description 3
- 125000001453 quaternary ammonium group Chemical group 0.000 claims description 3
- 125000003342 alkenyl group Chemical group 0.000 claims description 2
- 125000005600 alkyl phosphonate group Chemical group 0.000 claims description 2
- 150000008052 alkyl sulfonates Chemical class 0.000 claims description 2
- 125000000304 alkynyl group Chemical group 0.000 claims description 2
- 150000001408 amides Chemical class 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 150000003949 imides Chemical class 0.000 claims description 2
- 150000003568 thioethers Chemical class 0.000 claims description 2
- 239000004696 Poly ether ether ketone Substances 0.000 claims 9
- 230000001747 exhibiting effect Effects 0.000 claims 1
- 229920000642 polymer Polymers 0.000 description 44
- 239000011541 reaction mixture Substances 0.000 description 33
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 32
- 239000000463 material Substances 0.000 description 27
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 26
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 26
- 239000002904 solvent Substances 0.000 description 24
- 239000007787 solid Substances 0.000 description 21
- 239000000243 solution Substances 0.000 description 20
- LSQARZALBDFYQZ-UHFFFAOYSA-N 4,4'-difluorobenzophenone Chemical compound C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 LSQARZALBDFYQZ-UHFFFAOYSA-N 0.000 description 19
- 239000000203 mixture Substances 0.000 description 19
- 238000000110 selective laser sintering Methods 0.000 description 19
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 18
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 18
- 239000002245 particle Substances 0.000 description 18
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 18
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 17
- 229920001652 poly(etherketoneketone) Polymers 0.000 description 16
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- 238000007639 printing Methods 0.000 description 15
- 229910052757 nitrogen Inorganic materials 0.000 description 13
- 238000012545 processing Methods 0.000 description 13
- 229910000029 sodium carbonate Inorganic materials 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 11
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- 239000002253 acid Substances 0.000 description 10
- 238000007873 sieving Methods 0.000 description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 9
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 9
- 238000002835 absorbance Methods 0.000 description 8
- 230000032683 aging Effects 0.000 description 8
- 239000012062 aqueous buffer Substances 0.000 description 8
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- 150000001875 compounds Chemical class 0.000 description 8
- 229910000027 potassium carbonate Inorganic materials 0.000 description 8
- 238000010926 purge Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 229910000397 disodium phosphate Inorganic materials 0.000 description 7
- 238000009826 distribution Methods 0.000 description 7
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- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- 239000000155 melt Substances 0.000 description 6
- 239000007790 solid phase Substances 0.000 description 6
- 239000002585 base Substances 0.000 description 5
- 239000011575 calcium Substances 0.000 description 5
- 239000003153 chemical reaction reagent Substances 0.000 description 5
- 238000006482 condensation reaction Methods 0.000 description 5
- 230000009477 glass transition Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000012254 powdered material Substances 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- ZSBDGXGICLIJGD-UHFFFAOYSA-N 4-phenoxyphenol Chemical compound C1=CC(O)=CC=C1OC1=CC=CC=C1 ZSBDGXGICLIJGD-UHFFFAOYSA-N 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 238000000149 argon plasma sintering Methods 0.000 description 4
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical compound C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 description 4
- 229910052791 calcium Inorganic materials 0.000 description 4
- 235000011089 carbon dioxide Nutrition 0.000 description 4
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 229920006260 polyaryletherketone Polymers 0.000 description 4
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- 238000004064 recycling Methods 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 235000017550 sodium carbonate Nutrition 0.000 description 4
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 238000010146 3D printing Methods 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical group C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
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- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 3
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- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 3
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- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- ADUODNZKKNUWBZ-UHFFFAOYSA-N [4-(4-hydroxybenzoyl)phenyl]-(4-hydroxyphenyl)methanone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(C(=O)C=2C=CC(O)=CC=2)C=C1 ADUODNZKKNUWBZ-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical compound C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- FJDQFPXHSGXQBY-UHFFFAOYSA-L caesium carbonate Chemical compound [Cs+].[Cs+].[O-]C([O-])=O FJDQFPXHSGXQBY-UHFFFAOYSA-L 0.000 description 2
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
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- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 description 2
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- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 2
- BWQOPMJTQPWHOZ-UHFFFAOYSA-N (2,3-difluorophenyl)-phenylmethanone Chemical compound FC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1F BWQOPMJTQPWHOZ-UHFFFAOYSA-N 0.000 description 1
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- NCIYZALOQBXNLW-UHFFFAOYSA-N (3-fluorophenyl)-phenylmethanone Chemical compound FC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1 NCIYZALOQBXNLW-UHFFFAOYSA-N 0.000 description 1
- OGTSHGYHILFRHD-UHFFFAOYSA-N (4-fluorophenyl)-phenylmethanone Chemical compound C1=CC(F)=CC=C1C(=O)C1=CC=CC=C1 OGTSHGYHILFRHD-UHFFFAOYSA-N 0.000 description 1
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 description 1
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- PISLKPDKKIDMQT-UHFFFAOYSA-N [3-(4-fluorobenzoyl)phenyl]-(4-fluorophenyl)methanone Chemical compound C1=CC(F)=CC=C1C(=O)C1=CC=CC(C(=O)C=2C=CC(F)=CC=2)=C1 PISLKPDKKIDMQT-UHFFFAOYSA-N 0.000 description 1
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- 125000005842 heteroatom Chemical group 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 235000011167 hydrochloric acid Nutrition 0.000 description 1
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- UXYRZJKIQKRJCF-TZPFWLJSSA-N mesterolone Chemical compound C1C[C@@H]2[C@@]3(C)[C@@H](C)CC(=O)C[C@@H]3CC[C@H]2[C@@H]2CC[C@H](O)[C@]21C UXYRZJKIQKRJCF-TZPFWLJSSA-N 0.000 description 1
- PYLWMHQQBFSUBP-UHFFFAOYSA-N monofluorobenzene Chemical compound FC1=CC=CC=C1 PYLWMHQQBFSUBP-UHFFFAOYSA-N 0.000 description 1
- 150000004682 monohydrates Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910000028 potassium bicarbonate Inorganic materials 0.000 description 1
- 239000011736 potassium bicarbonate Substances 0.000 description 1
- 235000015497 potassium bicarbonate Nutrition 0.000 description 1
- 235000011181 potassium carbonates Nutrition 0.000 description 1
- 235000003270 potassium fluoride Nutrition 0.000 description 1
- 239000011698 potassium fluoride Substances 0.000 description 1
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 1
- 229910000160 potassium phosphate Inorganic materials 0.000 description 1
- 235000011009 potassium phosphates Nutrition 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000007581 slurry coating method Methods 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000013024 sodium fluoride Nutrition 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 230000010512 thermal transition Effects 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000001238 wet grinding Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/46—Post-polymerisation treatment, e.g. recovery, purification, drying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
- C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
- C08G65/4012—Other compound (II) containing a ketone group, e.g. X-Ar-C(=O)-Ar-X for polyetherketones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/12—Powdering or granulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/141—Processes of additive manufacturing using only solid materials
- B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2071/00—Use of polyethers, e.g. PEEK, i.e. polyether-etherketone or PEK, i.e. polyetherketone or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
- C08J2371/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08J2371/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
Definitions
- the present invention generally relates to a powder comprising a PEEK-PEoEK copolymer.
- the present invention also relates to a method of preparing the powder, as well as to the uses of the powder for coating, compression molding and to prepare a three-dimensional (3D) object.
- the copolymer described herein is generally such that it has R PEEK and R PEoEK repeat units in a molar ratio R PEEK /R PEoEK ranging from 95/5 to 5/95.
- Additive manufacturing systems are used to print or otherwise build 3D objects from a digital blueprint created with computer-aided design (CAD) modelling software.
- Selective laser sintering uses electromagnetic radiation from a laser to fuse powdered materials into a mass. The laser selectively fuses the powdered material by scanning cross-sections generated from the digital blueprint of the object on the surface of a powder bed. After a cross-section is scanned, the powder bed is lowered by one layer thickness, a new layer of material is applied, and the bed is rescanned. Locally full coalescence of polymer particles in the top powder layer is necessary as well as an adhesion with previous sintered layers. This process is repeated until the object is completed.
- the powdered material is generally preheated to a processing temperature close to the melting point (Tm) of the resin.
- Tm melting point
- Tc crystallization temperature
- the processing temperature must therefore be precisely adjusted between the melting temperature (Tm) and the crystallization temperature (Tc) of the semi crystalline polymer, also called the "sintering window".
- the preheating of the powder makes it easier for the laser to raise the temperature of the selected regions of layer of unfused powder to the melting point.
- the laser causes fusion of the powder only in locations specified by the input. Laser energy exposure is typically selected based on the polymer in use and to avoid polymer degradation.
- the non-fused powder is removed from the 3D object and can be recycled and reused in a subsequent SLS process.
- Producing an article by laser sintering can take a long time, more than 16 hours for certain articles or parts. This means that the powder material is submitted to high temperatures in the powder bed of the SLS printer for an extended period of time (called thermal aging). This can irreversibly affect the polymer material, in such a way that it is not recyclable anymore. Not only the chemical nature of the polymer is changed due to thermal aging, but also its mechanical properties of the polymer material such as its toughness.
- Poly(aryl ether ketone) polymers such as poly(ether ether ketone) polymer (PEEK) are known for their high temperature performance and excellent chemical resistance. Their uses to prepare 3D obkects/articles/parts have been described in the literature. For some semi-crystalline polymers, such as poly(ether ether ketone) (PEEK), the processing temperature is too high, causing degradation and/or crosslinking, which negatively affect SLS processability and recycling. The potential of the SLS process is therefore limited by the restricted number of materials optimised for the process.
- the high temperature needed to process PEEK is also a limiting factor in certain areas such as wire coatings and mobile electronics.
- the high temperature can irreversibly degrade the metal surface to be coated. This is especially true for copper.
- PEEK adhesion to metal is poor or insufficient for use in areas in which the polymer is in contact with metal.
- PEEK-PEDEK copolymers including PEDEK units of formula: -Ph-Ph-O-Ph-C(O)-Ph-, with -Ph- being a 1,4-phenylene unit, and comprising more than 65% PEEK units of formula -Ph'-O-Ph'-C(O)-Ph'-O-, with -Ph'- being a 1,4-phenylene group, exhibit lower melting temperatures but their mechanical properties are not as good as PEEK.
- WO2015/124903 Victrex
- Victrex generally describe the use of such copolymers to prepare shaped articles using a powder-based additive manufacturing system (for example SLS).
- PEEK-PEoEK copolymers comprising PEEK units and PEoEK units of formula -O- ortho Ph-O-Ph-C(O)-Ph- (with -ortho Ph - being a 1,2-phenylene unit; and -Ph- being a 1,4-phenylene unit) have been described in the art.
- JP1221426 describes notably copolymers of PEEK and PEoEK in its examples 5 and 6, manufactured from hydroquinone, catechol and difluorobenzophenone, as allegedly possessing increased glass transition temperature, and simultaneously excellent heat resistance.
- WO 2019122143 describes a PEEK-PEmEK copolymer.
- EP 2738219 and CN 108384193 do not describe a PEEK-PEoEK copolymer.
- PEEK-PEoEK copolymers with a PEEK/PEoEK units ratio in the range from 95/5 to 5/95, preferably from 95/5 to 65/35 exhibit a good thermal stability while retaining good mechanical properties.
- the low melting temperature of these copolymers further allows processing at lower temperature than PEEK, which positively affects the recyclability of the powdered material, notably in the context of Additive Manufacturing.
- the present invention relates to a powder comprising a PEEK-PEoEK copolymer, wherein the copolymer has R PEEK and R PEoEK repeat units in a molar ratio R PEEK /R PEoEK ranging from 95/5 to 5/95, preferably from 95/5 to 65/35. Also described are methods of making the PEEK-PEoEK copolymer, methods of obtaining the powder comprising a PEEK-PEoEK copolymer, as well as uses of the powder for coating, compression molding and to prepare a 3D object.
- a "PEEK-PEoEK copolymer” comprises at least 50 mol. %, collectively, of repeat units (R PEEK ) and repeat units (R PEoEK ), relative to the total number of moles of repeat units in the PEEK-PEoEK copolymer.
- the PEEK-PEoEK copolymer comprises at least 60 mol. %, at least 70 mol. %, at least 80 mol. %, at least 90 mol. %, at least 95 mol. %, and most preferably at least 99 mol. % of repeat units (R PEEK ) and (R PEoEK ), relative to the total number of moles of repeat units in the PEEK-PEoEK copolymer.
- Repeat unit (R PEEK ) is represented by formula: and repeat unit (R PEoEK ) is represented by formula: each R 1 and R 2 , equal to or different from each other, is independently at each occurrence selected from the group consisting of halogen, alkyl, alkenyl, alkynyl, aryl, ether, thioether, carboxylic acid, ester, amide, imide, alkali or alkaline earth metal sulfonate, alkyl sulfonate, alkali or alkaline earth metal phosphonate, alkyl phosphonate, amine and quaternary ammonium,
- each a is zero, such that the repeat units (R PEEK ) are repeat units of formula:
- each b is zero, such that the repeat units (R PEoEK ) are repeat units of formula:
- repeat units (R PEEK ) are repeat units of formula (A-1), and repeat units (R PEoEK ) are repeat units of formula (B-1).
- the PEEK-PEoEK copolymer of the present invention may additionally comprise repeat units (R PAEK ) different from repeat units (R PEEK ) and (R PEoEK ), as above detailed.
- the amount of repeat units (R PAEK ) can be comprised between 0.1 and less than 50 mol. %, preferably less than 10 mol. %, more preferably less than 5 mol. %, most preferably less than 2 mol. %, with respect to the total number of moles of repeat units of PEEK-PEoEK copolymer.
- repeat units (R PAEK ) different from repeat units (R PEEK ) and (R PEoEK ) are present in the PEEK-PEoEK copolymer of the present invention
- these repeat units (R PAEK ) different from units units (R PEEK ) and (R PEoEK ), as described above generally comply with any of the following formulae (K-A) to (K-M) herein below: wherein in each of formulae (K-A) to (K-M) above, each of R', equal to or different from each other, is independently selected at each occurrence from a C 1 -C 12 group optionally comprising one or more than one heteroatoms; sulfonic acid and sulfonate groups; phosphonic acid and phosphonate groups; amine and quaternary ammonium groups; and each of j', equal to or different from each other, is independently selected at each occurrence from 0 and an integer of 1 to 4, preferably j' being equal to zero.
- the PEEK-PEoEK copolymer of the present invention is essentially composed of repeat units (R PEEK ) and (R PEoEK ), as above detailed.
- the PEEK-PEoEK copolymer consists essentially of repeat units R PEEK and R PEoEK .
- the expression "consists essentially of repeat units R PEEK and R PEoEK” means that any additional repeat unit different from repeat units R PEEK and R PEoEK , as above detailed, may be present in the PEEK-PEoEK copolymer in amount of at most 2 mol.
- Repeat units R PEEK and R PEoEK are present in the PEEK-PEoEK copolymer in a R PEEK /R PEoEK molar ratio ranging from 95/5 to 5/95.
- the PEEK-PEoEK copolymers suitable for the powder of the invention are those comprising a majority of R PEEK units, that-is-to-say copolymers in which the R PEEK /R PEoEK molar ratio ranges from 95/5 to more than 50/50, even more preferably from 95/5 to 60/40, still more preferably from 90/10 to 65/35, most preferably 85/15 to 70/30.
- the PEEK-PEoEK copolymer has a melting temperature (Tm) of less than or equal to 340°C, preferably less than or equal to 335°C.
- Tm melting temperature
- the melting temperatures described herein are measured as the peak temperature of the melting endotherm on the second heat scan in a differential scanning calorimeter (DSC) according to ASTM D3418-03 and E794-06, and using heating and cooling rates of 20°C/min.
- the PEEK-PEoEK copolymer has a glass transition temperature (Tg) of at least 135°C and at most 155°C, preferably at least 140°C, as determined on the 2 nd heat scan according to ASTM D3418-03, E1356-03, E793-06, E794-06.
- Tg glass transition temperature
- the PEEK-PEoEK copolymer has as heat of fusion ( ⁇ H) of at least 1 J/g, preferably at least 2 J/g, at least 5 J/g.
- the heats of fusion described herein are determined as the area under the melting endotherm on the second heat scan in a differential scanning calorimeter (DSC) according to ASTM D3418-03 and E793-06, with heating and cooling rates of 20°C/min.
- the PEEK-PEoEK copolymer may have a heat of fusion ( ⁇ H) of at most 65 J/g, preferably at most 60 J/g.
- the PEEK-PEoEK copolymer possesses a microstructure such that its FT-IR spectrum, when recorded between 600 and 1,000 cm -1 in ATR mode on polymer powder, is such that the following inequalities are satisfied: A 700 cm ⁇ 1 A 704 cm ⁇ 1 ⁇ 0.99 , wherein A 700 cm -1 is the absorbance at 700 cm -1 and A 704 cm -1 is the absorbance at 704 cm -1 ; A 816 cm ⁇ 1 A 835 cm ⁇ 1 ⁇ 0.61 , wherein A 816 cm -1 is the of absorbance at 816 cm -1 and A 835 cm -1 is the absorbance at 835 cm -1 ; A 623 cm ⁇ 1 A 557 cm ⁇ 1 ⁇ 1.60 , wherein A 623 cm -1 is the of absorbance at 623 cm -1 and A 557 cm -1 is the absorbance at 557 cm -1 ; A 928 cm ⁇ 1 A 924 cm ⁇ 1 ⁇ 1.09 , where
- the PEEK-PEoEK copolymer may be such that it has a calcium content of less than 5 ppm, as measured by Inductively Coupled Plasma Optical Emission Spectrometry (ICP-OES) calibrated with standards of known calcium content.
- ICP-OES Inductively Coupled Plasma Optical Emission Spectrometry
- the PEEK-PEoEK copolymer may have a calcium content of less than 4 ppm, less than 3 ppm or even more preferably less than 2.5 ppm.
- the PEEK-PEoEK copolymer may also be such that it has a sodium content of less than 1,000 ppm, as measured by Inductively Coupled Plasma Optical Emission Spectrometry (ICP-OES) calibrated with standards of known sodium content.
- ICP-OES Inductively Coupled Plasma Optical Emission Spectrometry
- the PEEK-PEoEK copolymer may have a sodium content of less than 900 ppm, less than 800 ppm or even more preferably less than 500 ppm.
- the PEEK-PEoEK copolymer may be such that it has a phosphorus content of at least 6 ppm, as measured by Inductively Coupled Plasma Optical Emission Spectrometry (ICP-OES) calibrated with standards of known phosphorus content.
- ICP-OES Inductively Coupled Plasma Optical Emission Spectrometry
- the PEEK-PEoEK copolymer has a phosphorous content of at least 10 ppm, at least 15 ppm or even more preferably at least 20 ppm.
- PEEK-PEoEK copolymers having increased thermal stability may be particularly beneficial in certain fields of use, for example to prepare a 3D object by additive manufacturing.
- the PEEK-PEoEK copolymers may notably have peak degradation temperatures of at least 550°C, as measured TGA according to ASTM D3850, more preferably at least 551°C and even more preferably at least 552°C.
- PEEK-PEoEK copolymers are generally known in the art.
- the PEEK-PEoEK copolymer used in the polymer-metal junction of the invention is made by a method which comprises reacting at least one difluoro-compound of formula (C) :
- a step of terminating the (poly)condensation reaction by reaction with a suitable agent may be included; agents which may be used for terminating the polycondensation reaction include compounds which terminate chain growth by being incorporated in the polymer backbone via a condensation reaction (also referred to as end-capping agents) and compounds which terminate chain growth without being incorporated in the polymer backbone through a condensation reaction (also referred to as terminating agents).
- End-capping agents used in the method of making the PEEK-PEoEK copolymer notably include those represented by formula (F) below : wherein
- R 7 is -C(O)-Ar-R 10 , Ar-R 10 or H, with R 10 being F, Cl or H. According to certain preferred embodiments, R 10 is F.
- R 6 is F or OH. More preferably, R 6 is F.
- R 6 and R 7 may be 1,2- or ortho-substitution on the phenylene cycle of formula (F) or they may be 1,3- or meta-substitution on the phenylene cycle. Alternatively, R 6 and R 7 may preferably be 1,4- or para-substitution on the phenylene cycle of formula (F).
- the end-capping agent is selected from the group consisting of 4,4'-difluorobenzophenone, phenol, 4-phenoxyphenol, 4-phenylphenol, 4-fluorobenzophenone, 3-fluorobenzophenone, 2-fluorobenzophenone, 4,4'-dichlorodiphenylsulfone, 4,4'difluorodiphenylsulfone and a mixture thereof.
- Difluoro-compounds and monofunctional phenols are preferably used as end-capping agents.
- the end-capping agent is an excess of a difluoro-compound monomer.
- the end-capping agent used in the method of the present invention is preferably 4,4'-difluorobenzophenone, phenol, 4-phenoxyphenol, 4-phenylphenol or a mixture thereof.
- Lithium chloride is one example of a terminating agent, which will terminate the reaction without being incorporated in the polymer backbone through condensation.
- the reaction is terminated with at least one end-capping agent and with at least one terminating agent other than an end-capping agent.
- at least one end-capping agent and with at least one terminating agent other than an end-capping agent are respectively used as end-capping agent and terminating agent in the method of the present invention.
- the (poly)condensation reaction is carried out with a slight excess of difluoro-compound of formula (C); it is further understood that, when used, the end-capping agent may be added to the reaction mixture at the inception of the polycondensation; as a whole, hence, the molar ratio [(C)+(F)]/[(D)+(E)] is ⁇ 1.000, preferably ⁇ 1.003, more preferably ⁇ 1.006, even more preferably ⁇ 1.010.
- the compound of formula (C) is 4,4'-difluorobenzophenone (DFBP).
- the compound of formula (D) is hydroquinone.
- the compound of formula (E) is catechol (which may be also referred to as pyrocatechol or 1,2-dihydroxybenzene).
- the compound of formula (C) is 4,4'-difluorobenzophenone (DFBP)
- the compound of formula (D) is hydroquinone
- the compound of formula (E) is catechol.
- the PEEK-PEoEK copolymer of the invention may be made in a solvent comprising diphenysulfone.
- the solvent comprises at least 50 wt.% of diphenylsulfone, based on the total weight of solvent in the reaction mixture, for example at least 60 wt.%, at least 70 wt.%, at least 80 wt.%, at least 90 wt.%, at least 95 wt.% or at least 98 wt.%, based on the total weight of solvent in the reaction mixture.
- the solvent consists essentially in diphenylsulfone.
- a solvent comprising limited amounts of impurities as detailed in U.S. Patent No. 9,133,111 is generally used.
- the PEEK-PEoEK copolymer of the invention may be made by a method using a base, for example selected from the group consisting of potassium carbonate (K 2 CO 3 ), potassium bicarbonate, sodium carbonate (Na 2 CO 3 ), cesium carbonate (Cs 2 CO 3 ), potassium phosphate and sodium bicarbonate.
- the base acts to deprotonate the components (D) and (E) during the condensation reaction.
- the condensation is preferably carried out in the presence potassium carbonate (K 2 CO 3 ), sodium carbonate (Na 2 CO 3 ) or a mixture of both, most preferably a mixture of both.
- the reaction mixture is generally polycondensed, within the temperature range, until the requisite degree of condensation is reached.
- the polycondensation time can be from 0.1 to 10 hours, preferably from 0.2 to 4 or from 0.5 to 3 hours, depending on the nature of the starting monomers and on the selected reaction conditions.
- the solvent and the inorganic constituents for example sodium fluoride or potassium fluoride or excess of base, can be removed by suitable methods such as dissolving and filtering, screening or extracting. This is preferably achieved through steps (a) to (d) and (e) to (g) or (e') to (g'), as below detailed, this peculiar steps sequence being material for achieving the particularly preferred microstructure/end group chemistry and purity, as particularly beneficial for certain fields of use.
- the PEEK-PEoEK copolymer is advantageously recovered by successively:
- the said phase may be first exposed to at least one of comminution, pulverizing, and triturating, so as to be provided under the form of small particles.
- the solid phase is ground under the form of a powder.
- the solid phase comprising the PEEK-PEoEK copolymer may be contacted with a solvent having a normal boiling point of less than 100°C;
- the said solvent having a normal boiling point i.e. a boiling point under normal pressure of 1 atm or 10 5 Pa
- the said solvent having a normal boiling point is generally selected among polar organic solvents, in particular solvents possessing at least one carbonyl group and/or at least one hydroxyl group.
- Low boiling point ketones and alcohols are exemplary embodiment's thereof; preferred solvents used in step (b) are those selected from the group consisting of acetone, methyl ethyl ketone, ethanol, methanol, isopropanol, which may be used singly or in admixture.
- step (c) use may be made of demineralized water: methods for providing demineralized water are well-known and their choice is not critical to the extent demineralized water is used possessing an overall Na and Ca concentration of less than 20 ppm, preferably less than 10 ppm, more preferably less than 5 ppm.
- the solid residue (1) may be contacted with an aqueous solution of a protic acid having a pKa of at most 6, preferably at most 4, most preferably at most 3: the choice of the said protic acid is not particular critical, provided it complies with the mentioned pKa requirements.
- Hydrochloric acid, oxalic acid, phosphoric acid, acetic acid, formic acid, and mixtures thereof may be used as suitable protic acids in this step.
- the protic acid is at least one of hydrochloric acid, oxalic acid or phosphoric acid. It is nonetheless understood that HCl is a preferred acid to be used in this step.
- Steps (e) or step (f) may be carried out by contacting with a solvent having a normal boiling point of less than 100°C; features described above in connection with solvent used in step (b) are equally applicable for the selection of solvent used in steps (e) or (f). Further, while different solvents may be used in step (b) and steps (e) or (f), it may be convenient to make use of same solvent in both steps, i.e. in steps (b) and (e) or (b) and (f).
- step (f) or in step (e') the relevant solid residue may be contacted with an aqueous solution of a protic acid having a pKa of at most 6, preferably at most 4, most preferably at most 3: the choice of the said protic acid is not particular critical, provided it complies with the mentioned pKa requirements. It is nonetheless understood that HCl is a preferred acid to be used in this step.
- Steps (f) and (e') may require the use of an aqueous buffer solution, having a pH comprised between 6.0 and 7.0; while organic buffering agents may be used, it is generally preferred to make use of a phosphate-based buffering system.
- the PEEK-PEoEK copolymer is preferably performed with an aqueous buffer solution of at least one of sodium dihydrogen phosphate (NaH 2 PO 4 ) and disodium hydrogen phosphate (Na 2 HPO 4 ).
- the PEEK-PEoEK copolymer is contacted with a solution including both NaH 2 PO 4 and Na 2 HPO 4 .
- the phosphate salts used of the solutions used hereby can for example be anhydrous, monohydrate, dihydrate or heptahydrate.
- the concentration of the NaH 2 PO 4 in the aqueous buffer solution is not particularly limited, but should be sufficient in order for the copolymer to preferably present a phosphorus content of more than 20 ppm.
- the amount of NaH 2 PO 4 in the solution is preferably chosen to match the preferred minimal 20 ppm amount of phosphorus atoms attached to the copolymer.
- the concentration of NaH 2 PO 4 in the solution is preferably at least 0.002 wt.%, more preferably at least 0.004 wt.%, most preferably at least 0.006 wt.%, most preferably at least 0.01 wt.%.
- the concentration of NaH 2 PO 4 in the solution is preferably at most 0.30 wt.%, more preferably at most 0.20 wt.%, most preferably at most 0.10 wt.%, most preferably at most 0.05 wt.%.
- the concentration of Na 2 HPO 4 in the solution is preferably at least 0.002 wt.%, more preferably at least 0.004 wt.%, most preferably at least 0.006 wt.%, most preferably at least 0.02 wt.%.
- the concentration of Na 2 HPO 4 in the solution is preferably at most 0.30 wt.%, more preferably at most 0.20 wt.%, most preferably at most 0.10 wt.%, most preferably at most 0. 05 wt.%.
- the PEEK-PEoEK copolymer is advantageously submitted to washing with the said aqueous buffering solution, in particular the dihydrogen phosphate (NaH 2 PO 4 ) and disodium hydrogen phosphate (Na 2 HPO 4 ) solution.
- the copolymer with a solution including at least one of sodium dihydrogen phosphate (NaH 2 PO 4 ) and disodium hydrogen phosphate (Na 2 HPO 4 ) may involve substantially fixing phosphate groups on the copolymer.
- Substantially fixing means that the PEEK-PEoEK polymer preferably retains a phosphorus content of more than 20 ppm, as determined by Inductively Coupled Plasma Optical Emission Spectrometry (ICP-OES), for example more than 30 ppm, more than 40 ppm, more than 50 ppm or more than 60 ppm.
- ICP-OES Inductively Coupled Plasma Optical Emission Spectrometry
- the copolymer is contacted with the aqueous buffer solution for a time ranging from 5 minutes to 5 hours, preferably from 10 minutes to 3 hours.
- Methods of washing polymers are well known to those of skill in the art, and include, for example, slurrying the polymer with the solution including the acid or base, as defined below, and then filtering off the solution.
- Step (g) or (g') comprise drying the solid residue (4)/(4'), for obtaining the PEEK-PEoEK copolymer.
- drying is generally carried out at a temperature of at least 95°C, for example at least 100°C, for at least one hour, for example at least 2 hours, at least 5 hours, at least 10 hours or 12 hours.
- the powder of the present invention comprises at least one PEEK-PEoEK copolymer as described above.
- the powder of the present invention may consist essentially in one or several PEEK-PEoEK copolymers or may comprise further components, for example a flow aid/agent (F), as described below.
- F flow aid/agent
- the powder of the invention comprises additional components, they can be added or blended with the PEEK-PEoEK copolymer of the present invention before, during or after the step of grinding.
- the powder has a d 98 -value less than 300 ⁇ m, as measured by laser scattering in isopropanol. According to a preferred embodiment, the powder has a d 98 -value less than 280 ⁇ m, as measured by laser scattering in isopropanol, preferably less than 260 ⁇ m or less than 250 ⁇ m.
- the powder has a d 9 o-value less than 150 ⁇ m, as measured by laser scattering in isopropanol. According to an embodiment, the powder has a d 9 o-value less than 120 ⁇ m, as measured by laser scattering in isopropanol, preferably less than 110 ⁇ m or less 100 ⁇ m.
- the powder has a d 10 -value higher than 0.1 ⁇ m, as measured by laser scattering in isopropanol. According to a preferred embodiment, the powder has a d 10 -value higher than 0.2 ⁇ m, as measured by laser scattering in isopropanol, preferably higher than 0.5 ⁇ m or higher than 1 ⁇ m.
- the powder has a d 50 -value comprised between 40 ⁇ m and 70 ⁇ m, as measured by laser scattering in isopropanol, preferably between 40 ⁇ m and 60 ⁇ m, or between 43 ⁇ m and 58 ⁇ m or between 45 ⁇ m and 55 ⁇ m.
- a powder with such particle size distribution is for example well-suited for compression molding and selective laser sintering (SLS).
- the powder has a d 50 -value comprised between 20 ⁇ m and 35 ⁇ m, as measured by laser scattering in isopropanol, preferably between 21 ⁇ m and 34 ⁇ m, or between 22 ⁇ m and 33 ⁇ m or between 23 ⁇ m and 32 ⁇ m.
- the powder has preferably a d 9 o-value less than 80 ⁇ m, more preferably less than 70 ⁇ m.
- the powder has preferably a d 98 -value less than 150 ⁇ m, more preferably less than 110 ⁇ m.
- a powder with such particle size distribution is for example well-suited for powder coating, notably electrostatic powder coating.
- the powder has a d 50 -value comprised between 5 ⁇ m and 20 ⁇ m, as measured by laser scattering in isopropanol, preferably between 6 ⁇ m and 19 ⁇ m.
- the powder has preferably a d 90 -value less than 40 ⁇ m, more preferably less than 30 ⁇ m.
- the powder has preferably a d 98 -value less than 100 ⁇ m, more preferably less than 70 ⁇ m.
- a powder with such particle size distribution is for example well-suited for slurry coating.
- the powder has a d 99 -value less than 195 ⁇ m, as measured by laser scattering in isopropanol. According to a preferred embodiment, the powder has a d 99 -value less than 190 ⁇ m, as measured by laser scattering in isopropanol, preferably less than 180 ⁇ m or less than 170 ⁇ m.
- the powder of the present invention may have a BET surface area ranging from 0 to 30 m 2 /g, preferably from 0 to 20 m 2 /g, more preferably from 0 to 15 m 2 /g, as measured by ISO 9277, using a soak /evacuation temperature of at most 25° C.
- the powder of the present invention may have a bulk density ⁇ B (or poured bulk density) of at least 0.25, preferably at least 0.35, most preferably at least 0.40.
- An object of the present invention relates to a method of obtaining a powder, comprising grinding the PEEK-PEoEK copolymer at a temperature comprised between -25°C and 150°C inclusive, preferably between 20°C and 80°C inclusive.
- the powder may preferably has a d 9 o-value of less than 150 ⁇ m (as measured by laser scattering in isopropanol), and/or a d 50 -value less than 70 ⁇ m.
- the grinding mills used to grind the PEEK-PEoEK copolymer can be of any type, for example disk mills, jet mills, notably fluidized jet mill, impact mills, wet-grinding mills, pin mills or a combination of these equipment.
- a classifier may also be used.
- the PEEK-PEoEK material to be ground may be passed back through the same mill or through other serially arranged mills, possibly using a sieve or an air classifying mill, until the desired material fineness is achieved.
- the coarse PEEK-PEoEK powder, alone or in mixture with additional components may therefore, for example, be passed in a single mill and a series of successive passes of the materials there through is used. Alternatively when a series of mills is used, a single pass through each mill may be employed.
- the grinding process of the present invention may be continuous or semi-continuous.
- the PEEK-PEoEK copolymer to be ground or milled is in the form of a so-called "coarse powder", for example a powder having a d 9 o-value between 500 ⁇ m and 4,000 ⁇ m, preferably between 600 ⁇ m and 2,000 ⁇ m, and/or a d 50 -value between 200 ⁇ m and 2,000 ⁇ m, preferably between 300 ⁇ m and 1,000 ⁇ m.
- Such a coarse powder can be obtained by a polycondensation reaction and an additional step of extracting the solvent and salts after polycondensation, as well as optional post-treatment step(s) (such as tempering or heat treatment) of the polymer obtained from the polycondensation/extraction.
- the coarse powder is ground to produce the powder of the present invention, having preferably a d 90 -value of less than 150 ⁇ m (as measured by laser scattering in isopropanol), and/or a d 50 -value less than 70 ⁇ m.
- the PEEK-PEoEK powder can be treated at a temperature above its Tg for a period of at least 30 minutes, preferably at a temperature of at least 170°C for at least 5 hours.
- the powder particles of the powder preferably have a spherical form or an approximately spherical form. This means that the powder particles of the powder preferably have an aspect ratio of less than 2.0. Such aspect ratio of the powder particles is more preferably of less than 1.5, and most preferably of less than 1.48.
- the additional component may be a flow agent (F).
- This flow agent (F) may for example be hydrophilic.
- hydrophilic flow aids are inorganic pigments notably selected from the group consisting of silicas, aluminas and titanium oxide. Mention can be made of fumed silica. Fumed silicas are commercially available under the trade name Aerosil ® (Evonik) and Cab-O-Sil ® (Cabot). Fumed aluminas are commercially available under the trade name SpectraAl ® (Cabot).
- the powder of the present invention comprises at least 50 wt.% of the PEEK-PEoEK copolymer, for example at least 60 wt.% of the PEEK-PEoEK copolymer, at least 70 wt.%, at least 80 wt.%, at least 90 wt.%, at least 95 wt.%, at least 98 wt.% or at least 99 wt.% of the PEEK-PEoEK copolymer described herein, based on the total weight of the powder.
- the powder comprises from 0.01 to 10 wt.% of a flow agent (F), for example from 0.05 to 8 wt.%, from 0.1 to 6 wt.% or from 0.15 to 5 wt.% of at least one flow agent (F), for example of at least fumed silica or fumed alumina, based on the total weight of the powder.
- a flow agent for example from 0.05 to 8 wt.%, from 0.1 to 6 wt.% or from 0.15 to 5 wt.% of at least one flow agent (F), for example of at least fumed silica or fumed alumina, based on the total weight of the powder.
- silicas or aluminas are composed of nanometric primary particles (typically between 5 and 50 nm for fumed silicas or aluminas). These primary particles are combined to form aggregates. In use as flow agent, silicas or aluminas are found in various forms (elementary particles and aggregates).
- the powder of the present invention may further comprise at least another polymeric material, that-is-to-say at least one polymer or copolymer, distinct from the PEEK-PEoEK copolymer of the present invention.
- This additional polymeric material may for example be selected from the group consisting of poly(aryl ether sulfone) (PAES) polymers, for example a poly(biphenyl ether sulfone) (PPSU) polymer and/or a polysulfone (PSU) polymer, a poly(aryl ether ketone) (PAEK) polymers, for example a poly(ether ether ketone) (PEEK) polymer.
- PAES poly(aryl ether sulfone)
- PPSU poly(biphenyl ether sulfone)
- PSU polysulfone
- PAEK poly(aryl ether ketone)
- the powder of the present invention may also comprise one or several additives (A), such as lubricants, heat stabilizers, light stabilizers, antioxidants, pigments, processing aids, dyes, fillers, nanofillers or electromagnetic absorbers.
- additives such as lubricants, heat stabilizers, light stabilizers, antioxidants, pigments, processing aids, dyes, fillers, nanofillers or electromagnetic absorbers.
- additives such as titanium dioxide, zinc oxide, cerium oxide, silica or zinc sulphide, glass fibers, carbon fibers.
- the powder of the present invention may also comprise flame retardants, such as halogen and halogen free flame retardants.
- the powder of the present invention comprises:
- the present invention also relates to a process for manufacturing a 3D object, comprising depositing successive layers of the powder of the present invention and selectively sintering each layer prior to deposition of the subsequent layer, for example by means of an electromagnetic radiation of the powder.
- SLS 3D printers are, for example, available from EOS Corporation under the trade name EOSINT ® P.
- MJF 3D printers are, for example, available from Hewlett-Packard Company under the trade name Jet Fusion.
- the powder may also be used to produce continuous fiber composites in a CBAM process, for example as developed by Impossible Objects.
- the process for manufacturing a 3D object usually takes place in a printer.
- the printer may comprise a sintering chamber and a powder bed, both maintained at a specific temperature.
- the step of sintering comprises selective sintering by means of a high power energy source, for example a high power laser source such as an electromagnetic beam source.
- a high power energy source for example a high power laser source such as an electromagnetic beam source.
- the powder to be printed can be pre-heated to a processing temperature (Tp), above the glass transition (Tg) temperature of the powder (e.g. polymer).
- Tp processing temperature
- the processing temperature of the printer is the temperature at which is heated the material (M) prior to the sintering, for example in the powder bed of a SLS printer.
- M material
- the preheating of the powder makes it easier for the laser to raise the temperature of the selected regions of layer of unfused powder to the melting point.
- the laser causes fusion of the powder only in locations specified by the input. Laser energy exposure is typically selected based on the polymer in use and to avoid polymer degradation.
- the process for manufacturing a 3D object of the present invention employs a powder comprising at least one PEEK-PEoEK copolymer.
- the powder may comprise recycled powder, that-is-to say a material which has already been exposed to the processing temperature of a 3D printer.
- the powder comprises at least 10 wt.% of recycled powder, based on the total weight of the powder, at least 20 wt.%, at least 30 wt.%, at least 40 wt.%, at least 50 wt.%, at least 60 wt.%, at least 70 wt.%, at least 80 wt.%, at least 90 wt.%, at least 95 wt.% or at least 98 wt.%.
- the powdered polymer material (M) comprises a ratio of recycled powder/unrecycled powder ranging from 50/50 to 100/0, preferably 55/45 to 100/1, more preferably 60/40 to 100/1.
- the powder described herein, comprising the PEEK-PEoEK copolymer of the present invention is not significantly affected by the long-term exposure to the processing temperature.
- the combination of the material and the choice of a specific processing temperature (Tp), based on the material composition, makes possible the recycling of the unsintered material and its reuse in the manufacture of a new 3D object.
- the powder is not significantly affected by the long-term exposure to the processing temperature and presents a set of characteristics (namely powder aspect and color, disaggregation and coalescence abilities) which is comparable to a new, unprocessed polymer material. This makes the used powder completely suitable for reuse in a laser sintering 3D printing process, without impacting the appearance and mechanical performances of the resulting printed article (notably the expected performance of the polymer materials).
- the process for manufacturing a 3D object of the present invention additionally comprises steps a1) to a4) below:
- the 3D object/article/part may be built on substrate, for example a horizontal substrate and/or on a planar substrate.
- the substrate may be moveable in all directions, for example in the horizontal or vertical direction.
- the substrate can, for example, be lowered, in order for the successive layer of unsintered polymeric material to be sintered on top of the former layer of sintered polymeric material.
- the process further comprises a step consisting in producing a support structure.
- the 3D object/article/part is built upon the support structure and both the support structure and the 3D object/article/part are produced using the same AM method.
- the support structure may be useful in multiple situations.
- the support structure may be useful in providing sufficient support to the printed or under-printing, 3D object/article/part, in order to avoid distortion of the shape 3D object/article/part, especially when this 3D object/article/part is not planar. This is particularly true when the temperature used to maintain the printed or under-printing, 3D object/article/part is below the re-solidification temperature of the powder.
- the powder is not significantly affected by the long-term exposure to the processing temperature and presents a set of characteristics which is comparable to a new, unprocessed polymer material.
- the present invention also relates to a 3D object/article/part, obtainable by laser sintering from the powder of the present invention.
- the present invention also relates to a 3D object/article/part, comprising the powder of the present invention.
- the present invention also relates to the use of the powder of the present invention for the manufacture of a 3D object using additive manufacturing, preferably SLS, CBAM or JMF.
- the present invention also relates to the use of a PEEK-PEoEK copolymer, for the manufacture of a powder for additive manufacturing, preferably SLS, CBAM or JMF.
- the 3D objects/articles/parts obtainable by such method of manufacture can be used in a variety of final applications. Mention can be made in particular of medical devices, brackets and complex shaped parts in the aerospace industry and under-the-hood parts in the automotive industry (e.g. thermostat housing, water pump impeller, engine covers, pump casing).
- Tm melting temperature
- Tg glass transition temperature
- ⁇ H heat of fusion
- the melting temperature Tm was determined as the peak temperature of the melting endotherm on the 2 nd heat scan in differential scanning calorimeter (DSC) according to ASTM D3418-03, E1356-03, E793-06, E794-06. In some cases (always noted), the melting point is recorded on the 1 st heat scan using the same method, to characterize powders melting behavior. Details of the procedure as used in this invention are as follows: a TA Instruments DSC Q20 was used with nitrogen as carrier gas (99.998% purity, 50 mL/min).
- the melting of the composition was taken as the area over a linear baseline drawn from 220°C to a temperature above the last endotherm .
- the glass transition temperature Tg (mid-point) was determined on the 2 nd heat scan according to ASTM D3418-03, E1356-03, E793-06, E794-06.
- the crystallization temperature Tc was determined as the peak temperature of the crystallization exotherm on the 1 st cool scan.
- the melt flow index was determined according to ASTM D1238 at 340°C with a 3.8 kg weight.
- the final MFI for a 8.4 kg weight was obtained by multiplying the value obtained by 2.35.
- a 762 mm x 762 mm x 3.2 mm plaque was prepared from the polymer by compression molding of 30 g of polymer under the following conditions:
- the plaques were then annealed at 200°C for 3 hours.
- the 762 mm x 762 mm x 3.2 mm compression molded plaques were machined into Type V ASTM tensile specimens and these specimens of the various polymer compositions were subjected to tensile testing according to ASTM method D638 at 1.27 mm/ minute (or 0.05 inch/minute) room temperature (i.e. 23°C) on 3 specimens. The average of the 3 specimens is presented.
- Printed Type I ASTM tensile specimens were subjected to tensile testing according to ASTM method D638 at 5.08 mm/minute (or 0.2 inch/minute) room temperature (i.e. 23°C) on 5 specimens. The average of the 5 specimens is presented.
- the PSD volume distribution
- the solvent was isopropanol with a refractive index of 1.38 and the particles were assumed to have a refractive index of 1.59.
- the ultrasonic mode was enabled (25 W/60 seconds) and the flow was set at 55%.
- the reaction mixture was heated slowly to 270°C. At 270°C, 13.725 g of Na 2 CO 3 and 0.086 g of K 2 CO 3 was added via a powder dispenser to the reaction mixture over 60 minutes. At the end of the addition, the reaction mixture was heated to 320°C at 1°C/minute. After 2 minutes at 320°C, 1.207 g of 1,4-DFDK were added to the reaction mixture while keeping a nitrogen purge on the reactor. After 5 minutes, 0.529 g of lithium chloride were added to the reaction mixture. 10 minutes later, another 0.503 g of 1,4-DFDK were added to the reactor and the reaction mixture was kept at temperature for 15 minutes.
- the reaction mixture was heated slowly to 150°C. At 150°C, a mixture of 26.744 g of Na 2 CO 3 and 0.168 g of K 2 CO 3 was added via a powder dispenser to the reaction mixture over 30 minutes. At the end of the addition, the reaction mixture was heated to 320°C at 1°C/minute. After 16 minutes at 320°C, 3.713 g of 4,4'-difluorobenzophenone were added to the reaction mixture while keeping a nitrogen purge on the reactor. After 5 minutes, 1.031 g of lithium chloride were added to the reaction mixture. 10 minutes later, another 2.122 g of 4,4'-difluorobenzophenone were added to the reactor and the reaction mixture was kept at temperature for 15 minutes.
- the reactor content was then poured from the reactor into a SS pan and cooled.
- the solid was broken up and ground in an attrition mill through a 2 mm screen.
- Diphenyl sulfone and salts were extracted from the mixture with acetone and water at pH between 1 and 12.
- the powder was then removed from the reactor and dried at 120°C under vacuum for 12 hours yielding 74 g of a white powder.
- the repeat unit of the polymer is:
- the melt viscosity measured by capillary rheology at 410°C, 46 s -1 was 0.28 kN-s/m 2 .
- the reaction mixture was heated slowly to 150°C. At 150°C, a mixture of 55.482 g of Na 2 CO 3 and 0.174 g of K 2 CO 3 was added via a powder dispenser to the reaction mixture over 30 minutes. At the end of the addition, the reaction mixture was heated to 300°C at 1°C/minute. After 36 minutes at 300°C, 13.169 g of 4,4'-difluorobenzophenone were added to the reaction mixture while keeping a nitrogen purge on the reactor. After 5 minutes, 2.132 g of lithium chloride were added to the reaction mixture. 10 minutes later, another 4.390 g of 4,4'-difluorobenzophenone were added to the reactor and the reaction mixture was kept at temperature for 15 minutes.
- the reactor content was then poured from the reactor into a SS pan and cooled.
- the solid was broken up and ground in an attrition mill through a 2 mm screen.
- Diphenyl sulfone and salts were extracted from the mixture with acetone and water at pH between 1 and 12.
- the powder was then removed from the reactor and dried at 100°C under vacuum for 12 hours yielding 165 g of a light brown powder.
- the repeat unit of the polymer is:
- the reaction mixture was heated slowly to 150°C. At 150°C, a mixture of 76.938 g of Na 2 CO 3 and 0.484 g of K 2 CO 3 was added via a powder dispenser to the reaction mixture over 30 minutes. At the end of the addition, the reaction mixture was heated to 320°C at 1°C/minute. After 24 minutes at 320°C, the reaction was terminated in 3 stages: 18.329 g of 4,4'-difluorobenzophenone were added to the reaction mixture while keeping a nitrogen purge on the reactor. After 5 minutes, 2.388 g of lithium chloride were added to the reaction mixture. 10 minutes later, another 6.110 g of 4,4'-difluorobenzophenone were added to the reactor and the reaction mixture was kept at temperature for 15 minutes.
- the reactor content was then poured from the reactor into a SS pan and cooled.
- the solid was broken up and ground in an attrition mill through a 2 mm screen.
- Diphenyl sulfone and salts were extracted from the mixture by extracting successively with acetone and water at room temperature.
- the powder was then dried at 120°C under vacuum for 12 hours yielding 179 g of a white powder.
- the repeat unit of the polymer is:
- PEEK-PEoEK has improved mechanical properties over PEEK-PEDEK.
- the PEKK and PEEK-PEoEK polymer materials (as described in Table 7 below) were printed according to the disclosed printing conditions.
- the mechanical properties of the resultant tensile bars are disclosed in Table 7.
- Fresh powder of the polymer materials and the resultant unsintered loose powder in the powder bed after printing that was not sintered into objects were measured for melt flow.
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Description
- The present invention generally relates to a powder comprising a PEEK-PEoEK copolymer. The present invention also relates to a method of preparing the powder, as well as to the uses of the powder for coating, compression molding and to prepare a three-dimensional (3D) object. The copolymer described herein is generally such that it has RPEEK and RPEoEK repeat units in a molar ratio RPEEK/RPEoEK ranging from 95/5 to 5/95.
- Additive manufacturing systems are used to print or otherwise build 3D objects from a digital blueprint created with computer-aided design (CAD) modelling software. Selective laser sintering ("SLS"), one of the available additive manufacturing techniques, uses electromagnetic radiation from a laser to fuse powdered materials into a mass. The laser selectively fuses the powdered material by scanning cross-sections generated from the digital blueprint of the object on the surface of a powder bed. After a cross-section is scanned, the powder bed is lowered by one layer thickness, a new layer of material is applied, and the bed is rescanned. Locally full coalescence of polymer particles in the top powder layer is necessary as well as an adhesion with previous sintered layers. This process is repeated until the object is completed.
- In the powder bed of the SLS printer, the powdered material is generally preheated to a processing temperature close to the melting point (Tm) of the resin. For semi-crystalline polymers, crystallization (Tc) should be inhibited during printing as long as possible, at least for several sintered layers. The processing temperature must therefore be precisely adjusted between the melting temperature (Tm) and the crystallization temperature (Tc) of the semi crystalline polymer, also called the "sintering window". The preheating of the powder makes it easier for the laser to raise the temperature of the selected regions of layer of unfused powder to the melting point. The laser causes fusion of the powder only in locations specified by the input. Laser energy exposure is typically selected based on the polymer in use and to avoid polymer degradation.
- When the process is completed, the non-fused powder is removed from the 3D object and can be recycled and reused in a subsequent SLS process.
- Producing an article by laser sintering can take a long time, more than 16 hours for certain articles or parts. This means that the powder material is submitted to high temperatures in the powder bed of the SLS printer for an extended period of time (called thermal aging). This can irreversibly affect the polymer material, in such a way that it is not recyclable anymore. Not only the chemical nature of the polymer is changed due to thermal aging, but also its mechanical properties of the polymer material such as its toughness.
- Poly(aryl ether ketone) polymers (PAEK), such as poly(ether ether ketone) polymer (PEEK), are known for their high temperature performance and excellent chemical resistance. Their uses to prepare 3D obkects/articles/parts have been described in the literature. For some semi-crystalline polymers, such as poly(ether ether ketone) (PEEK), the processing temperature is too high, causing degradation and/or crosslinking, which negatively affect SLS processability and recycling. The potential of the SLS process is therefore limited by the restricted number of materials optimised for the process.
- The high temperature needed to process PEEK is also a limiting factor in certain areas such as wire coatings and mobile electronics. The high temperature can irreversibly degrade the metal surface to be coated. This is especially true for copper. Additionally, PEEK adhesion to metal is poor or insufficient for use in areas in which the polymer is in contact with metal.
- PEEK-PEDEK copolymers including PEDEK units of formula: -Ph-Ph-O-Ph-C(O)-Ph-, with -Ph- being a 1,4-phenylene unit, and comprising more than 65% PEEK units of formula -Ph'-O-Ph'-C(O)-Ph'-O-, with -Ph'- being a 1,4-phenylene group, exhibit lower melting temperatures but their mechanical properties are not as good as PEEK.
WO2015/124903 (Victrex ) generally describe the use of such copolymers to prepare shaped articles using a powder-based additive manufacturing system (for example SLS). - PEEK-PEoEK copolymers comprising PEEK units and PEoEK units of formula -O-orthoPh-O-Ph-C(O)-Ph- (with -orthoPh- being a 1,2-phenylene unit; and -Ph- being a 1,4-phenylene unit) have been described in the art. Notably
JP1221426 -
WO 2019122143 describes a PEEK-PEmEK copolymer.EP 2738219 andCN 108384193 do not describe a PEEK-PEoEK copolymer. - It has been now found that PEEK-PEoEK copolymers with a PEEK/PEoEK units ratio in the range from 95/5 to 5/95, preferably from 95/5 to 65/35 exhibit a good thermal stability while retaining good mechanical properties. The low melting temperature of these copolymers further allows processing at lower temperature than PEEK, which positively affects the recyclability of the powdered material, notably in the context of Additive Manufacturing.
- Specifically, the present invention relates to a powder comprising a PEEK-PEoEK copolymer, wherein the copolymer has RPEEK and RPEoEK repeat units in a molar ratio RPEEK/RPEoEK ranging from 95/5 to 5/95, preferably from 95/5 to 65/35. Also described are methods of making the PEEK-PEoEK copolymer, methods of obtaining the powder comprising a PEEK-PEoEK copolymer, as well as uses of the powder for coating, compression molding and to prepare a 3D object.
- As used herein, a "PEEK-PEoEK copolymer" comprises at least 50 mol. %, collectively, of repeat units (RPEEK) and repeat units (RPEoEK), relative to the total number of moles of repeat units in the PEEK-PEoEK copolymer. In some embodiments, the PEEK-PEoEK copolymer comprises at least 60 mol. %, at least 70 mol. %, at least 80 mol. %, at least 90 mol. %, at least 95 mol. %, and most preferably at least 99 mol. % of repeat units (RPEEK) and (RPEoEK), relative to the total number of moles of repeat units in the PEEK-PEoEK copolymer.
- Repeat unit (RPEEK) is represented by formula:
- each a and b is independently selected from the group consisting of integers ranging from 0 to 4, and
- the PEEK-PEoEK copolymer comprises the repeat units RPEEK and RPEoEK in a molar ratio RPEEK/RPEoEK ranging from 95/5 to 5/95.
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- Preferably, repeat units (RPEEK) are repeat units of formula (A-1), and repeat units (RPEoEK) are repeat units of formula (B-1).
- The PEEK-PEoEK copolymer of the present invention may additionally comprise repeat units (RPAEK) different from repeat units (RPEEK) and (RPEoEK), as above detailed. In such case, the amount of repeat units (RPAEK) can be comprised between 0.1 and less than 50 mol. %, preferably less than 10 mol. %, more preferably less than 5 mol. %, most preferably less than 2 mol. %, with respect to the total number of moles of repeat units of PEEK-PEoEK copolymer.
- When repeat units (RPAEK) different from repeat units (RPEEK) and (RPEoEK) are present in the PEEK-PEoEK copolymer of the present invention, these repeat units (RPAEK) different from units units (RPEEK) and (RPEoEK), as described above, generally comply with any of the following formulae (K-A) to (K-M) herein below:
- It is nevertheless generally preferred for the PEEK-PEoEK copolymer of the present invention to be essentially composed of repeat units (RPEEK) and (RPEoEK), as above detailed. Thus, in some preferred embodiments, the PEEK-PEoEK copolymer consists essentially of repeat units RPEEK and RPEoEK. As used herein, the expression "consists essentially of repeat units RPEEK and RPEoEK" means that any additional repeat unit different from repeat units RPEEK and RPEoEK, as above detailed, may be present in the PEEK-PEoEK copolymer in amount of at most 2 mol. %, at most 1 mol.% or at most 0.5 mol.%, relative to the total number of moles of repeat units in the PEEK-PEoEK copolymer, and so as not to substantially alter the advantageous properties of the PEEK-PEoEK copolymer.
- Repeat units RPEEK and RPEoEK are present in the PEEK-PEoEK copolymer in a RPEEK/RPEoEK molar ratio ranging from 95/5 to 5/95. Preferably, the PEEK-PEoEK copolymers suitable for the powder of the invention are those comprising a majority of RPEEK units, that-is-to-say copolymers in which the RPEEK/RPEoEK molar ratio ranges from 95/5 to more than 50/50, even more preferably from 95/5 to 60/40, still more preferably from 90/10 to 65/35, most preferably 85/15 to 70/30.
- In some embodiments, the PEEK-PEoEK copolymer has a melting temperature (Tm) of less than or equal to 340°C, preferably less than or equal to 335°C. The melting temperatures described herein are measured as the peak temperature of the melting endotherm on the second heat scan in a differential scanning calorimeter (DSC) according to ASTM D3418-03 and E794-06, and using heating and cooling rates of 20°C/min.
- In some embodiments, the PEEK-PEoEK copolymer has a glass transition temperature (Tg) of at least 135°C and at most 155°C, preferably at least 140°C, as determined on the 2nd heat scan according to ASTM D3418-03, E1356-03, E793-06, E794-06.
- In some embodiments, the PEEK-PEoEK copolymer has as heat of fusion (ΔH) of at least 1 J/g, preferably at least 2 J/g, at least 5 J/g. The heats of fusion described herein are determined as the area under the melting endotherm on the second heat scan in a differential scanning calorimeter (DSC) according to ASTM D3418-03 and E793-06, with heating and cooling rates of 20°C/min. In some aspects, the PEEK-PEoEK copolymer may have a heat of fusion (ΔH) of at most 65 J/g, preferably at most 60 J/g.
- According to certain embodiments, the PEEK-PEoEK copolymer possesses a microstructure such that its FT-IR spectrum, when recorded between 600 and 1,000 cm-1 in ATR mode on polymer powder, is such that the following inequalities are satisfied:
-1 is the absorbance at 700 cm-1 and A 704cm-1 is the absorbance at 704 cm-1;-1 is the of absorbance at 816 cm-1 and A 835cm-1 is the absorbance at 835 cm-1;-1 is the of absorbance at 623 cm-1 and A 557cm-1 is the absorbance at 557 cm-1;-1 is the of absorbance at 928 cm-1 and A 924cm-1 is the absorbance at 924 cm-1. - The PEEK-PEoEK copolymer may be such that it has a calcium content of less than 5 ppm, as measured by Inductively Coupled Plasma Optical Emission Spectrometry (ICP-OES) calibrated with standards of known calcium content. Such a particularly low and controlled Ca content is particularly beneficial when the said PEEK-PEoEK copolymer is to be used in metal junctions requiring very stringent dielectric performances. According to these preferred embodiments, the PEEK-PEoEK copolymer may have a calcium content of less than 4 ppm, less than 3 ppm or even more preferably less than 2.5 ppm.
- In these preferred embodiments, the PEEK-PEoEK copolymer may also be such that it has a sodium content of less than 1,000 ppm, as measured by Inductively Coupled Plasma Optical Emission Spectrometry (ICP-OES) calibrated with standards of known sodium content. Preferably, the PEEK-PEoEK copolymer may have a sodium content of less than 900 ppm, less than 800 ppm or even more preferably less than 500 ppm.
- In some embodiments, the PEEK-PEoEK copolymer may be such that it has a phosphorus content of at least 6 ppm, as measured by Inductively Coupled Plasma Optical Emission Spectrometry (ICP-OES) calibrated with standards of known phosphorus content. Preferably, the PEEK-PEoEK copolymer has a phosphorous content of at least 10 ppm, at least 15 ppm or even more preferably at least 20 ppm.
- In the powder of the present invention, it may be advantageous to select PEEK-PEoEK copolymers having increased thermal stability, which may be particularly beneficial in certain fields of use, for example to prepare a 3D object by additive manufacturing. The PEEK-PEoEK copolymers may notably have peak degradation temperatures of at least 550°C, as measured TGA according to ASTM D3850, more preferably at least 551°C and even more preferably at least 552°C.
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- with a mixture of di-hydroxy compounds of formulas (D) and (E) :
- in a molar ratio (D)/(E) ranging from 95/5 to 5/95, wherein R3, R4, and R5, have the meaning specified above, each c, d, and e is independently selected from the group consisting of integers ranging from 0 to 4, in a polar organic solvent in the presence of a base, such as, for example, Na2CO3, K2CO3, or a combination thereof. Preferably each of c, d, and e is zero.
- In said method, a step of terminating the (poly)condensation reaction by reaction with a suitable agent may be included; agents which may be used for terminating the polycondensation reaction include compounds which terminate chain growth by being incorporated in the polymer backbone via a condensation reaction (also referred to as end-capping agents) and compounds which terminate chain growth without being incorporated in the polymer backbone through a condensation reaction (also referred to as terminating agents).
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- R6 is F, Cl, or OH,
- R7 is -C(O)-Ar-R10, -O-Ar-R10, -SO2-Ar-R10, -Ar-R10, an alkyl (e.g. a C1-C10 alkyl or a C1-C5 alkyl) or -H, with Ar being an arylene group comprising at least one benzene ring (i.e. one benzene ring or several benzene rings), and with R10 being F, Cl or H.
- Preferably, R7 is -C(O)-Ar-R10, Ar-R10 or H, with R10 being F, Cl or H. According to certain preferred embodiments, R10 is F.
- Preferably, R6 is F or OH. More preferably, R6 is F.
- When R7 is different from -H, R6 and R7 may be 1,2- or ortho-substitution on the phenylene cycle of formula (F) or they may be 1,3- or meta-substitution on the phenylene cycle. Alternatively, R6 and R7 may preferably be 1,4- or para-substitution on the phenylene cycle of formula (F).
- In some embodiments, the end-capping agent is selected from the group consisting of 4,4'-difluorobenzophenone, phenol, 4-phenoxyphenol, 4-phenylphenol, 4-fluorobenzophenone, 3-fluorobenzophenone, 2-fluorobenzophenone, 4,4'-dichlorodiphenylsulfone, 4,4'difluorodiphenylsulfone and a mixture thereof.
- Difluoro-compounds and monofunctional phenols are preferably used as end-capping agents. In some embodiments, the end-capping agent is an excess of a difluoro-compound monomer. The end-capping agent used in the method of the present invention is preferably 4,4'-difluorobenzophenone, phenol, 4-phenoxyphenol, 4-phenylphenol or a mixture thereof.
- Lithium chloride is one example of a terminating agent, which will terminate the reaction without being incorporated in the polymer backbone through condensation.
- In some embodiments, the reaction is terminated with at least one end-capping agent and with at least one terminating agent other than an end-capping agent. Preferably, 4,4'-difluorobenzophenone and lithium chloride are respectively used as end-capping agent and terminating agent in the method of the present invention.
- In general, the (poly)condensation reaction is carried out with a slight excess of difluoro-compound of formula (C); it is further understood that, when used, the end-capping agent may be added to the reaction mixture at the inception of the polycondensation; as a whole, hence, the molar ratio [(C)+(F)]/[(D)+(E)] is ≥ 1.000, preferably ≥ 1.003, more preferably ≥ 1.006, even more preferably ≥ 1.010.
- Preferably, the compound of formula (C) is 4,4'-difluorobenzophenone (DFBP). Preferably, the compound of formula (D) is hydroquinone. Preferably, the compound of formula (E) is catechol (which may be also referred to as pyrocatechol or 1,2-dihydroxybenzene). In some embodiments, the compound of formula (C) is 4,4'-difluorobenzophenone (DFBP), the compound of formula (D) is hydroquinone, and the compound of formula (E) is catechol.
- The PEEK-PEoEK copolymer of the invention may be made in a solvent comprising diphenysulfone. In some embodiments, the solvent comprises at least 50 wt.% of diphenylsulfone, based on the total weight of solvent in the reaction mixture, for example at least 60 wt.%, at least 70 wt.%, at least 80 wt.%, at least 90 wt.%, at least 95 wt.% or at least 98 wt.%, based on the total weight of solvent in the reaction mixture. In some embodiments, the solvent consists essentially in diphenylsulfone. In the method of the present invention, a solvent comprising limited amounts of impurities, as detailed in
U.S. Patent No. 9,133,111 - The PEEK-PEoEK copolymer of the invention may be made by a method using a base, for example selected from the group consisting of potassium carbonate (K2CO3), potassium bicarbonate, sodium carbonate (Na2CO3), cesium carbonate (Cs2CO3), potassium phosphate and sodium bicarbonate. The base acts to deprotonate the components (D) and (E) during the condensation reaction. The condensation is preferably carried out in the presence potassium carbonate (K2CO3), sodium carbonate (Na2CO3) or a mixture of both, most preferably a mixture of both.
- In the method of making the PEEK-PEoEK copolymer, the reaction mixture is generally polycondensed, within the temperature range, until the requisite degree of condensation is reached. The polycondensation time can be from 0.1 to 10 hours, preferably from 0.2 to 4 or from 0.5 to 3 hours, depending on the nature of the starting monomers and on the selected reaction conditions.
- The solvent and the inorganic constituents, for example sodium fluoride or potassium fluoride or excess of base, can be removed by suitable methods such as dissolving and filtering, screening or extracting. This is preferably achieved through steps (a) to (d) and (e) to (g) or (e') to (g'), as below detailed, this peculiar steps sequence being material for achieving the particularly preferred microstructure/end group chemistry and purity, as particularly beneficial for certain fields of use.
- According to the preferred embodiments, the PEEK-PEoEK copolymer is advantageously recovered by successively:
- (a) isolating a solid phase comprising PEEK-PEoEK copolymer from the product mixture, by cooling the same at a temperature of below 120°C;
- (b) contacting the said solid phase comprising the PEEK-PEoEK copolymer with a solvent having a normal boiling point of less than 100°C at a temperature between 15 to 100°C and separating the residual solid from said solvent;
- (c) optionally, contacting the said solid phase comprising the PEEK-PEoEK copolymer with demineralized water at a temperature between 15 to 100°C, preferably between 15 to 40°C, and separating the residual solid (1) from said demineralized water;
- (d) contacting the said residual solid (1) comprising the PEEK-PEoEK copolymer with an aqueous solution of a protic acid having a pKa of at most 6, preferably at most 4, more preferably at most 3, at a temperature between 15 to 100°C, preferably between 15 to 40°C, and separating the residual solid (2) from said demineralized water; and
- (e) contacting the said residual solid (2) comprising the PEEK-PEoEK copolymer with a solvent having a normal boiling point of less than 100°C at a temperature between 15 to 100°C and separating the residual solid (3) from said solvent; and
- (f) contacting the said residual solid (3) comprising the PEEK-PEoEK copolymer with an aqueous buffer solution having a pH comprised between 6.0 and 7.0, at a temperature between 15 to 100°C, preferably between 15 to 40°C, and separating the residual solid (4) from said aqueous buffer solution; and
- (g) drying the so-obtained solid residue to obtain the PEEK-PEoEK copolymer;
or - (e') contacting the said residual solid (2) comprising the PEEK-PEoEK copolymer with an aqueous buffer solution having a pH comprised between 6.0 and 7.0, at a temperature between 15 to 100°C, preferably between 15 to 40°C, and separating the said residual solid (3') from said aqueous buffer solution; and
- (f) contacting the said residual solid (3') comprising the PEEK-PEoEK copolymer with a solvent having a normal boiling point of less than 100°C at a temperature between 15 to 100°C and separating the residual solid (4') from said solvent; and
- In particular, once a solid phase is isolated in step (a), the said phase may be first exposed to at least one of comminution, pulverizing, and triturating, so as to be provided under the form of small particles. Generally, the solid phase is ground under the form of a powder.
- In step (b), the solid phase comprising the PEEK-PEoEK copolymer may be contacted with a solvent having a normal boiling point of less than 100°C; the said solvent having a normal boiling point (i.e. a boiling point under normal pressure of 1 atm or 105 Pa) of less than 100°C is generally selected among polar organic solvents, in particular solvents possessing at least one carbonyl group and/or at least one hydroxyl group. Low boiling point ketones and alcohols are exemplary embodiment's thereof; preferred solvents used in step (b) are those selected from the group consisting of acetone, methyl ethyl ketone, ethanol, methanol, isopropanol, which may be used singly or in admixture.
- In step (c), use may be made of demineralized water: methods for providing demineralized water are well-known and their choice is not critical to the extent demineralized water is used possessing an overall Na and Ca concentration of less than 20 ppm, preferably less than 10 ppm, more preferably less than 5 ppm.
- In step (d), the solid residue (1) may be contacted with an aqueous solution of a protic acid having a pKa of at most 6, preferably at most 4, most preferably at most 3: the choice of the said protic acid is not particular critical, provided it complies with the mentioned pKa requirements. Hydrochloric acid, oxalic acid, phosphoric acid, acetic acid, formic acid, and mixtures thereof may be used as suitable protic acids in this step. Preferably the protic acid is at least one of hydrochloric acid, oxalic acid or phosphoric acid. It is nonetheless understood that HCl is a preferred acid to be used in this step.
- Steps (e) or step (f) may be carried out by contacting with a solvent having a normal boiling point of less than 100°C; features described above in connection with solvent used in step (b) are equally applicable for the selection of solvent used in steps (e) or (f). Further, while different solvents may be used in step (b) and steps (e) or (f), it may be convenient to make use of same solvent in both steps, i.e. in steps (b) and (e) or (b) and (f).
- In step (f) or in step (e'), the relevant solid residue may be contacted with an aqueous solution of a protic acid having a pKa of at most 6, preferably at most 4, most preferably at most 3: the choice of the said protic acid is not particular critical, provided it complies with the mentioned pKa requirements. It is nonetheless understood that HCl is a preferred acid to be used in this step.
- Steps (f) and (e') may require the use of an aqueous buffer solution, having a pH comprised between 6.0 and 7.0; while organic buffering agents may be used, it is generally preferred to make use of a phosphate-based buffering system. In the steps (f) and (e'), the PEEK-PEoEK copolymer, is preferably performed with an aqueous buffer solution of at least one of sodium dihydrogen phosphate (NaH2PO4) and disodium hydrogen phosphate (Na2HPO4). Preferably, the PEEK-PEoEK copolymer is contacted with a solution including both NaH2PO4 and Na2HPO4. The phosphate salts used of the solutions used hereby can for example be anhydrous, monohydrate, dihydrate or heptahydrate.
- The concentration of the NaH2PO4 in the aqueous buffer solution is not particularly limited, but should be sufficient in order for the copolymer to preferably present a phosphorus content of more than 20 ppm. The amount of NaH2PO4 in the solution is preferably chosen to match the preferred minimal 20 ppm amount of phosphorus atoms attached to the copolymer. The concentration of NaH2PO4 in the solution is preferably at least 0.002 wt.%, more preferably at least 0.004 wt.%, most preferably at least 0.006 wt.%, most preferably at least 0.01 wt.%. The concentration of NaH2PO4 in the solution is preferably at most 0.30 wt.%, more preferably at most 0.20 wt.%, most preferably at most 0.10 wt.%, most preferably at most 0.05 wt.%. The concentration of Na2HPO4 in the solution is preferably at least 0.002 wt.%, more preferably at least 0.004 wt.%, most preferably at least 0.006 wt.%, most preferably at least 0.02 wt.%. The concentration of Na2HPO4in the solution is preferably at most 0.30 wt.%, more preferably at most 0.20 wt.%, most preferably at most 0.10 wt.%, most preferably at most 0. 05 wt.%.
- In steps (f) and (e'), the PEEK-PEoEK copolymer is advantageously submitted to washing with the said aqueous buffering solution, in particular the dihydrogen phosphate (NaH2PO4) and disodium hydrogen phosphate (Na2HPO4) solution. As used herein, "washing" the copolymer with a solution including at least one of sodium dihydrogen phosphate (NaH2PO4) and disodium hydrogen phosphate (Na2HPO4) may involve substantially fixing phosphate groups on the copolymer. "Substantially fixing" means that the PEEK-PEoEK polymer preferably retains a phosphorus content of more than 20 ppm, as determined by Inductively Coupled Plasma Optical Emission Spectrometry (ICP-OES), for example more than 30 ppm, more than 40 ppm, more than 50 ppm or more than 60 ppm.
- In some embodiments, the copolymer is contacted with the aqueous buffer solution for a time ranging from 5 minutes to 5 hours, preferably from 10 minutes to 3 hours. Methods of washing polymers are well known to those of skill in the art, and include, for example, slurrying the polymer with the solution including the acid or base, as defined below, and then filtering off the solution.
- Step (g) or (g') comprise drying the solid residue (4)/(4'), for obtaining the PEEK-PEoEK copolymer. In this step, drying is generally carried out at a temperature of at least 95°C, for example at least 100°C, for at least one hour, for example at least 2 hours, at least 5 hours, at least 10 hours or 12 hours.
- The powder of the present invention comprises at least one PEEK-PEoEK copolymer as described above. The powder of the present invention may consist essentially in one or several PEEK-PEoEK copolymers or may comprise further components, for example a flow aid/agent (F), as described below. When the powder of the invention comprises additional components, they can be added or blended with the PEEK-PEoEK copolymer of the present invention before, during or after the step of grinding.
- In some embodiments of the present invention, the powder has a d98-value less than 300 µm, as measured by laser scattering in isopropanol. According to a preferred embodiment, the powder has a d98-value less than 280 µm, as measured by laser scattering in isopropanol, preferably less than 260 µm or less than 250 µm.
- In some embodiments of the present invention, the powder has a d9o-value less than 150 µm, as measured by laser scattering in isopropanol. According to an embodiment, the powder has a d9o-value less than 120 µm, as measured by laser scattering in isopropanol, preferably less than 110 µm or less 100 µm.
- In some embodiments of the present invention, the powder has a d10-value higher than 0.1 µm, as measured by laser scattering in isopropanol. According to a preferred embodiment, the powder has a d10-value higher than 0.2 µm, as measured by laser scattering in isopropanol, preferably higher than 0.5 µm or higher than 1 µm.
- In some embodiments of the present invention, the powder has a d50-value comprised between 40 µm and 70 µm, as measured by laser scattering in isopropanol, preferably between 40 µm and 60 µm, or between 43 µm and 58 µm or between 45 µm and 55 µm. A powder with such particle size distribution is for example well-suited for compression molding and selective laser sintering (SLS).
- In some embodiments of the present invention, the powder has a d50-value comprised between 20 µm and 35 µm, as measured by laser scattering in isopropanol, preferably between 21 µm and 34 µm, or between 22 µm and 33 µm or between 23 µm and 32 µm. In such embodiments, the powder has preferably a d9o-value less than 80 µm, more preferably less than 70 µm. In such embodiments, the powder has preferably a d98-value less than 150 µm, more preferably less than 110 µm. A powder with such particle size distribution is for example well-suited for powder coating, notably electrostatic powder coating.
- In some embodiments of the present invention, the powder has a d50-value comprised between 5 µm and 20 µm, as measured by laser scattering in isopropanol, preferably between 6 µm and 19 µm. In such embodiments, the powder has preferably a d90-value less than 40 µm, more preferably less than 30 µm. In such embodiments, the powder has preferably a d98-value less than 100 µm, more preferably less than 70 µm. A powder with such particle size distribution is for example well-suited for slurry coating.
- In some embodiments of the present invention, the powder has a d99-value less than 195 µm, as measured by laser scattering in isopropanol. According to a preferred embodiment, the powder has a d99-value less than 190 µm, as measured by laser scattering in isopropanol, preferably less than 180 µm or less than 170 µm.
- The powder of the present invention may have a BET surface area ranging from 0 to 30 m2/g, preferably from 0 to 20 m2/g, more preferably from 0 to 15 m2/g, as measured by ISO 9277, using a soak /evacuation temperature of at most 25° C.
- The powder of the present invention may have a bulk density ρ B (or poured bulk density) of at least 0.25, preferably at least 0.35, most preferably at least 0.40.
- An object of the present invention relates to a method of obtaining a powder, comprising grinding the PEEK-PEoEK copolymer at a temperature comprised between -25°C and 150°C inclusive, preferably between 20°C and 80°C inclusive. The powder may preferably has a d9o-value of less than 150 µm (as measured by laser scattering in isopropanol), and/or a d50-value less than 70 µm.
- The grinding mills used to grind the PEEK-PEoEK copolymer can be of any type, for example disk mills, jet mills, notably fluidized jet mill, impact mills, wet-grinding mills, pin mills or a combination of these equipment. A classifier may also be used.
- The PEEK-PEoEK material to be ground, alone or in mixture with additional components (as described below), may be passed back through the same mill or through other serially arranged mills, possibly using a sieve or an air classifying mill, until the desired material fineness is achieved. The coarse PEEK-PEoEK powder, alone or in mixture with additional components, may therefore, for example, be passed in a single mill and a series of successive passes of the materials there through is used. Alternatively when a series of mills is used, a single pass through each mill may be employed.
- The grinding process of the present invention may be continuous or semi-continuous. According to an embodiment, the PEEK-PEoEK copolymer to be ground or milled is in the form of a so-called "coarse powder", for example a powder having a d9o-value between 500 µm and 4,000 µm, preferably between 600 µm and 2,000 µm, and/or a d50-value between 200 µm and 2,000 µm, preferably between 300 µm and 1,000 µm. Such a coarse powder can be obtained by a polycondensation reaction and an additional step of extracting the solvent and salts after polycondensation, as well as optional post-treatment step(s) (such as tempering or heat treatment) of the polymer obtained from the polycondensation/extraction. According to this embodiment, the coarse powder is ground to produce the powder of the present invention, having preferably a d90-value of less than 150 µm (as measured by laser scattering in isopropanol), and/or a d50-value less than 70 µm.
- According to an embodiment, the PEEK-PEoEK powder can be treated at a temperature above its Tg for a period of at least 30 minutes, preferably at a temperature of at least 170°C for at least 5 hours.
- The powder particles of the powder preferably have a spherical form or an approximately spherical form. This means that the powder particles of the powder preferably have an aspect ratio of less than 2.0. Such aspect ratio of the powder particles is more preferably of less than 1.5, and most preferably of less than 1.48. The term aspect ratio used herein means the average ratio of maximum length dimension to minimum length dimension (=maximum length/minimum length), as counted on about 60 particles from a scanning electron microscopy (SEM) image of the PEKK powder particles obtained according to the process of the invention. The dimensions of the powder particle are measured in various different directions.
- Additional components may notably be added to the PEEK-PEoEK copolymer, before, during or after the step grinding, before the use of the powder in the end-applications. For example, the additional component may be a flow agent (F). This flow agent (F) may for example be hydrophilic. Examples of hydrophilic flow aids are inorganic pigments notably selected from the group consisting of silicas, aluminas and titanium oxide. Mention can be made of fumed silica. Fumed silicas are commercially available under the trade name Aerosil® (Evonik) and Cab-O-Sil® (Cabot). Fumed aluminas are commercially available under the trade name SpectraAl® (Cabot). According to one embodiment, the powder of the present invention comprises at least 50 wt.% of the PEEK-PEoEK copolymer, for example at least 60 wt.% of the PEEK-PEoEK copolymer, at least 70 wt.%, at least 80 wt.%, at least 90 wt.%, at least 95 wt.%, at least 98 wt.% or at least 99 wt.% of the PEEK-PEoEK copolymer described herein, based on the total weight of the powder.
- In one embodiment of the present invention, the powder comprises from 0.01 to 10 wt.% of a flow agent (F), for example from 0.05 to 8 wt.%, from 0.1 to 6 wt.% or from 0.15 to 5 wt.% of at least one flow agent (F), for example of at least fumed silica or fumed alumina, based on the total weight of the powder.
- These silicas or aluminas are composed of nanometric primary particles (typically between 5 and 50 nm for fumed silicas or aluminas). These primary particles are combined to form aggregates. In use as flow agent, silicas or aluminas are found in various forms (elementary particles and aggregates).
- The powder of the present invention may further comprise at least another polymeric material, that-is-to-say at least one polymer or copolymer, distinct from the PEEK-PEoEK copolymer of the present invention. This additional polymeric material may for example be selected from the group consisting of poly(aryl ether sulfone) (PAES) polymers, for example a poly(biphenyl ether sulfone) (PPSU) polymer and/or a polysulfone (PSU) polymer, a poly(aryl ether ketone) (PAEK) polymers, for example a poly(ether ether ketone) (PEEK) polymer.
- The powder of the present invention may also comprise one or several additives (A), such as lubricants, heat stabilizers, light stabilizers, antioxidants, pigments, processing aids, dyes, fillers, nanofillers or electromagnetic absorbers. Examples of these optional additives are titanium dioxide, zinc oxide, cerium oxide, silica or zinc sulphide, glass fibers, carbon fibers.
- The powder of the present invention may also comprise flame retardants, such as halogen and halogen free flame retardants.
- According to one embodiment, the powder of the present invention comprises:
- at least 50 wt.% of PEEK-PEoEK copolymer,
- from 0.01 wt.% to 10 wt.%, from 0.05 to 8 wt.%, from 0.1 to 6 wt.% or from 0.15 to 5 wt.% of at least one flow agent (F), and
- optionally at least one additive (A), for example selected from the group consisting of fillers (such as milled carbon fibers, silica beads, talc, calcium carbonates) colorants, dyes, pigments, lubricants, plasticizers, flame retardants (such as halogen and halogen free flame retardants), nucleating agents, heat stabilizers, light stabilizers, antioxidants, processing aids, fusing agents and electromagnetic absorbers,
- The present invention also relates to a process for manufacturing a 3D object, comprising depositing successive layers of the powder of the present invention and selectively sintering each layer prior to deposition of the subsequent layer, for example by means of an electromagnetic radiation of the powder.
- SLS 3D printers are, for example, available from EOS Corporation under the trade name EOSINT® P.
- MJF 3D printers are, for example, available from Hewlett-Packard Company under the trade name Jet Fusion.
- The powder may also be used to produce continuous fiber composites in a CBAM process, for example as developed by Impossible Objects.
- The process for manufacturing a 3D object usually takes place in a printer. The printer may comprise a sintering chamber and a powder bed, both maintained at a specific temperature.
- According to an embodiment, the step of sintering comprises selective sintering by means of a high power energy source, for example a high power laser source such as an electromagnetic beam source.
- The powder to be printed can be pre-heated to a processing temperature (Tp), above the glass transition (Tg) temperature of the powder (e.g. polymer). The processing temperature of the printer is the temperature at which is heated the material (M) prior to the sintering, for example in the powder bed of a SLS printer. The preheating of the powder makes it easier for the laser to raise the temperature of the selected regions of layer of unfused powder to the melting point. The laser causes fusion of the powder only in locations specified by the input. Laser energy exposure is typically selected based on the polymer in use and to avoid polymer degradation.
- The process for manufacturing a 3D object of the present invention employs a powder comprising at least one PEEK-PEoEK copolymer. The powder may comprise recycled powder, that-is-to say a material which has already been exposed to the processing temperature of a 3D printer. In some embodiments, the powder comprises at least 10 wt.% of recycled powder, based on the total weight of the powder, at least 20 wt.%, at least 30 wt.%, at least 40 wt.%, at least 50 wt.%, at least 60 wt.%, at least 70 wt.%, at least 80 wt.%, at least 90 wt.%, at least 95 wt.% or at least 98 wt.%. In some embodiments, the powdered polymer material (M) comprises a ratio of recycled powder/unrecycled powder ranging from 50/50 to 100/0, preferably 55/45 to 100/1, more preferably 60/40 to 100/1. As demonstrated below, the powder described herein, comprising the PEEK-PEoEK copolymer of the present invention, is not significantly affected by the long-term exposure to the processing temperature.
- The combination of the material and the choice of a specific processing temperature (Tp), based on the material composition, makes possible the recycling of the unsintered material and its reuse in the manufacture of a new 3D object. The powder is not significantly affected by the long-term exposure to the processing temperature and presents a set of characteristics (namely powder aspect and color, disaggregation and coalescence abilities) which is comparable to a new, unprocessed polymer material. This makes the used powder completely suitable for reuse in a laser sintering 3D printing process, without impacting the appearance and mechanical performances of the resulting printed article (notably the expected performance of the polymer materials).
-
- MFI is the Melt Flow Index as measured by ASTM D1238 at 340°C with a 8.4 kg weight,
- MFIt0 is the MFI before a 24-hour exposure to a temperature of 290° C under air,
- MFIti is the MFI after a 24-hour exposure to a temperature of 290° C under air.
-
- Tm is the melting temperature on the 1st heat scan in DSC according to ASTM D3418-03, E1356-03, E793-06, E794-06
- Tmt0 is the Tm before a 24-hour exposure to a temperature of 290° C under air,
- Tmti is the Tm after a 24-hour exposure to a temperature of 290° C under air.
- In some embodiments, the process for manufacturing a 3D object of the present invention additionally comprises steps a1) to a4) below:
- a1) heating the powder preferably a temperature Tp as follows:
- more preferably Tp < Tm - 10,
- even more preferably Tp < Tm - 15,
- wherein Tm (°C) is the melting temperature of the PEEK-PEoEK copolymer, as measured on the 1st heat scan by differential scanning calorimetry (DSC) according to ASTM D3418,
- a2) depositing successive layers of the heated powder,
- a3) selectively sintering each layer prior to deposition of the subsequent layer, and
- a4) removing heated, non-fused powdered material of step a1) and recycling it in a subsequent printing cycle.
- The 3D object/article/part may be built on substrate, for example a horizontal substrate and/or on a planar substrate. The substrate may be moveable in all directions, for example in the horizontal or vertical direction. During the 3D printing process, the substrate can, for example, be lowered, in order for the successive layer of unsintered polymeric material to be sintered on top of the former layer of sintered polymeric material.
- According to an embodiment, the process further comprises a step consisting in producing a support structure. According to this embodiment, the 3D object/article/part is built upon the support structure and both the support structure and the 3D object/article/part are produced using the same AM method. The support structure may be useful in multiple situations. For example, the support structure may be useful in providing sufficient support to the printed or under-printing, 3D object/article/part, in order to avoid distortion of the shape 3D object/article/part, especially when this 3D object/article/part is not planar. This is particularly true when the temperature used to maintain the printed or under-printing, 3D object/article/part is below the re-solidification temperature of the powder.
- According to the present invention, the powder is not significantly affected by the long-term exposure to the processing temperature and presents a set of characteristics which is comparable to a new, unprocessed polymer material. This makes the used powder completely suitable for reuse in a laser sintering 3D printing process, without impacting the appearance and mechanical performances of the resulting printed article (notably the expected performance of the polymer materials).
- The present invention also relates to a 3D object/article/part, obtainable by laser sintering from the powder of the present invention.
- The present invention also relates to a 3D object/article/part, comprising the powder of the present invention.
- The present invention also relates to the use of the powder of the present invention for the manufacture of a 3D object using additive manufacturing, preferably SLS, CBAM or JMF.
- The present invention also relates to the use of a PEEK-PEoEK copolymer, for the manufacture of a powder for additive manufacturing, preferably SLS, CBAM or JMF.
- The 3D objects/articles/parts obtainable by such method of manufacture can be used in a variety of final applications. Mention can be made in particular of medical devices, brackets and complex shaped parts in the aerospace industry and under-the-hood parts in the automotive industry (e.g. thermostat housing, water pump impeller, engine covers, pump casing).
- Exemplary embodiments will now be described in the following non-limiting examples.
-
- Hydroquinone, photo grade, was procured from Eastman, USA. It contained 0.38 wt% moisture, which amount was used to adapt the charge weights. All weights indicated include moisture.
- Pyrocatechol, flakes, was procured from Solvay USA. Its purity was 99.85% by GC. It contained 680 ppm moisture, which amount was used to adapt the charge weights. All weights indicated include moisture.
- Resorcinol, ACS reagent grade, was procured from Aldrich, USA
- 4,4'-Biphenol, polymer grade, was procured from SI, USA.
- 2,2'- Biphenol, 99%, was procured from Aldrich, USA
- 4,4'-Difluorobenzophenone, polymer grade (99.8%+), was procured from Malwa, India
- Diphenyl sulfone (DPS), polymer grade, was procured from Proviron (99.8% pure).
- Sodium carbonate, light soda ash, was procured from Solvay S.A., France.
- Potassium carbonate with a d90 < 45 µm was procured from Armand products.
- Lithium chloride (LiCl), anhydrous grade, was procured from Acros.
- 1,4-bis(4'-fluorobenzoyl)benzene (1,4-DFDK) and 1,3 bis(4'-fluorobenzoyl)benzene (1,3-DFDK) were prepared by Friedel-Crafts acylation of fluorobenzene according to Example 1 of
U.S. Patent No. 5,300,693 to Gilb et al. (filed November 25, 1992 and incorporated herein by reference in its entirety). Some of the 1,4-DFDK was purified as described inU.S. Patent No. 5,300,693 by recrystallization in chlorobenzene, and some of the 1,4-DFDK was purified by recrystallization in DMSO/ethanol. The 1,4-DFDK purified by recrystallization in DMSO/ethanol was used as the 1,4-DFDK in the polymerization reactions to make PEKK described below, while 1,4-DFDK recrystallized in chlorobenzene was used as precursor for - 1,4-bis(4'-hydroxybenzoyl)benzene (1,4-BHBB).
- 1,4-bis(4'-hydroxybenzoyl)benzene (1,4-BHBB) and 1,3-bis(4'-hydroxybenzoyl)benzene (1,3-BHBB) were produced by hydrolysis of the 1,4-DFDK, and 1,3-DFDK, respectively, following the procedure described in Example 1 of
U.S. Patent No. 5,250,738 to Hackenbruch et al. (filed February 24, 1992 and incorporated herein by reference in its entirety). They were purified by recrystallization in DMF/ethanol. - Unless otherwise noted, the melting temperature Tm was determined as the peak temperature of the melting endotherm on the 2nd heat scan in differential scanning calorimeter (DSC) according to ASTM D3418-03, E1356-03, E793-06, E794-06. In some cases (always noted), the melting point is recorded on the 1st heat scan using the same method, to characterize powders melting behavior. Details of the procedure as used in this invention are as follows: a TA Instruments DSC Q20 was used with nitrogen as carrier gas (99.998% purity, 50 mL/min).
- Temperature and heat flow calibrations were done using indium. Sample size was 4 to 7 mg. The weight was recorded ±0.01 mg. The heat cycles were:
- 1st heat cycle: 30.00°C to 400.00°C at 20.00°C/min, isothermal at 400.00°C for 1 min;
- 1st cool cycle: 400.00°C to 30.00°C at 20.00°C/min, isothermal for 1 min;
- 2nd heat cycle: 30.00°C to 400.00°C at 20.00°C/min, isothermal at 400.00°C for 1 min. The melting temperature Tm was determined as the peak temperature of the melting endotherm on the 2nd heat scan. The enthalpy of fusion was determined on the 2nd heat scan.
- The melting of the composition was taken as the area over a linear baseline drawn from 220°C to a temperature above the last endotherm .
- The glass transition temperature Tg (mid-point) was determined on the 2nd heat scan according to ASTM D3418-03, E1356-03, E793-06, E794-06.
- The crystallization temperature Tc was determined as the peak temperature of the crystallization exotherm on the 1st cool scan.
- The melt viscosity was measured using a capillary rheometer according to ASTM D3835. Readings were taken at 410°C and a shear rate of 46.3 s-1 using a die with the following characteristics: diameter = 1.016 mm, length = 20.32 mm, cone angle = 120°.
- The melt flow index was determined according to ASTM D1238 at 340°C with a 3.8 kg weight. The final MFI for a 8.4 kg weight was obtained by multiplying the value obtained by 2.35.
- A 762 mm x 762 mm x 3.2 mm plaque was prepared from the polymer by compression molding of 30 g of polymer under the following conditions:
- preheat at Ti,
- T1 /20 minutes, 2000 kg-f
- T1 /2 minutes, 2700 kg-f
- cool down to 30°C over 40 minutes, 2000 kg-f
- Ti values used for the polymers are indicated in the results table.
- The plaques were then annealed at 200°C for 3 hours.
- The 762 mm x 762 mm x 3.2 mm compression molded plaques were machined into Type V ASTM tensile specimens and these specimens of the various polymer compositions were subjected to tensile testing according to ASTM method D638 at 1.27 mm/ minute (or 0.05 inch/minute) room temperature (i.e. 23°C) on 3 specimens. The average of the 3 specimens is presented.
- Printing occurred on an EOSINT® P800 SLS Printer, using the following print settings: hatch laser power of 16 watts, contour laser power of 8.5 watts, laser speed of 2.65 m/s, and cooling rate after print completion of less than 10°C /min.
- Printed Type I ASTM tensile specimens were subjected to tensile testing according to ASTM method D638 at 5.08 mm/minute (or 0.2 inch/minute) room temperature (i.e. 23°C) on 5 specimens. The average of the 5 specimens is presented.
- The PSD (volume distribution) was determined by an average of 3 runs using laser scattering Microtrac S3500 analyzer in wet mode (128 channels, between 0.0215 and 1408 µm). The solvent was isopropanol with a refractive index of 1.38 and the particles were assumed to have a refractive index of 1.59. The ultrasonic mode was enabled (25 W/60 seconds) and the flow was set at 55%.
- In a 500 mL 4-neck reaction flask fitted with a stirrer, a N2 inlet tube, a Claisen adapter with a thermocouple plunging in the reaction medium, and a Dean-Stark trap with a condenser and a dry ice trap were introduced 112.50 g of diphenyl sulfone, 33.390 g of 1,3-BHBB, 6.372 g of 1,4-BHBB and 41.051 g of 1,4-DFDK. The flask content was evacuated under vacuum and then filled with high purity nitrogen (containing less than 10 ppm O2). The reaction mixture was then placed under a constant nitrogen purge (60 mL/min).
- The reaction mixture was heated slowly to 270°C. At 270°C, 13.725 g of Na2CO3 and 0.086 g of K2CO3 was added via a powder dispenser to the reaction mixture over 60 minutes. At the end of the addition, the reaction mixture was heated to 320°C at 1°C/minute. After 2 minutes at 320°C, 1.207 g of 1,4-DFDK were added to the reaction mixture while keeping a nitrogen purge on the reactor. After 5 minutes, 0.529 g of lithium chloride were added to the reaction mixture. 10 minutes later, another 0.503 g of 1,4-DFDK were added to the reactor and the reaction mixture was kept at temperature for 15 minutes. Another charge of 25 g of diphenyl sulfone was added to the reaction mixture, which was kept under agitation for 15 minutes. The reactor content was then poured from the reactor into a stainless steel pan and cooled. The solid was broken up and ground in an attrition mill through a 2 mm screen. Diphenyl sulfone and salts were extracted from the mixture with acetone and water at pH between 1 and 12. 0.67 g of NaH2PO4·2H2O and 0.62 g of Na2HPO4 were dissolved in 1200 mL DI water for the last wash. The powder was then removed from the reactor and dried at 120°C under vacuum for 12 hours yielding 72 g of a yellow powder.
- The properties of the polymer are disclosed in Table 3 below.
- The same procedure as PEKK (58/42 T/I ratio) was followed but with the reagents amounts as listed in Table 1. The carbonates were added at 200°C instead of 270°C.
Table 1 Reagent Units T/I 60/40 Diphenyl sulfone g 112.50 1,3-BHBB g 31.800 1,4-BHBB g 7.950 1,4-DFDK g 40.810 Na2CO3 g 13.725 K2CO3 g 0.086 Time at 320 °C minutes 180 1,4-DFDK in first termination g 0.805 Lithium chloride in second termination g 0.529 1,4-DFDK in third termination g 0.402 Polymer weight g 70 - The properties of the polymer are disclosed in Table 3 below.
- In a 500 mL 4-neck reaction flask fitted with a stirrer, a N2 inlet tube, a Claisen adapter with a thermocouple plunging in the reaction medium, and a Dean-Stark trap with a condenser and a dry ice trap were introduced 128.21 g of diphenyl sulfone, 20.158 g of hydroquinone, 11.322 g of 4,4'-biphenol and 53.520 g of 4,4'-difluorobenzophenone. The flask content was evacuated under vacuum and then filled with high purity nitrogen (containing less than 10 ppm O2). The reaction mixture was then placed under a constant nitrogen purge (60 mL/min).
- The reaction mixture was heated slowly to 150°C. At 150°C, a mixture of 26.744 g of Na2CO3 and 0.168 g of K2CO3 was added via a powder dispenser to the reaction mixture over 30 minutes. At the end of the addition, the reaction mixture was heated to 320°C at 1°C/minute. After 16 minutes at 320°C, 3.713 g of 4,4'-difluorobenzophenone were added to the reaction mixture while keeping a nitrogen purge on the reactor. After 5 minutes, 1.031 g of lithium chloride were added to the reaction mixture. 10 minutes later, another 2.122 g of 4,4'-difluorobenzophenone were added to the reactor and the reaction mixture was kept at temperature for 15 minutes.
- The reactor content was then poured from the reactor into a SS pan and cooled. The solid was broken up and ground in an attrition mill through a 2 mm screen. Diphenyl sulfone and salts were extracted from the mixture with acetone and water at pH between 1 and 12. The powder was then removed from the reactor and dried at 120°C under vacuum for 12 hours yielding 74 g of a white powder.
-
- The melt viscosity measured by capillary rheology at 410°C, 46 s-1 was 0.28 kN-s/m2.
- The properties of the polymer are disclosed in Table 3 below.
- In a 1000 mL 4-neck reaction flask fitted with a stirrer, a N2 inlet tube, a Claisen adapter with a thermocouple plunging in the reaction medium, and a Dean-Stark trap with a condenser and a dry ice trap were introduced 338.33 g of diphenyl sulfone, 41.665 g of hydroquinone, 13.863 g of resorcinol and 112.593 g of 4,4'-difluorobenzophenone. The flask content was evacuated under vacuum and then filled with high purity nitrogen (containing less than 10 ppm O2). The reaction mixture was then placed under a constant nitrogen purge (60 mL/min).
- The reaction mixture was heated slowly to 150°C. At 150°C, a mixture of 55.482 g of Na2CO3 and 0.174 g of K2CO3 was added via a powder dispenser to the reaction mixture over 30 minutes. At the end of the addition, the reaction mixture was heated to 300°C at 1°C/minute. After 36 minutes at 300°C, 13.169 g of 4,4'-difluorobenzophenone were added to the reaction mixture while keeping a nitrogen purge on the reactor. After 5 minutes, 2.132 g of lithium chloride were added to the reaction mixture. 10 minutes later, another 4.390 g of 4,4'-difluorobenzophenone were added to the reactor and the reaction mixture was kept at temperature for 15 minutes.
- The reactor content was then poured from the reactor into a SS pan and cooled. The solid was broken up and ground in an attrition mill through a 2 mm screen. Diphenyl sulfone and salts were extracted from the mixture with acetone and water at pH between 1 and 12. The powder was then removed from the reactor and dried at 100°C under vacuum for 12 hours yielding 165 g of a light brown powder.
-
- The properties of the polymer are disclosed in Table 3 below.
- In a 1000 mL 4-neck reaction flask fitted with a stirrer, a N2 inlet tube, a Claisen adapter with a thermocouple plunging in the reaction medium, and a Dean-Stark trap with a condenser and a dry ice trap were introduced 343.63 g of diphenyl sulfone, 61.852 g of hydroquinone, 15.426 g of pyrocatechol and 154.573 g of 4,4'-difluorobenzophenone. The flask content was evacuated under vacuum and then filled with high purity nitrogen (containing less than 10 ppm O2). The reaction mixture was then placed under a constant nitrogen purge (60 mL/min).
- The reaction mixture was heated slowly to 150°C. At 150°C, a mixture of 76.938 g of Na2CO3 and 0.484 g of K2CO3 was added via a powder dispenser to the reaction mixture over 30 minutes. At the end of the addition, the reaction mixture was heated to 320°C at 1°C/minute. After 24 minutes at 320°C, the reaction was terminated in 3 stages: 18.329 g of 4,4'-difluorobenzophenone were added to the reaction mixture while keeping a nitrogen purge on the reactor. After 5 minutes, 2.388 g of lithium chloride were added to the reaction mixture. 10 minutes later, another 6.110 g of 4,4'-difluorobenzophenone were added to the reactor and the reaction mixture was kept at temperature for 15 minutes.
- The reactor content was then poured from the reactor into a SS pan and cooled. The solid was broken up and ground in an attrition mill through a 2 mm screen. Diphenyl sulfone and salts were extracted from the mixture by extracting successively with acetone and water at room temperature. The powder was then dried at 120°C under vacuum for 12 hours yielding 179 g of a white powder.
-
- The properties of the polymer are disclosed in Table 3 below.
- The same procedure as PEEK-PEoEK (80/20) was followed but with the reagents amounts listed in Table 2.
Table 2 Reagent Units PEEK/PEoEK 75/25 Diphenyl sulfone g 343.63 Hydroquinone g 57.989 pyrocatechol g 19.271 4,4' -difluorobenzophenone g 154.483 Na2CO3 g 76.893 K2CO3 g 0.483 Time at 320°C minutes 37 4,4'-difluorobenzophenone in first termination g 10.686 Lithium chloride in second termination g 2.966 4,4'-difluorobenzophenone in third termination g 6.106 Polymer weight g 188 - The properties of the polymers are disclosed in Table 3 below.
Table 3 Property Units PEKK (58/42) PEKK (60/40) PEEK-PEDEK (75/25) PEEK-PEmEK (75/25) PEEK-PEoEK (75/25) PEEK-PEoEK (80/20) MV (410°C, 46 s-1) kN-s/m2 0.58 0.59 0.80 2.11 0.62 0.52 Tg °C 160 160 155 140 143 144 Tm °C 301 310 306 304 290 301 Tc °C 208 214 252 233 199 193 Heat fusion J/g 8 5 31 38 18 7 T1 molding °C N/A 343 343 343 343 368 Ultimatea Tensile strength by CMb psi N/A 14200 13100 15000 13700 14100 Tensile modulus by CM ksi N/A 532 468 611 562 567 a: larger value of at yield and at break;
b: compression molded samples - PEEK-PEoEK has improved mechanical properties over PEEK-PEDEK.
- 1 kg of each of the PEKK and PEoEK polymer materials were prepared according to the synthesis methods described above and were slowly fed to the feed port of a Retsch® SR200 rotor mill, fitted with a 0.5 mm opening Conidur screen mounted in the reverse flow position and standard 6-blade rotor with a speed of 10,000 rpm. The feed rate was adjusted so that the outlet pipe of the grinder was cold to the touch (T max 30-40°C). The materials were re-fed to the Retsch SR200 with a 0.25 mmm then through a 0.08mm screen, also in the reverse flow position with a standard 6-blade rotor at 10,000 rpm.
- Once all the materials had been ground through the 0.08 mm grinding screen, they were sieved through a 106 µm screen and the particle size distribution was measured. The details of the grinding results are presented in Table 4 below.
Table 4 Example CE1 E2 Nature of polymer PEKK (58/42) PEEK-PEoEK (80/20) Yield after grinding and sieving (%) 61 91 d10 after sieving (µm) 31 21 d50 after sieving (µm) 61 50 d90 after sieving (µm) 113 97 d98 after sieving (µm) 190 170 d99 after sieving (µm) 227 202 - The data indicates that PEKK is difficult to grind (low yield) and that a d50 of 50 µm typically desired for SLS applications is difficult to reach. The PEEK-PEoEK copolymer can be ground in an economical way into a powder matching the particle size requirement for SLS and compression molding (d50 = 50 µm, d90 < 110 µm).
- 1 kg of each of the four different polymeric material described in Table 5 below were prepared according to the synthesis methods described above and ground using a Restch® Ultracentrifugal mill ZM200 grinder using a 0.5 mm screen, to ensure homogeneous particle size for the exposure testing.
- For each sample, 50 g of ground powder were weighed up in aluminium loaf pans and the pans placed in an oven under air at 290°C, with fan for 24 hours. This aging test was aimed at evaluating the stability of the powder upon recycling in an SLS process where the powder is kept at temperature close to its melting point under concentrations of oxygen around 0.5-2.0 %. The melt flow and thermal transitions properties were measured on the samples before and after aging as a way to monitor polymer degradation. The results are detailed in Table 5.
Table 5 Polymer MFI before aging (g/10 min) MFI after aging (g/10 min) ΔMFI upon aging Tm 1st heat before aging (°C) Tm 1st heat after aging (°C) CE3 PEKK (58/42) 27 16 -41 300 304 CE4 PEEK-PEDEK (75/25) 31 16 -49 299 308 CE5 PEEK-PEmEK (75/25) 8 0 -100 302 307 E6 PEEK-PEoEK (80/20) 38 26 -30 304 308 - The data indicates that the PEEK-PEoEK copolymer powder according to the invention is more stable at 290°C under air than the material of the comparative examples CE3, CE4 and CE5:
- The MFI change for E6 is less than 40%, while the comparative materials were found to a change of more than 40% in melt flow.
- The increase in Tm in the first heat is +4°C, which is less than the increase for CE4 and CE5.
- This data indicates that the PEEK-PEoEK copolymer of the invention exhibits an improved stability over other low Tm polyketones, which is important to ensure good recyclability in SLS.
- 5 kg of each of the PEKK and PEEK-PEoEK polymer materials as described in Table 6 below were prepared according to the synthesis methods described above and slowly fed to the feed port of a Retsch® SR200 rotor mill, fitted with a 0.5 mm opening Conidur screen mounted in the reverse flow position and standard 6-blade rotor with a speed of 10,000 rpm. The feed rate was adjusted so that the outlet pipe of the grinder was cold to the touch (T max 30-40°C). The materials were re-fed to the Retsch SR200 with a 0.25 mmm then through a 0.08mm screen, also in the reverse flow position with a standard 6-blade rotor at 10,000 rpm.
- Once all the materials had been ground through the 0.08 mm grinding screen, they were sieved through No. 120 mesh tensile bolting cloth (pore size of 147 µm) and the particle size distribution was measured. The details of the grinding results are presented in Table 6.
Table 6 Example CE7 E8 Nature of polymer PEKK (60/40) PEEK-PEoEK (75/25) d10 after sieving (µm) N/A 24 d50 after sieving (µm) 57 56 d90 after sieving (µm) 88 106 d99 after sieving (µm) 152 208 - The PEKK and PEEK-PEoEK polymer materials (as described in Table 7 below) were printed according to the disclosed printing conditions. The mechanical properties of the resultant tensile bars are disclosed in Table 7. Fresh powder of the polymer materials and the resultant unsintered loose powder in the powder bed after printing that was not sintered into objects were measured for melt flow.
Table 7 Property Units CE7 PEKK (60/40) E8 PEEK-PEoEK (75/25) Processing temperature (Tp) °C 293 263 Print duration min 290 390 Ultimatea Tensile strength by printing psi 10500 10900 Tensile modulus by printing ksi 536 513 MFI of unsintered powder g/10 32 38 before printing min MFI of unsintered powder after printing g/10 min 23 38 ΔMFI of unsintered powder % -28 0 a: larger value of at yield and at break - The data in Table 7 indicates that the PEEK-PEoEK copolymer powder according to the invention (E8) is more stable at relative printing conditions than the materials of the comparative example CE7:
- The MFI change for E8 is 0%, while the comparative material of CE7 was found to have a change of -28% in melt flow.
- The mechanical properties of E8 are comparable to that of the materials of comparative example CE7.
- The differences in processing temperature between the example E8 and comparative example CE7 is due to the relative difference in melting temperatures of the materials. Considering that the print duration of example E8 is longer than that of comparative example CE7 (390 min vs. 290 min), the fact that the MFI change for E8 is still 0% is surprising. The PEEK-PEoEK copolymer of the invention exhibits an improved stability over PEKK, which is also a low Tm polyketone. This is an important property of the copolymer of the present invention to ensure good recyclability in SLS.
Claims (22)
- A powder comprising a PEEK-PEoEK copolymer, wherein the copolymer comprises at least 50 mol. %, collectively, of repeat units (RPEEK) and repeat units (RPEoEK), relative to the total number of repeat units in the PEEK-PEoEK copolymer, wherein:(b) repeat units (RPEoEK) are repeat units of formula (B) :each R1 and R2, equal to or different from each other, is independently at each occurrence selected from the group consisting of halogen, alkyl, alkenyl, alkynyl, aryl, ether, thioether, carboxylic acid, ester, amide, imide, alkali or alkaline earth metal sulfonate, alkyl sulfonate, alkali or alkaline earth metal phosphonate, alkyl phosphonate, amine and quaternary ammonium,each a and b is independently selected from the group consisting of integers ranging from 0 to 4, andthe PEEK-PEoEK copolymer comprises the repeat units RPEEK and RPEoEK in a molar ratio RPEEK/RPEoEK ranging from 95/5 to 5/95,wherein the powder has a d98-value less than 300 µm, preferably less than 280 µm, as measured by laser scattering in isopropanol.
- The powder of any one of claims 1 to 3, wherein the PEEK-PEoEK copolymer is essentially composed of repeat units (RPEEK) and (RPEoEK), wherein any additional repeat unit different from repeat units RPEEK and RPEoEK, are either absent or may be present in amount of at most 2 mol. %, at most 1 mol.% or at most 0.5 mol.%, relative to the total number of moles of repeat units in the PEEK-PEoEK copolymer.
- The powder of any one of claims 1 to 3, wherein the PEEK-PEoEK copolymer comprises at least 95 mol. %, collectively, of repeat units (RPEEK) and repeat units (RPEoEK).
- The powder of any one of claims 1 to 5, wherein repeat units RPEEK and RPEoEK are present in the PEEK-PEoEK copolymer in a RPEEK/RPEoEK molar ratio ranging from 95/5 to more than 50/50, preferably from 95/5 to 60/40, still more preferably from 90/10 to 65/35, even more preferably from 85/15 to 70/30.
- The powder of any one of claims 1 to 6, wherein:- the PEEK-PEoEK copolymer has a melting temperature (Tm) of less than or equal to 340°C, preferably less than or equal to 335°C, wherein the melting temperature (Tm) is measured as the peak temperature of the melting endotherm on the second heat scan in a differential scanning calorimeter (DSC) according to ASTM D3418-03 and E794-06, and using heating and cooling rates of 20°C/min; and/or- the PEEK-PEoEK copolymer has as heat of fusion (ΔH) of at least 1 J/g, preferably at least 2 J/g, at least 5 J/g, wherein the heat of fusion is determined as the area under the melting endotherm on the second heat scan in a differential scanning calorimeter (DSC) according to ASTM D3418-03 and E793-06, with heating and cooling rates of 20°C/min.
- The powder of any one of claims 1 to 7, wherein the PEEK-PEoEK copolymer has a phosphorus content of at least 6 ppm, preferably at least 10 ppm, even more preferably at least 15 ppm, even more preferably at least 20 ppm, as measured by Inductively Coupled Plasma Optical Emission Spectrometry (ICP-OES) calibrated with standards of known phosphorus content.
- The powder of any one of claims 1 to 8, exhibiting a bulk density of at least 0.25, preferably at least 0.35, more preferably at least 0.40.
- The powder of any one of claims 1 to 9, further comprising:- at least one flow agent (F), and/or- at least one additive (A) selected from the group consisting of lubricants, heat stabilizers, light stabilizers, antioxidants, pigments, processing aids, dyes, fillers, nanofillers or electromagnetic absorbers and flame retardants.
- The powder of any one of claims 1 to 10, comprising at least 50 wt. % of PEEK-PEoEK copolymer, based on the total weight of the powder.
- The powder of any one of claims 1 to 11, wherein the powder has a d90-value of less than 150 µm, as measured by laser scattering in isopropanol.
- The powder of any one of claims 1 to 12, wherein the powder has a d50-value ranging from 40 to 70 µm, as measured by laser scattering in isopropanol.
- The powder of any one of claims 1 to 12, wherein the powder has a d50-value ranging from 20 to 35 µm, as measured by laser scattering in isopropanol.
- The powder of any one of claims 1 to 12, wherein the powder has a d50-value ranging from 5 to 20 µm, as measured by laser scattering in isopropanol.
- The powder of any one of claims 1 to 15, wherein the powder has a d98-value less than 260 µm or less than 250 µm, as measured by laser scattering in isopropanol.
- The powder of any one of claims 1 to 16, wherein the powder has a d90-value less than 150 µm, preferably less than 120 µm, preferably less 110 µm or less than 100 µm, as measured by laser scattering in isopropanol.
- The powder of any one of claims 1 to 17, wherein the powder has a d10-value higher than 0.1 µm, preferably at least 0.2 µm, even more preferably at least 0.5 µm or higher than 1 µm, as measured by laser scattering in isopropanol.
- The powder of any one of claims 1 to 18, wherein the powder has a d99-value less than 195 µm, preferably less than 190 µm, preferably less than 180 µm or less than 170 µm, as measured by laser scattering in isopropanol.
- A method of obtaining the powder of any one of claims 1-19, comprising a step of grinding the PEEK-PEoEK copolymer at a temperature comprised between -25°C and 150°C.
- A process for manufacturing a three-dimensional (3D) object, comprising:a) depositing successive layers of the powder of any one of claims 1-19, andb) selectively sintering each layer prior to deposition of the subsequent layer.
- Use of the powder of any one of claims 1-19 for coating or compression molding.
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US201962869099P | 2019-07-01 | 2019-07-01 | |
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PCT/EP2020/066177 WO2021001132A1 (en) | 2019-07-01 | 2020-06-11 | PEEK-PEoEK COPOLYMER POWDER AND METHOD OF PREPARING THE POWDER |
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EP3994200B1 true EP3994200B1 (en) | 2023-08-09 |
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EP4251676A1 (en) * | 2020-11-30 | 2023-10-04 | Solvay Specialty Polymers USA, LLC | Additive manufacturing method for making a three-dimensional object |
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CN115590644B (en) * | 2022-10-21 | 2024-06-21 | 华中科技大学 | PEEK cladding titanium integrated repair bracket and preparation method thereof |
CN118146511B (en) * | 2024-05-09 | 2024-07-26 | 长春吉大特塑工程研究有限公司 | Preparation method of polyaryletherketone containing m-phenyl |
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US20050207931A1 (en) * | 2004-03-21 | 2005-09-22 | Toyota Motorsport Gmbh | unknown |
DE102006015791A1 (en) * | 2006-04-01 | 2007-10-04 | Degussa Gmbh | Polymer powder, process for the preparation and use of such a powder and molded articles thereof |
JP5711538B2 (en) * | 2008-03-14 | 2015-05-07 | ヴァルスパー・ソーシング・インコーポレーテッド | Powder composition and method for producing an article from the powder composition |
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JP2017503893A (en) * | 2014-01-22 | 2017-02-02 | ソルベイ スペシャルティ ポリマーズ ユーエスエー, エルエルシー | New polymer materials |
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CN113966353B (en) | 2019-06-20 | 2024-04-05 | 索尔维特殊聚合物美国有限责任公司 | Polymer-metal joint comprising PEEK-PEoEK copolymer composition in contact with a metal substrate |
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EP4251676A1 (en) * | 2020-11-30 | 2023-10-04 | Solvay Specialty Polymers USA, LLC | Additive manufacturing method for making a three-dimensional object |
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CN114026149A (en) | 2022-02-08 |
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