EP3646617A1

EP3646617A1 - Sound transducer arrangement having an mems unit

Info

Publication number: EP3646617A1
Application number: EP18729967.2A
Authority: EP
Inventors: Ferruccio Bottoni; Andrea Rusconi Clerici Beltrami
Original assignee: USound GmbH
Current assignee: USound GmbH
Priority date: 2017-06-26
Filing date: 2018-06-08
Publication date: 2020-05-06
Anticipated expiration: 2038-06-08
Also published as: SG11201912970YA; US20210067853A1; DE102017114142A1; US11128942B2; CA3068339A1; CN110915236B; EP3646617B1; KR20200023414A; AU2018292941A1; CN110915236A; WO2019001930A1; TW201904859A

Abstract

The invention relates to a sound transducer arrangement (1) for generating and/or detecting sound waves in the audible wavelength spectrum, having an acoustic unit (2), which comprises an oscillatable diaphragm (3), having an MEMS unit (4), which comprises an MEMS structure (5), coupled to the diaphragm (3), for generating and/or detecting a deflection of the diaphragm (3), and having a support unit (6) on which the MEMS unit (4) and the acoustic unit (2) are arranged. According to the invention, the support unit (6) comprises a metal leadframe (7) and a plastic body (8), in which the leadframe (7) is partially cast.

Description

Sound transducer arrangement with a MEMS unit

The present invention relates to a sound transducer assembly for generating and / or detecting sound waves in the audible wavelength spectrum with an acoustic unit comprising a vibratable diaphragm having a MEMS unit comprising a membrane-coupled MEMS structure for generating and / or detecting a deflection the membrane comprises, and with a support unit, on which the MEMS unit and the acoustic unit are arranged.

From DE 10 2015 107 560 A1 a sound transducer arrangement with a first MEMS sound transducer for generating and / or detecting sound waves in the audible wavelength spectrum. The MEMS transducer is arranged on a printed circuit board. This is disadvantageous because the use of a printed circuit board as a carrier for the MEMS transducer limits are set in terms of stability, modular design of the transducer assembly and performance of the MEMS transducer.

The object of the present invention is therefore to eliminate the disadvantages of the prior art.

The object is achieved by a sound transducer arrangement having the features of independent patent claim 1.

A sound transducer arrangement is proposed for generating and / or detecting sound waves in the audible wavelength spectrum. The acoustic transducer assembly comprises an acoustic unit comprising a vibratable membrane.

Furthermore, the acoustic transducer arrangement has a MEMS unit which has a MEMS structure coupled to the membrane for generating and / or Detecting a deflection of the membrane comprises. The term MEMS stands for microelectromechanical systems.

The deflection can be transferred to the vibratable membrane. As a result, air arranged above the diaphragm can be vibrated, so that the sound waves are generated. The sound transducer arrangement can thus be designed as a speaker.

Additionally or alternatively, the membrane may also be caused to oscillate by the air arranged above it. These vibrations can be transmitted to the MEMS structure so that it is deflected. The sound transducer arrangement can thereby be designed as a microphone.

Furthermore, the sound transducer arrangement comprises a carrier unit, on which the MEMS unit and the acoustic unit are arranged.

According to the invention, the carrier unit comprises a metallic lead frame and a plastic body with which the lead frame is partially remelted. The lead frame with the reflowed plastic body can be produced inexpensively in large quantities. The lead frame, for example, can be relatively easily punched out of a metal sheet. The plastic body can then be arranged by means of an injection molding process around the lead frame. The liquid plastic encloses the lead frame. In this case, the lead frame can be completely or only partially remelted. An advantage of this is that almost any structures can be formed on the lead frame.

In an advantageous development of the invention, the carrier unit has a breakthrough. This can preferably be arranged in a central region of the carrier unit. The breakthrough is at least partially surrounded by a support area for receiving the MEMS unit. The Supporting area can be advantageously designed as a support frame. The MEMS unit can be placed on the support area. For example, the MEMS unit can be placed on the support area such that the MEMS unit covers the breakthrough. The MEMS unit can completely cover the breakthrough. The MEMS unit can be arranged, for example, with an edge region in the support region. The MEMS unit can completely close the breakthrough. The advantage of the breakdown is that the MEMS structure of the MEMS unit can not only deflect away from the carrier unit but also into the breakdown towards the carrier unit. This deflection can take place along an axial direction to the MEMS unit. The MEMS unit may further be arranged parallel to the carrier unit so that the axial direction of the MEMS unit is oriented parallel to an axial direction of the carrier unit.

Furthermore, it is advantageous if the lead frame has frame struts and intermediate frame openings. Thereby, the amount of metal used for the lead frame can be reduced, so that the sound transducer assembly is designed to save weight.

The frame struts may extend radially outward from the support area. The frame struts may extend radially outward. The radial direction can be oriented such that it is oriented perpendicular to the axial direction. The radial direction can also run transversely to the axial direction.

The frame struts can furthermore be arranged parallel to one another in a first region of the carrier unit. This first region can be arranged, for example, adjacent to the support region. The first area can also be arranged around the support area.

In a first region radially further outward arranged second region, the frame struts may have an angle with each other. The Frame struts can move radially outward in this second area.

In a transition region between the first and the second region, at least a part of the frame struts may have a kink.

Additionally or alternatively, the plastic body can fill at least part of the frame openings between the frame struts. The plastic body can also completely fill the frame openings. As a result, a stability of the carrier unit can be increased.

It is also advantageous if the support area is formed by the lead frame. Additionally or alternatively, the support area may also be formed by the plastic body. Instead of the support area and the support frame may be formed by the lead frame. Additionally or alternatively, the support frame may be formed by the plastic body. This makes it possible to dispense with further elements for the support area or for the support frame.

Furthermore, it is advantageous if the support region has at least one electrical contact region. Additionally or alternatively, the lead frame may also have at least one electrical contact area. With the aid of the contact region, for example, electrical energy can be supplied for the operation of the MEMS unit. Additionally or alternatively, audio signals can also be fed to the MEMS unit if the sound transducer arrangement is operated, for example, as a loudspeaker. Furthermore, additionally or alternatively, the audio signals can also be led away from the MEMS unit if the sound transducer arrangement is operated, for example, as a microphone.

Advantageously, the support area and / or the lead frame may also have a plurality of contact areas, so that a plurality of audio signals and / or other signals can be transmitted parallel and parallel to the MEMS unit away from the MEMS unit.

If the support area and / or the leadframe has at least two contact areas, these can be electrically insulated from one another by the plastic body. As a result, the risk of a short circuit and a concomitant damage to an electronics of the sound transducer arrangement is reduced.

In a further advantageous embodiment of the invention, at least one contact region is electrically conductively connected to the lead frame. Alternatively, the contact region can also be connected to at least one frame strut. If the support region, for example the support frame, and / or the leadframe has a plurality of contact regions, one contact region can advantageously also be electrically conductively connected to only one associated frame strut.

Furthermore, at least two contact regions can be connected to one another in an electrically conductive manner. If, for example, a reference potential (ground) is to be applied to these contact areas, they can be electrically conductively connected to one another for equipotential bonding.

With the aid of the electrically conductive connection between a contact region and an associated frame strut, the lead frame itself can be used as an electrical line. It can be dispensed with additional audio lines and / or power lines.

The frame strut (s) can also be used to connect to an external unit. The external unit may be, for example, a smartphone and / or a player. Furthermore, it is advantageous if the MEMS unit has at least one connection section for transmitting audio signals and / or electrical energy. The connection section may thus be an interface for supplying the audio signals and / or the electrical energy to the MEMS unit. Additionally or alternatively, the audio signals can be removed from the MEMS unit by means of the connection section when the sound transducer arrangement is operated as a microphone.

In order to be able to supply the audio signals to the MEMS unit or to be able to discharge the audio signals, the connection section can be connected to the at least one contact area.

The connection section can be connected to the contact region, for example, by means of a solder connection. Additionally or alternatively, an electrically conductive adhesive connection may also be formed between the connection section and the contact region.

With the aid of the connection section of the MEMS unit, it can be arranged in a simple manner on the carrier unit or in the carrier area, in particular on the carrier frame. The MEMS unit can be used for example by surface mounting in the support area. The connection section can then coincide with the associated contact area. Subsequently, the electrically conductive connection, for example the solder connection, can be produced between the connection section and the contact region. Of course, this method can also be carried out simply and quickly even if a plurality of connection sections are arranged on the MEMS unit and, accordingly, a plurality of contact regions are arranged on the carrier unit. A complex and error-prone wiring of the MEMS unit on the carrier unit is thereby eliminated. It is likewise advantageous if the carrier unit, in particular adjacent to the MEMS unit, has an ASIC receptacle in which an ASIC for controlling the acoustic transducer arrangement can be arranged.

It is advantageous if the ASIC receptacle has an electrical connection to the lead frame. As a result, the ASIC can be supplied with electrical energy, for example.

Additionally or alternatively, the ASIC receptacle may also have an electrical connection to at least one frame strut. For example, the audio signals can thereby be supplied to an input of the ASIC via the at least one frame strut. As a result, no further data lines are needed.

The frame strut also allows the ASIC to connect to the external unit.

It is also advantageous if at least a first base element is arranged around the support area on a first end side of the carrier unit. The first base element may be formed, for example, annular. The first base element can thus rotate around the support area. Furthermore, the acoustic unit can be arranged on the first base element.

Additionally or alternatively, a first cavity can be formed between the acoustic unit and the carrier unit. For example, the MEMS structure is directed into the first cavity.

Furthermore, it is advantageous if at least one second base element is arranged on a second end face opposite the first base element. The second base element may, for example, be annular. Furthermore, a cover element can be arranged on the second base element, so that a second cavity can be formed between the cover element and the carrier unit. The MEMS structure can also deflect into the second cavity.

Advantageously, in addition, the first and / or the second base element is formed by the plastic body. The base elements can be produced in a simple manner, for example by means of the injection molding process. The base elements can thus be formed integrally with the plastic body.

In order to be able to compensate for pressure between the first and the second cavity, it is advantageous if the carrier unit has at least one compensating opening. Due to the oscillating membrane, at least the first cavity is reduced in volume and increased. The resulting compression and expansion of the air contained in the first cavity results in pressure and drag on the membrane. The membrane is thus hindered in its free vibration. By means of the equalization breakthrough, a larger volume, namely now the volume of the first and the second cavity, can be compressed and expanded, so that the pressure and the tension on the membrane are weakened. If the second cavity is not bounded by a cover member, the second cavity is open so that the pressure and tension on the membrane are further reduced.

In an advantageous further development of the invention, at least part of the frame struts project outward beyond the first base element. Additionally or alternatively, at least a part of the frame struts can protrude outwards beyond the second base element.

Advantageously, the frame struts may be connected in the region of their ends with a housing. The housing can, for example, be a Be ear listener who can be arranged as a hearing aid in a user's ear canal. The housing may also be a housing of a microphone and / or a speaker. The projecting frame struts can thus serve as fastening elements with which the sound transducer arrangement can be arranged in the housing. This can be dispensed with further fasteners.

Furthermore, it is advantageous if the ends of at least part of the frame struts are bent in the axial direction on the side of the first end face. Additionally or alternatively, the ends of at least a part of the frame struts may be bent in the axial direction to the side of the second end side. Preferably, all the frame struts can be bent towards an end face. By bending over the ends of the frame struts, a contact area between the ends and an inner side of the housing can be increased. The ends can be bent in such a way that they are oriented parallel to the inside of the housing. Further, the ends may be alternately bent, for example. That is, one end is bent, for example, in the axial direction toward the first end side, and the end adjacent in the circumferential direction is bent in the axial direction toward the second end side. This is followed in the circumferential direction again an end which is bent in the axial direction to the first end face.

In order to form a secure connection between the ends and the housing, it is advantageous if at least a part of the free ends of the frame struts is glued to the housing. Additionally or alternatively, a portion of the ends may be bolted to the housing. To form a simple connection, the ends may be latched to the housing. The housing may have receptacles into which the ends can be inserted. With the help of a locking element in the receptacles and / or at the ends of the ends can be locked to the housing. Further advantages of the invention are described in the following exemplary embodiments. Show it:

FIG. 1 shows a schematic sectional view of a sound transducer arrangement with an acoustic unit, a MEMS unit and a carrier unit,

FIG. 2 shows a plan view of a carrier unit with a lead frame and a plastic body,

FIG. 3 shows a plan view of a carrier unit with a lead frame and a plastic body in an alternative exemplary embodiment,

FIG. 4 shows a perspective top view of a part of the sound transducer arrangement,

Figure 5 is a rear perspective view of a portion of the transducer assembly and

FIG. 6 shows a perspective sectional view of the sound transducer arrangement in a housing.

FIG. 1 shows a schematic sectional view of a sound transducer arrangement 1. The sound transducer arrangement 1 has an acoustic unit 2 which comprises a vibratable membrane 3. The diaphragm 3 can vibrate in an axial direction X. The diaphragm 3 can swing in both directions of the axial direction X. The membrane 3 can swing forward and backward. With the help of the membrane 3 sound waves can be generated when the membrane 3 is driven. Additionally or alternatively, sound waves can also be detected with the aid of the membrane 3. Is the membrane 3 When exposed to sound waves, it begins to vibrate itself and can transmit the vibrations.

Furthermore, the sound transducer arrangement 1 has a MEMS unit 4, which comprises a MEMS structure 5. The MEMS structure 5 is coupled to the membrane 3. In order to couple the MEMS structure 5 to the membrane 3, the sound transducer arrangement in the present exemplary embodiment has a coupling element 18. With the help of the MEMS structure 5, for example, deflections can be generated, which are transmitted to the membrane 3. The MEMS structure 5 can convert, for example, electrical signals, which may include an audio signal, into the deflections. As a result of the deflection of the membrane 3, an air arranged above the membrane 3 is likewise caused to oscillate, so that the sound waves are formed. The sound transducer arrangement 1 can thus be operated as a loudspeaker.

When 3 sound waves are picked up with the help of the diaphragm, the oscillating air causes the diaphragm 3 to vibrate. The vibrations can be transmitted from the membrane 3 to the MEMS structure 5 by means of the coupling element 18. The MEMS structure 5 can form electrical signals which can correspond to an audio signal.

The MEMS structure 5 may comprise at least one piezoelectric element, not shown here, which forms the deflections when a voltage is applied. With the help of the piezoelectric element, the deflection can also be converted into a voltage. The voltage can correspond to the audio signal.

In addition, the sound transducer assembly 1 on a support unit 6. On the carrier unit 6, the acoustic unit 2 and the MEMS unit 4 are arranged. The support unit 6 comprises a metallic lead frame 7 and a plastic body 8. The lead frame 7 is partially remelted by the plastic body 8. With the help of the lead frame 7 and the plastic body 8, the support unit 6 can be made more stable. In addition, the metallic lead frame 7 in a simple manner, for example by means of punching, are formed. In addition, the metallic lead frame 7 can also be made simpler if no high electrical requirements are placed on it.

With the help of the plastic body 8, for example, the acoustic unit 2 can be decoupled from the lead frame 7 against transmission of unwanted vibrations when, as shown in Figure 1, the acoustic unit 2 is arranged on the plastic body 8.

In an advantageous development of the invention, the carrier unit 6 has an opening 9. The MEMS structure 5 can at least partially cover the opening 9. The breakthrough 9 has the advantage that the MEMS structure 5 can swing freely into the opening 9. The

MEMS structure 5 can thus freely swing away from the membrane 3 in the axial direction X. In this case, the MEMS structure 5 pulls the membrane 3 with it. The coupling element 18 can also transmit a tensile force between the membrane 3 and the MEMS structure 5. The deflection of the MEMS structure 5 is thus not hindered by a background.

The opening 9 can also be surrounded by a support area 10. The support portion 10 may be formed as a support frame, which surrounds the opening 9. The support portion 10 may, as shown in Figure 1, be formed by the lead frame 7. In the support area 10, the MEMS unit 4 is advantageously arranged. The support area 10 carries the MEMS unit 4. Furthermore, according to the present exemplary embodiment, at least one first base element 21a, 21b is arranged on a first end face 19 of the carrier unit 6. The at least one first base element 21 a, 21 b may be arranged at least partially around the support region 10. In the present exemplary embodiment, two first base elements 21 a, 21 b are arranged around the support region 10. On the at least one first base element 21 a, 21 b, the acoustic unit 2 is arranged. The acoustic unit 2 can for example be glued to the at least one first base element 21 a, 21 b. As shown in FIG. 1, the acoustic unit 2 can have an acoustic frame 27 on which the membrane 3 is mounted. In the present exemplary embodiment, the acoustic frame 27 is arranged on the at least one first base element 21 a, 21 b. The acoustic frame 27 may also be formed, for example, as a ring.

The at least one first base element 21 a, 21 b may be formed by the lead frame 7. Additionally or alternatively, the at least one first base element 21 a, 21 b may be formed by the plastic body 8. In the present embodiment, the at least one first base element 21 a, 21 b formed by the plastic body 8.

In addition, according to FIG. 1, at least one second base element 22a, 22b is arranged on a second end face 20 opposite the first end face 19. The at least one second base element 22a, 22b can be arranged at least partially around the support region 10. In the present exemplary embodiment, two second base elements 22a, 22b are arranged around the support region 10. On the at least one second base element 22a, 22b, a cover element, not shown here, can be arranged.

The cover element can, for example, be adhesively bonded to the at least one second base element 22a, 22b. The at least one second base element 22a, 22b may be formed by the lead frame 7. Additionally or alternatively, the at least one second base element 22a, 22b may be formed by the plastic body 8. In the present exemplary embodiment, the at least one second base element 22a, 22b is formed by the plastic body 8.

Furthermore, a first cavity 23 is formed between the acoustic unit 2 and the carrier unit 6. If the cover element is arranged on the at least one second base element 22a, 22b, a second cavity 24 is formed between the carrier unit 6 and the cover element.

In the lead frame 7 and / or in the plastic body 8 at least one compensation opening 17 is arranged. According to the present embodiment of Figure 1, two compensation openings 17a, 17b are arranged. With the aid of the at least one compensating opening 17 a, 17 b, a pressure between the first cavity 23 and the second cavity 24 can be compensated. The pressure is then formed when the diaphragm 3 vibrates and the volume of the first cavity 23 is reduced and increased. As a result, the vibration of the diaphragm 3 is hindered and may, for example, distort the recorded audio signal when the sound transducer assembly 1 is operated as a microphone.

FIG. 2 shows a plan view of the metallic lead frame 7 of the support unit 6 of the sound transducer arrangement 1. The lead frame 7 is further partially remelted from the plastic body 8. In the plan views shown in Figure 2 and Figure 3, the plastic body 8 is shown hatched for better visibility. These are not necessarily sectional views.

The carrier unit 6 is round in this embodiment. For this purpose, the lead frame 7 is so melted from the plastic body 8, that the support unit 6 is formed round. The support unit 6 can also be angular, for example rectangular, or elliptical. The carrier Gearing unit 6 may also have several areas, which is formed according to various, for example, above, forms.

Furthermore, the carrier unit 6 on the opening 9. The opening 9 is an opening which passes through the carrier unit 6. The opening 9 is at least partially surrounded by the support portion 10. According to FIG. 2, the support area 10 completely surrounds the opening 9. The support portion 10 may further be formed as a support frame. The support region 10 may preferably be formed at least partially by the lead frame 7. However, the support area 10 may additionally or alternatively also be formed by the plastic body 8. Furthermore, the MEMS unit 4 of the sound transducer arrangement 1 can be arranged in the support region 10. The MEMS unit 4 can completely cover the opening 9. For this purpose, the opening 9 may be formed, for example, in the dimensions such that it corresponds to the size of the MEMS unit 4. The MEMS unit 4 can be arranged, for example, with its edge regions in the support region 10.

In this embodiment, the lead frame 7 frame struts 1 1 a, 1 1 b and intermediate frame openings 12a, 12b. For the sake of simplicity, only two frame struts 11a, 11b and two frame openings 12a, 12b are provided with a reference numeral by way of example.

According to Figure 2, the frame struts 1 1 extend radially outward. In the embodiment shown here, the frame struts 1 1 extend from the opening 9 to the outside. The frame struts 1 1 may further extend away from the support portion 10 to the outside.

The frame struts 1 1 have at least a portion which extends radially outward. The frame struts 1 1 thus extend in a radial direction to the outside. The radial direction is perpendicular to the Axial direction X of the carrier unit 6. The axial direction X extends in the present figure 1 perpendicular to the plane of the drawing.

In a first region 13, the frame struts 1 1 can extend parallel to each other outwards. The frame struts 1 1 extend in the first region 13 in a proportion radially outward.

In a first region 13 radially further outwardly arranged second region 14, the frame struts 1 1 to each other at an angle. The frame struts 1 1 run apart in the second region 14.

Between the first region 13 and the second region 14, according to FIG. 1, a kink 15 is arranged in the frame struts 11. For simplicity, only a kink of a frame strut 1 1 is provided with a reference numeral.

The frame struts 1 1 also have in this embodiment on the plastic body 8 projecting free ends 16. Again, only a free end 16 is provided with a reference numeral for the sake of simplicity.

The free ends 16 may be bent over. The bent free ends 16 are shown in FIG. According to FIG. 1, the free ends 16 are bent in the axial direction X towards the second end face 20 of the carrier unit 6. Alternatively, the free ends 16 may also be bent in the axial direction X towards the first end face 19. Again alternatively, a portion of the free ends 16 to the first end face 19 and another part of the free ends 16 to the second end face 20 may be bent. By means of the bent-over ends 16 of the frame struts 11, the sound transducer arrangement 1 can be arranged, for example, in a housing 28, not shown here (see FIG. The bent free ends 16 can thereby enlarge a contact surface between the frame struts 1 1 and the housing 28, so that the sound transducer assembly 1 can be better fixed in the housing 28.

In the present exemplary embodiment, the carrier unit 6 has at least one compensating opening 17a, 17b. According to FIG. 2, the carrier unit 6 has two compensation openings 17a, 17b. With the aid of the at least one compensating opening 17a, 17b, a pressure between the first cavity 23 and the second cavity 24 can be compensated (see FIG.

Furthermore, in the exemplary embodiment of FIG. 2, the at least one first base element 21 is shown. Here only a single base element 21 is arranged on the carrier unit 6. In addition, the first base member 21 is annular. About the base member 21, the free ends 16 of the frame struts 1 1 extend radially outward.

Additionally or alternatively, the at least second base element 22 may also be annular.

Figure 3 shows a plan view of a support unit 6 with a lead frame 7 and a plastic body 8 in an alternative embodiment. In this exemplary embodiment, the support region 10, which may be designed as a support frame, has at least one electrically conductive contact region 25. The contact region 25 is also part of the lead frame 7. For the sake of simplicity, in this embodiment, only one contact region 25 is provided with a reference numeral.

Here are two contact areas 25 are interrupted by the plastic body 8. With the help of the plastic body 8, two contact areas 25 are electrically isolated from each other. With the aid of the contact regions 25, electrical signals, in particular audio signals, can be led to the MEMS unit 4 and / or led away from the MEMS unit 4. When the MEMS unit 4 is arranged in the support region 10, at least one edge region lies at the same time MEMS unit 4 above the contact regions 25. With the aid of corresponding connection sections 26 (see FIG. 5) of the MEMS unit 4, in particular in the edge region, an electrical connection can be established from the MEMS unit 4 via the connection sections 26 to the contact regions 25 become. The corresponding connection sections 26 lie in the contact regions 25. The MEMS unit 4 can furthermore be arranged in the support region 10 by means of a solder connection and / or an electrically conductive adhesive connection. Additionally or alternatively, the solder connection and / or the electrically conductive adhesive connection can also connect the MEMS unit 4, in particular the connection sections 26, to the corresponding contact regions 25.

Likewise, it is advantageous if, as shown in the embodiment of Figure 3, the respective contact areas 25 are electrically conductively connected to one frame strut 1 1. As a result, the electrical signals, in particular the audio signals and / or electrical energy, can be routed via the frame struts 11 to the MEMS unit 4 and / or led away from the MEMS unit 4. This can be dispensed with additional lines.

FIG. 4 shows a perspective top view of a part of the sound transducer arrangement 1. The plan view corresponds to a view of the first end face 19 of the carrier unit 6.

In the support area 10 covered here, the MEMS unit 4 is arranged, which comprises the MEMS structure 5. On the MEMS structure 5, the coupling element 18 is arranged to connect the MEMS structure 5 with the membrane 3, not shown.

The sound transducer assembly 1 comprises on the support unit 6, the first base member 21 which is annular in this embodiment and revolves around the support portion 10. On the first base element 21, the acoustic unit 2 can be arranged with the membrane.

FIG. 5 shows a perspective rear view of a part of the sound transducer arrangement 1. The view is here on the second end face 20 of the carrier unit 6. In the rear view, the MEMS structure 5 of the MEMS unit 4 can be recognized by the opening 9. In this exemplary embodiment, the MEMS unit 4 has at least one connection section 26. For the sake of simplicity, only a single connection section 26 is again provided with a reference numeral. With the aid of the connection sections 26, an electrical connection to the contact regions 25 of FIG. 3 can be produced. As a result, electric signals, in particular audio signals, and / or electrical energy can be led to the MEMS unit 4 and / or led away from the MEMS unit 4 via the frame struts 11.

Furthermore, the carrier unit 6 has the second base element 22. The second base element 22 is here annular. The second base element 22 also surrounds the opening 9. A cover element can be arranged on the second base element 22.

FIG. 6 shows a housing 28 with the sound transducer arrangement 1 arranged therein. The sound transducer assembly 1 comprises in this embodiment frame struts 1 1, wherein only one frame strut 1 1 is shown. The frame struts 1 1 include the ends 16 a, 16 b, by means of which the sound transducer assembly 1 is connected to the housing 28. The ends 16a, 16b are bent over so that a contact area between the ends 16a, 16b and the housing 28 increases. The ends 16 may be glued, screwed and / or locked, for example, with the housing 28. The sound transducer assembly 1 can thereby be arranged more stable in the housing 28. The sound transducer assembly 1 further defines a resonance chamber 29 in the housing 28, so that a part of the resonance chamber 29 forms a rear volume 30. The rear volume 30 is arranged on the side of the second end face 20 of the sound transducer arrangement 1. The rear volume 30 can be easily adapted in size, for example, if the sound transducer assembly 1 is further arranged in the direction of a central region of the housing 28. As a result, the rear volume 30 is smaller than the rear volume 30 shown in FIG. As a result, resonance properties of the rear volume 30 can be adapted.

According to the present exemplary embodiment of FIG. 6, the sound transducer arrangement 1 has a coupling element 32. The coupling element 32 is arranged on the acoustic frame 27. Between the membrane 3 and the coupling element 32, a front volume 31 is formed. According to a shape of the coupling element 32, the shape of the front volume 31 can be adjusted. If the coupling element 32, for example, further arched away from the membrane 3, the front volume 31 increases. Thereby, the resonance characteristics of the front volume 31 can be adjusted.

The coupling element 32 arranged on the sound transducer arrangement 1 in this exemplary embodiment of FIG. 6 also has a first outlet opening 33. Through the first outlet opening 33, the sound generated by the membrane 3 can escape. Additionally or alternatively, the sound can pass through the first outlet opening 33 to the membrane 3 when the sound is detected.

Furthermore, the housing 28 has a second outlet opening 34. Through the second outlet opening 34, the sound, which is generated by the sound transducer assembly 1, emerge from the housing 28. Additionally or alternatively, the sound can also enter through the second outlet opening when the sound is detected by the sound transducer arrangement 1. The present invention is not limited to the illustrated and described embodiments. Variations within the scope of the claims are also possible as a combination of features, even if they are shown and described in different embodiments.

LIST OF REFERENCE NUMBERS

Transducer array

acoustic unit

membrane

MEMS unit

MEMS structure

support unit

lead frame

Plastic body

breakthrough

support area

frame strut

frame opening

first area

second area

kink

free end

Compensation breakthrough

coupling element

first end face

second end face

first base element

second base element

first cavity

second cavity

contact area

connecting section

acoustic frame

casing

resonant cavity

back volume Front volume coupling element first outlet opening second outlet opening axial direction

Claims

Patent claims

1 . Sound transducer assembly (1) for generating and / or detecting sound waves in the audible wavelength spectrum

comprising an acoustic unit (2) comprising a vibratable membrane (3) with a MEMS unit (4) having a MEMS structure (5) coupled to the membrane (3) for generating and / or detecting a deflection the membrane (3) comprises, and

with a carrier unit (6), on which the MEMS unit (4) and the acoustic unit (2) are arranged,

characterized,

the support unit (6) comprises a metallic lead frame (7) and a plastic body (8) with which the lead frame (7) is partially remelted.

Second sound transducer assembly according to the preceding claim, characterized in that the carrier unit (6), preferably in a central region, an opening (9), at least partially by a support portion (10), in particular a support frame, for receiving the MEMS unit (4) is bordered.

3. Sound transducer arrangement according to one of the preceding claims,

characterized in that the lead frame (7) frame struts (1 1) and intermediate frame openings (12), preferably extending the frame struts (1 1) radially from the support portion (10) to the outside, and / or

in that the plastic body (8) fills at least part of the frame openings (12) between the frame struts (1 1), in particular completely.

4. Sound transducer arrangement according to one of the preceding claims, characterized in that the support region (10) through the lead frame (7) and / or the plastic body (8) is formed.

5. A sound transducer assembly according to one of the preceding claims, characterized in that the support region (10) and / or the lead frame (7) has at least one electrical contact region (25), wherein at least two contact regions (25), these preferably from the plastic body (8) electrically isolated from each other,

and or

in that at least one contact region (25) is electrically conductively connected to the lead frame (7) or to at least one frame strut (11).

6. A sound transducer arrangement according to one of the preceding claims, characterized in that the MEMS unit (4) has at least one connection section (26) for transmitting audio signals and / or electrical energy, by means of a solder connection and / or an electrically conductive adhesive connection with the Contact area (25) is electrically connected.

7. A sound transducer arrangement according to one of the preceding claims, characterized in that the carrier unit (6), in particular adjacent to the MEMS unit (4), has an ASIC recording in which an ASIC for controlling the sound transducer arrangement (1) can be arranged, and or

in that the ASIC receptacle has an electrical connection to the lead frame (7) and / or to at least one frame strut (1 1), so that the audio signals and / or the electrical energy between the ASIC and the MEMS unit (4) and / or an external unit are interchangeable.

8. A sound transducer arrangement according to one of the preceding claims, characterized in that on a first end face (19) of the carrier unit (6) at least one, in particular annular, first base element (21) is arranged around the support region (10), wherein on the first base element (21) the acoustic unit (2) is arranged, and / or that between the acoustic unit (2) and the carrier unit (6), a first cavity (23) is formed.

9. sound transducer arrangement according to one of the preceding claims,

characterized in that at least one, in particular annular, second base element (22) is arranged around the support area (10) on a second end face (20) opposite the first base element (21) and / or

in that a cover element can be arranged on the second base element (22) so that a second cavity (24) can be formed between the cover element and the carrier unit (6).

10. Sound transducer arrangement according to one of the preceding claims,

characterized in that the first and / or the second base element (21, 22) through the plastic body (8) is formed.

1 1. Sound transducer arrangement according to one of the preceding claims,

characterized in that the carrier unit (6) comprises at least one compensating opening (17), by means of which a pressure between the first and the second cavity (23, 24) can be compensated.

12. Sound transducer arrangement according to one of the preceding claims,

characterized in that at least a part of the frame struts (1 1) project radially outwardly beyond the first and / or second base element (21, 22) and / or in the region of their ends (16) are connected to a housing (28).

13. A sound transducer arrangement according to one of the preceding claims, characterized in that the ends (16) of at least part of the frame struts (1 1) in the axial direction (X) on the side of the first and / or second end face (19, 20) are bent.

14. A sound transducer assembly according to one of the preceding claims, characterized in that at least a portion of the free ends (16) of the frame struts (1 1) bonded to the housing (28), screwed and / or locked.