EP3532248A1 - Bonded abrasive wheel and method of making the same - Google Patents
Bonded abrasive wheel and method of making the sameInfo
- Publication number
- EP3532248A1 EP3532248A1 EP17864183.3A EP17864183A EP3532248A1 EP 3532248 A1 EP3532248 A1 EP 3532248A1 EP 17864183 A EP17864183 A EP 17864183A EP 3532248 A1 EP3532248 A1 EP 3532248A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- magnetizable
- abrasive
- layer
- bonded abrasive
- abrasive wheel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000002245 particle Substances 0.000 claims abstract description 143
- 239000011230 binding agent Substances 0.000 claims abstract description 135
- 230000000717 retained effect Effects 0.000 claims abstract description 18
- 239000000919 ceramic Substances 0.000 claims description 88
- 239000000203 mixture Substances 0.000 claims description 71
- 239000002243 precursor Substances 0.000 claims description 62
- 238000000034 method Methods 0.000 claims description 50
- 230000005291 magnetic effect Effects 0.000 claims description 34
- 239000012779 reinforcing material Substances 0.000 claims description 30
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 18
- 239000000945 filler Substances 0.000 claims description 7
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 6
- 230000000994 depressogenic effect Effects 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 38
- 239000000463 material Substances 0.000 description 34
- 238000000227 grinding Methods 0.000 description 31
- 229920005989 resin Polymers 0.000 description 24
- 239000011347 resin Substances 0.000 description 24
- -1 Nd2Fe14B) Chemical compound 0.000 description 21
- 239000011521 glass Substances 0.000 description 20
- 229920001568 phenolic resin Polymers 0.000 description 18
- 229920000647 polyepoxide Polymers 0.000 description 18
- 239000005011 phenolic resin Substances 0.000 description 16
- 239000000377 silicon dioxide Substances 0.000 description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 14
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 14
- 239000003822 epoxy resin Substances 0.000 description 14
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 14
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 14
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 13
- 239000000126 substance Substances 0.000 description 13
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 11
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 239000000292 calcium oxide Substances 0.000 description 9
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 8
- 239000010941 cobalt Substances 0.000 description 8
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- 229910052593 corundum Inorganic materials 0.000 description 8
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 8
- 239000000395 magnesium oxide Substances 0.000 description 8
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 8
- 229910001845 yogo sapphire Inorganic materials 0.000 description 8
- 239000005388 borosilicate glass Substances 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 7
- 125000002091 cationic group Chemical group 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 229910052681 coesite Inorganic materials 0.000 description 7
- 229910052906 cristobalite Inorganic materials 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 229920003986 novolac Polymers 0.000 description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 7
- 229910052682 stishovite Inorganic materials 0.000 description 7
- 229910052905 tridymite Inorganic materials 0.000 description 7
- 239000011787 zinc oxide Substances 0.000 description 7
- 235000014692 zinc oxide Nutrition 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- 239000003082 abrasive agent Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 229920003180 amino resin Polymers 0.000 description 6
- 229910017052 cobalt Inorganic materials 0.000 description 6
- 125000003700 epoxy group Chemical group 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- FUJCRWPEOMXPAD-UHFFFAOYSA-N lithium oxide Chemical compound [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000001993 wax Substances 0.000 description 6
- 229910000859 α-Fe Inorganic materials 0.000 description 6
- 229910011255 B2O3 Inorganic materials 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 5
- 229910000640 Fe alloy Inorganic materials 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000005308 ferrimagnetism Effects 0.000 description 5
- 239000002241 glass-ceramic Substances 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 5
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 238000005240 physical vapour deposition Methods 0.000 description 5
- 235000013824 polyphenols Nutrition 0.000 description 5
- 229910001950 potassium oxide Inorganic materials 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 229920003987 resole Polymers 0.000 description 5
- 229910001948 sodium oxide Inorganic materials 0.000 description 5
- 229920001169 thermoplastic Polymers 0.000 description 5
- 239000004416 thermosoftening plastic Substances 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 150000003673 urethanes Chemical class 0.000 description 5
- 239000010963 304 stainless steel Substances 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 4
- 239000011324 bead Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- 229910001610 cryolite Inorganic materials 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 4
- 230000005294 ferromagnetic effect Effects 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229920003261 Durez Polymers 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229920001807 Urea-formaldehyde Polymers 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 229910052810 boron oxide Inorganic materials 0.000 description 3
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000011222 crystalline ceramic Substances 0.000 description 3
- 229910002106 crystalline ceramic Inorganic materials 0.000 description 3
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000010433 feldspar Substances 0.000 description 3
- 230000005307 ferromagnetism Effects 0.000 description 3
- 239000002223 garnet Substances 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 229910001947 lithium oxide Inorganic materials 0.000 description 3
- 239000000314 lubricant Substances 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 229910052752 metalloid Inorganic materials 0.000 description 3
- 150000002738 metalloids Chemical class 0.000 description 3
- 125000002524 organometallic group Chemical group 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004848 polyfunctional curative Substances 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- 239000005368 silicate glass Substances 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- CQGDBBBZCJYDRY-UHFFFAOYSA-N 1-methoxyanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2OC CQGDBBBZCJYDRY-UHFFFAOYSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 description 2
- 229910052580 B4C Inorganic materials 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 206010073306 Exposure to radiation Diseases 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 235000019738 Limestone Nutrition 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- 229910033181 TiB2 Inorganic materials 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229910000828 alnico Inorganic materials 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 150000004056 anthraquinones Chemical class 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 229910021418 black silicon Inorganic materials 0.000 description 2
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 2
- 235000012241 calcium silicate Nutrition 0.000 description 2
- 229910052918 calcium silicate Inorganic materials 0.000 description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 2
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- AYTAKQFHWFYBMA-UHFFFAOYSA-N chromium dioxide Chemical compound O=[Cr]=O AYTAKQFHWFYBMA-UHFFFAOYSA-N 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000005293 ferrimagnetic effect Effects 0.000 description 2
- 239000002902 ferrimagnetic material Substances 0.000 description 2
- 239000003302 ferromagnetic material Substances 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 239000012948 isocyanate Chemical class 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 239000006028 limestone Substances 0.000 description 2
- 230000005415 magnetization Effects 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 239000004579 marble Substances 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229910001172 neodymium magnet Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000002667 nucleating agent Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 150000004760 silicates Chemical class 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 235000017550 sodium carbonate Nutrition 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 2
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- JRZKNHITLINYHV-UHFFFAOYSA-N 1,2,3,4,5-pentachloronaphthalene Chemical compound ClC1=CC=CC2=C(Cl)C(Cl)=C(Cl)C(Cl)=C21 JRZKNHITLINYHV-UHFFFAOYSA-N 0.000 description 1
- NAQWICRLNQSPPW-UHFFFAOYSA-N 1,2,3,4-tetrachloronaphthalene Chemical compound C1=CC=CC2=C(Cl)C(Cl)=C(Cl)C(Cl)=C21 NAQWICRLNQSPPW-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 description 1
- DVFAVJDEPNXAME-UHFFFAOYSA-N 1,4-dimethylanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C(C)=CC=C2C DVFAVJDEPNXAME-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- PBGPBHYPCGDFEZ-UHFFFAOYSA-N 1-ethenylpiperidin-2-one Chemical compound C=CN1CCCCC1=O PBGPBHYPCGDFEZ-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- VOBUAPTXJKMNCT-UHFFFAOYSA-N 1-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound CCCCCC(OC(=O)C=C)OC(=O)C=C VOBUAPTXJKMNCT-UHFFFAOYSA-N 0.000 description 1
- PUGOMSLRUSTQGV-UHFFFAOYSA-N 2,3-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OCC(OC(=O)C=C)COC(=O)C=C PUGOMSLRUSTQGV-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- LRRQSCPPOIUNGX-UHFFFAOYSA-N 2-hydroxy-1,2-bis(4-methoxyphenyl)ethanone Chemical compound C1=CC(OC)=CC=C1C(O)C(=O)C1=CC=C(OC)C=C1 LRRQSCPPOIUNGX-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 1
- UNIYDALVXFPINL-UHFFFAOYSA-N 3-(2-methylprop-2-enoyloxy)propylsilicon Chemical compound CC(=C)C(=O)OCCC[Si] UNIYDALVXFPINL-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- YMRDPCUYKKPMFC-UHFFFAOYSA-N 4-hydroxy-2,2,5,5-tetramethylhexan-3-one Chemical compound CC(C)(C)C(O)C(=O)C(C)(C)C YMRDPCUYKKPMFC-UHFFFAOYSA-N 0.000 description 1
- VOLRSQPSJGXRNJ-UHFFFAOYSA-N 4-nitrobenzyl bromide Chemical compound [O-][N+](=O)C1=CC=C(CBr)C=C1 VOLRSQPSJGXRNJ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 229910000521 B alloy Inorganic materials 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 229910052689 Holmium Inorganic materials 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 229910000502 Li-aluminosilicate Inorganic materials 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229930195725 Mannitol Natural products 0.000 description 1
- 241000276489 Merlangius merlangus Species 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229910016987 MnOFe2O3 Inorganic materials 0.000 description 1
- 229910016964 MnSb Inorganic materials 0.000 description 1
- 229910017034 MnSn Inorganic materials 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 229910000503 Na-aluminosilicate Inorganic materials 0.000 description 1
- 229910000583 Nd alloy Inorganic materials 0.000 description 1
- 229910004291 O3.2SiO2 Inorganic materials 0.000 description 1
- 229910004288 O3.5SiO2 Inorganic materials 0.000 description 1
- 101150108813 PMIX gene Proteins 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229920001800 Shellac Polymers 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000612 Sm alloy Inorganic materials 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 229910009493 Y3Fe5O12 Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910001308 Zinc ferrite Inorganic materials 0.000 description 1
- LFOXEOLGJPJZAA-UHFFFAOYSA-N [(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)phosphoryl]-(2,6-dimethoxyphenyl)methanone Chemical compound COC1=CC=CC(OC)=C1C(=O)P(=O)(CC(C)CC(C)(C)C)C(=O)C1=C(OC)C=CC=C1OC LFOXEOLGJPJZAA-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- APZPSKFMSWZPKL-UHFFFAOYSA-N [3-hydroxy-2,2-bis(hydroxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(CO)CO APZPSKFMSWZPKL-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- HZVVJJIYJKGMFL-UHFFFAOYSA-N almasilate Chemical compound O.[Mg+2].[Al+3].[Al+3].O[Si](O)=O.O[Si](O)=O HZVVJJIYJKGMFL-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- CNLWCVNCHLKFHK-UHFFFAOYSA-N aluminum;lithium;dioxido(oxo)silane Chemical compound [Li+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O CNLWCVNCHLKFHK-UHFFFAOYSA-N 0.000 description 1
- 229910052661 anorthite Inorganic materials 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 230000005303 antiferromagnetism Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- 229910001570 bauxite Inorganic materials 0.000 description 1
- LHMRXAIRPKSGDE-UHFFFAOYSA-N benzo[a]anthracene-7,12-dione Chemical compound C1=CC2=CC=CC=C2C2=C1C(=O)C1=CC=CC=C1C2=O LHMRXAIRPKSGDE-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- CSXPRVTYIFRYPR-UHFFFAOYSA-N bis(ethenyl)-diethoxysilane Chemical compound CCO[Si](C=C)(C=C)OCC CSXPRVTYIFRYPR-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- FPODCVUTIPDRTE-UHFFFAOYSA-N bis(prop-2-enyl) hexanedioate Chemical compound C=CCOC(=O)CCCCC(=O)OCC=C FPODCVUTIPDRTE-UHFFFAOYSA-N 0.000 description 1
- NFMAZVUSKIJEIH-UHFFFAOYSA-N bis(sulfanylidene)iron Chemical compound S=[Fe]=S NFMAZVUSKIJEIH-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 229910000877 bismanol Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000000404 calcium aluminium silicate Substances 0.000 description 1
- 235000012215 calcium aluminium silicate Nutrition 0.000 description 1
- WNCYAPRTYDMSFP-UHFFFAOYSA-N calcium aluminosilicate Chemical compound [Al+3].[Al+3].[Ca+2].[O-][Si]([O-])=O.[O-][Si]([O-])=O.[O-][Si]([O-])=O.[O-][Si]([O-])=O WNCYAPRTYDMSFP-UHFFFAOYSA-N 0.000 description 1
- 229940078583 calcium aluminosilicate Drugs 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- 239000010960 cold rolled steel Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 239000007799 cork Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 150000001913 cyanates Chemical class 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- GWWPLLOVYSCJIO-UHFFFAOYSA-N dialuminum;calcium;disilicate Chemical compound [Al+3].[Al+3].[Ca+2].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] GWWPLLOVYSCJIO-UHFFFAOYSA-N 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- KTQYJQFGNYHXMB-UHFFFAOYSA-N dichloro(methyl)silicon Chemical compound C[Si](Cl)Cl KTQYJQFGNYHXMB-UHFFFAOYSA-N 0.000 description 1
- VTEHVUWHCBXMPI-UHFFFAOYSA-N dichloro-bis(prop-2-enyl)silane Chemical compound C=CC[Si](Cl)(Cl)CC=C VTEHVUWHCBXMPI-UHFFFAOYSA-N 0.000 description 1
- OLLFKUHHDPMQFR-UHFFFAOYSA-N dihydroxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](O)(O)C1=CC=CC=C1 OLLFKUHHDPMQFR-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- YZEPTPHNQLPQIU-UHFFFAOYSA-M dimethyl-[2-(2-methylprop-2-enoyloxy)ethyl]-(3-trimethoxysilylpropyl)azanium;chloride Chemical compound [Cl-].CO[Si](OC)(OC)CCC[N+](C)(C)CCOC(=O)C(C)=C YZEPTPHNQLPQIU-UHFFFAOYSA-M 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 229910001651 emery Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 229910001940 europium oxide Inorganic materials 0.000 description 1
- AEBZCFFCDTZXHP-UHFFFAOYSA-N europium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Eu+3].[Eu+3] AEBZCFFCDTZXHP-UHFFFAOYSA-N 0.000 description 1
- 229910000830 fernico Inorganic materials 0.000 description 1
- 229910000977 fernicos II Inorganic materials 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000012847 fine chemical Substances 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 1
- 229910001676 gahnite Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910001678 gehlenite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 150000002357 guanidines Chemical class 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 229910001291 heusler alloy Inorganic materials 0.000 description 1
- KJZYNXUDTRRSPN-UHFFFAOYSA-N holmium atom Chemical compound [Ho] KJZYNXUDTRRSPN-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- 229910000339 iron disulfide Inorganic materials 0.000 description 1
- MTRJKZUDDJZTLA-UHFFFAOYSA-N iron yttrium Chemical compound [Fe].[Y] MTRJKZUDDJZTLA-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-IHWYPQMZSA-N isocrotonic acid Chemical compound C\C=C/C(O)=O LDHQCZJRKDOVOX-IHWYPQMZSA-N 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate Chemical compound [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000594 mannitol Substances 0.000 description 1
- 235000010355 mannitol Nutrition 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 229940086559 methyl benzoin Drugs 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- 239000005048 methyldichlorosilane Substances 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 229940088644 n,n-dimethylacrylamide Drugs 0.000 description 1
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 description 1
- FOGSDLLFGSNQCW-UHFFFAOYSA-N n-[(prop-2-enoylamino)methoxymethyl]prop-2-enamide Chemical compound C=CC(=O)NCOCNC(=O)C=C FOGSDLLFGSNQCW-UHFFFAOYSA-N 0.000 description 1
- YPHQUSNPXDGUHL-UHFFFAOYSA-N n-methylprop-2-enamide Chemical compound CNC(=O)C=C YPHQUSNPXDGUHL-UHFFFAOYSA-N 0.000 description 1
- NQNBVCBUOCNRFZ-UHFFFAOYSA-N nickel ferrite Chemical compound [Ni]=O.O=[Fe]O[Fe]=O NQNBVCBUOCNRFZ-UHFFFAOYSA-N 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 150000002898 organic sulfur compounds Chemical class 0.000 description 1
- 150000001282 organosilanes Chemical class 0.000 description 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N oxalic acid group Chemical group C(C(=O)O)(=O)O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 1
- AJCDFVKYMIUXCR-UHFFFAOYSA-N oxobarium;oxo(oxoferriooxy)iron Chemical compound [Ba]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O AJCDFVKYMIUXCR-UHFFFAOYSA-N 0.000 description 1
- 125000005489 p-toluenesulfonic acid group Chemical class 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000005054 phenyltrichlorosilane Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229910000702 sendust Inorganic materials 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 235000013874 shellac Nutrition 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical class F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 description 1
- 239000000429 sodium aluminium silicate Substances 0.000 description 1
- 235000012217 sodium aluminium silicate Nutrition 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 235000019794 sodium silicate Nutrition 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 229910001495 sodium tetrafluoroborate Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 229910052642 spodumene Inorganic materials 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 150000003608 titanium Chemical class 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- ZOYFEXPFPVDYIS-UHFFFAOYSA-N trichloro(ethyl)silane Chemical compound CC[Si](Cl)(Cl)Cl ZOYFEXPFPVDYIS-UHFFFAOYSA-N 0.000 description 1
- KWDQAHIRKOXFAV-UHFFFAOYSA-N trichloro(pentyl)silane Chemical compound CCCCC[Si](Cl)(Cl)Cl KWDQAHIRKOXFAV-UHFFFAOYSA-N 0.000 description 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- FYUZFGQCEXHZQV-UHFFFAOYSA-N triethoxy(hydroxy)silane Chemical compound CCO[Si](O)(OCC)OCC FYUZFGQCEXHZQV-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- FHVAUDREWWXPRW-UHFFFAOYSA-N triethoxy(pentyl)silane Chemical compound CCCCC[Si](OCC)(OCC)OCC FHVAUDREWWXPRW-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- HGCVEHIYVPDFMS-UHFFFAOYSA-N trimethoxy(7-oxabicyclo[4.1.0]heptan-4-ylmethyl)silane Chemical compound C1C(C[Si](OC)(OC)OC)CCC2OC21 HGCVEHIYVPDFMS-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea group Chemical group NC(=O)N XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000001238 wet grinding Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 229910052844 willemite Inorganic materials 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- WGEATSXPYVGFCC-UHFFFAOYSA-N zinc ferrite Chemical compound O=[Zn].O=[Fe]O[Fe]=O WGEATSXPYVGFCC-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/14—Zonally-graded wheels; Composite wheels comprising different abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/346—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties utilised during polishing, or grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
Definitions
- the present disclosure broadly relates to bonded abrasive articles and methods of making and using them.
- Bonded abrasive wheels include abrasive rods bonded together by a bonding medium (i.e., a binder) in the shape of a circular wheel, typically around a central hub. Bonded abrasive wheels include, for example, grinding wheels and cut-off wheels.
- the bonding medium may be an organic resin (e.g., resin bond wheels), but may also be an inorganic material such as a ceramic or glass (i.e., vitreous bond wheels).
- Grinding wheels of various shapes may be driven by a stationary-mounted motor such as, for example, a bench grinder, or attached and driven by a hand-operated portable grinder.
- Hand-operated portable grinders are typically held at a slight angle relative to the workpiece surface, and may be used to grind, for example, welding beads, flash, gates, and risers off castings.
- Grinding wheels used with handheld angle grinders are typically thin wheels of modest diameter (e.g., 4 to 9 inches (10 to 23 cm)) that resemble cut-off wheels in their construction, but in use they are contacted with the workpiece being abraded at an angle generally less than about 45 degrees, in contrast with cut-off wheels that are used at angles typically closer to 90 degrees.
- abrasive rods that include rod-shaped abrasive rods (hereinafter “abrasive rods”) are known. Certain abrasive rods are made be a sol-gel extrusion process using an alumina precursor, followed by firing the alumina precursor to form alpha alumina.
- abrasive rods are made be a sol-gel extrusion process using an alumina precursor, followed by firing the alumina precursor to form alpha alumina.
- U.S. Pat. Nos.3,183,071 (Rue et al.) and 3,481,723 disclose grinding wheels for use in heavy duty snagging operations made with extruded rod shaped polycrystalline alpha alumina abrasive grits. Kistler et al.
- U.S. Pat. No.3,495,960 discloses a member formed by a bondable and solidified plastic support element for surface finishing a workpiece to provide a lustrous, transparent and shiny appearance.
- the member has a smooth working surface and is provided with a multiplicity of metallic magnetizable rod-shaped abrasive filaments aligned in substantial parallelism with one another within the member and generally positioned normal to the working surface to define a portion thereof.
- the cutting efficiency and abrasive particle fracture mechanism varies with orientation.
- the abrasive wheel and/or workpiece relative motion is such that an end of the elongated particle is presented at the working surface instead of the elongated abrasive particle side.
- the present inventors have discovered a method of orienting the abrasive particles within a bonded abrasive wheel that can lead to substantially improved abrading performance.
- This alignment is achieved using magnetizable abrasive particles which are aligned by a magnetic field during manufacture of the bonded abrasive wheel.
- the present disclosure provides a bonded abrasive wheel comprising magnetizable abrasive particles retained in a first organic binder, wherein the bonded abrasive wheel has a central portion adjacent to a central hub, wherein the bonded abrasive wheel has an outer circumference and a rotational axis extending through the central hub, wherein a majority of the magnetizable abrasive particles are substantially parallel to the rotational axis.
- the present disclosure further provides a method of making a bonded abrasive wheel, the method comprising steps:
- aligned with refers to the alignment of the rotational axis of a bonded abrasive wheel, refers to the longitudinal axis in the case of a rod, and refers to the largest planar surface of in the case of a platelet.
- central hub refers to the central region of a bonded abrasive wheel that engages and/or contacts a rotatable shaft of a power tool in normal usage. Examples include an arbor hole, an arbor hole lined with a sleeve, grommet or rivet, an arbor hole filled having an insert therein, and a mechanical fastener centrally adhered to the bonded abrasive wheel.
- ceramic refers to any of various hard, brittle, heat- and corrosion-resistant materials made of at least one metallic element (which may include silicon) combined with oxygen, carbon, nitrogen, or sulfur.
- ferrimagnetic refers to materials that exhibit ferrimagnetism.
- Ferrimagnetism is a type of permanent magnetism that occurs in solids in which the magnetic fields associated with individual atoms spontaneously align themselves, some parallel, or in the same direction (as in ferromagnetism), and others generally antiparallel, or paired off in opposite directions (as in antiferromagnetism).
- the magnetic behavior of single crystals of ferrimagnetic materials may be attributed to the parallel alignment; the diluting effect of those atoms in the antiparallel arrangement keeps the magnetic strength of these materials generally less than that of purely ferromagnetic solids such as metallic iron.
- Ferrimagnetism occurs chiefly in magnetic oxides known as ferrites.
- the spontaneous alignment that produces ferrimagnetism is entirely disrupted above a temperature called the Curie point, characteristic of each ferrimagnetic material.
- the Curie point characteristic of each ferrimagnetic material.
- ferromagnetic refers to materials that exhibit ferromagnetism. Ferromagnetism is a physical phenomenon in which certain electrically uncharged materials strongly attract others. In contrast to other substances, ferromagnetic materials are magnetized easily, and in strong magnetic fields the magnetization approaches a definite limit called saturation. When a field is applied and then removed, the magnetization does not return to its original value. This phenomenon is referred to as hysteresis. When heated to a certain temperature called the Curie point, which is generally different for each substance, ferromagnetic materials lose their characteristic properties and cease to be magnetic; however, they become ferromagnetic again on cooling.
- magnetizable layers mean being ferromagnetic or ferrimagnetic at 20°C, or capable of being made so, unless otherwise specified.
- magnetizable layers according to the present disclosure either have, or can be made to have by exposure to an applied magnetic field, a magnetic moment of at least 0.001 electromagnetic units (emu), more preferably at least 0.005 emu, more preferably 0.01 emu, up to an including 0.1 emu, although this is not a requirement.
- magnetic field refers to magnetic fields that are not generated by any astronomical body or bodies (e.g., Earth or the sun).
- magnetic fields used in practice of the present disclosure have a field strength in the region of the magnetizable abrasive particles being oriented of at least about 10 gauss (1 mT), preferably at least about 100 gauss (10 mT), and more preferably at least about 1000 gauss (0.1 T).
- the term “magnetizable” means capable of being magnetized or already in a magnetized state.
- abrasive rod refers to an abrasive particle having a length that is at least 3 times (preferably at least 5 times, at least 8 times, or even at least 10 times) its width and thickness. Rods may be cylindrical or prism-shaped (e.g., a 3-sided, 4-sided, 5-sided, or 6-sided prism), and may be tapered toward it middle or an end.
- shaped ceramic body refers to a ceramic body that has been intentionally shaped (e.g., extruded, die cut, molded, screen-printed) at some point during its preparation such that the resulting ceramic body is non-randomly shaped.
- shaped ceramic body as used herein excludes ceramic bodies obtained by a mechanical crushing or milling operation.
- precise-shaped ceramic body refers to a ceramic body wherein at least a portion of the ceramic body has a predetermined shape that is replicated from a mold cavity used to form a precursor precisely-shaped ceramic body that is sintered to form the precisely-shaped ceramic body.
- rotational axis is reference to a bonded abrasive wheel refers to the axis around which the wheel is rotated during normal usage to abrade a workpiece.
- length refers to the longest dimension of an object.
- width refers to the longest dimension of an object that is perpendicular to its length.
- thickness refers to the longest dimension of an object that is perpendicular to both of its length and width.
- spect ratio refers to the ratio length/thickness of an object.
- substantially means within 35 percent (preferably within 30 percent, more preferably within 25 percent, more preferably within 20 percent, more preferably within 10 percent, and more preferably within 5 percent) of the attribute being referred to.
- FIG.1 is a schematic perspective view of an exemplary bonded abrasive wheel 100 according to one embodiment of the present disclosure.
- FIG.1A is a schematic cross-sectional view of bonded abrasive wheel 100 shown in FIG.1 taken along line 1A-1A.
- FIG.2 is a schematic perspective view of exemplary magnetizable abrasive rod 200 useful for making a bonded abrasive wheel according to the present disclosure.
- FIG.2A is a schematic cross-sectional view of magnetizable abrasive rod 200 taken along line 2A-2A.
- FIG.3 is a schematic top view of exemplary magnetizable shaped abrasive platelet 300 useful for making a bonded abrasive wheel according to the present disclosure.
- FIG.3A is a schematic cross-sectional view of magnetizable shaped abrasive platelet 300 taken along line 3A-3A.
- FIG.4 schematically how magnetic field lines orient magnetic abrasive particles in a mold cavity.
- FIG.5 is a photograph of a cross-section of the bonded abrasive wheel made in Example 1.
- FIG.6 is a photograph of a cross-section of the bonded abrasive wheel made in Comparative Example A.
- Bonded abrasive wheel 100 (shown as a depressed-center bonded abrasive wheel) has a depressed central portion 104 encircling central hub 190 that extends from front surface 124 to back surface 126, which can be used, for example, for attachment to a power driven tool (not shown).
- Primary abrasive layer 120 comprises magnetizable abrasive particles 140 (shown as rods) retained in binder 150.
- Optional secondary abrasive layer 160 comprises abrasive particles 170 (e.g., crushed abrasive particles retained in binder 175.
- Primary abrasive layer 120 optionally further comprises primary reinforcing material 115 adjacent to front surface 124 primary abrasive layer 120.
- Optional secondary abrasive layer 160 optionally further comprises secondary reinforcing material 116 adjacent to back surface 126.
- Optional reinforcing material 117 is sandwiched between, and/or is disposed at the junction of, primary abrasive layer 120 and secondary abrasive layer 160.
- the primary and secondary abrasive layers contact each other, while in other embodiments they a bonded to one another through one or more additional elements (e.g., a layer of a third organic binder optionally including reinforcing material 117).
- more than one (e.g., at least 2, at least 3, at least 4) abrasive layer containing magnetizable abrasive particles may be included in the bonded abrasive wheel.
- These abrasive layers may be prepared under the same or different magnetic field orientations.
- Bonded abrasive wheel 100 has rotational axis 195 around which the wheel rotates in use, and which is generally perpendicular to the disc of the bonded abrasive wheel.
- the magnetizable abrasive particles 140 are aligned substantially parallel to the rotational axis 195.
- Magnetizable abrasive particles useful in practice of the present disclosure each have a respective ceramic body having a magnetizable layer disposed on at least a portion thereof.
- exemplary magnetizable abrasive particle 200 comprises cylindrically-shaped ceramic body 210 having magnetizable layer 220 disposed on its entire outer surface 230.
- exemplary magnetizable abrasive particle 300 comprises truncated triangular ceramic platelets 360 having magnetizable layer 370 disposed on its entire outer surface 330.
- Magnetizable abrasive particle 300 has opposed major surfaces 321, 323 connected to each other by sidewalls 325a, 325b, 325c.
- the magnetizable layer covers the ceramic body thereby enclosing it.
- the magnetizable layer may be a unitary magnetizable material (e.g., vapor-coated magnetizable metal), or it may comprise magnetizable particles in a binder.
- the ceramic bodies are precisely-shaped.
- Exemplary useful magnetizable materials for use in the magnetizable layer may comprise: iron; cobalt; nickel; various alloys of nickel and iron marketed as Permalloy in various grades; various alloys of iron, nickel and cobalt marketed as Fernico, Kovar, FerNiCo I, or FerNiCo II; various alloys of iron, aluminum, nickel, cobalt, and sometimes also copper and/or titanium marketed as Alnico in various grades; alloys of iron, silicon, and aluminum (typically about 85:9:6 by weight) marketed as Sendust alloy; Heusler alloys (e.g., Cu 2 MnSn); manganese bismuthide (also known as Bismanol); rare earth magnetizable materials such as gadolinium, dysprosium, holmium, europium oxide, alloys of neodymium, iron and boron (e.g., Nd 2 Fe 14 B), and alloys of samarium and cobalt (e.g., SmCo
- the magnetizable material comprises at least one metal selected from iron, nickel, and cobalt, an alloy of two or more such metals, or an alloy of at one such metal with at least one element selected from phosphorus and manganese.
- the magnetizable material is an alloy (e.g., Alnico alloy) containing 8 to 12 weight percent (wt. %) aluminum, 15 to 26 wt. % nickel, 5 to 24 wt. % cobalt, up to 6 wt. % copper, up to 1 wt. % titanium, wherein the balance of material to add up to 100 wt. % is iron.
- the magnetizable layer may be deposited using a vapor deposition technique such as, for example, physical vapor deposition (PVD) including magnetron sputtering.
- PVD physical vapor deposition
- PVD metallization of various particles is disclosed in, for example, U.S. Pat. Nos.4,612,242 (Vesley) and 7,727,931 (Brey et al.).
- Metallic magnetizable layers can typically be prepared in this general manner.
- the magnetizable layer includes a binder that retains magnetizable particles.
- the binder may be inorganic (e.g., vitreous) or organic resin-based, and is typically formed from a respective binder precursor.
- Suitable binders for the magnetizable layer may be vitreous or organic, for example, as described for the binder 130 hereinbelow.
- the binder of the magnetizable layer is organic, as high temperature curing conditions for inorganic binder precursor may tend to degrade the magnetizable properties of the magnetizable particles.
- Organic binders are generally prepared by curing (i.e., crosslinking) a resinous organic binder precursor.
- suitable organic binder precursors include thermally-curable resins and radiation-curable resins, which may be cured, for example, thermally and/or by exposure to radiation.
- Exemplary organic binder precursors include glues, phenolic resins, aminoplast resins, urea-formaldehyde resins, melamine-formaldehyde resins, urethane resins, acrylic resins (e.g., aminoplast resins having pendant ⁇ , ⁇ -unsaturated groups, acrylated urethanes, acrylated epoxy resins, acrylated isocyanurates), acrylic monomer/oligomer resins, epoxy resins (including bismaleimide and fluorene-modified epoxy resins), isocyanurate resins, an combinations thereof.
- glues e.g., phenolic resins, aminoplast resins, urea-formaldehyde resins, melamine-formaldehyde resins, urethane resins, acrylic resins (e.g., aminoplast resins having pendant ⁇ , ⁇ -unsaturated groups, acrylated urethanes, acrylated epoxy resins, acrylated isocyanurates),
- Curatives such as thermal initiators, catalysts, photoinitiators, hardeners, and the like may be added to the organic binder precursor, typically selected and in an effective amount according to the resin system chosen.
- Exemplary organic binders can be found in U.S. Pat. No.5,766,277 (DeVoe et al.). Examples of vitreous binders are set forth hereinbelow in the discussion of bonded abrasive wheel manufacture.
- the ceramic bodies may comprise any ceramic material (preferably a ceramic abrasive material), for example, selected from among the ceramic (i.e., not including diamond) materials listed below, and combinations thereof.
- the magnetizable layer is preferably essentially free of (i.e., containing less than 5 weight percent of, preferably containing less than 1 weight percent of) ceramic abrasive materials used in the ceramic body.
- Useful ceramic materials that can be used in ceramic bodies include, for example, alumina (e.g., fused aluminum oxide, heat treated aluminum oxide, white fused aluminum oxide, ceramic aluminum oxide materials such as those commercially available as 3M CERAMIC ABRASIVE GRAIN from 3M Company of St.
- alumina e.g., fused aluminum oxide, heat treated aluminum oxide, white fused aluminum oxide, ceramic aluminum oxide materials such as those commercially available as 3M CERAMIC ABRASIVE GRAIN from 3M Company of St.
- sol-gel derived ceramics e.g., alumina ceramics doped with chromia, ceria, zirconia, titania, silica, and/or tin oxide
- silica e.g., quartz, glass beads, glass bubbles and glass fibers
- feldspar or flint.
- sol-gel derived crushed ceramic particles can be found in U.S. Pat.
- the ceramic material in the ceramic bodies has a Mohs hardness of at least 6, preferably at least 7, and more preferably at least 8, although this is not a requirement.
- the ceramic body may be shaped (e.g., precisely-shaped) or randomly shaped (e.g., crushed). Shaped abrasive particles and precisely-shaped ceramic bodies may be prepared by a molding process using sol-gel technology as described in U.S. Pat. Nos.5,201,916 (Berg); 5,366,523 (Rowenhorst (Re 35,570)); and 5,984,988 (Berg).
- U.S. Pat. No.8,034,137 (Erickson et al.) describes alumina particles that have been formed in a specific shape, then crushed to form shards that retain a portion of their original shape features.
- the ceramic bodies are precisely-shaped (i.e., the ceramic bodies have shapes that are at least partially determined by the shapes of cavities in a production tool used to make them).
- Exemplary shapes of ceramic bodies include cylindrical, vermiform, hourglass-shaped, bow tie shaped, truncated pyramids (e.g., 3-, 4-, 5-, or 6-sided truncated pyramids), truncated cones, and prisms (e.g., 3-, 4-, 5-, or 6-sided prisms), and crushed ceramic abrasive particles.
- Useful ceramic bodies may have an average aspect ratio (i.e., length to thickness ratio) of at least 2, in some embodiments at least 4, in some embodiments at least 5, and in some embodiments at least 8.
- Useful ceramic platelets include triangular ceramic platelets (e.g., triangular prismatic ceramic platelets and truncated triangular ceramic platelets).
- the magnetizable layer may be disposed on the ceramic bodies by any suitable method such as, for example, dip coating, spraying, painting, vapor coating, and powder coating.
- Individual magnetizable abrasive particles may have magnetizable layers with different degrees of coverage and/or locations of coverage.
- the magnetizable particles may have any size, but are preferably much smaller than the ceramic bodies as judged by average particle diameter, preferably 4 to 2000 times smaller, more preferably 100 to 2000 times smaller, and even more preferably 500 to 2000 times smaller, although other sizes may also be used.
- the magnetizable particles may have a Mohs hardness of 6 or less (e.g., 5 or less, or 4 or less), although this is not a requirement.
- the magnetizable abrasive particles preferably have an average particle length of less than or equal to 1500 microns, although average particle sizes outside of this range may also be used.
- useful abrasive particle sizes for magnetizable abrasive particles, and optional non-magnetizable abrasive particles/rods if present typically range from an average length in a range of from at least 1 micron, at least 50 microns, or at least 100 microns up to and including 500, 1000, or even as much as 5 millimeters, or even 10 millimeters, although other lengths may also be used.
- the primary abrasive layer includes magnetizable abrasive particles retained in a first binder.
- the secondary abrasive layer includes non-magnetizable abrasive particles retained in a second binder, which may be the same as or different from the first binder.
- Useful binders may be and organic binder (which may be thermoplastic and/or crosslinked) or an inorganic binder (e.g., vitreous binder).
- the primary abrasive layer is generally provided by dispersing the magnetizable abrasive particles in a suitable binder precursor, optionally in the presence of an appropriate curative (e.g., photoinitiator, thermal curative, and/or catalyst). Simply mixing techniques are generally sufficient to mix the components. Subsequently, the mixture is molded and cured as discussed hereinbelow.
- an appropriate curative e.g., photoinitiator, thermal curative, and/or catalyst.
- the secondary abrasive layer is generally accomplished by dispersing non-magnetizable abrasive particles in a suitable binder precursor, optionally in the presence of an appropriate curative (e.g., photoinitiator, thermal curative, and/or catalyst). Simply mixing techniques are generally sufficient to mix the components. Subsequently, the mixture is molded and cured as discussed hereinbelow.
- an appropriate curative e.g., photoinitiator, thermal curative, and/or catalyst.
- the first organic binder and the second organic binder may be the same or different (e.g., chemically different).
- the first organic binder may be a first phenolic binder and the second organic binder may be a second phenolic binder that is chemically different than the first phenolic binder.
- suitable organic binders that are useful in abrasive composites include phenolics, aminoplasts, urethanes, epoxies, acrylics, cyanates, isocyanurates, glue, and combinations thereof.
- organic binders are prepared by crosslinking (e.g., at least partially curing and/or polymerizing) an organic binder precursor.
- Suitable organic binder precursors for the shaped abrasive composites may be the same as, or different from, organic binder precursors that can be used in the magnetizable layer described hereinabove.
- the organic binder precursor may be exposed to an energy source which aids in the initiation of
- polymerization typically including crosslinking of the organic binder precursor.
- energy sources include thermal energy and radiation energy which includes electron beam, ultraviolet light, and visible light.
- curative is not necessarily required because the electron beam itself generates free radicals.
- the organic binder precursor is converted into a solidified organic binder.
- the thermoplastic organic binder precursor is cooled to a degree that results in solidification of the organic binder precursor.
- Organic binders are preferably included in both of the first and secondary abrasive layers; for example, in amounts of from 5 to 50 percent by weight, more preferably 10 to 40 percent by weight, and even more preferably 15 to 40 percent by weight, based on the total weight of the respective first and secondary abrasive layers, however other amounts may also be used.
- the organic binder is typically formed by at least partially curing a corresponding organic binder precursor.
- Addition polymerizable resins are advantageous because they are readily cured by exposure to radiation energy. Addition polymerized resins can polymerize, for example, through a cationic mechanism or a free-radical mechanism. Depending upon the energy source that is utilized and the binder precursor chemistry, a curing agent, initiator, or catalyst may be useful to help initiate the polymerization.
- binder precursors examples include phenolic resins, urea-formaldehyde resins, aminoplast resins, urethane resins, melamine formaldehyde resins, cyanate resins, isocyanurate resins, (meth)acrylate resins (e.g., (meth)acrylated urethanes, (meth)acrylated epoxies, ethylenically-unsaturated free-radically polymerizable compounds, aminoplast derivatives having pendant alpha, beta-unsaturated carbonyl groups, isocyanurate derivatives having at least one pendant acrylate group, and isocyanate derivatives having at least one pendant acrylate group) vinyl ethers, epoxy resins, and mixtures and combinations thereof.
- (meth)acryl encompasses acryl and methacryl.
- Phenolic resin is an exemplary useful organic binder precursor, and may be used in powder form and/or liquid state.
- Organic binder precursors that can be cured (i.e., polymerized and/or crosslinked) to form useful organic binders include, for example, one or more phenolic resins (including novolac and/or resole phenolic resins) one or more epoxy resins, one or more urea-formaldehyde binders, one or more polyester resins, one or more polyimide resins, one or more rubbers, one or more polybenzimidazole resins, one or more shellacs, one or more acrylic monomers and/or oligomers, and combinations thereof.
- the organic binder precursor(s) may be combined with additional components such as, for example, curatives, hardeners, catalysts, initiators, colorants, antistatic agents, grinding aids, and lubricants.
- Useful phenolic resins include novolac and resole phenolic resins.
- Novolac phenolic resins are characterized by being acid-catalyzed and having a ratio of formaldehyde to phenol of less than one, typically between 0.5:1 and 0.8:1.
- Resole phenolic resins are characterized by being alkaline catalyzed and having a ratio of formaldehyde to phenol of greater than or equal to one, typically from 1:1 to 3:1.
- Novolac and resole phenolic resins may be chemically modified (e.g., by reaction with epoxy compounds), or they may be unmodified.
- Exemplary acidic catalysts suitable for curing phenolic resins include sulfuric, hydrochloric, phosphoric, oxalic, and p-toluenesulfonic acids.
- Alkaline catalysts suitable for curing phenolic resins include sodium hydroxide, barium hydroxide, potassium hydroxide, calcium hydroxide, organic amines, or sodium carbonate.
- Phenolic resins are well-known and readily available from commercial sources. Examples of commercially available novolac resins include DUREZ 1364, a two-step, powdered phenolic resin (marketed by Durez Corporation, Addison, Texas, under the trade designation VARCUM (e.g., 29302), or HEXION AD5534 RESIN (marketed by Hexion Specialty Chemicals, Inc., Louisville, Kentucky).
- DUREZ 1364 a two-step, powdered phenolic resin
- VARCUM e.g., 29302
- HEXION AD5534 RESIN marketed by Hexion Specialty Chemicals, Inc., Louisville, Kentucky
- Examples of commercially available resole phenolic resins useful in practice of the present disclosure include those marketed by Durez Corporation under the trade designation VARCUM (e.g., 29217, 29306, 29318, 29338, 29353); those marketed by Ashland Chemical Co., Bartow, Florida under the trade designation AEROFENE (e.g., AEROFENE 295); and those marketed by Kangnam Chemical Company Ltd., Seoul, South Korea under the trade designation "PHENOLITE” (e.g., PHENOLITE TD-2207).
- VARCUM e.g., 29217, 29306, 29318, 29338, 29353
- AEROFENE e.g., AEROFENE 295
- Kangnam Chemical Company Ltd. Seoul, South Korea under the trade designation "PHENOLITE” (e.g., PHENOLITE TD-2207).
- Curing temperatures of thermally curable organic binder precursors will vary with the material chosen and wheel design. Selection of suitable conditions is within the capability of one of ordinary skill in the art. Exemplary conditions for a phenolic binder may include an applied pressure of about 20 tons per 4 inches diameter (224 kg/cm 2 ) at room temperature followed by heating at temperatures up to about 185oC for sufficient time to cure the organic binder material precursor.
- (Meth)acrylated urethanes include di(meth)acrylate esters of hydroxyl-terminated NCO extended polyesters or polyethers.
- Examples of commercially available acrylated urethanes include those available as CMD 6600, CMD 8400, and CMD 8805 from Cytec Industries, West Paterson, New Jersey.
- (Meth)acrylated epoxies include di(meth)acrylate esters of epoxy resins such as the diacrylate esters of bisphenol A epoxy resin.
- Examples of commercially available acrylated epoxies include those available as CMD 3500, CMD 3600, and CMD 3700 from Cytec Industries.
- Ethylenically-unsaturated free-radically polymerizable compounds include both monomeric and polymeric compounds that contain atoms of carbon, hydrogen, and oxygen, and optionally, nitrogen and the halogens. Oxygen or nitrogen atoms or both are generally present in ether, ester, urethane, amide, and urea groups.
- Ethylenically-unsaturated free-radically polymerizable compounds typically have a molecular weight of less than about 4,000 g/mole and are typically esters made from the reaction of compounds containing a single aliphatic hydroxyl group or multiple aliphatic hydroxyl groups and unsaturated carboxylic acids, such as acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid, maleic acid, and the like.
- ethylenically-unsaturated free- radically polymerizable compounds include methyl methacrylate, ethyl methacrylate, styrene, divinylbenzene, vinyl toluene, ethylene glycol diacrylate, ethylene glycol methacrylate, hexanediol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, glycerol triacrylate,
- ethylenically unsaturated resins include monoallyl, polyallyl, and polymethallyl esters and amides of carboxylic acids, such as diallyl phthalate, diallyl adipate, and N,N-diallyladipamide.
- Still other nitrogen containing compounds include tris(2-acryloyl-oxyethyl) isocyanurate, 1,3,5-tris(2-methyacryloxyethyl)-s- triazine, acrylamide, N-methylacrylamide, N,N-dimethylacrylamide, N-vinylpyrrolidone, and N- vinylpiperidone.
- Useful aminoplast resins have at least one pendant ⁇ , ⁇ -unsaturated carbonyl group per molecule or oligomer. These unsaturated carbonyl groups can be acrylate, methacrylate, or acrylamide type groups. Examples of such materials include N-(hydroxymethyl)acrylamide, N,N'-oxydimethylenebisacrylamide, ortho- and para-acrylamidomethylated phenol, acrylamidomethylated phenolic novolac, and combinations thereof. These materials are further described in U.S. Pat. Nos.4,903,440 and 5,236,472 (both to Kirk et al.).
- Isocyanurate derivatives having at least one pendant acrylate group and isocyanate derivatives having at least one pendant acrylate group are further described in U.S. Pat. No.4,652,274 (Boettcher et al.).
- An example of one isocyanurate material is the triacrylate of tris(hydroxyethyl) isocyanurate.
- Epoxy resins have one or more epoxy groups that may be polymerized by ring opening of the epoxy group(s). Such epoxy resins include monomeric epoxy resins and oligomeric epoxy resins.
- Examples of useful epoxy resins include 2,2-bis[4-(2,3-epoxypropoxy)-phenyl propane] (diglycidyl ether of bisphenol) and materials available as EPON 828, EPON 1004, and EPON 1001F from Momentive Specialty Chemicals, Columbus, Ohio; and DER-331, DER-332, and DER-334 from Dow Chemical Co., Midland, Michigan.
- Other suitable epoxy resins include glycidyl ethers of phenol formaldehyde novolac commercially available as DEN-431 and DEN-428 from Dow Chemical Co.
- Epoxy resins can polymerize via a cationic mechanism with the addition of an appropriate cationic curing agent.
- Cationic curing agents generate an acid source to initiate the polymerization of an epoxy resin.
- These cationic curing agents can include a salt having an onium cation and a halogen containing a complex anion of a metal or metalloid.
- Other curing agents e.g., amine hardeners and guanidines
- epoxy resins and phenolic resins may also be used.
- cationic curing agents include a salt having an organometallic complex cation and a halogen containing complex anion of a metal or metalloid which are further described in U.S. Pat. No. 4,751,138 (Tumey et al.).
- organometallic salt and an onium salt is described in U.S. Pat. No.4,985,340 (Palazzotto et al.); U.S. Pat. No.5,086,086 (Brown-Wensley et al.); and U.S. Pat. No.5,376,428 (Palazzotto et al.).
- Still other cationic curing agents include an ionic salt of an organometallic complex in which the metal is selected from the elements of Periodic Group IVB, VB, VIB, VIIB and VIIIB which is described in U.S. Pat. No.5,385,954 (Palazzotto et al.).
- free radical thermal initiators include peroxides, e.g., benzoyl peroxide and azo compounds.
- Photoinitiators Compounds that generate a free radical source if exposed to actinic electromagnetic radiation are generally termed photoinitiators.
- photoinitiators include benzoin and its derivatives such as ⁇ -methylbenzoin; ⁇ -phenylbenzoin; ⁇ -allylbenzoin; ⁇ -benzylbenzoin; benzoin ethers such as benzil dimethyl ketal (e.g., as commercially available as IRGACURE 651 from Ciba Specialty Chemicals, Tarrytown, New York), benzoin methyl ether, benzoin ethyl ether, benzoin n-butyl ether; acetophenone and its derivatives such as 2-hydroxy-2-methyl-1-phenyl-1-propanone (e.g., as DAROCUR 1173 from Ciba Specialty Chemicals) and 1-hydroxycyclohexyl phenyl ketone (e.g., as IRGACURE 184 from Ciba Specialty
- photoinitiators include, for example, pivaloin ethyl ether, anisoin ethyl ether, anthraquinones (e.g., anthraquinone, 2-ethylanthraquinone, 1-chloroanthraquinone, 1,4-dimethylanthraquinone, 1- methoxyanthraquinone, or benzanthraquinone), halomethyltriazines, benzophenone and its derivatives, iodonium salts and sulfonium salts, titanium complexes such as bis( ⁇ 5 -2,4-cyclopentadien-1-yl)-bis[2,6- difluoro-3-(1H-pyrrol-1-yl)phenyl]titanium (e.g., as CGI 784DC from Ciba Specialty Chemicals);
- anthraquinones e.g., anthraquinone, 2-eth
- halonitrobenzenes e.g., 4-bromomethylnitrobenzene
- mono- and bis-acylphosphines e.g., as
- IRGACURE 1700, IRGACURE 1800, IRGACURE 1850, and DAROCUR 4265 all from Ciba Specialty Chemicals). Combinations of photoinitiators may be used.
- One or more spectral sensitizers e.g., dyes
- the photoinitiator(s) may be used in conjunction with the photoinitiator(s), for example, in order to increase sensitivity of the photoinitiator to a specific source of actinic radiation.
- a silane coupling agent may be included in the slurry of abrasive particles and organic binder precursor; typically in an amount of from about 0.01 to 5 percent by weight, more typically in an amount of from about 0.01 to 3 percent by weight, more typically in an amount of from about 0.01 to 1 percent by weight, although other amounts may also be used, for example depending on the size of the abrasive particles.
- Suitable silane coupling agents include, for example, methacryloxypropylsilane, vinyltriethoxysilane, vinyltris(2-methoxyethoxy)silane, 3,4-epoxycyclohexylmethyltrimethoxysilane, ⁇ - glycidoxypropyltrimethoxysilane, and ⁇ -mercaptopropyltrimethoxysilane (e.g., as available under the respective trade designations A-174, A-151, A-172, A-186, A-187, and A-189 from Witco Corp.
- phenyltriethoxysilane methyltrichlorosilane, methyldichlorosilane, dimethyldichlorosilane, dimethyldiethoxysilane, and mixtures thereof.
- Vitreous binders may be produced from a precursor composition comprising a mixture or combination of one or more raw materials that when heated to a high temperature melt and/or fuse to form an integral vitreous binder matrix.
- the vitreous binder may be formed, for example, from frit.
- a frit is a composition that has been pre-fired before its use as a vitreous binder precursor composition for forming the vitreous binder of the magnetizable abrasive particle.
- Vitreous binders may be produced from a precursor composition comprising a mixture or combination of one or more raw materials that when heated to a high temperature melt and/or fuse to form an integral vitreous binder matrix.
- the vitreous binder may be formed, for example, from frit.
- a frit is a composition that has been pre-fired before its use as a vitreous binder precursor composition for forming the vitreous binder of the magnetizable abrasive particle.
- frit is a generic term for a material that is formed by thoroughly blending a mixture comprising one or more frit forming components, followed by heating (also referred to as pre-firing) the mixture to a temperature at least high enough to melt it; cooling the resulting glass, and crushing it. The crushed material can then be screened to a very fine powder.
- suitable glasses for the vitreous binder and the frit for making it include silica glass, silicate glass, borosilicate glass, and combinations thereof.
- a silica glass is typically composed of 100 percent by weight of silica.
- the vitreous binder is a glass that include metal oxides or oxides of metalloids, for example, aluminum oxide, silicon oxide, boron oxide, magnesium oxide, sodium oxide, manganese oxide, zinc oxide, calcium oxide, barium oxide, lithium oxide, potassium oxide, titanium oxide, metal oxides that can be characterized as pigments (e.g., cobalt oxide, chromium oxide, and iron oxide), and mixtures thereof.
- suitable ranges for the vitreous binder and/or vitreous binder precursor include, based on the total weight of the vitreous binder and/or vitreous binder precursor: 25 to 90% by weight , preferably 35 to 85% by weight of SiO 2 ; 0 to 40% by weight, preferably 0 to 30% by weight, of B 2 O 3 ; 0 to 40% by weight, preferably 5 to 30% by weight, of Al 2 O 3 ; 0 to 5% by weight, preferably 0 to 3% by weight, of Fe 2 O 3 ; 0 to 5% by weight, preferably 0 to 3% by weight, of TiO 2 ; 0 to 20% by weight, preferably 0 to 10% by weight, of CaO; 0 to 20% by weight, preferably 1 to 10% by weight, of MgO; 0 to 20% by weight, preferably 0 to 10% by weight, of K 2 O; 0 to 25% by weight, preferably 0 to 15% by weight, of Na 2 O; 0 to 20% by weight, preferably 0 0
- An example of a suitable silicate glass composition comprises about 70 to about 80 percent by weight of silica, about 10 to about 20 percent sodium oxide, about 5 to about 10 percent calcium oxide, about 0.5 to about 1 percent aluminum oxide, about 2 to about 5 percent magnesium oxide, and about 0.5 to about 1 percent potassium oxide, based on the total weight of the glass frit.
- Another example of a suitable silicate glass composition includes about 73 percent by weight of silica, about 16 percent by weight of sodium oxide, about 5 percent by weight of calcium oxide, about 1 percent by weight of aluminum oxide, about 4 percent by weight of magnesium oxide, and about 1 percent by weight of potassium oxide, based on the total weight of the glass frit.
- the glass matrix comprises an alumina-borosilicate glass comprising SiO 2 , B 2 O 3 , and Al 2 O 3 .
- An example of a suitable borosilicate glass composition comprises about 50 to about 80 percent by weight of silica, about 10 to about 30 percent by weight of boron oxide, about 1 to about 2 percent by weight of aluminum oxide, about 0 to about 10 percent by weight of magnesium oxide, about 0 to about 3 percent by weight of zinc oxide, about 0 to about 2 percent by weight of calcium oxide, about 1 to about 5 percent by weight of sodium oxide, about 0 to about 2 percent by weight of potassium oxide, and about 0 to about 2 percent by weight of lithium oxide, based on the total weight of the glass frit.
- borosilicate glass composition includes about 52 percent by weight of silica, about 27 percent by weight of boron oxide, about 9 percent by weight of aluminum oxide, about 8 percent by weight of magnesium oxide, about 2 percent by weight of zinc oxide, about 1 percent by weight of calcium oxide, about 1 percent by weight of sodium oxide, about 1 percent by weight of potassium oxide, and about 1 percent by weight of lithium oxide, based on the total weight of the glass frit.
- suitable borosilicate glass composition include, based upon weight, 47.61% SiO 2 , 16.65% Al 2 O 3 , 0.38% Fe 2 O 3 , 0.35% TiO 2 , 1.58% CaO, 0.10% MgO, 9.63% Na 2 O, 2.86% K 2 O, 1.77% Li 2 O, 19.03% B 2 O 3 , 0.02% MnO 2 , and 0.22% P 2 O 5 ; and 63% SiO 2 , 12% Al 2 O 3 , 1.2% CaO, 6.3% Na 2 O, 7.5% K 2 O, and 10% B 2 O 3 .
- a useful alumina-borosilicate glass composition comprises, by weight, about 18% B 2 O 3 , 8.5% Al 2 O 3 , 2.8% BaO, 1.1% CaO, 2.1% Na 2 O, 1.0% Li 2 O, with the balance being SiO 2 .
- Such an alumina-borosilicate glass, having a particle size of less than about 45 mm, is commercially available from Specialty Glass Incorporated, Oldsmar, Florida.
- Glass frit for making glass ceramics suitable for use as the vitreous binder matrix may be selected from the group consisting of magnesium aluminosilicate, lithium aluminosilicate, zinc aluminosilicate, calcium aluminosilicate, and combinations thereof.
- Known crystalline ceramic phases that can form glasses within the above listed systems include: cordierite (2MgO.2Al 2 O 3 .5SiO 2 ), gehlenite
- Glass frit for making glass-ceramic may comprise nucleating agents. Nucleating agents are known to facilitate the formation of crystalline ceramic phases in glass-ceramics. As a result of specific processing techniques, glassy materials do not have the long range order that crystalline ceramics have. Glass- ceramics are the result of controlled heat-treatment to produce, in some cases, over 90% crystalline phase or phases with the remaining non-crystalline phase filling the grain boundaries. Glass ceramics combine the advantage of both ceramics and glasses and offer durable mechanical and physical properties.
- Frit useful for forming vitreous binder may also contain frit binders (e.g., feldspar, borax, quartz, soda ash, zinc oxide, whiting, antimony trioxide, titanium dioxide, sodium silicofluoride, flint, cryolite, boric acid, and combinations thereof) and other minerals (e.g., clay, kaolin, wollastonite, limestone, dolomite, chalk, and combinations thereof).
- frit binders e.g., feldspar, borax, quartz, soda ash, zinc oxide, whiting, antimony trioxide, titanium dioxide, sodium silicofluoride, flint, cryolite, boric acid, and combinations thereof
- other minerals e.g., clay, kaolin, wollastonite, limestone, dolomite, chalk, and combinations thereof.
- Vitreous binder in the magnetizable abrasive particles may be selected, for example, based on a desired coefficient of thermal expansion (CTE). Generally, it is useful for the vitreous binder and abrasive particles to have similar CTEs, for example, ⁇ 100%, 50%, 40%, 25%, or 20% of each other.
- the CTE of fused alumina is typically about 8 x 10 -6 /Kelvin (K).
- K Kelvin
- a vitreous binder may be selected to have a CTE in a range from 4 x 10 -6 /K to 16 x 10 -6 /K.
- An example of a glass frit for making a suitable vitreous binder is commercially available, for example, as F245 from Fusion Ceramics, Carrollton, Ohio.
- the vitreous binder precursor in a powder form, may be mixed with a temporary binder, typically an organic binder (e.g., starch, sucrose, mannitol), which burns out during firing of the vitreous binder precursor.
- a temporary binder typically an organic binder (e.g., starch, sucrose, mannitol), which burns out during firing of the vitreous binder precursor.
- Organic and vitreous binder precursors may optionally contain additives such as, for example, colorants, grinding aids, fillers, pore formers, wetting agents, dispersing agents, light stabilizers, and antioxidants.
- additives such as, for example, colorants, grinding aids, fillers, pore formers, wetting agents, dispersing agents, light stabilizers, and antioxidants.
- Grinding aids encompass a wide variety of different materials including both organic and inorganic compounds.
- a sampling of chemical compounds effective as grinding aids includes waxes, organic halide compounds, halide salts, metals and metal alloys.
- Specific waxes effective as a grinding aid include specifically, but not exclusively, the halogenated waxes tetrachloronaphthalene and pentachloronaphthalene.
- Other effective grinding aids include halogenated thermoplastics, sulfonated thermoplastics, waxes, halogenated waxes, sulfonated waxes, and mixtures thereof.
- organic materials effective as a grinding aid include specifically, but not exclusively, polytetrafluoroethylene, polyvinyl chloride, and polyvinylidene chloride.
- halide salts generally effective as a grinding aid include sodium chloride, potassium cryolite, sodium cryolite, ammonium cryolite, potassium tetrafluoroborate, sodium tetrafluoroborate, silicon fluorides, sodium chloride, potassium chloride, potassium fluoroaluminate, iron disulfide, and magnesium chloride.
- Halide salts employed as a grinding aid typically have an average particle size of less than 100 microns, with particles of less than 25 microns being preferred.
- grinding aid examples include antimony, bismuth, cadmium, cobalt, iron, lead, tin, and titanium.
- Other commonly used grinding aids include sulfur, organic sulfur compounds, graphite, and metallic sulfides. Combinations of these grinding aids can also be employed. If present, grinding aid is preferably included in an amount of from 1 to 25 percent by weight, and more preferably in an amount of from 10 to 20 percent by weight, subject to weight range requirements of the other constituents being met. Grinding aids may be added to improve the cutting characteristics of the bonded abrasive wheel (e.g., a cut off wheel), generally by reducing the temperature of the cutting interface. Examples of precisely shaped grinding aid particles are taught in U.S. Pat. Appln. Publ. No.2002/0026752 A1 (Culler et al.)
- Bonded abrasive wheels according to the present disclosure may further comprise non- magnetizable abrasive particles (e.g., which may be crushed or shaped) in either of the primary abrasive layer and the secondary abrasive layer.
- non-magnetizable abrasive particles may be sized according to an abrasives industry specified nominal grade or combination of nominal grades.
- Bonded abrasive wheels according to the present disclosure can be made by a molding process. During molding, first and second organic binder precursors, which may be liquid or powdered, or a combination of liquid and powder, is mixed with abrasive particles. In some embodiments, a liquid medium (either curable organic resin or a solvent) is first applied to the abrasive particles to wet their outer surface, and then the wetted abrasive particles are mixed with a powdered organic binder precursor. Bonded abrasive wheels according to the present disclosure may be made, for example, by compression molding, injection molding, and/or transfer molding.
- a mold having a central-aperture-forming arbor surrounded by a circular cavity in which the center is optionally depressed e.g., for making depressed- center or raised-hub wheels.
- Bonded abrasive wheels may be molded by first placing a disc of reinforcing material having a center hole around the arbor and in contact with the bottom of the mold. Then, spreading a uniform layer of a second curable mixture comprising the first crushed abrasive particles, and the second organic binder precursor on top of the disc of reinforcing material.
- a disc of reinforcing material with a center hole positioned around the arbor is placed onto the layer of the second curable mixture, followed by spreading a uniform layer of the first curable mixture comprising shaped ceramic abrasive particles, optional non-magnetizable abrasive particles (e.g., non- magnetizable crushed abrasive particles) and the first binder precursor thereon.
- a hub reinforcing disc with a center hole therein is placed around the arbor and onto the layer of the first curable mixture, and a top mold plate of the desired shape to either produce the depressed-center or the straight center hub portion of the wheels, is placed on top of the layers to form a mold assembly.
- the mold assembly is then placed between the platens of either a conventional cold or hot press. Then the press is actuated to force the mold plate downwardly and compress the discs and abrasive mixtures together, at a pressure of from 1 to 4 tons per square inch, into a self-supporting structure of predetermined thickness, diameter and density. After molding the wheel is stripped from the mold and placed in an oven heated (e.g., to a temperature of approximately 175oC to 200°C for approximately 36 hours) to cure the curable mixtures and convert the organic binder precursors into useful organic binders.
- an oven heated e.g., to a temperature of approximately 175oC to 200°C for approximately 36 hours
- the primary abrasive layer includes from about 10 to about 90 percent by weight of the magnetizable abrasive particles; preferably from about 30 to about 80 percent by weight, and more preferably from about 40 to about 80 percent by weight, based on the total weight of the binder material and magnetizable abrasive particles.
- the secondary abrasive layer includes from about 10 to about 90 percent by weight of non-magnetizable abrasive particles; preferably from about 30 to about 80 percent by weight, and more preferably from about 40 to about 80 percent by weight, based on the total weight of the binder material and non-magnetizable abrasive particles.
- the secondary abrasive layer comprises less than 10 percent by volume, less than 5 percent by volume, or even less than one percent by volume, of the magnetizable abrasive particles.
- the secondary abrasive layer is free of the magnetizable abrasive particles.
- Useful non-magnetizable abrasive particles include, for example, crushed particles of fused aluminum oxide, heat treated aluminum oxide, white fused aluminum oxide, ceramic aluminum oxide materials such as those commercially available under the trade designation 3M CERAMIC ABRASIVE GRAIN from 3M Company of St.
- sol-gel derived abrasive particles can be found in U.S. Pat. Nos. 4,314,827 (Leitheiser et al.), 4,623,364 (Cottringer et al.); 4,744,802 (Schwabel), 4,770,671 (Monroe et al.); and 4,881,951 (Monroe et al.).
- Abrasive particles used in the bonded abrasive wheels of the present disclosure may be independently sized according to an abrasives industry recognized specified nominal grade.
- Exemplary abrasive industry recognized grading standards include those promulgated by ANSI (American National Standards Institute), FEPA (Federation of European Producers of Abrasives), and JIS (Japanese Industrial Standard).
- Such industry accepted grading standards include, for example: ANSI 4, ANSI 6, ANSI 8, ANSI 16, ANSI 24, ANSI 30, ANSI 36, ANSI 40, ANSI 50, ANSI 60, ANSI 80, ANSI 100, ANSI 120, ANSI 150, ANSI 180, ANSI 220, ANSI 240, ANSI 280, ANSI 320, ANSI 360, ANSI 400, and ANSI 600; FEPA P8, FEPA P12, FEPA P16, FEPA P24, FEPA P30, FEPA P36, FEPA P40, FEPA P50, FEPA P60, FEPA P80, FEPA P100, FEPA P120, FEPA P150, FEPA P180, FEPA P220, FEPA P320, FEPA P400, FEPA P500, FEPA P600, FEPA P800, FEPA P1000, FEPA P1200; FEPA F8, FEPA F12, FEPA F16, and FEPA F24;.and
- the crushed aluminum oxide particles and the non-seeded sol-gel derived alumina-based abrasive particles are independently sized to ANSI 60 and 80, or FEPA F36, F46, F54 and F60 or FEPA P60 and P80 grading standards.
- the abrasive particles can be graded to a nominal screened grade using U.S.A. Standard Test Sieves conforming to ASTM E-11 "Standard Specification for Wire Cloth and Sieves for Testing Purposes".
- ASTM E-11 prescribes the requirements for the design and construction of testing sieves using a medium of woven wire cloth mounted in a frame for the classification of materials according to a designated particle size.
- a typical designation may be represented as -18+20 meaning that the shaped ceramic abrasive particles pass through a test sieve meeting ASTM E-11 specifications for the number 18 sieve and are retained on a test sieve meeting ASTM E-11 specifications for the number 20 sieve.
- the shaped ceramic abrasive particles have a particle size such that most of the particles pass through an 18 mesh test sieve and can be retained on a 20, 25, 30, 35, 40, 45, or 50 mesh test sieve.
- the shaped ceramic abrasive particles can have a nominal screened grade comprising: -18+20, -20/+25, -25+30, -30+35, - 35+40, 5 -40+45, -45+50, -50+60, -60+70, -70/+80, -80+100, -100+120, -120+140, -140+170, -170+200, -200+230, -230+270, -270+325, -325+400, -400+450, -450+500, or -500+635.
- a custom mesh size could be used such as -90+100.
- Abrasive particles may be uniformly or non-uniformly distributed throughout the primary abrasive layer.
- Non-magnetizable abrasive particles may be uniformly or non-uniformly distributed throughout the secondary abrasive layer of the bonded abrasive wheel.
- Abrasive particles may be concentrated toward the middle (e.g., located away from outer surfaces of), or only adjacent the outer edge, i.e., the periphery, of the bonded abrasive wheel.
- a center portion may contain a lesser amount of abrasive particles.
- the abrasive particles in the primary abrasive layer are homogenously distributed among each other, because the manufacture of the wheels is easier, and the cutting effect is optimized when the two types of abrasive particles are closely positioned to each other.
- abrasive particles in the secondary abrasive layer are homogenously distributed among each other.
- the abrasive particles may be treated with a coupling agent (e.g., an organosilane coupling agent) to enhance adhesion of the abrasive particles to the binder (e.g., the first and/or second organic binder).
- a coupling agent e.g., an organosilane coupling agent
- the abrasive particles may be treated before combining them with the binder, or they may be surface treated in situ by including a coupling agent to the binder.
- the organic binder material contains plasticizer such as, for example, that available as SANTICIZER 154 PLASTICIZER from UNIVAR USA, Inc. of Chicago, Illinois.
- the primary abrasive layer and the secondary abrasive layer may contain additional components such as, for example, filler particles, subject to weight range requirements of the other constituents being met. Filler particles may be added to occupy space and/or provide porosity. Porosity enables the bonded abrasive wheel to shed used or worn abrasive particles to expose new or fresh abrasive particles.
- the primary abrasive layer and the secondary abrasive layer may have any range of porosity; for example, from about 1 percent to 50 percent, typically 1 percent to 40 percent by volume.
- fillers include bubbles and beads (e.g., glass, ceramic (alumina), clay, polymeric, metal), cork, gypsum, marble, limestone, flint, silica, aluminum silicate, and combinations thereof.
- Bonded abrasive wheels (and especially depressed-center bonded abrasive wheels) according to the present disclosure preferably have one or more additional layers or discs of reinforcing material integrally molded and bonded therein.
- One layer of reinforcing material is preferably bonded to and situated in between the secondary and primary abrasive layers of the wheel.
- a central hub portion of the abrasive wheel adjacent the central hub may be further reinforced with a disc of fiberglass cloth molded in and bonded to the bottom side of the primary abrasive layer.
- bonded abrasive wheels may include one or more reinforcing materials (e.g., a woven fabric, a knitted fabric, a nonwoven fabric, and/or a scrim) that reinforces the bonded abrasive wheel.
- the reinforcing material may comprise inorganic fibers (e.g., fiberglass) and/or organic fibers such as polyamide fibers, polyester fibers, or polyimide fibers.
- inorganic fibers e.g., fiberglass
- organic fibers such as polyamide fibers, polyester fibers, or polyimide fibers.
- the bonded abrasive wheels may be molded either by hot or cold pressing in any suitable manner well known to those skilled in the art.
- Bonded abrasive wheels may be molded to the shape of, for example, a shallow or flat dish or saucer with curved or straight flaring sides, and may have either a straight or depressed-center portion encircling and/or adjacent to a central hub (e.g., as in a Type 27 depressed-center abrasive wheel).
- the bonded abrasive wheel can be adapted adjacent to, or within, the central hub (i.e., a center mounting hole) to receive any suitable mounting or adapter, for example, for attaching the bonded abrasive wheel to the drive spindle or shaft of a portable grinder, for example, as described in U.S. Pat. Nos.3,081,584 (Bullard); 3,136,100 (Robertson, Jr.); 3,500,592 (Harrist); and 3,596,415 (Donahue).
- suitable mountings known to those skilled in the art which may be attached in various ways to the abrasive wheels.
- Bonded abrasive wheels can be made according to any suitable method.
- a first reinforcing material is placed into a wheel-shaped mold centered over a circular magnet placed just below the mold. In this configuration the magnetic field lines within the disc shaped mold cavity are perpendicular to the plane of the disc cavity. Crushed abrasive particles are mixed with a liquid binder precursor and then a powdered binder precursor, and placed in the mold onto the scrim thereby forming a substantially uniform layer onto which a second reinforcing material is placed.
- a mixture of magnetizable abrasive particles, optional grinding aid, and a second liquid binder precursor and powdered binder precursor (as before) is placed on top of the second reinforcing material.
- the mold may be agitated and/or allowed to rest for a period of time, to facilitate alignment of the magnetic abrasive particles with the magnetic field lines.
- mold is closed and pressed (e.g., at an applied pressure of 20 tons per 4 inches diameter (224 kg/cm 2 ) at room temperature.
- the molded abrasive wheel precursor is then heated at sufficient temperature (e.g., up to about 185oC) for sufficient time to cure the binder precursors. After some cooling, the mold is opened and the bonded abrasive wheel removed.
- Bonded abrasive wheels according to the present disclosure can be made according to any suitable method.
- ceramic shaped abrasive particles are optionally coated with a coupling agent prior to mixing with a curable organic precursor.
- a curable organic precursor preferably in liquid form
- any optional ingredients preferably in liquid form
- the mixture is pressed into a mold having a central hub disposed therein (e.g., at an applied pressure of 20 tons per 4 inches diameter (224 kg/cm 2 ) at room temperature.
- FIG.4 shows schematically how magnetic field lines orient magnetic abrasive particles in a circular mold cavity.
- FIG.4 represents a cross-section of a circular mold cavity and circular magnets.
- Circular external magnets 420a, 420b with north magnetic poles 450a, 450b and south magnetic poles 460a, 460b are disposed adjacent to mold 405 which has a circular mold cavity 410.
- Magnetic field lines 430 orient magnetizable abrasive particles 440 contained in a mixture of the magnetizable abrasive particles and binder precursor (not shown) within the mold cavity.
- the magnetizable abrasive particles are oriented substantially perpendicular to the plane of the abrasive disc (i.e., substantially parallel to the rotational axis of the resultant bonded abrasive wheel (not shown).
- the magnetic field may be supplied by a permanent magnet and/or an electromagnet, for example.
- the viscosity of the binder precursor/magnetizable abrasive particles mixture and the dwell time in the magnetic field prior to curing is sufficient to allow the magnetizable abrasive particles to substantially align with the lines of magnetic force.
- the orientation occurs between two magnets (e.g., circular magnets).
- the magnetizable abrasive particles will tend to align with their magnetizable layers substantially longitudinally aligned with lines of the applied magnetic force in the mold cavity. Their orientation is locked in placed after curing/hardening of the binder precursor.
- Vitreous bond abrasive wheels are made in a similar manner, but the firing temperature is typically from 500 to 1100°C instead of the lower temperatures used for organic binder precursors.
- Bonded abrasive wheels according to the present disclosure may be useful, for example, as cut- off wheels, grinding wheels, cup wheels, and off-angle grinding wheels, including abrasives industry Type 27 (e.g., as in American National Standards Institute standard ANSI B7.1-2000 (2000) in section 1.4.14) depressed-center grinding wheels.
- abrasives industry Type 27 e.g., as in American National Standards Institute standard ANSI B7.1-2000 (2000) in section 1.4.14
- Bonded abrasive wheels typically have a thickness of 0.1 cm to 100 cm, more typically 1 cm to 10 cm, and typically have a diameter between about 1 cm and 100 cm, more typically between about 10 cm and 100 cm, although other dimensions may also be used.
- bonded abrasive articles may be in the form of a cup wheel generally between 10 and 15 cm in diameter, or may be in the form of a snagging wheel of up to 100 cm in diameter, or may also be in the form of a bonded abrasive wheel of up to about 25 cm in diameter.
- a central hub (typically disposed around a center hole although this is not a requirement) is used for reinforcement and to attaching the abrasive wheel to a power driven tool.
- the center hole is typically 0.5 cm to 2.5 cm in diameter, although other sizes may be used.
- the central hub may comprise, for example, a metal or plastic flange.
- a mechanical fastener may be axially secured to one surface of the bonded abrasive wheel. Examples include threaded posts.
- the modulus and/or thickness of the secondary abrasive layer can be varied, for example, by choosing the second organic binder to be different than the first organic binder and/or by adjusting the levels of other components in the secondary abrasive layer.
- the secondary abrasive layer is stiffer than the primary abrasive layer, while in other embodiments the primary abrasive layer is stiffer than the secondary abrasive layer.
- Bonded abrasive wheels can be used on an off-angle grinding tool such as, for example, those available from Ingersoll-Rand, Sioux, Milwaukee, and Cooper Power Tools of Lexington, South Carolina.
- the tool can be electrically or pneumatically driven, generally at speeds from about 1000 to 50000 RPM.
- Bonded abrasive wheels are generally useful for abrading a workpiece.
- the workpiece may comprise any material and may have any form.
- workpiece materials include metals (e.g., carbon steel, stainless steel, titanium, mild steel, low alloy steels, cast irons, and metal alloys), ceramics, painted surfaces, plastics, polymeric coatings, stone, polycrystalline silicon, wood, marble, and combinations thereof.
- workpieces include metal bar and/or stock and welded seams.
- a bonded abrasive wheel according to the present disclosure is secured to a rotating powered tool and the primary abrasive layer is brought into frictional contact with a surface of a workpiece and at least a portion of the surface is abraded.
- the bonded abrasive wheels can be used dry or wet.
- the bonded abrasive wheel is typically used in conjunction with water, oil-based lubricants, surfactant solutions, or water-based lubricants.
- the present disclosure provides a bonded abrasive wheel comprising magnetizable abrasive particles retained in a first organic binder, wherein the bonded abrasive wheel has a central portion adjacent to a central hub, wherein the bonded abrasive wheel has an outer circumference and a rotational axis extending through the central hub, wherein a majority of the magnetizable abrasive particles are substantially parallel to the rotational axis.
- the present disclosure provides a bonded abrasive wheel according to the first embodiment, wherein the bonded abrasive wheel comprises: a primary abrasive layer comprising the magnetizable abrasive particles retained in the first organic binder;
- a secondary abrasive layer comprising non-magnetizable abrasive particles retained in a second organic binder
- a first reinforcing material disposed between and contacting the primary abrasive layer and the secondary abrasive layer.
- the present disclosure provides a bonded abrasive wheel according to the second embodiment, further comprising a second reinforcing material contacting the secondary abrasive layer opposite the first reinforcing material.
- the present disclosure provides a bonded abrasive wheel according to any one of the first to third embodiments, wherein the magnetizable abrasive particles comprise ceramic bodies, each having a respective magnetizable layer disposed thereon.
- the present disclosure provides a bonded abrasive wheel according to the fourth embodiment, wherein the ceramic bodies comprise alpha alumina.
- the present disclosure provides a bonded abrasive wheel according to the fourth embodiment, wherein the ceramic bodies comprise ceramic rods.
- the present disclosure provides a bonded abrasive wheel according to the fourth embodiment, wherein the ceramic bodies comprise ceramic platelets.
- the present disclosure provides a bonded abrasive wheel according to the seventh embodiment, wherein the ceramic platelets comprise ceramic truncated triangular pyramids.
- the present disclosure provides a bonded abrasive wheel according to any one of the first to eighth embodiments, wherein the magnetizable layer consists essentially of a metal or metal alloy.
- the present disclosure provides a bonded abrasive wheel according to any one of the first to eighth embodiments, wherein the magnetizable layer comprises magnetizable particles retained in a binder.
- the present disclosure provides a method of making a bonded abrasive wheel, the method comprising steps:
- the present disclosure provides a method according to the eleventh embodiment, wherein prior to step a) a second porous reinforcing material is placed in the circular mold cavity, and wherein the layer of the first curable composition is disposed on the second reinforcing material.
- the present disclosure provides a method according to the eleventh or twelfth embodiment, further comprising separating the bonded abrasive wheel from the mold.
- the present disclosure provides a method according to any one of the eleventh to thirteenth embodiments, wherein steps a) and b) are simultaneous.
- the present disclosure provides a method according to any one of the eleventh to thirteenth embodiments, wherein steps b) and c) are simultaneous.
- step c) further comprises compressing the layers of the first and second curable compositions.
- step b) further comprises mechanically agitating at least the layer of the second curable composition.
- the present disclosure provides a method according to any one of the eleventh to seventeenth embodiments, wherein the magnetizable abrasive particles comprise ceramic bodies, each having a respective magnetizable layer disposed thereon.
- the present disclosure provides a method according to the eighteenth embodiment, wherein the ceramic bodies comprise ceramic rods.
- the present disclosure provides a method according to the eighteenth embodiment, wherein the ceramic bodies comprise ceramic platelets.
- the present disclosure provides a method according to the twentieth embodiment, wherein the ceramic platelets comprise ceramic truncated triangular pyramids.
- the present disclosure provides a method according to any one of the eighteenth to twenty-first embodiments, wherein the magnetizable layer consists essentially of a metal or metal alloy.
- the present disclosure provides a method according to any one of the eighteenth to twenty-first embodiments, wherein the magnetizable layer comprises magnetizable particles retained in a binder.
- the present disclosure provides a method according to any one of the eighteenth to twenty-third embodiments, wherein the ceramic bodies comprise alpha alumina.
- the ceramic bodies comprise alpha alumina.
- SAP was coated with 304 stainless steel using physical vapor deposition with magnetron sputtering, 304 stainless steel sputter target, described by Barbee et al. in Thin Solid Films, 1979, vol.63, pp.143-150, deposited as the magnetic ferritic body centered cubic form.
- the apparatus used for the preparation of 304 stainless steel film coated abrasive particles i.e., magnetizable abrasive particles
- U.S. Pat. No.8,698,394 McCutcheon et al.
- 3592 grams of SAP were placed in a particle agitator that was disclosed in U.S. Pat. No.7,727,931 (Brey et al, Column 13, line 60).
- the blade end gap distance to the walls of the agitator was 1.7 mm.
- the physical vapor deposition was carried out for 12 hours at 5.0 kilowatts at an argon sputtering gas pressure of 10 millitorr (1.33 pascal) onto SAP.
- the density of the coated SAP was 3.912 grams per cubic centimeter (the density of the uncoated SAP was 3.887 grams per cubic centimeter).
- the weight percentage of metal coating in the coated abrasive particles was 0.65% and the coating thickness is 1 micron.
- a Type 27 depressed-center composite grinding wheel was prepared as follows. A 4.5-inch diameter (11.43-cm) mold made of 304 stainless steel was placed on top of the center of an 8-inch (20.32- cm) diameter ⁇ 2-inch (5.08-cm) thick neodymium magnet with an average surface field strength of 0.6 Tesla. A 4.5-inch (11.4cm) diameter disc of SCRIM1 was placed into the mold. Mix 1 (75 grams) was spread out evenly and a second 4.5-inch (11.4-cm) disc of SCRIM1 was placed on top of the mix 1. Mix 3 (75 grams) was spread out evenly on the second scrim. A 3-inch (7.6-cm) SCRIM2 disc was inserted and centered into the cavity.
- the filled cavity mold was then pressed at a pressure of 30 tons.
- the resulting wheel was removed from the cavity mold and placed on a spindle between depressed-center aluminum plates in order to be pressed into a Type 27 depressed-center grinding wheel.
- the wheel was compressed at 5 tons to shape the disc.
- the wheel was then placed in an oven to cure for 7 hours at 79 o C, 3 hours at 107 o C, 18 hours at 185 o C, and a temperature ramp-down over 4 hours to 27 o C.
- the dimensions of the final grinding wheel were 114.3 mm diameter ⁇ 6.35 mm thickness.
- the center hole was 7/8 inch (2.2 cm) in diameter.
- the wheels were mounted on an Atlas Copco GTG25 pneumatic grinder which was in turn mounted to a robotic arm to precisely control movement.
- the wheels were tested grinding against a 1018 cold rolled steel workpiece with 2-inch (5.18-cm) height, 0.25-inch (0.64-cm) thickness and 18-inch (45.72-cm) length.
- the abrasive article was then urged at an angle of 12.5 degrees against the workpiece at a load of 9 pounds (4.08 kilograms).
- the grinder continuously traversed back and forth across the entire steel bar on the 0.25-inch edge.
- the wheel was tested for 10 minutes.
- the mass of the workpiece was measured before and after the test to determine the cut in grams.
- the wheel was weighed before and after the test to determine the wear in grams.
- G-ratio was calculated as the ratio of cut to wear. The results are shown in Table 3, below.
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- Inorganic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US201662412411P | 2016-10-25 | 2016-10-25 | |
PCT/US2017/053695 WO2018080704A1 (en) | 2016-10-25 | 2017-09-27 | Bonded abrasive wheel and method of making the same |
Publications (3)
Publication Number | Publication Date |
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EP3532248A1 true EP3532248A1 (en) | 2019-09-04 |
EP3532248A4 EP3532248A4 (en) | 2020-07-08 |
EP3532248B1 EP3532248B1 (en) | 2021-08-04 |
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Family Applications (1)
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EP17864183.3A Active EP3532248B1 (en) | 2016-10-25 | 2017-09-27 | Bonded abrasive wheel and method of making the same |
Country Status (4)
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---|---|
US (1) | US20190262973A1 (en) |
EP (1) | EP3532248B1 (en) |
CN (1) | CN109890566B (en) |
WO (1) | WO2018080704A1 (en) |
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KR102243356B1 (en) | 2016-05-10 | 2021-04-23 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | Abrasive particles and their formation method |
US11230653B2 (en) | 2016-09-29 | 2022-01-25 | Saint-Gobain Abrasives, Inc. | Fixed abrasive articles and methods of forming same |
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CN112020407A (en) | 2018-04-24 | 2020-12-01 | 3M创新有限公司 | Coated abrasive article and method of making same |
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US11926019B2 (en) | 2019-12-27 | 2024-03-12 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive articles and methods of forming same |
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WO2021214605A1 (en) | 2020-04-23 | 2021-10-28 | 3M Innovative Properties Company | Shaped abrasive particles |
EP4161733A1 (en) | 2020-06-04 | 2023-04-12 | 3M Innovative Properties Company | Incomplete polygonal shaped abrasive particles, methods of manufacture and articles containing the same |
WO2021245494A1 (en) | 2020-06-04 | 2021-12-09 | 3M Innovative Properties Company | Shaped abrasive particles and methods of manufacture the same |
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-
2017
- 2017-09-27 WO PCT/US2017/053695 patent/WO2018080704A1/en unknown
- 2017-09-27 US US16/343,816 patent/US20190262973A1/en active Pending
- 2017-09-27 CN CN201780065866.2A patent/CN109890566B/en active Active
- 2017-09-27 EP EP17864183.3A patent/EP3532248B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20190262973A1 (en) | 2019-08-29 |
CN109890566A (en) | 2019-06-14 |
EP3532248A4 (en) | 2020-07-08 |
WO2018080704A1 (en) | 2018-05-03 |
EP3532248B1 (en) | 2021-08-04 |
CN109890566B (en) | 2021-11-19 |
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