EP3084272A1 - Method for producing an electronic module having an interlockingly connected housing part element - Google Patents
Method for producing an electronic module having an interlockingly connected housing part elementInfo
- Publication number
- EP3084272A1 EP3084272A1 EP14793549.8A EP14793549A EP3084272A1 EP 3084272 A1 EP3084272 A1 EP 3084272A1 EP 14793549 A EP14793549 A EP 14793549A EP 3084272 A1 EP3084272 A1 EP 3084272A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- housing part
- circuit board
- printed circuit
- part element
- board element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 27
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 238000005304 joining Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 15
- 239000012815 thermoplastic material Substances 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 abstract description 5
- 229920002647 polyamide Polymers 0.000 abstract description 5
- 230000001678 irradiating effect Effects 0.000 abstract description 2
- 229920001169 thermoplastic Polymers 0.000 abstract 1
- 239000004416 thermosoftening plastic Substances 0.000 abstract 1
- 238000001746 injection moulding Methods 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- 239000004033 plastic Substances 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000012208 gear oil Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
- B29C65/1432—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface direct heating of the surfaces to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1632—Laser beams characterised by the way of heating the interface direct heating the surfaces to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1677—Laser beams making use of an absorber or impact modifier
- B29C65/168—Laser beams making use of an absorber or impact modifier placed at the interface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
- B29C65/60—Riveting or staking
- B29C65/606—Riveting or staking the rivets being integral with one of the parts to be joined, i.e. staking
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/72—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by combined operations or combined techniques, e.g. welding and stitching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/13—Single flanged joints; Fin-type joints; Single hem joints; Edge joints; Interpenetrating fingered joints; Other specific particular designs of joint cross-sections not provided for in groups B29C66/11 - B29C66/12
- B29C66/131—Single flanged joints, i.e. one of the parts to be joined being rigid and flanged in the joint area
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/303—Particular design of joint configurations the joint involving an anchoring effect
- B29C66/3032—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined
- B29C66/30321—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined making use of protrusions belonging to at least one of the parts to be joined
- B29C66/30322—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined making use of protrusions belonging to at least one of the parts to be joined in the form of rugosity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/32—Measures for keeping the burr form under control; Avoiding burr formation; Shaping the burr
- B29C66/322—Providing cavities in the joined article to collect the burr
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/53—Joining single elements to tubular articles, hollow articles or bars
- B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
- B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
- B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
- B29C66/712—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined the composition of one of the parts to be joined being different from the composition of the other part
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
- B29C66/721—Fibre-reinforced materials
- B29C66/7212—Fibre-reinforced materials characterised by the composition of the fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
- B29C66/7316—Surface properties
- B29C66/73161—Roughness or rugosity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/7394—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
- F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
- F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2309/00—Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
- B29K2309/08—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2663/00—Use of EP, i.e. epoxy resins or derivatives thereof for preformed parts, e.g. for inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2677/00—Use of PA, i.e. polyamides, e.g. polyesteramides or derivatives thereof, for preformed parts, e.g. for inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2072—Anchoring, i.e. one structure gripping into another
Definitions
- the present invention relates to a method for producing a
- Electronic modules generally serve to form electrical circuits.
- the electrical circuits may be part of a control unit, for example.
- vehicle electronics modules are used to provide vehicle control devices.
- a plurality of electronic components are typically provided on a printed circuit board element, which are electrically connected to one another by means of conductor tracks.
- Transmission control unit can be arranged for example inside a vehicle transmission, where, for example, chemically aggressive gear oil, dirt or chips can come into contact with the electronic module. Since at least parts of the electronic module provided on the components, interconnects, etc. sensitive to such aggressive media or May be necessary to protect them by a hermetically sealed housing.
- a housing sub-element may be e.g. a lid or a frame, which optionally together with other components and in particular together with the circuit board element form a housing.
- the circuit board element can hermetically enclose a space together with the housing part element or the housing part elements, in which electronic components can be protected against surrounding media.
- Microstructuring to provide and then injecting at this microstructured portion plastic, so that a frame or a
- the plastic to be sprayed can penetrate in cavities in the microstructured portion in the initially liquid state and form a positive connection with the printed circuit board element during subsequent solidification.
- Printed circuit board element are introduced into an injection molding tool. During an injection molding process, the printed circuit board element and possibly already attached thereto electronic components can be damaged or contaminated.
- a method for producing an electronic module in which advantageously can be omitted, a circuit board element in a To introduce injection mold. Accordingly, risks of damage or contamination can be minimized.
- the inventive method for producing an electronic module has at least the following steps: providing a printed circuit board element, which at least one electronic component and a
- the step of attaching the housing part element to the circuit board element comprises the following substeps: First, a separately manufactured housing part element is provided, wherein the
- Housing part element is formed from a reversibly plastifiable material. Then at least a portion of a surface of this
- Housing part element on the circuit board element by joining the plasticized portion of the surface of the housing part element with the microstructured portion of the circuit board element and then solidifying the plasticized portion of the surface of the
- Circuit board elements used for electronic modules often consist of a material such as thermosetting material, such as epoxy resin, which can often only be connected with other materials using conventional methods with the aid of measures in which electronic components can be damaged on the circuit board element.
- thermosetting plastic with other materials has hitherto mostly been adhesively bonded only with the aid of tempering steps, whereby electronic components can be damaged at the high temperatures that occur in the process.
- Microstructuring differs from an otherwise smooth surface of a printed circuit board element in that the surface has some roughness due to microscopic pits in the surface.
- the microstructuring can be generated, for example, by irradiation with the aid of a laser, as a result of which parts of the material of the printed circuit board element can be removed by absorption of laser radiation and thus microscopically small depressions can be formed which form a microstructure.
- Microstructured portions should be injected, it has now been recognized that such direct injection molding can bring disadvantages in terms of manufacturing technology.
- Either the Anspritzvorgang should be performed before the circuit board element is equipped with electronic component elements, after the Anspritzvorgang any occurring contamination must be removed from the circuit board element before the electronic components are attached. Or alternatively should be electronic
- a housing sub-element already in advance separately produce for example, with a separately performed injection molding.
- the housing part element should in this case be formed from a reversibly plastifiable material.
- the housing member may be made of a thermoplastic material such as polyamide, for example PA66. Such material should normally be firm and for the
- such a material should be able to be plasticized reversibly, that is, reversibly in a plastic, ie viscous or liquid and thus plastically deformable state, transfer, and then allowed to solidify again.
- PCB element or attached thereto electronic components to damage or pollute.
- Housing part element reversibly plasticized.
- this sub-area can be temporarily heated locally, for example.
- at least one near-surface layer of the housing part element is temporarily plasticized, that is soft and deformable.
- the housing sub-element and the circuit board element are joined together.
- the joining takes place in such a way that the plastified subregion of the surface of the housing subelement is brought into contact with the microstructured subregion of the printed circuit board element and both are pressed together as far as possible.
- Parts of the previously already plasticized material of the housing part element can thereby flow into the recesses or microcavities in the microstructured portion of the printed circuit board element.
- this subarea can be locally irradiated with light, in particular laser light.
- the incident light should in this case have a sufficiently high power density, so that it comes to a heating of the thermoplastic material of the housing part member to beyond a plasticizing temperature.
- One wavelength of the light used should be on
- Material properties of the housing part element be adapted so that the incident light is absorbed as completely as possible in a near-surface layer of the housing part element and this heated.
- a pulsed laser the one
- this portion may be heated by hot air, radiant heat, contacting with a hot plate or other heating object, etc.
- this portion may be heated by hot air, radiant heat, contacting with a hot plate or other heating object, etc.
- energy for plastification of the subregion is introduced locally only in the subregion or that the
- the microstructured portion of the surface of the printed circuit board element may
- Such depressions or microcavities can be generated in particular by local irradiation by means of a laser.
- the wavelength and power density of the laser should be chosen appropriately, but it is not enough, by irradiating the laser light, the material of the
- PCB element only to plasticize or melt.
- the material should be removed locally, for example by evaporation or ablation.
- the laser radiation used for this purpose must generally have a higher power density than is the case for merely plasticizing a thermoplastic material. It can be used for this purpose, for example, a pulsed laser with a wavelength in the range of 200 nm to 10 ⁇ , preferably between 512 nm and 1064 nm, and a power of about 1 to 100 watts.
- a pulsed laser with a wavelength in the range of 200 nm to 10 ⁇ , preferably between 512 nm and 1064 nm, and a power of about 1 to 100 watts.
- the housing part element may have an annularly closed bearing surface and the part of the surface to be plastified of the surface of the housing part element may be this contact surface of the frame.
- the microstructured portion of the surface of the printed circuit board element may also be closed annularly and thereby correspond in terms of its geometry of the contact surface of the housing part element.
- Housing part element in microstructured material of the printed circuit board element and then can solidify therein. This results in a form-fitting connection along the entire annularly closed contact surface, which is also hermetically sealed.
- FIG. 1 shows a perspective top view of a printed circuit board element for an electronic module to be produced according to the invention.
- FIG. 2 shows a perspective view from below of a housing part element for an electronic module to be produced according to the invention.
- 3 shows an enlarged sectional view along the line AA from FIG. 1.
- FIG. 4 shows an enlarged sectional view along the line B-B of FIG. 2.
- Fig. 5 shows an enlarged sectional view of the areas shown in Figs. 3 and 4, after these in the context of an inventive
- Fig. 6 shows a sectional view through a manufactured according to the invention
- FIG. 7 shows a partial sectional view through a further electronic module produced according to the invention.
- Fig. 1 shows a printed circuit board element 1 for an electronic module, for example for use in a transmission control unit.
- the printed circuit board element 1 has on its surface a plurality of electronic components 3, such as electrical resistors, coils, capacitors, ICs, etc.
- the components 3 are interconnected by electrically conductive tracks 5.
- the conductor tracks 5 may extend on the surface of the printed circuit board element 1 or be arranged in the interior of the printed circuit board element as intermediate layers.
- the printed circuit board element 1 is made of reinforced with glass fibers thermosetting material such as epoxy resin, sometimes referred to as prepreg.
- a ring-shaped closed portion 7 is provided, in which a microstructuring is introduced.
- Fig. 3 shows this provided with the microstructure 9 portion 7 in
- the microstructuring has microscopic depressions 1 1, which extend for example over several microns deep into the surface of the PCB element 1 extend into it.
- the microstructured subregion 7 is arranged in an annular manner around a partial surface 13 of the printed circuit board element 1. Within this subarea 13 components 3 may be provided, which are to be protected against aggressive media from the environment, for example.
- Fig. 2 shows a housing part element 15 in the form of a rectangular frame.
- the housing part element 15 is made of a thermoplastic material such as polyamide.
- the rectangular shape of the housing part element 15 essentially corresponds to the shape of the microstructured portion 7 of the printed circuit board element 1.
- FIG. 4 shows a cross section through the housing part element 15.
- this contact surface 17 is supported by means of a laser
- Light 19 of appropriate wavelength and power irradiated is absorbed near the surface of the contact surface 17, whereby the local material is above its plasticizing temperature, when using polyamide, for example, to over 220 ° C, preferably over 250 ' ⁇ , heated and thus plastic.
- Side next to the contact surface 17 are respectively
- Fig. 5 shows a sectional view in which the parts shown in Figs. 3 and 4 of the printed circuit board element 1 on the one hand and the housing part element 15 on the other hand are interconnected.
- Bearing surface 17 adjacent portion 18 of the housing part element 15 is in the recesses 1 1 of the microstructured portion 7 of the
- Flowed circuit board element 1 and is solidified in the subsequent cooling therein. Excess plasticized material has been partially pushed aside and may be received in the material overflow grooves 21.
- FIG. 6 shows an example of an electronic module 23 produced according to the invention in cross section. Many optional features are illustrated as they may be provided on an electronics module, but do not need it.
- PCB element 1 is formed with the frame Housing part element 15 via the microstructured portion 7 positively connected.
- a lid 25 is placed, which is hermetically sealed to the housing part member 15, for example via a weld 27.
- the printed circuit board element 1, the housing part element 15 and the cover 25 thus enclose the
- Interior 13 hermetically sealed. Via an opening 29, the interior 13 can optionally be filled with a protective gel 31. The opening 29 can then be closed by means of a plug, for example a ball.
- the housing part element 15 can be additionally held by at least one rivet head 33 on the printed circuit board element 1. When assembled, the rivet head 33 in undeformed state in an opening 35 in the
- Printed circuit board element 1 is inserted and then hot-caulked.
- housing sub-element 15 is shown in the illustrated examples each as an annular frame, this housing sub-element 15 may also have other suitable shapes and geometries.
- the housing part element 15 may be designed as a cover element, which may have a trough-like shape, so that the inner space 13 is enclosed solely by the housing part element 15 embodied in one piece and the printed circuit board element 1.
- a film for example
- Polyamide are provided, which is plasticized in suitable areas and is pressed into microstructured portions 7 of a printed circuit board element 1.
- the film can cover electronic component and against external
- FIG. 7 shows a partial sectional view through a further electronic module 23 produced according to the invention.
- this electronic module 23 designed as a housing part element 15 lid is made in two parts.
- a trough-shaped main part 37 is formed of a laser-transparent plastic.
- an additional part 39 made of a laser-absorbing plastic is provided at the edge of this main part 37. This additional part 39 encloses the
- Body 37 is annular and extends into an area in which at the Printed circuit board element 1 of the microstructured portion 7 is provided.
- laser light 41 is transmitted from above through the laser-transparent body 37, toward the attachment 39, where it is absorbed.
- the main and auxiliary parts 37, 39 are welded together and on the other hand the plastic of the additional part 39 is plasticized in a partial area 18 so that it can be connected to the microstructured partial area 7 of the printed circuit board element 1.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Casings For Electric Apparatus (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013226150.0A DE102013226150A1 (en) | 2013-12-17 | 2013-12-17 | Method for producing an electronic module with positively connected housing part element |
PCT/EP2014/073684 WO2015090711A1 (en) | 2013-12-17 | 2014-11-04 | Method for producing an electronic module having an interlockingly connected housing part element |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3084272A1 true EP3084272A1 (en) | 2016-10-26 |
Family
ID=51862306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14793549.8A Withdrawn EP3084272A1 (en) | 2013-12-17 | 2014-11-04 | Method for producing an electronic module having an interlockingly connected housing part element |
Country Status (6)
Country | Link |
---|---|
US (1) | US20160381817A1 (en) |
EP (1) | EP3084272A1 (en) |
KR (1) | KR20160099577A (en) |
CN (1) | CN105917145A (en) |
DE (1) | DE102013226150A1 (en) |
WO (1) | WO2015090711A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6565403B2 (en) * | 2015-07-15 | 2019-08-28 | 浜名湖電装株式会社 | Manufacturing method of resin molded products |
DE102015221149A1 (en) * | 2015-10-29 | 2017-05-04 | Robert Bosch Gmbh | Control device for a transmission control of a motor vehicle |
DE102016215086B4 (en) | 2016-08-12 | 2024-04-18 | Vitesco Technologies Germany Gmbh | Printed circuit board and circuit assembly with printed circuit board |
DE102016215411A1 (en) * | 2016-08-17 | 2018-02-22 | Conti Temic Microelectronic Gmbh | Frame for an electronic circuit board and electronic circuit board |
DE102016011795A1 (en) * | 2016-09-30 | 2018-04-05 | Friedrich-Alexander-Universität Erlangen-Nürnberg | Method for joining also adhesion-incompatible plastic parts with each other and composite component made of adhesion-incompatible plastic parts |
BE1025341B1 (en) * | 2017-06-27 | 2019-02-04 | LASER ENGINEERING APPLICATIONS S.A. en abrégé LASEA S.A. | METHOD FOR STRUCTURING A SUBSTRATE |
US10314205B2 (en) * | 2017-09-21 | 2019-06-04 | Nanning Fugui Precision Industrial Co., Ltd. | Flame retardant structure for electronic component |
DE102019106284A1 (en) * | 2019-03-12 | 2020-09-17 | HELLA GmbH & Co. KGaA | Method for producing a joint between a structural component made of a plastic and a metal component |
CN112917922B (en) * | 2021-01-21 | 2022-11-29 | 台州义民电机股份有限公司 | Production method of integral water pump shell |
DE102021202286A1 (en) * | 2021-03-09 | 2022-09-15 | Robert Bosch Gesellschaft mit beschränkter Haftung | Battery module element, method of manufacturing such and battery module |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60214931A (en) * | 1984-04-10 | 1985-10-28 | Toyota Motor Corp | Bonding of different synthetic resin materials |
DE19510493A1 (en) * | 1994-03-31 | 1995-10-05 | Marquardt Gmbh | Laser welding of thermoplastic housing parts |
US6136128A (en) * | 1998-06-23 | 2000-10-24 | Amerasia International Technology, Inc. | Method of making an adhesive preform lid for electronic devices |
US20020170897A1 (en) * | 2001-05-21 | 2002-11-21 | Hall Frank L. | Methods for preparing ball grid array substrates via use of a laser |
US20070131348A1 (en) * | 2005-10-19 | 2007-06-14 | Katsuhiko Nakajima | Process for laser welding |
JP2008172172A (en) * | 2007-01-15 | 2008-07-24 | Denso Corp | Electronic controller and method of manufacturing the same |
DE102009043200A1 (en) * | 2009-09-26 | 2011-04-21 | Continental Automotive Gmbh | Method for welding a plastic housing |
DE102012213917A1 (en) * | 2012-08-06 | 2014-02-20 | Robert Bosch Gmbh | Component sheath for an electronics module |
CN103057117A (en) * | 2012-12-28 | 2013-04-24 | 江苏大学 | Method for improving laser transmission welding connection strength |
-
2013
- 2013-12-17 DE DE102013226150.0A patent/DE102013226150A1/en not_active Withdrawn
-
2014
- 2014-11-04 WO PCT/EP2014/073684 patent/WO2015090711A1/en active Application Filing
- 2014-11-04 CN CN201480068598.6A patent/CN105917145A/en active Pending
- 2014-11-04 KR KR1020167016089A patent/KR20160099577A/en not_active Application Discontinuation
- 2014-11-04 EP EP14793549.8A patent/EP3084272A1/en not_active Withdrawn
- 2014-11-04 US US15/105,997 patent/US20160381817A1/en not_active Abandoned
Non-Patent Citations (2)
Title |
---|
None * |
See also references of WO2015090711A1 * |
Also Published As
Publication number | Publication date |
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US20160381817A1 (en) | 2016-12-29 |
KR20160099577A (en) | 2016-08-22 |
CN105917145A (en) | 2016-08-31 |
WO2015090711A1 (en) | 2015-06-25 |
DE102013226150A1 (en) | 2015-06-18 |
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