EP3074239B2 - Multi-layer body as security element and method for the production thereof - Google Patents
Multi-layer body as security element and method for the production thereof Download PDFInfo
- Publication number
- EP3074239B2 EP3074239B2 EP14805273.1A EP14805273A EP3074239B2 EP 3074239 B2 EP3074239 B2 EP 3074239B2 EP 14805273 A EP14805273 A EP 14805273A EP 3074239 B2 EP3074239 B2 EP 3074239B2
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- partial
- layer system
- structuring
- lacquer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 35
- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 239000004922 lacquer Substances 0.000 claims description 54
- 238000005530 etching Methods 0.000 claims description 48
- 230000010076 replication Effects 0.000 claims description 19
- 230000000694 effects Effects 0.000 claims description 18
- 239000000049 pigment Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 16
- 230000001681 protective effect Effects 0.000 claims description 11
- 239000002105 nanoparticle Substances 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 5
- 239000004986 Cholesteric liquid crystals (ChLC) Substances 0.000 claims description 4
- 239000011230 binding agent Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 438
- 229910052751 metal Inorganic materials 0.000 description 33
- 239000002184 metal Substances 0.000 description 33
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 30
- 229920002120 photoresistant polymer Polymers 0.000 description 30
- 238000007639 printing Methods 0.000 description 17
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 12
- 239000013067 intermediate product Substances 0.000 description 11
- 235000011121 sodium hydroxide Nutrition 0.000 description 11
- 230000003287 optical effect Effects 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 238000007740 vapor deposition Methods 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229920002689 polyvinyl acetate Polymers 0.000 description 6
- 229920000915 polyvinyl chloride Polymers 0.000 description 6
- 239000004800 polyvinyl chloride Substances 0.000 description 6
- 239000004408 titanium dioxide Substances 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000000975 dye Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 239000003086 colorant Substances 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- 229910052984 zinc sulfide Inorganic materials 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000012776 electronic material Substances 0.000 description 3
- 238000004049 embossing Methods 0.000 description 3
- 239000011118 polyvinyl acetate Substances 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000005083 Zinc sulfide Substances 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 238000013019 agitation Methods 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002086 nanomaterial Substances 0.000 description 2
- 238000007645 offset printing Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000009993 protective function Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000009210 therapy by ultrasound Methods 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 230000003098 cholesteric effect Effects 0.000 description 1
- 150000001851 cinnamic acid derivatives Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009500 colour coating Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052950 sphalerite Inorganic materials 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/405—Marking
- B42D25/43—Marking by removal of material
- B42D25/445—Marking by removal of material using chemical means, e.g. etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/14—Multicolour printing
- B41M1/18—Printing one ink over another
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
- B42D25/29—Securities; Bank notes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/324—Reliefs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/328—Diffraction gratings; Holograms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
- B42D25/364—Liquid crystals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
- B42D25/373—Metallic materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
- B42D25/378—Special inks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/405—Marking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/405—Marking
- B42D25/415—Marking using chemicals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/405—Marking
- B42D25/43—Marking by removal of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/45—Associating two or more layers
Definitions
- the invention relates to a method for producing a multi-layer body with two layers or layer systems.
- ODD optically variable elements
- diffractive elements diffractive elements
- partially metallized layers printed features
- the document US2012/0189159 relates to a security element comprising an optical system.
- the document DE 10 2007 007 914 A1 relates to a high-index embossing lacquer for the production of micro-optical arrangements.
- WO 2009/053673 A1 relates to a security element for use in or on security substrates.
- the document GB 2464496A relates to a security feature having a printed image.
- the document DE 103 33 255 B3 relates to a method for generating a surface pattern.
- Register or register accuracy is to be understood as meaning the positionally accurate arrangement of layers lying one above the other in relation to one another while maintaining a desired positional tolerance.
- the partial second layer or the partial second layer system as a mask in order to structure the partial first layer or the partial first layer system, it is possible to arrange the two layers or layer systems exactly in register with one another. It is particularly important that the second partial layer or the second partial layer system not only extends into those areas that are covered by the first partial layer or the first partial layer system - i.e. the first partial area - but also in the areas not covered by the first partial layer or the first partial layer system--ie the second partial area.
- the second partial layer or the second partial layer system as a mask is to be understood here that when structuring the first partial layer or the first partial layer system, this or this in those areas that are covered by the second partial layer or the second partial layer system is selectively covered. A defined positional relationship between the two layers or layer systems therefore results during the structuring, so that they are arranged in register with one another, for example adjoining one another seamlessly.
- a layer system is to be understood here as meaning any arrangement of a plurality of layers.
- the layers can be arranged one above the other in the direction of the surface normal of the layer system or also next to one another in one plane. A combination of such horizontally and vertically arranged layers is also possible.
- Overlapping is understood here to mean that the respective subregions lie at least partially on top of one another in the direction of the surface normal of the planes spanned by the first or second layer, ie viewed in the stacking direction of the multi-layer body.
- the two layers or layer systems do not have to be generated in the specified order, i.e. the second partial layer or the second partial layer system can also be generated before the first partial layer or the first partial layer system.
- the layers or layer systems can be produced directly on the substrate, directly one on top of the other or with the production of any intermediate layers.
- the partial first layer or partial first layer system is structured in step c) by etching.
- the partial second layer or the partial second layer system is an etching resist or comprises an etching resist.
- An etch resist should be understood to mean a substance that is resistant to an etchant and one that is sensitive to the etchant substance from attack by the etchant where it covers it.
- an etchant is applied to the resulting layer stack, which removes the first partial layer or the first partial layer system where it is not covered by the second partial layer or the second partial layer system is.
- the etching resist is a lacquer that can include, in particular, binders, dyes, pigments, in particular colored or achromatic pigments, effect pigments, thin-film layer systems, cholesteric liquid crystals and/or metallic or nonmetallic nanoparticles.
- the second partial layer or the second partial layer system thus not only fulfills a protective function when structuring the first partial layer or the first partial layer system, but can itself develop a decorative effect. It is also possible for several different etching resists, for example resist lacquers with different colors, to be used for the second partial layer or the second partial layer system in order to produce further visual effects.
- the etchant used to structure the first partial layer or the first partial layer system depends on the composition of this layer or this layer system.
- Etching resists based on PVC (polyvinyl chloride), polyester resins, acrylates, for example, are suitable for such etching agents, with other film-forming substances such as nitrocellulose typically being admixed.
- the etching can be supported by mechanical agitation, for example by brushing, moving the etching bath or ultrasonic treatment. Customary temperatures for the etching process are preferably between 15°C and 75°C.
- the partial second layer or the partial second layer system can preferably be a protective lacquer or comprise a protective lacquer.
- Protective lacquer should be understood to mean a substance which absorbs in a wavelength range used for exposing the partial first layer or the partial first layer system. During exposure, the partial layers or layer systems are irradiated over their entire surface with light in this wavelength range, preferably perpendicularly to the layer plane. Typical wavelengths used for exposure are, for example, 250 nm to 420 nm. Exposure is preferably carried out with a dose of 10 mJ/cm 2 to 500 mJ/cm 2 . The exposure times result from the sensitivities of the materials used and the power of the available exposure source.
- the partial second layer or the partial second layer system is present, less light of this wavelength therefore reaches the partial first layer or the partial first layer system.
- etch resists and protective lacquers for example by adding absorbing substances, for example so-called UV absorbers, dyes, color pigments or scattering substances, such as titanium dioxide, to an etch resist lacquer.
- absorbing substances for example so-called UV absorbers, dyes, color pigments or scattering substances, such as titanium dioxide
- the protective lacquer is preferably a lacquer that contains, in particular, binders, dyes, pigments, in particular colored or achromatic pigments, effect pigments, thin-film layer systems, cholesteric Includes liquid crystals and/or metallic or non-metallic nanoparticles.
- Suitable protective coatings are formulated, for example, based on PVC, polyester or acrylates.
- the second partial layer or the second partial layer system thus not only fulfills a protective function when structuring the first partial layer or the first partial layer system, but can itself develop a decorative effect. It is also possible for several different protective lacquers, for example with different colors, to be used for the second partial layer or the second partial layer system in order to produce further visual effects.
- the partial first layer or the partial first layer system is a photoresist or includes a photoresist.
- a photoresist changes its chemical and/or physical properties when exposed to light in a specific wavelength range, so that the different properties of the exposed and unexposed areas can be used to selectively remove the photoresist in one of the areas. For example, when the photoresist is exposed to light, its solubility in relation to a solvent that can be used to develop the photoresist after exposure changes. In the case of positive photoresists, the exposed area is selectively removed in the development step following exposure, while in the case of negative photoresists the unexposed area is removed.
- a photoresist can also serve as a washable lacquer.
- Suitable positive photoresists are, for example, AZ 1518 or AZ 4562 from AZ Electronic Materials based on phenolic resin/diazoquinone.
- Suitable negative photoresists are, for example, AZ nLOF 2000 or ma-N 1420 from micro resist technology GmbH, for example based on cinnamic acid derivatives. These can preferably be exposed by irradiation with light in a wavelength range from 250 nm to 440 nm. The required dose depends on the respective layer thickness, the exposure wavelength and the sensitivity of the photoresist.
- Tetramethylammonium hydroxide for example, is suitable for developing these photoresists.
- the development preferably takes place at temperatures of 15°C to 65°C for a preferred development time of 2 seconds to a few minutes.
- the development process and the associated local removal of the photoresist can again be carried out by mechanical agitation, such as brushing, wiping, or flowing be assisted with the developing medium or ultrasonic treatment.
- the photoresist can also contain, in particular, binders, dyes, pigments, in particular colored pigments, effect pigments, thin-film layer systems, cholesteric liquid crystals and/or metallic or non-metallic nanoparticles in order to achieve additional decorative effects.
- the partial first layer or the partial first layer system and/or the partial second layer or the partial second layer system is first produced over the entire surface or at least in large areas and then structured.
- the full-area or large-area production can take place, for example, by printing or vapor deposition.
- the subsequent structuring of the partial first layer or the partial first layer system and/or the partial second layer or the partial second layer system in steps a) or b) then takes place by etching.
- the required etching resists can in turn be part of one or both of the layer systems or be applied as additional layers. These layers can in turn remain as part of the layer systems or can also be detached again in a further step.
- an external exposure mask can also be used, which is placed on the respective layer or the respective layer system.
- methods are also possible in which specific areas of the first layer or of the first layer system are partially removed, for example by means of a laser. Such methods are particularly suitable for the individual marking of security elements.
- the partial first layer or the partial first layer system is structured at the same time as in step c). This creates a method that can be carried out particularly simply and quickly.
- the partial first layer or the partial first layer system and/or the partial second layer or the partial second layer system can be produced in a structured manner in step a) and/or b).
- a printing process is preferably used for this purpose, in particular gravure printing, flexographic printing, offset printing, screen printing or digital printing, in particular inkjet printing.
- the partial first layer or the partial first layer system is or comprises a reflective layer made of a particularly opaque metal and/or a particularly transparent or translucent material with a high refractive index (this means a high real part of the complex refractive index), and/or at least a single-color or multicolor color coat and/or a Fabry-Perot layer system.
- the partial second layer or the partial second layer system is at least transparent, translucent or also largely is or comprises an opaque single-color or multi-color lacquer layer, in particular an etching and/or protective lacquer, and/or a Fabry-Perot layer system.
- the partial first layer or the partial first layer system and/or the partial second layer or the partial second layer system is applied in the form of at least one motif, pattern, symbol, image, logo or alphanumeric character, in particular numbers or letters.
- the layers or layer systems can also form such a motif, pattern, symbol, image, logo or alphanumeric characters, in particular numbers or letters, before or only after the structuring of the partial first layer or the partial first layer system.
- a graphic element produced in this way, which is created by the interaction of several layers, is particularly difficult to reproduce and is therefore particularly forgery-proof.
- the partial first layer or the partial first layer system and/or the partial second layer or the partial second layer system is applied in the form of a one-dimensional or two-dimensional grid of lines and/or points.
- transformed line grids are also possible, for example with wavy lines, which can also have a variable line width.
- the points of a point grid can have any geometry and/or size and do not have to be in the shape of a circular disk.
- point grids made up of triangular, rectangular, any polygonal, star-shaped points or points designed in the form of symbols are also possible.
- the dot grid can also be made up of dots of different sizes and/or different shapes. It is precisely when such a grid interacts with a graphic element in the respective other layer or in the respective other layer system that further graphic effects, such as halftone images, can be produced.
- the line and/or point grid preferably has a grid width of less than 300 ⁇ m, preferably less than 200 ⁇ m and more than 25 ⁇ m and preferably more than 50 ⁇ m.
- the grid width can also vary across the grid. Line widths or point diameters are preferably from 25 ⁇ m to 150 ⁇ m and can also vary. Such grids affect other graphic elements that are overlaid by the grid, but are no longer perceived as such, even to the naked human eye.
- the substrate comprises a carrier layer, in particular a film made from a plastic, preferably polyester, in particular PET (polyethylene terephthalate), and/or a release layer, for example made from a polymer lacquer, e.g. PMMA (polymethyl methacrylate) or from waxy substances.
- a carrier layer gives the multi-layer body stability during its production and later handling and protects it from damage.
- a detachment layer enables the security element to be easily detached from layers that are not required, such as the carrier layer, so that it can be attached to the desired document or object, in particular in the form of a hot stamping film with the carrier layer as the carrier film and the security element as the carrier film on a substrate transfer layer to be transferred.
- the substrate comprises a replication layer with a diffractive surface relief.
- the replication layer can consist of a thermoplastic, i.e. thermally curable or dryable replication lacquer or a UV-curable replication lacquer or a mixture of such lacquers.
- the surface relief introduced into the replication layer is an optically variable element, in particular a hologram, Kinegram® or Trustseal® , a preferably sinusoidal diffraction grating, an asymmetric relief structure, a blazed grating, a preferably isotropic or anisotropic matte structure, or a light-diffracting and/or light-refracting and/or light-focusing micro- or nanostructure, a binary or continuous Fresnel lens, a microprism structure, a microlens structure or a combination structure thereof.
- a hologram Kinegram® or Trustseal®
- a preferably sinusoidal diffraction grating an asymmetric relief structure
- a blazed grating a preferably isotropic or anisotropic matte structure
- a light-diffracting and/or light-refracting and/or light-focusing micro- or nanostructure a binary or continuous Fresnel lens
- a microprism structure a
- a variety of optical effects can be achieved by such structures or combinations thereof, which are also difficult to imitate and cannot be copied or can only be copied with difficulty using conventional optical copying methods, resulting in a multilayer body that is particularly forgery-proof.
- a third layer or a third layer system is applied, which is or comprises in particular an HRI layer and/or an adhesive layer.
- Adhesive layers can be used to attach the multi-layer body to a substrate, for example a document to be secured.
- HRI layers are particularly expedient in connection with extensive relief structures which are made visible by the transparent HRI layer even in areas in which the first and/or second layer or the first and/or second layer system do not provide an opaque metallized layer can become.
- Zinc sulfide for example, or also titanium dioxide or zirconium dioxide is suitable as a material for an HRI layer.
- a multi-layer body obtainable in this way can be used as a security element, in particular for a security document, in particular a banknote, a security, an identity document, a passport or a credit card.
- the multi-layer body 10 comprises a first layer 11, which is designed as a metal layer, for example made of aluminum, and a second layer 12, which is designed as a colored etching resist.
- a first layer 11 which is designed as a metal layer, for example made of aluminum
- a second layer 12 which is designed as a colored etching resist.
- aluminum copper, silver or chrome are also suitable, as are a wide variety of metal alloys.
- the first layer 11 is produced, which can be done, for example, by vapor deposition onto a substrate (not shown).
- the vapor deposition is preferably carried out in a vacuum by thermal vaporization, by means of electron beam vaporization or also by means of sputtering.
- the layer thickness of the first layer 11 is preferably 5 nm to 100 nm, more preferably 15 nm to 40 nm.
- the first vapor-deposited layer can then be partially removed using known methods, for example by partially applying an etch resist after the vapor deposition and subsequent etching including removal of the etch resist; by the partial application of a wash lacquer before the vapor deposition and washing off (lift-off) after the vapor deposition or by the partial application of a photoresist after the vapor deposition and subsequent exposure and subsequent Removal of the exposed or unexposed parts of the photoresist depending on the type (positive, negative) of the photoresist.
- the substrate is not vapour-deposited over the entire surface, the layer 11 is rather produced partially, so that it is present in a first area 111 and is not present in a second area 112 .
- Various methods are known for this, such as shielding by means of a moving mask or pressure of an oil, which prevents the deposition of the metal layer in the vapor deposition process.
- ODD optically variable device
- the first layer 11 does not have to be continuous, as shown, but can be structured as desired and have any shape.
- the second layer 12, here in the form of a radial pattern is printed onto the first layer.
- the printing technique used is preferably intaglio printing, flexographic printing, offset printing, screen printing or digital printing, in particular ink jet printing.
- the second layer 12 extends both into the region 111 covered by the first layer 11, but does not cover it completely, and into the region 112 not covered by the first layer 11. If a replicated diffractive structure is present, printing takes place preferably in register with this structure, with tolerances of +/- 1 mm, preferably +/- 0.5 mm, depending on the printing process.
- the lacquer used to print the second layer 12 is an etching resist, ie resistant to an etchant which can dissolve the metal of the first layer 11 . If aluminum is used for the first layer, this etchant can be caustic soda, for example.
- a lacquer based on PVC/PVAc (polyvinyl acetate) copolymer, for example, is then suitable as an etching resist.
- the paint also contains dyes, pigments, in particular colored or achromatic pigments or effect pigments, thin-film layer systems or cholesteric liquid crystals or nanoparticles, so that it produces an optically visible effect.
- the etching is then preferably carried out at a concentration of 0.1% to 5%, an etchant temperature of 15° C. to 75° C. over a period of 5 seconds to 100 seconds.
- a suitable etching resist is, for example, a lacquer based on PVC/PVAc (polyvinyl acetate) copolymer, which is printed in a layer thickness of preferably 0.1 ⁇ m to 10 ⁇ m.
- the first layer 11 dissolves in the areas not covered by the second layer.
- a rinsing process for example with water, and a drying step can also follow the etching.
- 1c shows the resulting multi-layer body 10 from the side opposite the pressure side. It can be seen that the structures of the first layer 11 and second layer 12 seamlessly merge into one another, ie are arranged with register accuracy. This side is also the typical viewing side of the multi-layer body 10. If a replicated diffractive structure is present, the first layer 11 acts as a reflection layer, so that the diffractive structure in the region of the first layer 11 is particularly clearly visible. An additional coating with an adhesive layer (not shown) can completely erase the diffractive structure in the area 111 not covered by the first layer 11 if the adhesive layer has a similar refractive index (e.g. about 1.5) to the replication layer and therefore no optically effective boundary layer is formed between the adhesive layer and the replication layer.
- a similar refractive index e.g. about 1.5
- the adhesive layer serves to apply the multi-layer body 10 to a substrate, for example a bank note.
- the color can be designed to be largely transparent or translucent, so that the underlying substrate can be seen, but a largely opaque design is also possible.
- a metal layer as the first layer 11
- a plurality of adjacent color layers which are printed onto the substrate.
- Suitable resists for this are, for example, photoresists such as AZ 1518 from AZ Electronic Materials.
- the second layer 12 is then preferably a protective lacquer, for example a transparent or opaque lacquer with a UV blocker. Benzophenone derivatives or highly disperse titanium dioxide are particularly suitable for this.
- the second layer 12 is then preferably printed so that it overlaps with the boundary areas of the colored layers of the first layer 11 .
- a preferred exposure dose of 10 mJ/cm 2 to 500 mJ/cm 2 and etching with e.g. 0.3% NaOH at a preferred temperature of about 50°C for a time of preferably 10 seconds to 30 seconds then only the color components of the first layer 11 remain where they were covered by the second layer 12 and thus form a multicolored decoration.
- the second layer 12 in the form of guilloche lines the finished multi-layer body shows 10 guilloche lines in which color transitions show, ie a so-called iris print.
- the inside 2 Multi-layer body 10 shown is analogous to 1 produced.
- the second layer 12 is formed as a layer system by printing two differently colored lacquers 121, 122.
- the two lacquers 121, 122 can overlap in some areas and are preferably printed in register with a tolerance of preferably less than 0.5 mm and particularly preferably less than 0.2 mm.
- the result is the multi-layer body 10 according to Figure 2c .
- FIGS. 3 to 5 show the manufacturing steps of an alternative multi-layer body 10, which, however, corresponds to the basic structure in 2 shown.
- the essential difference lies in the fact that the second layer 12 is not already printed on in a structured manner in this case, but is first applied over the entire area or at least in large areas and is then structured.
- a release layer 14 and a replication layer 15 made of, for example, a thermoplastic material or a radiation-curable or temperature-curable replication lacquer are first applied to a carrier layer 13 made of polyester, in particular PET, with these layers in turn being able to consist of several layers.
- Diffractive structures 151 are then molded into the replication layer 15, for example by embossing with a metallic embossing tool.
- HRI High Refractive Index
- the second layer 12 is then applied to the first layer 11 over the entire surface or at least in large areas, which in turn consists of two differently colored lacquers 121, 122 which adjoin one another.
- the lacquers 121, 122 are UV-sensitive photoresists such as AZ 1518 from AZ Electronic Materials based on phenolic resin/diazoquinone.
- a mask layer 16 is then partially printed onto the second layer 12 .
- the mask layer 16 serves at the same time as an etching and protective lacquer.
- an etching resist lacquer for example based on PVC/PVAc (polyvinyl acetate) copolymer, can be provided with, for example, UV-absorbing titanium dioxide particles or other UV blockers.
- Exposure to UV light then takes place from the side of the mask layer 16 .
- the exposure preferably takes place at a wavelength of 365 nm with a dose of 25 mJ/cm 2 to 500 mJ/cm 2 .
- NaOH is suitable for this purpose, for example, in a preferred concentration of 0.05% to 2.5%, which preferably acts on the intermediate product for a period of 2 seconds to 60 seconds at a temperature of 20° C. to 65° C.
- the photoresist 121, 122 of the layer 12 was exposed during the UV irradiation and therefore now dissolves in the developer bath. You get that in 4 shown intermediate. However, this is not isolated. Rather, the etching process is continued, the HRI layer 11 now being attacked where it is not protected by the remaining layer 12 .
- the lacquers 121, 122 thus act here at the same time as an etching resist.
- the in figure 5 illustrated finished multi-layer body 10.
- An adhesive layer can also be applied to this, which fills the exposed diffractive structures 151 where they are not covered by the first layer 11. The diffractive structures 151 are then only visible where the HRI material of the first layer 11 acts as a reflection layer.
- FIG. 6 another multi-layer body 10 is shown. Layers 11 and 12 are applied in the same way as in 1 illustrated embodiment. A further transparent HRI layer 17 is then applied over the entire surface, so that a diffractive element 18 that is not covered by the first layer 11 becomes visible.
- Diffractive structures can thus be seen in the opaque metallic areas of the first layer 11 and in the areas of the transparent HRI layer 17, but typically not in the printed areas of the second layer 12, because the diffractive structures are printed directly onto the diffractive structures by the color coating of the second layer 12 are extinguished because the colored lacquer preferably has a similar refractive index (about 1.5) as the replication layer and therefore no optically effective boundary layer is formed between colored lacquer and replication layer.
- the refractive indices of the two adjacent layers should preferably not differ from one another by more than 0.1.
- the embodiment according to Fig. 7a-c again corresponds to the exemplary embodiment 1 .
- the only difference is that for the first Layer 11 two different metals 113, 114, such as Al and Cu are used.
- the two metals 113, 114 can be spatially separate, adjacent or partially overlapping.
- Figure 7b again shows how the second layer 12 is printed onto the first layer 11 viewed from the print side.
- Figure 7c shows the finished multi-layer body viewed from the metal side. Due to the opaque metal layers, the print of layer 12 under the metal areas of layer 11 is not visible.
- the first layer 11 can be structured in two steps, since, for example, different etching agents have to be used for the two metals or metal alloys used. If Al and Cu are used for the first layer 11, these are NaOH and FeCl 3 , for example. However, since the same printed mask is used for structuring, namely the second layer 12, the transitions between the two metals 113, 114 of the first layer 11 take place in perfect register, i.e. in the exact position relative to the printing of the second layer 12.
- the embodiment after 8 again corresponds to the exemplary embodiment 1 .
- only one more transparent HRI layer 17 is applied.
- an opaque metal 113 for example aluminum
- the HRI layer 17 made of ZnS or TiO 2 is applied, which can also be done by vapor deposition or sputtering, so that a layer arrangement according to FIG Figure 8a present.
- the HRI layer 17 can also be present only partially, bordering on the metal layer 113, or at least partially overlapping it.
- the metal layer 113 and the HRI layer 17 together form the first layer 11.
- a red color layer is overprinted as the second layer 12, so that the situation according to FIG Figure 8b results. Viewing is from the print side.
- the areas of the two reflection layers 113, 17 that are not overprinted are removed, possibly also in two process steps with chemicals that are matched to the layers to be removed, for example two different lyes.
- NaOH can be used to remove the aluminum fractions under the conditions described
- NaOH or Na 2 CO 3 is preferably also used to remove an HRI layer made of ZnS at a temperature of 20° C. to 60° C. for a period of 5 seconds to 60 seconds used.
- the finished multi-layer body is in Figure 8c seen from the side of the first layer 11.
- the effect of the diffractive structures in the substrate can also be seen in the non-metallic areas in which the HRI layer 17 is present, while at the same time the color print of the second layer 12 can be seen because the HRI layer is still between the printed and the diffractive structures 17 is arranged as an optical boundary layer.
- the colored lacquer can be made transparent, translucent or also largely opaque.
- the manufacturing process includes a first step in which the finely structured first layer 11 according to Figure 9a is produced.
- Correspondingly finely structured metal layers can be produced, for example, in the following way: by structuring a photoresist layer using high-resolution mask exposure, which is then in turn used to structure the metal layer, or by using a process for tolerance-free partial metallization, as is known, for example, from WO 2006/084685 A2 is known.
- the layer 11 consists of a fine grid, which consists, for example, of a microscopically fine text.
- the colored printing of the second layer 12 is then carried out according to FIG Figure 9b .
- the second layer 12 is a comparatively coarsely structured motif in the form of the large number "50".
- the second layer 12 can also be structured very finely.
- the colored print of layer 12 serves as a mask for removing the first layer 11 in register, so that the in 9c shown multi-layer body 10 is obtained. This is done analogously to the etching process already described.
- first layer 11 and second layer 12 are, for example, finely structured line grids, superposition effects occur depending on their relative position to one another, and the structure that is finally created is a finely structured superimposition structure of the first layer 11 and second layer 12.
- the overlay structure can produce a desired moiré effect, for example.
- the fine structuring of the first layer 11 can, for example, also be designed as a guilloche pattern made up of a large number of fine lines, preferably as a metallic reflection layer in combination with diffractive structures, for example with a KINEGRAM® , like this Figure 17A indicates.
- the colored printing of the second layer 12 is then carried out according to FIG Figure 17B .
- the colored print can have several differently colored areas, for example in the form of a national flag (as shown here) and/or a geographical contour of a country or in the form of a coat of arms or another multicolored motif.
- the colored print of layer 12 serves as a mask for removing the first layer 11 with precise register, so that the in Figure 17C shown multi-layer body 10 is obtained. This is done analogously to the etching process already described.
- the in 17 shown embodiment recognizes the viewer as counterfeit-proof and independent Characteristics that the finely structured lines are only present in the colored areas and the finely structured lines recognizable in one colored area continue in register in an adjacent further colored area.
- the fine structuring of the first layer 11 can also be implemented, for example, as a guilloche pattern made up of a large number of fine lines, preferably as a metallic reflection layer in combination with optical-diffraction structures, for example with a KINEGRAM® , like this 18A indicates.
- the second layer 12 is then printed according to FIG Figure 18B .
- a colorless, preferably transparent etching resist with a UV absorber is used.
- This etch resist should then fulfill a dual function: on the one hand, the etch resist is used for further substructuring of the finely structured first layer 11 by means of etching and, on the other hand, later as an exposure mask for structuring a color area.
- the fine structure of the first layer 11 is removed by etching in the areas in which the etching resist is not provided.
- a colored photoresist is then printed on, which covers at least the area that is not covered by the colorless etching resist.
- the photoresist can also overlap with the etch resist.
- the colored photoresist is cured in those areas that do not have a transparent etch resist and can register in the remaining areas with the etch resist and the areas protected and defined by the etch resist Areas of the finely structured first layer 11 are removed.
- the viewer recognizes as forgery-proof and independent features that the fine structures of the first layer 11 are only present in the colorless areas and end in register with the colored area of the photoresist and that the fine structures of the first layer 11 are practically "above the colored Across area" continue in register in an adjacent transparent area.
- the Figures 10 to 13 show the manufacturing steps of an alternative multi-layer body 10, which, however, corresponds to the basic structure in 9 shown.
- the essential difference lies in the fact that the second layer 12 is not already printed on in a structured manner in this case, but is first applied over the entire area or at least in large areas and is then structured.
- a release layer 14 and a replication layer 15 are first applied to a carrier layer 13 made of polyester or PET. Diffractive structures 151 are then molded into the replication layer 15 .
- the first layer 11 is now applied to the replication layer 15, which in this case is present as a finely structured metal layer, for example in the form of a grid.
- the resists 121, 122 are UV-sensitive colored photoresists.
- a mask layer 16 is then partially printed onto the second layer 12, so that the in 12 intermediate product shown is obtained.
- the mask layer 16 can have the form of a further grid.
- the mask layer 16 serves at the same time as an etching and protective lacquer.
- an etching resist can be provided with UV-absorbing titanium dioxide particles or other UV blockers, for example. Exposure to UV light then takes place from the side of the mask layer 16 .
- the exposure parameters and lacquers used correspond to those already described above.
- a film mask can also be used, which is only in contact with the layers 121 and 122 during the exposure process and is then removed again.
- first layer 11 and the second layer 12 Screenings of the first layer 11 and the second layer 12 are in 14 shown.
- other structures such as point grids, are of course also possible.
- the first layer 11 and/or the second layer 12 can be provided with a further grid of diffractive structures on the respective replication layer of the first and/or second layer second layer 11, 12, but also a further, additional overlay with the or the diffractive grids of the first and / or second layer or their optically variable effects.
- the overlay effects can be very different, depending on how similar or different the screen rulings and/or screen shapes of the screens involved in the overlay are.
- the viewing angle and/or illumination angle dependency of the diffractive raster can lead to surprising optical effects with this lead to complex superposition.
- first layer 11 a partial reflection layer made of opaque metal or transparent HRI material
- second layer 12 a print (second layer 12) is applied.
- the print of the second layer 12 serves as a mask layer, for example analogously to an etching resist print, for further structuring of the partial metal layer 11.
- a print (second layer 12) is first introduced into the pre-material, in which a diffractive structure (not shown) is then molded (see Figure 15a ).
- a first partial metal area (first layer 11) is produced, as in Figure 15b shown.
- the print already present in the starting material is used as an exposure mask for a photoresist layer applied thereto in order to structure the first layer 11 in perfect register for printing the second layer 12 .
- the materials and process parameters used correspond to those already described above.
- the second layer 12 is thus generated completely independently of the first layer 11 in terms of time and place.
- the second layer 12 can also be arranged, for example, on the rear side of the substrate, which is not shown, and the first layer 11 on its front side.
- the second layer 12 could be removed for specific purposes when it has served its purpose as a structuring aid for the first layer 11.
- FIG. 16 shows a multi-layer body 10.
- first the first layer 11 is produced as a metal layer with a recessed lettering 19 .
- the second layer 12 is, as in Figure 16b shown, printed as a wavy patterned lacquer layer on the first layer 11 and then serves as an etching resist mask for further structuring of the first layer 11 in a lye bath. After etching you get the in Figure 16c Multi-layer body 10 shown, in which the colored lines of the second layer 12 continue in the area of the recessed lettering in perfect register with the remaining metallic lines of the first layer 11 outside of the lettering 19.
- the line widths do not have to be constant, but can also be modulated, which results in different local area densities of the grid, which form additional information.
- the line widths are preferably from 25 ⁇ m to 150 ⁇ m.
- the screen width can also be modulated and is preferably less than 300 ⁇ m and preferably less than 200 ⁇ m, and preferably more than 25 ⁇ m.
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Description
Die Erfindung betrifft ein Verfahren zur Herstellung eines Mehrschichtkörpers mit zwei Schichten bzw. Schichtsystemen.The invention relates to a method for producing a multi-layer body with two layers or layer systems.
Mehrschichtkörper als Sicherheitselement sind dem Stand der Technik als bekannt zu entnehmen und werden weithin zum Fälschungsschutz von Banknoten, Wertpapieren, Ausweisdokumenten oder auch zur Authentifizierung von Produkten verwendet. Sie beruhen auf einer Kombination von mehreren funktionalen Schichten, die beispielsweise optisch variable Elemente (OVD = Optical Variable Devices), diffraktive Elemente, partiell metallisierte Schichten oder gedruckte Merkmale aufweisen können.Multi-layer bodies as security elements are known from the prior art and are widely used to protect banknotes, securities, identity documents from counterfeiting or also to authenticate products. They are based on a combination of several functional layers, which can have, for example, optically variable elements (OVD=Optical Variable Devices), diffractive elements, partially metallized layers or printed features.
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Es ist dabei bekannt, solche Mehrschichtkörper durch die sequentielle Applikation einzelner Schichten unter Aufbau der gewünschten Schichtabfolge zu erzeugen. Um besonders fälschungssichere Mehrschichtkörper zu erhalten, ist es dabei wünschenswert, Merkmale der einzelnen Schichten nahtlos ineinander übergehen zu lassen. Mit anderen Worten sollen die Schichten möglichst genau im Register zueinander angeordnet werden. Bei einem sequentiellen Aufbau des Mehrschichtkörpers ist dies jedoch nicht immer zu bewerkstelligen, da die zur Erzeugung jeder individuellen Schicht verwendeten Verfahren bezüglich der relativen Lage der Schichten zueinander toleranzbehaftet sind. Dadurch können die gewünschten nahtlosen Übergänge zwischen den Merkmalen nicht zuverlässig erreicht werden, was die Fälschungssicherheit sowie das optische Erscheinungsbild eines solchen Mehrschichtkörpers beeinträchtigt.It is known to produce such multi-layer bodies by the sequential application of individual layers to build up the desired layer sequence. In order to obtain multi-layer bodies that are particularly forgery-proof, it is desirable to allow features of the individual layers to merge seamlessly into one another. In other words, the layers should be arranged in register with one another as precisely as possible. With a sequential construction of the multi-layer body, however, this cannot always be accomplished since the methods used to produce each individual layer are subject to tolerances with regard to the relative position of the layers to one another. As a result, the desired seamless transitions between the features cannot be reliably achieved, which impairs the security against forgery and the visual appearance of such a multi-layer body.
Unter Register oder Registergenauigkeit ist die lagegenaue Anordnung von übereinander liegenden Schichten relativ zueinander unter Einhaltung einer gewünschten Lagetoleranz zu verstehen.Register or register accuracy is to be understood as meaning the positionally accurate arrangement of layers lying one above the other in relation to one another while maintaining a desired positional tolerance.
Es ist somit Aufgabe der vorliegenden Erfindung, ein Verfahren zum Herstellen eines Mehrschichtkörpers anzugeben, welches die Herstellung eines Mehrschichtkörpers mit verbesserter Fälschungssicherheit ermöglicht.It is therefore the object of the present invention to specify a method for producing a multi-layer body which enables the production of a multi-layer body with improved security against forgery.
Diese Aufgabe wird durch ein Verfahren mit den Merkmalen des Patentanspruchs 1 gelöst.This object is achieved by a method having the features of
Indem die partielle zweite Schicht bzw. das partielle zweite Schichtsystem als Maske verwendet wird, um die partielle erste Schicht bzw. das partielle erste Schichtsystem zu strukturieren, wird es ermöglicht, die beiden Schichten bzw. Schichtsysteme exakt im Register zueinander anzuordnen. Dabei ist es insbesondere von Bedeutung, dass sich die zweite partielle Schicht bzw. das zweite partielle Schichtsystem nicht nur in diejenigen Bereiche erstreckt, die von der ersten partiellen Schicht bzw. dem ersten partiellen Schichtsystem bedeckt sind - also den ersten Teilbereich -, sondern auch in die von der ersten partiellen Schicht bzw. dem ersten partiellen Schichtsystem nicht bedeckten Bereiche - also den zweiten Teilbereich. Unter einer Verwendung der zweiten partiellen Schicht bzw. des zweiten partiellen Schichtsystems als Maske ist hierbei zu verstehen, dass beim Strukturieren der ersten partiellen Schicht bzw. des ersten partiellen Schichtsystem diese bzw. dieses in denjenigen Bereichen, die von der zweiten partiellen Schicht bzw. dem zweiten partiellen Schichtsystem bedeckt sind selektiv erhalten bleibt wird. Es ergibt sich daher bei der Strukturierung eine definierte Lagebeziehung zwischen den beiden Schichten bzw. Schichtsystemen, so dass diese registergenau zueinander angeordnet sind, beispielsweise nahtlos aneinander anschließen.By using the partial second layer or the partial second layer system as a mask in order to structure the partial first layer or the partial first layer system, it is possible to arrange the two layers or layer systems exactly in register with one another. It is particularly important that the second partial layer or the second partial layer system not only extends into those areas that are covered by the first partial layer or the first partial layer system - i.e. the first partial area - but also in the areas not covered by the first partial layer or the first partial layer system--ie the second partial area. Using the second partial layer or the second partial layer system as a mask is to be understood here that when structuring the first partial layer or the first partial layer system, this or this in those areas that are covered by the second partial layer or the second partial layer system is selectively covered. A defined positional relationship between the two layers or layer systems therefore results during the structuring, so that they are arranged in register with one another, for example adjoining one another seamlessly.
Unter Schichtsystem soll hierbei jegliche Anordnung mehrerer Schichten verstanden werden. Die Schichten können dabei in Richtung der Flächennormalen des Schichtsystems übereinander oder aber auch in einer Ebene nebeneinander angeordnet sein. Auch eine Kombination von derart horizontal und vertikal angeordneten Schichten ist möglich.A layer system is to be understood here as meaning any arrangement of a plurality of layers. The layers can be arranged one above the other in the direction of the surface normal of the layer system or also next to one another in one plane. A combination of such horizontally and vertically arranged layers is also possible.
Unter Überlappung wird dabei verstanden, dass die jeweiligen Teilbereiche in Richtung der Flächennormalen der von der ersten bzw. zweiten Schicht aufgespannten Ebenen, also in Stapelrichtung des Mehrschichtkörpers betrachtet zumindest teilweise übereinander liegen.Overlapping is understood here to mean that the respective subregions lie at least partially on top of one another in the direction of the surface normal of the planes spanned by the first or second layer, ie viewed in the stacking direction of the multi-layer body.
Die Erzeugung der beiden Schichten bzw. Schichtsysteme muss dabei nicht in der angegebenen Reihenfolge erfolgen, d.h. die zweite partielle Schicht bzw. das zweite partielle Schichtsystem kann auch vor der ersten partiellen Schicht bzw. dem ersten partiellen Schichtsystem erzeugt werden. Die Schichten bzw. Schichtsysteme können dabei direkt auf dem Substrat, direkt aufeinander oder unter Erzeugung beliebiger Zwischenschichten erzeugt werden.The two layers or layer systems do not have to be generated in the specified order, i.e. the second partial layer or the second partial layer system can also be generated before the first partial layer or the first partial layer system. The layers or layer systems can be produced directly on the substrate, directly one on top of the other or with the production of any intermediate layers.
Das Strukturieren der partiellen ersten Schicht bzw. des partiellen ersten Schichtsystems in Schritt c) erfolgt durch Ätzen. Die partielle zweite Schicht bzw. das partielle zweite Schichtsystem ist ein Ätzresist, bzw. umfasst einen Ätzresist.The partial first layer or partial first layer system is structured in step c) by etching. The partial second layer or the partial second layer system is an etching resist or comprises an etching resist.
Unter einem Ätzresist soll dabei eine Substanz verstanden werden, die gegenüber einem Ätzmittel beständig ist und die eine gegenüber dem Ätzmittel empfindliche Substanz vor einem Angriff durch das Ätzmittel dort schützen kann, wo sie diese bedeckt.An etch resist should be understood to mean a substance that is resistant to an etchant and one that is sensitive to the etchant substance from attack by the etchant where it covers it.
Bei dieser Ausführungsform wird nach Erzeugen der beiden Schichten bzw. Schichtsysteme also ein Ätzmittel auf den resultierenden Schichtstapel angewendet, das die erste partielle Schicht bzw. das erste partielle Schichtsystem dort entfernt, wo es nicht von der zweiten partiellen Schicht bzw. dem zweiten partiellen Schichtsystem bedeckt ist.In this embodiment, after the two layers or layer systems have been produced, an etchant is applied to the resulting layer stack, which removes the first partial layer or the first partial layer system where it is not covered by the second partial layer or the second partial layer system is.
Der Ätzresist ist dabei ein Lack, der insbesondere Bindemittel, Farbstoffe, Pigmente, insbesondere bunte oder unbunte Pigmente, Effektpigmente, Dünnfilmschichtsysteme, cholesterische Flüssigkristalle und/oder metallische oder nichtmetallische Nanopartikel umfassen kann. Damit erfüllt die zweite partielle Schicht bzw. das zweite partielle Schichtsystem nicht nur eine Schutzfunktion beim Strukturieren der ersten partiellen Schicht bzw. des ersten partiellen Schichtsystems, sondern kann selbst eine dekorative Wirkung entfalten. Es ist auch möglich, dass für die zweite partielle Schicht bzw. das zweite partielle Schichtsystem mehrere verschiedene Ätzresists, beispielsweise Resistlacke mit unterschiedlicher Farbgebung, verwendet werden, um weitere visuelle Effekte zu erzeugen.The etching resist is a lacquer that can include, in particular, binders, dyes, pigments, in particular colored or achromatic pigments, effect pigments, thin-film layer systems, cholesteric liquid crystals and/or metallic or nonmetallic nanoparticles. The second partial layer or the second partial layer system thus not only fulfills a protective function when structuring the first partial layer or the first partial layer system, but can itself develop a decorative effect. It is also possible for several different etching resists, for example resist lacquers with different colors, to be used for the second partial layer or the second partial layer system in order to produce further visual effects.
Das zum Strukturieren der ersten partiellen Schicht bzw. des ersten partiellen Schichtsystems verwendete Ätzmittel hängt dabei von der Zusammensetzung dieser Schicht bzw. dieses Schichtsystems ab. Für insbesondere weitgehend opake metallische Schichten oder insbesondere transparente oder transluzente HRI-Schichten (HRI = High Refractive Index) eignet sich beispielsweise Natriumhydroxid, Kaliumhydroxid, Natriumcarbonat, Tetramethylammoniumhydroxid oder Natrium-Ethylendiamintetraacetat. Für solche Ätzmittel eignen sich beispielsweise Ätzresiste auf der Basis von PVC (Polyvinylchlorid), Polyesterharzen, Acrylaten, wobei typischerweise weitere filmbildende Substanzen wie Nitrozellulose beigemischt sein können. Das Ätzen kann dabei durch mechanische Agitation, beispielsweise durch Bürsten, Bewegen des Ätzbades oder Ultraschallbehandlung unterstützt werden. Übliche Temperaturen für den Ätzvorgang liegen bevorzugt zwischen 15°C und 75°C.The etchant used to structure the first partial layer or the first partial layer system depends on the composition of this layer or this layer system. Sodium hydroxide, potassium hydroxide, sodium carbonate, tetramethylammonium hydroxide or sodium ethylenediaminetetraacetate, for example, is suitable for particularly largely opaque metallic layers or, in particular, transparent or translucent HRI layers (HRI=high refractive index). Etching resists based on PVC (polyvinyl chloride), polyester resins, acrylates, for example, are suitable for such etching agents, with other film-forming substances such as nitrocellulose typically being admixed. The etching can be supported by mechanical agitation, for example by brushing, moving the etching bath or ultrasonic treatment. Customary temperatures for the etching process are preferably between 15°C and 75°C.
Vorzugsweise kann die partielle zweite Schicht bzw. das partielle zweite Schichtsystem ein Schutzlack sein bzw. einen Schutzlack umfassen.The partial second layer or the partial second layer system can preferably be a protective lacquer or comprise a protective lacquer.
Unter Schutzlack soll dabei eine Substanz verstanden werden, welche in einem zum Belichten der partiellen ersten Schicht bzw. des partiellen ersten Schichtsystems verwendeten Wellenlängenbereich absorbiert. Bei der Belichtung werden die partiellen Schichten bzw. Schichtsysteme vollflächig mit Licht dieses Wellenlängenbereichs bestrahlt, vorzugsweise senkrecht zur Schichtebene. Übliche für die Belichtung verwendete Wellenlängen sind beispielsweise 250 nm bis 420 nm. Vorzugsweise erfolgt die Belichtung mit einer Dosis von 10 mJ/cm2 bis 500 mJ/cm2. Die Belichtungszeiten ergeben sich aus den Empfindlichkeiten der verwendeten Materialien und der Leistung der zur Verfügung stehenden Belichtungsquelle.Protective lacquer should be understood to mean a substance which absorbs in a wavelength range used for exposing the partial first layer or the partial first layer system. During exposure, the partial layers or layer systems are irradiated over their entire surface with light in this wavelength range, preferably perpendicularly to the layer plane. Typical wavelengths used for exposure are, for example, 250 nm to 420 nm. Exposure is preferably carried out with a dose of 10 mJ/cm 2 to 500 mJ/cm 2 . The exposure times result from the sensitivities of the materials used and the power of the available exposure source.
Wo die partielle zweite Schicht bzw. das partielle zweite Schichtsystem vorliegt, erreicht also weniger Licht dieser Wellenlänge die partielle erste Schicht bzw. das partielle erste Schichtsystem.Where the partial second layer or the partial second layer system is present, less light of this wavelength therefore reaches the partial first layer or the partial first layer system.
Es ist auch möglich, Ätzresists und Schutzlacke zu kombinieren, beispielsweise durch Zugabe von absorbierenden Substanzen, beispielsweise sogenannten UV-Absorbern, Farbstoffen, Farbpigmenten oder streuenden Substanzen, wie beispielsweise Titandioxid zu einem Ätzresistlack.It is also possible to combine etch resists and protective lacquers, for example by adding absorbing substances, for example so-called UV absorbers, dyes, color pigments or scattering substances, such as titanium dioxide, to an etch resist lacquer.
Der Schutzlack ist dabei vorzugsweise ein Lack, der insbesondere Bindemittel, Farbstoffe, Pigmente, insbesondere bunte oder unbunte Pigmente, Effektpigmente, Dünnfilmschichtsysteme, cholesterische Flüssigkristalle und/oder metallische oder nichtmetallische Nanopartikel umfasst. Geeignete Schutzlacke sind beispielsweise auf Basis PVC, Polyester oder Acrylaten formuliert. Damit erfüllt die zweite partielle Schicht bzw. das zweite partielle Schichtsystem nicht nur eine Schutzfunktion beim Strukturieren der ersten partiellen Schicht bzw. des ersten partiellen Schichtsystems, sondern kann selbst eine dekorative Wirkung entfalten. Es ist auch möglich, dass für die zweite partielle Schicht bzw. das zweite partielle Schichtsystem mehrere verschiedene Schutzlacke, beispielsweise mit unterschiedlicher Farbgebung, verwendet werden, um weitere visuelle Effekte zu erzeugen.The protective lacquer is preferably a lacquer that contains, in particular, binders, dyes, pigments, in particular colored or achromatic pigments, effect pigments, thin-film layer systems, cholesteric Includes liquid crystals and/or metallic or non-metallic nanoparticles. Suitable protective coatings are formulated, for example, based on PVC, polyester or acrylates. The second partial layer or the second partial layer system thus not only fulfills a protective function when structuring the first partial layer or the first partial layer system, but can itself develop a decorative effect. It is also possible for several different protective lacquers, for example with different colors, to be used for the second partial layer or the second partial layer system in order to produce further visual effects.
Um die gewünschte Strukturierung zu erreichen, ist es zweckmäßig, wenn die partielle erste Schicht bzw. das partielle erste Schichtsystem ein Fotolack ist, bzw. einen Fotolack umfasst.In order to achieve the desired structuring, it is expedient if the partial first layer or the partial first layer system is a photoresist or includes a photoresist.
Ein Fotolack ändert bei Belichtung in einem bestimmten Wellenlängenbereich seine chemischen und/oder physikalischen Eigenschaften, so dass die unterschiedlichen Eigenschaften der belichteten und unbelichteten Bereiche ausgenutzt werden können, um in einem der Bereiche den Fotolack selektiv zu entfernen. Beispielsweise verändert sich beim Belichten des Fotolacks dessen Löslichkeit gegenüber einem Lösemittel, welches nach der Belichtung zum Entwickeln des Fotolacks verwendet werden kann. Bei positiven Fotolacken wird bei dem an die Belichtung anschließenden Entwicklungsschritt selektiv der belichtete Bereich entfernt, bei negativen Fotolacken der unbelichtete Bereich. Ein Fotolack kann also auch als Waschlack dienen.A photoresist changes its chemical and/or physical properties when exposed to light in a specific wavelength range, so that the different properties of the exposed and unexposed areas can be used to selectively remove the photoresist in one of the areas. For example, when the photoresist is exposed to light, its solubility in relation to a solvent that can be used to develop the photoresist after exposure changes. In the case of positive photoresists, the exposed area is selectively removed in the development step following exposure, while in the case of negative photoresists the unexposed area is removed. A photoresist can also serve as a washable lacquer.
Geeignete positive Fotolacke sind beispielsweise AZ 1518 oder AZ 4562 von AZ Electronic Materials auf Basis von Phenolharz/Diazochinon. Geeignete negative Fotolacke sind beispielsweise AZ nLOF 2000 oder ma-N 1420 von micro resist technology GmbH beispielsweise auf Basis von Zimtsäurederivaten. Diese können vorzugsweise durch Bestrahlung mit Licht in einem Wellenlängenbereich von 250nm bis 440nm belichtet werden. Die benötigte Dosis richtet sich nach den jeweiligen Schichtdicken, der Wellenlänge der Belichtung und der Empfindlichkeit der Fotolacke.Suitable positive photoresists are, for example, AZ 1518 or AZ 4562 from AZ Electronic Materials based on phenolic resin/diazoquinone. Suitable negative photoresists are, for example, AZ nLOF 2000 or ma-N 1420 from micro resist technology GmbH, for example based on cinnamic acid derivatives. These can preferably be exposed by irradiation with light in a wavelength range from 250 nm to 440 nm. The required dose depends on the respective layer thickness, the exposure wavelength and the sensitivity of the photoresist.
Zur Entwicklung dieser Fotolacke eignet sich beispielsweise Tetramethylammoniumhydroxid. Die Entwicklung erfolgt bevorzugt bei Temperaturen von 15°C bis 65°C für eine bevorzugte Entwicklungszeit von 2 Sekunden bis zu wenigen Minuten Auch hier kann der Entwicklungsvorgang und die damit einhergehende lokale Entfernung des Fotolackes wieder durch mechanische Agitation, wie beispielsweise Bürsten, Wischen, Anströmen mit dem Entwicklungsmedium oder Ultraschallbehandlung unterstützt werden.Tetramethylammonium hydroxide, for example, is suitable for developing these photoresists. The development preferably takes place at temperatures of 15°C to 65°C for a preferred development time of 2 seconds to a few minutes. Here, too, the development process and the associated local removal of the photoresist can again be carried out by mechanical agitation, such as brushing, wiping, or flowing be assisted with the developing medium or ultrasonic treatment.
Auch der Fotolack kann insbesondere Bindemittel, Farbstoffe, Pigmente, insbesondere farbige Pigmente, Effektpigmente, Dünnfilmschichtsysteme, cholesterische Flüssigkristalle und/oder metallische oder nichtmetallische Nanopartikel enthalten, um zusätzliche dekorative Effekte zu erfüllen.The photoresist can also contain, in particular, binders, dyes, pigments, in particular colored pigments, effect pigments, thin-film layer systems, cholesteric liquid crystals and/or metallic or non-metallic nanoparticles in order to achieve additional decorative effects.
In den Schritten a) bzw. b) wird die partielle erste Schicht bzw. das partielle erste Schichtsystem und/oder die partielle zweite Schicht bzw. das partielle zweite Schichtsystem zunächst vollflächig oder zumindest in großflächigen Bereichen erzeugt und anschließend strukturiert. Das vollflächige oder großflächige Erzeugen kann dabei beispielsweise durch Drucken oder Bedampfen erfolgen.In steps a) and b), the partial first layer or the partial first layer system and/or the partial second layer or the partial second layer system is first produced over the entire surface or at least in large areas and then structured. The full-area or large-area production can take place, for example, by printing or vapor deposition.
Das anschließende Strukturieren der partiellen ersten Schicht bzw. des partiellen ersten Schichtsystems und/oder der partiellen zweiten Schicht bzw. des partiellen zweiten Schichtsystems in den Schritten a) bzw. b) erfolgt dann durch Ätzen. Dies erfolgt analog zur Strukturierung der partiellen ersten Schicht bzw. des partiellen ersten Schichtsystems in Schritt c), wie vorstehend beschrieben. Die benötigten Ätzresists können dabei wiederum Bestandteil eines oder beider der Schichtsysteme sein oder aber als zusätzliche Schichten aufgetragen werden. Diese Schichten können wiederum als Bestandteil der Schichtsysteme verbleiben oder auch in einem weiteren Schritt wieder abgelöst werden. Im Falle der Maskenbelichtung kann auch eine externe Belichtungsmaske verwendet werden, die auf die jeweilige Schicht bzw. das jeweilige Schichtsystem aufgelegt wird. Es sind jedoch auch Verfahren möglich, in denen beispielsweise mittels eines Lasers bestimmte Bereiche der ersten Schicht oder des ersten Schichtsystems partiell entfernt werden. Solche Verfahren eignen sich insbesondere zur individuellen Kennzeichnung von Sicherheitselementen.The subsequent structuring of the partial first layer or the partial first layer system and/or the partial second layer or the partial second layer system in steps a) or b) then takes place by etching. This takes place analogously to the structuring of the partial first layer or the partial first layer system in step c), as described above. The required etching resists can in turn be part of one or both of the layer systems or be applied as additional layers. These layers can in turn remain as part of the layer systems or can also be detached again in a further step. In the case of mask exposure, an external exposure mask can also be used, which is placed on the respective layer or the respective layer system. However, methods are also possible in which specific areas of the first layer or of the first layer system are partially removed, for example by means of a laser. Such methods are particularly suitable for the individual marking of security elements.
Beim Strukturieren der partiellen zweiten Schicht bzw. des partiellen zweiten Schichtsystems in Schritt b) erfolgt gleichzeitig die Strukturierung der partiellen ersten Schicht bzw. des partiellen ersten Schichtsystems gemäß Schritt c). Hierdurch wird ein besonders einfach und schnell durchzuführendes Verfahren geschaffen.When the partial second layer or the partial second layer system is structured in step b), the partial first layer or the partial first layer system is structured at the same time as in step c). This creates a method that can be carried out particularly simply and quickly.
Alternativ ist es auch möglich, dass in Schritt a) und/oder b) die partielle erste Schicht bzw. das partielle erste Schichtsystem und/oder die partielle zweite Schicht bzw. das partielle zweite Schichtsystem strukturiert erzeugt werden. Hierzu wird bevorzugt ein Druckverfahren verwendet, insbesondere Tiefdruck, Flexodruck, Offsetdruck, Siebdruck oder Digitaldruck, insbesondere Tintenstrahldruck.Alternatively, it is also possible for the partial first layer or the partial first layer system and/or the partial second layer or the partial second layer system to be produced in a structured manner in step a) and/or b). A printing process is preferably used for this purpose, in particular gravure printing, flexographic printing, offset printing, screen printing or digital printing, in particular inkjet printing.
Vorzugsweise ist bzw. umfasst die partielle erste Schicht bzw. das partielle erste Schichtsystem eine Reflexionsschicht aus einem insbesondere opaken Metall und/oder einem insbesondere transparenten oder transluzenten Material mit hohem Brechungsindex (damit ist ein hoher Realteil des komplexen Brechungsindex gemeint), und/oder zumindest eine ein-oder mehrfarbige Farblackschicht und/oder ein Fabry-Perot-Schichtsystem.Preferably, the partial first layer or the partial first layer system is or comprises a reflective layer made of a particularly opaque metal and/or a particularly transparent or translucent material with a high refractive index (this means a high real part of the complex refractive index), and/or at least a single-color or multicolor color coat and/or a Fabry-Perot layer system.
Es ist weiter bevorzugt, wenn die partielle zweite Schicht bzw. das partielle zweite Schichtsystem zumindest eine transparente, transluzente oder auch weitgehend opake einfarbige oder mehrfarbige Lackschicht, insbesondere einen Ätz- und/oder Schutzlack, und/oder ein Fabry-Perot-Schichtsystem ist oder umfasst. Durch die Verwendung bzw. Kombination solcher Schichten oder Schichtsysteme für die partielle erste und zweite Schicht bzw. das partielle erste und zweite Schichtsystem lassen sich vielfältige optische Effekte erzeugen, die weiter zur Fälschungssicherheit beitragen und das optische Erscheinungsbild besonders ansprechend gestalten.It is further preferred if the partial second layer or the partial second layer system is at least transparent, translucent or also largely is or comprises an opaque single-color or multi-color lacquer layer, in particular an etching and/or protective lacquer, and/or a Fabry-Perot layer system. By using or combining such layers or layer systems for the partial first and second layer or the partial first and second layer system, a variety of optical effects can be produced which further contribute to security against forgery and make the optical appearance particularly appealing.
Die partielle erste Schicht bzw. das partielle erste Schichtsystem und/oder die partielle zweite Schicht bzw. das partielle zweite Schichtsystem wird in Form zumindest eines Motivs, Musters, Symbols, Bilds, Logos oder alphanumerischer Charaktere, insbesondere Zahlen oder Buchstaben, aufgetragen. Die Schichten bzw. Schichtsysteme können sich auch bereits vor oder auch erst nach dem Strukturieren der partiellen ersten Schicht bzw. des partiellen ersten Schichtsystems zu einem solchen Motiv, Muster, Symbol, Bild, Logo oder zu alphanumerischen Charakteren, insbesondere Zahlen oder Buchstaben ergänzen. Ein derart erzeugtes graphisches Element, das durch die Zusammenwirkung mehrerer Schichten entsteht, ist besonders schwer zu reproduzieren und daher besonders fälschungssicher.The partial first layer or the partial first layer system and/or the partial second layer or the partial second layer system is applied in the form of at least one motif, pattern, symbol, image, logo or alphanumeric character, in particular numbers or letters. The layers or layer systems can also form such a motif, pattern, symbol, image, logo or alphanumeric characters, in particular numbers or letters, before or only after the structuring of the partial first layer or the partial first layer system. A graphic element produced in this way, which is created by the interaction of several layers, is particularly difficult to reproduce and is therefore particularly forgery-proof.
Es ist weiter vorteilhaft, wenn die partielle erste Schicht bzw. das partielle erste Schichtsystem und/oder die partielle zweite Schicht bzw. das partielle zweite Schichtsystem in Form eines ein- oder zweidimensionalen Linien- und/oder Punktrasters aufgetragen wird. Hierbei sind auch transformierte Linienraster möglich, beispielsweise mit wellenförmigen Linien, welche auch eine variable Linienbreite aufweisen können. Die Punkte eines Punktrasters können beliebige Geometrien und/oder Größen aufweisen und müssen nicht kreisscheibenförmig sein. Beispielsweise sind auch Punktraster aus dreieckigen, rechteckigen, beliebig polygonalen, sternförmigen oder in Form von Symbolen ausgebildeten Punkten möglich. Das Punktraster kann auch aus unterschiedlich großen und/oder unterschiedlich geformten Punkten aufgebraut sein. Gerade wenn ein solches Raster mit einem graphischen Element in der jeweils anderen Schicht bzw. im jeweils anderen Schichtsystem zusammenwirkt, können weitere graphische Effekte, wie beispielsweise Halbtonbilder erzeugt werden.It is also advantageous if the partial first layer or the partial first layer system and/or the partial second layer or the partial second layer system is applied in the form of a one-dimensional or two-dimensional grid of lines and/or points. In this case, transformed line grids are also possible, for example with wavy lines, which can also have a variable line width. The points of a point grid can have any geometry and/or size and do not have to be in the shape of a circular disk. For example, point grids made up of triangular, rectangular, any polygonal, star-shaped points or points designed in the form of symbols are also possible. The dot grid can also be made up of dots of different sizes and/or different shapes. It is precisely when such a grid interacts with a graphic element in the respective other layer or in the respective other layer system that further graphic effects, such as halftone images, can be produced.
Bevorzugt weist das Linien- und/oder Punktraster dabei eine Rasterweite von weniger als 300 µm, bevorzugt von weniger als 200 µm und von mehr als 25 µm und bevorzugt von mehr als 50 µm auf. Die Rasterweite kann über das Raster hinweg auch variieren. Linienstärken bzw. Punktdurchmesser betragen vorzugsweise von 25 µm bis 150 µm und können ebenfalls variieren. Solche Raster wirken sich aufandere graphische Elemente, die von dem Raster überlagert werden aus, werden aber selbst mit dem nackten menschlichen Auge nicht mehr als solche wahrgenommen.The line and/or point grid preferably has a grid width of less than 300 μm, preferably less than 200 μm and more than 25 μm and preferably more than 50 μm. The grid width can also vary across the grid. Line widths or point diameters are preferably from 25 μm to 150 μm and can also vary. Such grids affect other graphic elements that are overlaid by the grid, but are no longer perceived as such, even to the naked human eye.
Es ist weiter vorteilhaft, wenn das Substrat eine Trägerschicht, insbesondere eine Folie aus einem Kunststoff, bevorzugt Polyester, insbesondere PET (Polyethylenterephthalat), und/oder eine Ablöseschicht, beispielsweise aus einem Polymerlack, z.B. PMMA (Polymethylmethacrylat) oder aus wachsartigen Substanzen umfasst. Eine solche Trägerschicht verleiht dem Mehrschichtkörper bei seiner Herstellung und späteren Handhabung Stabilität und schützt ihn vor Beschädigung. Eine Ablöseschicht ermöglicht ein leichtes Ablösen des Sicherheitselements von nicht benötigten Schichten, wie der Trägerschicht, so dass es an dem gewünschten Dokument oder Objekt angebracht werden kann, insbesondere in Form einer Heißprägefolie mit der Trägerschicht als Trägerfolie und dem Sicherheitselement als von der Trägerfolie auf einen Untergrund zu übertragende Transferlage.It is also advantageous if the substrate comprises a carrier layer, in particular a film made from a plastic, preferably polyester, in particular PET (polyethylene terephthalate), and/or a release layer, for example made from a polymer lacquer, e.g. PMMA (polymethyl methacrylate) or from waxy substances. Such a carrier layer gives the multi-layer body stability during its production and later handling and protects it from damage. A detachment layer enables the security element to be easily detached from layers that are not required, such as the carrier layer, so that it can be attached to the desired document or object, in particular in the form of a hot stamping film with the carrier layer as the carrier film and the security element as the carrier film on a substrate transfer layer to be transferred.
Das Substrat umfasst eine Replizierschicht mit einem diffraktiven Oberflächenrelief. Die Replizierschicht kann aus einem thermoplastischen, d.h. thermisch härtbaren oder trockenbaren Replizierlack oder einem UV-härtbaren Replizierlack oder einer Mischung aus solchen Lacken bestehen.The substrate comprises a replication layer with a diffractive surface relief. The replication layer can consist of a thermoplastic, i.e. thermally curable or dryable replication lacquer or a UV-curable replication lacquer or a mixture of such lacquers.
Es ist dabei vorteilhaft, wenn das in die Replizierschicht eingebrachte Oberflächenrelief ein optisch variables Element, insbesondere ein Hologramm, Kinegram® oder Trustseal®, ein vorzugsweise sinusförmiges Beugungsgitter, eine asymmetrische Reliefstruktur, ein Blaze-Gitter, eine vorzugsweise isotrope oder anisotrope Mattstruktur, oder eine lichtbeugende und/oder lichtbrechende und/oder lichtfokussierende Mikro- oder Nanostruktur, eine binäre oder kontinuierliche Fresnellinse, eine Mikroprismenstruktur, eine Mikrolinsenstruktur oder eine Kombinationsstruktur daraus ausbildet.It is advantageous if the surface relief introduced into the replication layer is an optically variable element, in particular a hologram, Kinegram® or Trustseal® , a preferably sinusoidal diffraction grating, an asymmetric relief structure, a blazed grating, a preferably isotropic or anisotropic matte structure, or a light-diffracting and/or light-refracting and/or light-focusing micro- or nanostructure, a binary or continuous Fresnel lens, a microprism structure, a microlens structure or a combination structure thereof.
Durch solche Strukturen oder Kombinationen daraus lassen sich vielfältige optische Effekte erzielen, die zudem schwer nachzuahmen und mit üblichen optischen Kopiermethoden nicht oder nur schwer kopierbar sind, so dass sich ein besonders fälschungssicherer Mehrschichtkörper ergibt.A variety of optical effects can be achieved by such structures or combinations thereof, which are also difficult to imitate and cannot be copied or can only be copied with difficulty using conventional optical copying methods, resulting in a multilayer body that is particularly forgery-proof.
Es ist weiter zweckmäßig, wenn in einem weiteren Schritt d) eine dritte Schicht bzw. ein drittes Schichtsystem aufgetragen wird, welche bzw. welches insbesondere eine HRI-Schicht und/oder eine Klebstoffschicht ist bzw. umfasst.It is also expedient if, in a further step d), a third layer or a third layer system is applied, which is or comprises in particular an HRI layer and/or an adhesive layer.
Klebeschichten können benutzt werden, um den Mehrschichtkörper auf einem Untergrund, beispielsweise einem zu sichernden Dokument zu befestigen. HRI-Schichten sind besonders zweckmäßig im Zusammenhang mit flächig ausgedehnten Reliefstrukturen, die durch die transparente HRI-Schicht auch in Bereichen, in denen die erste und/oder zweite Schicht bzw. das erste und/oder zweite Schichtsystem keine opake metallisierte Schicht bereitstellen, sichtbar gemacht werden können. Als Material für eine HRI-Schicht eignet sich beispielsweise Zinksulfid, oder auch Titandioxid oder Zirkondioxid.Adhesive layers can be used to attach the multi-layer body to a substrate, for example a document to be secured. HRI layers are particularly expedient in connection with extensive relief structures which are made visible by the transparent HRI layer even in areas in which the first and/or second layer or the first and/or second layer system do not provide an opaque metallized layer can become. Zinc sulfide, for example, or also titanium dioxide or zirconium dioxide is suitable as a material for an HRI layer.
Ein derart erhältlicher Mehrschichtkörper kann als Sicherheitselement Anwendung finden, insbesondere für ein Sicherheitsdokument, insbesondere eine Banknote, ein Wertpapier, ein Ausweisdokument, einen Reisepass oder eine Kreditkarte.A multi-layer body obtainable in this way can be used as a security element, in particular for a security document, in particular a banknote, a security, an identity document, a passport or a credit card.
Im Folgenden wird die Erfindung anhand von mehreren Ausführungsbeispielen unter Zuhilfenahme der Zeichnung beispielhaft verdeutlicht. Lediglich die
- Fig. 1A-C:
- einen Mehrschichtkörper und die Herstellungsschritte eines Mehrschichtkörpers mit einer Metallschicht und einer einfarbigen Lackschicht;
- Fig. 2A-C:
- einen Mehrschichtkörper und die Herstellungsschritte eines Mehrschichtkörpers mit einer Metallschicht und einer zweifarbigen Lackschicht;
- Fig. 3:
- eine Schnittdarstellung durch ein erstes Zwischenprodukt bei der Herstellung eines Mehrschichtkörpers gemäß
Fig. 2 ; - Fig. 4:
- eine Schnittdarstellung durch ein zweites Zwischenprodukt bei der Herstellung eines Mehrschichtkörpers gemäß
Fig. 2 ; - Fig. 5:
- eine Schnittdarstellung durch ein drittes Zwischenprodukt bei der Herstellung eines Mehrschichtkörpers gemäß
Fig. 2 ; - Fig. 6:
- einen Mehrschichtkörpers mit einer Metallschicht, einer einfarbigen Lackschicht, einer diffraktiven Struktur und einer HRI-Schicht;
- Fig. 7A-C:
- einen Mehrschichtkörper und die Herstellungsschritte eines Mehrschichtkörpers mit zwei Metallschichten und einer einfarbigen Lackschicht;
- Fig. 8A-C:
- einen Mehrschichtkörper und Herstellungsschritte eines Mehrschichtkörpers mit einer Metallschicht, einer HRI-Schicht und einer einfarbigen Lackschicht;
- Fig. 9A-C:
- einen Mehrschichtkörper und Herstellungsschritte eines Mehrschichtkörpers mit einer feinstrukturierten Metallschicht und einer einfarbigen Lackschicht;
- Fig. 10:
- eine Schnittdarstellung durch ein erstes Zwischenprodukt bei der Herstellung eines Mehrschichtkörpers gemäß
Fig. 9 ; - Fig. 11:
- eine Schnittdarstellung durch ein zweites Zwischenprodukt bei der Herstellung eines Mehrschichtkörpers gemäß
Fig. 9 ; - Fig. 12:
- eine Schnittdarstellung durch ein drittes Zwischenprodukt bei der Herstellung eines Mehrschichtkörpers gemäß
Fig. 9 ; - Fig. 13:
- eine Schnittdarstellung durch den fertigen Mehrschichtkörper gemäß
Fig. 9 ; - Fig. 14
- eine Detailansicht der Strukturen für die Metall- und Lackschicht für den Mehrschichtkörper gemäß
Fig. 9 - Fig. 15A-C:
- einen Mehrschichtkörper und Herstellungsschritte eines Mehrschichtkörpers mit einer Metallschicht und einer frontseitigen Lackschicht;
- Fig. 16A-C:
- einen Mehrschichtkörper und Herstellungsschritte eines Mehrschichtkörpers mit einer gerasterten Metall- und Lackschicht;
- Fig. 17A-C:
- einen Mehrschichtkörper und Herstellungsschritte eines Mehrschichtkörpers mit einer feinstrukturierten Metallschicht und einer mehrfarbigen Lackschicht;
- Fig. 18A-E:
- einen Mehrschichtkörper und Herstellungsschritte eines Mehrschichtkörpers mit einer feinstrukturierten Metallschicht und einer einfarbigen Lackschicht;
- Fig. 1A-C:
- a multi-layer body and the manufacturing steps of a multi-layer body with a metal layer and a single-color paint layer;
- Fig. 2A-C:
- a multi-layer body and the production steps of a multi-layer body with a metal layer and a two-tone lacquer layer;
- Figure 3:
- a sectional view through a first intermediate product in the production of a multi-layer body according to
2 ; - Figure 4:
- a sectional view through a second intermediate product in the production of a multi-layer body according to
2 ; - Figure 5:
- a sectional view through a third intermediate product in the production of a multi-layer body according to
2 ; - Figure 6:
- a multi-layer body with a metal layer, a monochromatic lacquer layer, a diffractive structure and an HRI layer;
- Fig. 7A-C:
- a multi-layer body and the production steps of a multi-layer body with two metal layers and a single-color lacquer layer;
- Fig. 8A-C:
- a multi-layer body and manufacturing steps of a multi-layer body having a metal layer, an HRI layer and a single-color paint layer;
- Fig. 9A-C:
- a multi-layer body and production steps of a multi-layer body with a finely structured metal layer and a single-color lacquer layer;
- Figure 10:
- a sectional view through a first intermediate product in the production of a multi-layer body according to
9 ; - Figure 11:
- a sectional view through a second intermediate product in the production of a multi-layer body according to
9 ; - Figure 12:
- a sectional view through a third intermediate product in the production of a multi-layer body according to
9 ; - Figure 13:
- according to a sectional view through the finished multi-layer body
9 ; - 14
- a detailed view of the structures for the metal and lacquer layer for the multi-layer body according to FIG
9 - Fig. 15A-C:
- a multi-layer body and manufacturing steps of a multi-layer body with a metal layer and a front lacquer layer;
- Fig. 16A-C:
- a multi-layer body and production steps of a multi-layer body with a gridded metal and lacquer layer;
- Fig. 17A-C:
- a multi-layer body and production steps of a multi-layer body with a finely structured metal layer and a multicolored lacquer layer;
- Fig. 18A-E:
- a multi-layer body and production steps of a multi-layer body with a finely structured metal layer and a single-color lacquer layer;
Wie
Anschließend kann die erste aufgedampfte Schicht mittels bekannter Verfahren partiell entfernt werden, beispielsweise durch das partielle Auftragen eines Ätzresists nach dem Bedampfen und anschließendes Ätzen inklusive Entfernen des Ätzresists; durch das partielle Auftragen eines Waschlacks vor dem Bedampfen und Abwaschen (Lift-Off) nach dem Bedampfen oder durch partielles Auftragen eines Fotolacks nach dem Bedampfen und anschließendes Belichten und nachfolgendes Entfernen der belichteten oder unbelichteten Bestandteile des Fotolacks je nach Art (positiv, negativ) des Fotolacks.The first vapor-deposited layer can then be partially removed using known methods, for example by partially applying an etch resist after the vapor deposition and subsequent etching including removal of the etch resist; by the partial application of a wash lacquer before the vapor deposition and washing off (lift-off) after the vapor deposition or by the partial application of a photoresist after the vapor deposition and subsequent exposure and subsequent Removal of the exposed or unexposed parts of the photoresist depending on the type (positive, negative) of the photoresist.
Alternativ wird das Substrat nicht vollflächig bedampft, die Schicht 11 wird vielmehr partiell erzeugt, so dass sie in einem ersten Bereich 111 vorliegt und in einem zweiten Bereich 112 nicht vorhanden ist. Es sind hierzu verschiedene Verfahren bekannt, wie beispielsweise Abschirmung mittels einer mitlaufenden Maske oder Druck eines Öls, welches die Abscheidung der Metallschicht im Aufdampfprozess verhindert.Alternatively, the substrate is not vapour-deposited over the entire surface, the
Auf dem Substrat kann vorher bereits eine replizierte diffraktive Struktur, beispielsweise in Form eines optisch variablen Elements (OVD = optical variable device), insbesondere ein Hologramm, Kinegram® oder Trustseal®, ein vorzugsweise sinusförmiges Beugungsgitter, eine asymmetrische Reliefstruktur, ein Blaze-Gitter, eine vorzugsweise isotrope oder anisotrope Mattstruktur, oder eine lichtbeugende und/oder lichtbrechende und/oder lichtfokussierende Mikro- oder Nanostruktur, eine binäre oder kontinuierliche Fresnellinse, eine Mikroprismenstruktur, eine Mikrolinsenstruktur oder eine Kombinationsstruktur daraus, aufgebracht worden sein. Diese muss aber nicht notwendigerweise vorliegen.A replicated diffractive structure, for example in the form of an optically variable element (OVD=optical variable device), in particular a hologram, Kinegram® or Trustseal® , a preferably sinusoidal diffraction grating, an asymmetric relief structure, a blaze grating, a preferably isotropic or anisotropic matt structure, or a light-diffracting and/or light-refracting and/or light-focusing micro- or nanostructure, a binary or continuous Fresnel lens, a microprism structure, a microlens structure or a combination structure thereof. However, this does not necessarily have to be the case.
Die erste Schicht 11 muss auch nicht, wie gezeigt, zusammenhängend vorliegen, sondern kann beliebig strukturiert sein und eine beliebige Form aufweisen.The
Im nächsten Schritt wird die zweite Schicht 12, hier in Form eines strahlenförmigen Musters, auf die erste Schicht aufgedruckt. Als Drucktechnik wird dabei vorzugsweise Tiefdruck, Flexodruck, Offsetdruck, Siebdruck oder Digitaldruck, insbesondere Tintenstrahldruck, verwendet.In the next step, the
Hierbei erstreckt sich die zweite Schicht 12 sowohl in den von der ersten Schicht 11 bedeckten Bereich 111, deckt diesen aber nicht vollständig ab, als auch in den von der ersten Schicht 11 nicht bedeckten Bereich 112. Falls eine replizierte diffraktive Struktur vorliegt, erfolgt der Druck bevorzugt im Register zu dieser Struktur, wobei je nach Druckverfahren Toleranzen von +/- 1 mm, bevorzugt +/-0,5 mm angestrebt werden.In this case, the
Der zum Druck der zweiten Schicht 12 verwendete Lack ist ein Ätzresist, also resistent gegenüber einem Ätzmittel, welches das Metall der ersten Schicht 11 auflösen kann. Bei der Verwendung von Aluminium für die erste Schicht kann dieses Ätzmittel beispielsweise Natronlauge sein. Als Ätzresist eignet sich dann beispielsweise ein Lack auf Basis von PVC/PVAc (Polyvinylacetat)-Copolymer.The lacquer used to print the
Der Lack enthält ferner Farbstoffe, Pigmente, insbesondere bunte oder unbunte Pigmente oder Effektpigmente, Dünnfilmschichtsysteme oder cholesterische Flüssigkristalle oder Nanopartikel, so dass er einen optisch sichtbaren Effekt erzeugt.The paint also contains dyes, pigments, in particular colored or achromatic pigments or effect pigments, thin-film layer systems or cholesteric liquid crystals or nanoparticles, so that it produces an optically visible effect.
Nach dem Druck der zweiten Schicht 12 wird das in
Anstelle einer Metallschicht als erste Schicht 11 können auch mehrere aneinandergrenzende Farbschichten verwendet werden, die auf das Substrat aufgedruckt werden. Geeignete Lacke hierfür sind beispielsweise Fotolacke, wie beispielsweise AZ 1518 von AZ Electronic Materials. Die zweite Schicht 12 ist dann bevorzugt ein Schutzlack, beispielsweise ein transparenter oder opaker Lack mit einem UV-Blocker. Hierfür eignen sich insbesondere Benzophenon-Derivate oder hochdisperses Titandioxid. Die zweite Schicht 12 wird dann bevorzugt überlappend mit den Grenzbereichen der Farbschichten der ersten Schicht 11 aufgedruckt. Nach vollflächiger Belichtung in einem Wellenlängenbereich von vorzugsweise 320 nm bis 430 nm, einer bevorzugten Belichtungsdosis von 10 mJ/cm2 bis 500 mJ/cm2 und Ätzen mit beispielsweise 0,3% NaOH bei einer bevorzugten Temperatur von etwa 50°C für eine Zeit von vorzugsweise 10 Sekunden bis 30 Sekunden verbleiben dann lediglich die Farbbestandteile der ersten Schicht 11, wo sie durch die zweite Schicht 12 abgedeckt wurden und bilden so ein mehrfarbiges Dekor. Liegt z.B. die zweite Schicht 12 in Form von Guillochenlinien vor, so zeigt der fertige Mehrschichtkörper 10 Guillochenlinien, in denen sich Farbübergänge zeigen, also einen sogenannten Irisdruck.Instead of a metal layer as the
Der in
Nach dem Ätzen, das wie in
Auch hier kann, wie anhand
Die
Hierzu wird zunächst auf eine Trägerschicht 13 aus Polyester, insbesondere PET eine Ablöseschicht 14 und eine Replizierschicht 15 aus beispielsweise einem thermoplastischen Kunststoff oder einem strahlungs- oder temperaturhärtbaren Replizierlack aufgebracht, wobei diese Schichten wiederum aus mehreren Lagen bestehen können. In die Replizierschicht 15 werden dann diffraktive Strukturen 151 eingeformt, beispielsweise durch Prägen mit einem metallischen Prägewerkzeug. Auf die Replizierschicht 15 wird nun die erste Schicht 11 aufgetragen, die in diesem Fall als Schicht aus einem transparenten hochbrechenden Material (HRI = High Refractive Index), beispielsweise aus Zinksulfid oder Titandioxid, ausgebildet ist. Auf die erste Schicht 11 wird dann vollflächig oder zumindest in großflächigen Bereichen die zweite Schicht 12 aufgetragen, die wiederum aus zwei verschiedenfarbigen Lacken 121, 122 besteht, die aneinander angrenzen. Die Lacke 121, 122 sind dabei UVempfindliche Fotolacke, wie beispielsweise AZ 1518 von AZ Electronic Materials auf Basis von Phenolharz/Diazochinon. Anschließend wird eine Maskenschicht 16 partiell auf die zweite Schicht 12 aufgedruckt. Die Maskenschicht 16 dient dabei gleichzeitig als Ätz- und Schutzlack. Hierzu kann ein Ätzresistlack, beispielsweise auf Basis von PVC/PVAc (Polyvinylacetat)-Copolymer, beispielsweise mit UVabsorbierenden Titandioxidpartikeln oder anderen UV-Blockern versehen werden. Anschließend erfolgt eine Belichtung mit UV-Licht von der Seite der Maskenschicht 16 her. Die Belichtung erfolgt bevorzugt bei einer Wellenlänge von 365 nm mit einer Dosis von 25 mJ/cm2 bis 500 mJ/cm2.For this purpose, a
Das in
Hierfür eignet sich beispielsweise NaOH in einer bevorzugten Konzentration von 0,05% bis 2,5%, welches bevorzugt für eine Zeitdauer von 2 Sekunden bis 60 Sekunden bei einer Temperatur von 20°C bis 65°C auf das Zwischenprodukt einwirkt.NaOH is suitable for this purpose, for example, in a preferred concentration of 0.05% to 2.5%, which preferably acts on the intermediate product for a period of 2 seconds to 60 seconds at a temperature of 20° C. to 65° C.
In den nicht von der Maskenschicht 16 geschützten Bereichen wurde der Fotolack 121, 122 der Schicht 12 während der UV-Bestrahlung belichtet und löst sich daher nun im Entwicklerbad auf. Man erhält das in
In
Diffraktive Strukturen sind somit in den opaken metallischen Bereichen der ersten Schicht 11 und in den Bereichen der transparenten HRI-Schicht 17, jedoch typischerweise nicht in den Druckbereichen der zweiten Schicht 12 erkennbar, weil die diffraktiven Strukturen durch den direkt auf die diffraktiven Strukturen gedruckten Farblack der zweiten Schicht 12 ausgelöscht sind, weil der Farblack bevorzugt einen ähnlichen Brechungsindex (etwa 1,5) wie die Replizierschicht aufweist und daher keine optisch wirksame Grenzschicht zwischen Farblack und Replizierschicht ausgebildet wird. Dabei sollten sich bevorzugt die Brechungsindizes beider benachbarter Schichten um nicht mehr als 0,1 voneinander unterscheiden.Diffractive structures can thus be seen in the opaque metallic areas of the
Das Ausführungsbeispiel gemäß
Die Strukturierung der ersten Schicht 11 kann in zwei Schritten erfolgen, da beispielsweise unterschiedliche Ätzmittel für die beiden verwendeten Metalle oder Metalllegierungen eingesetzt werden müssen. Im Falle der Verwendung von Al und Cu für die erste Schicht 11 sind dies beispielsweise NaOH und FeCl3 Da zur Strukturierung jedoch dieselbe aufgedruckte Maske, nämlich die zweite Schicht 12, verwendet wird, erfolgen die Übergänge der beiden Metalle 113, 114 der ersten Schicht 11 im perfekten Register, das heißt in exakter relativer Lage zum Druck der zweiten Schicht 12.The
Das Ausführungsbeispiel nach
Anschließend wird mit einer beispielsweise roten Farbschicht als zweite Schicht 12 überdruckt, so dass sich die Situation gemäß
In einem weiteren Verfahrensschritt werden die nicht überdruckten Bereiche der beiden Reflexionsschichten 113, 17 entfernt, ggf. auch in zwei Verfahrensschritten mit entsprechend den zu entfernenden Schichten angepassten Chemikalien, z.B. zwei unterschiedlichen Laugen. Während zur Entfernung der Aluminiumanteile NaOH unter den beschriebenen Bedingungen verwendet werden kann, wird zum Entfernen einer HRI-Schicht aus ZnS vorzugsweise ebenfalls NaOH oder auch Na2CO3 bei einer Temperatur von 20°C bis 60°C für einen Zeitraum von 5 Sekunden bis 60 Sekunden verwendet.In a further process step, the areas of the two
Der fertige Mehrschichtkörper ist in
Die
Anschließend erfolgt der farbige Druck der zweiten Schicht 12 gemäß
Im letzten Schritt dient der farbige Druck der Schicht 12 als Maske zum registergenauen Entfernen der ersten Schicht 11, so dass der in
Sind erste Schicht 11 und zweite Schicht 12 beispielsweise fein strukturierte Linienraster, kommt es je nach deren relativer Lage zueinander zu Überlagerungseffekten und die final entstehende Struktur ist eine fein strukturierte Überlagerungsstruktur der ersten Schicht 11 und zweiten Schicht 12. Die
Überlagerungsstruktur kann dabei beispielsweise einen gewünschten Moire-Effekt erzeugen.If the
In this case, the overlay structure can produce a desired moiré effect, for example.
Die feine Strukturierung der ersten Schicht 11 kann beispielsweise auch als Guilloche aus einer Vielzahl von feinen Linien, bevorzugt als metallischeReflexionsschicht in Kombination mit beugungsoptischen Strukturenbeispielsweise mit einem KINEGRAM®, ausgeführt sein, wie dies
Der farbige Druck kann dabei mehrere unterschiedlich farbige Bereiche, beispielsweise in Form einer Landesflagge (wie hier gezeigt) und/oder einer geographischen Kontur eines Landes oder in Form eines Wappens oder eines anderen mehrfarbigen Motivs aufweisen. Im letzten Schritt dient der farbige Druck der Schicht 12 als Maske zumregistergenauen Entfernen der ersten Schicht 11 , so dass der in
In der in
Eine andere Ausführungsform mit einer fein strukturierten ersten Schicht 11 zeigt
Anschließend erfolgt der Druck der zweiten Schicht 12 gemäß
Entsprechend der mit Ätzresist belegten Fläche der ersten Schicht 11 wird die feine Struktur der ersten Schicht 11 in den Bereichen mittels Ätzen entfernt, in der der Ätzresist nicht vorgesehen ist.Corresponding to the area of the
Anschließend wird ein farbiger Fotolack aufgedruckt, welcher zumindest den Bereich umfasst, welcher nicht vom farblosen Ätzresist bedeckt ist. Der Fotolack kann aber auch mit dem Ätzresist überlappen. Durch Belichtung des eingefärbten Fotolacks unter Verwendung des farblosen Ätzresists mit dem UV-Absorber als Belichtungsmaske wird der farbige Fotolack in denjenigen Bereichen ausgehärtet, die keinen transparenten Ätzresist aufweisen und kann in den übrigen Bereichen registergenau zu dem Ätzresist und zu den durch den Ätzresist geschützten und definierten Bereichen der fein strukturierten ersten Schicht 11 entfernt werden.A colored photoresist is then printed on, which covers at least the area that is not covered by the colorless etching resist. However, the photoresist can also overlap with the etch resist. By exposing the colored photoresist using the colorless etch resist with the UV absorber as an exposure mask, the colored photoresist is cured in those areas that do not have a transparent etch resist and can register in the remaining areas with the etch resist and the areas protected and defined by the etch resist Areas of the finely structured
In der in
Die
Hierzu wird zunächst auf eine Trägerschicht 13 aus Polyester oder PET eine Ablöseschicht 14 und eine Replizierschicht 15 aufgebracht. In die Replizierschicht 15 werden dann diffraktive Strukturen 151 eingeformt. Auf die Replizierschicht 15 wird nun die erste Schicht 11 aufgetragen, die in diesem Fall als fein strukturierte Metallschicht, beispielsweise in Form eines Rasters, vorliegt.For this purpose, a
Auf die erste Schicht 11 wird dann, wie in
Anstelle einer Maskenschicht 16 kann auch eine Filmmaske eingesetzt werden, die nur während des Belichtungsprozesses im Kontakt mit den Schichten 121 und 122 aufliegt und anschließend wieder entfernt wird.Instead of a
Das in
Rasterungen der ersten Schicht 11 und der zweiten Schicht 12 sind in
In einem weiteren Schritt wird ein erster partieller Metallbereich (erste Schicht 11) erzeugt, wie in
Im nächsten Schritt wird der bereits im Vormaterial vorhandene Druck als Belichtungsmaske für eine darauf aufgebrachte Fotolackschicht genutzt, um im perfekten Register zum Druck der zweiten Schicht 12 die erste Schicht 11 zu strukturieren. Die verwendeten Materialien und Verfahrensparameter entsprechen dabei den oben bereits beschriebenen.In the next step, the print already present in the starting material is used as an exposure mask for a photoresist layer applied thereto in order to structure the
Die zweite Schicht 12 wird also zeitlich und örtlich vollkommen unabhängig von der ersten Schicht 11 erzeugt. Die zweite Schicht 12 kann beispielsweise auch auf der Rückseite des nicht gezeigten Substrats angeordnet sein und die erste Schicht 11 auf dessen Vorderseite. Optional könnte man für bestimmte Zwecke die zweite Schicht 12 entfernen, wenn sie als Strukturierungshilfe für die erste Schicht 11 ausgedient hat.The
In Aufsicht sind somit sowohl farbige metallische Bereiche mit den diffraktiven Strukturen zu erkennen, als auch nur farbige Bereiche ohne diffraktiven Wirkung, wobei diese Bereiche, entsprechend den Schichten 11, 12 im perfekten Register zueinander ineinander übergehen.Both colored metallic areas with the diffractive structures and only colored areas without a diffractive effect can thus be seen in a top view, with these areas merging into one another in perfect register, corresponding to the
Die Linienbreiten müssen dabei nicht konstant sein, sondern können zusätzlich moduliert sein, wodurch sich unterschiedliche lokale Flächendichten des Rasters ergeben, die eine zusätzliche Information bilden. Die Linienbreiten betragen vorzugsweise von 25 µm bis 150 µm.. Auch die Rasterweite kann moduliert werden und beträgt vorzugsweise weniger als 300 µm und bevorzugt weniger als 200 µm, sowie vorzugsweise mehr als 25 µm. The line widths do not have to be constant, but can also be modulated, which results in different local area densities of the grid, which form additional information. The line widths are preferably from 25 μm to 150 μm. The screen width can also be modulated and is preferably less than 300 μm and preferably less than 200 μm, and preferably more than 25 μm.
Claims (8)
- Method for producing a
security element (10), comprising the following steps:a) generating a partial first layer (11) or a partial first layer system on a substrate, wherein the partial first layer (11) or the partial first layer system is present in a first sub-region (111) and it is not present in a second sub-region (112);b) generating a partial second layer (12) or a partial second layer system, wherein the partial second layer (12) or the partial second layer system is present in a third sub-region and it is not present in a fourth sub-region, and wherein the third sub-region overlaps with the first (111) and second sub-region (112);c) structuring the partial first layer (11) or the partial first layer system by using the partial second layer (12) or the partial second layer system as a mask, wherein, when structuring the first partial layer (11) or the first partial layer system, this first partial layer (11) or first partial layer system remains selectively maintained in those regions, in particular in the third sub-region, which are covered by the second partial layer (12) or the second partial layer system, andwherein the partial second layer (12) or the partial second layer system is an etch resist, or comprises at least one etch resist, which is a lacquer, which comprises, in particular, binding agents, pigments, in particular multi-coloured or non-coloured pigments and/or effect pigments, thin film layer systems, cholesteric liquid crystals, colourants and/or metallic or non-metallic nanoparticles, andwherein in steps a) and/or b), the partial first layer (11) or the partial first layer system and/or the partial second layer (12) or the partial second layer system is firstly generated over the entire surface or at least in regions covering a large surface area and is then structured, wherein the structuring of the partial first layer (11) or the partial first layer system and/or the partial second layer (12) or the partial second layer system in steps a) or b) takes place by means of etching, andwherein, at the same time, the structuring of the partial first layer (11) or the partial first layer system takes place according to step c) when structuring the partial second layer (12) or the partial second layer system in step b), andwherein the partial first layer (11) or the partial first layer system and/or the partial second layer (12) or the partial second layer system is applied in the form of at least one motif, pattern, symbol, image, logo or alphanumerical character, andwherein the substrate comprises a replication layer with a diffractive surface relief, or the substrate itself is formed as a replication layer. - Method according to claim 1,
characterised in that
the structuring of the partial first layer (11) or the partial first layer system in step c) takes place by means of etching. - Method according to one of claims 1 to 2,
characterised in that
the structuring of the partial first layer (11) or the partial first layer system in step c) takes place by means of mask exposure. - Method according to claim 3,
characterised in that
the partial second layer system comprises at least one protective lacquer. - Method according to claim 3 or 4,
characterised in that
the partial first layer (11) or the partial first layer system is a photo lacquer or comprises at least one photo lacquer. - Method according to one of claims 1 to 5,
characterised in that,
in step a) and/or b), the partial first layer (11) or the partial first layer system and/or the partial second layer (12) or the partial second layer system are generated in a structured manner. - Method according to one of claims 1 to 6,
characterised in that
the partial first layer (11) or the partial first layer system and/or the partial second layer (12) or the partial second layer system is applied in the form of at least one motif, pattern, symbol, image, logo or alphanumerical character, numbers and/or letters. - Method according to one of claims 1 to 7,
characterised in that
the partial first layer (11) or the partial first layer system and/or the partial second layer (12) or the partial second layer system is applied in the form of a one- or twodimensional line- and/or point grid, which has, in particular, a grid width of less than 300 µm, preferably of less than 200 µm, and of more than 25 µm, preferably more than 50 µm.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
RS20190222A RS58357B2 (en) | 2013-11-29 | 2014-11-28 | Multi-layer body as security element and method for the production thereof |
PL14805273.1T PL3074239T5 (en) | 2013-11-29 | 2014-11-28 | Multi-layer body as security element and method for the production thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013113283.9A DE102013113283A1 (en) | 2013-11-29 | 2013-11-29 | Multilayer body and method for its production |
PCT/EP2014/075928 WO2015079017A1 (en) | 2013-11-29 | 2014-11-28 | Multi-layer body and method for the production thereof |
Publications (3)
Publication Number | Publication Date |
---|---|
EP3074239A1 EP3074239A1 (en) | 2016-10-05 |
EP3074239B1 EP3074239B1 (en) | 2018-12-19 |
EP3074239B2 true EP3074239B2 (en) | 2022-04-13 |
Family
ID=51999431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14805273.1A Active EP3074239B2 (en) | 2013-11-29 | 2014-11-28 | Multi-layer body as security element and method for the production thereof |
Country Status (11)
Country | Link |
---|---|
US (2) | US9956807B2 (en) |
EP (1) | EP3074239B2 (en) |
JP (1) | JP6634659B2 (en) |
CN (1) | CN105793060B (en) |
CA (1) | CA2930911C (en) |
DE (1) | DE102013113283A1 (en) |
ES (1) | ES2711547T5 (en) |
PL (1) | PL3074239T5 (en) |
RS (1) | RS58357B2 (en) |
TR (1) | TR201902966T4 (en) |
WO (1) | WO2015079017A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102015104416A1 (en) * | 2015-03-24 | 2016-09-29 | Leonhard Kurz Stiftung & Co. Kg | Multilayer body and method for its production |
DE102015015991A1 (en) * | 2015-12-10 | 2017-06-14 | Giesecke & Devrient Gmbh | Security element with lenticular image |
FR3057205B1 (en) * | 2016-10-10 | 2020-10-16 | Arjowiggins Security | MANUFACTURING PROCESS OF A SAFETY ELEMENT |
DE102017106721A1 (en) | 2017-03-29 | 2018-10-04 | Leonhard Kurz Stiftung & Co. Kg | Method for producing a multilayer film and a multilayer film, and a security element and a security document |
US11167581B2 (en) | 2018-04-06 | 2021-11-09 | Proof Authentication Corporation | Authentication hologram |
DE102018003030A1 (en) * | 2018-04-13 | 2019-10-17 | Giesecke+Devrient Currency Technology Gmbh | Security element, method for producing the same and equipped with the security element disk |
CA3007268C (en) * | 2018-06-05 | 2023-12-12 | Canadian Bank Note Company, Limited | Method for making a security document comprising a thermosplastic substrate and uv-cured image and security document formed thereby |
CN113795389B (en) | 2019-05-20 | 2024-08-20 | 克瑞尼股份有限公司 | Tuning the refractive index of a polymer matrix layer using nanoparticles to optimize micro-optical (MO) focusing |
CN111748770B (en) * | 2020-06-18 | 2022-04-05 | 苏州希声科技有限公司 | Grating forming process of ultrasonic rotary encoder |
EP4271572A1 (en) * | 2020-12-29 | 2023-11-08 | EPTAINKS S.p.A. | Security element for documents, particularly banknotes, and method for its production |
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- 2014-11-28 JP JP2016534897A patent/JP6634659B2/en active Active
- 2014-11-28 US US15/038,874 patent/US9956807B2/en active Active
- 2014-11-28 WO PCT/EP2014/075928 patent/WO2015079017A1/en active Application Filing
- 2014-11-28 CA CA2930911A patent/CA2930911C/en active Active
- 2014-11-28 PL PL14805273.1T patent/PL3074239T5/en unknown
- 2014-11-28 RS RS20190222A patent/RS58357B2/en unknown
- 2014-11-28 ES ES14805273T patent/ES2711547T5/en active Active
- 2014-11-28 CN CN201480065028.1A patent/CN105793060B/en active Active
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2018
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Also Published As
Publication number | Publication date |
---|---|
ES2711547T5 (en) | 2022-07-12 |
RS58357B1 (en) | 2019-03-29 |
PL3074239T3 (en) | 2019-06-28 |
US9956807B2 (en) | 2018-05-01 |
WO2015079017A1 (en) | 2015-06-04 |
ES2711547T3 (en) | 2019-05-06 |
PL3074239T5 (en) | 2022-07-18 |
US10850551B2 (en) | 2020-12-01 |
CN105793060A (en) | 2016-07-20 |
JP6634659B2 (en) | 2020-01-22 |
EP3074239B1 (en) | 2018-12-19 |
US20180290480A1 (en) | 2018-10-11 |
CN105793060B (en) | 2017-10-24 |
CA2930911C (en) | 2021-12-28 |
TR201902966T4 (en) | 2019-03-21 |
RS58357B2 (en) | 2022-06-30 |
EP3074239A1 (en) | 2016-10-05 |
DE102013113283A1 (en) | 2015-06-03 |
US20170028765A1 (en) | 2017-02-02 |
JP2017500607A (en) | 2017-01-05 |
CA2930911A1 (en) | 2015-06-04 |
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