EP2936556A1

EP2936556A1 - Electronic module with a plastic-coated electronic circuit and method for the production thereof

Info

Publication number: EP2936556A1
Application number: EP13805754.2A
Authority: EP
Inventors: Martin Steinau; Thomas Schmidt; Bernhard Schuch
Original assignee: Conti Temic Microelectronic GmbH
Current assignee: Conti Temic Microelectronic GmbH
Priority date: 2012-12-20
Filing date: 2013-11-11
Publication date: 2015-10-28
Also published as: US20150359107A1; WO2014094754A1; DE102012112738A1; DE112013006131A5; JP2016502279A

Abstract

An electronic module for use as a control device in a motor vehicle, comprising a plastic-coated electronic circuit (1) with at least one organic HDI circuit carrier (5) for assembly, the electronic circuit (1) being arranged on a cooling body (3), and electrically-conductive conductor structures (6) for electrically connecting the electronic circuit (1) to electric components outside of the electronic module. The circuit carrier (5) is thermally and conductively connected to the cooling body (3), and the electronic circuit (1) and the cooling body (3) are coated in plastic (2) in such a manner that only the rear side of the cooling body (3) lying opposite the circuit carrier (5) are at least partially free of plastic, and at least the contact ends (8) of the conductor structures (6), which make the electrical connection to the electronic components outside the electronic module are free of plastic. The result is the electronic module and a method for the production thereof.

Description

Electronic module with a plastic-encased electronic circuit and method for its production

The invention relates to an electronic module with a plastic covered

Electronic circuit according to the preamble of claim 1, and a method for its production according to claim 12.

In the automotive industry, it is now common to control devices in the controlled

Automotive assembly, in particular engine or transmission to integrate. Above all, the gearbox control units form a very compact unit as a local control unit. in the

Compared to the conventional use of external control devices, this arrangement has enormous advantages in terms of quality, cost, weight and functionality. In particular, this results in a significant reduction of connectors and lines, and thus of possible causes of failure.

The integration of the control unit in the transmission makes high demands, especially on its thermal and mechanical strength. The functionality must be ensured over a wide temperature range (about -40 ° C to 150 ° C) as well as extreme mechanical vibrations (up to 40g). Since the control unit is surrounded by highly viscous and chemically aggressive gear oil, high demands are placed on the oil-tightness of the control unit.

The patent DE 197 51 095 C 1 describes such a suburb control unit in

Transmission housing of a motor vehicle. The control unit comprises two oil-tightly interconnected housing parts, through which an electrical connection element is passed, wherein the connection element connects the circuit carrier in the housing with electrical components outside the housing.

US2008 / 0170372 AI describes a control device with a circuit board, are arranged on the electronic components, and an electrical connection element to Connecting the circuit carrier to its periphery. The circuit carrier is arranged on a base plate, which serves as a heat sink and dissipates the heat from the circuit substrate. The circuit carrier, the connecting element and the base plate are surrounded with a plastic in such a way that the circuit carrier is completely enclosed with its components, but most of the back of the base plate and the outer ends of the electrical connection element are free of plastic. This control unit can be mounted without a housing as a local control unit, for example in a transmission.

The surfaces of the circuit carrier and the base plate are at least partially roughened. This surface roughness ensures that the enclosing plastic is better interlocked with the surfaces of the circuit carrier and the base plate than on smooth surfaces. This is intended to prevent components of the control device, in particular the connection of the electrical component, from becoming unstable during temperature fluctuations due to the different coefficients of expansion of the involved components

Circuit board is destroyed, or that the plastic gets cracks or dissolves from the circuit board or the base plate, and thus, for example, oil from the transmission can penetrate to the circuit board and this damaged.

In the cited US2008 / 0170372 AI the importance of the individual material characteristics is emphasized in the selection of the components of the control unit involved. Thus, for example, the advantages of a ceramic circuit board compared to an organic circuit board is discussed in detail. In particular, the thermal conductivity of a ceramic circuit board is an order of magnitude higher than that of an organic circuit board. This is important in terms of dissipating the heat, for example, from one

Microcontroller is generated on the circuit carrier.

A disadvantage of using a ceramic circuit board is above all the high price, which is much higher than that of an organic circuit board. Another disadvantage of the described arrangement is that the production of the rough surface both during

Circuit carrier as well as the base plate each represents an additional step, which increases the overall cost of the control unit. The use of a ceramic circuit board as a circuit carrier has the further disadvantage that the selection of the electrical components that can be mounted on it, is limited. In particular, either only power components such as power transistors can be arranged as switching elements on the ceramic circuit carrier, or it can only produce signal or signal processing

Components such as microprocessors are installed.

An example of this is DE 100 13 255 A1, which is a resin-encapsulated electronic

Device described, wherein the microprocessor is arranged on a ceramic circuit board and the Leistungshalbeiter on a separate device.

WO 2011/072629 Al describes a so-called HDI (High Density Interconnect) - circuit board for use in a housing of a local control unit in a motor vehicle. HDI circuit boards are special organic multilayer printed circuit boards, which are characterized by a good heat dissipation from the top PCB layer on which, for example, a heat-generating active component is arranged, to the lowest printed circuit board layer, which is thermally conductively connected to a heat sink, our own HDI] registration.

An HDI circuit carrier has vertical vias from one circuit board layer to the next, which have both an electrically, as well as a thermally conductive function. These vias are referred to as Vertical Interconnect Access, hereinafter referred to as Via. Vias, which are formed as plated through holes with a diameter smaller than about 150 μιη, are also referred to as microvias. Due to the small diameter of the microvias, a relatively large number of contacts on a relatively small area of the circuit substrate is possible, making this kind of

Circuit board is predestined for the assembly of unhoused Halbeiterbausteinen, so-called. Bare Dies, which naturally have a much closer contact spacing, as components with housing.

It is therefore an object of the invention to provide a plastic-encased electronics module for use as a control device in a motor vehicle which is both low Material as well as low production costs and beyond throughout the lifetime high process reliability, especially oil tightness guaranteed.

This object is achieved by an electronic module having the features of claim 1.

The core of the invention is that at least one organic so-called HDI circuit carrier with an electronic circuit comprising at least one electronic component, is thermally conductively connected to a heat sink and the electronic circuit and the heat sink are coated with plastic such that only the circuit carrier opposite rear side of the heat sink at least partially, and at least the contact ends of the conductor structures, which are used for electrical connection with the electrical components outside of the electronic module, are free of plastic.

The enclosure of the circuit carrier and a part of the heat sink and the

Conductor structures with plastic, in particular a thermosetting polymer, such as silicone, epoxy silicone, epoxy or phenolic resin allows the same protection against harmful environmental influences in the suburbs environment as an expensive housing. In addition, the conductor structures for the electrical connection of the electronic circuit with the electrical components outside the electronic module need not be sealed separately as in a control unit with housing and the plastic-free back of the heat sink can be mounted for optimal heat dissipation to a part of the transmission, prevail at the lower temperatures ,

The different coefficients of thermal expansion, in particular of the plastic, of the circuit carrier, of the conductor structures and of the heat sink are ideally matched to one another such that they are in the direct comparison of the order of +/- 15%, so that temperature fluctuations within the range

Operating temperature range of about -40 ° C to 150 ° C, for example, does not cause cracks in the plastic itself or the plastic from the circuit board or the

Solves the base plate, and thus about oil from the gearbox penetrate to the circuit board and this can damage or even destroy. The use of an HDI circuit board with its particular arrangement and combination of vias and heat conducting layers of the various board layers makes it possible, on the top PCB layer, a power device with high

Heat generation and operating currents up to about 80 A and at the same time to use a signal-generating or processing device, such as an unhoused microprocessor with very close contact distances and comparatively low operating currents, simultaneously. On ceramic circuit carriers, however, usually only currents up to 25 A can be realized.

As a heat sink material for an organic HDI printed circuit board are due to their thermal expansion coefficient (CTE = Coefficient of Thermal Expansion) and their thermal conductivity aluminum or copper or their alloys particularly well. They are also cheaper than special composites such. Eg AlSiC. Particularly suitable as a heat sink is a flat plate, since this has a large area for heat dissipation and is easily mounted on the housing, for example, a transmission.

The plate of the heat sink may also have a gradation, in particular on the edge of the plate. The gradation increases the contact area between the plate and the enveloping plastic and thus the creepage path for any liquids and gases that may penetrate into the electronics module. The Kriechwegverlängerung can be carried out both by the gradation in the cross section of the heat sink and as an undercut, in the targeted plastic can penetrate, the undercut is arranged in particular so that it is optimally adapted to the shape of the plastic filling behavior to avoid air pockets. Both creep extension measures can also occur in combination.

As electrically conductive conductor structures for electrically connecting an electronic component on the circuit carrier of the electronic circuit with electrical

Components outside the electronic module serve, as already mentioned, in particular at least one stamped grid, another printed circuit board or a flexible foil conductor. In this case, the stamped grid or the flex foil can be soldered, welded or glued directly onto the circuit carrier, for example. But the electrical connection can also indirectly, for example by means of a bonding wire between the circuit carrier and

Ladder structure are produced. Punching grid and PCB are mainly used in simple structured environments of the electronic module, the more expensive flexible film conductors can be adapted to more complex environments.

The mechanical connection between the circuit carrier of the conductor structure is usually material or non-positive. This function can be carried out in particular as described above in connection with the electrical connection, by soldering, welding or gluing, or sintering, sinter bonding.

Advantageously, the enveloping plastic with non-metallic, inorganic particles, such as Si0 ₂ or A1 ₂ 0 ₃ filled, as these are on the one hand electrically insulating to avoid short circuits of the electronic circuit, on the other hand have a good thermal conductivity, in addition to the heat sink for dissipation contribute to the heat generated due to the power loss of the electronic components.

Other fillers such as AlN, BN or SiC would also be conceivable in principle since they have an even higher thermal conductivity than the abovementioned oxides, but for reasons of cost and owing to their high hardness, they are very unlikely to be economically usable.

Since the contact surface of plastic and circuit substrate is usually smaller than the contact surface of circuit carrier and heat dissipating heat sink, the

Glass transition point of the plastic preferably at least equal to or greater than that of the circuit substrate. The glass transition point of a material is a measure of the maximum permissible operating temperature, in particular for carbon-based thermosets. In particular, the thermal expansion coefficient of the material increases from the glass transition temperature four to five times, which would have negative effects on the structure of the electronic module.

In principle, it is important that the glass transition temperature of the enveloping polymer is above the operating temperature of the electronics. Since the change in the CTE during the thermal cycle can lead to delamination on the circuit carrier. In order to achieve a particularly good thermal connection of the circuit carrier to the heat sink, the circuit carrier is connected to the heat sink in particular by means of a thermally conductive adhesive material, eg by means of a filled with inorganic particles

Thermal adhesive or thermally conductive film material connected by lamination.

Another object of the invention is a method for producing a with

Plastic coated electronic module for use as a control unit in one

Motor vehicle to create both low material and low

Production costs and beyond during the entire life high

Process reliability, in particular oil-tightness, guaranteed.

This object is achieved according to the invention by a method having the features of claim 12.

In the inventive method for producing the inventive

Electronic modules are initially provided with the following components:

an organic HDI circuit carrier suitable for a bare assembly, that is to say for the assembly of unhoused components, with at least one electronic component,

at least one electrically conductive conductor structure for electrically connecting the electronic circuit to electrical components outside the electronic module,

a heat sink,

- an injection mold.

Subsequently, an electrical connection of the at least one electronic component of the electronic circuit with corresponding electrically conductive

Ladder structures produced.

In particular, at least one stamped grid, another printed circuit board or a flexible foil conductor or a combination thereof may be used as electrically conductive conductor structures. Here, the punched grid or the Flexfolie on the one hand directly on the

Circuit carrier, for example, soldered, welded or glued. These Direct electrically conductive connection is usually also used as a mechanical connection between the electronic circuit and the conductor structure.

But the electrical connection can also indirectly, for example by means of a bonding wire, for example, gold, silver or copper between circuit carrier and

Ladder structure are produced.

In a further step, the circuit carrier is thermally conductively connected to the heat sink. This is advantageously carried out by means of a thermally conductive

Adhesive material, eg. B. a thermal adhesive. The order of the last two steps is arbitrary.

Thereafter, the electronic circuit is placed with the heat sink in an injection mold and molded with plastic. The plastic is preferably a thermosetting polymer such as silicone, epoxysilicone, epoxy or

Phenolic resin, which may be filled with inorganic particles.

After encapsulation, the electronic circuit and the heat sink are coated with plastic such that only the rear side of the heat sink opposite the circuit carrier is at least partially free of plastic. The free surface of the back of the heat sink is then the dissipation of heat from the electronic module available.

In addition to a part of the back of the heat sink remain during the injection process, the contact ends of the conductor structures, which are used for electrical connection with the electrical components outside the electronic module, free of plastic.

In particular, the so-called transfer molding, or else transfer molding, may be used as the injection method, in which case plastic is pressed into the injection mold and cured under heat and pressure. This method offers over other methods, e.g. Compression molding the possibility also electronics with complex

Circuit layout and different sized components without air pockets to ummoulden. In principle, thermoset injection molding (injection molding) would also be conceivable. In this process, however, significantly higher pressures, which can lead to the fact that especially the fine gold bonding wires are blown or demolished.

In the following description, the features and details of the invention in conjunction with the accompanying drawings with reference to embodiments will be explained in more detail. In this case, features and relationships described in individual variants can in principle be applied to all exemplary embodiments. In the drawings show:

1 shows an electronic module with a heat sink and a direct connection between the circuit carrier and the conductor structure,

2 shows an electronic module as in FIG. 1 with a heat sink with a graduation, FIG.

3 shows an electronic module as in FIG. 1 with a heat sink with a gradation and an undercut, FIG.

4 shows an electronic module with a step on the heat sink and a bonding wire between circuit carrier and conductor structure as an indirect electrical connection, and

Fig. 5 is an electronic module with a gradation on the heat sink and a bonding wire

between the circuit carrier and the conductor structure, wherein the conductor structure is electrically non-conductive connected to the circuit carrier.

FIG. 1 shows an electronic module for use as a control unit in a motor vehicle, with an electronic circuit 1 covered with plastic 2, which is arranged on a heat sink 3. The electronic circuit 1 comprises an organic HDI (High Density Interconnect) circuit carrier 5, on which electronic components 4, 7 are mounted.

The known structural features of an HDI conductor bar will be explained in more detail below. An HDI board 5 is a special multi-layer board. The printed circuit board layers each have at least one on the electrically insulating base material

Glass fiber reinforced plastic applied heat conducting layer, in particular of copper, on. Several vias are provided in the z direction perpendicular to the printed circuit board layers.

With Via (= Vertical Interconnect Access), also called layer changer, a vertical via is referred to, which electrically and thermally connects at least two printed circuit board layers of a multilayer printed circuit board 5.

As blind via a via is referred to, which is formed as a blind hole with a via, which connects in particular the uppermost or lowermost circuit board layer with at least one inner circuit board layer of a multilayer printed circuit board 5.

As Buried Via, a via is referred to, which is arranged inside a multilayer printed circuit board 5, and connects at least two inner PCB layers.

Vias, which are formed as plated through holes with a diameter smaller than about 150 μιη, are also referred to as microvias.

Vias, which primarily serve to improve the heat transfer through a printed circuit board 5, are also referred to as thermal vias.

The vias connect the heat conducting layers of different printed circuit board layers in such a way that the vias and the heat conducting layers of the printed circuit board layers form a heat conducting bridge from the uppermost printed circuit board layer to the lowest printed circuit board layer. The heat conducting layers simultaneously serve as electrical conductors.

In particular, an entire surface of all heat conducting layers is at least one

Circuit board location greater than a total surface area of all the heat conducting layers above it lying circuit board position. The heat conduction bridge formed by the vias and heat conducting layers is thereby widened by at least one printed circuit board layer to an underlying printed circuit board layer, since the total surface area of all heat conducting layers of at least one printed circuit board layer is greater than an overall surface of all heat conducting layers of an overlying printed circuit board layer. As a result, the surface effective for the heat transport is advantageously increased and the thermal resistance of the entire printed circuit board 5 is reduced, since the thermal resistance is at least approximately proportional to the reciprocal of the surface effective for the heat transfer.

Specifically, in an HDI printed circuit board, the uppermost circuit board layer is at least partially connected to at least the inner circuit board layer next to the circuit board layers in the z-direction, with blind vias formed as microvias of small diameter. This allows a higher number of vias per area. This results in addition to an increased current carrying capacity, in particular an improved heat dissipation, especially by heat-emitting active electronic components 4, 7. The higher number of vias per area by the use of microvias but above all also allows that on the top PCB situation specially unpackaged electronic components , so-called bare dies, can be mounted, whose contact distances are much smaller than those of components 7 with housing.

In particular, a multifunctional additional metallization with a layer sequence of z. As nickel, palladium and gold applied. As a result, connection techniques for assembling the printed circuit board 5 with unhoused components 4 together with housed components 4 are possible. For this purpose, the additional metallization is applied to the outer copper surface of the heat conducting layers, wherein the additional metallization simultaneously for assembly processes, in particular by means of soldering, Silberleitkleben etc. for unhoused active components 4 and

Connection techniques, such. B. wire bonding with gold wire and / or aluminum wire in particular for cased passive components 7, is suitable.

As already mentioned, in particular the heat conducting layers of the printed circuit board layers and the walls of the vias are coated with copper and additionally with a multifunctional one

Metallization of NiPdAu provided. This also contributes to the fact that the Current carrying capacity of this HDI board 5 up to 50 A and more. The maximum ampacity of thick-film ceramic PCBs, however, is about 25 A.

When using the electronic module made of plastic 2 enveloped electronic circuit 1 on a heat sink 3 as a control unit in a motor vehicle, it is essentially important that the different thermal expansion coefficients of the individual components

ideally be coordinated with each other so that they are in the direct comparison of each of the order of +/- 15%. This ensures that it is at

Temperature fluctuations do not cause cracks in the plastic itself or the plastic dissolves from the circuit substrate 5 or the heat sink 3, and thus ewa oil from the transmission can penetrate to the circuit board 5 and this damage or even destroy.

The thermal expansion coefficient CTE of a circuit carrier such as the HDI printed circuit board 5 is in the range of 18 - 20 ppm / ° C. The copper CTE is 16 ppm / ° C and that of aluminum is 23 ppm / ° C. These two materials are therefore particularly suitable as a heat sink 3 for a HDI circuit board 5 because they can be connected to each other almost stress-free

Compared, for example, with iron, its CTE at 12 ppm / ° C, and thus rather than

Heat sink material for a ceramic circuit board with 5-7 ppm / ° C is suitable, have copper and aluminum compared to iron also has the advantage that their thermal

Thermal conductivity of 200 W / mK for aluminum and 400 W / mK for copper is 3-5 times higher than that of iron, which is 70 W / mK.

The conductor structure 6 can in particular as a stamped grid made of copper, with a CTE of 16 ppm / ° C, as an additional printed circuit board made of glass fiber reinforced plastic with a CTE of 18-20 ppm / ° C or a flexible film conductor of a composite of a polyimide and a Copper foil with a CTE in the range 16-18 ppm / ° C be executed. The

Conductor structure 6 is connected directly to the circuit carrier 5 in FIG. 1. This connection can be made by welding, soldering or gluing and has both the function of an electrical and a mechanical connection.

The enveloping plastic 2 consists in particular of a thermosetting polymer, such as silicone, epoxy silicone, epoxy resin or phenolic resin. The CTE of these materials is here in the range of 14-19 ppm / ° C, whereby the range can be adjusted by different admixtures of the inorganic fillers, eg Si0 ₂ .

These plastic materials are thus suitable because of their CTE, the circuit substrate 3, the conductor structure 6 and at least a part of the heat sink 3 to be wrapped so that it does not come to cracks in the plastic 2 itself with temperature fluctuations or the plastic 2 from the circuit substrate 5 or the heat sink 3 dissolves. However, it would also be conceivable to use a thermoplastic polymer.

The cover with plastic 2 allows the same protection against harmful

Environmental influences in the suburb environment like a more expensive housing. Furthermore, the soft plastic encapsulation of the electronic circuit 1 with silicone gel and / or silicone varnish as protection against, for example, penetrating harmful gases is saved by the encapsulation with plastic 2 of otherwise customary in control unit housings.

In addition, the conductor structure 6 for electrical connection of the electronic

Circuit 1 with the electrical components outside the electronic module not be sealed separately as a control unit with housing in the housing wall.

The operating temperature of the plastic 2 is usually slightly higher than that of the

Circuit carrier 5, since in particular the contact surface between plastic 2 and

Therefore, the glass transition point of the plastic 2 is preferably at least equal to or greater than that of the circuit substrate 5, wherein the glass transition point of a material is a measure of the maximum permissible operating temperature. The plastic-free rear side of the heat sink 3 can be mounted for optimum heat dissipation on a part of the transmission, not shown here, prevail at the lower temperatures.

FIG. 2 shows an electronic module in which the heat sink 3 has a gradation 10 at the edge. The gradation 10 may be circumferentially arranged on the edge of the heat sink 3, but does not have to. The gradation 10 increases the contact area between the heat sink 3 and the enveloping plastic 2 and thus the creepage distance for liquids and gases which may penetrate from the outside into the electronics module, thereby reducing the likelihood of module failure.

The Kriechwegverlängerung can alternatively be performed as grading 10 as an undercut 9, in the targeted plastic 2 can penetrate. Both creep extension measures may also occur in combination as shown in FIG.

The conductor structure 6 is electrically connected in FIG. 4 to the circuit carrier 5 indirectly with a bonding wire 12, for example a Cu bonding wire, whose CTE, as described above, lies in the region of the plastic 2 and is thus enveloped by the latter substantially free of stress.

5 shows an electronic module in which the conductor structure 6 is connected to the circuit carrier 5 in an electrically non-conductive manner, for example by gluing. The electrically conductive connection between circuit carrier 5 and conductor structure 6 is produced by means of a bonding wire 12.

By suitable selection of the materials of its individual components, the electronic module according to the invention is largely insensitive to temperature fluctuations, thus substantially stress-free and thus reliably tight over its entire life. The compact design of the electronic module guarantees a space-saving installation, in particular, by suitable shape of the heat sink, the electronic module can also be installed like a plug. In addition, in the manufacture of the electronic module advantageously the same injection mold for different electronic circuits are used. Last but not least, the complete encapsulation of the electronic module offers protection against plagiarism or protection against external manipulation.

List of reference numbers:

1 electronic circuit

2 plastic

3 heatsinks

4 unhoused electronic component

5 circuit carrier

6 Electrically conductive conductor structure

7 housings electronic component

8 open contact ends of the ladder structure

9 undercut

10 gradation

11 thermal adhesive

12 bonding wire

Claims

Claims:

1. Electronic module for use as a control unit in a motor vehicle, with a plastic (2) enveloped electronic circuit (1) arranged on a heat sink (3), wherein the electronic circuit (1)

- At least one organic HDI (High Density Interconnect) - circuit carrier (5) for bare The mounting on which at least one electronic component (4) is arranged

- electrically conductive conductor structures (6) for electrically connecting the electronic component (4) of the electronic circuit (1) with electrical components outside the electronic module,

characterized in that

the circuit carrier (5) with the heat sink (3) is thermally conductively connected, and the electronic circuit (1) and the heat sink (3) are coated with plastic (2), that only the circuit carrier (5) opposite the back of the heat sink (3) at least partially, and at least the contact ends (8) of the conductor structures (6), which are used for electrical connection with the electrical components outside the electronic module, are free of plastic.

2. An electronic module according to claim 1, characterized in that the thermal expansion coefficients of the plastic (2), the circuit substrate (5), the conductor structures (6) and the heat sink (3) are matched to one another such that they are compared in the order of magnitude of +/- 15%.

3. Electronic module according to claim 1 or 2, characterized in that in the arrangement of more than one electronic component (4, 7) on the circuit carrier (5) a power component and a signal generating or processing component is mounted simultaneously.

4. Electronic module according to one of the preceding claims, characterized in that the heat sink (3) is designed as a flat metallic plate, for example made of aluminum or copper.

5. Electronic module according to claim 4, characterized in that the cooling body (3) is designed as a flat plate with at least one step (10).

6. Electronic module according to claim 4, characterized in that the heat sink (3) is designed as a flat plate with at least one undercut (9).

7. Electronic module according to one of the preceding claims, characterized in that the electrically conductive conductor structures (6) are designed as stamped grid, printed circuit board or foil conductor.

8. Electronic module according to one of the preceding claims, characterized in that the plastic (2) is a thermosetting polymer, such as silicone, epoxy silicone, epoxy resin or phenolic resin.

9. Electronic module according to claim 8, characterized in that the plastic (2) with inorganic particles, such as Si0 _{2 is} filled.

10. Electronics module according to one of the preceding claims, characterized in that the glass transition point of the plastic (2) is equal to or greater than that of the

Circuit carrier (5).

11. Electronic module according to one of the preceding claims, characterized in that the circuit carrier (5) by means of a thermally conductive adhesive material, for. B. a Wärmeleitklebers (1 1), with the heat sink (3) is thermally conductively connected.

12. A method for producing an electronic module according to claims 1 to 11 with the steps:

Providing a suitable for a bare mounting, organic HDI circuit substrate (5), with at least one electronic component (4), - Providing electrically conductive conductor structures (6) for electrically connecting the electronic component (4) of the electronic circuit (1) with electrical components outside the electronic module,

Providing a heat sink (3),

Providing an injection mold,

Establishing an electrical connection of the electronic component (4) of the electronic circuit (1) to the corresponding electrically conductive conductor structure (6),

Producing a thermally conductive connection between the HDI circuit carrier (5) and the heat sink (3),

Inserting the electronic circuit (1) with the heat sink (3) into the injection mold,

- Encapsulating the electronic circuit (1) with the heat sink (3) with plastic that the electronic circuit (1) and the heat sink (3) are coated with plastic (2) that only the circuit carrier (5) opposite the back of Heatsink (3) at least partially, and at least the contact ends (8) of the conductor structures (6), which are used for electrical connection with the electrical components outside the electronic module, are free of plastic,

- curing of the plastic.

13. The method according to claim 12, characterized in that the establishing of the electrical connection of the electronic component (4) of the electronic circuit (1) with the electrically conductive conductor structure (6), directly by soldering, welding or gluing the conductor structure (6) the circuit carrier (5).

14. The method according to claim 12, characterized in that the establishment of the electrical connection of the electronic component (4) of the electronic circuit (1) with the electrically conductive conductor structure (6), takes place indirectly by means of wire bonding.

15. The method according to any one of claims 12 to 14, characterized in that the

Producing a thermally conductive connection between the HDI circuit carrier (5) and the heat sink (3) by means of a thermally conductive adhesive material, for. B. a Wärmeleitklebers (1 1) takes place.

16. The method according to any one of claims 12 to 15, characterized in that the

Encapsulation of the electronic circuit (1) with the heat sink (3) with plastic by means of transfer molding.