EP2896720A4 - Electroless plating base agent - Google Patents

Electroless plating base agent

Info

Publication number: EP2896720A4
Authority: EP; European Patent Office
Prior art keywords: electroless plating; plating base; base agent; agent; electroless
Prior art date: 2012-09-13
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP13837102.6A

Other languages

German (de)

French (fr)

Other versions

EP2896720B1 (en

EP2896720A1 (en

Inventor

Daigo Saito

Keisuke Kojima

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Nissan Chemical Corp

Original Assignee

Nissan Chemical Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-09-13

Filing date

2013-09-12

Publication date

2016-06-22

2013-09-12 Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp

2015-07-22 Publication of EP2896720A1 publication Critical patent/EP2896720A1/en

2016-06-22 Publication of EP2896720A4 publication Critical patent/EP2896720A4/en

2017-11-22 Application granted granted Critical

2017-11-22 Publication of EP2896720B1 publication Critical patent/EP2896720B1/en

Status Active legal-status Critical Current

2033-09-12 Anticipated expiration legal-status Critical

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1882—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Inorganic Chemistry (AREA)
Chemically Coating (AREA)
Powder Metallurgy (AREA)
Catalysts (AREA)

EP13837102.6A 2012-09-13 2013-09-12 Electroless plating base agent Active EP2896720B1 (en)

Applications Claiming Priority (4)

Application Number	Priority Date	Filing Date	Title
JP2012201584		2012-09-13
JP2013003605		2013-01-11
JP2013053574		2013-03-15
PCT/JP2013/074714 WO2014042215A1 (en)	2012-09-13	2013-09-12	Electroless plating base agent

Publications (3)

Publication Number	Publication Date
EP2896720A1 EP2896720A1 (en)	2015-07-22
EP2896720A4 true EP2896720A4 (en)	2016-06-22
EP2896720B1 EP2896720B1 (en)	2017-11-22

Family

ID=50278324

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP13837102.6A Active EP2896720B1 (en)	2012-09-13	2013-09-12	Electroless plating base agent

Country Status (7)

Country	Link
US (1)	US20160010215A1 (en)
EP (1)	EP2896720B1 (en)
JP (1)	JP6354950B2 (en)
KR (2)	KR20150054851A (en)
CN (1)	CN104641017B (en)
TW (1)	TWI627194B (en)
WO (1)	WO2014042215A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP6352059B2 (en) *	2014-06-05	2018-07-04	奥野製薬工業株式会社	Composition for forming electroless plating underlayer
JP6631806B2 (en) *	2014-07-30	2020-01-15	日産化学株式会社	Electroless plating primer containing hyperbranched polymer, fine metal particles and resin primer
EP3190207B1 (en) *	2014-09-05	2019-05-08	Nissan Chemical Corporation	Photocurable electroless plating primer
CN106662812B (en) *	2014-09-05	2020-10-02	日产化学工业株式会社	Photosensitive electroless plating base agent
CH710579A1 (en) *	2014-12-23	2016-06-30	Metalor Tech Int Sa	A method of electroless plating of a precious metal.
JP6471392B2 (en) *	2015-02-12	2019-02-20	上村工業株式会社	Pretreatment agent for electroless plating, pretreatment method for printed wiring board using said pretreatment agent for electroless plating, and method for producing the same
KR102558400B1 (en) *	2015-03-31	2023-07-24	닛산 가가쿠 가부시키가이샤	Photosensitive electroless plating liner
JP6879470B2 (en) *	2016-02-19	2021-06-02	日産化学株式会社	Electroless plating base material containing highly branched polymer and metal fine particles
WO2017154913A1 (en) *	2016-03-09	2017-09-14	日産化学工業株式会社	Photosensitive electroless plating undercoat agent
WO2017154919A1 (en) *	2016-03-09	2017-09-14	日産化学工業株式会社	Electroless plating undercoat agent including metal microparticles and hyperbranched polymer
JP6607811B2 (en) *	2016-03-11	2019-11-20	マクセルホールディングス株式会社	Plating parts manufacturing method, plating parts, catalytic activity interference agent and electroless plating composite material
JPWO2019022151A1 (en) *	2017-07-25	2020-07-09	日産化学株式会社	Method for producing metal fine particle composite
CN113195788A (en) *	2018-12-21	2021-07-30	日产化学株式会社	Electroless plating base agent comprising polymer and metal fine particles
JP6817502B1 (en) *	2019-03-05	2021-01-20	マクセルホールディングス株式会社	Manufacturing method of electroless plating suppression composition and plated parts
JPWO2021166726A1 (en) *	2020-02-19	2021-08-26

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP1491656A1 (en) *	2003-06-24	2004-12-29	Rohm and Haas Electronic Materials, L.L.C.	Electroless deposition catalyst and menthod
US20080248211A1 (en) *	2007-03-13	2008-10-09	Basf Corporation	Coating compositions containing silane, methods for producing a coating composition and a coated substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2006052101A (en) *	2004-08-10	2006-02-23	Mitsuboshi Belting Ltd	Method of forming metal coating film on ceramic base material surface and metallized ceramic base material
JP2008007849A (en) *	2006-06-01	2008-01-17	Nippon Paint Co Ltd	Primer composition for electroless plating and electroless plating method
WO2008029688A1 (en)	2006-09-01	2008-03-13	Nissan Chemical Industries, Ltd.	Hyperbranched polymer and method for producing the same
CN102131573B (en)	2008-08-22	2015-05-20	日产化学工业株式会社	Metal microparticle-dispersing agent comprising branched polymeric compound having ammonium group
WO2012141215A1 (en) *	2011-04-12	2012-10-18	日産化学工業株式会社	Electroless plating primer including hyperbranched polymer and metallic microparticles

2013
- 2013-09-12 KR KR1020157007380A patent/KR20150054851A/en active Application Filing
- 2013-09-12 US US14/428,189 patent/US20160010215A1/en not_active Abandoned
- 2013-09-12 WO PCT/JP2013/074714 patent/WO2014042215A1/en active Application Filing
- 2013-09-12 CN CN201380047242.XA patent/CN104641017B/en active Active
- 2013-09-12 EP EP13837102.6A patent/EP2896720B1/en active Active
- 2013-09-12 JP JP2014535588A patent/JP6354950B2/en active Active
- 2013-09-12 KR KR1020207003144A patent/KR102157192B1/en active IP Right Grant
- 2013-09-13 TW TW102133177A patent/TWI627194B/en active

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP1491656A1 (en) *	2003-06-24	2004-12-29	Rohm and Haas Electronic Materials, L.L.C.	Electroless deposition catalyst and menthod
US20080248211A1 (en) *	2007-03-13	2008-10-09	Basf Corporation	Coating compositions containing silane, methods for producing a coating composition and a coated substrate

Non-Patent Citations (1)

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Title
See also references of WO2014042215A1 *

Also Published As

Publication number	Publication date
KR20150054851A (en)	2015-05-20
CN104641017B (en)	2018-06-15
KR20200015818A (en)	2020-02-12
EP2896720B1 (en)	2017-11-22
WO2014042215A1 (en)	2014-03-20
JPWO2014042215A1 (en)	2016-08-18
KR102157192B1 (en)	2020-09-18
TW201418299A (en)	2014-05-16
JP6354950B2 (en)	2018-07-11
TWI627194B (en)	2018-06-21
CN104641017A (en)	2015-05-20
US20160010215A1 (en)	2016-01-14
EP2896720A1 (en)	2015-07-22

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2016-06-22	RA4	Supplementary search report drawn up and despatched (corrected)	Effective date: 20160524
2016-06-22	RIC1	Information provided on ipc code assigned before grant	Ipc: C23C 18/16 20060101ALI20160518BHEP Ipc: C23C 18/20 20060101ALI20160518BHEP Ipc: C23C 18/30 20060101AFI20160518BHEP Ipc: C23C 18/18 20060101ALI20160518BHEP Ipc: C23C 18/31 20060101ALI20160518BHEP
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