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EP2625712A4 - Radiant heat circuit board, heat generating device package having the same, and backlight unit - Google Patents

Radiant heat circuit board, heat generating device package having the same, and backlight unit

Info

Publication number
EP2625712A4
EP2625712A4 EP11830887.3A EP11830887A EP2625712A4 EP 2625712 A4 EP2625712 A4 EP 2625712A4 EP 11830887 A EP11830887 A EP 11830887A EP 2625712 A4 EP2625712 A4 EP 2625712A4
Authority
EP
European Patent Office
Prior art keywords
circuit board
same
generating device
backlight unit
device package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP11830887.3A
Other languages
German (de)
French (fr)
Other versions
EP2625712A2 (en
EP2625712B1 (en
Inventor
Hyun Gyu Park
In Hee Cho
Yun Ho An
Jae Man Park
Eun Jin Kim
Hae Yeon Kim
Hyuk Soo Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of EP2625712A2 publication Critical patent/EP2625712A2/en
Publication of EP2625712A4 publication Critical patent/EP2625712A4/en
Application granted granted Critical
Publication of EP2625712B1 publication Critical patent/EP2625712B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
EP11830887.3A 2010-10-06 2011-10-05 Radiant heat circuit board Active EP2625712B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100097474A KR101779205B1 (en) 2010-10-06 2010-10-06 The radiant heat circuit board and the heat generating device package having the same
PCT/KR2011/007337 WO2012047002A2 (en) 2010-10-06 2011-10-05 Radiant heat circuit board, heat generating device package having the same, and backlight unit

Publications (3)

Publication Number Publication Date
EP2625712A2 EP2625712A2 (en) 2013-08-14
EP2625712A4 true EP2625712A4 (en) 2014-03-26
EP2625712B1 EP2625712B1 (en) 2019-09-18

Family

ID=45928208

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11830887.3A Active EP2625712B1 (en) 2010-10-06 2011-10-05 Radiant heat circuit board

Country Status (5)

Country Link
US (1) US9549458B2 (en)
EP (1) EP2625712B1 (en)
KR (1) KR101779205B1 (en)
TW (1) TWI434628B (en)
WO (1) WO2012047002A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITTR20120012A1 (en) * 2012-11-20 2013-02-19 Tecnologie E Servizi Innovativi T S I S R L MPCB-LED-SINK20 - CIRCUIT PRINTED ON METALLIC BASE WITH DIRECT TRANSFER OF HEAT FROM THE THERMAL PAD OF THE POWER LEDS TO THE METAL LAYER OF THE MPCB WITH THE ABILITY TO LOWER THE TEMPERATURE OF THE LED JUNCTION OF ADDITIONAL 20 ° C RESPECT
CN104201276B (en) * 2014-08-15 2015-05-06 厦门市瀚锋光电科技有限公司 Peripherally light-emitting strip-shaped light source
KR102198695B1 (en) * 2014-09-03 2021-01-06 삼성전자주식회사 Light source module and backlight unit having the same
KR101658214B1 (en) * 2015-01-16 2016-09-26 최범근 Printed circuit board for led lamp
CN112822876B (en) * 2020-12-28 2022-10-28 广州广合科技股份有限公司 Printed circuit board embedded with three-dimensional metal base and processing method thereof
CN114513894A (en) * 2022-01-25 2022-05-17 工业和信息化部电子第五研究所华东分所 High heat dissipation type printed circuit board and car cooling system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020175621A1 (en) * 2001-05-24 2002-11-28 Samsung Electro-Mechanics Co., Ltd. Light emitting diode, light emitting device using the same, and fabrication processes therefor
DE102004031685A1 (en) * 2004-06-30 2006-01-19 Osram Opto Semiconductors Gmbh Housing for an optoelectronic component has central heat dissipating element with central thermal contact region surrounded by ring of chip mounting surfaces
US20060197101A1 (en) * 2005-02-18 2006-09-07 Industrial Technology Research Institute Light source module of light emitting diode
US7355276B1 (en) * 2005-03-11 2008-04-08 Maxtor Corporation Thermally-enhanced circuit assembly
US20080278917A1 (en) * 2007-05-07 2008-11-13 Advanced Connectek Inc. Heat dissipation module and method for fabricating the same

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003043484A (en) * 2001-08-03 2003-02-13 Fujitsu Ltd Liquid crystal display device
JP4045781B2 (en) * 2001-08-28 2008-02-13 松下電工株式会社 Light emitting device
US7268425B2 (en) * 2003-03-05 2007-09-11 Intel Corporation Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
WO2004105142A1 (en) * 2003-05-26 2004-12-02 Matsushita Electric Works, Ltd. Light-emitting device
JP2006100687A (en) * 2004-09-30 2006-04-13 Nippon Seiki Co Ltd Packaging structure of light-emitting diode
US20070081342A1 (en) * 2005-10-07 2007-04-12 Oliver Szeto System and method for mounting a light emitting diode to a printed circuit board
KR101240650B1 (en) * 2006-01-18 2013-03-08 삼성디스플레이 주식회사 Light emitting diode module and a backlight assembly provided with the same and a display device provided with the same
CN101438633A (en) * 2006-05-08 2009-05-20 皇家飞利浦电子股份有限公司 Thermal surface mounting of multiple LEDs onto a heatsink
TWM311844U (en) * 2006-11-17 2007-05-11 Mgta Consultant Co Ltd Heat dissipation devices for LED lamps
KR20080053048A (en) 2006-12-08 2008-06-12 엘지마이크론 주식회사 Radiant heat circuit substrate and method for manufacturing thereof
KR20080057881A (en) * 2006-12-21 2008-06-25 엘지전자 주식회사 Printed circuit board, light emitting apparatus having the same and method for manufacturing thereof
US20080180015A1 (en) * 2007-01-29 2008-07-31 Unity Opto Technology Co., Ltd. Heat-sink module of light-emitting diode
TWI372918B (en) * 2007-12-27 2012-09-21 Everlight Electronics Co Ltd Edge lighting light-emitting diode backlight module
TWI383220B (en) * 2008-02-05 2013-01-21 Dynascan Technology Corp Backlight module with mix colors device
KR101096626B1 (en) 2008-02-15 2011-12-21 엘지이노텍 주식회사 Radiant heat circuit board and Method for manufacturing of radiant heat circuit board
KR100958024B1 (en) * 2008-08-05 2010-05-17 삼성엘이디 주식회사 Light emitting diode package and method of manufacturing the same
KR101494705B1 (en) 2008-11-21 2015-02-23 주식회사 케이엠더블유 Multi-chip LED package
JP2010140820A (en) * 2008-12-12 2010-06-24 Toshiba Corp Lamp unit, circuit board, and method of manufacturing the circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020175621A1 (en) * 2001-05-24 2002-11-28 Samsung Electro-Mechanics Co., Ltd. Light emitting diode, light emitting device using the same, and fabrication processes therefor
DE102004031685A1 (en) * 2004-06-30 2006-01-19 Osram Opto Semiconductors Gmbh Housing for an optoelectronic component has central heat dissipating element with central thermal contact region surrounded by ring of chip mounting surfaces
US20060197101A1 (en) * 2005-02-18 2006-09-07 Industrial Technology Research Institute Light source module of light emitting diode
US7355276B1 (en) * 2005-03-11 2008-04-08 Maxtor Corporation Thermally-enhanced circuit assembly
US20080278917A1 (en) * 2007-05-07 2008-11-13 Advanced Connectek Inc. Heat dissipation module and method for fabricating the same

Also Published As

Publication number Publication date
WO2012047002A3 (en) 2012-08-30
EP2625712A2 (en) 2013-08-14
KR20120035759A (en) 2012-04-16
TWI434628B (en) 2014-04-11
US20130206459A1 (en) 2013-08-15
US9549458B2 (en) 2017-01-17
WO2012047002A2 (en) 2012-04-12
EP2625712B1 (en) 2019-09-18
TW201220983A (en) 2012-05-16
KR101779205B1 (en) 2017-09-26

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