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EP2608254A3 - Leistungshalbleitermodul oder Ansteuermodul hierfür - Google Patents

Leistungshalbleitermodul oder Ansteuermodul hierfür Download PDF

Info

Publication number
EP2608254A3
EP2608254A3 EP12188805.1A EP12188805A EP2608254A3 EP 2608254 A3 EP2608254 A3 EP 2608254A3 EP 12188805 A EP12188805 A EP 12188805A EP 2608254 A3 EP2608254 A3 EP 2608254A3
Authority
EP
European Patent Office
Prior art keywords
module
same
semiconductor power
housing
actuation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12188805.1A
Other languages
English (en)
French (fr)
Other versions
EP2608254A2 (de
EP2608254B1 (de
Inventor
Rainer Popp
Stefan Weiss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron GmbH and Co KG, Semikron Elektronik GmbH and Co KG filed Critical Semikron GmbH and Co KG
Publication of EP2608254A2 publication Critical patent/EP2608254A2/de
Publication of EP2608254A3 publication Critical patent/EP2608254A3/de
Application granted granted Critical
Publication of EP2608254B1 publication Critical patent/EP2608254B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
  • Semiconductor Lasers (AREA)

Abstract

Es wird ein Leistungshalbleitermodul oder Ansteuermodul hierfür beschrieben, umfassend eine leistungselektronische Schaltung, ein Gehäuse (11) mit einem Gehäusedeckel (13), wobei der Gehäusedeckel (13) von Anschlussmitteln (15, 16) durchgriffen ist. Zwischen einer oberen Stirnseite (11o) des Gehäuses (11) und einer unteren Stirnfläche des Gehäusedeckels (13) ist eine elastomere Dichtungseinrichtung (14) angeordnet, die eine Grundplatte (14p) und auf der Grundplatte (14p) angeordnete, im Querschnitt trapezförmige Dichtungselemente (14e) aufweist, wobei die Dichtungselemente (14e) eine Kopfplatte mit mindestens einem Durchgangsloch (14d) aufweisen.
EP12188805.1A 2011-12-22 2012-10-17 Leistungshalbleitermodul oder Ansteuermodul hierfür Active EP2608254B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE201110056848 DE102011056848A1 (de) 2011-12-22 2011-12-22 Leistungshalbleitermodul oder Ansteuermodul hierfür

Publications (3)

Publication Number Publication Date
EP2608254A2 EP2608254A2 (de) 2013-06-26
EP2608254A3 true EP2608254A3 (de) 2014-04-23
EP2608254B1 EP2608254B1 (de) 2016-04-27

Family

ID=47278085

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12188805.1A Active EP2608254B1 (de) 2011-12-22 2012-10-17 Leistungshalbleitermodul oder Ansteuermodul hierfür

Country Status (3)

Country Link
EP (1) EP2608254B1 (de)
CN (2) CN103178022A (de)
DE (1) DE102011056848A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011056848A1 (de) * 2011-12-22 2013-06-27 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul oder Ansteuermodul hierfür
DE102013216035B3 (de) * 2013-08-13 2015-01-22 Infineon Technologies Ag Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls
DE102015113111B4 (de) * 2015-08-10 2020-01-30 Infineon Technologies Ag Leistungshalbleitermodul mit verbesserter Abdichtung
CN114582810A (zh) * 2022-01-29 2022-06-03 华为数字能源技术有限公司 一种盖板、功率模块以及电子设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2822512A (en) * 1955-05-17 1958-02-04 Westinghouse Brake & Signal Rectifier assemblies
DE1489097B1 (de) * 1964-12-16 1970-10-22 Licentia Gmbh Halbleiter-Gleichrichterzelle
DE2501337A1 (de) * 1974-01-18 1975-07-24 Lucas Electrical Co Ltd Halbleitervorrichtung
EP0237739A2 (de) * 1986-02-15 1987-09-23 Asea Brown Boveri Aktiengesellschaft Leistungshalbleitermodul und Verfahren zur Herstellung des Moduls
DE10340974A1 (de) * 2003-09-05 2005-03-24 Robert Bosch Gmbh Steuergeräteeinheit und Verfahren zur Hestellung derselben
EP2019424A2 (de) * 2007-07-26 2009-01-28 SEMIKRON Elektronik GmbH & Co. KG Leistungshalbleitermodul mit Dichteinrichtung zum Substratträger und Herstellungsverfahren hierzu
DE102009037257A1 (de) * 2009-08-12 2011-02-17 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Schaltungsträger und Lastanschlusselement sowie Herstellungsverfahren hierzu

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4182425A (en) * 1977-05-23 1980-01-08 Smith International, Inc. Reamer
DE102011056848A1 (de) * 2011-12-22 2013-06-27 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul oder Ansteuermodul hierfür

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2822512A (en) * 1955-05-17 1958-02-04 Westinghouse Brake & Signal Rectifier assemblies
DE1489097B1 (de) * 1964-12-16 1970-10-22 Licentia Gmbh Halbleiter-Gleichrichterzelle
DE2501337A1 (de) * 1974-01-18 1975-07-24 Lucas Electrical Co Ltd Halbleitervorrichtung
EP0237739A2 (de) * 1986-02-15 1987-09-23 Asea Brown Boveri Aktiengesellschaft Leistungshalbleitermodul und Verfahren zur Herstellung des Moduls
DE10340974A1 (de) * 2003-09-05 2005-03-24 Robert Bosch Gmbh Steuergeräteeinheit und Verfahren zur Hestellung derselben
EP2019424A2 (de) * 2007-07-26 2009-01-28 SEMIKRON Elektronik GmbH & Co. KG Leistungshalbleitermodul mit Dichteinrichtung zum Substratträger und Herstellungsverfahren hierzu
DE102009037257A1 (de) * 2009-08-12 2011-02-17 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Schaltungsträger und Lastanschlusselement sowie Herstellungsverfahren hierzu

Also Published As

Publication number Publication date
CN203134776U (zh) 2013-08-14
EP2608254A2 (de) 2013-06-26
DE102011056848A1 (de) 2013-06-27
CN103178022A (zh) 2013-06-26
EP2608254B1 (de) 2016-04-27

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