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EP2697557B1 - Dispositif d'éclairage - Google Patents

Dispositif d'éclairage Download PDF

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Publication number
EP2697557B1
EP2697557B1 EP12720815.5A EP12720815A EP2697557B1 EP 2697557 B1 EP2697557 B1 EP 2697557B1 EP 12720815 A EP12720815 A EP 12720815A EP 2697557 B1 EP2697557 B1 EP 2697557B1
Authority
EP
European Patent Office
Prior art keywords
mounting
semiconductor light
emitting elements
light
lighting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP12720815.5A
Other languages
German (de)
English (en)
Other versions
EP2697557A1 (fr
Inventor
Gerhard Kuhn
Ales Markytan
Christian Gärtner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP2697557A1 publication Critical patent/EP2697557A1/fr
Application granted granted Critical
Publication of EP2697557B1 publication Critical patent/EP2697557B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/005—Reflectors for light sources with an elongated shape to cooperate with linear light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • a light-emitting foil in which a multiplicity of light-emitting diode chips are arranged between two transparent substrate foils. By joining two such light-emitting films with a reflective layer therebetween, a bi-directionally emitting light-emitting film can be achieved.
  • a light source which comprises a clear acrylic or glass rod having a series of holes along the rod extension direction, in which pairs of light emitting diode chips are arranged, facing in opposite directions and emitting light along the rod extension direction.
  • At least one object of certain embodiments is to provide a lighting device that can emit light in different directions during operation.
  • a lighting device has a carrier body.
  • the carrier body may in particular be designed rod-shaped, which means that the carrier body has an elongated shape with a main extension direction, wherein the dimensions of the carrier body along the main extension direction larger, preferably many times greater than the dimensions perpendicular to the main extension direction.
  • the carrier body has at least a first and a second mounting side.
  • the Mounting sides extend along the main extension direction of the carrier body, wherein on the first mounting side first mounting surfaces and on the second mounting side second mounting surfaces are formed.
  • each of the mounting sides has a plurality of mounting surfaces.
  • the mounting surfaces of each mounting side are arranged along the main extension direction.
  • the mounting surfaces may be arranged spaced from one another along the main extension direction.
  • the illumination device has first semiconductor light-emitting elements on the first mounting surfaces of the first mounting side. Furthermore, according to a further embodiment, the illumination device has second semiconductor light-emitting elements on the second mounting surfaces of the second mounting side.
  • each of the mounting surfaces is formed by a recess in the respective mounting side.
  • this may mean that the first mounting surfaces on the first mounting side are formed as depressions arranged along the main extension direction, and the second mounting surfaces are formed as depressions arranged along the main extension direction in the second mounting side.
  • each of the mounting surfaces is at least partially planar.
  • each of the mounting surfaces may be formed as a recess with a flat base.
  • each one is Mounting surface provided for that on it one or more semiconductor light elements can be mounted and electrically connected.
  • Each of the mounting surfaces has a surface normal, which may in particular correspond to a main emission direction of the respectively mounted semiconductor light-emitting element.
  • the first mounting surfaces are arranged parallel to each other and in particular in a plane with respect to the flat base surfaces.
  • the second mounting surfaces are particularly preferably arranged in parallel and with respect to the flat base surfaces in a plane.
  • the surface normals of the first mounting surfaces with the surface normals of the second mounting surfaces include an angle that is greater than or equal to 90 °.
  • an angle between surface normals here and in the following, the smaller of the two angles enclosed by two surface normals is always assumed.
  • the carrier body is designed as a heat sink for the semiconductor light elements mounted thereon.
  • This may in particular mean that the material, the dimensions and the mass of the carrier body are selected such that the heat generated by the operation of the semiconductor light elements can be dissipated, so that a permanent operation of the semiconductor light elements and thus the illumination device is possible.
  • the carrier body may be made of metal, for example aluminum and / or copper, or at least comprise such a metal.
  • the carrier body is designed as a rod with a partially round profile or as a plate, that is, with a rectangular profile.
  • the carrier body has at least two rod-shaped partial bodies each with a partially round cross section.
  • Each of the at least two rod-shaped part bodies has a flattened side in the form of a flattened side surface, which extends along the main extension direction of the carrier body or each part body and by means of which the part bodies are arranged against one another.
  • the support body can be formed in one piece or in several parts.
  • Each of the partial bodies can, for example, have a semicircular cross-sectional profile, for example in the form of a semicircle or a half ellipse, so that the carrier body forms a rod with round cross-section after the joining of two rod-shaped partial bodies.
  • each partial body may, for example, have a section in the form of a circular or elliptical sector so that the partial bodies likewise form a circular or elliptical cross section for the carrier body after assembly.
  • the cross-section of a partial body may, for example, have a round, approximately circular, cross-section, from which a circle segment or another region has been removed, so that the partial body has at least one flattened side.
  • the carrier body which has at least two such partial bodies, can thereby have a cross-section which is dumbbell-shaped or whose outer peripheral line has the shape of an eight or at least recalls an eight. Does the Carrier body, for example, three part body, the cross section of the carrier body can be kleebattartig.
  • the first and second semiconductor light-emitting elements are suitable for emitting light in a wavelength range from ultraviolet radiation to infrared radiation, particularly preferably visible light.
  • one or more of the semiconductor light element can emit monochromatic or mixed-colored light, particularly preferably white light.
  • a semiconductor light-emitting element can for this purpose have a light-emitting semiconductor layer sequence, which is followed by a wavelength conversion element in the form of a dye layer, a dye plate or dye-containing encapsulation, which can convert at least a portion of the radiation generated by the semiconductor layer sequence into light with a different wavelength, so that the semiconductor element can emit mixed-colored light.
  • the semiconductor light-emitting elements can be designed in particular as epitaxially grown semiconductor layer sequences or in each case have an epitaxially grown semiconductor layer sequence.
  • the semiconductor layer sequence can be embodied in particular as a semiconductor chip.
  • the semiconductor layer sequence may comprise an arsenide, phosphide and / or nitride compound semiconductor material, which is formed with respect to its composition and in terms of its layer structure according to the desired light.
  • One or more semiconductor light-emitting elements can be designed in particular as light-emitting diodes (LED).
  • a semiconductor light-emitting element can have a housing body into which the epitaxially grown semiconductor layer sequence, that is to say the semiconductor chip, is mounted and optionally embedded in a potting material.
  • one or more semiconductor light-emitting elements can also be mounted as epitaxially grown semiconductor layer sequences in the form of semiconductor chips directly on the carrier body without a respective housing body.
  • the first semiconductor light elements are identical to one another.
  • the second semiconductor light elements are equal to one another.
  • the first semiconductor light emitting elements emit light that is different from the light emitted by the second semiconductor light elements.
  • the first semiconductor light-emitting elements are provided for the direct illumination of an object or a work area, while the second semiconductor light elements are provided for the indirect illumination of the space or the environment in which the illumination device is located.
  • the illumination device can be used at the same time as direct and indirect illumination, wherein the respectively emitted light intensities for direct and indirect illumination can be regulated and adjusted separately from one another.
  • direct and indirect illumination in known light sources are usually achieved by using a light source with separate optical paths or two optically separate light sources. Since a different emission characteristic is desired for the indirect and the direct illumination, further optical components are required in known light sources, which is why a compact design can no longer be achieved.
  • the illumination device has as the first semiconductor light-emitting elements in each recess of the first mounting surface exactly one light-emitting semiconductor chip.
  • each semiconductor chip as described above, be provided with a wavelength conversion element, so that each of the first semiconductor light elements can emit preferentially cold white light in operation, which may be particularly suitable for direct illumination.
  • the first semiconductor light-emitting elements and / or the second semiconductor light-emitting elements each have a plurality of light-emitting semiconductor chips.
  • the respective plurality of In this case, light-emitting semiconductor chips can be configured as a single housing, arranged in a common housing or in separate housings as a respective semiconductor light-emitting element.
  • the respective plurality of light-emitting semiconductor chips may comprise a plurality of differently colored semiconductor chips, particularly preferably the combination of a red, a green or whitish-green and a blue-emitting semiconductor chip. Additionally or alternatively, differently colored semiconductor chips and / or semiconductor chips may also be provided in combination with wavelength conversion elements.
  • the light color on the first and / or second mounting side of the illumination device can be selectively changed and controlled during operation, so that, for example, an illumination effect with different colors, temporally changing colors and / or a variable white light , For example, along the white light curve known in the art of Planckian black body radiators, are adjustable.
  • each mounting surface has electrical connections for a semiconductor light-emitting element arranged on the mounting surface.
  • Such connections may be provided, for example, in the form of electrical contact surfaces, solder contacts and / or plug contacts.
  • Electrical leads, which interconnect, for example, the mounting surfaces on a mounting side, can run as traces or cables along the surface or alternatively also in the interior or in a combination thereof along the main extension direction of the support body.
  • the carrier body in each case on the mounting surfaces on a circuit board, wherein the semiconductor light elements are each arranged on a circuit board, mounted and electrically connected.
  • the semiconductor light-emitting elements can be embodied as surface-mounted semiconductor light-emitting elements which are soldered onto the printed circuit boards on the mounting surfaces.
  • each mounting surface may have its own printed circuit board, which are interconnected via printed conductors and / or cable connections, for example via the interior of the carrier body.
  • a continuous printed circuit board may be provided on each mounting side, which extends along the main extension direction of the carrier body and projects, for example, between each of the mounting surfaces through a partial region of the carrier body.
  • the recesses forming the mounting surfaces have reflective side surfaces.
  • the side surfaces can be designed to be reflective or specularly reflective.
  • the side surfaces of a recess are formed perpendicular to the respective mounting surface.
  • the recesses may also have oblique side surfaces, so that it may be possible to deflect light emitted laterally from the semiconductor light-emitting elements in the direction of the main emission direction of the respective semiconductor light-emitting element.
  • the depressions may be the same or different on the at least two mounting sides.
  • the depressions on a mounting side ie the first and / or the second mounting side, may be particularly preferably the same. Due to the different design of wells, for example, by forming different wells on the first mounting side compared to the second mounting side, the desired emission characteristics for the mounting sides can be set independently.
  • the semiconductor light-emitting elements are at least partially or even completely sunk in the mounting surfaces formed by the depressions.
  • the depressions of the first mounting surfaces may have a shape, width and depth, so that light emitted by the first semiconductor light elements only at an angle of less than or equal to 65 °, and preferably of less than or equal to 45 ° to the surface normal of the respective mounting surface in Operation can be radiated.
  • the angle given here corresponds to the angle measured to the main emission direction, which also corresponds to the angle to the surface normal of the mounting surface.
  • the depressions or the side surfaces of the depressions act as shadows or, if these are designed to be reflective, as reflectors which, for example, can redirect the light in the direction of the main emission direction.
  • the depressions of the second mounting surfaces have a shape, width and depth, so that all the light emitted by the second semiconductor light elements is emitted directly. This may mean, in particular, that the depth together with the width and the shape of the recesses of the second mounting surfaces is selected such that the recesses and in particular the side surfaces of the recesses do not shade light.
  • the recesses of the second mounting surface are designed such that they have a shape, width and depth, so that light can be emitted at an angle of less than or equal to 90 ° to the main emission of the respective mounting surface or the surface normal of the respective mounting surface during operation ,
  • such emission characteristics or emission angles are particularly suitable for direct illumination and, in the case of the second mounting side, for indirect illumination.
  • the mounting surfaces of a mounting side along the main extension direction are spaced from each other with a respective same distance.
  • the distance between two adjacent mounting surfaces of the distance between the respective centers to each other is referred to as the distance between two adjacent mounting surfaces of the distance between the respective centers to each other.
  • the mounting surfaces and / or the second mounting surfaces may each be arranged uniformly spaced along the main extension direction of the carrier body.
  • the distance between two directly adjacent mounting surfaces is at least 2 cm.
  • the distances between the first mounting surfaces are equal to the distances between the second mounting surfaces, wherein the first and second mounting surfaces are arranged offset to one another.
  • the first mounting surfaces on the first mounting side and the second mounting surfaces on the second mounting side can be offset by a half distance from each other.
  • the semiconductor light-emitting elements of the first and / or the second mounting side are arranged at mutually different positions on the respective mounting surfaces.
  • This may mean in particular that the arrangement of the semiconductor light-emitting elements on the mounting surfaces of a mounting side is not uniform, but is formed in an asymmetrical arrangement, whereby in each case in the recesses formed by mounting surfaces, a different distance to the respective side surfaces can be achieved.
  • a different emission direction or a different emission cone of the semiconductor light elements can be achieved, whereby different emission characteristics of the first and / or the second mounting side of the illumination device can be achieved.
  • the carrier body has at least a third mounting side with third semiconductor light elements arranged along the main extension direction, formed by depressions third mounting surfaces.
  • the first, second and third mounting side are each arranged facing away from each other.
  • the surface normals of the second and third mounting surfaces may be formed symmetrically to the plane in which the surface normals of the first mounting surfaces lie.
  • the surface normals of the second and / or third mounting surfaces preferably include an angle greater than or equal to 90 ° and less than or equal to 135 ° with the surface normals of the first mounting surfaces.
  • the surface normals of the first mounting surfaces in an exemplary orientation of the illumination device in space pointing vertically downwards
  • the surface normals of the second and third mounting side in each case particularly preferably at an angle of greater than or equal to 0 ° and smaller or are directed at 45 ° to the horizontal.
  • the first, second and third mounting sides can be arranged uniformly with respect to the angle enclosed in each case between the surface normals, so that the respective surface normals each enclose an angle of approximately 120 ° with one another.
  • the second and third semiconductor light-emitting elements are of similar construction.
  • the second and third semiconductor light elements or the second and third mounting sides can be provided for indirect illumination be while the first mounting side and thus the first semiconductor light elements can be provided for direct illumination.
  • the third mounting surfaces and the recesses forming the third mounting surfaces what has been said above in connection with the first and second semiconductor light elements, mounting surfaces and their recesses, in particular the comments made in connection with the second semiconductor light elements and the second mounting surfaces.
  • the illumination device has a reflector, which is arranged downstream of the second mounting side in the emission direction of the second semiconductor light elements. If the illumination device has a third mounting side with third semiconductor light elements, then the reflector, in particular the second and the third mounting side, can be arranged downstream in the emission direction of the second and third semiconductor light elements. "Downstream in the emission direction" may mean in particular that the entire light emitted by the second and optionally also by the third semiconductor light elements falls on the reflector.
  • the reflector may be formed, for example, as a diffuse reflector, which may result, for example, in conjunction with second and optionally third semiconductor light elements, each having a plurality of different colored semiconductor chips, a good mixing of each emitted light.
  • the illumination device has one or more diffusers, for example scattering plates or scattering films, which are arranged downstream of the individual or several semiconductor light-emitting elements.
  • each of the wells of a mounting side or even all the mounting sides may be covered individually or jointly by such a diffuser.
  • optical diffusers By means of optical diffusers, a uniform and homogeneous emission as well as the use of differently colored semiconductor chips for the semiconductor light elements can also be achieved by a uniform mixing and thus a light color of the emitted light which is uniform over the solid angle.
  • the illumination device may comprise electrical connections, holding device such as a lamp base, a suspension attachment and / or a plug. Furthermore, a plurality of lighting devices can be plugged together, so that a lighting device with variable length can be possible.
  • the lighting device described here is used for general and indirect interior lighting, for example for office lighting, and at the same time as direct object lighting or is used for this purpose.
  • the lighting device described here can fulfill the following five requirements at the same time, namely glare-free, direct and indirect lighting, high luminaire efficiency, lighting efficiency of direct lighting and a compact design.
  • This can be supplemented particularly advantageous in that Surface mount semiconductor light elements such as surface mount light emitting diodes are used as light sources.
  • known light sources is usually achieved by the use of reflectors, secondary lenses or cover plates glare, but either the luminance is reduced or the direct eye contact with the light sources in the light source is avoided.
  • all the components mentioned require, in addition to the light source, additional optical components, which both reduce luminaire efficiency and increase the external dimensions of the luminaire.
  • the illumination device preferably has few or no optical elements arranged downstream of the semiconductor light elements, a high luminous efficiency and a high illumination efficiency can be achieved, in particular for direct illumination.
  • a high or highest luminous efficiency can always be achieved if the light within the illumination device enters into as few interactions as possible with optical components such as reflectors or lenses, since each interaction is associated with an absorption or a refractive index transition.
  • optical components such as reflectors or lenses, since each interaction is associated with an absorption or a refractive index transition.
  • the possibility decreases of adapting the emission characteristic of the known light sources in the desired manner. Due to the special geometric design and arrangement of the semiconductor light elements on the carrier body are in the illumination device described here such additional components not necessary to adjust the radiation characteristics of the lighting device in the desired manner.
  • FIGS. 1A to 3B schematic representations of lighting devices according to various embodiments.
  • identical or identically acting components may each be provided with the same reference numerals.
  • the elements shown and their proportions with each other are basically not to be regarded as true to scale, but individual elements such. As layers, components, components and areas, for better representability and / or better understanding exaggerated be shown thick or large.
  • FIGS. 1A to 1C a lighting device 10 is shown according to an embodiment, wherein the FIGS. 1B and 1C Sectional views of in Figure 1A shown view of the illumination device 100 along the cutting planes BB and CC are. The following description refers equally to the FIGS. 1A to 1C ,
  • the illumination device 100 has a rod-shaped carrier body 1 with a first and a second mounting side 11, 12.
  • the rod-shaped carrier body 1 has a main extension direction 99, along which first and second semiconductor light-emitting elements 31, 32 are arranged on the first and the second mounting side 11, 12.
  • each partial body 51, 52 has a circular cross-section, from which a circle segment has been removed, so that each of the partial bodies 51, 52 has a flattened side 50 and the partial bodies 51, 52 with the flattened sides 50 are arranged against one another.
  • the production of such a support body 1 can be carried out in one piece or in the form of a multi-part support body 1, for example in the form of separate part bodies 51, 52.
  • the carrier body 1 is made of metal, for example aluminum, which has a high thermal conductivity, so that the carrier body 1 is simultaneously formed as a heat sink for the semiconductor light elements 31, 32.
  • the support body 1 On the first and second mounting side 11, 12, the support body 1 has first and second mounting surfaces 21, 22, respectively are each formed by depressions and which are arranged along the main extension direction 99 spaced from each other.
  • the mounting surfaces 21, 22 are formed in particular by the bottom surfaces of the recesses and executed flat.
  • the recesses each spaced evenly on each of the mounting sides 11, 12 and arranged offset on the second mounting side 12 in comparison to the first mounting side 11 by half a distance.
  • the distance between two adjacent depressions on the mounting sides is in the present embodiment at least 2 cm.
  • first and second semiconductor light elements 31, 32 directly adjacent to each other are arranged to each other, whereby the formation of a high local heat generation can be avoided.
  • the first and the second mounting side 11, 12 are arranged facing away from each other, wherein in the FIGS. 1B and 1C indicated surface normals 41, 42 of the first and second mounting surfaces 21, 22 form an angle of 180 ° with each other, resulting in a radiation of the first and second semiconductor light elements 31, 32 in the opposite direction.
  • circuit boards 6 For electrical contacting or for electrical connection of the semiconductor light elements 31, 32, these are arranged on circuit boards 6 within the recesses.
  • the printed circuit boards 6 can, as described in the general part, be interconnected, so that a simultaneous control of the first Halbleit triallemente 31 and a simultaneous control of the second semiconductor light elements 32 is possible.
  • the illumination device 100 can have electrical connections as well as a holding device, for example in the form of a lamp cap or a suspension attachment (not shown), via which electrical supply lines can also be provided at the same time. Furthermore, the illumination device 100 can have connecting elements or plug-in elements (not shown) at the ends arranged in the main extension direction 99, by means of which, for example, a plurality of illumination devices 100 can be connected to one another and simultaneously operated.
  • the illumination device 100 in the exemplary embodiment shown is designed purely as an example on the first mounting side 11 as direct illumination and on the second mounting side 12 as indirect illumination.
  • the illumination device 100 purely by way of example as the first semiconductor light elements 31 described in the general part described cold white emitting light emitting diodes, while the second semiconductor light elements 32 are formed as warm white emitted light emitting diodes.
  • the light-emitting diodes are surface mountable on the circuit boards 6, so that a simple installation and a simple electrical connection of this result.
  • warm white emitting semiconductor light elements 31 and on the second mounting side 12 cold white emitting semiconductor light elements 32 can be used.
  • semiconductor light elements 31, 32nd to use on at least one mounting side 11, 12, each having a plurality of semiconductor chips, each emitting different colored light, so that a variable adjustability and controllability of the emitted light or its light color may be possible.
  • the individual Halbleiter criterialemente 31, 32 are formed as groups of light-emitting diodes, so-called LED clusters, which are formed of a plurality of individual LEDs.
  • the first semiconductor light elements 31 are each formed the same and the second semiconductor light elements 32 are each formed the same.
  • the first and second semiconductor light-emitting elements 31, 32 may be different from each other in terms of their construction and, as already described, in terms of their radiated light color.
  • the recesses forming the first and second mounting surfaces 21, 22 are provided with vertical side surfaces, whereby a high compactness of the illumination device 100 can be achieved.
  • the depressions of the first mounting surfaces 21 are formed with respect to their shape, width and height such that the light emitted by the first semiconductor light elements 31 light only in an angular range of at most 65 ° and preferably of at most 45 ° measured to the surface normal 41 of the first mounting surfaces 21 directly can be radiated while light, which is radiated at larger angles from the first semiconductor light elements 31, is shaded by the side surfaces.
  • the side surfaces of the recesses on the first and / or second mounting side 11, 12 may also be reflective be formed and in particular have a specular reflectivity.
  • the side surfaces can also be inclined or oblique to the mounting surfaces 21, 22, so that the light emitted laterally by the semiconductor light elements 31, 32 can be deflected along the surface normals 41, 42 in the direction of the respective main radiation direction.
  • the recesses of the second mounting surfaces 22 are executed in the embodiment shown so that the entire light or preferably light in the range of a maximum of 90 ° relative to the surface normal 42 of the second mounting surfaces can be radiated without contact or direct irradiation on the side surfaces. This makes it possible to achieve a homogeneous emission characteristic for the second mounting side 12 designed as indirect illumination in the embodiment shown.
  • the illumination device 100 can meet in particular the requirements for glare-free, direct and indirect illumination, high luminaire efficiency and illumination efficiency of the direct illumination as well as a compact design.
  • a structured cover pane and / or an optical diffuser can be arranged within the depressions or over the depressions and in particular also over the first and / or the second mounting side 11, 12.
  • FIG. 2 a part of a lighting device 101 is shown, which has on a mounting side, in the illustrated embodiment, the first mounting side 11, first formed by recesses mounting surfaces 21, whose side surfaces are formed as reflectors. Furthermore, the first semiconductor light-emitting elements 31 are arranged at mutually different positions on the respective first mounting surfaces 21 within the respective recesses. As a result, an asymmetrical emission characteristic or a precise adjustment of the desired emission characteristic of the first mounting side 11 shown in the present case can be achieved, for which purpose no additional optical components such as lenses or additional reflectors are necessary.
  • FIGS. 3A and 3B a further embodiment of a lighting device 102 is shown, wherein the FIGS. 3A and 3B each show sections along the main extension direction 99 of the illumination device, the sections of the FIGS. 1B and 1C correspond.
  • the lighting device 102 has, in addition to the first and second mounting side 11, 12, a third mounting side 13, wherein the first, the second and the third mounting side 11, 12, 13 are arranged facing away from each other.
  • the surface normals 41, 42, 43 of the first, second and third mounting surfaces 21, 22, 23 of the first, second and third mounting side 11, 12, 13 arranged at an angle of about 120 ° to each other.
  • the second and third mounting sides 12, 13 may also be arranged such that the second and third semiconductor light elements 32, 33 can radiate at an angle of 0 ° to 45 ° to a horizontal.
  • the carrier body 1 of the illumination device 103 of the illustrated embodiment of FIGS. 3A and 3B has three rod-shaped part body 51, 52, 53, each having a partially circular cross-section with flattened side surfaces 50, on which the partial body 51, 52, 53 are arranged together.
  • first semiconductor light elements 31 are arranged, which are designed as warm white emitting LEDs.
  • the second and third semiconductor light-emitting elements 32, 33 which are arranged in the second and third mounting surfaces 22, 23 formed by depressions and arranged along the main extension direction of the illumination device 103 or of the carrier body 1, each have clusters of blue, greenish-white and red LEDs , In this case, the second and third semiconductor light elements 32, 33 are each formed the same.
  • the semiconductor light elements 32, 33 are provided on the second and third mounting side 12, 13 for indirect illumination.
  • Their design as multi-colored LED clusters makes it possible to change the light color of the indirect lighting for example, along the white curve of a Planckian black body radiator or with different, adjustable color and light impressions.
  • the second and third semiconductor light-emitting elements 32, 33 it is possible for the second and third semiconductor light-emitting elements 32, 33 to arrange a reflector, in particular a diffuse reflector, as indicated by the reference numeral 7. As a result, good mixing of the light emitted by the second and third semiconductor light-emitting elements 32, 33 can be achieved.
  • FIGS. 1A to 3B shown embodiments of lighting devices also have other or other features according to the embodiments described above in the general part.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Claims (13)

  1. Dispositif d'éclairage, comprenant
    un corps porteur (1) en forme de bâton avec au moins un premier et un deuxième côté de montage (11, 12) et une direction d'extension principale (99),
    des premiers éléments d'éclairage (31) à semi-conducteurs sur des premières surfaces de montage (21) du premier côté de montage (11) et
    des deuxièmes éléments d'éclairage (32) à semi-conducteurs sur des deuxièmes surfaces de montage (22) du deuxième côté de montage (12),
    le premier et le deuxième côté de montage (11, 12) étant opposés l'un à l'autre,
    les surfaces de montage (21, 22) étant formées par des creux placés avec un écart dans les côtés de montage (11, 12), le long de la direction d'extension principale (99) et
    les premiers éléments d'éclairage (31) à semi-conducteurs étant identiques les uns aux autres et les deuxièmes éléments d'éclairage (32) à semi-conducteurs étant identiques les uns aux autres, caractérisé en ce que
    le corps porteur (1) comporte au moins deux corps partiels (51, 52) en forme de bâtons avec chacun une section transversale partiellement ronde et avec chacun au moins un côté (50) aplati et les corps partiels (51, 52) sont placés l'un à côté de l'autre avec les côtés (50) aplatis
    et/ou
    le corps porteur (1) comporte un troisième (13) côté de montage avec des troisièmes éléments d'éclairage (33) à semi-conducteurs sur des troisièmes surfaces de montage (23) placées le long de la direction d'extension principale, formées par des creux et le premier, le deuxième et le troisième côté de montage (11, 12, 13) sont à chaque fois opposés les uns aux autres.
  2. Dispositif d'éclairage selon la revendication 1, les éléments d'éclairage (31, 32) à semi-conducteurs étant placés chacun sur une carte de circuits imprimés (6) sur les surfaces de montage (21, 22).
  3. Dispositif d'éclairage selon l'une quelconque des revendications précédentes, les éléments d'éclairage (31, 32) à semi-conducteurs d'un côté de montage (11, 12) étant placés sur les surfaces de montage (21, 22) respectives sur des positions différentes les unes des autres.
  4. Dispositif d'éclairage selon l'une quelconque des revendications précédentes, les écarts entre les premières surfaces de montage (21) étant identiques aux écarts entre les deuxièmes surfaces de montage (22) et les premières et les deuxièmes surfaces de montage (21, 22) étant placées en étant décalées les unes par rapport aux autres.
  5. Dispositif d'éclairage selon l'une quelconque des revendications précédentes, les creux des premières et/ou des deuxièmes surfaces de montage (21, 22) comportant des surfaces latérales réfléchissantes.
  6. Dispositif d'éclairage selon l'une quelconque des revendications précédentes, les creux des premières surfaces de montage (21) présentant une forme, une largeur et une profondeur telles, qu'en fonctionnement la lumière des premiers éléments d'éclairage (31) à semi-conducteurs soit rayonnée avec un angle inférieur ou égal à 65°, de manière particulièrement préférée, inférieur ou égal à 45° par rapport à la normale de surface (41) de la première surface de montage (21) respective.
  7. Dispositif d'éclairage selon l'une quelconque des revendications 1 à 6, les creux des deuxièmes surfaces de montage (22) présentant une forme, une largeur et une profondeur telles, que l'ensemble de la lumière rayonnée par les deuxièmes éléments d'éclairage (32) à semi-conducteurs soit rayonné directement.
  8. Dispositif d'éclairage selon l'une quelconque des revendications 1 à 6, les creux des deuxièmes surfaces de montage (22) présentant une forme, une largeur et une profondeur telles, qu'en fonctionnement la lumière des deuxièmes éléments d'éclairage (32) à semi-conducteurs soit rayonnée avec un angle inférieur ou égal à 90° par rapport à la normale de surface (42) de la deuxième surface de montage (22) respective.
  9. Dispositif d'éclairage selon l'une quelconque des revendications précédentes, les premiers éléments d'éclairage (31) à semi-conducteurs comportant dans chaque creux de la première surface de montage (21) et/ou les deuxièmes éléments d'éclairage (32) à semi-conducteurs comportant dans chaque creux de la deuxième surface d'éclairage (22) chaque fois précisément une puce à semi-conducteur émettant de la lumière.
  10. Dispositif d'éclairage selon l'une quelconque des revendications précédentes, les premiers éléments d'éclairage (31) à semi-conducteurs et/ou les deuxièmes éléments d'éclairage (32) à semi-conducteurs comportant chacun une pluralité de puces à semi-conducteurs émettant de la lumière.
  11. Dispositif d'éclairage selon l'une quelconque des revendications précédentes, les premiers et les deuxièmes éléments d'éclairage (31, 32) à semi-conducteurs rayonnant de la lumière de couleur différente.
  12. Dispositif d'éclairage selon l'une quelconque des revendications précédentes, les deuxièmes et les troisièmes éléments d'éclairage (32, 33) étant conçus en étant de type identique.
  13. Dispositif d'éclairage selon l'une quelconque des revendications précédentes, en aval du deuxième côté de montage (12), en direction de rayonnement des deuxièmes éléments d'éclairage (32) à semi-conducteurs étant placé un réflecteur (7).
EP12720815.5A 2011-04-15 2012-04-12 Dispositif d'éclairage Not-in-force EP2697557B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011017195A DE102011017195A1 (de) 2011-04-15 2011-04-15 Beleuchtungseinrichtung
PCT/EP2012/056688 WO2012140146A1 (fr) 2011-04-15 2012-04-12 Dispositif d'éclairage

Publications (2)

Publication Number Publication Date
EP2697557A1 EP2697557A1 (fr) 2014-02-19
EP2697557B1 true EP2697557B1 (fr) 2016-06-08

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ID=46085002

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EP12720815.5A Not-in-force EP2697557B1 (fr) 2011-04-15 2012-04-12 Dispositif d'éclairage

Country Status (5)

Country Link
US (1) US9371968B2 (fr)
EP (1) EP2697557B1 (fr)
CN (1) CN103492790B (fr)
DE (1) DE102011017195A1 (fr)
WO (1) WO2012140146A1 (fr)

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CN106252491A (zh) 2012-05-29 2016-12-21 晶元光电股份有限公司 发光装置
CH707975A1 (de) * 2013-04-30 2014-10-31 Regent Beleuchtungskörper Ag Leuchte mit optoelektronischer Einheit.
US10488001B2 (en) 2017-11-28 2019-11-26 Contemporary Visions, LLC Lighting system
CA3058851A1 (fr) * 2018-12-24 2020-06-24 Axis Lighting Inc. Appareils d`eclairage exterieurs
EP4272266B1 (fr) * 2021-01-04 2024-06-05 Signify Holding B.V. Filament led

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Also Published As

Publication number Publication date
DE102011017195A1 (de) 2012-10-18
US9371968B2 (en) 2016-06-21
CN103492790A (zh) 2014-01-01
US20140104829A1 (en) 2014-04-17
WO2012140146A1 (fr) 2012-10-18
EP2697557A1 (fr) 2014-02-19
CN103492790B (zh) 2016-08-10

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