EP2509770A4 - System and method for overmolding of decorated plastic parts - Google Patents

System and method for overmolding of decorated plastic parts Download PDF

Info

Publication number: EP2509770A4
Authority: EP; European Patent Office
Prior art keywords: overmolding; plastic parts; decorated plastic; decorated; parts
Prior art date: 2009-12-11
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP10836323.5A

Other languages

German (de)

French (fr)

Other versions

EP2509770A1 (en

EP2509770C0 (en

EP2509770B1 (en

Inventor

Jeff Qin (Jichen)

Charles R. Hill

Suriaprakash Narotamo

Levin Li Wu Bing

Spring Wu

Zhong Wang

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Flextronics AP LLC

Original Assignee

Flextronics AP LLC

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-12-11

Filing date

2010-12-13

Publication date

2017-06-14

2010-12-13 Application filed by Flextronics AP LLC filed Critical Flextronics AP LLC

2012-10-17 Publication of EP2509770A1 publication Critical patent/EP2509770A1/en

2017-06-14 Publication of EP2509770A4 publication Critical patent/EP2509770A4/en

2023-06-07 Application granted granted Critical

2023-06-07 Publication of EP2509770C0 publication Critical patent/EP2509770C0/en

2023-06-07 Publication of EP2509770B1 publication Critical patent/EP2509770B1/en

Status Active legal-status Critical Current

2030-12-13 Anticipated expiration legal-status Critical

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0243—Mechanical details of casings for decorative purposes
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/03—Injection moulding apparatus
- B29C45/04—Injection moulding apparatus using movable moulds or mould halves
- B29C45/06—Injection moulding apparatus using movable moulds or mould halves mounted on a turntable, i.e. on a rotating support having a rotating axis parallel to the mould opening, closing or clamping direction
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1615—The materials being injected at different moulding stations
- B29C45/162—The materials being injected at different moulding stations using means, e.g. mould parts, for transferring an injected part between moulding stations
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1675—Making multilayered or multicoloured articles using exchangeable mould halves
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0279—Improving the user comfort or ergonomics
- H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Mechanical Engineering (AREA)
Microelectronics & Electronic Packaging (AREA)
Signal Processing (AREA)
Injection Moulding Of Plastics Or The Like (AREA)
Moulds For Moulding Plastics Or The Like (AREA)

EP10836323.5A 2009-12-11 2010-12-13 System and method for overmolding of decorated plastic parts Active EP2509770B1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US28577209P	2009-12-11	2009-12-11
PCT/US2010/003152 WO2011071539A1 (en)	2009-12-11	2010-12-13	System and method for overmolding of decorated plastic parts

Publications (4)

Publication Number	Publication Date
EP2509770A1 EP2509770A1 (en)	2012-10-17
EP2509770A4 true EP2509770A4 (en)	2017-06-14
EP2509770C0 EP2509770C0 (en)	2023-06-07
EP2509770B1 EP2509770B1 (en)	2023-06-07

Family

ID=44145838

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP10836323.5A Active EP2509770B1 (en)	2009-12-11	2010-12-13	System and method for overmolding of decorated plastic parts

Country Status (4)

Country	Link
US (1)	US8552292B2 (en)
EP (1)	EP2509770B1 (en)
CN (1)	CN102869492B (en)
WO (1)	WO2011071539A1 (en)

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CN102686057A (en) *	2011-03-18	2012-09-19	深圳富泰宏精密工业有限公司	Electronic device shell and manufacturing method thereof
US8624111B2 (en) *	2011-06-21	2014-01-07	A.G. Findings & Mfg. Co.	Multilayer portable device case and method therefor
US9956704B2 (en)	2012-04-19	2018-05-01	Kohler Co.	Decorated rigid panel
US9539749B2 (en)	2012-05-15	2017-01-10	Blackberry Limited	Formable inserts and related methods
US9476247B2 (en)	2013-03-14	2016-10-25	Kohler Co.	Shower threshold and methods of implementation
JP6371100B2 (en) *	2014-04-23	2018-08-08	株式会社小糸製作所	Two-color molding method
DE102014210843A1 (en) *	2014-06-06	2015-12-17	Robert Bosch Gmbh	Housing, method for manufacturing a housing and injection molding apparatus for producing a housing
CN107920677A (en) *	2015-06-26	2018-04-17	现代包装有限责任公司	Overmolded low cost tableware
DE102015120876A1 (en) *	2015-12-02	2017-06-08	Novem Car Interior Design Gmbh	Molded part, in particular formed as a molded part decorative part and / or trim part for a vehicle interior and a method for producing a molded part
CN105599327B (en) *	2016-02-29	2018-03-16	清远市鑫叶新型装饰材料有限公司	A kind of preparation technology of cavity structure decorative wire strip
CN107618133B (en) *	2016-07-14	2019-09-20	书香门地（上海）美学家居股份有限公司	A kind of molding equipment and preparation method thereof on transparent diamond setting floor
JP6441271B2 (en) *	2016-08-23	2018-12-19	株式会社名機製作所	Mold rotary injection molding machine and mold replacement method for mold rotary injection molding machine
US20180065780A1 (en) *	2016-09-06	2018-03-08	Samsonite Ip Holdings S.Àr.L.	Case with internal graphic
WO2020050844A1 (en) *	2018-09-06	2020-03-12	Hewlett-Packard Development Company, L.P.	Decorated panels for electronic devices
US11090876B2 (en)	2018-09-18	2021-08-17	Flex Ltd.	Assembly of sub-components by compression molding
US11200385B2 (en)	2018-09-27	2021-12-14	Apple Inc.	Electronic card having an electronic interface
US11571766B2 (en)	2018-12-10	2023-02-07	Apple Inc.	Laser marking of an electronic device through a cover
US11299421B2 (en)	2019-05-13	2022-04-12	Apple Inc.	Electronic device enclosure with a glass member having an internal encoded marking

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US7003267B2 (en) *	2002-05-14	2006-02-21	Siemens Communications, Inc.	Internal part design, molding and surface finish for cosmetic appearance
US20070048470A1 (en) *	2005-08-16	2007-03-01	Apple Computer, Inc.	Housing of an electronic device formed by doubleshot injection molding
US20090186758A1 (en) *	2008-01-22	2009-07-23	Ukpabi Pauline O	Laser coloration of coated substrates

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2010
- 2010-12-13 WO PCT/US2010/003152 patent/WO2011071539A1/en active Application Filing
- 2010-12-13 US US12/928,508 patent/US8552292B2/en active Active
- 2010-12-13 CN CN201080063520.7A patent/CN102869492B/en active Active
- 2010-12-13 EP EP10836323.5A patent/EP2509770B1/en active Active

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US7003267B2 (en) *	2002-05-14	2006-02-21	Siemens Communications, Inc.	Internal part design, molding and surface finish for cosmetic appearance
US20070048470A1 (en) *	2005-08-16	2007-03-01	Apple Computer, Inc.	Housing of an electronic device formed by doubleshot injection molding
US20090186758A1 (en) *	2008-01-22	2009-07-23	Ukpabi Pauline O	Laser coloration of coated substrates

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2011071539A1 *

Also Published As

Publication number	Publication date
EP2509770A1 (en)	2012-10-17
US20110180294A1 (en)	2011-07-28
WO2011071539A1 (en)	2011-06-16
EP2509770C0 (en)	2023-06-07
EP2509770B1 (en)	2023-06-07
US8552292B2 (en)	2013-10-08
CN102869492B (en)	2015-11-25
CN102869492A (en)	2013-01-09

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