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EP2592696B1 - Automation components of a modular automation device - Google Patents

Automation components of a modular automation device Download PDF

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Publication number
EP2592696B1
EP2592696B1 EP20110188484 EP11188484A EP2592696B1 EP 2592696 B1 EP2592696 B1 EP 2592696B1 EP 20110188484 EP20110188484 EP 20110188484 EP 11188484 A EP11188484 A EP 11188484A EP 2592696 B1 EP2592696 B1 EP 2592696B1
Authority
EP
European Patent Office
Prior art keywords
connection elements
circuit board
printed circuit
connection
multilayer printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP20110188484
Other languages
German (de)
French (fr)
Other versions
EP2592696A1 (en
Inventor
Michael BRÄUNLICH
Michael Chowaniec
Gunter Griessbach
Dirk Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to EP20110188484 priority Critical patent/EP2592696B1/en
Priority to CN201210444578.7A priority patent/CN103107427B/en
Publication of EP2592696A1 publication Critical patent/EP2592696A1/en
Application granted granted Critical
Publication of EP2592696B1 publication Critical patent/EP2592696B1/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/22—Bases, e.g. strip, block, panel
    • H01R9/24—Terminal blocks
    • H01R9/26—Clip-on terminal blocks for side-by-side rail- or strip-mounting
    • H01R9/2625—Clip-on terminal blocks for side-by-side rail- or strip-mounting with built-in electrical component
    • H01R9/2658—Clip-on terminal blocks for side-by-side rail- or strip-mounting with built-in electrical component with built-in data-bus connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6582—Shield structure with resilient means for engaging mating connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/22—Bases, e.g. strip, block, panel
    • H01R9/24—Terminal blocks
    • H01R9/26—Clip-on terminal blocks for side-by-side rail- or strip-mounting
    • H01R9/2675—Electrical interconnections between two blocks, e.g. by means of busbars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/22—Bases, e.g. strip, block, panel
    • H01R9/24—Terminal blocks
    • H01R9/26—Clip-on terminal blocks for side-by-side rail- or strip-mounting
    • H01R9/2691—Clip-on terminal blocks for side-by-side rail- or strip-mounting with ground wire connection to the rail

Definitions

  • the invention relates to an automation component of a modular automation device having a base module and an electronics module which can be plugged onto this base module according to the preamble of claim 1.
  • the invention relates to a modular automation device with such an automation component.
  • the process signal lines are shielded by means of a metal shell provided with reference potential, in order to avoid the influence of electromagnetic interference fields, in particular electromagnetic interference fields in a rough process environment, to reduce.
  • process voltage lines are often not shielded.
  • the interference fields can have a detrimental effect on the process signals, for example in the form of a disturbing signal influencing, and can also affect the process voltages disturbing.
  • high-frequency currents can flow through this metallic shell or shielding, which also have a disadvantageous effect; because these generate a magnetic interference field, which can induce interference voltages in the process signal and process voltage lines and thus interferes with the useful signals conducted via the connection elements of the automation component.
  • An automation component according to the preamble of claim 1 and an automation device according to the preamble of claim 5 is known from DE 197 48 530 C1 known. Measures to achieve good behavior with regard to electromagnetic compatibility (EMC behavior) are not proposed there.
  • EMC behavior electromagnetic compatibility
  • the invention is therefore an object of the invention to provide an automation component of the type mentioned with improved behavior in terms of electromagnetic compatibility (EMC behavior) and beyond a modular automation device with improved EMC behavior.
  • EMC behavior electromagnetic compatibility
  • connection elements for contacting with the process signal and process voltage lines are part of a terminal block, which is arranged on a carrier element in the form of a multilayer printed circuit board whose outer layers are provided for shielding.
  • a support element By such a support element, the process signals are shielded in the region of the support element and the support member acts as an "extended" cable shield or as a continuation of the cable shield to the connection elements of the electronic module.
  • the connection elements for connecting the process voltage lines are connected to the outer end of the terminal block, whereby a coupling of caused by the process voltage disturbances is largely avoided.
  • the terminal block shielded, for example, as a shielded connector to form.
  • a headband provided with a contact spring is attached to one side of the multilayer printed circuit board, such that the contact spring and a side wall at the outer end of the terminal block form a recess for receiving a flag of a cable shield. Therefore, if the tab of the cable shield pad is inserted into the recess, the cable shield pad covers the connection elements for connecting the process voltage lines, whereby the disturbances caused by the process voltage are even better suppressed or prevented from coupling into the process signal lines.
  • the unshielded surface is reduced, which passes through the interference magnetic field, this Interference magnetic field of high-frequency via the cable shield and the process voltage lines flowing currents is effected.
  • This unshielded surface is "spanned" on the one hand between the process signal lines and the cable shield and on the other hand between the process signal lines and the reference potential of the electronic module.
  • Due to the reduced area the couplable interference voltage is reduced, the interference voltage component induced in the process signal lines, which is applied together with the useful signal at the electronics module, is reduced.
  • the multilayer printed circuit board is provided with filtering and damping means, which are connected downstream of the connecting elements for connection of the process voltage lines.
  • the electronic module is loaded with already filtered process voltages.
  • these filter and damping means can be designed for a higher cutoff frequency, whereby faster or higher-frequency process signals can be transmitted or processed.
  • the multi-layer printed circuit board between the terminal block and the other connection elements is arranged, wherein the connection elements for connecting the process voltage lines by means of multilayer printed circuit board with the other connection elements are electrically connected and wherein a arranged over these other connections Schirmbügel with contacted the mounting rail.
  • the terminal block is shielded, z.
  • educated in the form of a shielded connector.
  • a multilayer printed circuit board which is part of a base module of an automation component of an automation device.
  • the base module for example, not shown here clamping connections.
  • a terminal block 3 with a plurality of connection elements 4, 5 is arranged, of which the connection elements 4 are provided for connecting not shown here process signal lines of a signal cable and the connection elements 5 for connecting also not shown here process voltage lines of a voltage cable.
  • the connecting elements 5 for connecting the process voltage lines are connected to the outer end of the terminal block 3.
  • the multilayer printed circuit board 1 is further provided with a connector 6, which is provided for receiving an electronic module of the automation component.
  • This electronic module can be used, for example, as an analog or digital input / output module, as an intelligent module with CPU functionality, be designed as an interface module or as another functional or technology module.
  • the terminals of the connector 6 are at least partially electrically connected via corresponding tracks of the multilayer printed circuit board 1 with the connection elements 4, 5 of the terminal block 3.
  • the outer layers of the multi-layer printed circuit board 1 are formed for shielding, wherein the outer layers of the multilayer printed circuit board 1 are electrically connected via contact springs 13, 14 with the mounting rail 2 connected to the shield potential.
  • the transmitted over the process signal lines process signals are shielded.
  • the outer layers of the multilayer printed circuit board 1 are connected to the screen of the signal cable or the process signal lines by - as will be shown below - contact them with a flag 7 of a cable shield 8, in which the shielding of the process signal lines connected to the shield potential by means of a Screw terminal 9 is attached.
  • These process signal lines are passed through the cable screen support 8 for connection to the connection elements 4, which is described in US Pat FIG. 1 indicated by an arrow X.
  • a further contact spring 10 of a retaining clip 11 is provided, which is attached to one side of the multilayer printed circuit board 1.
  • This contact spring 10 forms with the side wall 12 of the terminal block 3 at the outer end of this terminal block 3 has a recess for receiving the lug 7 of the cable shield 8.
  • the multilayer printed circuit board 1 on the opposite side of the terminal block 3 of this multilayer printed circuit board 1 filter and damping means 15, which are connected downstream of the connection elements 5 for connecting the process voltage lines.
  • further connection elements 16 are further arranged, which are provided for forwarding the process voltage to at least one adjacent base module.
  • These further connection elements 16 are electrically connected via conductor tracks of the multi-layer printed circuit board 1 to the connection elements 5 for connecting the process voltage lines, to improve the shield and to protect the other connection elements 16, a shield bracket 17 is arranged on these other connection elements 16, which is connected to the mounting rail 2 contacted by the contact spring 13.

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Description

Die Erfindung betrifft eine Automatisierungskomponente eines modularen Automatisierungsgerätes mit einem Basismodul und einem auf dieses Basismodul steckbaren Elektronikmodul gemäß dem Oberbegriff des Anspruchs 1. Darüber hinaus betrifft die Erfindung ein modulares Automatisierungsgerät mit einer derartigen Automatisierungskomponente.The invention relates to an automation component of a modular automation device having a base module and an electronics module which can be plugged onto this base module according to the preamble of claim 1. In addition, the invention relates to a modular automation device with such an automation component.

Aus dem Siemens-Katalog ST 70, Kapitel 9, Ausgabe 2011 ist ein Automatisierungsgerät in Form einer so genannten "Dezentralen Peripherie " bekannt, welche für eine dezentrale Automatisierung eines zu steuernden technischen Prozesses vorgesehen ist. Diese Peripherie ist über einen geeigneten Bus mit einem übergeordneten Automatisierungsgerät bzw. Automatisierungssystem verbunden und weist Automatisierungskomponenten in Form von mit Elektronikmodulen bestückten Basismodulen auf, an die Prozesssignal- und Prozessspannungsleitungen anschließbar sind, wobei über die Prozessspannungsleitungen häufig Aktoren sowie Sensoren mit einer Versorgungs- bzw. einer Prozessspannung beaufschlagt werden. Die Prozesssignalleitungen sind zur Übermittlung von Prozesssignalen vorgesehen, z. B. Prozesssignale in Form von Sensor-und/oder Aktorsignalen, wobei ein Sensor, z. B. ein Druck-oder Temperatursensor, dem Elektronikmodul der Automatisierungskomponente ein Sensorsignal zuführt, welches eine erfasste Temperatur oder einen erfassten Druck repräsentiert, und das Elektronikmodul beispielsweise nach der Verarbeitung des Sensorsignals mittels eines Aktorsignals einen Aktor ansteuert.From the Siemens Catalog ST 70, Chapter 9, Edition 2011 is an automation device in the form of a so-called "decentralized periphery This peripheral is connected to a higher-level automation device or automation system via a suitable bus and has automation components in the form of base modules equipped with electronic modules, to which process signal and process voltage lines can be connected Actuators and sensors are frequently supplied with a supply voltage or a process voltage via the process voltage lines The process signal lines are provided for the transmission of process signals, for example process signals in the form of sensor and / or actuator signals, wherein a sensor, e.g. B. a pressure or temperature sensor, the electronic module of the automation component supplies a sensor signal representing a detected temperature or a detected pressure, and the electronic module, for example, after processing the sensor signal s by means of an actuator signal drives an actuator.

Gewöhnlich sind die Prozesssignalleitungen mittels einer mit Bezugspotential versehenen metallischen Hülle abgeschirmt, um den Einfluss elektromagnetischer Störfelder, insbesondere elektromagnetische Störfelder in einer rauen Prozessumgebung, zu verringern. Prozessspannungsleitungen sind dagegen oft nicht abgeschirmt. Die Störfelder können sich schädlich auf die Prozesssignale auswirken, beispielsweise in Form einer störenden Signalbeeinflussung, und können ferner die Prozessspannungen störend beeinflussen. Allerdings können über diese metallische Hülle bzw. Abschirmung hochfrequente Ströme flie-βen, die sich ebenfalls nachteilig auswirken; denn diese erzeugen ein magnetisches Störfeld, welches in den Prozesssignal- und Prozessspannungsleitungen Störspannungen induzieren kann und somit die über die Anschlusselemente der Automatisierungskomponente geleiteten Nutzsignale störend beeinflusst.
Es sind daher Maßnahmen erforderlich, welche ein Einkoppeln der genannten Störungen in die Automatisierungskomponente weitgehend verhindern, um dadurch ein fehlerfreies und sichereres Steuern eines technischen Prozesses zu gewährleisten, d. h. um dadurch sicherzustellen, dass die Automatisierungskomponente bzw. das Automatisierungsgerät einen technischen Prozess zur Lösung der Automatisierungsaufgabe fehlerfrei steuern kann.Usually, the process signal lines are shielded by means of a metal shell provided with reference potential, in order to avoid the influence of electromagnetic interference fields, in particular electromagnetic interference fields in a rough process environment, to reduce. In contrast, process voltage lines are often not shielded. The interference fields can have a detrimental effect on the process signals, for example in the form of a disturbing signal influencing, and can also affect the process voltages disturbing. However, high-frequency currents can flow through this metallic shell or shielding, which also have a disadvantageous effect; because these generate a magnetic interference field, which can induce interference voltages in the process signal and process voltage lines and thus interferes with the useful signals conducted via the connection elements of the automation component.
Therefore, measures are required which largely prevent a coupling of said disturbances in the automation component, thereby ensuring error-free and safer control of a technical process, ie to ensure that the automation component or the automation device, a technical process to solve the automation task can control error-free.

Eine Automatisierungskomponente gemäß dem Oberbegriff des Anspruchs 1 sowie ein Automatisierungsgerät gemäß dem Oberbegriff des Anspruchs 5 ist aus der DE 197 48 530 C1 bekannt. Maßnahmen, um ein gutes Verhalten im Hinblick auf die elektromagnetische Verträglichkeit (EMV-Verhalten) zu erzielen, werden dort nicht vorgeschlagen.An automation component according to the preamble of claim 1 and an automation device according to the preamble of claim 5 is known from DE 197 48 530 C1 known. Measures to achieve good behavior with regard to electromagnetic compatibility (EMC behavior) are not proposed there.

Der Erfindung liegt daher die Aufgabe zugrunde, eine Automatisierungskomponente der eingangs genannten Art mit einem verbesserten Verhalten im Hinblick auf die elektromagnetische Verträglichkeit (EMV-Verhalten) und darüber hinaus ein modulares Automatisierungsgerät mit einem verbesserten EMV-Verhalten zu schaffen.The invention is therefore an object of the invention to provide an automation component of the type mentioned with improved behavior in terms of electromagnetic compatibility (EMC behavior) and beyond a modular automation device with improved EMC behavior.

Diese Aufgabe wird im Hinblick auf die Automatisierungskomponente durch die im kennzeichnenden Teil des Anspruchs 1, bezüglich des modularen Automatisierungsgerätes durch die im kennzeichnenden Teil des Anspruchs 5 angegebenen Maßnahmen gelöst.This object is achieved with regard to the automation component by the in the characterizing part of claim 1, with respect to the modular automation device by the in characterizing part of claim 5 specified measures.

Die Anschlusselemente zum Kontaktieren mit den Prozesssignal-und Prozessspannungsleitungen sind Bestandteil eines Anschlussblockes, welcher auf einem Trägerelement in Form einer Mehrlagen-Leiterplatte angeordnet ist, deren Außenlagen zur Abschirmung vorgesehen sind. Durch ein derartiges Trägerelement werden die Prozesssignale auch im Bereich des Trägerelementes abgeschirmt und das Trägerelement wirkt wie ein "verlängerter" Kabelschirm bzw. wie eine Weiterführung des Kabelschirms bis zu den Anschlusselementen des Elektronikmoduls. Darüber hinaus sind die Anschlusselemente zum Anschluss der Prozessspannungsleitungen an das äußere Ende des Anschlussblockes gelegt, wodurch ein Einkoppeln von durch die Prozessspannung bewirkten Störungen weitgehend vermieden wird. Ferner ermöglicht ein derartiges Trägerelement in Form einer Mehrlagen-Leiterplatte, den Anschlussblock geschirmt, beispielsweise als geschirmten Steckverbinder, auszubilden.The connection elements for contacting with the process signal and process voltage lines are part of a terminal block, which is arranged on a carrier element in the form of a multilayer printed circuit board whose outer layers are provided for shielding. By such a support element, the process signals are shielded in the region of the support element and the support member acts as an "extended" cable shield or as a continuation of the cable shield to the connection elements of the electronic module. In addition, the connection elements for connecting the process voltage lines are connected to the outer end of the terminal block, whereby a coupling of caused by the process voltage disturbances is largely avoided. Furthermore, such a carrier element in the form of a multi-layer printed circuit board, the terminal block shielded, for example, as a shielded connector to form.

Ein mit einer Kontaktfeder versehener Haltebügel ist an einer Seite der Mehrlagen-Leiterplatte befestigt, derart, dass die Kontaktfeder und eine Seitenwand am äußeren Ende des Anschlussblockes eine Ausnehmung zur Aufnahme einer Fahne einer Kabelschirmauflage bilden. Falls die Fahne der Kabelschirmauflage in die Ausnehmung gesteckt ist, überdeckt daher die Kabelschirmauflage die Anschlusselemente zum Anschluss der Prozessspannungsleitungen, wodurch die durch die Prozessspannung bewirkten Störungen noch besser unterdrückt bzw. gehindert werden, in die Prozessignalleitungen einzukoppeln. Mittels einer derartigen direkten Kontaktierung der Kabelschirmauflage mit den Außenlagen der Mehrlagen-Leiterplatte ist die Fläche, welche sich zwischen dem Kabelschirm und den aus diesem Kabelschirm herausragenden Prozesssignalleitungen und den Anschlusselementen ergibt, minimal.A headband provided with a contact spring is attached to one side of the multilayer printed circuit board, such that the contact spring and a side wall at the outer end of the terminal block form a recess for receiving a flag of a cable shield. Therefore, if the tab of the cable shield pad is inserted into the recess, the cable shield pad covers the connection elements for connecting the process voltage lines, whereby the disturbances caused by the process voltage are even better suppressed or prevented from coupling into the process signal lines. By means of such a direct contacting of the cable shield support with the outer layers of the multilayer printed circuit board, the area which results between the cable shield and the process signal lines protruding from this cable shield and the connection elements is minimal.

Vorteilhaft ist, dass die ungeschirmte Fläche verringert wird, welche das Störmagnetfeld durchsetzt, wobei dieses Störmagnetfeld von hochfrequenten über die Kabelschirmung und die Prozessspannungsleitungen fließenden Strömen bewirkt wird. Diese ungeschirmte Fläche wird einerseits zwischen den Prozesssignalleitungen und der Kabelschirmung und andererseits zwischen den Prozesssignalleitungen und dem Bezugspotential des Elektronikmoduls "aufgespannt". Mit anderen Worten: Durch die verringerte Fläche wird die einkoppelbare Störspannung verringert, der in die Prozesssignalleitungen induzierte Störspannungsanteil, welcher zusammen mit dem Nutzsignal am Elektronikmodul anliegt, wird vermindert.It is advantageous that the unshielded surface is reduced, which passes through the interference magnetic field, this Interference magnetic field of high-frequency via the cable shield and the process voltage lines flowing currents is effected. This unshielded surface is "spanned" on the one hand between the process signal lines and the cable shield and on the other hand between the process signal lines and the reference potential of the electronic module. In other words: Due to the reduced area, the couplable interference voltage is reduced, the interference voltage component induced in the process signal lines, which is applied together with the useful signal at the electronics module, is reduced.

In einer weiteren Ausgestaltung der Erfindung ist die Mehrlagen-Leiterplatte mit Filter- und Dämpfungsmitteln versehen, welche den Anschlusselementen zum Anschluss der Prozessspannungsleitungen nachgeschaltet sind. Dadurch wird das Elektronikmodul mit bereits gefilterten Prozessspannungen beaufschlagt.In a further embodiment of the invention, the multilayer printed circuit board is provided with filtering and damping means, which are connected downstream of the connecting elements for connection of the process voltage lines. As a result, the electronic module is loaded with already filtered process voltages.

Aufgrund der - wie erläutert - geringen Einkoppelfläche können diese Filter- und Dämpfungsmittel für eine höhere Grenzfrequenz ausgelegt sein, wodurch schnellere bzw. höherfrequente Prozesssignale übermittelt bzw. verarbeitet werden können.Due to the - as explained - low coupling surface, these filter and damping means can be designed for a higher cutoff frequency, whereby faster or higher-frequency process signals can be transmitted or processed.

Gemäß den in Anspruch 3 angegebenen Maßnahmen ist die Mehrlagen-Leiterplatte zwischen dem Anschlussblock und den weiteren Anschlusselementen angeordnet, wobei die Anschlusselemente zum Anschluss der Prozessspannungsleitungen mittels der Mehrlagen-Leiterplatte mit den weiteren Anschlusselementen elektrisch verbunden sind und wobei ein über diesen weiteren Anschlüssen angeordneter Schirmbügel mit der Montageschiene kontaktiert. Mittels derartiger Maßnahmen wird die gefilterte Prozessspannung an benachbarte Automatisierungskomponenten weitergeleitet, wobei die Abschirmung aufgrund des Schirmbügels weiter verbessert wird.According to the measures specified in claim 3, the multi-layer printed circuit board between the terminal block and the other connection elements is arranged, wherein the connection elements for connecting the process voltage lines by means of multilayer printed circuit board with the other connection elements are electrically connected and wherein a arranged over these other connections Schirmbügel with contacted the mounting rail. By means of such measures, the filtered process voltage is forwarded to adjacent automation components, wherein the shield is further improved due to the shield bracket.

In einer Ausführungsform der Erfindung ist der Anschlussblock geschirmt, z. B. in Form eines geschirmten Steckverbinders, ausgebildet. Dadurch können schnellere bzw. höherfrequente Prozesssignale, insbesondere in Verbindung mit den Filter-und Dämpfungsmitteln, übermittelt bzw. verarbeitet werden.In one embodiment of the invention, the terminal block is shielded, z. In the form of a shielded connector, educated. As a result, faster or higher-frequency process signals, in particular in connection with the filter and damping means, can be transmitted or processed.

Anhand der Zeichnung, in der ein Ausführungsbeispiel der Erfindung veranschaulicht ist, werden im Folgenden die Erfindung, deren Ausgestaltungen sowie Vorteile näher erläutert.Reference to the drawing, in which an embodiment of the invention is illustrated, the invention, the embodiments and advantages are explained in more detail below.

Es zeigen:

  • Figuren 1 und 2 Bestandteile eines Automatisierungsgerätes.
Show it:
  • Figures 1 and 2 Components of an automation device.

Die in den Figuren dargestellten gleichen Teile sind mit gleichen Bezugszeichen versehen.The same parts shown in the figures are provided with the same reference numerals.

In den Figuren 1 und 2 ist mit 1 eine Mehrlagen-Leiterplatte bezeichnet, die Bestandteil eines Basismoduls einer Automatisierungskomponente eines Automatisierungsgerätes ist. Um die Automatisierungskomponente auf einer an ein Schirmpotential, z. B. einer Funktionserde, angeschlossenen Montageschiene bzw. Hutschiene 2 des Automatisierungsgerätes zu befestigen, weist das Basismodul beispielsweise hier nicht dargestellte Klemmverbindungen auf. Auf der Mehrlagen-Leiterplatte 1 ist ein Anschlussblock 3 mit mehreren Anschlusselementen 4, 5 angeordnet, von denen die Anschlusselemente 4 zum Anschließen von hier nicht dargestellten Prozesssignalleitungen eines Signalkabels und die Anschlusselemente 5 zum Anschließen von ebenfalls hier nicht dargestellten Prozessspannungsleitungen eines Spannungskabels vorgesehen sind. Um ein Einkoppeln von durch die Prozessspannung bewirkten Störungen weitgehend zu vermeiden, sind die Anschlusselemente 5 zum Anschließen der Prozessspannungsleitungen an das äußere Ende des Anschlussblockes 3 gelegt.In the Figures 1 and 2 is denoted by 1 a multilayer printed circuit board, which is part of a base module of an automation component of an automation device. To the automation component on a to a screen potential, z. B. a functional earth to attach mounting rail or DIN rail 2 of the programmable controller, the base module, for example, not shown here clamping connections. On the multi-layer printed circuit board 1, a terminal block 3 with a plurality of connection elements 4, 5 is arranged, of which the connection elements 4 are provided for connecting not shown here process signal lines of a signal cable and the connection elements 5 for connecting also not shown here process voltage lines of a voltage cable. In order to largely avoid coupling in of disturbances caused by the process voltage, the connecting elements 5 for connecting the process voltage lines are connected to the outer end of the terminal block 3.

Die Mehrlagen-Leiterplatte 1 ist ferner mit einem Steckverbinder 6 versehen, welcher zur Aufnahme eines Elektronikmoduls der Automatisierungskomponente vorgesehen ist. Dieses Elektronikmodul kann beispielsweise als analoges oder digitales Ein-/Ausgabemodul, als intelligentes Modul mit CPU-Funktionalität, als Interface-Modul oder als sonstiges Funktions- oder Technologiemodul ausgebildet sein. Die Anschlüsse des Steckverbinders 6 sind zumindest teilweise über entsprechende Leiterbahnen der Mehrlagen-Leiterplatte 1 mit den Anschlusselementen 4, 5 des Anschlussblockes 3 elektrisch verbunden. Die Außenlagen der Mehrlagen-Leiterplatte 1 sind zur Abschirmung ausgebildet, wobei die Außenlagen der Mehrlagen-Leiterplatte 1 über Kontaktfedern 13, 14 mit der an das Schirmpotential angeschlossenen Montageschiene 2 elektrisch verbunden sind. Dadurch, dass die Außenlagen der Mehrlagen-Leiterplatte 1 zur Abschirmung vorgesehen sind, werden die über die Prozesssignalleitungen übermittelten Prozesssignale abgeschirmt. Das bedeutet, dass die Prozesssignale sowohl im Bereich des Anschlussblockes 3 als auch im Bereich des Steckverbinders 6 abgeschirmt werden und die Mehrlagen-Leiterplatte 1 wie ein "verlängerter" Kabelschirm wirkt.
Die Außenlagen der Mehrlagen-Leiterplatte 1 werden mit dem Schirm des Signalkabels bzw. der Prozesssignalleitungen verbunden, indem - wie im Folgenden noch gezeigt wird - diese mit einer Fahne 7 einer Kabelschirmauflage 8 kontaktieren, in welcher die an das Schirmpotential angeschlossene Abschirmung der Prozesssignalleitungen mittels einer Schraubklemme 9 befestigt ist. Diese Prozesssignalleitungen sind zum Anschließen an die Anschlusselemente 4 durch die Kabelschirmauflage 8 hindurchgeführt, was in der Figur 1 mittels eines Pfeils X angedeutet ist. Zum Kontaktieren der Fahne 7 der Kabelschirmauflage 8 mit den Außenlagen der Mehrlagen-Leiterplatte 1 ist eine weitere Kontaktfeder 10 eines Haltebügels 11 vorgesehen, welcher an einer Seite der Mehrlagen-Leiterplatte 1 befestigt ist. Diese Kontaktfeder 10 bildet mit der Seitenwand 12 des Anschlussblockes 3 am äußeren Ende dieses Anschlussblockes 3 eine Ausnehmung zur Aufnahme der Fahne 7 der Kabelschirmauflage 8. Für den Fall, dass die Fahne 7 in die Ausnehmung gesteckt wird - was in Figur 1 mittels eines Pfeils Y angedeutet ist -, kontaktieren die Außenlagen der Mehrlagen-Leiterplatte 1, welche über die Kontaktfedern 13, 14 direkt und mit geringer Impedanz mit der Montageschiene 2 kontaktieren, mit der Schirmung des Signalkabels bzw. der Prozesssignalleitungen, wobei die Kabelschirmauflage 8 die Anschlusselemente 5 überdeckt, an welche die Prozessspannungsleitungen angeschlossen sind. Diese Überdeckung bedeutet, dass die Prozessspannungsleitungen unter der Kabelschirmauflage 8 geführt werden - was in Figur 1 mittels einer Linie Z angedeutet ist -, wodurch die Prozessspannungsleitungen sehr gut von den Prozesssignalleitungen getrennt geführt sind.The multilayer printed circuit board 1 is further provided with a connector 6, which is provided for receiving an electronic module of the automation component. This electronic module can be used, for example, as an analog or digital input / output module, as an intelligent module with CPU functionality, be designed as an interface module or as another functional or technology module. The terminals of the connector 6 are at least partially electrically connected via corresponding tracks of the multilayer printed circuit board 1 with the connection elements 4, 5 of the terminal block 3. The outer layers of the multi-layer printed circuit board 1 are formed for shielding, wherein the outer layers of the multilayer printed circuit board 1 are electrically connected via contact springs 13, 14 with the mounting rail 2 connected to the shield potential. Characterized in that the outer layers of the multilayer printed circuit board 1 are provided for shielding, the transmitted over the process signal lines process signals are shielded. This means that the process signals are shielded both in the area of the terminal block 3 and in the region of the connector 6 and the multilayer printed circuit board 1 acts like an "extended" cable shield.
The outer layers of the multilayer printed circuit board 1 are connected to the screen of the signal cable or the process signal lines by - as will be shown below - contact them with a flag 7 of a cable shield 8, in which the shielding of the process signal lines connected to the shield potential by means of a Screw terminal 9 is attached. These process signal lines are passed through the cable screen support 8 for connection to the connection elements 4, which is described in US Pat FIG. 1 indicated by an arrow X. For contacting the lug 7 of the cable shield 8 with the outer layers of the multilayer printed circuit board 1, a further contact spring 10 of a retaining clip 11 is provided, which is attached to one side of the multilayer printed circuit board 1. This contact spring 10 forms with the side wall 12 of the terminal block 3 at the outer end of this terminal block 3 has a recess for receiving the lug 7 of the cable shield 8. In the event that the flag 7 is inserted into the recess - which in FIG. 1 indicated by an arrow Y - contact the outer layers of the multilayer printed circuit board 1, which contact via the contact springs 13, 14 directly and with low impedance to the mounting rail 2, with the shielding of the signal cable and the process signal lines, wherein the cable screen support 8 covers the connection elements 5, to which the process voltage lines are connected. This overlap means that the process voltage lines are routed under the cable shield 8 - what in FIG. 1 is indicated by a line Z -, whereby the process voltage lines are very well separated from the process signal lines.

Um das Elektronikmodul mit bereits gefilterten Prozessspannungen zu beaufschlagen, weist die Mehrlagen-Leiterplatte 1 auf der dem Anschlussblock 3 gegenüberliegenden Unterseite dieser Mehrlagen-Leiterplatte 1 Filter- und Dämpfungsmittel 15 auf, welche den Anschlusselementen 5 zum Anschluss der Prozessspannungsleitungen nachgeschaltet sind. Auf dieser Unterseite sind ferner weitere Anschlusselemente 16 angeordnet, welche zur Weiterleitung der Prozessspannung zu mindestens einem benachbarten Basismodul vorgesehen sind. Diese weiteren Anschlusselemente 16 sind über Leiterbahnen der Mehrlagen-Leiterplatte 1 mit den Anschlusselementen 5 zum Anschluss der Prozessspannungsleitungen elektrisch verbunden, wobei zur Verbesserung der Abschirmung und zum Schutz der weiteren Anschlusselemente 16 ein Schirmbügel 17 über diesen weiteren Anschlusselementen 16 angeordnet ist, der mit der Montageschiene 2 mittels der Kontaktfeder 13 kontaktiert.In order to pressurize the electronic module with already filtered process voltages, the multilayer printed circuit board 1 on the opposite side of the terminal block 3 of this multilayer printed circuit board 1 filter and damping means 15, which are connected downstream of the connection elements 5 for connecting the process voltage lines. On this underside, further connection elements 16 are further arranged, which are provided for forwarding the process voltage to at least one adjacent base module. These further connection elements 16 are electrically connected via conductor tracks of the multi-layer printed circuit board 1 to the connection elements 5 for connecting the process voltage lines, to improve the shield and to protect the other connection elements 16, a shield bracket 17 is arranged on these other connection elements 16, which is connected to the mounting rail 2 contacted by the contact spring 13.

Claims (5)

  1. Automation component of a modular automation device having a base module and an electronics module which can be plugged onto the said base module, wherein the base module has:
    - means for fastening the base module on a mounting rail (2),
    - connection elements (4, 5, 6) for making contact with process-signal and process-voltage lines and also for making contact with connection elements of the electronics module,
    - further connection elements (16) for forwarding a process voltage to an adjacent base module,
    characterized in that
    - the connection elements (4, 5) for making contact with the process-signal and process-voltage lines are constituent parts of a connection block (3) which is arranged on a multilayer printed circuit board (1), the outer layers of said printed circuit board being provided for screening purposes,
    - the connection elements (5) at the outer end of the connection block (3) are provided for connection of the process-voltage lines,
    - a retaining clip (11), which is provided with a contact spring (10), is fastened to one side of the multilayer printed circuit board (1) in such a way that the contact spring (10) and a side wall (12) of the connection block (3) form a recess for receiving a lug (7) of a cable screen support (8) at the outer end of the connection block (3),
    - further contact springs (13, 14) for making contact with the mounting rail (2) are fastened to the multilayer printed circuit board (1).
  2. Automation component according to Claim 1, characterized in that the multilayer printed circuit board (1) is provided with filter and damping means (15) which are connected behind the connection elements (5) for connection of the process-voltage lines.
  3. Automation component according to Claim 1 or 2, characterized in that the multilayer printed circuit board (1) is arranged between the connection block (3) and the further connection elements (16), wherein the connection elements (5) for connection of the process-voltage lines are electrically connected to the further connection elements (16) by means of the multilayer printed circuit board (1), and wherein a screening clip (17), which is arranged over these further connection elements (16), makes contact with the mounting rail (2).
  4. Automation component according to one of Claims 1 to 3, characterized in that the connection block (3) is designed in a screened manner.
  5. Modular automation device having at least one automation component according to one of Claims 1 to 4, characterized in that the cable screen support (8) covers the connection elements (5) for connection of the process-voltage lines if the lug (7) of the cable screen support (8) is held in the recess.
EP20110188484 2011-11-09 2011-11-09 Automation components of a modular automation device Active EP2592696B1 (en)

Priority Applications (2)

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EP20110188484 EP2592696B1 (en) 2011-11-09 2011-11-09 Automation components of a modular automation device
CN201210444578.7A CN103107427B (en) 2011-11-09 2012-11-08 Automation components of a modular automation device

Applications Claiming Priority (1)

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EP20110188484 EP2592696B1 (en) 2011-11-09 2011-11-09 Automation components of a modular automation device

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DE102014015658A1 (en) * 2014-10-24 2016-04-28 Phoenix Contact Gmbh & Co. Kg electronics assembly
DE102015101133A1 (en) * 2015-01-27 2016-07-28 Euchner Gmbh + Co. Kg Module arrangement with at least one basic module
US9525832B1 (en) * 2015-06-16 2016-12-20 Stmicroelectronics Pte Ltd Image sensor device with an electromagnetic compatibility shield (EMC) and associated methods
CN109571446B (en) * 2017-09-29 2024-11-08 深圳市越疆科技有限公司 Modular automation device

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DE19748530B9 (en) 1997-11-03 2004-09-09 Siemens Ag Modular automation device and assembly of a modular automation device
DE20104606U1 (en) * 2001-03-16 2001-05-31 3M Innovative Properties Co., St. Paul, Minn. Assembly tray for connection modules of insulation displacement technology
EP1583408B1 (en) * 2004-04-02 2008-05-28 Siemens Aktiengesellschaft Locking of exchangeable modules with forced automatic disconnection
DE102007004865B4 (en) * 2007-01-31 2010-07-01 Tyco Electronics Amp Gmbh Rail-based, modular device system of industrial information network technology
EP2256868A1 (en) * 2009-05-27 2010-12-01 Siemens Aktiengesellschaft Automation device with a terminal module
DE202010006065U1 (en) * 2010-04-23 2010-08-05 VIPA Gesellschaft für Visualisierung und Prozeßautomatisierung m.b.H. Sequentially buildable, modular bus for an automation or control system

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EP2592696A1 (en) 2013-05-15
CN103107427A (en) 2013-05-15

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