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EP2466687A1 - Integral transceiver in millimetric waves - Google Patents

Integral transceiver in millimetric waves Download PDF

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Publication number
EP2466687A1
EP2466687A1 EP11193822A EP11193822A EP2466687A1 EP 2466687 A1 EP2466687 A1 EP 2466687A1 EP 11193822 A EP11193822 A EP 11193822A EP 11193822 A EP11193822 A EP 11193822A EP 2466687 A1 EP2466687 A1 EP 2466687A1
Authority
EP
European Patent Office
Prior art keywords
interposer
antenna
upper face
transmitter
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP11193822A
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German (de)
French (fr)
Other versions
EP2466687B1 (en
Inventor
Jean-François Carpentier
Laurent Dussopt
Henri Sibuet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Crolles 2 SAS
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
STMicroelectronics Crolles 2 SAS
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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Publication date
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Publication of EP2466687A1 publication Critical patent/EP2466687A1/en
Application granted granted Critical
Publication of EP2466687B1 publication Critical patent/EP2466687B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H01Q13/18—Resonant slot antennas the slot being backed by, or formed in boundary wall of, a resonant cavity ; Open cavity antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them

Definitions

  • the present invention relates to transceiver systems adapted to operate in millimeter waves and capable of providing and receiving signals from devices arranged at distances greater than one meter, for example of the order of 10 meters.
  • each antenna transmits a signal out of phase with that of the other antennas, or is able to receive a signal out of phase with that of the other antennas.
  • the wavelength in air is 5 mm.
  • the largest dimension of the antennas is commonly of the order of the half wavelength is 2.5 mm and each antenna is separated from neighboring antennas at least a distance of the same order of magnitude.
  • the known devices have often used antennas mounted on individual substrates inserted in a ceramic block, also intended to receive the integrated processing circuit. This causes the system to be relatively complex especially since it is necessary to make minimum the lengths of the tracks between each of the elements to avoid spurious radiation and interference. In addition, some of these systems require the card manufacturer to provide relatively complicated devices for processing the transmitted / received signals.
  • an object of embodiments of the present invention is to provide a system forming a single assembly comprising a transmission-reception circuit and advantageously of processing and amplification of the high frequency signals and an emission antenna array / reception of minimum size.
  • Another object of embodiments of the present invention is to provide such a system particularly adapted to be mounted simply on a printed circuit board.
  • a millimeter wave transmitter / receiver comprising: an interposer plate whose upper face carries an interconnection network and whose lower face is intended to be mounted on an electronic device; at least one integrated circuit chip mounted on the upper face of the interposer; at least one antenna comprising at least one track formed on the upper face of the interposer; and at least one block fixed below the plate and comprising, facing each antenna, a cavity whose bottom is metallized, the distance between each antenna and the bottom being of the order of a quarter of the wavelength, taking into account the dielectric constants of the interposed materials.
  • each of the antennas is wholly or partly surrounded by a peripheral conductive track on the upper face of the interposer, said track being connected to a network of through vias in contact or in quasi-contact with metallization of the block.
  • the interposer is a silicon wafer.
  • the upper face is coated with an encapsulating resin.
  • the bottom and the peripheral conductive tracks are connected to ground.
  • the electronic device is a printed circuit board and the interposer is mounted on the card by balls.
  • the figure 1 is a very schematic sectional view of a transmitter / receiver unit of millimeter waves.
  • This set comprises an integrated circuit chip 1 comprising various circuits for processing and amplifying high frequency signals transmitted / received by antennas.
  • On the lower side of the chip it comprises a set of conductive and insulating layers, not shown, forming interconnection levels for the interconnection of the various components of the chip and the connection of these components to the outside.
  • the chip 1 is mounted on an interposer plate 3.
  • This plate is surmounted by a not shown interconnection network comprising insulating layers, metal tracks on one level or more, and vias.
  • the assembly of the chip 1 on the interposer plate 3 is carried out for example by means of conducting pillars 5, for example made of copper.
  • interposer 3 which is for example a wafer of silicon or glass, are formed isolated vias 8 of which only one is shown, which are connected by the interconnection network to the pads of the chip 1.
  • metallizations 20 actually comprising in practice a set of metallizations, to which are fixed (welded) balls 21.
  • antennas 30 consisting of conductive tracks in any suitable antenna configuration for transmitting and / or receiving millimeter waves. Although only one antenna appears in the sectional view of the figure 1 it will be understood that there are a number of transmitting antennas and a number of receiving antennas which are connected by metallization levels, not shown, to appropriate terminals of the chip 1 so that, in operation, each of these antennas is excited with a certain phase shift with respect to the other antennas.
  • An antenna 30 emits, when excited, high frequency radiation, both upwardly and downwardly. To enhance the performance of the antenna and avoid parasitic radiation, it is necessary to return upward the beam that this antenna sends down.
  • this distance ⁇ / 4 must be calculated taking into account that the space between the antenna and the reflector comprises the thickness of the interposer plate, of dielectric constant of the order of 12 if this interposer is silicon, and an air space of dielectric constant equal to 1, and possibly a small thickness of insulation between the antenna and the interposer.
  • the thickness of the interposer plate is accurately known and the height of the recess in the block 32 is also accurately determined.
  • the height of the recess will be 400 microns for a frequency of 60 GHz, which leads to a bandwidth of operation of the order 13 GHz.
  • the figure 2 is a sectional view of a part of the assembly described here comprising, on the upper side of the interposer plate 3, antennas 30. There is shown a portion of a block 32 comprising a plurality of recesses.
  • This block 32 is advantageously made of silicon and can be manufactured and fixed by any known means to the lower face of the interposer. In particular we can use technologies developed in the field of manufacturing and assembly of MEMS (Micro-Electro-Mechanical-System).
  • the upper face of the block 32 in contact with the interposer 3 is also coated with a metal layer 40 and the periphery of each region
  • the surrounding track 42 is connected by a network of vias 44 to the lower layer 40 (these vias are effectively in contact with the layer 40 or are separated from them by a small distance in front of the layer 40).
  • the wavelength of the antenna radiation - we will talk about quasi-contact).
  • the downward radiation of the antenna 30 is reflected on the reflector 38 but can not diverge to create parasitic waves, especially in the interposer, because of the tight network of vias surrounding the area separating the antenna of its reflector and forms a Faraday cage.
  • any influence of an antenna 30 on the neighboring antennas and / or on the integrated circuit chip 1 is avoided.
  • figure 2 a double network of tracks and vias.
  • a single surrounding line 42 and a single vias network 44 could also be used.
  • the figure 3 is a top view of an antenna 30 surrounded by a track 42 connected by vias regularly distributed 44 to the upper face metallization of the block 32.
  • the surrounding track and the metallizations 36, 38, 40 are connected to the mass.
  • the balls 21 represented in figure 1 can be fixed to the interposer 3 after placing the block or blocks 32.
  • the block or blocks 32 will have a thickness less than the diameter of the balls so that, when the system is disposed on a printed circuit board, there is have no contact between these blocks and the printed circuit board.
  • the chip 1, the interposer plate 3 and the balls 21 form an assembly ready to be delivered by a manufacturer to a system erector who mounts the assembly mentioned above on another electronic device, for example a printed circuit board. on which are formed metallizations adapted to receive the balls 21.
  • the upper face of this assembly is preferably encapsulated in an insulating body, for example resin, for the protection of the product and possibly its marking.
  • the connections between the chip and the antennas may have minimum and well-defined lengths.
  • the figure 4 is an overhead overview of the system. It distinguishes in the central part, the integrated circuit 1 and the connection pads of this circuit to be connected to vias through 8 mentioned above.
  • Antennas 30, 16 in the example shown, are arranged on either side of the integrated circuit 1. As indicated, each of these antennas is surrounded by a conductive track 42 periodically connected by vias 44 to a corresponding conductive track formed under the interposer 3.
  • a block 32 may be provided in each of the sets of antennas or a single block under the entire interposer plate.
  • the present invention is capable of various variants that will occur to those skilled in the art, in particular as regards the shape of the antennas.
  • the various metallization levels formed on the interposer have not been described in detail, and in particular the metallizations intended to connect the integrated circuit to each of the antennas. Indeed, these are current provisions. The important thing is that all these metallizations are arranged on the same face of an interposer and can therefore have a minimum dimension.

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Abstract

The transceiver has an interposer plate (3) i.e. silicon plate, whose upper face bears a network of interconnections and lower face mounted on an electronic device. An integrated circuit chip (1) is mounted on the upper face of the plate. An antenna (30) includes a track formed on the upper face of the plate. A block (32) is fixed under the plate, and includes a recess (34) next to the antenna. A bottom part of the recess is metalized. Distance between the antenna and the bottom part is in the order of one-fourth value of wavelength by considering dielectric constants of interposed materials.

Description

Domaine de l'inventionField of the invention

La présente invention concerne des systèmes émetteurs-récepteurs adaptés à fonctionner en ondes millimétriques et aptes à fournir et recevoir des signaux de dispositifs disposés à des distances supérieures au mètre, par exemple de l'ordre de 10 mètres.The present invention relates to transceiver systems adapted to operate in millimeter waves and capable of providing and receiving signals from devices arranged at distances greater than one meter, for example of the order of 10 meters.

Exposé de l'art antérieurPresentation of the prior art

Dans un système fonctionnant en ondes millimétriques, par exemple à une fréquence de l'ordre de 60 GHz, les puissances disponibles sont telles qu'il faut prévoir des réseaux d'antennes fournissant des faisceaux directifs, souvent appelés réseaux phasés. Dans de tels réseaux, chaque antenne émet un signal déphasé par rapport à celui des autres antennes, ou est apte à recevoir un signal déphasé par rapport celui des autres antennes.In a system operating on millimeter waves, for example at a frequency of the order of 60 GHz, the available powers are such that it is necessary to provide antenna networks providing directional beams, often called phased networks. In such networks, each antenna transmits a signal out of phase with that of the other antennas, or is able to receive a signal out of phase with that of the other antennas.

A 60 GHz, la longueur d'onde dans l'air est de 5 mm. La plus grande dimension des antennes est couramment de l'ordre de la demi longueur d'onde soit 2,5 mm et chaque antenne est séparée des antennes voisines d'une distance au moins du même ordre de grandeur.At 60 GHz, the wavelength in air is 5 mm. The largest dimension of the antennas is commonly of the order of the half wavelength is 2.5 mm and each antenna is separated from neighboring antennas at least a distance of the same order of magnitude.

En conséquence, il est en pratique impossible de disposer le réseau d'antennes sur la puce de circuit intégré qui contient les circuits électroniques propres à fournir, recevoir, traiter et amplifier les signaux haute fréquence des antennes. En effet, cela conduirait à des dimensions de puce prohibitives.Consequently, it is in practice impossible to have the antenna array on the integrated circuit chip which contains the proper electronic circuits to supply, receive, process and amplify the high frequency signals of the antennas. Indeed, it would lead to prohibitive chip dimensions.

Les dispositifs connus ont souvent utilisé des antennes montées sur des substrats individuels insérés dans un bloc de céramique, également destiné à recevoir le circuit intégré de traitement. Ceci amène le système à être relativement complexe d'autant plus qu'il faut rendre minimum les longueurs des pistes entre chacun des éléments pour éviter les rayonnements parasites et les interférences. Par ailleurs, certains de ces systèmes obligent le fabricant de carte à prévoir des dispositifs relativement compliqués pour retraiter les signaux émis/reçus.The known devices have often used antennas mounted on individual substrates inserted in a ceramic block, also intended to receive the integrated processing circuit. This causes the system to be relatively complex especially since it is necessary to make minimum the lengths of the tracks between each of the elements to avoid spurious radiation and interference. In addition, some of these systems require the card manufacturer to provide relatively complicated devices for processing the transmitted / received signals.

Résumésummary

Ainsi, un objet de modes de réalisation de la présente invention est de prévoir un système formant un ensemble unique comprenant un circuit d'émission-réception et avantageusement de traitement et d'amplification des signaux haute fréquence et un réseau d'antennes d'émission/réception d'encombrement minimum.Thus, an object of embodiments of the present invention is to provide a system forming a single assembly comprising a transmission-reception circuit and advantageously of processing and amplification of the high frequency signals and an emission antenna array / reception of minimum size.

Un autre objet de modes de réalisation de la présente invention est de prévoir un tel système particulièrement adapté à être monté simplement sur une carte de circuit imprimé.Another object of embodiments of the present invention is to provide such a system particularly adapted to be mounted simply on a printed circuit board.

Selon un aspect de la présente invention il est prévu un émetteur/récepteur à ondes millimétriques comprenant : une plaque formant interposeur dont la face supérieure porte un réseau d'interconnexions et dont la face inférieure est destinée à être montée sur un dispositif électronique ; au moins une puce de circuit intégré montée sur la face supérieure de l'interposeur ; au moins une antenne comprenant au moins une piste formée sur la face supérieure de l'interposeur ; et au moins un bloc fixé sous la plaque et comprenant en regard de chaque antenne une cavité dont le fond est métallisé, la distance entre chaque antenne et le fond étant de l'ordre du quart de la longueur d'onde, en tenant compte des constantes diélectriques des matériaux interposés.According to one aspect of the present invention there is provided a millimeter wave transmitter / receiver comprising: an interposer plate whose upper face carries an interconnection network and whose lower face is intended to be mounted on an electronic device; at least one integrated circuit chip mounted on the upper face of the interposer; at least one antenna comprising at least one track formed on the upper face of the interposer; and at least one block fixed below the plate and comprising, facing each antenna, a cavity whose bottom is metallized, the distance between each antenna and the bottom being of the order of a quarter of the wavelength, taking into account the dielectric constants of the interposed materials.

Selon un mode de réalisation de la présente invention, chacune des antennes est tout ou partie entourée d'une piste conductrice périphérique sur la face supérieure de l'interposeur, ladite piste étant reliée à un réseau de vias traversants en contact ou en quasi-contact avec une métallisation du bloc.According to one embodiment of the present invention, each of the antennas is wholly or partly surrounded by a peripheral conductive track on the upper face of the interposer, said track being connected to a network of through vias in contact or in quasi-contact with metallization of the block.

Selon un mode de réalisation de la présente invention, l'interposeur est une plaque de silicium.According to one embodiment of the present invention, the interposer is a silicon wafer.

Selon un mode de réalisation de la présente invention, la face supérieure est revêtue d'une résine d'encapsulation.According to one embodiment of the present invention, the upper face is coated with an encapsulating resin.

Selon un mode de réalisation de la présente invention, le fond et les pistes conductrices périphériques sont reliés à la masse.According to one embodiment of the present invention, the bottom and the peripheral conductive tracks are connected to ground.

Selon un mode de réalisation de la présente invention, le dispositif électronique est une carte de circuit imprimé et l'interposeur est monté sur la carte par des billes.According to one embodiment of the present invention, the electronic device is a printed circuit board and the interposer is mounted on the card by balls.

Brève description des dessinsBrief description of the drawings

Ces objets, caractéristiques et avantages, ainsi que d'autres seront exposés en détail dans la description suivante de modes de réalisation particuliers faite à titre non-limitatif en relation avec les figures jointes parmi lesquelles :

  • la figure 1 est une vue en coupe simplifiée d'une partie d'un système émetteur/récepteur intégré ;
  • la figure 2 est une vue en coupe simplifiée d'une partie d'antennes du système émetteur/récepteur de la figure 1 ;
  • la figure 3 est une vue de dessus d'un élément d'antenne ; et
  • la figure 4 est une vue de dessus de l'ensemble d'un système émetteur/récepteur.
These and other objects, features, and advantages will be set forth in detail in the following description of particular embodiments in a non-limitative manner with reference to the accompanying figures in which:
  • the figure 1 is a simplified sectional view of a portion of an integrated transceiver system;
  • the figure 2 is a simplified sectional view of an antenna part of the transmitter / receiver system of the figure 1 ;
  • the figure 3 is a top view of an antenna element; and
  • the figure 4 is a top view of the entire transceiver system.

Par souci de clarté, de mêmes éléments ont été désignés par de mêmes références dans les différentes figures et, de plus, comme cela est habituel dans la représentation des circuits intégrés, les diverses figures ne sont pas tracées à l'échelle.For the sake of clarity, the same elements have been designated by the same references in the various figures and, moreover, as is customary in the representation of the integrated circuits, the various figures are not drawn to scale.

Description détailléedetailed description

La figure 1 est une vue en coupe très schématique d'un ensemble émetteur/récepteur d'ondes millimétriques. Cet ensemble comprend une puce de circuit intégré 1 comprenant divers circuits de traitement et d'amplification de signaux haute fréquence émis/reçus par des antennes. Du côté inférieur de la puce celle-ci comprend un ensemble de couches conductrices et isolantes, non représentées, formant des niveaux d'interconnexion destinés à l'interconnexion des divers composants de la puce et à la connexion de ces composants vers l'extérieur.The figure 1 is a very schematic sectional view of a transmitter / receiver unit of millimeter waves. This set comprises an integrated circuit chip 1 comprising various circuits for processing and amplifying high frequency signals transmitted / received by antennas. On the lower side of the chip it comprises a set of conductive and insulating layers, not shown, forming interconnection levels for the interconnection of the various components of the chip and the connection of these components to the outside.

La puce 1 est montée sur une plaque d'interposeur 3. Cette plaque est surmontée d'un réseau d'interconnexions non représenté comprenant des couches isolantes, des pistes métalliques sur un niveau ou plus, et des vias. Le montage de la puce 1 sur la plaque d'interposeur 3 est effectué par exemple par l'intermédiaire de piliers conducteurs 5, par exemple en cuivre.The chip 1 is mounted on an interposer plate 3. This plate is surmounted by a not shown interconnection network comprising insulating layers, metal tracks on one level or more, and vias. The assembly of the chip 1 on the interposer plate 3 is carried out for example by means of conducting pillars 5, for example made of copper.

Dans l'interposeur 3, qui est par exemple une plaquette de silicium ou de verre, sont formés des vias traversants isolés 8 dont un seul est représenté, qui sont reliés par le réseau d'interconnexions à des plots de la puce 1. Du côté inférieur de la plaque d'interposeur sont formées des métallisations 20 comprenant en fait en pratique un ensemble de métallisations, auxquelles sont fixées (soudées) des billes 21.In the interposer 3, which is for example a wafer of silicon or glass, are formed isolated vias 8 of which only one is shown, which are connected by the interconnection network to the pads of the chip 1. On the side lower part of the interposer plate are formed metallizations 20 actually comprising in practice a set of metallizations, to which are fixed (welded) balls 21.

Sur la face supérieure de la plaque d'interposeur 3, sont disposées des antennes 30 constituées de pistes conductrices selon toute configuration d'antenne convenable pour l'émission et/ou la réception d'ondes millimétriques. Bien qu'une seule antenne apparaisse dans la vue en coupe de la figure 1, on comprendra qu'il y a un certain nombre d'antennes émettrices et un certain nombre d'antennes réceptrices qui sont connectées par des niveaux de métallisation, non représentés, à des bornes appropriées de la puce 1 de façon que, en fonctionnement, chacune de ces antennes soit excitée avec un certain décalage de phase par rapport aux autres antennes.On the upper face of the interposer plate 3 are arranged antennas 30 consisting of conductive tracks in any suitable antenna configuration for transmitting and / or receiving millimeter waves. Although only one antenna appears in the sectional view of the figure 1 it will be understood that there are a number of transmitting antennas and a number of receiving antennas which are connected by metallization levels, not shown, to appropriate terminals of the chip 1 so that, in operation, each of these antennas is excited with a certain phase shift with respect to the other antennas.

Une antenne 30 émet, quand elle est excitée, un rayonnement haute fréquence, aussi bien vers le haut que vers le bas. Pour renforcer le rendement de l'antenne et éviter les rayonnements parasites, il convient de renvoyer vers le haut le faisceau que cette antenne envoie vers le bas. Pour cela, on prévoit de disposer sous des ensembles d'antennes un bloc 32 comprenant, en regard de chaque antenne 30, un évidement 34 revêtu d'une métallisation 36 dont le fond 38 constitue un réflecteur. Ce réflecteur doit être disposé à une distance verticale de l'ordre de λ/4 de l'antenne, λ étant la longueur d'onde du rayonnement. Bien entendu, cette distance λ/4 doit être calculée en tenant compte du fait que l'espace entre l'antenne et le réflecteur comprend l'épaisseur de la plaque d'interposeur, de constante diélectrique de l'ordre de 12 si cet interposeur est en silicium, et un espace d'air de constante diélectrique égale à 1, ainsi qu'éventuellement une faible épaisseur d'isolant entre l'antenne et l'interposeur. L'épaisseur de la plaque d'interposeur est connue avec précision et la hauteur de l'évidement dans le bloc 32 est également déterminée avec précision.An antenna 30 emits, when excited, high frequency radiation, both upwardly and downwardly. To enhance the performance of the antenna and avoid parasitic radiation, it is necessary to return upward the beam that this antenna sends down. For this purpose, provision is made under sets of antennas block 32 comprising, facing each antenna 30, a recess 34 coated with a metallization 36, the bottom 38 is a reflector. This reflector must be arranged at a vertical distance of the order of λ / 4 of the antenna, λ being the wavelength of the radiation. Of course, this distance λ / 4 must be calculated taking into account that the space between the antenna and the reflector comprises the thickness of the interposer plate, of dielectric constant of the order of 12 if this interposer is silicon, and an air space of dielectric constant equal to 1, and possibly a small thickness of insulation between the antenna and the interposer. The thickness of the interposer plate is accurately known and the height of the recess in the block 32 is also accurately determined.

A titre d'exemple numérique, pour un interposeur en silicium d'une épaisseur de 120 µm, la hauteur de l'évidement sera de 400 µm pour une fréquence de 60 GHz, ce qui conduit à une bande passante de fonctionnement de l'ordre de 13 GHz.As a numerical example, for a silicon interposer of a thickness of 120 microns, the height of the recess will be 400 microns for a frequency of 60 GHz, which leads to a bandwidth of operation of the order 13 GHz.

La figure 2 est une vue en coupe d'une partie de l'ensemble décrit ici comprenant, du côté supérieur de la plaque d'interposeur 3, des antennes 30. On a représenté une partie d'un bloc 32 comprenant plusieurs évidements. Ce bloc 32 est avantageusement en silicium et peut être fabriqué et fixé par tous moyens connus à la face inférieure de l'interposeur. Notamment on pourra utiliser des technologies développées dans le domaine de la fabrication et du montage des MEMS (Micro-Electro-Mechanical-System). De préférence, la face supérieure du bloc 32 en contact avec l'interposeur 3 est également revêtue d'une couche métallique 40 et la périphérie de chaque région d'antenne est entourée d'une piste conductrice 42. La piste entourante 42 est reliée par un réseau de vias 44 à la couche inférieure 40 (ces vias sont effectivement en contact avec la couche 40 ou en sont séparés d'une distance petite devant la longueur d'onde du rayonnement de l'antenne - on parlera de quasi-contact). Ainsi, le rayonnement vers le bas de l'antenne 30 vient se réfléchir sur le réflecteur 38 mais ne peut diverger pour créer des ondes parasites, notamment dans l'interposeur, en raison du réseau serré de vias qui entoure la zone séparant l'antenne de son réflecteur et forme une cage de Faraday. Ainsi, on évite toute influence d'une antenne 30 sur les antennes voisines et/ou sur la puce de circuit intégré 1. On a représenté en figure 2 un double réseau de pistes et de vias. Une simple ligne entourante 42 et un unique réseau de vias 44 pourraient également être utilisés.The figure 2 is a sectional view of a part of the assembly described here comprising, on the upper side of the interposer plate 3, antennas 30. There is shown a portion of a block 32 comprising a plurality of recesses. This block 32 is advantageously made of silicon and can be manufactured and fixed by any known means to the lower face of the interposer. In particular we can use technologies developed in the field of manufacturing and assembly of MEMS (Micro-Electro-Mechanical-System). Preferably, the upper face of the block 32 in contact with the interposer 3 is also coated with a metal layer 40 and the periphery of each region The surrounding track 42 is connected by a network of vias 44 to the lower layer 40 (these vias are effectively in contact with the layer 40 or are separated from them by a small distance in front of the layer 40). the wavelength of the antenna radiation - we will talk about quasi-contact). Thus, the downward radiation of the antenna 30 is reflected on the reflector 38 but can not diverge to create parasitic waves, especially in the interposer, because of the tight network of vias surrounding the area separating the antenna of its reflector and forms a Faraday cage. Thus, any influence of an antenna 30 on the neighboring antennas and / or on the integrated circuit chip 1 is avoided. figure 2 a double network of tracks and vias. A single surrounding line 42 and a single vias network 44 could also be used.

La figure 3 est une vue de dessus d'une antenne 30 entourée d'une piste 42 reliée par des vias régulièrement répartis 44 à la métallisation de face supérieure du bloc 32. De préférence, la piste entourante et les métallisations 36, 38, 40 sont reliées à la masse. Les billes 21 représentées en figure 1 peuvent être fixées à l'interposeur 3 après mise en place du ou des blocs 32. Le ou les blocs 32 auront une épaisseur inférieure au diamètre des billes pour que, quand le système est disposé sur une carte de circuit imprimé, il n'y ait pas contact entre ces blocs et la carte de circuit imprimé.The figure 3 is a top view of an antenna 30 surrounded by a track 42 connected by vias regularly distributed 44 to the upper face metallization of the block 32. Preferably, the surrounding track and the metallizations 36, 38, 40 are connected to the mass. The balls 21 represented in figure 1 can be fixed to the interposer 3 after placing the block or blocks 32. The block or blocks 32 will have a thickness less than the diameter of the balls so that, when the system is disposed on a printed circuit board, there is have no contact between these blocks and the printed circuit board.

Ainsi, la puce 1, la plaque d'interposeur 3 et les billes 21 forment un ensemble prêt à être livré par un fabricant à un monteur de système qui monte l'ensemble susmentionné sur un autre dispositif électronique, par exemple une carte de circuit imprimé sur laquelle sont formées des métallisations adaptées à recevoir les billes 21. La face supérieure de cet ensemble est de préférence encapsulée dans un corps isolant, par exemple en résine, pour la protection du produit et éventuellement son marquage.Thus, the chip 1, the interposer plate 3 and the balls 21 form an assembly ready to be delivered by a manufacturer to a system erector who mounts the assembly mentioned above on another electronic device, for example a printed circuit board. on which are formed metallizations adapted to receive the balls 21. The upper face of this assembly is preferably encapsulated in an insulating body, for example resin, for the protection of the product and possibly its marking.

Selon un avantage du système décrit ci-dessus, les connexions entre la puce et les antennes peuvent avoir des longueurs minimales et bien déterminées.According to an advantage of the system described above, the connections between the chip and the antennas may have minimum and well-defined lengths.

La figure 4 est une vue d'ensemble de dessus du système. On y distingue, dans la partie centrale, le circuit intégré 1 et des plots de connexion de ce circuit destinés à être reliés aux vias traversants 8 susmentionnés. Des antennes 30, au nombre de 16 dans l'exemple représenté, sont disposées de part et d'autre du circuit intégré 1. Comme cela a été indiqué, chacune de ces antennes est entourée d'une piste conductrice 42 périodiquement reliée par des vias 44 à une piste conductrice correspondante formée sous l'interposeur 3. On pourra prévoir un bloc 32 sous chacun des ensembles d'antennes ou un bloc unique sous toute la plaque d'interposeur.The figure 4 is an overhead overview of the system. It distinguishes in the central part, the integrated circuit 1 and the connection pads of this circuit to be connected to vias through 8 mentioned above. Antennas 30, 16 in the example shown, are arranged on either side of the integrated circuit 1. As indicated, each of these antennas is surrounded by a conductive track 42 periodically connected by vias 44 to a corresponding conductive track formed under the interposer 3. A block 32 may be provided in each of the sets of antennas or a single block under the entire interposer plate.

Cette vue de dessus montre bien que chacune des antennes est isolée des voisines et de l'environnement par le réseau de vias.This view from above shows that each of the antennas is isolated from neighbors and the environment by the network of vias.

Bien entendu, la présente invention est susceptible de diverses variantes qui apparaîtront à l'homme de l'art, notamment en ce qui concerne la forme des antennes. En outre, on n'a pas décrit en détail les divers niveaux de métallisation formés sur l'interposeur, et notamment les métallisations destinées à connecter le circuit intégré à chacune des antennes. En effet, il s'agit là de dispositions courantes. L'important est que toutes ces métallisations sont disposées sur une même face d'un interposeur et peuvent donc avoir une dimension minimale.Of course, the present invention is capable of various variants that will occur to those skilled in the art, in particular as regards the shape of the antennas. In addition, the various metallization levels formed on the interposer have not been described in detail, and in particular the metallizations intended to connect the integrated circuit to each of the antennas. Indeed, these are current provisions. The important thing is that all these metallizations are arranged on the same face of an interposer and can therefore have a minimum dimension.

Claims (6)

Emetteur/récepteur à ondes millimétriques comprenant : une plaque formant interposeur (3) dont la face supérieure porte un réseau d'interconnexions et dont la face inférieure est destinée à être montée sur un dispositif électronique ; au moins une puce de circuit intégré (1) montée sur la face supérieure de l'interposeur ; au moins une antenne (30) comprenant au moins une piste formée sur la face supérieure de l'interposeur ; et au moins un bloc (32) fixé sous la plaque et comprenant en regard de chaque antenne une cavité (34) dont le fond (38) est métallisé, la distance entre chaque antenne et le fond étant de l'ordre du quart de la longueur d'onde (λ/4), en tenant compte des constantes diélectriques des matériaux interposés. A millimeter wave transmitter / receiver comprising: an interposer plate (3) whose upper face carries an interconnection network and whose lower face is intended to be mounted on an electronic device; at least one integrated circuit chip (1) mounted on the upper face of the interposer; at least one antenna (30) comprising at least one track formed on the upper face of the interposer; and at least one block (32) fixed under the plate and comprising facing each antenna a cavity (34) whose bottom (38) is metallized, the distance between each antenna and the bottom being of the order of a quarter of the length wavelength (λ / 4), taking into account the dielectric constants of the interposed materials. Emetteur/récepteur selon la revendication 1, dans lequel chacune des antennes (30) est tout ou partie entourée d'une piste conductrice périphérique (42) sur la face supérieure de l'interposeur, ladite piste étant reliée à un réseau de vias traversants (44) en contact ou en quasi-contact avec une métallisation (40) du bloc (32).Transmitter / receiver according to claim 1, wherein each of the antennas (30) is wholly or partly surrounded by a peripheral conductive track (42) on the upper face of the interposer, said track being connected to a network of through vias ( 44) in contact or in quasi-contact with a metallization (40) of the block (32). Emetteur/récepteur selon la revendication 1 ou 2, dans lequel l'interposeur est une plaque de silicium.Transmitter / receiver according to claim 1 or 2, wherein the interposer is a silicon wafer. Emetteur/récepteur selon l'une quelconque des revendications 1 à 3, dont la face supérieure est revêtue d'une résine d'encapsulation.Transmitter / receiver according to any one of claims 1 to 3, whose upper face is coated with an encapsulating resin. Emetteur/récepteur selon l'une quelconque des revendications 2 à 4, dans lequel le fond et les pistes conductrices périphériques sont reliés à la masse.Transmitter / receiver according to any one of claims 2 to 4, wherein the bottom and the peripheral conductive tracks are connected to ground. Emetteur/récepteur selon l'une quelconque des revendications 1 à 5, dans lequel le dispositif électronique est une carte de circuit imprimé et dans lequel l'interposeur est monté sur la carte par des billes.Transmitter / receiver according to any one of claims 1 to 5, wherein the electronic device is a printed circuit board and wherein the interposer is mounted on the card by balls.
EP11193822.1A 2010-12-20 2011-12-15 Integral transceiver in millimetric waves Not-in-force EP2466687B1 (en)

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FR1060849A FR2969397B1 (en) 2010-12-20 2010-12-20 INTEGRATED EMITTER-RECEIVER IN MILLIMETER WAVES

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US20130027274A1 (en) 2013-01-31
EP2466687B1 (en) 2015-11-25
FR2969397B1 (en) 2013-09-06
US9070982B2 (en) 2015-06-30
FR2969397A1 (en) 2012-06-22

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