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EP2444254A1 - Aluminum alloy strip for electrochemical roughening and method for producing same - Google Patents

Aluminum alloy strip for electrochemical roughening and method for producing same Download PDF

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Publication number
EP2444254A1
EP2444254A1 EP10188553A EP10188553A EP2444254A1 EP 2444254 A1 EP2444254 A1 EP 2444254A1 EP 10188553 A EP10188553 A EP 10188553A EP 10188553 A EP10188553 A EP 10188553A EP 2444254 A1 EP2444254 A1 EP 2444254A1
Authority
EP
European Patent Office
Prior art keywords
lithoband
pickling
litho
strip
printing plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP10188553A
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German (de)
French (fr)
Other versions
EP2444254B1 (en
Inventor
Bernhard Kernig
Christoph Settele
Olaf Güssgen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speira GmbH
Original Assignee
Hydro Aluminium Rolled Products GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=43827713&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP2444254(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hydro Aluminium Rolled Products GmbH filed Critical Hydro Aluminium Rolled Products GmbH
Priority to EP10188553.1A priority Critical patent/EP2444254B1/en
Priority to ES10188553T priority patent/ES2430641T3/en
Priority to KR1020137013127A priority patent/KR101534293B1/en
Priority to PCT/EP2011/067896 priority patent/WO2012052353A1/en
Priority to CN201180050866.8A priority patent/CN103228457B/en
Priority to JP2013534262A priority patent/JP5507765B2/en
Priority to RU2013123356/12A priority patent/RU2537835C2/en
Priority to BR112013009510A priority patent/BR112013009510B8/en
Publication of EP2444254A1 publication Critical patent/EP2444254A1/en
Priority to US13/866,639 priority patent/US20130263749A1/en
Publication of EP2444254B1 publication Critical patent/EP2444254B1/en
Application granted granted Critical
Priority to US15/466,671 priority patent/US20170190204A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41NPRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N3/00Preparing for use and conserving printing surfaces
    • B41N3/03Chemical or electrical pretreatment
    • B41N3/034Chemical or electrical pretreatment characterised by the electrochemical treatment of the aluminum support, e.g. anodisation, electro-graining; Sealing of the anodised layer; Treatment of the anodic layer with inorganic compounds; Colouring of the anodic layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41NPRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N3/00Preparing for use and conserving printing surfaces
    • B41N3/03Chemical or electrical pretreatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41NPRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00Printing plates or foils; Materials therefor
    • B41N1/04Printing plates or foils; Materials therefor metallic
    • B41N1/08Printing plates or foils; Materials therefor metallic for lithographic printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41NPRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00Printing plates or foils; Materials therefor
    • B41N1/04Printing plates or foils; Materials therefor metallic
    • B41N1/08Printing plates or foils; Materials therefor metallic for lithographic printing
    • B41N1/083Printing plates or foils; Materials therefor metallic for lithographic printing made of aluminium or aluminium alloys or having such surface layers
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/14Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
    • C23G1/22Light metals
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12993Surface feature [e.g., rough, mirror]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]

Definitions

  • the invention relates to a litho strip for electrochemical roughening, consisting of a rolled aluminum alloy. Furthermore, the invention also relates to a method for producing such a lithoband, in which a litho strip consisting of an aluminum alloy is cold rolled and in which the litho strip is subjected after the last cold rolling pass to a degreasing treatment with simultaneous pickling step with an aqueous pickling medium, wherein the aqueous pickling medium is at least 1 , 5 to 3 wt .-% of a mixture of 5-40% sodium tripolyphosphate, 3-10% sodium gluconate, 3-8% nonionic and anionic surfactants and optionally 0.5 to 70% soda and the sodium hydroxide concentration in aqueous Pickling medium between 0.1 wt .-% and 5 wt .-% is. Finally, the invention also relates to a pressure plate carrier and its advantageous use.
  • Lithographic tapes are usually subjected to an electrochemical roughening step, which should result in a nationwide roughening and a structureless appearance.
  • the roughened structure is important for applying a photosensitive layer to the printing plate supports made of the litho ribbons. To be able to produce evenly roughened surfaces is therefore a particularly flat surface of the litho ribbons required.
  • the topography of the lithoband surface is essentially an impression of the roll topography of the last cold roll pass. Elevations and depressions in the roll surface lead to grooves or webs in the lithoband surface, which can be partially preserved in the further production steps for the production of printing plate support.
  • the quality of the lithoband surface and thus the printing plate support is thus determined by the quality of the roll surface and thus on the one hand by the grinding practice in the surface treatment of the rollers and on the other hand by the ongoing wear of the rollers.
  • a measure for determining the surface quality of the lithographic strip is the mean roughness R a in accordance with DIN EN ISO 4287 and DIN EN ISO 4288.
  • R a the mean roughness value in accordance with DIN EN ISO 4287 and DIN EN ISO 4288.
  • the litho ribbons are pickled after rolling to remove interfering oxide islands on the surface of the bands and thereby to improve the subsequent electrochemical roughening.
  • the surface quality of the printing plate supports can be fundamentally improved in this way, the problem of the abovementioned printing errors still persists.
  • the present invention based on the object to provide a litho strip and a method for its production, with which the aforementioned disadvantages of the prior art can be avoided or at least reduced.
  • This object is achieved according to the invention in a generic lithographic strip in that the strip surface has a topography whose maximum peak height Rp and / or Sp is at most 1.4 ⁇ m, preferably at most 1.2 ⁇ m, in particular at most 1.0 ⁇ m.
  • the topography of a band surface is understood to mean its deviation from an ideal level. It can be described by a function Z (x, y) which assigns to each point of the band surface (x, y) the local deviation from the mean height of the surface.
  • F is the size of the integration area. Local surveys correspond to positive values and local reductions correspond to negative values of Z (x, y).
  • Z (x) is a profile of the surface, ie a one-dimensional section through the function Z (x, y).
  • L is the length of the integration interval.
  • one-dimensional profiles Z (x) are measured by linear scanning in various places on the surface and the corresponding values R a and R q are determined.
  • S a and Sq result from a two-dimensional measurement of the surface, ie the topography Z (x, y).
  • the presence of individual high rolling webs is only insufficiently detected by the characteristic value R a or S a used to characterize the lithoband surface.
  • the probability of high rolling webs and thus the occurrence of said printing errors can be reduced by optimizing the lithoband or the method for its production with respect to another roughness characteristic value which has hitherto been ignored.
  • the maximum peak height Rp and / or Sp to a maximum of 1.4 .mu.m, preferably a maximum of 1.2 .mu.m, in particular a maximum of 1.0 .mu.m, litho tapes can be made available which meets today's high demands on the surface quality, for example Use of CtP technology, suffice.
  • profiles Z (x) over a length of, for example, 4.8 mm in each case can be measured at three points of the lithoband transversely to the rolling direction in order to determine a value for Rp.
  • R p Max Z x .
  • the max (Z) function returns the maximum value of Z (x).
  • the area to be measured can in practice be square, for example, and have an edge length of 800 ⁇ m.
  • a profile Z (x) in the middle and on the sides of the lithoband is preferably measured.
  • the strip surface has a topography whose reduced peak height R pk and / or S pk is at most 0.4 ⁇ m, preferably at most 0.37 ⁇ m. It has been found that the quality of the strip surface can be further improved with regard to freedom from printing defects by additional control of the reduced peak height R pk and / or S pk .
  • the reduced peak height R pk is determined according to DIN EN ISO 13 565.
  • the reduced peak height S pk is also determined according to DIN EN ISO 13 565 by an area measurement.
  • the profiles Z (x) and the topography Z (x, y) can be measured as previously described for Rp or Sp, respectively.
  • the thickness of the lithoband is 0.5 mm to 0.1 mm. It has been found that just conventional litho tapes with small thicknesses can have high rolling webs. Therefore, the surface quality of thin lithographic ribbons can be particularly improved by restricting the maximum peak height Rp and / or Sp and the reduced peak height R pk and / or S pk , respectively.
  • the lithoband consists of an AA1050, AA1100, AA3103 or AlMg0.5 alloy.
  • the lithoband has the following alloy compositions in% by weight: 0.3% ⁇ Fe ⁇ 1.0%, 0.05% ⁇ Mg ⁇ 0.6%, 0.05% ⁇ Si ⁇ 0.25%, Mn ⁇ 0.05%, Cu ⁇ 0.04%, Residual Al and unavoidable impurities, individually max. 0.05%, in total max. 0.15%.
  • the litho strip can be improved in terms of the application, in particular with regard to its strength or heat resistance properties.
  • the lithoband having the following alloy contents in% by weight: 0.3% ⁇ Fe ⁇ 0.4%, 0.2% ⁇ Mg ⁇ 0.6%, 0, 05% ⁇ Si ⁇ 0.25%, Mn ⁇ 0.05%, Cu ⁇ 0.04%
  • the lithoband has the following alloy contents in% by weight: 0.3% ⁇ Fe ⁇ 0.4%, 0.1% ⁇ Mg ⁇ 0.3%, 0.05% ⁇ Si ⁇ 0.25%, Mn ⁇ 0.05%, Cu ⁇ 0.04%.
  • the impurities of the alloy of the lithoband have the following limit values in% by weight: Cr ⁇ 0.01%, Zn ⁇ 0.02%, Ti ⁇ 0.04%, B ⁇ 50 ppm.
  • Titanium can also be deliberately added to grain refining up to a concentration of 0.04% by weight.
  • the above object is achieved in a further teaching of the invention in a generic method for producing a lithographic strip according to the invention that the surface removal by the degreasing with simultaneous pickling step is at least 0.25 g / m 2 , preferably at least 0.4 g / m 2 .
  • the composition of the pickling medium, as well as the pickling temperature and pickling time, are to be adjusted so that an areal removal of at least 0.25 g / m 2 is achieved in the lithoband surface during the degreasing treatment with pickling step.
  • a topography of the lithoband surface can be achieved whose maximum peak height Rp and / or Spmax. 1.4 ⁇ m, preferably max. 1.2 ⁇ m, in particular max. 1.0 ⁇ m
  • the area removal is understood to be the weight of the litho strip per area removed during the degreasing treatment with the pickling step.
  • the lithoband is weighed before and after the degreasing treatment with a pickling step. The calculated weight loss divided by the size of the treated area gives the area removal.
  • the area of the front side and the back side must therefore be added.
  • the removal on the one hand is large enough to reduce the high webs, on the other hand, the thickness of the lithographic ribbon is not reduced too much.
  • the removal should also be kept as low as possible, so that the least possible loss of material during the degreasing treatment with pickling step arises.
  • the topography of the lithoband surface can be improved in a preferred embodiment of the method by the sodium hydroxide concentration in the aqueous pickling medium is between 2 and 3.5 wt .-% and optionally the degreasing treatment with pickling at temperatures between 70 and 85 ° C for a Duration between 1 and 3.5 s. At these concentrations, temperatures and treatment times, the topography according to the invention can be achieved particularly reliably.
  • a further improvement is achieved in that the sodium hydroxide concentration in the aqueous pickling medium is between 2.6 and 3.5% by weight and / or the pickling temperature is between 76 and 84 ° C.
  • the pickling time is between 1 and 2 s, preferably between 1.1 and 1.9 s.
  • the litho strip is rolled in the last cold rolling pass to a final thickness of 0.5 mm to 0.1 mm.
  • Particularly high rolling webs which can be greatly reduced by the degreasing treatment with pickling step, occur at these preferably used rolling thicknesses.
  • AA1050, AA1100, AA3103 or AlMg0.5 is used as the aluminum alloy. These aluminum alloys have proven to be particularly advantageous for the properties of the litho tapes.
  • the aluminum alloy has the following alloy composition in% by weight: 0.3% ⁇ Fe ⁇ 1.0%, 0.1% ⁇ Mg ⁇ 0.6%, 0.05% ⁇ Si ⁇ 0.25%, Mn ⁇ 0.05%, Cu ⁇ 0.04%, Residual Al and unavoidable impurities, individually max. 0.05%, in total max. 0.15%.
  • the effect of the degreasing treatment with pickling step is influenced by the alloy of the lithoband. It has been found that in this alloy composition with the selected process parameters for the pickling degreasing treatment very good results can be achieved with respect to the surface topography and at the same time good material properties of the lithographic strips.
  • the aluminum alloy has the following alloy contents in% by weight: 0.3% ⁇ Fe ⁇ 0.4%, 0.1% ⁇ Mg ⁇ 0.3%, 0.05% ⁇ Si ⁇ 0.25%, Mn ⁇ 0, 05%, Cu ⁇ 0.04%.
  • the impurities of the alloy of the lithoband have according to a further embodiment the following limits: Cr ⁇ 0.01%, Zn ⁇ 0.02%, Ti ⁇ 0.04%, B ⁇ 50 ppm, wherein titanium for grain refining up to a value of 0.04 wt .-% can also be added deliberatelymélegiert.
  • the structural properties of the lithographic strip can be improved by hot-rolling the lithoband before cold-rolling and, optionally, homogenizing treatment before hot-rolling and / or intermediate annealing during cold-rolling.
  • a pressure plate carrier having a topography whose maximum peak height Rp and / or Sp at most 1.4 microns, preferably at most 1.2 microns, in particular at most 1.0 microns , is.
  • the printing plate carrier is preferably produced from a lithoband according to the invention.
  • the printing plate support has a photosensitive coating with a thickness of less than 2 ⁇ m, preferably of less than 1 ⁇ m.
  • the printing plate support has a transparent photosensitive layer, which offers advantages in the exposure. In these layers, the complete coverage of the printing plate support can be detected only late after printing, so that faulty printing plate supports cause higher costs. By improving the topography and the associated reduction in printing errors, the costs can be greatly reduced by printing errors.
  • the printing plate support may preferably have a width of 200 mm to 2800 mm, more preferably from 800 mm to 1900 mm, in particular from 1700 mm to 1900 mm, and a length of 300 to 1200 mm, in particular 800 mm to 1200 mm.
  • the printing plate support according to the invention may preferably be in the CtP technique, i. used for a CtP printing plate.
  • the surface structure of the printing plate support is particularly critical, since the flat Aufrau Modellen or the relatively thin photosensitive coating at high rolling webs can increasingly lead to printing errors.
  • the CtP technique often uses transparent photosensitive layers with the aforementioned problems.
  • Fig. 1 shows a schematic representation of the determination of the maximum peak height Rp and the reduced peak height R pk according to DIN EN ISO 13 565th
  • a one-dimensional profile function Z (x) is plotted in an interval with the limits 0 and L.
  • the so-called Abbott-Firestone curve Z AF (Q) 6 is plotted.
  • This curve is the cumulative probability density function of the surface profile Z (x). It provides for a percentage value Q between 0 and 100% (plotted on the abscissa) that height value Z AF above which the corresponding percentage of the surface is located.
  • L is the length of the measured profile Z (x), ie the size of the domain of Z (x).
  • the integration range is the part of the total length for which the inequality Z (x) ⁇ Z AF (Q) is satisfied.
  • the intersections of this tangent 8 with the 0% line 10 and the 100% line 12 can define a core area of the surface whose extent is the kernel roughness depth R k is designated.
  • the average height of the peaks protruding from the core region is referred to as the reduced peak height R pk and the average depth of the grooves protruding from the core region is referred to as the reduced groove depth R vk .
  • the maximum peak height Rp drawn which the Distance of the highest peak to the mean at 0 microns corresponds.
  • the maximum peak height Rp or the reduced peak height R pk can be determined, for example, from profiles Z (x) measured at different positions of the lithoband transversely to the rolling direction.
  • the reduced peak height S pk can be determined in practice from a surface measurement accordingly.
  • A is the size of the measured area, ie the size of the domain of Z (x, y).
  • the integration range is the part of the total area for which the inequality Z (x, y) ⁇ Z AF (Q) is satisfied.
  • Fig. 2 shows an embodiment of the method according to the invention for producing a lithographic strip.
  • first an aluminum alloy for example an AA1050, AA1100, AA3103 or AlMg0.5 alloy, preferably an alloy having the following composition in% by weight: 0.3% ⁇ Fe ⁇ 1.0%, 0.05% ⁇ Mg ⁇ 0.6%, 0.05% ⁇ Si ⁇ 0.25%, Mn ⁇ 0.05%, Cu ⁇ 0.04%, Residual Al and unavoidable impurities, individually max. 0.05%, in total max. 0.15%, cast. Casting may generally be continuous or batch, especially in a continuous, semi-continuous or discontinuous continuous casting process.
  • the cast product ie in particular the cast ingot or the cast strip
  • the cast product may be subjected to a homogenization treatment before further processing, for example in the temperature range between 480 and 620 ° C. for at least two hours.
  • the cast product is optionally hot rolled, preferably to a thickness between 7 mm and 2 mm. Hot rolling can be dispensed with, for example, in a lithoband produced in the double-belt casting process.
  • the hot strip is then cold rolled in step 28, in particular to a thickness between 0.5 and 0.1 mm.
  • an intermediate annealing can optionally be carried out.
  • the lithoband is subjected to a pickling step in a degreasing treatment with an aqueous pickling medium, wherein the aqueous pickling medium contains at least 1.5 to 3% by weight of a mixture of 5-40% sodium tripolyphosphate, 3-10% sodium gluconate, 3 Contains 8% nonionic and anionic surfactants and optionally 0.5-70% soda, the sodium hydroxide concentration in the aqueous pickling medium being between 0.1 and 5% by weight, in particular between 2 and 3.5% by weight , is the degreasing treatment with pickling step at temperatures between 70 and 85 ° C for a period between 1 and 3.5 s and a surface removal by the degreasing treatment with pickling step of at least 0.25 g / m 2 is set.
  • the litho strip after the degreasing treatment with pickling step has a topography whose maximum peak height Rp and / or S p is at most 1.4 ⁇ m, preferably at most 1.2 ⁇ m, in particular maximum 1.0 ⁇ m, and is particularly suitable for CtP pressure plate carrier.
  • Fig. 3 The results of a 3D topography measurement of a lithoband surface after the last cold roll pass are shown.
  • the figure shows a three-dimensional view of the surface function Z (x, y) on a square area with the side length of 800 microns.
  • the height information can additionally be the scale right in Fig. 3 be removed.
  • the y-axis lies parallel to the rolling direction of the lithoband. It can be seen that the litho strip along the rolling direction, ie along the y-axis, has high rolling webs, which are clearly visible as bright elevations. These rolling webs can interfere with the application of a photosensitive layer or even prevent locally, so that printing errors can occur when using the printing plate carrier produced from these litho tapes.
  • Fig. 4 shows a profile Z (x) from the in Fig. 3 represented topography measurement, ie a section from the topography measurement parallel to the x-axis. It can be clearly seen that the roll webs in the litho strip after the Cold rolls may have a height of more than 1.6 microns. However, these high rolling webs have only a small influence on the value of the mean roughness R a of the lithoband.
  • Fig. 5 are the results of a topography measurement on the lithoband surface Fig. 3 after carrying out an embodiment of the method according to the invention, ie after the degreasing treatment with pickling step according to the method according to the invention.
  • Fig. 5 is shown essentially the same area of the litho ribbon as in Fig. 3
  • Fig. 6 shows analogously to Fig. 4 an associated profile Z (x) from the in Fig. 5 shown topography measurement.
  • the Figures 5 and 6 show that can be significantly reduced by the degreasing treatment with pickling step especially the high roll webs.
  • the maximum peak height Rp is in Fig. 6 now only at 1.3 microns and thus significantly below the maximum peak height R p of the untreated litho strip accordingly Fig. 4 ,
  • the inventive method it is therefore possible to produce a strip surface, the maximum peak height Rp and / or Sp max. 1.4 ⁇ m, preferably max. 1.2 ⁇ m, in particular max. 1.0 ⁇ m.
  • three measurements of a profile transverse to the rolling direction can be made, for example, on the outside and in the middle of the strip, whereby the length of the profile can be 4.8 mm, for example.
  • the value for Sp can be determined by means of a square area measurement with the side length of 800 microns can be determined.
  • Figs. 7 and 8th are also shown 3D topography measurements of a lithoband surface with the length 2146.9 microns and the width 2071.7 microns, immediately after the last cold roll pass ( Fig. 7 ) and after carrying out a degreasing treatment with pickling step according to the method of the invention ( Fig. 8 ).
  • the y-axis is in turn parallel to the rolling direction of the lithoband. From the comparison of Fig. 8 with the Fig. 7 it will be seen that the in Fig. 7 existing high rolling webs along the rolling direction can be greatly reduced by the degreasing treatment with pickling step, so that there is an improved lithoband surface.
  • a litho ribbon with a like in the Figures 5 . 6 or 8 shown surface topography can be used particularly advantageous as printing plate support with very flat Aufrau Modellen and / or in very thin photosensitive coatings, such as in the CtP technique. Further features and properties of the invention can also be taken from the results of roughness measurements of embodiments of the lithographic strip according to the invention which are shown below.
  • identical parameters were set as in the embodiment Fig. 2 ,
  • the mean surface roughness S a has hitherto been used to characterize the lithographic ribbons.
  • Table 1 shows that this roughness parameter is not suitable for representing the effect of the degreasing treatment according to the invention with pickling step or the surface quality of the lithographic strips with respect to individual high rolling webs. Its value is essentially unchanged after the degreasing treatment with pickling step.
  • the reduced groove depth S vk is also unsuitable as an indicator for high rolling webs.
  • the values for the maximum peak height S p are significantly reduced and thus indicate the improvement of the lithoband surface with regard to the disturbing high rolling webs.
  • Table 2 compares the results for the maximum peak height S p from the roughness measurements on litho ribbons of different thicknesses.
  • the litho tapes with strip thicknesses of 0.3 mm to 0.1 mm clearly benefit from the process according to the invention, since they have relatively large S p values of more than 1.5 ⁇ m directly after the last cold rolling pass and are thus susceptible to the aforementioned printing defects are.
  • the maximum peak height Sp can be reduced substantially to the same value for all measured strip thicknesses. Consequently, the surface quality of thin lithographic ribbons can be improved particularly well with the method according to the present invention.
  • Tables 1 and 2 also show that high rolling webs occur, in particular at the strip edges. Therefore, for example, the degreasing treatment with pickling step can also be carried out selectively in the edge region of the litho tapes.
  • Table 3 ⁇ / b> Time of measurement S a S vk S pk P before degreasing 0.22 0.23 0.43 1.51 after degreasing 0.21 0.24 0.37 1.13
  • Table 3 shows the roughness characteristics S a , S vk , S pk and Sp averaged over litho tapes of different thicknesses.
  • the results clearly show that the average roughness S a previously used for the characterization of litho tapes is not suitable for improving the quality of a litho strip surface with regard to the disturbing high roll webs.
  • the values of the maximum peak height Rp and / or Sp and the reduced peak height R pk and / or S pk after the degreasing treatment with pickling step show a significant reduction, so that the lithoband or the method for its production by an optimization with respect to the parameter Rp and / or Sp, possibly in combination with R pk and / or S pk , can be significantly improved.
  • the method according to the invention can be used for the production of the litho strip according to the invention.
  • the lithoband of the present invention is not limited to this production method.
  • the person skilled in the art can also develop further methods in order to arrive at a lithoband according to the invention.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

Abstract

The litho sheet for the electrochemical roughening, comprises a rolled aluminum alloy, where a sheet surface has a topography with: a maximum peak height R pand/or S pof less than 1.0 mu m; and a reduced peak height R p kand/or S p kof less than 0.37 mu m. A thickness of the litho sheet is 0.5-0.1 mm. Independent claims are included for: (1) a method for producing a litho sheet; and (2) printing plate supports.

Description

Die Erfindung betrifft ein Lithoband für die elektrochemische Aufrauung, bestehend aus einer gewalzten Aluminiumlegierung. Weiterhin betrifft die Erfindung auch ein Verfahren zur Herstellung eines solchen Lithobandes, bei dem ein aus einer Aluminiumlegierung bestehendes Lithoband kaltgewalzt wird und bei dem das Lithoband nach dem letzten Kaltwalzstich einer Entfettungsbehandlung mit gleichzeitigem Beizschritt mit einem wässrigen Beizmedium unterzogen wird, wobei das wässrige Beizmedium mindestens 1,5 bis 3 Gew.-% eines Gemisches aus 5 - 40 % Natriumtripolyphosphat, 3 - 10 % Natriumgluconat, 3 - 8 % nicht-ionischen und anionischen Tensiden und optional 0,5 bis 70% Soda enthält und die Natriumhydroxid-Konzentration im wässrigen Beizmedium zwischen 0,1 Gew.-% und 5 Gew.-% beträgt. Schließlich betrifft die Erfindung noch einen Druckplattenträger sowie dessen vorteilhafte Verwendung.The invention relates to a litho strip for electrochemical roughening, consisting of a rolled aluminum alloy. Furthermore, the invention also relates to a method for producing such a lithoband, in which a litho strip consisting of an aluminum alloy is cold rolled and in which the litho strip is subjected after the last cold rolling pass to a degreasing treatment with simultaneous pickling step with an aqueous pickling medium, wherein the aqueous pickling medium is at least 1 , 5 to 3 wt .-% of a mixture of 5-40% sodium tripolyphosphate, 3-10% sodium gluconate, 3-8% nonionic and anionic surfactants and optionally 0.5 to 70% soda and the sodium hydroxide concentration in aqueous Pickling medium between 0.1 wt .-% and 5 wt .-% is. Finally, the invention also relates to a pressure plate carrier and its advantageous use.

An die Oberflächenbeschaffenheit von Lithobändern, d.h. von Aluminiumbändern zur Herstellung lithografischer Druckplattenträger, werden sehr hohe Anforderungen gestellt. Lithobänder werden üblicherweise einem elektrochemischen Aufrauschritt unterzogen, welcher eine flächendeckende Aufrauung und ein strukturloses Aussehen zur Folge haben sollte. Die aufgeraute Struktur ist wichtig für das Aufbringen einer photosensitiven Schicht auf die aus den Lithobändern hergestellten Druckplattenträger. Um gleichmäßig aufgeraute Oberflächen herstellen zu können, ist daher eine besonders ebene Oberfläche der Lithobänder erforderlich. Die Topografie der Lithobandoberfläche ist im Wesentlichen ein Abdruck der Walzentopografie des letzten Kaltwalzstichs. Erhebungen und Vertiefungen in der Walzenoberfläche führen zu Riefen bzw. Stegen in der Lithobandoberfläche, welche bei den weiteren Fertigungsschritten zur Herstellung der Druckplattenträger teilweise erhalten bleiben können. Die Qualität der Lithobandoberfläche und damit der Druckplattenträger wird damit durch die Qualität der Walzenoberfläche und somit einerseits durch die Schleifpraxis bei der Oberflächenbehandlung der Walzen und andererseits durch den laufenden Verschleiß der Walzen bestimmt.Very high demands are placed on the surface quality of lithographic strips, ie aluminum strips for the production of lithographic printing plate supports. Lithographic tapes are usually subjected to an electrochemical roughening step, which should result in a nationwide roughening and a structureless appearance. The roughened structure is important for applying a photosensitive layer to the printing plate supports made of the litho ribbons. To be able to produce evenly roughened surfaces is therefore a particularly flat surface of the litho ribbons required. The topography of the lithoband surface is essentially an impression of the roll topography of the last cold roll pass. Elevations and depressions in the roll surface lead to grooves or webs in the lithoband surface, which can be partially preserved in the further production steps for the production of printing plate support. The quality of the lithoband surface and thus the printing plate support is thus determined by the quality of the roll surface and thus on the one hand by the grinding practice in the surface treatment of the rollers and on the other hand by the ongoing wear of the rollers.

Ein Maß zur Bestimmung der Oberflächenqualität des Lithobandes stellt die mittlere Rauheit Ra nach DIN EN ISO 4287 und DIN EN ISO 4288 dar. Bei den derzeitigen Verfahren zur Herstellung von Lithobändern werden im letzten Kaltwalzstich bereits Oberflächen mit einem üblichen mittleren Rauheitswert Ra von ca. 0,15 µm bis 0,25 µm erzeugt. Diese Rauheitswerte sind für viele Anwendungsbereiche ausreichend.A measure for determining the surface quality of the lithographic strip is the mean roughness R a in accordance with DIN EN ISO 4287 and DIN EN ISO 4288. In the current method for producing lithographic strips, surfaces having a customary average roughness value R a of approx. 0.15 .mu.m to 0.25 .mu.m generated. These roughness values are sufficient for many applications.

In den letzten Jahren werden jedoch immer mehr Druckplatten mit sehr flachen Aufraustrukturen und/oder einer relativ dünnen photosensitiven Beschichtung nachgefragt. Diese werden beispielsweise in der immer weiter verbreiteten CtP-Technik eingesetzt, bei der die Druckerplatten direkt digital über einen Computer belichtet werden können. Weiterhin nimmt auch die Dicke der verwendeten Beschichtungen ab und deren Komplexität zu. Bei den derzeitig verfügbaren Druckplattenträgern kommt es bei diesen Anwendungen immer wieder zu Druckfehlern. Eine flache Topografie des Lithobandes nach dem Walzen stellt daher ein immer wichtiger werdendes Qualitätskriterium für Lithobänder dar.In recent years, however, more and more printing plates with very flat Aufraustrukturen and / or a relatively thin photosensitive coating are in demand. These are used for example in the increasingly widespread CtP technology, in which the printer plates can be exposed directly digitally via a computer. Furthermore, the thickness of the coatings used decreases and their complexity increases. With the currently available printing plate carriers, printing errors occur again and again in these applications. A flat topography of the Lithobandes after rolling is therefore an increasingly important quality criterion for litho ribbons.

Es wurde versucht, das Schleifen der Walzen zu optimieren, um flachere Walzstrukturen zu erhalten. Die Schleifpraxen sind jedoch bereits weitgehend optimiert, so dass sich weitere Qualitätssteigerungen auf diese Weise nur sehr schwer erreichen lassen. Weiterhin nimmt die Oberflächenqualität der Walzen nach dem Schleifen durch den Verschleiß beim Walzen wieder ab, so dass ein häufiges Nachschleifen der Walzen erforderlich ist. Schließlich können sehr glatte Walzenoberflächen nur eine geringe Reibkraft auf die Lithobandoberfläche ausüben, so dass es zum Schlupf zwischen der Walze und dem Lithoband und dadurch zu einer Störung des Walzprozesses oder einer Beschädigung des Lithobands kommen kann.An attempt was made to optimize the grinding of the rolls in order to obtain flatter rolling structures. The grinding practices are, however, already largely optimized, so that further improvements in quality are very difficult to achieve in this way. Furthermore, the surface quality of the rolls decreases after grinding due to the wear during rolling, so that frequent re-grinding of the rolls is required. Finally, very smooth roll surfaces can exert only a low frictional force on the lithoband surface, so that there may be slippage between the roll and the lithoband, thereby disrupting the rolling process or damaging the lithoband.

Bei anderen, aus dem Stand der Technik der WO 2006/122852 A1 und der WO 2007/141300 A1 bekannten Verfahren, werden die Lithobänder nach dem Walzen gebeizt, um störende Oxidinseln auf der Oberfläche der Bänder zu entfernen und dadurch die nachfolgende elektrochemische Aufrauung zu verbessern. Auf diese Weise kann die Oberflächengüte der Druckplattenträger zwar grundsätzlich verbessert werden, das Problem der zuvor genannten Druckfehler bleibt jedoch weiterhin bestehen.In others, from the prior art of WO 2006/122852 A1 and the WO 2007/141300 A1 known methods, the litho ribbons are pickled after rolling to remove interfering oxide islands on the surface of the bands and thereby to improve the subsequent electrochemical roughening. Although the surface quality of the printing plate supports can be fundamentally improved in this way, the problem of the abovementioned printing errors still persists.

Ausgehend von diesem Stand der Technik liegt der vorliegenden Erfindung die Aufgabe zu Grunde, ein Lithoband und ein Verfahren zu dessen Herstellung zur Verfügung zu stellen, mit denen die zuvor genannten Nachteile aus dem Stand der Technik vermieden oder zumindest reduziert werden können.Based on this prior art, the present invention based on the object to provide a litho strip and a method for its production, with which the aforementioned disadvantages of the prior art can be avoided or at least reduced.

Diese Aufgabe wird bei einem gattungsgemäßen Lithoband erfindungsgemäß dadurch gelöst, dass die Bandoberfläche eine Topografie aufweist, deren maximale Peakhöhe Rp und/oder Sp maximal 1,4 µm, bevorzugt maximal 1,2 µm, insbesondere maximal 1,0 µm, beträgt.This object is achieved according to the invention in a generic lithographic strip in that the strip surface has a topography whose maximum peak height Rp and / or Sp is at most 1.4 μm, preferably at most 1.2 μm, in particular at most 1.0 μm.

Unter der Topografie einer Bandoberfläche wird deren Abweichung von einer idealen Ebene verstanden. Sie kann über eine Funktion Z(x,y) beschrieben werden, welche jedem Punkt der Bandoberfläche (x,y) die lokale Abweichung von der mittleren Höhe der Oberfläche zuweist. Der Mittelwert der Funktion Z(x,y), d.h. die Position der mittleren Oberfläche, ist demnach auf 0 gesetzt, wie sich aus folgender Formel ergibt: Z x y = 1 F Z x y dxdy = 0

Figure imgb0001
The topography of a band surface is understood to mean its deviation from an ideal level. It can be described by a function Z (x, y) which assigns to each point of the band surface (x, y) the local deviation from the mean height of the surface. The mean value of the function Z (x, y), ie the position of the mean surface, is therefore set to 0, as follows from the following formula: < Z x y > = 1 F Z x y dxdy = 0
Figure imgb0001

F ist die Größe der Integrationsfläche. Lokale Erhebungen entsprechen positiven Werten und lokale Senkungen entsprechen negativen Werte von Z(x,y).F is the size of the integration area. Local surveys correspond to positive values and local reductions correspond to negative values of Z (x, y).

Die Eigenschaften einer solchen Topografie lassen sich durch verschiedene Kennwerte bestimmen. Ein üblicher Kennwert ist die mittlere Rauheit Ra bzw. die mittlere quadratische Rauheit Rq nach DIN EN ISO 4287 und DIN EN ISO 4288. Diese Kennwerte sind über die folgenden Gleichungen definiert: R a = 1 L Z x dx R q = 1 L Z x 2 dx

Figure imgb0002
The properties of such a topography can be determined by different characteristics. A common characteristic value is the average roughness R a or the mean square roughness Rq according to DIN EN ISO 4287 and DIN EN ISO 4288. These characteristic values are defined by the following equations: R a = 1 L Z x dx R q = 1 L Z x 2 dx
Figure imgb0002

Z (x) ist ein Profil der Oberfläche, d.h. ein eindimensionaler Schnitt durch die Funktion Z (x,y). L ist die Länge des Integrationsintervalls. Zur Bestimmung der Oberflächengüte einer Fläche werden in der Praxis an verschiedenen Stellen der Oberfläche eindimensionale Profile Z (x) durch lineare Abtastung gemessen und die entsprechenden Werte Ra und Rq ermittelt.Z (x) is a profile of the surface, ie a one-dimensional section through the function Z (x, y). L is the length of the integration interval. In order to determine the surface quality of a surface, one-dimensional profiles Z (x) are measured by linear scanning in various places on the surface and the corresponding values R a and R q are determined.

Die Werte für Sa und Sq ergeben sich aus einer zweidimensionalen Vermessung der Oberfläche, also der Topographie Z (x,y). Die Berechnung der Werte Sa und Sq erfolgt anhand der nachfolgenden Gleichung, wobei A die Größe der Integrationsfläche ist: S a = 1 A Z x y dxdy S q = 1 A Z x y 2 dxdy

Figure imgb0003
The values for S a and Sq result from a two-dimensional measurement of the surface, ie the topography Z (x, y). The calculation of the values S a and S q is based on the following equation, where A is the size of the integration surface: S a = 1 A Z x y dxdy S q = 1 A Z x y 2 dxdy
Figure imgb0003

Im Rahmen der vorliegenden Erfindung ist erkannt worden, dass die im Stand der Technik auftretenden Druckfehler häufig durch einzelne, besonders hohe Walzstege hervorgerufen werden, welche bei der Fertigung zu Druckplattenträgern teilweise erhalten bleiben können. Bei der Beschichtung der Druckplattenträger kann es dann im Bereich dieser Walzstege zu Unterbrechungen in der photosensitiven Schicht kommen, was beim Einsatz der fertigen Druckplatten zu Druckfehlern führt. Die hohen Walzstege haben sich bei Druckplattenträgern mit einer flachen Aufraustruktur und/oder einer relativ dünnen photosensitiven Beschichtung als besonders problematisch herausgestellt.In the context of the present invention, it has been recognized that the printing errors occurring in the prior art are frequently caused by individual, particularly high rolling webs, which can be partially preserved during production to printing plate supports. During the coating of the printing plate supports, interruptions in the photosensitive layer may then occur in the region of these rolling webs, which leads to printing errors when using the finished printing plates. The high rolling webs have been found to be particularly problematic in printing plate carriers with a flat Aufraustruktur and / or a relatively thin photosensitive coating.

Das Vorliegen einzelner hoher Walzstege wird durch den bisher verwendeten Kennwert Ra bzw. Sa zur Charakterisierung der Lithobandoberfläche jedoch nur unzureichend erfasst. Demgegenüber kann die Wahrscheinlichkeit hoher Walzstege und damit das Auftreten der genannten Druckfehler dadurch reduziert werden, dass das Lithoband bzw. das Verfahren zu dessen Herstellung hinsichtlich eines anderen, bisher nicht beachteten Rauheitskennwerts optimiert wird. Durch die Beschränkung der maximalen Peakhöhe Rp und/oder Sp auf maximal 1,4 µm, bevorzugt maximal 1,2 µm, insbesondere maximal 1,0 µm, können Lithobänder zur Verfügung gestellt werden, welche den heutigen hohen Anforderungen an die Oberflächenqualität, beispielsweise beim Einsatz der CtP-Technik, genügen.However, the presence of individual high rolling webs is only insufficiently detected by the characteristic value R a or S a used to characterize the lithoband surface. In contrast, the probability of high rolling webs and thus the occurrence of said printing errors can be reduced by optimizing the lithoband or the method for its production with respect to another roughness characteristic value which has hitherto been ignored. By limiting the maximum peak height Rp and / or Sp to a maximum of 1.4 .mu.m, preferably a maximum of 1.2 .mu.m, in particular a maximum of 1.0 .mu.m, litho tapes can be made available which meets today's high demands on the surface quality, for example Use of CtP technology, suffice.

Zur Bestimmung der maximalen Peakhöhe Rp eines Lithobandes können in der Praxis an drei Stellen des Lithobandes quer zur Walzrichtung Profile Z(x) über eine Länge von beispielsweise jeweils 4,8 mm vermessen werden, um einen Wert für Rp zu bestimmen. Für jedes dieser Profile gilt R p = max Z x ,

Figure imgb0004
wobei die Funktion max(Z) den Maximalwert von Z(x) liefert. Sp wird über eine Flächenmessung mit der Gleichung S p = max Z x y ,
Figure imgb0005
ermittelt, wobei die Funktion max(Z) den Maximalwert von Z(x,y) liefert. Die zu vermessende Fläche kann in der Praxis beispielsweise quadratisch sein und eine Kantenlänge von 800µm aufweisen.In order to determine the maximum peak height Rp of a lithographic strip, profiles Z (x) over a length of, for example, 4.8 mm in each case can be measured at three points of the lithoband transversely to the rolling direction in order to determine a value for Rp. For each of these profiles applies R p = Max Z x .
Figure imgb0004
where the max (Z) function returns the maximum value of Z (x). S p is about an area measurement using the equation S p = Max Z x y .
Figure imgb0005
determined, wherein the function max (Z) provides the maximum value of Z (x, y). The area to be measured can in practice be square, for example, and have an edge length of 800 μm.

Bevorzugt wird zur Ermittlung der maximalen Peakhöhe Rp jeweils ein Profil Z(x) in der Mitte und an den Seiten des Lithobandes gemessen.In order to determine the maximum peak height Rp, in each case a profile Z (x) in the middle and on the sides of the lithoband is preferably measured.

Es versteht sich, dass für die Messung der Profile Z(x) bzw. der Topographie Z(x,y) nur die Bereiche des Lithobandes in Frage kommen, welche später zu Druckplattenträgern weiterverarbeitet werden sollen. Beschädigte Bereiche oder Bereiche mit Walzfehlern kommen beispielsweise nicht in Betracht.It is understood that for the measurement of the profiles Z (x) and the topography Z (x, y) only those areas of the lithoband are possible, which will later be further processed into printing plate carriers. For example, damaged areas or areas with rolling defects are out of the question.

In einer ersten Ausführungsform des Lithobands weist die Bandoberfläche eine Topografie auf, deren reduzierte Peakhöhe Rpk und/oder Spk maximal 0,4 µm, bevorzugt maximal 0,37 µm, beträgt. Es hat sich herausgestellt, dass die Qualität der Bandoberfläche im Hinblick auf die Druckfehlerfreiheit durch eine zusätzliche Kontrolle der reduzierten Peakhöhe Rpk und/oder Spk weiter verbessert werden kann.In a first embodiment of the lithoband, the strip surface has a topography whose reduced peak height R pk and / or S pk is at most 0.4 μm, preferably at most 0.37 μm. It has been found that the quality of the strip surface can be further improved with regard to freedom from printing defects by additional control of the reduced peak height R pk and / or S pk .

Die reduzierte Peakhöhe Rpk wird nach DIN EN ISO 13 565 bestimmt. Die reduzierte Peakhöhe Spk wird ebenfalls nach DIN EN ISO 13 565 durch eine Flächenmessung ermittelt. In der Praxis können die Profile Z (x) bzw. die Topographie Z (x,y) wie zuvor für Rp bzw. Sp beschrieben gemessen werden.The reduced peak height R pk is determined according to DIN EN ISO 13 565. The reduced peak height S pk is also determined according to DIN EN ISO 13 565 by an area measurement. In practice, the profiles Z (x) and the topography Z (x, y) can be measured as previously described for Rp or Sp, respectively.

In einer weiteren Ausführungsform beträgt die Dicke des Lithobandes 0,5 mm bis 0,1 mm. Es hat sich herausgestellt, dass gerade konventionelle Lithobänder mit geringen Dicken hohe Walzstege aufweisen können. Daher kann die Oberflächenqualität dünner Lithobänder durch die Beschränkung der maximalen Peakhöhe Rp und/oder Sp bzw. der reduzierten Peakhöhe Rpk und/oder Spk besonders verbessert werden.In a further embodiment, the thickness of the lithoband is 0.5 mm to 0.1 mm. It has been found that just conventional litho tapes with small thicknesses can have high rolling webs. Therefore, the surface quality of thin lithographic ribbons can be particularly improved by restricting the maximum peak height Rp and / or Sp and the reduced peak height R pk and / or S pk , respectively.

Gute Materialeigenschaften der Lithobänder werden in einer weiteren Ausführungsform des Lithobandes dadurch erreicht, dass das Lithoband aus einer AA1050, AA1100, AA3103 oder AlMg0.5 Legierung besteht.Good material properties of the lithographic ribbons are achieved in a further embodiment of the lithoband in that the lithoband consists of an AA1050, AA1100, AA3103 or AlMg0.5 alloy.

In einer weiteren bevorzugten Ausführungsform weist das Lithoband folgende Legierungszusammensetzungen in Gew.-% auf: 0,3 % ≤ Fe ≤ 1,0 %, 0,05 % ≤ Mg ≤ 0,6 %, 0,05 % ≤ Si ≤ 0,25 %, Mn ≤ 0,05 %, Cu ≤ 0,04 %, Rest Al sowie unvermeidbare Verunreinigungen, einzeln max. 0,05 %, in Summe max. 0,15 %. In a further preferred embodiment, the lithoband has the following alloy compositions in% by weight: 0.3% ≤ Fe ≤ 1.0%, 0.05% ≤ Mg ≤ 0.6%, 0.05% ≤ Si ≤ 0.25%, Mn ≤ 0.05%, Cu ≤ 0.04%, Residual Al and unavoidable impurities, individually max. 0.05%, in total max. 0.15%.

Dadurch kann das Lithoband besonders hinsichtlich seiner Festigkeits- bzw. Warmfestigkeitseigenschaften anwendungsbezogen verbessert werden.As a result, the litho strip can be improved in terms of the application, in particular with regard to its strength or heat resistance properties.

Hohe Biegewechselbeständigkeiten und gleichzeitig eine sehr gute thermische Stabilität des Lithobandes können in einer weiteren Ausführungsform dadurch erreicht werden, dass das Lithoband folgende Legierungsgehalte in Gew.-% aufweist: 0,3 % ≤ Fe ≤ 0,4 %, 0,2 % ≤ Mg ≤ 0,6 %, 0, 05 % ≤ Si ≤ 0,25 %, Mn ≤ 0,05 %, Cu ≤ 0,04 % High bending fatigue resistance and at the same time a very good thermal stability of the lithoband can be achieved in another embodiment by the lithoband having the following alloy contents in% by weight: 0.3% ≤ Fe ≤ 0.4%, 0.2% ≤ Mg ≤ 0.6%, 0, 05% ≤ Si ≤ 0.25%, Mn ≤ 0.05%, Cu ≤ 0.04%

In einer weiteren Ausführungsform weist das Lithoband folgende Legierungsgehalte in Gew.-% auf: 0,3 % ≤ Fe ≤ 0,4 %, 0,1 % ≤ Mg ≤ 0,3 %, 0,05 % ≤ Si ≤ 0,25 %, Mn ≤ 0,05 %, Cu ≤ 0,04 %. In a further embodiment, the lithoband has the following alloy contents in% by weight: 0.3% ≤ Fe ≤ 0.4%, 0.1% ≤ Mg ≤ 0.3%, 0.05% ≤ Si ≤ 0.25%, Mn ≤ 0.05%, Cu ≤ 0.04%.

Auf diese Weise können die Aufraueigenschaften und die Warmfestigkeit des Lithobandes verbessert werden.In this way, the roughening properties and the heat resistance of the lithographic strip can be improved.

Gemäß einer weiteren Ausführungsform weisen die Verunreinigungen der Legierung des Lithobandes folgende Grenzwerte in Gew.-% auf: Cr ≤ 0,01 %, Zn ≤ 0,02 %, Ti ≤ 0,04 %, B ≤ 50 ppm. According to a further embodiment, the impurities of the alloy of the lithoband have the following limit values in% by weight: Cr ≤ 0.01%, Zn ≤ 0.02%, Ti ≤ 0.04%, B ≤ 50 ppm.

Titan kann zur Kornfeinung bis zu einer Konzentration von 0,04 Gew.-% auch bewusst hinzulegiert werden.Titanium can also be deliberately added to grain refining up to a concentration of 0.04% by weight.

Die oben genannte Aufgabe wird in einer weiteren Lehre der Erfindung bei einem gattungsgemäßen Verfahren zur Herstellung eines Lithobandes erfindungsgemäß dadurch gelöst, dass der Flächenabtrag durch die Entfettungsbehandlung mit gleichzeitigem Beizschritt mindestens 0,25 g/m2, bevorzugt mindestens 0,4 g/m2 beträgt.The above object is achieved in a further teaching of the invention in a generic method for producing a lithographic strip according to the invention that the surface removal by the degreasing with simultaneous pickling step is at least 0.25 g / m 2 , preferably at least 0.4 g / m 2 .

Es wurde erkannt, dass die störenden hohen Walzstege auf der Lithobandoberfläche nach dem letzten Kaltwalzstich durch eine spezifische Entfettungsbehandlung mit gleichzeitigem Beizschritt reduziert werden können. Bekannt sind Beizbehandlungen zur Entfernung von Oxidinseln, die gezielte Entfernung von Walzstegen war bisher nicht bekannt. Durch die spezielle Wahl des Beiz- bzw. Entfettungsmediums und der Prozessparameter ist es nun jedoch möglich, stattdessen oder zusätzlich eine Topografie der Lithobandoberfläche zu erreichen, welche gegenüber den bisher bekannten Lithobändern eine deutlich geringere Druckfehleranfälligkeit wegen hoher Walzstege aufweist. Da die Entfettungsbehandlung mit Beizschritt von Lithobandoberflächen ein sehr kritischer Prozess ist, erfordert das Verfahren eine sehr enge Auswahl der Prozessparameter. Insbesondere sind die Zusammensetzung des Beizmediums sowie die Beiztemperatur und die Beizdauer so einzustellen, dass bei der Lithobandoberfläche während der Entfettungsbehandlung mit Beizschritt ein Flächenabtrag von mindestens 0,25 g/m2 erreicht wird. Dadurch kann eine Topografie der Lithobandoberfläche erreicht werden, deren maximale Peakhöhe Rp und/oder Sp max. 1,4 µm, bevorzugt max. 1,2 µm, insbesondere max. 1,0 µm, beträgtIt was recognized that the disruptive high rolling webs on the lithoband surface can be reduced after the last cold rolling pass by a specific degreasing treatment with simultaneous pickling step. Are known pickling treatments for the removal of oxide islands, the targeted removal of rolling bars was previously unknown. However, due to the special choice of pickling or degreasing medium and the process parameters, it is now possible instead or additionally to achieve a topography of the lithoband surface, which has a significantly lower susceptibility to printing errors due to high rolling webs compared to the previously known litho tapes. Since the degreasing treatment with pickling step of lithoband surfaces is a very critical process, the process requires a very narrow selection of process parameters. In particular, the composition of the pickling medium, as well as the pickling temperature and pickling time, are to be adjusted so that an areal removal of at least 0.25 g / m 2 is achieved in the lithoband surface during the degreasing treatment with pickling step. As a result, a topography of the lithoband surface can be achieved whose maximum peak height Rp and / or Spmax. 1.4 μm, preferably max. 1.2 μm, in particular max. 1.0 μm

Unter dem Flächenabtrag wird das während der Entfettungsbehandlung mit Beizschritt abgetragene Gewicht des Lithobandes pro Fläche verstanden. Zur Bestimmung des Flächenabtrags wird das Lithoband vor und nach der Entfettungsbehandlung mit Beizschritt gewogen. Der daraus berechnete Gewichtsverlust dividiert durch die Größe der behandelten Fläche ergibt den Flächenabtrag. Bei einer beidseitigen Entfettungsbehandlung mit Beizschritt des Lithobandes ist demnach die Fläche der Vorderseite und der Rückseite zu addieren.The area removal is understood to be the weight of the litho strip per area removed during the degreasing treatment with the pickling step. To determine the surface removal, the lithoband is weighed before and after the degreasing treatment with a pickling step. The calculated weight loss divided by the size of the treated area gives the area removal. In the case of a two-sided degreasing treatment with pickling step of the litho strip, the area of the front side and the back side must therefore be added.

Als besonders vorteilhaft hat sich ein eingestellter Flächenabtrag zwischen 0,25 g/m2 und 0,6 g/m2, bevorzugt zwischen 0,4 g/m2 und 0,6 g/m2 herausgestellt. Auf diese Weise ist der Abtrag einerseits groß genug, um die hohen Stege zu reduzieren, anderseits wird die Dicke des Lithobandes nicht zu stark reduziert. Grundsätzlich sollte der Abtrag aber auch so gering wie möglich gehalten werden, so dass ein möglichst geringer Materialverlust bei der Entfettungsbehandlung mit Beizschritt entsteht.A set surface removal of between 0.25 g / m 2 and 0.6 g / m 2 , preferably between 0.4 g / m 2 and 0.6 g / m 2 , has proven to be particularly advantageous. In this way, the removal on the one hand is large enough to reduce the high webs, on the other hand, the thickness of the lithographic ribbon is not reduced too much. In principle, the removal should also be kept as low as possible, so that the least possible loss of material during the degreasing treatment with pickling step arises.

Die Topografie der Lithobandoberfläche kann bei einer bevorzugten Ausführungsform des Verfahrens dadurch verbessert werden, dass die Natriumhydroxid-Konzentration im wässrigen Beizmedium zwischen 2 und 3,5 Gew.-% beträgt und optional die Entfettungsbehandlung mit Beizschritt bei Temperaturen zwischen 70 und 85 °C für eine Dauer zwischen 1 und 3,5 s erfolgt. Bei diesen Konzentrationen, Temperaturen und Behandlungsdauern kann besonders prozesssicher die erfindungsgemäße Topographie erreicht werden.The topography of the lithoband surface can be improved in a preferred embodiment of the method by the sodium hydroxide concentration in the aqueous pickling medium is between 2 and 3.5 wt .-% and optionally the degreasing treatment with pickling at temperatures between 70 and 85 ° C for a Duration between 1 and 3.5 s. At these concentrations, temperatures and treatment times, the topography according to the invention can be achieved particularly reliably.

Eine weitere Verbesserung wird dadurch erreicht, dass die Natriumhydroxid-Konzentration im wässrigen Beizmedium zwischen 2,6 und 3,5 Gew.-% beträgt und/oder die Beiztemperatur zwischen 76 und 84 °C beträgt. Hierdurch wird eine kürzere Behandlungsdauer bei dennoch homogener Entfernung hoher Walzstege ermöglicht. Eine weitere Verbesserung in der Geschwindigkeit der Entfettungsbehandlung mit Beizschritt des Lithobandes kann dadurch erreicht werden, dass die Beizdauer zwischen 1 und 2 s, bevorzugt zwischen 1.1 und 1.9 s beträgt.A further improvement is achieved in that the sodium hydroxide concentration in the aqueous pickling medium is between 2.6 and 3.5% by weight and / or the pickling temperature is between 76 and 84 ° C. As a result, a shorter treatment time is possible with nevertheless homogeneous removal of high rolling webs. Another improvement in the speed of degreasing treatment With pickling step of the litho tape can be achieved in that the pickling time is between 1 and 2 s, preferably between 1.1 and 1.9 s.

Gemäß einer weiteren Ausführungsform des Verfahrens wird das Lithoband im letzten Kaltwalzstich auf eine Enddicke von 0,5 mm bis 0,1 mm gewalzt. Bei diesen bevorzugt eingesetzten Walzdicken tretenden besonders hohe Walzstege auf, welche durch die Entfettungsbehandlung mit Beizschritt stark reduziert werden können.According to a further embodiment of the method, the litho strip is rolled in the last cold rolling pass to a final thickness of 0.5 mm to 0.1 mm. Particularly high rolling webs, which can be greatly reduced by the degreasing treatment with pickling step, occur at these preferably used rolling thicknesses.

Als Aluminiumlegierung wird gemäß einer weiteren Ausführungsform des Verfahrens AA1050, AA1100, AA3103 oder AlMg0.5 verwendet. Diese Aluminiumlegierungen haben sich für die Eigenschaften der Lithobänder als besonders vorteilhaft erwiesen.As the aluminum alloy, according to another embodiment of the method, AA1050, AA1100, AA3103 or AlMg0.5 is used. These aluminum alloys have proven to be particularly advantageous for the properties of the litho tapes.

In einer weiteren Ausführungsform des Verfahrens weist die Aluminiumlegierung folgende Legierungszusammensetzung in Gew.-% auf: 0,3 % ≤ Fe ≤ 1,0 %, 0,1 % ≤ Mg ≤ 0,6 %, 0,05 % ≤ Si ≤ 0,25 %, Mn ≤ 0,05 %, Cu ≤ 0,04 %, Rest Al sowie unvermeidbare Verunreinigungen, einzeln max. 0,05 %, in Summe max. 0,15 %. In a further embodiment of the method, the aluminum alloy has the following alloy composition in% by weight: 0.3% ≤ Fe ≤ 1.0%, 0.1% ≤ Mg ≤ 0.6%, 0.05% ≤ Si ≤ 0.25%, Mn ≤ 0.05%, Cu ≤ 0.04%, Residual Al and unavoidable impurities, individually max. 0.05%, in total max. 0.15%.

Die Wirkung der Entfettungsbehandlung mit Beizschritt wird durch die Legierung des Lithobands beeinflusst. Es wurde festgestellt, dass bei dieser Legierungszusammensetzung mit den ausgewählten Prozessparametern für die Entfettungsbehandlung mit Beizschritt sehr gute Ergebnisse bezüglich der Oberflächentopografie und gleichzeitig gute Materialeigenschaften der Lithobänder erreicht werden können.The effect of the degreasing treatment with pickling step is influenced by the alloy of the lithoband. It has been found that in this alloy composition with the selected process parameters for the pickling degreasing treatment very good results can be achieved with respect to the surface topography and at the same time good material properties of the lithographic strips.

In weiteren Ausführungsformen des Verfahrens weist die Aluminiumlegierung folgende Legierungsgehalte in Gew.-% auf: 0,3 % ≤ Fe ≤ 0,4 %, 0,1 % ≤ Mg ≤ 0,3 %, 0,05 % ≤ Si ≤ 0,25 %, Mn ≤ 0, 05 %, Cu ≤ 0,04 %. In further embodiments of the method, the aluminum alloy has the following alloy contents in% by weight: 0.3% ≤ Fe ≤ 0.4%, 0.1% ≤ Mg ≤ 0.3%, 0.05% ≤ Si ≤ 0.25%, Mn ≤ 0, 05%, Cu ≤ 0.04%.

Die Verunreinigungen der Legierung des Lithobandes weisen gemäß einer weiteren Ausführungsform folgende Grenzwerte auf: Cr ≤ 0,01 %, Zn ≤ 0,02 %, Ti ≤ 0,04 %, B ≤ 50 ppm, wobei Titan zur Kornfeinung bis zu einem Wert von 0,04 Gew.-% auch bewusst hinzulegiert werden kann.The impurities of the alloy of the lithoband have according to a further embodiment the following limits: Cr ≤ 0.01%, Zn ≤ 0.02%, Ti ≤ 0.04%, B ≤ 50 ppm, wherein titanium for grain refining up to a value of 0.04 wt .-% can also be added deliberately hinzulegiert.

Für die Vorteile der bevorzugten Legierungszusammensetzungen wird auf die entsprechenden Ausführungen bezüglich des Lithobands verwiesen.For the advantages of the preferred alloy compositions, reference is made to the corresponding explanations regarding the lithoband.

Die Gefügeeigenschaften des Lithobands können in einer weiteren Ausführungsform des Verfahrens dadurch verbessert werden, dass das Lithoband vor dem Kaltwalzen warmgewalzt wird und optional vor dem Warmwalzen eine Homogenisierungsbehandlung und/oder während des Kaltwalzens eine Zwischenglühung durchgeführt wird.In another embodiment of the method, the structural properties of the lithographic strip can be improved by hot-rolling the lithoband before cold-rolling and, optionally, homogenizing treatment before hot-rolling and / or intermediate annealing during cold-rolling.

Die oben genannte Aufgabe wird gemäß einer weiteren Lehre der vorliegenden Erfindung auch durch einen Druckplattenträger gelöst, welcher eine Topografie aufweist, deren maximale Peakhöhe Rp und/oder Sp maximal 1,4 µm, bevorzugt maximal 1,2 µm, insbesondere maximal 1,0 µm, beträgt. Bevorzugt ist der Druckplattenträger aus einem erfindungsgemäßen Lithoband hergestellt.The above object is achieved according to a further teaching of the present invention by a pressure plate carrier having a topography whose maximum peak height Rp and / or Sp at most 1.4 microns, preferably at most 1.2 microns, in particular at most 1.0 microns , is. The printing plate carrier is preferably produced from a lithoband according to the invention.

In einer bevorzugten Ausführungsform des Druckplattenträgers weist dieser eine photosensitive Beschichtung mit einer Dicke von weniger als 2 µm, vorzugsweise von weniger als 1 µm auf. Die hohen Walzstege bisheriger Lithobleche führten besonders bei dünnen photosensitiven Beschichtungen zu Druckfehlern, so dass sich in diesem Fall eine besondere Verbesserung der Druckplattenqualität ergibt. Bevorzugt weist der Druckplattenträger eine transparente photosensitive Schicht auf, welche Vorteile bei der Belichtung bietet. Bei diesen Schichten kann die vollständige Bedeckung des Druckplattenträgers erst spät nach dem Druck festgestellt werden, so dass fehlerhafte Druckplattenträger höhere Kosten verursachen. Durch die Verbesserung der Topografie und die damit verbundenen Reduzierung der Druckfehler können die Kosten durch Druckfehler daher stark reduziert werden.In a preferred embodiment of the printing plate support, the latter has a photosensitive coating with a thickness of less than 2 μm, preferably of less than 1 μm. The high rolling webs of previous litho sheets led to printing errors especially with thin photosensitive coatings, so that in this case results in a special improvement of the printing plate quality. Preferably, the printing plate support has a transparent photosensitive layer, which offers advantages in the exposure. In these layers, the complete coverage of the printing plate support can be detected only late after printing, so that faulty printing plate supports cause higher costs. By improving the topography and the associated reduction in printing errors, the costs can be greatly reduced by printing errors.

Der Druckplattenträger kann bevorzugt eine Breite von 200 mm bis 2800 mm, weiter bevorzugt von 800 mm bis 1900 mm, insbesondere von 1700 mm bis 1900 mm, und eine Länge von 300 bis 1200 mm, insbesondere 800 mm bis 1200 mm, aufweisen.The printing plate support may preferably have a width of 200 mm to 2800 mm, more preferably from 800 mm to 1900 mm, in particular from 1700 mm to 1900 mm, and a length of 300 to 1200 mm, in particular 800 mm to 1200 mm.

Der erfindungsgemäße Druckplattenträger kann bevorzugt in der CtP-Technik, d.h. für eine CtP-Druckplatte verwendet werden. Bei der CtP-Technik ist die Oberflächenstruktur des Druckplattenträgers besonders kritisch, da die flachen Aufraustrukturen bzw. die relativ dünne photosensitive Beschichtung bei hohen Walzstegen vermehrt zu Druckfehlern führen können. Zudem werden in der CtP-Technik häufig transparente photosensitive Schichten mit den zuvor genannten Problemen eingesetzt. Durch die im Vergleich zu Druckplattenträgern aus dem Stand der Technik flache Topografie des erfindungsgemäßen Druckplattenträgers können die Druckqualität damit verbessert und die Kosten reduziert werden.The printing plate support according to the invention may preferably be in the CtP technique, i. used for a CtP printing plate. In the CtP technique, the surface structure of the printing plate support is particularly critical, since the flat Aufraustrukturen or the relatively thin photosensitive coating at high rolling webs can increasingly lead to printing errors. In addition, the CtP technique often uses transparent photosensitive layers with the aforementioned problems. As a result of the flat topography of the printing plate support according to the invention compared with printing plate supports from the prior art, the print quality can be improved and the costs can be reduced.

Weitere Merkmale und Vorteile der vorliegenden Erfindung ergeben sich aus der nachfolgenden Beschreibung von Ausführungsbeispielen des erfindungsgemäßen Lithobands und des erfindungsgemäßen Verfahrens, wobei auf die beigefügte Zeichnung Bezug genommen wird. In der Zeichnung zeigen

Fig. 1
eine schematische Darstellung der Bestimmung der maximalen Peakhöhe Rp und der reduzierten Peakhöhe Rpk nach DIN EN ISO 13 565,
Fig. 2
ein Ausführungsbeispiel des erfindungsgemäßen Verfahrens,
Fig. 3
die Ergebnisse einer Topografiemessung einer Lithobandoberfläche nach dem letzten Kaltwalzstich,
Fig. 4
ein Profil aus der in Fig. 3 dargestellten Topografiemessung,
Fig. 5
die Ergebnisse einer Topografiemessung der Lithobandoberfläche aus Fig. 3 nach Durchführung eines Ausführungsbeispiels des erfindungsgemäßen Verfahrens,
Fig. 6
ein Profil aus der in Fig. 5 dargestellten Topografiemessung,
Fig. 7
die Ergebnisse einer Topografiemessung einer Lithobandoberfläche nach dem letzten Kaltwalzstich und
Fig. 8
die Ergebnisse einer Topografiemessung der Lithobandoberfläche aus Fig. 7 nach Durchführung eines Ausführungsbeispiels des erfindungsgemäßen Verfahrens.
Further features and advantages of the present invention will become apparent from the following description of embodiments of the litho strip according to the invention and the method according to the invention, reference being made to the accompanying drawings. In the drawing show
Fig. 1
a schematic representation of the determination of the maximum peak height Rp and the reduced peak height R pk according to DIN EN ISO 13 565,
Fig. 2
an embodiment of the method according to the invention,
Fig. 3
the results of a topography measurement of a lithoband surface after the last cold roll pass,
Fig. 4
a profile from the in Fig. 3 illustrated topography measurement,
Fig. 5
the results of a topography measurement of the lithoband surface Fig. 3 after carrying out an embodiment of the method according to the invention,
Fig. 6
a profile from the in Fig. 5 illustrated topography measurement,
Fig. 7
the results of a topography measurement of a lithoband surface after the last cold roll pass and
Fig. 8
the results of a topography measurement of the lithoband surface Fig. 7 after carrying out an embodiment of the method according to the invention.

Fig. 1 zeigt eine schematische Darstellung der Bestimmung der maximalen Peakhöhe Rp sowie der reduzierten Peakhöhe Rpk nach DIN EN ISO 13 565. Fig. 1 shows a schematic representation of the determination of the maximum peak height Rp and the reduced peak height R pk according to DIN EN ISO 13 565th

Im linken Bereich 2 der Fig. 1 ist eine eindimensionale Profilfunktion Z(x) in einem Intervall mit den Grenzen 0 und L aufgetragen. Die Funktion Z(x) liefert zu jedem Punkt x einen Wert Z(x), welcher der lokalen Position der tatsächlichen Oberfläche, d.h. der Höhenabweichung der Oberfläche von der mittleren Oberfläche bei <Z (x) > = 0 µm entspricht.In the left area 2 of the Fig. 1 a one-dimensional profile function Z (x) is plotted in an interval with the limits 0 and L. The function Z (x) supplies at each point x a value Z (x), which is the local position of the actual surface, ie the height deviation of the Surface from the mean surface at <Z (x)> = 0 microns corresponds.

Im rechten Bereich 4 der Fig. 1 ist die sogenannte Abbott-Firestone-Kurve ZAF (Q) 6 aufgetragen. Bei dieser Kurve handelt es sich um die kumulative Wahrscheinlichkeitsdichtefunktion des Oberflächenprofils Z (x). Sie liefert zu einem prozentualen Wert Q zwischen 0 und 100 % (aufgetragen auf der Abszisse) denjenigen Höhenwert ZAF, über dem sich der entsprechende prozentuale Anteil der Oberfläche befindet. Die Abbott-Firestone-Kurve ZAF (Q) kann damit implizit durch folgende Gleichung definiert werden: Q = 1 L Z x Z AF Q x

Figure imgb0006
In the right area 4 of the Fig. 1 the so-called Abbott-Firestone curve Z AF (Q) 6 is plotted. This curve is the cumulative probability density function of the surface profile Z (x). It provides for a percentage value Q between 0 and 100% (plotted on the abscissa) that height value Z AF above which the corresponding percentage of the surface is located. The Abbott-Firestone curve Z AF (Q) can thus be implicitly defined by the following equation: Q = 1 L Z x Z AF Q x
Figure imgb0006

L ist die Länge des gemessenen Profils Z(x), d.h. die Größe des Definitionsbereichs von Z(x). Der Integrationsbereich ist der Teil der Gesamtlänge, für den die Ungleichung Z(x) ≥ ZAF(Q) erfüllt ist.L is the length of the measured profile Z (x), ie the size of the domain of Z (x). The integration range is the part of the total length for which the inequality Z (x) ≥ Z AF (Q) is satisfied.

Indem eine Tangente 8 durch den Wendepunkt der Abbott-Firestone-Kurve 6 gelegt wird, kann durch die Schnittpunkte dieser Tangente 8 mit der 0%-Linie 10 und der 100%-Linie 12 ein Kernbereich der Oberfläche definiert werden, dessen Ausdehnung als Kernrauheitstiefe Rk bezeichnet wird. Die gemittelte Höhe der aus dem Kernbereich herausragenden Spitzen wird als reduzierte Peakhöhe Rpk und die gemittelte Tiefe der aus dem Kernbereich herausragenden Riefen als reduzierte Riefentiefe Rvk bezeichnet. Weiterhin ist in Fig. 1 auch die maximale Peakhöhe Rp eingezeichnet, welche dem Abstand der höchsten Spitze zum Mittelwert bei 0 µm entspricht.By placing a tangent 8 through the inflection point of the Abbott-Firestone curve 6, the intersections of this tangent 8 with the 0% line 10 and the 100% line 12 can define a core area of the surface whose extent is the kernel roughness depth R k is designated. The average height of the peaks protruding from the core region is referred to as the reduced peak height R pk and the average depth of the grooves protruding from the core region is referred to as the reduced groove depth R vk . Furthermore, in Fig. 1 also the maximum peak height Rp drawn, which the Distance of the highest peak to the mean at 0 microns corresponds.

Die maximale Peakhöhe Rp bzw. die reduzierte Peakhöhe Rpk kann in der Praxis beispielsweise aus an verschiedenen Positionen des Lithobandes quer zur Walzrichtung gemessenen Profilen Z(x) bestimmt werden.In practice, the maximum peak height Rp or the reduced peak height R pk can be determined, for example, from profiles Z (x) measured at different positions of the lithoband transversely to the rolling direction.

Die reduzierte Peakhöhe Spk kann in der Praxis entsprechend aus einer Flächenmessung bestimmt werden. Die Berechnung erfolgt analog zur reduzierten Peakhöhe Rpk, wobei die Abbott-Firestone-Kurve ZAF (Q) für Spk implizit durch folgende Gleichung definiert werden kann: Q = 1 A Z x y Z AF Q dxdy

Figure imgb0007
The reduced peak height S pk can be determined in practice from a surface measurement accordingly. The calculation is analogous to the reduced peak height R pk , where the Abbott-Firestone curve Z AF (Q) for S pk can be implicitly defined by the following equation: Q = 1 A Z x y Z AF Q dxdy
Figure imgb0007

A ist die Größe der gemessenen Fläche, d.h. die Größe des Definitionsbereichs von Z (x,y). Der Integrationsbereich ist der Teil der Gesamtfläche, für den die Ungleichung Z (x,y) ≥ ZAF(Q) erfüllt ist.A is the size of the measured area, ie the size of the domain of Z (x, y). The integration range is the part of the total area for which the inequality Z (x, y) ≥ Z AF (Q) is satisfied.

Fig. 2 zeigt ein Ausführungsbeispiel des erfindungsgemäßen Verfahrens zur Herstellung eines Lithobandes. Bei dem Verfahren 20 wird in einem ersten Schritt 22 zunächst eine Aluminiumlegierung, beispielsweise eine AA1050, AA1100, AA3103 oder AlMg0.5 Legierung, bevorzugt eine Legierung mit der folgenden Zusammensetzung in Gew.-%: 0,3 % ≤ Fe ≤ 1,0 %, 0,05 % ≤ Mg ≤ 0,6 %, 0,05 % ≤ Si ≤ 0,25 %, Mn ≤ 0,05 %, Cu ≤ 0,04 %, Rest Al sowie unvermeidbare Verunreinigungen, einzeln max. 0,05 %, in Summe max. 0,15 %, gegossen. Das Gießen kann generell kontinuierlich oder diskontinuierlich erfolgen, insbesondere in einem kontinuierlichen, halbkontinuierlichen oder diskontinuierlichen Stranggussverfahren. In einem optionalen Schritt 24 kann das Gießprodukt, d.h. insbesondere der Gussbarren oder das Gussband, vor einer weiteren Bearbeitung einer Homogenisierungsbehandlung unterzogen werden, beispielsweise im Temperaturbereich zwischen 480 und 620 °C für mindestens zwei Stunden. Im nachfolgenden Schritt 26 wird das Gießprodukt optional warmgewalzt, vorzugsweise auf eine Dicke zwischen 7 mm und 2 mm. Auf das Warmwalzen kann beispielsweise bei einem im Doppelbandguss-Verfahren hergestellten Lithoband verzichtet werden. Anschließend wird das Warmband dann im Schritt 28 kaltgewalzt, insbesondere auf eine Dicke zwischen 0,5 und 0,1 mm. Während des Kaltwalzens kann optional eine Zwischenglühung erfolgen. Nach dem letzten Kaltwalzstich wird das Lithoband in Schritt 30 einer Entfettungsbehandlung mit Beizschritt mit einem wässrigen Beizmedium unterzogen, wobei das wässrige Beizmedium mindestens 1,5 bis 3 Gew.-% eines Gemisches aus 5 - 40 % Natriumtripolyphosphat, 3 - 10 % Natriumgluconat, 3 - 8 % nicht-ionischen und anionischen Tensiden und optional 0,5 - 70 % Soda enthält, wobei die Natriumhydroxid-Konzentration im wässrigen Beizmedium zwischen 0,1 und 5 Gew.-%, insbesondere zwischen 2 und 3,5 Gew.-%, beträgt, die Entfettungsbehandlung mit Beizschritt bei Temperaturen zwischen 70 und 85 °C für eine Dauer zwischen 1 und 3,5 s erfolgt und ein Flächenabtrag durch die Entfettungsbehandlung mit Beizschritt von mindestens 0,25 g/m2 eingestellt wird. Fig. 2 shows an embodiment of the method according to the invention for producing a lithographic strip. In the method 20, in a first step 22, first an aluminum alloy, for example an AA1050, AA1100, AA3103 or AlMg0.5 alloy, preferably an alloy having the following composition in% by weight: 0.3% ≤ Fe ≤ 1.0%, 0.05% ≤ Mg ≤ 0.6%, 0.05% ≤ Si ≤ 0.25%, Mn ≤ 0.05%, Cu ≤ 0.04%, Residual Al and unavoidable impurities, individually max. 0.05%, in total max. 0.15%, cast. Casting may generally be continuous or batch, especially in a continuous, semi-continuous or discontinuous continuous casting process. In an optional step 24, the cast product, ie in particular the cast ingot or the cast strip, may be subjected to a homogenization treatment before further processing, for example in the temperature range between 480 and 620 ° C. for at least two hours. In the subsequent step 26, the cast product is optionally hot rolled, preferably to a thickness between 7 mm and 2 mm. Hot rolling can be dispensed with, for example, in a lithoband produced in the double-belt casting process. Subsequently, the hot strip is then cold rolled in step 28, in particular to a thickness between 0.5 and 0.1 mm. During cold rolling, an intermediate annealing can optionally be carried out. After the last cold rolling pass, the lithoband is subjected to a pickling step in a degreasing treatment with an aqueous pickling medium, wherein the aqueous pickling medium contains at least 1.5 to 3% by weight of a mixture of 5-40% sodium tripolyphosphate, 3-10% sodium gluconate, 3 Contains 8% nonionic and anionic surfactants and optionally 0.5-70% soda, the sodium hydroxide concentration in the aqueous pickling medium being between 0.1 and 5% by weight, in particular between 2 and 3.5% by weight , is the degreasing treatment with pickling step at temperatures between 70 and 85 ° C for a period between 1 and 3.5 s and a surface removal by the degreasing treatment with pickling step of at least 0.25 g / m 2 is set.

Durch den gewählten Flächenabtrag können hohe Walzstege in der Bandoberfläche so weit reduziert werden, dass das Lithoband nach der Entfettungsbehandlung mit Beizschritt eine Topografie aufweist, deren maximale Peakhöhe Rp und/oder Sp maximal 1,4 µm, bevorzugt maximal 1,2 µm, insbesondere maximal 1,0 µm, beträgt und sich besonders für CtP-Druckplattenträger eignet.Due to the selected surface removal, high rolling webs in the strip surface can be reduced so far that the litho strip after the degreasing treatment with pickling step has a topography whose maximum peak height Rp and / or S p is at most 1.4 μm, preferably at most 1.2 μm, in particular maximum 1.0 μm, and is particularly suitable for CtP pressure plate carrier.

In Fig. 3 sind die Ergebnisse einer 3D-Topografiemessung einer Lithobandoberfläche nach dem letzten Kaltwalzstich dargestellt. Die Figur zeigt eine dreidimensionale Ansicht der Oberflächenfunktion Z(x,y) auf einem quadratischen Bereich mit der Seitenlänge 800 µm. Die Höheninformation kann zusätzlich der Skala rechts in Fig. 3 entnommen werden. Die y-Achse liegt parallel zur Walzrichtung des Lithobandes. Es zeigt sich, dass das Lithoband längs zur Walzrichtung, d.h. entlang der y-Achse, hohe Walzstege aufweist, die deutlich als helle Erhebungen zu erkennen sind. Diese Walzstege können den Auftrag einer photosensitiven Schicht stören oder sogar lokal verhindern, so dass sich beim Einsatz der aus diesen Lithobändern hergestellten Druckplattenträger Druckfehler ergeben können.In Fig. 3 The results of a 3D topography measurement of a lithoband surface after the last cold roll pass are shown. The figure shows a three-dimensional view of the surface function Z (x, y) on a square area with the side length of 800 microns. The height information can additionally be the scale right in Fig. 3 be removed. The y-axis lies parallel to the rolling direction of the lithoband. It can be seen that the litho strip along the rolling direction, ie along the y-axis, has high rolling webs, which are clearly visible as bright elevations. These rolling webs can interfere with the application of a photosensitive layer or even prevent locally, so that printing errors can occur when using the printing plate carrier produced from these litho tapes.

Fig. 4 zeigt ein Profil Z(x) aus der in Fig. 3 dargestellten Topografiemessung, d.h. einen Schnitt aus der Topografiemessung parallel zur x-Achse. Es ist deutlich zu erkennen, dass die Walzstege in dem Lithoband nach dem Kaltwalzen eine Höhe von mehr als 1,6 µm aufweisen können. Diese hohen Walzstege haben auf den Wert der mittleren Rauheit Ra des Lithobandes jedoch nur einen geringen Einfluss. Fig. 4 shows a profile Z (x) from the in Fig. 3 represented topography measurement, ie a section from the topography measurement parallel to the x-axis. It can be clearly seen that the roll webs in the litho strip after the Cold rolls may have a height of more than 1.6 microns. However, these high rolling webs have only a small influence on the value of the mean roughness R a of the lithoband.

In Fig. 5 sind die Ergebnisse einer Topografiemessung an der Lithobandoberfläche aus Fig. 3 nach Durchführung eines Ausführungsbeispiels des erfindungsgemäßen Verfahrens, d.h. nach der Entfettungsbehandlung mit Beizschritt gemäß dem erfindungsgemäßen Verfahren dargestellt. In Fig. 5 ist im Wesentlichen der gleiche Bereich des Lithobandes gezeigt wie in Fig. 3. Fig. 6 zeigt analog zu Fig. 4 ein zugehöriges Profil Z(x) aus der in Fig. 5 gezeigten Topografiemessung.In Fig. 5 are the results of a topography measurement on the lithoband surface Fig. 3 after carrying out an embodiment of the method according to the invention, ie after the degreasing treatment with pickling step according to the method according to the invention. In Fig. 5 is shown essentially the same area of the litho ribbon as in Fig. 3 , Fig. 6 shows analogously to Fig. 4 an associated profile Z (x) from the in Fig. 5 shown topography measurement.

Die Figuren 5 und 6 zeigen, dass durch die Entfettungsbehandlung mit Beizschritt insbesondere die hohen Walzstege deutlich reduziert werden können. Die maximale Peakhöhe Rp liegt in Fig. 6 nun nur noch bei 1,3 µm und damit deutlich unterhalb der maximalen Peakhöhe Rp des unbehandelten Lithobands entsprechend Fig. 4.The Figures 5 and 6 show that can be significantly reduced by the degreasing treatment with pickling step especially the high roll webs. The maximum peak height Rp is in Fig. 6 now only at 1.3 microns and thus significantly below the maximum peak height R p of the untreated litho strip accordingly Fig. 4 ,

Durch das erfindungsgemäße Verfahren ist es demnach möglich, eine Bandoberfläche herzustellen, deren maximale Peakhöhe Rp und/oder Sp max. 1,4 µm, bevorzugt max. 1,2 µm, insbesondere max. 1,0 µm, beträgt.The inventive method, it is therefore possible to produce a strip surface, the maximum peak height Rp and / or Sp max. 1.4 μm, preferably max. 1.2 μm, in particular max. 1.0 μm.

Um praktisch sicherzustellen, dass bei der Produktion der Lithobänder die maximalen Peakhöhen Rp eingehalten werden, können beispielsweise drei Messungen eines Profils quer zur Walzrichtung jeweils außen und in der Mitte des Bandes erfolgen, wobei die Länge des Profils beispielsweise 4,8 mm betragen kann. Der Wert für Sp kann anhand einer quadratischen Flächenmessung mit der Seitenlänge von 800 µm bestimmt werden.In order to practically ensure that the maximum peak heights Rp are maintained during the production of the litho tapes, three measurements of a profile transverse to the rolling direction can be made, for example, on the outside and in the middle of the strip, whereby the length of the profile can be 4.8 mm, for example. The value for Sp can be determined by means of a square area measurement with the side length of 800 microns can be determined.

Wie ein Vergleich der Fig. 4 und 6 zeigt, wurde die mittlere Rauheit Ra durch die Entfettungsbehandlung mit Beizschritt kaum beeinflusst. Dieser Parameter, auf den bei der konventionellen Herstellung und Charakterisierung von Lithobändern abgestellt wurde, ist demnach nicht geeignet, das Vorliegen störender Walzstege im Lithoband anzuzeigen. Demgegenüber ist die Qualität der Lithobandoberfläche über die Rauheitskennwerte der maximalen Peakhöhe Rp und/oder Sp besser einstellbar.Like a comparison of Fig. 4 and 6 shows the mean roughness Ra by the degreasing treatment with pickling step was hardly affected. This parameter, which was used in the conventional production and characterization of lithographic ribbons, is therefore not suitable for indicating the presence of disturbing roll webs in the lithoband. In contrast, the quality of the lithoband surface can be better adjusted by way of the roughness characteristics of the maximum peak height Rp and / or S p .

In den Figs. 7 und 8 sind ebenfalls 3D-Topografiemessungen einer Lithobandoberfläche mit der Länge 2146,9 µm und der Breite 2071,7 µm dargestellt, und zwar unmittelbar nach dem letzten Kaltwalzstich (Fig. 7) und nach Durchführung einer Entfettungsbehandlung mit Beizschritt gemäß dem erfindungsgemäßen Verfahren (Fig. 8). Die y-Achse liegt wiederum parallel zur Walzrichtung des Lithobandes. Aus dem Vergleich der Fig. 8 mit der Fig. 7 wird ersichtlich, dass die in Fig. 7 vorhandenen hohen Walzstege längs zur Walzrichtung durch die Entfettungsbehandlung mit Beizschritt stark reduziert werden können, so dass sich eine verbesserte Lithobandoberfläche ergibt.In the Figs. 7 and 8th are also shown 3D topography measurements of a lithoband surface with the length 2146.9 microns and the width 2071.7 microns, immediately after the last cold roll pass ( Fig. 7 ) and after carrying out a degreasing treatment with pickling step according to the method of the invention ( Fig. 8 ). The y-axis is in turn parallel to the rolling direction of the lithoband. From the comparison of Fig. 8 with the Fig. 7 it will be seen that the in Fig. 7 existing high rolling webs along the rolling direction can be greatly reduced by the degreasing treatment with pickling step, so that there is an improved lithoband surface.

Ein Lithoband mit einer wie in den Figuren 5, 6 bzw. 8 gezeigten Oberflächentopografie kann insbesondere vorteilhaft als Druckplattenträger mit sehr flachen Aufraustrukturen und/oder bei sehr dünnen photosensitiven Beschichtungen, wie beispielsweise in der CtP-Technik, eingesetzt werden. Weitere Merkmale und Eigenschaften der Erfindung können auch den im Folgenden dargestellten Ergebnissen von Rauheitsmessungen an Ausführungsbeispielen des erfindungsgemäßen Lithobands entnommen werden.A litho ribbon with a like in the Figures 5 . 6 or 8 shown surface topography can be used particularly advantageous as printing plate support with very flat Aufraustrukturen and / or in very thin photosensitive coatings, such as in the CtP technique. Further features and properties of the invention can also be taken from the results of roughness measurements of embodiments of the lithographic strip according to the invention which are shown below.

Lithobänder, deren Aluminiumlegierung neben herstellungsbedingten Verunreinigungen die folgenden Legierungsgehalte in Gew.-% aufweisen: 0,30 % ≤ Fe ≤ 0,40 %, 0,10 % ≤ Mg ≤ 0,30 %, 0,05 % ≤ Si ≤ 0,25 %, Mn ≤ 0,05 %, Cu ≤ 0,04 %, Rest Al, wurden auf eine Enddicke von 0,14 mm, 0,28 mm bzw. 0,38 mm kaltgewalzt. Bei der Entfettungsbehandlung mit gleichzeitigem Beizschritt wurden identische Parameter eingestellt wie im Ausführungsbeispiel aus Fig. 2.Litho tapes whose aluminum alloys contain, in addition to production-related impurities, the following alloy contents in% by weight: 0.30% ≤ Fe ≤ 0.40%, 0.10% ≤ Mg ≤ 0.30%, 0.05% ≤ Si ≤ 0.25%, Mn ≤ 0.05%, Cu ≤ 0.04%, Rest al, were cold rolled to a final thickness of 0.14 mm, 0.28 mm and 0.38 mm, respectively. In the degreasing treatment with simultaneous pickling step, identical parameters were set as in the embodiment Fig. 2 ,

Vor und nach der Entfettungsbehandlung wurden Rauheitsmessungen an den Oberseiten der Lithobänder durchgeführt, und zwar sowohl in den Randbereichen als auch in der Mitte der Lithobänder. Bei den Rauheitsmessungen wurden jeweils die mittlere Rauheit Sa, die reduzierte Riefentiefe Svk, die reduzierte Peakhöhe Spk und die maximale Peakhöhe Sp ermittelt. Die Ergebnisse für das Lithoband mit 0,14 mm Dicke sind in Tabelle 1 dargestellt. Tabelle 1 Messposition Zeitpunkt der Messung Sa Svk Spk Sp Randbereich vor der Entfettung 0,22 0,23 0,35 1, 9 nach der Entfettung 0,21 0,27 0,33 1,0 Mitte vor der Entfettung 0,21 0,26 0,35 1,6 nach der Entfettung 0,21 0,26 0,32 1,0 Before and after the degreasing treatment, roughness measurements were made on the tops of the litho tapes both in the margins and in the middle of the litho tapes. In the roughness measurements, the average roughness S a , the reduced groove depth S vk , the reduced peak height S pk and the maximum peak height Sp were determined in each case. The results for the 0.14 mm thick litho tape are shown in Table 1. <b> Table 1 </ b> measuring position Time of measurement S a S vk S pk P border area before degreasing 0.22 0.23 0.35 1, 9 after degreasing 0.21 0.27 0.33 1.0 center before degreasing 0.21 0.26 0.35 1.6 after degreasing 0.21 0.26 0.32 1.0

Im Stand der Technik wird zur Charakterisierung der Lithobänder bisher die mittlere Flächenrauheit Sa verwendet. Tabelle 1 zeigt, dass dieser Rauheitskennwert nicht geeignet ist, die Wirkung der erfindungsgemäßen Entfettungsbehandlung mit Beizschritt bzw. die Oberflächenqualität der Lithobänder hinsichtlich einzelner hoher Walzstege darzustellen. Sein Wert ist nach der Entfettungsbehandlung mit Beizschritt im Wesentlichen unverändert. Auch die reduzierte Riefentiefe Svk ist als Indikator für hohe Walzstege ersichtlich ungeeignet. Demgegenüber werden die Werte für die maximale Peakhöhe Sp deutlich reduziert und zeigen damit die Verbesserung der Lithobandoberfläche im Hinblick auf die störenden hohen Walzstege an. Eine Optimierung der Lithobänder bzw. des Verfahrens zu deren Herstellung anhand des Rauheitskennwerts Sp führt demnach zu einer besonders geringen Anfälligkeit für die zuvor genannten Druckfehler. Auch die reduzierte Peakhöhe Spk wird durch die Entfettungsbehandlung mit Beizschritt verringert und kann als zusätzlicher Rauheitskennwert verwendet werden. Tabelle 2 Sp (Rand) Sp (Mitte) Banddicke vor der Entfettung nach der Entfettung vor der Entfettung nach der Entfettung 0,14 mm 1,9 1,0 1,67 1,1 0,28 mm 1, 61 1,2 1,38 1,1 0,38 mm 1,3 1,0 1,3 1, 1 In the prior art, the mean surface roughness S a has hitherto been used to characterize the lithographic ribbons. Table 1 shows that this roughness parameter is not suitable for representing the effect of the degreasing treatment according to the invention with pickling step or the surface quality of the lithographic strips with respect to individual high rolling webs. Its value is essentially unchanged after the degreasing treatment with pickling step. The reduced groove depth S vk is also unsuitable as an indicator for high rolling webs. In contrast, the values for the maximum peak height S p are significantly reduced and thus indicate the improvement of the lithoband surface with regard to the disturbing high rolling webs. An optimization of the lithographic ribbons or of the method for their production on the basis of the roughness characteristic value S p accordingly leads to a particularly low susceptibility to the aforementioned printing errors. The reduced peak height S pk is also reduced by the pickling step degreasing treatment and can be used as an additional roughness parameter. <b> Table 2 </ b> S p (edge) S p (middle) strip thickness before degreasing after degreasing before degreasing after degreasing 0.14 mm 1.9 1.0 1.67 1.1 0.28 mm 1, 61 1.2 1.38 1.1 0.38 mm 1.3 1.0 1.3 1, 1

In Tabelle 2 sind die Ergebnisse für die maximale Peakhöhe Sp aus den Rauheitsmessungen an Lithobändern verschiedener Dicke gegenübergestellt. Insbesondere die Lithobänder mit Banddicken 0,3 mm bis 0,1 mm profitieren deutlich von dem erfindungsgemäßen Verfahren, da diese direkt nach dem letzten Kaltwalzstich relativ große Sp-Werte von mehr als 1,5 µm aufweisen und damit anfällig für die zuvor genannten Druckfehler sind. Durch die Entfettungsbehandlung mit Beizschritt kann die maximale Peakhöhe Sp für alle gemessenen Banddicken im Wesentlichen auf denselben Wert reduziert werden. Folglich kann die Oberflächenqualität dünner Lithobänder mit dem Verfahren gemäß der vorliegenden Erfindung besonders gut verbessert werden.Table 2 compares the results for the maximum peak height S p from the roughness measurements on litho ribbons of different thicknesses. In particular, the litho tapes with strip thicknesses of 0.3 mm to 0.1 mm clearly benefit from the process according to the invention, since they have relatively large S p values of more than 1.5 μm directly after the last cold rolling pass and are thus susceptible to the aforementioned printing defects are. By means of the degreasing treatment with pickling step, the maximum peak height Sp can be reduced substantially to the same value for all measured strip thicknesses. Consequently, the surface quality of thin lithographic ribbons can be improved particularly well with the method according to the present invention.

Die Ergebnisse in den Tabellen 1 und 2 zeigen weiterhin, dass insbesondere an den Bandrändern hohe Walzstege auftreten. Daher kann die Entfettungsbehandlung mit Beizschritt beispielsweise auch selektiv im Randbereich der Lithobänder erfolgen. Tabelle 3 Zeitpunkt der Messung Sa Svk Spk Sp vor der Entfettung 0,22 0,23 0,43 1,51 nach der Entfettung 0,21 0,24 0,37 1,13 The results in Tables 1 and 2 also show that high rolling webs occur, in particular at the strip edges. Therefore, for example, the degreasing treatment with pickling step can also be carried out selectively in the edge region of the litho tapes. <b> Table 3 </ b> Time of measurement S a S vk S pk P before degreasing 0.22 0.23 0.43 1.51 after degreasing 0.21 0.24 0.37 1.13

In Tabelle 3 sind die Rauheitskennwerte Sa, Svk, Spk und Sp gemittelt über Lithobänder verschiedener Dicke wiedergegeben. Die Ergebnisse zeigen deutlich, dass die bisher zur Charakterisierung von Lithobändern herangezogene mittlere Rauheit Sa nicht geeignet ist, die Güte einer Lithobandoberfäche hinsichtlich der störenden hohen Walzstege zu verbessern. Demgegenüber zeigen die Werte der maximalen Peakhöhe Rp und/oder Sp und der reduzierten Peakhöhe Rpk und/oder Spk nach der Entfettungsbehandlung mit Beizschritt eine deutliche Reduzierung, so dass das Lithoband bzw. das Verfahren zu dessen Herstellung durch eine Optimierung hinsichtlich des Parameters Rp und/oder Sp, ggf. in Kombination mit Rpk und/oder Spk, deutlich verbessert werden kann.Table 3 shows the roughness characteristics S a , S vk , S pk and Sp averaged over litho tapes of different thicknesses. The results clearly show that the average roughness S a previously used for the characterization of litho tapes is not suitable for improving the quality of a litho strip surface with regard to the disturbing high roll webs. In contrast, the values of the maximum peak height Rp and / or Sp and the reduced peak height R pk and / or S pk after the degreasing treatment with pickling step show a significant reduction, so that the lithoband or the method for its production by an optimization with respect to the parameter Rp and / or Sp, possibly in combination with R pk and / or S pk , can be significantly improved.

Zur Herstellung des erfindungsgemäßen Lithobands kann beispielsweise das erfindungsgemäße Verfahren verwendet werden. Jedoch ist das erfindungsgemäße Lithoband nicht auf dieses Herstellungsverfahren beschränkt. Auf Grundlage der vorliegenden Erfindung kann der Fachmann durch eine Optimierung auf den Rauheitskennwert Rp und/oder Sp auch weitere Verfahren entwickeln, um zu einem erfindungsgemäßen Lithoband zu gelangen.For the production of the litho strip according to the invention, for example, the method according to the invention can be used. However, the lithoband of the present invention is not limited to this production method. On the basis of the present invention, by optimizing the roughness index Rp and / or Sp, the person skilled in the art can also develop further methods in order to arrive at a lithoband according to the invention.

Claims (16)

Lithoband für die elektrochemische Aufrauung, bestehend aus einer gewalzten Aluminiumlegierung,
dadurch gekennzeichnet, dass die Bandoberfläche eine Topografie aufweist, deren maximale Peakhöhe Rp und/oder Sp maximal 1,4 µm, bevorzugt maximal 1,2 µm, insbesondere maximal 1,0 µm, beträgt.
Lithoband for electrochemical roughening, consisting of a rolled aluminum alloy,
characterized in that the strip surface has a topography whose maximum peak height R p and / or Sp is at most 1.4 μm, preferably at most 1.2 μm, in particular at most 1.0 μm.
Lithoband nach Anspruch 1,
dadurch gekennzeichnet, dass die Bandoberfläche eine Topografie aufweist, deren reduzierte Peakhöhe Rpk und/oder Spk maximal 0,4 µm, bevorzugt maximal 0,37 µm, beträgt.
Lithoband according to claim 1,
characterized in that the strip surface has a topography whose reduced peak height R pk and / or S pk is at most 0.4 μm, preferably at most 0.37 μm.
Lithoband nach Anspruch 1 oder 2,
dadurch gekennzeichnet, dass die Dicke des Lithobandes 0,5 mm bis 0,1 mm beträgt.
Lithoband according to claim 1 or 2,
characterized in that the thickness of the lithoband is 0.5 mm to 0.1 mm.
Lithoband nach einem der Ansprüche 1 bis 3,
dadurch gekennzeichnet, dass das Lithoband aus einer AA1050, AA1100, AA3103 oder AlMg0.5 Legierung besteht.
Lithoband according to one of claims 1 to 3,
characterized in that the litho strip consists of an AA1050, AA1100, AA3103 or AlMg0.5 alloy.
Lithoband nach einem der Ansprüche 1 bis 4,
dadurch gekennzeichnet, dass das Lithoband folgende Legierungszusammensetzung in Gew.% aufweist: 0,3 % ≤ Fe ≤ 1,0 %, 0,05 % ≤ Mg ≤ 0,6 %, 0,05 % ≤ Si ≤ 0,25 %, Mn ≤ 0,05 %, Cu ≤ 0, 04 %, Rest Al sowie unvermeidbare Verunreinigungen, einzeln max. 0,05 %, in Summe max. 0,15 %.
Lithoband according to one of claims 1 to 4,
characterized in that the lithoband has the following alloy composition in% by weight: 0.3% ≤ Fe ≤ 1.0%, 0.05% ≤ Mg ≤ 0.6%, 0.05% ≤ Si ≤ 0.25%, Mn ≤ 0.05%, Cu ≤ 0, 04%, Residual Al and unavoidable impurities, individually max. 0.05%, in total max. 0.15%.
Lithoband nach einem der Ansprüche 1 bis 5,
dadurch gekennzeichnet, dass das Lithoband folgende Legierungsgehalte in Gew.-% aufweist: 0,3 % ≤ Fe ≤ 0, 4 %, 0,1 % ≤ Mg ≤ 0,3 %, 0,05 % ≤ Si ≤ 0,25 %, Mn ≤ 0,05 %, Cu ≤ 0,04 %.
Lithoband according to one of claims 1 to 5,
characterized in that the litho strip has the following alloy contents in wt .-%: 0.3% ≤ Fe ≤ 0, 4%, 0.1% ≤ Mg ≤ 0.3%, 0.05% ≤ Si ≤ 0.25%, Mn ≤ 0.05%, Cu ≤ 0.04%.
Lithoband nach einem der Ansprüche 1 bis 6,
dadurch gekennzeichnet, dass die Verunreinigungen der Legierung des Lithobandes folgende Grenzwerte in Gew.-% aufweisen: Cr ≤ 0,01 %, Zn ≤ 0,02 %, Ti ≤ 0,04 %, B ≤ 50 ppm.
Lithoband according to one of claims 1 to 6,
characterized in that the impurities of the alloy of the lithoband have the following limit values in% by weight: Cr ≤ 0.01%, Zn ≤ 0.02%, Ti ≤ 0.04%, B ≤ 50 ppm.
Verfahren zur Herstellung eines Lithobandes, insbesondere eines Lithobandes nach einem der Ansprüche 1 bis 7, bei dem ein aus einer Aluminiumlegierung bestehendes Lithoband kaltgewalzt wird und bei dem das Lithoband nach dem letzten Kaltwalzstich einer Entfettungsbehandlung mit gleichzeitigem Beizschritt mit einem wässrigen Beizmedium unterzogen wird, wobei das wässrige Beizmedium mindestens 1,5 bis 3 Gew.-% eines Gemisches aus 5 - 40 % Natriumtripolyphosphat, 3 - 10 % Natriumgluconat, 3 - 8 % nicht-ionischen und anionischen Tensiden und optional 0,5 - 70 % Soda enthält und die Natriumhydroxid-Konzentration im wässrigen Beizmedium zwischen 0,1 und 5 Gew.-% beträgt,
dadurch gekennzeichnet, dass der Flächenabtrag durch die Entfettungsbehandlung mit gleichzeitigem Beizschritt mindestens 0,25 g/m2 beträgt.
Process for the production of a lithoband, in particular a lithoband according to one of claims 1 to 7, in which a lithoband consisting of an aluminum alloy is cold-rolled and in which the lithoband is subjected after the last cold-rolling pass to a degreasing treatment with a simultaneous etching step with an aqueous pickling medium, wherein the aqueous pickling medium contains at least 1.5 to 3% by weight of a mixture of 5-40% sodium tripolyphosphate, 3-10% sodium gluconate, 3-8% nonionic and anionic surfactants and optionally 0.5-70% sodium carbonate and the sodium hydroxide Concentration in the aqueous pickling medium is between 0.1 and 5% by weight,
characterized in that the surface removal by the degreasing treatment with simultaneous pickling step is at least 0.25 g / m 2 .
Verfahren nach Anspruch 8,
dadurch gekennzeichnet, dass die Natriumhydroxid-Konzentration im wässrigen Beizmedium zwischen 2 und 3,5 Gew.-% beträgt und optional die Entfettungsbehandlung mit Beizschritt bei Temperaturen zwischen 70 und 85 °C für eine Dauer zwischen 1 und 3,5 s erfolgt.
Method according to claim 8,
characterized in that the sodium hydroxide concentration in the aqueous pickling medium is between 2 and 3.5 wt .-% and optionally the degreasing treatment with pickling at temperatures between 70 and 85 ° C for a period between 1 and 3.5 s.
Verfahren nach Anspruch 8 oder 9,
dadurch gekennzeichnet, dass die Beiztemperatur zwischen 76 und 84 °C beträgt und/oder die Natriumhydroxid-Konzentration im wässrigen Beizmedium zwischen 2,6 und 3,5 Gew.-% beträgt.
Method according to claim 8 or 9,
characterized in that the pickling temperature is between 76 and 84 ° C and / or the sodium hydroxide concentration in the aqueous pickling medium is between 2.6 and 3.5 wt .-%.
Verfahren nach einem der Ansprüche 8 bis 10,
dadurch gekennzeichnet, dass die Beizdauer zwischen 1 und 2 s, bevorzugt zwischen 1,1 und 1,9 s beträgt.
Method according to one of claims 8 to 10,
characterized in that the pickling time is between 1 and 2 s, preferably between 1.1 and 1.9 s.
Verfahren nach einem der Ansprüche 8 bis 11,
dadurch gekennzeichnet, dass das Lithoband im letzten Kaltwalzstich auf eine Enddicke von 0,5 mm bis 0,1 mm gewalzt wird.
Method according to one of claims 8 to 11,
characterized in that the litho strip is rolled in the last cold rolling pass to a final thickness of 0.5 mm to 0.1 mm.
Verfahren nach einem der Ansprüche 8 bis 12,
dadurch gekennzeichnet, dass als Aluminiumlegierung AA1050, AA1100, AA3103 oder AlMg0.5 verwendet wird.
Method according to one of claims 8 to 12,
characterized in that is used as aluminum alloy AA1050, AA1100, AA3103 or AlMg0.5.
Druckplattenträger, insbesondere herstellbar aus einem Lithoband nach einem der Ansprüche 1 bis 7,
dadurch gekennzeichnet, dass der Druckplattenträger eine Topografie aufweist, deren maximale Peakhöhe Rp und/oder Sp maximal 1,4 µm, bevorzugt maximal 1,2 µm, insbesondere maximal 1,0 µm, beträgt.
Printing plate carrier, in particular producible from a litho strip according to one of claims 1 to 7,
characterized in that the printing plate support has a topography whose maximum peak height Rp and / or Sp is at most 1.4 μm, preferably at most 1.2 μm, in particular at most 1.0 μm.
Druckplattenträger nach Anspruch 14,
dadurch gekennzeichnet, dass der Druckplattenträger eine photosensitive Beschichtung mit einer Dicke von weniger als 2 µm aufweist.
Print plate carrier according to claim 14,
characterized in that the printing plate support has a photosensitive coating with a thickness of less than 2 microns.
Verwendung eines Druckplattenträgers nach Anspruch 14 oder 15 für eine CtP-Druckplatte.Use of a printing plate support according to claim 14 or 15 for a CtP printing plate.
EP10188553.1A 2010-10-22 2010-10-22 Aluminum alloy strip for electrochemical roughening and method for producing same Active EP2444254B1 (en)

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ES10188553T ES2430641T3 (en) 2010-10-22 2010-10-22 Lithographic band for electrochemical roughing and manufacturing method
RU2013123356/12A RU2537835C2 (en) 2010-10-22 2011-10-13 Lithographic band for electrochemical graining, as well as method for its manufacture
PCT/EP2011/067896 WO2012052353A1 (en) 2010-10-22 2011-10-13 Litho sheet for electrochemical roughening, and method for producing the same
CN201180050866.8A CN103228457B (en) 2010-10-22 2011-10-13 For Electrochemical roughening lithographic printing band and manufacture method thereof
JP2013534262A JP5507765B2 (en) 2010-10-22 2011-10-13 Lithographic strip for electrochemical roughening and manufacturing method thereof
KR1020137013127A KR101534293B1 (en) 2010-10-22 2011-10-13 Litho sheet for electrochemical roughening, and method for producing the same
BR112013009510A BR112013009510B8 (en) 2010-10-22 2011-10-13 LITHOGRAPHIC STRIP FOR ELECTROCHEMICAL GRINDING
US13/866,639 US20130263749A1 (en) 2010-10-22 2013-04-19 Litho Strip for Electrochemical Roughening and Method for its Manufacture
US15/466,671 US20170190204A1 (en) 2010-10-22 2017-03-22 Litho strip for electrochemical roughening and method for its manufacture

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BR112013009510A2 (en) 2016-07-26
RU2013123356A (en) 2014-11-27

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