[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

EP2337044A1 - Herstellungsverfahren eines Kontaktplättchens eines elektrischen Kontakts und eines elektrischen Kontakts - Google Patents

Herstellungsverfahren eines Kontaktplättchens eines elektrischen Kontakts und eines elektrischen Kontakts Download PDF

Info

Publication number
EP2337044A1
EP2337044A1 EP09179852A EP09179852A EP2337044A1 EP 2337044 A1 EP2337044 A1 EP 2337044A1 EP 09179852 A EP09179852 A EP 09179852A EP 09179852 A EP09179852 A EP 09179852A EP 2337044 A1 EP2337044 A1 EP 2337044A1
Authority
EP
European Patent Office
Prior art keywords
powder
contact
grains
support
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09179852A
Other languages
English (en)
French (fr)
Inventor
Gilles Rolland
Michel Jeandin
Christine Bourda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metalor Technologies International SA
Original Assignee
Metalor Technologies International SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=42138780&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP2337044(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Metalor Technologies International SA filed Critical Metalor Technologies International SA
Priority to EP09179852A priority Critical patent/EP2337044A1/de
Priority to BR112012014648A priority patent/BR112012014648A2/pt
Priority to CA2788260A priority patent/CA2788260A1/fr
Priority to PCT/EP2010/069885 priority patent/WO2011073314A1/fr
Priority to MX2012007066A priority patent/MX337345B/es
Priority to CN201080064059.7A priority patent/CN102763183B/zh
Priority to JP2012543748A priority patent/JP2013514614A/ja
Priority to US13/516,807 priority patent/US20120305300A1/en
Priority to EP10793241.0A priority patent/EP2513932B1/de
Publication of EP2337044A1 publication Critical patent/EP2337044A1/de
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/02—Coating starting from inorganic powder by application of pressure only
    • C23C24/04—Impact or kinetic deposition of particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/027—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal matrix material comprising a mixture of at least two metals or metal phases or metal matrix composites, e.g. metal matrix with embedded inorganic hard particles, CERMET, MMC.
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/048—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by powder-metallurgical processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/023—Composite material having a noble metal as the basic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/025—Composite material having copper as the basic material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts

Definitions

  • the present invention relates to the field of electrical contacts. It relates, more particularly, to a method of manufacturing an electrical contact pad and a method of manufacturing an electrical contact, as well as an electrical contact pad and an electrical contact that can be obtained by their manufacturing method. respective.
  • low voltage electrical contacts that is to say whose operating range is approximately between 10 and 1000V and between 1 and 10000A, are generally used in the domestic, industrial and automotive fields, as well as in electricity. AC current, for switches, relays, contactors and circuit breakers, etc.
  • one solution consists in using pseudoalloys comprising a matrix of silver or copper in order to make the stud, and, inserted in this matrix, a fraction consisting of approximately 10 to 50% by volume.
  • refractory particles for example, Ni, C, W, WC, CdO, SnO 2
  • the material thus obtained is more resistant to the energy released by the electric arc.
  • the pad can be obtained from powders, by compacting-sintering or compacting-sintering-extrusion-rolling-cutting. Then, the stud is assembled on a suitable contact support, very good conductor of electricity and heat, to get electrical contact.
  • the assembly of the stud on the contact support can be done by welding, brazing or riveting, for example.
  • the contact support is traditionally copper.
  • the pad being made to be resistant to welding, the assembly of the pad on the copper by welding is difficult. It is therefore necessary to add on the pad a silver bonding layer for example.
  • An object of the present invention is therefore to overcome these disadvantages by providing a method of manufacturing an electrical contact pad and methods of manufacturing an electrical contact to simplify the known methods by reducing the number of operations.
  • Another object of the present invention is to provide a method of manufacturing an electrical contact making it easier to use aluminum as an electrical contact support material.
  • a method of manufacturing at least one electrical contact pad comprising a pad support and at least one contact layer, said method comprising a step of deposition, by dynamic spraying by cold gas, of a first powder on said pad support to form said contact layer, said first powder containing at least particles comprising grains of at least one refractory material incorporated in a matrix based on conductive metal selected from silver or copper.
  • the invention relates to a method for manufacturing an electrical contact comprising a contact support and at least one contact layer, said method comprising a deposition step, by dynamic cold gas projection, of a first powder on said contact support for forming said contact layer, said first powder containing at least particles comprising grains of at least one refractory material incorporated into a conductive metal matrix selected from silver or copper.
  • the present invention also relates to an electrical contact pad that can be obtained by the method of manufacturing an electrical contact pad defined above.
  • the present invention also relates to an electrical contact that can be obtained by one or other of the methods of manufacturing an electrical contact defined above.
  • the present invention relates to a method of manufacturing at least one electrical contact pad comprising a pad support and at least one contact layer and a similar method applied to the manufacture of at least one electrical contact comprising a support of contact and at least one contact layer.
  • the methods according to the invention are distinguished first of all in that they use the cold gas dynamic projection technique to deposit a first powder on said pad support or said contact support in order to form said contact layer.
  • This technique of depositing a powder by dynamic projection by cold gas also called “cold spray” is characterized, contrary to other thermal spraying processes, by a low projection temperature and a high speed of spraying powder particles up to Mach 5.
  • the cold spray from a projection gas temperature generally not exceeding 600 ° C, does not cause melting of the particles which remain in the solid state throughout the duration of projection.
  • the particles deform plastically and agglomerate to form a deposit.
  • the advantage of the cold spray process compared to plasma spraying for example is not to overheat the particles comprising the deposit and the support, resulting in favorable low oxidation to obtain better electrical conductivity and good cohesion.
  • the cold spray process is for example described in the patent EP 0 484 533 .
  • the powder 1 with a particle size ideally comprised between 5 and 50 ⁇ m, is conveyed under pressure at the level of the spray nozzle 2 via a carrier gas, generally of the same nature as the propellant gas 3.
  • the kinetic energy input The particles are effected by means of a carrier gas which can be heated between 200 ° C and 650 ° C in order to increase the expansion and therefore its speed.
  • the powder + carrier gas mixture is brought to a supersonic speed at the outlet of the nozzle 4 by virtue of its particular shape (Laval nozzle 5) which carries the mixture at its outlet at a speed that is largely supersonic.
  • the divergent nozzle 5 causes a relaxation of the gases and therefore a significant lowering of temperature (650 ° C to 250 ° C).
  • the powder particles which moreover have an extremely limited residence time in the flow of hot gases, remain in all cases in a solid or slightly viscous state (surface heating).
  • the main influence parameter on the quality of the deposits obtained is the projection speed of the particles. Indeed, too slow a speed causes poor cohesion between the powder particles.
  • the processes according to the invention are also distinguished in that the powder deposited to form the contact layer of the pad or electrical contact, hereinafter referred to as the first powder, contains at least particles comprising grains of at least one refractory material. embedded in a conductive metal matrix selected from silver or copper.
  • the first powder is prepared prior to the deposit. More particularly, the particles comprising the grains of at least one refractory material incorporated in the conductive metal matrix are obtained from a process selected from the group consisting of physical vapor deposition (PVD) processes, chemical vapor deposition (CVD) processes, electroless processes, chemical precipitation on suspended particles.
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • electroless processes chemical precipitation on suspended particles.
  • Particles obtained by chemical precipitation on suspended particles are particularly preferred. Indeed, these particles have a spongy structure, with "percolating" porosity, that is to say communicating with each other, resulting in a great ability to deform so as not to bounce during deposition by cold spray.
  • the refractory material may be chosen from the group comprising CdO, CuO, SnO 2 , ZnO, Bi 2 O 3 , C, WC, MgO, In 2 O 3 , as well as Ni, Fe, Mo, Zr , W or their oxides.
  • the first powder may contain between 2% and 50%, and preferably between 10% and 40% by volume of grains of refractory material relative to the total volume of the first powder.
  • the conductive metal present in the contact layer of the pad or electrical contact may constitute 100% of the matrix comprising the grains of refractory material or a smaller amount.
  • the first powder further contains pure metal particles corresponding to the conductive metal of the matrix containing the grains of refractory material, representing the conductive metal residue present in the contact layer.
  • the first powder may also contain at least one doping agent.
  • particles comprising grains of at least one doping agent are incorporated in a metal matrix whose metal corresponds to the conductive metal of the matrix containing the grains of refractory material. These particles are prepared in the same way as the particles comprising the grains of refractory material incorporated in the conductive metal matrix, and are then mixed with said particles comprising the grains of refractory material incorporated in the conductive metal matrix and optionally to pure metal particles to form the first powder.
  • At least one doping agent is incorporated with grains of refractory material to combine them in their conductive metal matrix.
  • At least one doping agent is introduced into the matrix containing the grains of refractory material.
  • the doping agent is a metal or an oxide of this metal, said metal being chosen from the group comprising Bi, Mo, W, Re, In and Cu.
  • the particle size of the first powder is between 10 ⁇ m and 300 ⁇ m.
  • this shaping can be done for example by plastic deformation (stamping, pegging, rolling), by removal of material (milling, planing, grinding) or both.
  • the method of manufacturing an electrical contact makes it possible to directly obtain an electrical contact comprising a contact support and at least one contact layer as defined above.
  • the contact support is a conductive support, preferably consisting of a very good metal conductor of electricity and heat.
  • the contact support may be made of a material selected from the group consisting of copper, aluminum, copper alloys, aluminum alloys, or a composite consisting of a conductive metal and a metal with high elastic limit, for example copper on steel.
  • the contact support may be coated with a galvanic deposit of silver or cu drunk.
  • the contact support may be in the form of individual pre-cut pieces.
  • the contact support may also be in the form of a continuous strip.
  • the process may further comprise a step of cutting said strip to form the electrical contacts.
  • the contact support is in the form of a strip, the contact layer can be deposited on the contact support by cold spray deposition, in accordance with the invention, so as to form discrete contact points or at least one continuous track.
  • the electrical contact manufacturing method according to the invention makes it possible to directly obtain an electrical contact, in a few operations, contrary to conventional methods of manufacturing electrical contacts.
  • the cold spray deposition method also has the advantage of cleaning the support of any traces of oxide, the particles of powder sprayed at the beginning of the process acting as a sanding of the surface of the support. The adhesion of the powder particles then projected is improved.
  • Such a method notably makes it possible to eliminate the oxides present on the aluminum supports, and thus to deposit the first powder on an aluminum support to form an electrical contact comprising an aluminum contact support.
  • the method of manufacturing an electrical contact is such that the electrical contact is manufactured in two stages: a step of manufacturing the pad on a pad support, in accordance with the manufacturing method of a plot described above, and a step of assembling the pad on a suitable electrical contact support for use as an electrical contact.
  • the stud support may consist of a thin continuous band of silver or copper (0.1-1 mm) which serves as an underlayer for soldering or welding.
  • the deposition of the first powder by cold spray to form the contact layer can take place directly on this band.
  • this band will be able to undergo a final shaping operation, either by plastic deformation (rolling), or by removal of material (milling, planing, grinding), or possibly both. It is also possible to start from a solder band, then to add the different layers described above. A multi-metallic strip is then obtained.
  • the method may further comprise a step of cutting said strip to form pads to be assembled by a conventional method (welding or soldering) for use as an electrical contact.
  • the method of manufacturing an electrical contact according to the invention may comprise, in addition, prior to the step of depositing the contact layer, at least one step of applying at least one underlayer connecting between the contact support and the contact layer.
  • said step of applying the bonding sub-layer is carried out by dynamic projection by cold gas, of a second powder on said contact support to form the bonding sub-layer, said second powder containing at least particles of a conductive metal compound.
  • link sublayer The presence of such a link sublayer is optional.
  • the bonding sub-layer may consist of a metal or a metal alloy having a hardness of the same order of magnitude as that of the support and a relatively high electrical conductivity, for example silver, a silver alloy with 5% copper or silver solder.
  • the method for manufacturing an electrical pad according to the invention may comprise, in addition, prior to the step of depositing the contact layer, at least one application step, by dynamic projection by cold gas, at least one second powder on said pad support to form at least one bonding sub-layer between the pad support and the contact layer.
  • the melting range of the bonding sub-layer must be significantly higher than the solder subsequently used for the assembly of the stud on the contact support.
  • the particle size of the second powder is between 10 microns and 300 microns.
  • the manufacturing process of the stud or the manufacturing of the electrical contact may furthermore comprise, after the deposition step of the contact layer, at least one deposition step, by dynamic projection by cold gas, of at least one third powder for forming at least one overlayer, said third powder having a composition different from the first powder.
  • the particle size of the third powder is between 10 microns and 300 microns.
  • another advantage of the cold spray deposition method is to be able to modify the spray nozzle, the composition of the powders used and the flow rates to obtain above the contact layer, different layers, which can correspond to different contact layers having different compositions.
  • a layer adapted to weak currents may be provided on the surface, and another layer adapted to stronger currents below.
  • a protective overcoat to protect the pad or the contact during storage, this overcoating being made of a material chosen to be eliminated rapidly when using the electrical contact.
  • the "Kinetic 3000M” model manufactured by Cold Gas Technology (CGT) is used as a cold gas dynamic projection system. It includes a control cabinet, a LINDSPRAY® Cold Spray Heater HT 800/30, a CGT-PF4000 Comfort powder dispenser, and a POWER-JET 3000 spray gun.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Composite Materials (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Contacts (AREA)
  • Manufacture Of Switches (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Conductive Materials (AREA)
EP09179852A 2009-12-18 2009-12-18 Herstellungsverfahren eines Kontaktplättchens eines elektrischen Kontakts und eines elektrischen Kontakts Withdrawn EP2337044A1 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
EP09179852A EP2337044A1 (de) 2009-12-18 2009-12-18 Herstellungsverfahren eines Kontaktplättchens eines elektrischen Kontakts und eines elektrischen Kontakts
EP10793241.0A EP2513932B1 (de) 2009-12-18 2010-12-16 Herstellungsverfahren eines kontaktplättchens eines elektrischen kontakts und eines elektrischen kontakts
MX2012007066A MX337345B (es) 2009-12-18 2010-12-16 Metodos para manufacturar una almohadilla de contacto electrico y contacto electrico.
CA2788260A CA2788260A1 (fr) 2009-12-18 2010-12-16 Procedes de fabrication d'un plot de contact electrique et d'un contact electrique
PCT/EP2010/069885 WO2011073314A1 (fr) 2009-12-18 2010-12-16 Procedes de fabrication d'un plot de contact electrique et d'un contact electrique
BR112012014648A BR112012014648A2 (pt) 2009-12-18 2010-12-16 método para manufatura de uma ilha de contato elétrico e contato elétrico
CN201080064059.7A CN102763183B (zh) 2009-12-18 2010-12-16 制造电接触垫和电触头的方法
JP2012543748A JP2013514614A (ja) 2009-12-18 2010-12-16 電気接点パッドおよび電気接点を製造する方法
US13/516,807 US20120305300A1 (en) 2009-12-18 2010-12-16 Methods for manufacturing an electric contact pad and electric contact

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP09179852A EP2337044A1 (de) 2009-12-18 2009-12-18 Herstellungsverfahren eines Kontaktplättchens eines elektrischen Kontakts und eines elektrischen Kontakts

Publications (1)

Publication Number Publication Date
EP2337044A1 true EP2337044A1 (de) 2011-06-22

Family

ID=42138780

Family Applications (2)

Application Number Title Priority Date Filing Date
EP09179852A Withdrawn EP2337044A1 (de) 2009-12-18 2009-12-18 Herstellungsverfahren eines Kontaktplättchens eines elektrischen Kontakts und eines elektrischen Kontakts
EP10793241.0A Revoked EP2513932B1 (de) 2009-12-18 2010-12-16 Herstellungsverfahren eines kontaktplättchens eines elektrischen kontakts und eines elektrischen kontakts

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP10793241.0A Revoked EP2513932B1 (de) 2009-12-18 2010-12-16 Herstellungsverfahren eines kontaktplättchens eines elektrischen kontakts und eines elektrischen kontakts

Country Status (8)

Country Link
US (1) US20120305300A1 (de)
EP (2) EP2337044A1 (de)
JP (1) JP2013514614A (de)
CN (1) CN102763183B (de)
BR (1) BR112012014648A2 (de)
CA (1) CA2788260A1 (de)
MX (1) MX337345B (de)
WO (1) WO2011073314A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111029179A (zh) * 2019-12-11 2020-04-17 哈尔滨东大高新材料股份有限公司 一种低压电器用触头材料与铜复合方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013014915A1 (de) * 2013-09-11 2015-03-12 Airbus Defence and Space GmbH Kontaktwerkstoffe für Hochspannungs-Gleichstrombordsysteme
CN103589897B (zh) * 2013-11-22 2015-11-25 福达合金材料股份有限公司 银金属氧化物钨复合电触头材料的制备方法及其产品
DE102016123816A1 (de) * 2016-12-08 2018-06-14 Air Liquide Deutschland Gmbh Anordnung und Vorrichtung zum Behandeln einer Oberfläche
US10446336B2 (en) 2016-12-16 2019-10-15 Abb Schweiz Ag Contact assembly for electrical devices and method for making
WO2018180216A1 (ja) * 2017-03-27 2018-10-04 日本電産株式会社 電気接点、それを備えた電磁リレー及び電気接点の製造方法
WO2018180217A1 (ja) * 2017-03-27 2018-10-04 日本電産株式会社 電気接点、それを備えた電磁リレー及び電気接点の製造方法
DE102022129225A1 (de) * 2022-11-04 2024-05-08 Te Connectivity Germany Gmbh Kontaktelement mit einer Sprühbeschichtung sowie Verbindungsanordnung, Verwendung eines Sprühmittels und Verfahren zum Herstellen eines Kontaktelements

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0484533A1 (de) 1990-05-19 1992-05-13 Anatoly Nikiforovich Papyrin Beschichtungsverfahren und -vorrichtung
US5846288A (en) 1995-11-27 1998-12-08 Chemet Corporation Electrically conductive material and method for making
DE10045783A1 (de) * 2000-05-08 2001-11-22 Ami Doduco Gmbh Verfahren zum Herstellen von Werkstücken, welche der Leitung von elektrischem Strom dienen und mit einem überwiegend metallischen Material beschichtet sind
US20060093736A1 (en) * 2004-10-29 2006-05-04 Derek Raybould Aluminum articles with wear-resistant coatings and methods for applying the coatings onto the articles
US20070116890A1 (en) * 2005-11-21 2007-05-24 Honeywell International, Inc. Method for coating turbine engine components with rhenium alloys using high velocity-low temperature spray process
DE102005062225B3 (de) * 2005-12-21 2007-06-21 Siemens Ag Legierungsprodukt vom MCrAIX-Typ und Verfahren zur Herstellung einer Schicht aus diesem Legierungsprodukt
EP1921176A2 (de) * 2006-11-13 2008-05-14 Sulzer Metco (US) Inc. Material und Herstellungsverfahren für eine Lötnaht mit hoher Wärmeleitfähigkeit und hoher Stromleitfähigkeit
DE102008015464A1 (de) * 2008-03-18 2009-09-24 Siemens Aktiengesellschaft Bauteil mit einer elektrischen Kontaktfläche für ein elektrisches Kontaktelement, insbesondere Stromschiene
FR2931303A1 (fr) * 2008-05-15 2009-11-20 Daniel Bernard Contact electrique et son procede de fabrication associe

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5206059A (en) * 1988-09-20 1993-04-27 Plasma-Technik Ag Method of forming metal-matrix composites and composite materials
US6139913A (en) * 1999-06-29 2000-10-31 National Center For Manufacturing Sciences Kinetic spray coating method and apparatus
WO2001086018A2 (de) * 2000-05-08 2001-11-15 Ami Doduco Gmbh Verfahren zum herstellen von werkstücken, welche der leitung von elektrischem strom dienen und mit einem überwiegend metallischen material beschichtet sind
US6685988B2 (en) * 2001-10-09 2004-02-03 Delphi Technologies, Inc. Kinetic sprayed electrical contacts on conductive substrates
US6759085B2 (en) * 2002-06-17 2004-07-06 Sulzer Metco (Us) Inc. Method and apparatus for low pressure cold spraying
US20060121187A1 (en) * 2004-12-03 2006-06-08 Haynes Jeffrey D Vacuum cold spray process
DE102004059716B3 (de) * 2004-12-08 2006-04-06 Siemens Ag Verfahren zum Kaltgasspritzen
DE102005050045B3 (de) * 2005-10-19 2007-01-04 Praxair Surface Technologies Gmbh Verfahren zur Beschichtung eines Bauteils

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0484533A1 (de) 1990-05-19 1992-05-13 Anatoly Nikiforovich Papyrin Beschichtungsverfahren und -vorrichtung
US5846288A (en) 1995-11-27 1998-12-08 Chemet Corporation Electrically conductive material and method for making
US5963772A (en) 1995-11-27 1999-10-05 Chemet Corporation Electrically conductive material and method of making
DE10045783A1 (de) * 2000-05-08 2001-11-22 Ami Doduco Gmbh Verfahren zum Herstellen von Werkstücken, welche der Leitung von elektrischem Strom dienen und mit einem überwiegend metallischen Material beschichtet sind
US20060093736A1 (en) * 2004-10-29 2006-05-04 Derek Raybould Aluminum articles with wear-resistant coatings and methods for applying the coatings onto the articles
US20070116890A1 (en) * 2005-11-21 2007-05-24 Honeywell International, Inc. Method for coating turbine engine components with rhenium alloys using high velocity-low temperature spray process
DE102005062225B3 (de) * 2005-12-21 2007-06-21 Siemens Ag Legierungsprodukt vom MCrAIX-Typ und Verfahren zur Herstellung einer Schicht aus diesem Legierungsprodukt
EP1921176A2 (de) * 2006-11-13 2008-05-14 Sulzer Metco (US) Inc. Material und Herstellungsverfahren für eine Lötnaht mit hoher Wärmeleitfähigkeit und hoher Stromleitfähigkeit
DE102008015464A1 (de) * 2008-03-18 2009-09-24 Siemens Aktiengesellschaft Bauteil mit einer elektrischen Kontaktfläche für ein elektrisches Kontaktelement, insbesondere Stromschiene
FR2931303A1 (fr) * 2008-05-15 2009-11-20 Daniel Bernard Contact electrique et son procede de fabrication associe

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111029179A (zh) * 2019-12-11 2020-04-17 哈尔滨东大高新材料股份有限公司 一种低压电器用触头材料与铜复合方法

Also Published As

Publication number Publication date
MX2012007066A (es) 2012-10-03
EP2513932B1 (de) 2013-11-27
CA2788260A1 (fr) 2011-06-23
JP2013514614A (ja) 2013-04-25
CN102763183B (zh) 2015-03-11
MX337345B (es) 2014-08-22
BR112012014648A2 (pt) 2017-03-14
WO2011073314A1 (fr) 2011-06-23
EP2513932A1 (de) 2012-10-24
CN102763183A (zh) 2012-10-31
US20120305300A1 (en) 2012-12-06

Similar Documents

Publication Publication Date Title
EP2513932B1 (de) Herstellungsverfahren eines kontaktplättchens eines elektrischen kontakts und eines elektrischen kontakts
EP2695972B1 (de) Laminat und herstellungsverfahren für das laminat
WO2012128327A1 (ja) 積層体、導電材料および積層体の製造方法
US11600454B2 (en) Contact assembly for electrical devices and method for making
JP4851672B2 (ja) 改良されたスパッタリングターゲット及びその製法並びに使用
CA2207579A1 (fr) Piece frittee a surface anti-abrasive et procede pour sa realisation
WO1994013426A1 (fr) Materiau et procede pour la formation d'un revetement protecteur sur un substrat en un alliage a base de cuivre
WO2016185996A1 (ja) 半田接続構造、及び成膜方法
KR100771434B1 (ko) 스퍼터링 타겟의 제조방법 및 스퍼터링 타겟
US4308321A (en) Laminated bearing material produced by thermokinetic plating
CN114209218B (zh) 复合材料、不粘炊具及制造不粘炊具的方法
JP2003112269A (ja) ベリリウムと銅または銅合金の接合体の製造方法およびその接合体
TWI546139B (zh) 複合材料之製造方法及複合材料
FR2516941A1 (fr) Poudre pour pulverisation par flamme
CA2849416C (fr) Dispositif delivrant des fibres de verre a teneur reduite en metaux precieux
CN112226723B (zh) 一种大气氛围下含铝合金涂层的制备方法
EP0794026A1 (de) Verfahren zur Herstellung eines Verbunddrahtes mit geringem Durchmesser, insbesondere eine Drahtelektrode für Funkenerodierbearbeitung und damit hergestellte Drahtelektrode
FR2931303A1 (fr) Contact electrique et son procede de fabrication associe
WO2014091632A1 (ja) 温度ヒューズ用電極材料およびその製造方法
JP6021284B2 (ja) 温度ヒューズ用電極材料およびその製造方法
JP6073924B2 (ja) 温度ヒューズ用電極材料およびその製造方法
WO2024194588A1 (fr) Poudre métallique pour procédé de fabrication additive
CN111029179A (zh) 一种低压电器用触头材料与铜复合方法
FR2808808A1 (fr) Projection de titane sur prothese medicale avec refroidissement par co2 ou argon

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

AX Request for extension of the european patent

Extension state: AL BA RS

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20111223