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EP2269168A1 - Chip card, and method for the production thereof - Google Patents

Chip card, and method for the production thereof

Info

Publication number
EP2269168A1
EP2269168A1 EP09732963A EP09732963A EP2269168A1 EP 2269168 A1 EP2269168 A1 EP 2269168A1 EP 09732963 A EP09732963 A EP 09732963A EP 09732963 A EP09732963 A EP 09732963A EP 2269168 A1 EP2269168 A1 EP 2269168A1
Authority
EP
European Patent Office
Prior art keywords
chip
flip
film
layer
chip card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP09732963A
Other languages
German (de)
French (fr)
Inventor
Thomas Tarantino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient Mobile Security GmbH
Original Assignee
Giesecke and Devrient GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke and Devrient GmbH filed Critical Giesecke and Devrient GmbH
Publication of EP2269168A1 publication Critical patent/EP2269168A1/en
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

Definitions

  • Chip card and method for its production
  • the invention relates to a method for producing smart cards in the form of plug-in SIMs or as standardized smart cards, in particular in ID-I format. These can also be dual-interface cards or cards with other form factors, for example in the form of a USB token with corresponding USB contact connections.
  • chip cards are subject to special cost constraints. Therefore, special efforts are made in this technical field to reduce the manufacturing costs.
  • chip modules are used in prefabricated chip card bodies, typically glued into a recess provided in the card body for this purpose.
  • the production of the chip modules and the production of the card bodies fall apart accordingly.
  • the card bodies are predominantly produced in laminating technology as sheets or rolls, and the chip modules are inserted into the card body before or after the card bodies have been punched out of the film composite.
  • the chip modules are usually provided on a film substrate in the form of a carrier tape and punched out of the carrier tape during insertion into the card body, so that a part of the carrier tape is also transferred.
  • On the front of the carrier tape are ISO contact surfaces for contact communication with external communication devices and on the back of the carrier tape are the chip and pads for the chip, over which the chip is electrically is conductively connected to the contact surfaces on the carrier tape front side.
  • the chip is mounted on the back contact surfaces in flip-chip technology. This saves the complicated Wirebond- wiring, and also on an encapsulation of the chip and the sensitive wires with epoxy resin or the like may be omitted if necessary.
  • the object of the present invention is to further reduce the production costs of such chip cards.
  • the film substrate which is provided on the front side with a plurality of contact layouts for the contact-type communication and on the back side with a plurality of contact layouts and flip-chips mounted or to be mounted thereon, together with at least one amplification layer to form a layer composite, from which then the individual chip cards are cut out with the final chip card dimensions.
  • the entire film substrate with the chip modules constructed thereon becomes a component of the layer composite as a whole, so that a substantial production step can be saved.
  • the foil substrate carrying the flip chips has a width and / or length which corresponds to a multiple of the width or length of the chip cards to be produced therefrom.
  • the film substrate - and, if the reinforcing layer is in the form of a film, also the reinforcing film - is provided as sheet or roll goods.
  • the contact surfaces at least on the front side and preferably also on the back side of the film substrate are advantageously realized as a metallization of the film surface.
  • the corresponding contact layout can be produced from an originally full-area metallization, for example by etching or additive etching.
  • the contact layout on the back can also have the necessary components of a coil for the additional contactless data exchange and / or the contactless power supply of the card (dual-interface card).
  • the layer composite can advantageously consist only of the two aforementioned layers.
  • an intermediate foil is placed between the foil substrate and the reinforcing layer to protect the flip-chip in the final card from mechanical stresses.
  • the intermediate foil may, according to a first variant, have recesses in which the fliograms lie.
  • the depth of the recess preferably corresponds approximately to the thickness of the flip chips, that is, it may also be insignificantly lower, but in any case should not be flatter than the flip-chip structure on the film substrate.
  • the recesses of the intermediate film can advantageously be present as continuous openings in the intermediate film, which can be produced inexpensively, for example by punching.
  • a material for the intermediate film which is softer than the materials of the film substrate and an associated reinforcing film can be selected for the protection of the flip chips.
  • the flip-chips can be embedded in the bonding of the film layers to the composite layer.
  • a material for the intermediate film a correspondingly flexible and plastically deformable material is suitable, in particular a foam material.
  • the film composite preferably consists only of the three layers mentioned, in order to keep production costs low, but if necessary can also consist of more than just three film layers.
  • adhesives can be used.
  • thermoplastic film layers can be dispensed with the use of adhesives.
  • the reinforcing layer as a film
  • it can alternatively be produced as an injection-molded layer by injection-molding of the film substrate or, if appropriate, the intermediate film.
  • the thickness of the layer composite is preferably chosen such that they correspond to the ISO standard thickness of ID-1 chip cards or corresponding plug-in SIMs. But they can also have other dimensions, for example, have the shape of USB tokens. As a USB token, the outer contact surfaces for communication with USB interfaces are formed, and the dimensions of the chip card are chosen so that the card with its USB interface into a USB port can be inserted. In this case, the ISO standard thickness can be exceeded in particular.
  • the chip cards can be personalized and / or printed in a further method step, whereby this method step is used for cost reasons. which preferably takes place before the chip cards are separated out of the layer composite.
  • FIG. 2 shows the layer structure of the chip card from FIG. 1 schematically in cross-section
  • FIG. 3 shows an alternative layer structure of the chip card of Figure 1 schematically in cross section
  • FIG. 4 shows a further alternative construction of the chip card from FIG. 1, schematically in cross section,
  • FIG. 5 schematically shows the steps for producing the chip card from FIG. 1 in a roll-to-roll process
  • FIG. 6 shows a chip card in the format of a USB token
  • Fig. 7 shows a further alternative layer structure of the chip card of Figure 1 schematically in cross section
  • FIG. 8 shows a strip-shaped layer composite according to Figure 7 in plan view, are already separated out of the individual smart cards.
  • FIG. 1 shows schematically in plan view a chip card 1 in the ID-I format with an external contact layout 2 for contact-type communication with and / or power supply by external data processing devices, such as payment terminals, access control devices, computers and the like.
  • the chip card 1 is embodied here as a dual-interface card and accordingly has a coil 3 integrated in the chip card for contactless data and / or energy transfer, which is shown in FIG. 1 by dashed lines.
  • the chip card 1 from FIG. 1 can also have other form factors instead of an ID-I chip card, for example that of a plug-in SIM, but as a rule without the coil 3.
  • FIGS. 2 to 4 show the chip card of Figure 1 according to three embodiments schematically in cross section.
  • the chip card 1 is realized as a two-layer laminate 12 and comprises a film substrate 4 as a first layer and a reinforcement film 5 as a second layer.
  • the contact layout 2 for the contact-type communication in FIG Form of an etched metallization provided.
  • a second contact layout 6 on which a flip-chip 7 is mounted in conventional flip-chip technology.
  • the connections of the flip-chip 7, which are not shown in detail here, are electrically conductively connected via the flip-chip contact layout 6 and further via the film substrate 4 to penetrating vias 8 with the communication contact layout 2 lying on the film substrate front side 4a.
  • the flip-chip contact layout 6 is also realized, for example, as etched metallization. Simultaneously with the production of the flip-chip contact layout 6, the turns 3a of the coil 3 have been produced (apart from the "bridge" spanning the turns of the coil), ie also preferably as etched metallization.
  • the film layers 4, 5 have a total thickness D corresponding to the thickness of the finished card.
  • the compound of the two film layers 4, 5 to the finished layer composite 12 with the total thickness D is carried out using increased pressure and elevated temperature.
  • thermoplastics are used as materials for the two film layers 4, 5, intimate bonding of the two layers can be achieved in this way without the use of an additional adhesive.
  • an adhesive is appropriate.
  • a thermally activated adhesive the use of increased pressure and elevated temperature is also useful here.
  • the second exemplary embodiment according to FIG. 3 differs from the exemplary embodiment from FIG. 2 solely in that the layer composite 12 has, as the third film layer, an intermediate film 9 between the film substrate 4 and the reinforcing film 5.
  • the intermediate film 9 has a recess 10 in which the flip-chip 7 is accommodated for protection against mechanical stress.
  • On the intermediate foil 9 with the recess 10 can be dispensed with, if the flip-chip 7 is very thin and flexible, as in the case of the embodiment of Figure 2.
  • It is also conceivable in the embodiment of Figure 2 is a recess in the reinforcing sheet 5 for To provide recording of the flip-chip 7. This recording would then corresponding to the depth of the thickness of the flip-chip 7 and the flip-chip structure, or slightly above.
  • the use of the intermediate foil 9 in the case of thicker and / or less flexible flip-chips 7 is advantageous because the recess 10 in this case can be produced as a through opening simply, for example in a punching step , Because the depth the recess only the thickness of the flip-chip 7 and the flip-chip structure, or slightly above, corresponds, the intermediate foil 9 can be selected with a correspondingly small thickness.
  • the third embodiment according to FIG. 4 shows another variant for protecting a comparatively thick and / or inflexible flip chip 7 against mechanical loads.
  • an intermediate foil 9 is provided between the foil substrate 4 and the reinforcing foil 5.
  • the intermediate film 9 does not have a cutout but consists of a material which is softer than the materials of the film substrate 4 and the reinforcing film 5. This applies at least to the time of joining the three film layers to the three-layer laminate 12.
  • the intermediate foil 9 has a lower softening point than the foil substrate 4 and the reinforcing foil 5, so that it is considerably softer when laminating the layers under elevated temperature than the foil layers of the foil substrate 4 and the reinforcing foil 5.
  • the intermediate film 9 may in particular also consist of a foam material which is hot or cold glued to the two other film layers 4, 5.
  • the region of the flip-chip 7 can be kept free during adhesive bonding, so that there is no firm connection between the flip-chip 7 and the intermediate layer 9. As a result, the flip-chip 7 is mechanically decoupled from the intermediate layer 9.
  • FIG. 5 shows by way of example the production of the chip cards 1 in a roll-to-roll method.
  • the chip cards 1 can also be produced from film layers made available in an arc shape.
  • the method begins with the provision of a film substrate 4, on which at least the communication contact layout 2 and the flip-chip contact layout 6 are present and electrically connected to one another by means of the vias 8 (FIG. 2). If not yet available, first flip-chips 2 are mounted on the flip-chip contact layouts 6. Subsequently, the film substrate 4 is brought together with the reinforcing film 5 and, in this case, the intermediate film 9. Before merging 11 recesses 10 are punched out of the intermediate foil 9 in a first punching station, in which then the flip-chips 7 come to rest. The film layers 4, 5, 9 are subsequently elevated using
  • the chip cards 1 are then punched out in a second punching station 13.
  • the rest of the film composite 12 is wound onto a waste bobbin.
  • the chip cards 1 can be personalized and / or printed prior to separation in a corresponding station, not shown here, e.g. by laser inscription.
  • FIG. 6 shows a chip card 1 in the form of a USB token.
  • the contact layout 2 for the contact-type communication with and power supply by an external device comprises the two leading outer pins 14, 15 for the supply voltage and the shorter pins 16, 17 for the data traffic.
  • FIG. 7 shows schematically in cross section a further exemplary embodiment of a layer structure 12, which differs essentially from the exemplary embodiments according to FIGS. 2 to 4 in that, instead of the reinforcing film 5, an injection-molded layer 5 1 is provided as the reinforcing layer in order to form the layer composite 12.
  • An intermediate film 9 with recesses 10 for receiving the flip chips 7, as described with reference to FIG. written, can be additionally provided.
  • the connection of the injection-molding layer 5 'to the film substrate 4 - or alternatively to the intermediate layer 9 - can be realized in a simple manner by back-molding the film substrate 4 with the injection-molding material of the injection-molding layer 5'.
  • either the entire film substrate 4 with the flip-chips 7 mounted thereon can be back-injected.
  • the film substrate 4 can be previously cut into strips and then back-injected with the injection-molding layer 5 '.
  • Such a strip is shown in FIG. From the strip-shaped layer composite 12, the chip cards 1 are then cut out, for example punched, and there are corresponding holes 18 in the layer composite 12th

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The invention relates to a chip card in the form of an ID-1 card, a plug-in SIMs, or a USB token, comprising a layered composite (12) having two (4, 5) or three (4, 5, 9) layers extending across the entire chip card (1). For this purpose an exterior film layer (4) has a communication contact layout (2) on the front (4a) thereof facing toward the exterior (4b), and a flip chip (7) on the back thereof, and a flip chip contact layout (6) being connected to the front communication contact layout (2) in an electrically conducting manner.

Description

Chipkarte und Verfahren zu deren Herstellung Chip card and method for its production
Die Erfindung betrifft ein Verfahren zum Herstellen von Chipkarten in Form von Plug-In-SIMs oder als genormte Smartcards, insbesondere im ID-I- Format. Es kann sich dabei auch um Dual-Interface-Karten handeln oder auch um Karten mit anderen Formfaktoren, zum Beispiel in Form eines USB- Tokens mit entsprechenden USB-Kontaktanschlüssen.The invention relates to a method for producing smart cards in the form of plug-in SIMs or as standardized smart cards, in particular in ID-I format. These can also be dual-interface cards or cards with other form factors, for example in the form of a USB token with corresponding USB contact connections.
Die Herstellung von Chipkarten ist besonderen Kostenzwängen unterworfen. Es werden auf diesem technischen Gebiet daher besondere Anstrengungen unternommen, die Herstellungskosten zu senken. Üblicherweise werden in vorgefertigte Chipkartenkörper Chipmodule eingesetzt, typiεcherweise in eine dafür im Kartenkörper vorgesehen Ausnehmung eingeklebt. Die Her- Stellung der Chipmodule und die Herstellung der Kartenkörper fallen dementsprechend auseinander. Die Kartenkörper werden überwiegend in Lami- niertechnik als Bogen oder Rollen hergestellt und die Chipmodule vor oder nach dem Ausstanzen der Kartenkörper aus dem Folienverbund in den Kartenkörper eingesetzt.The production of chip cards is subject to special cost constraints. Therefore, special efforts are made in this technical field to reduce the manufacturing costs. Usually, chip modules are used in prefabricated chip card bodies, typically glued into a recess provided in the card body for this purpose. The production of the chip modules and the production of the card bodies fall apart accordingly. The card bodies are predominantly produced in laminating technology as sheets or rolls, and the chip modules are inserted into the card body before or after the card bodies have been punched out of the film composite.
Die Chipmodule werden üblicherweise auf einem Foliensubstrat in Form eines Trägerbands zur Verfügung gestellt und beim Einsetzen in den Kartenkörper aus dem Trägerband ausgestanzt, so dass ein Teil des Trägerbands mit übertragen wird. Auf der Vorderseite des Trägerbands befinden sich ISO-Kontaktflächen zur kontaktbehafteten Kommunikation mit externen Kommunikationsgeräten und auf der Rückseite des Trägerbands befinden sich der Chip und Kontaktflächen für den Chip, über den der Chip elektrisch leitend mit den Kontaktflächen auf der Trägerbandvorderseite verbunden ist. Neuerdings wird der Chip auf die rückseitigen Kontaktflächen in Flip-Chip- Technologie montiert. Dadurch spart man sich die aufwändige Wirebond- Verdrahtung, und auch auf ein Umgießen des Chips und der empfindlichen Drähte mit Epoxidharz oder ähnliches kann gegebenenfalls verzichtet werden.The chip modules are usually provided on a film substrate in the form of a carrier tape and punched out of the carrier tape during insertion into the card body, so that a part of the carrier tape is also transferred. On the front of the carrier tape are ISO contact surfaces for contact communication with external communication devices and on the back of the carrier tape are the chip and pads for the chip, over which the chip is electrically is conductively connected to the contact surfaces on the carrier tape front side. Recently, the chip is mounted on the back contact surfaces in flip-chip technology. This saves the complicated Wirebond- wiring, and also on an encapsulation of the chip and the sensitive wires with epoxy resin or the like may be omitted if necessary.
Aufgabe der vorliegenden Erfindung ist es, die Herstellungskosten derartiger Chipkarten weiter zu reduzieren.The object of the present invention is to further reduce the production costs of such chip cards.
Dementsprechend ist es vorgesehen, das Foliensubstrat, das vorderseitig mit mehreren Kontaktlayouts für die kontaktbehaftete Kommunikation und rückseitig mit mehreren Kontaktlayouts und darauf montierten oder zu montierenden Flip-Chips versehen ist, gemeinsam mit mindestens einer Ver- Stärkungsschicht zu einem Schichtverbund zu verbinden, aus der dann die einzelnen Chipkarten mit den endgültigen Chipkartenabmessungen herausgetrennt werden.Accordingly, it is provided to connect the film substrate, which is provided on the front side with a plurality of contact layouts for the contact-type communication and on the back side with a plurality of contact layouts and flip-chips mounted or to be mounted thereon, together with at least one amplification layer to form a layer composite, from which then the individual chip cards are cut out with the final chip card dimensions.
Anstatt also Chipmodule aus dem Foliensubstrat bzw. Trägerband auszu- stanzen und in Chipkartenkörper einzusetzen, wird das gesamte Foliensubstrat mit den darauf aufgebauten Chipmodulen insgesamt Bestandteil des Schichtverbunds, so dass ein wesentlicher Produktionsschritt eingespart werden kann. Dementsprechend besitzt das die Flip-Chips tragende Foliensubstrat eine Breite und/ oder Länge, die einem Vielfachen der Breite bzw. Länge der daraus herzustellenden Chipkarten entspricht. Vorzugsweise wird das Foliensubstrat - und, wenn die Verstärkungsschicht als Folie vorliegt, auch die Verstärkungsfolie - als Bogen- oder Rollenware zur Verfügung gestellt. Die Kontaktflächen zumindest auf der Vorderseite und vorzugsweise auch auf der Rückseite des Foliensubstrats werden vorteilhaft als eine Metallisierung der Folienoberfläche realisiert. Dabei kann das entsprechende Kontaktlayout aus einer ursprünglich vollflächigen Metallisierung zum Beispiel durch Ätzen oder additives Ätzen erzeugt werden. Das Kontaktlayout auf der Rückseite kann darüber hinaus die notwendigen Bestandteile einer Spule für den zusätzlichen kontaktlosen Datenaustausch und/ oder die kontaktlose Energieversorgung der Karte aufweisen (Dual-Interface-Karte).Thus, instead of stamping out chip modules from the film substrate or carrier tape and inserting them into chip card bodies, the entire film substrate with the chip modules constructed thereon becomes a component of the layer composite as a whole, so that a substantial production step can be saved. Accordingly, the foil substrate carrying the flip chips has a width and / or length which corresponds to a multiple of the width or length of the chip cards to be produced therefrom. Preferably, the film substrate - and, if the reinforcing layer is in the form of a film, also the reinforcing film - is provided as sheet or roll goods. The contact surfaces at least on the front side and preferably also on the back side of the film substrate are advantageously realized as a metallization of the film surface. In this case, the corresponding contact layout can be produced from an originally full-area metallization, for example by etching or additive etching. The contact layout on the back can also have the necessary components of a coil for the additional contactless data exchange and / or the contactless power supply of the card (dual-interface card).
Der Schichtverbund kann vorteilhaft nur aus den zwei vorgenannten Schichten bestehen. Gemäß einer bevorzugten Ausführungsform wird jedoch eine Zwischenfolie zwischen dem Foliensubstrat und der Verstärkungsschicht angeordnet, um den Flip-Chip in der endgültigen Karte vor mechanischen Belastungen zu schützen. Dazu kann die Zwischenfolie gemäß einer ersten Variante Aussparungen besitzen, in denen die Fliρ-Chiρs zu liegen kommen. Die Tiefe der Aussparung entspricht vorzugsweise in etwa der Dicke der Flip-Chips, das heißt sie kann auch unwesentlich tiefer sein, sollte aber jedenfalls nicht flacher als der Flip-Chip-Aufbau auf dem Foliensubstrat sein. Die Aussparungen der Zwischenfolie können vorteilhaft als durchgehende Öff- nungen in der Zwischenfolie vorliegen, die beispielsweise durch Ausstanzen preiswert erzeugbar sind.The layer composite can advantageously consist only of the two aforementioned layers. However, according to a preferred embodiment, an intermediate foil is placed between the foil substrate and the reinforcing layer to protect the flip-chip in the final card from mechanical stresses. For this purpose, the intermediate foil may, according to a first variant, have recesses in which the fliograms lie. The depth of the recess preferably corresponds approximately to the thickness of the flip chips, that is, it may also be insignificantly lower, but in any case should not be flatter than the flip-chip structure on the film substrate. The recesses of the intermediate film can advantageously be present as continuous openings in the intermediate film, which can be produced inexpensively, for example by punching.
Gemäß einer zweiten Variante kann zum Schutz der Flip-Chips ein Material für die Zwischenfolie gewählt werden, welches weicher ist als die Materia- lien des Foliensubstrats und einer damit verbundenen Verstärkungsfolie. In ein solches Zwischenfolienmaterial können die Flip-Chips beim Verbinden der Folienschichten zum Schichtverbund eingebettet werden. Als Material für die Zwischenfolie bietet sich ein entsprechend flexibles und plastisch verformbares Material an, insbesondere ein Schaumstoffmaterial. Im Falle des Vorsehens einer Zwischenfolie besteht der Folienverbund vorzugsweise nur aus den drei genannten Schichten, um den Herstellungsaufwand gering zu halten, kann aber bei Bedarf auch aus mehr als nur drei Folienschichten bestehen.According to a second variant, a material for the intermediate film which is softer than the materials of the film substrate and an associated reinforcing film can be selected for the protection of the flip chips. In such an intermediate film material, the flip-chips can be embedded in the bonding of the film layers to the composite layer. As a material for the intermediate film, a correspondingly flexible and plastically deformable material is suitable, in particular a foam material. In the case of the provision of an intermediate film, the film composite preferably consists only of the three layers mentioned, in order to keep production costs low, but if necessary can also consist of more than just three film layers.
Beim Verbinden der Folienschichten zu einem Folienverbund können Klebstoffe eingesetzt werden. Im Falle thermoplastischer Folienschichten kann auf den Einsatz von Klebstoffen verzichtet werden. In jedem Falle ist es aber von Vorteil, das Laminieren der Folienschichten zu einem Folienverbund unter Anwendung von erhöhtem Druck und erhöhter Temperatur durchzuführen, dies insbesondere wenn thermoplastische Folienschichten ohne Klebstoffeinsatz miteinander verbunden werden.When bonding the film layers to a film composite adhesives can be used. In the case of thermoplastic film layers can be dispensed with the use of adhesives. In any case, it is advantageous to carry out the lamination of the film layers to form a film composite using elevated pressure and elevated temperature, in particular when thermoplastic film layers are bonded together without the use of adhesive.
Anstatt die Verstärkungsschicht als Folie zur Verfügung zu stellen, kann sie gemäß einer anderen Ausführungsform der Erfindung alternativ als Spritzgussschicht durch Hinterspritzen des Foliensubstrats - oder ggf. der Zwischenfolie - hergestellt werden.Instead of providing the reinforcing layer as a film, according to another embodiment of the invention, it can alternatively be produced as an injection-molded layer by injection-molding of the film substrate or, if appropriate, the intermediate film.
Die Dicke des Schichtverbunds wird vorzugsweise so gewählt, dass sie der ISO-Normdicke von ID-1-Chipkarten oder entsprechenden Plug-In-SIMs entsprechen. Sie können aber auch andere Abmessungen besitzen, beispielsweise die Gestalt von USB-Tokens haben. Als USB-Token sind die außen liegenden Kontaktflächen zur Kommunikation mit USB-Schnittstellen ausgebildet, und die Abmessungen der Chipkarte sind so gewählt, dass die Karte mit ihrer USB-Schnittstelle in einen USB-Anschluss einsteckbar ist. Hierbei kann die ISO-Normdicke insbesondere überschritten werden.The thickness of the layer composite is preferably chosen such that they correspond to the ISO standard thickness of ID-1 chip cards or corresponding plug-in SIMs. But they can also have other dimensions, for example, have the shape of USB tokens. As a USB token, the outer contact surfaces for communication with USB interfaces are formed, and the dimensions of the chip card are chosen so that the card with its USB interface into a USB port can be inserted. In this case, the ISO standard thickness can be exceeded in particular.
Die Chipkarten können in einem weiteren Verfahrensschritt personalisiert und/ oder bedruckt werden, wobei dieser Verfahrensschritt aus Kostengrün- den vorzugsweise vor dem Heraustrennen der Chipkarten aus dem Schichtverbund erfolgt.The chip cards can be personalized and / or printed in a further method step, whereby this method step is used for cost reasons. which preferably takes place before the chip cards are separated out of the layer composite.
Nachfolgend wird die Erfindung anhand der begleitenden Zeichnungen bei- spielhaft beschrieben. Darin zeigen:The invention will now be described by way of example with reference to the accompanying drawings. Show:
Fig. 1 schematisch eine Chipkarte im ID-I -Format in Draufsicht,1 schematically a chip card in ID-I format in plan view,
Fig. 2 den Schichtaufbau der Chipkarte aus Figur 1 schematisch im Quer- schnitt,2 shows the layer structure of the chip card from FIG. 1 schematically in cross-section,
Fig. 3 einen alternativen Schichtaufbau der Chipkarte aus Figur 1 schematisch im Querschnitt,3 shows an alternative layer structure of the chip card of Figure 1 schematically in cross section,
Fig. 4 einen weiteren alternativen Aufbau der Chipkarte aus Figur 1 schematisch im Querschnitt,4 shows a further alternative construction of the chip card from FIG. 1, schematically in cross section,
Fig. 5 schematisch die Schritte zur Herstellung der Chipkarte aus Figur 1 in einem Rolle-zu-Rolle-Prozess,5 schematically shows the steps for producing the chip card from FIG. 1 in a roll-to-roll process, FIG.
Fig. 6 eine Chipkarte im Format eines USB-Tokens,6 shows a chip card in the format of a USB token,
Fig. 7 einen weiteren alternativen Schichtaufbau der Chipkarte aus Figur 1 schematisch im Querschnitt undFig. 7 shows a further alternative layer structure of the chip card of Figure 1 schematically in cross section and
Fig. 8 einen streifenförmigen Schichtverbund gemäß Figur 7 in Draufsicht, aus dem einzelne Chipkarten bereits herausgetrennt sind. Figur 1 zeigt schematisch in Aufsicht eine Chipkarte 1 im ID-I -Format mit einem außen liegenden Kontaktlayout 2 für die kontaktbehaftete Kommunikation mit und/ oder Energieversorgung durch externe Datenverarbeitungsgeräte, wie beispielsweise Zahlungsterminals, Zutrittskontrollgeräten, Com- putern und dergleichen. Die Chipkarte 1 ist hier als Dual-Interface-Karte ausgebildet und besitzt dementsprechend zur kontaktlosen Daten- und/ oder Energieübertragung eine in der Chipkarte integrierte Spule 3, die in Figur 1 durch Strichlinien dargestellt ist. Die Chipkarte 1 aus Figur 1 kann anstatt einer ID-I -Chipkarte auch andere Formfaktoren besitzen, beispielsweise die eines Plug-In-SIMs, dann aber in der Regel ohne die Spule 3.Fig. 8 shows a strip-shaped layer composite according to Figure 7 in plan view, are already separated out of the individual smart cards. FIG. 1 shows schematically in plan view a chip card 1 in the ID-I format with an external contact layout 2 for contact-type communication with and / or power supply by external data processing devices, such as payment terminals, access control devices, computers and the like. The chip card 1 is embodied here as a dual-interface card and accordingly has a coil 3 integrated in the chip card for contactless data and / or energy transfer, which is shown in FIG. 1 by dashed lines. The chip card 1 from FIG. 1 can also have other form factors instead of an ID-I chip card, for example that of a plug-in SIM, but as a rule without the coil 3.
Figuren 2 bis 4 zeigen die Chipkarte aus Figur 1 gemäß drei Ausführungsbeispielen schematisch im Querschnitt. In dem ersten Ausführungsbeispiel gemäß Figur 2 ist die Chipkarte 1 als zweischichtiger Schichtverbund 12 reali- siert und umfasst als erste Schicht ein Foliensubstrat 4 und als zweite Schicht eine Verstärkungsfolie 5. Auf der Vorderseite 4a des Foliensubstrats 4 ist das Kontaktlayout 2 für die kontaktbehaftete Kommunikation in Form einer geätzten Metallisierung vorgesehen. Auf der Rückseite 4b des Foliensubstrats 4 befindet sich ein zweites Kontaktlayout 6 auf der ein Flip-Chip 7 in her- kömmlicher Flip-Chip-Technologie montiert ist. Die hier nicht im Detail dargestellten Anschlüsse des Flip-Chips 7 sind über das Flip-Chip- Kontaktlayout 6 und weiter über das Foliensubstrat 4 durchdringende Vias 8 mit dem auf der Foliensubstratvorderseite 4a liegenden Kommunikations- Kontaktlayout 2 elektrisch leitend verbunden. Auch das Flip-Chip- Kontaktlayout 6 ist z.B. als geätzte Metallisierung realisiert. Gleichzeitig mit der Herstellung des Flip-Chip-Kontaktlayouts 6 sind die Windungen 3a der Spule 3 (abgesehen von der die Windungen der Spule überspannenden "Brücke") erzeugt worden, also ebenfalls vorzugsweise als geätzte Metallisierung. Die Folienschichten 4, 5 besitzen eine Gesamtdicke D entsprechend der Dicke der fertigen Karte. Die Verbindung der beiden Folienschichten 4, 5 zum fertigen Schichtverbund 12 mit der Gesamtdicke D erfolgt unter Anwendung erhöhten Drucks und erhöhter Temperatur. Wenn als Materialien für die beiden Folienschichten 4, 5 geeignete Thermoplaste verwendet werden, kann auf diese Weise ein inniger Verbund der beiden Schichten ohne Einsatz eines zusätzlichen Klebers erreicht werden. Im Falle der Verwendung von nicht kompatiblen Thermoplasten und/ oder eines Duroplast für die eine und/ oder die andere Folienschicht ist der Einsatz eines Klebers jedoch zweckmäßig. Insbesondere im Falle eines thermoaktivierbaren Klebers ist auch hier der Einsatz von erhöhtem Druck und erhöhter Temperatur sinnvoll.Figures 2 to 4 show the chip card of Figure 1 according to three embodiments schematically in cross section. In the first exemplary embodiment according to FIG. 2, the chip card 1 is realized as a two-layer laminate 12 and comprises a film substrate 4 as a first layer and a reinforcement film 5 as a second layer. On the front side 4 a of the film substrate 4 is the contact layout 2 for the contact-type communication in FIG Form of an etched metallization provided. On the back 4b of the film substrate 4 is a second contact layout 6 on which a flip-chip 7 is mounted in conventional flip-chip technology. The connections of the flip-chip 7, which are not shown in detail here, are electrically conductively connected via the flip-chip contact layout 6 and further via the film substrate 4 to penetrating vias 8 with the communication contact layout 2 lying on the film substrate front side 4a. The flip-chip contact layout 6 is also realized, for example, as etched metallization. Simultaneously with the production of the flip-chip contact layout 6, the turns 3a of the coil 3 have been produced (apart from the "bridge" spanning the turns of the coil), ie also preferably as etched metallization. The film layers 4, 5 have a total thickness D corresponding to the thickness of the finished card. The compound of the two film layers 4, 5 to the finished layer composite 12 with the total thickness D is carried out using increased pressure and elevated temperature. If suitable thermoplastics are used as materials for the two film layers 4, 5, intimate bonding of the two layers can be achieved in this way without the use of an additional adhesive. In the case of the use of non-compatible thermoplastics and / or a thermoset for the one and / or the other film layer, however, the use of an adhesive is appropriate. In particular, in the case of a thermally activated adhesive, the use of increased pressure and elevated temperature is also useful here.
Das zweite Ausführungsbeispiel gemäß Figur 3 unterscheidet sich von dem Ausführungsbeispiel aus Figur 2 allein dadurch, dass der Schichtverbund 12 als dritte Folienschicht eine Zwischenfolie 9 zwischen dem Foliensubstrat 4 und der Verstärkungsfolie 5 aufweist. Die Zwischenfolie 9 besitzt eine Aussparung 10, in der der Flip-Chip 7 zum Schutz gegen mechanische Belastungen aufgenommen ist. Auf die Zwischenfolie 9 mit der Aussparung 10 kann verzichtet werden, wenn der Flip-Chip 7 sehr dünn und flexibel ist, wie im Falle des Ausführungsbeispiels gemäß Figur 2. Es ist auch denkbar bei dem Ausführungsbeispiel gemäß Figur 2 eine Aussparung in der Verstärkungsfolie 5 zur Aufnahme des Flip-Chips 7 vorzusehen. Diese Aufnahme hätte dann entsprechend die Tiefe der Dicke des Flip-Chips 7 bzw. des Flip-Chip- Aufbaus, oder geringfügig darüber. Da aber das Vorsehen derartiger Aussparungen aufwendig und entsprechend teuer ist, ist der Einsatz der Zwischenfolie 9 im Falle dickerer und/ oder unflexiblerer Flip-Chips 7 vorteilhaft, weil die Aussparung 10 in diesem Falle als durchgehende Öffnung einfach zum Beispiel in einem Stanzschritt erzeugt werden kann. Da die Tiefe der Aussparung lediglich der Dicke des Flip-Chips 7 bzw. des Flip-Chip- Aufbaus, oder geringfügig darüber, entspricht, kann die Zwischenfolie 9 mit einer entsprechend geringen Dicke gewählt werden.The second exemplary embodiment according to FIG. 3 differs from the exemplary embodiment from FIG. 2 solely in that the layer composite 12 has, as the third film layer, an intermediate film 9 between the film substrate 4 and the reinforcing film 5. The intermediate film 9 has a recess 10 in which the flip-chip 7 is accommodated for protection against mechanical stress. On the intermediate foil 9 with the recess 10 can be dispensed with, if the flip-chip 7 is very thin and flexible, as in the case of the embodiment of Figure 2. It is also conceivable in the embodiment of Figure 2 is a recess in the reinforcing sheet 5 for To provide recording of the flip-chip 7. This recording would then corresponding to the depth of the thickness of the flip-chip 7 and the flip-chip structure, or slightly above. However, since the provision of such recesses is complicated and correspondingly expensive, the use of the intermediate foil 9 in the case of thicker and / or less flexible flip-chips 7 is advantageous because the recess 10 in this case can be produced as a through opening simply, for example in a punching step , Because the depth the recess only the thickness of the flip-chip 7 and the flip-chip structure, or slightly above, corresponds, the intermediate foil 9 can be selected with a correspondingly small thickness.
Das dritte Ausführungsbeispiel gemäß Figur 4 zeigt eine andere Variante zum Schutz eines vergleichsweise dicken und/ oder unflexiblen Flip-Chips 7 gegen mechanische Belastungen. Wiederum ist eine Zwischenfolie 9 zwischen dem Foliensubstrat 4 und der Verstärkungsfolie 5 vorgesehen. In diesem Falle besitzt die Zwischenfolie 9 jedoch keine Aussparung sondern be- steht aus einem Material, welches weicher ist als die Materialien des Foliensubstrats 4 und der Verstärkungsfolie 5. Dies gilt zumindest für den Zeitpunkt des Verbindens der drei Folienschichten zum dreischichtigen Schichtverbund 12. So kann die Zwischenfolie 9 zum Beispiel einen niedrigeren Erweichungspunkt besitzen als das Foliensubstrat 4 und die Verstärkungsfolie 5, so dass sie beim Laminieren der Schichten unter erhöhter Temperatur wesentlich weicher ist als die Folienschichten des Foliensubstrats 4 und der Verstärkungsfolie 5. Auf diese Weise lässt sich der Flip-Chip 7 in die Zwischenfolie 9 einbetten.The third embodiment according to FIG. 4 shows another variant for protecting a comparatively thick and / or inflexible flip chip 7 against mechanical loads. Again, an intermediate foil 9 is provided between the foil substrate 4 and the reinforcing foil 5. In this case, however, the intermediate film 9 does not have a cutout but consists of a material which is softer than the materials of the film substrate 4 and the reinforcing film 5. This applies at least to the time of joining the three film layers to the three-layer laminate 12. Thus For example, the intermediate foil 9 has a lower softening point than the foil substrate 4 and the reinforcing foil 5, so that it is considerably softer when laminating the layers under elevated temperature than the foil layers of the foil substrate 4 and the reinforcing foil 5. Embed chip 7 in the intermediate foil 9.
Die Zwischenfolie 9 kann insbesondere auch aus einem Schaumstoffmaterial bestehen, welches mit den beiden anderen Folienschichten 4, 5 warm- oder kaltverklebt wird. Der Bereich des Flip-Chips 7 kann beim Verkleben von Klebstoff freigehalten werden, so dass keine feste Verbindung zwischen dem Flip-Chip 7 und der Zwischenschicht 9 besteht. Dadurch wird der Flip-Chip 7 mechanisch von der Zwischenschicht 9 entkoppelt.The intermediate film 9 may in particular also consist of a foam material which is hot or cold glued to the two other film layers 4, 5. The region of the flip-chip 7 can be kept free during adhesive bonding, so that there is no firm connection between the flip-chip 7 and the intermediate layer 9. As a result, the flip-chip 7 is mechanically decoupled from the intermediate layer 9.
Figur 5 zeigt beispielhaft die Herstellung der Chipkarten 1 in einem Rolle-zu- RoIIe- Verfahren. In entsprechender Weise können die Chipkarten 1 auch aus bogenförmig zur Verfügung gestellten Folienschichten hergestellt werden. Das Verfahren beginnt mit dem Bereitstellen eines Foliensubstrats 4, auf dem zumindest das Kommunikations-Kontaktlayout 2 und das Flip-Chip- Kontaktlayout 6 vorhanden und mittels der Vias 8 (Figur 2) elektrisch leitend miteinander verbunden sind. Soweit noch nicht vorhanden, werden zunächst Flip-Chips 2 auf die Flip-Chip-Kontaktlayouts 6 montiert. Anschließend wird das Foliensubstrat 4 mit der Verstärkungsfolie 5 und - in diesem Falle - der Zwischenfolie 9 zusammengeführt. Vor dem Zusammenführen werden in einer ersten Stanzstation 11 Aussparungen 10 aus der Zwischenfolie 9 ausgestanzt, in denen anschließend die Flip-Chips 7 zu liegen kommen. Die Fo- lienschichten 4, 5, 9 werden anschließend unter Anwendung erhöhtenFIG. 5 shows by way of example the production of the chip cards 1 in a roll-to-roll method. In a corresponding manner, the chip cards 1 can also be produced from film layers made available in an arc shape. The method begins with the provision of a film substrate 4, on which at least the communication contact layout 2 and the flip-chip contact layout 6 are present and electrically connected to one another by means of the vias 8 (FIG. 2). If not yet available, first flip-chips 2 are mounted on the flip-chip contact layouts 6. Subsequently, the film substrate 4 is brought together with the reinforcing film 5 and, in this case, the intermediate film 9. Before merging 11 recesses 10 are punched out of the intermediate foil 9 in a first punching station, in which then the flip-chips 7 come to rest. The film layers 4, 5, 9 are subsequently elevated using
Drucks p und erhöhter Temperatur T zu einem Schichtverbund 12 laminiert. Aus dem Schichtverbund 12 werden dann in einer zweiten Stanzstation 13 die Chipkarten 1 ausgestanzt. Der Rest des Folienverbunds 12 wird auf eine Abfallspule aufgewickelt. Die Chipkarten 1 können noch vor dem Heraus- trennen in einer entsprechenden hier nicht dargestellten Station personalisiert und/ oder bedruckt werden, z.B. durch Laserbeschriftung.Pressure p and elevated temperature T laminated to a laminate 12. From the layer composite 12, the chip cards 1 are then punched out in a second punching station 13. The rest of the film composite 12 is wound onto a waste bobbin. The chip cards 1 can be personalized and / or printed prior to separation in a corresponding station, not shown here, e.g. by laser inscription.
Figur 6 zeigt eine Chipkarte 1 in Gestalt eines USB-Tokens. Das Kontaktlayout 2 für die kontaktbehaftete Kommunikation mit und Stromversorgung durch ein externes Gerät umfasst die beiden voreilenden äußeren Pins 14, 15 für die Versorgungsspannung und die kürzeren Pins 16, 17 für den Datenverkehr.FIG. 6 shows a chip card 1 in the form of a USB token. The contact layout 2 for the contact-type communication with and power supply by an external device comprises the two leading outer pins 14, 15 for the supply voltage and the shorter pins 16, 17 for the data traffic.
Figur 7 zeigt schematisch im Querschnitt ein weiteres Ausführungsbeispiel für einen Schichtaufbau 12, der sich von den Ausführungsbeispielen gemäß Figuren 2 bis 4 im wesentlichen dadurch unterscheidet, dass anstatt der Verstärkungsfolie 5 eine Spritzgussschicht 51 als Verstärkungsschicht vorgesehen ist, um den Schichtverbund 12 zu bilden. Eine Zwischenfolie 9 mit Aussparungen 10 zur Aufnahme der Flip-Chips 7, wie in Bezug auf Figur 3 be- schrieben, kann zusätzlich vorgesehen sein. Die Verbindung der Spritzgussschicht 5' mit dem Foliensubstrat 4 - bzw. alternativ mit der Zwischenschicht 9 - kann in einfacher Weise dadurch realisiert werden, dass das Foliensubstrat 4 mit dem Spritzgussmaterial der Spritzgussschicht 5' hinterspritzt wird. Dazu kann entweder das gesamte Foliensubstrat 4 mit den darauf montierten Flip-Chips 7 hinterspritzt werden. Alternativ kann das Foliensubstrat 4 zuvor aber auch in Streifen geschnitten werden und dann mit der Spritzgussschicht 5' hinterspritzt werden. Ein solcher Streifen ist in Figur 8 dargestellt. Aus dem streifenförmigen Schichtverbund 12 werden dann die Chipkarten 1 herausgetrennt, beispielsweise ausgestanzt, und es verbleiben entsprechende Löcher 18 im Schichtverbund 12. FIG. 7 shows schematically in cross section a further exemplary embodiment of a layer structure 12, which differs essentially from the exemplary embodiments according to FIGS. 2 to 4 in that, instead of the reinforcing film 5, an injection-molded layer 5 1 is provided as the reinforcing layer in order to form the layer composite 12. An intermediate film 9 with recesses 10 for receiving the flip chips 7, as described with reference to FIG. written, can be additionally provided. The connection of the injection-molding layer 5 'to the film substrate 4 - or alternatively to the intermediate layer 9 - can be realized in a simple manner by back-molding the film substrate 4 with the injection-molding material of the injection-molding layer 5'. For this purpose, either the entire film substrate 4 with the flip-chips 7 mounted thereon can be back-injected. Alternatively, however, the film substrate 4 can be previously cut into strips and then back-injected with the injection-molding layer 5 '. Such a strip is shown in FIG. From the strip-shaped layer composite 12, the chip cards 1 are then cut out, for example punched, and there are corresponding holes 18 in the layer composite 12th

Claims

P a t e n t a n s p r ü c h e Patent claims
1. Verfahren zum Herstellen von Chipkarten (1), umfassend die Schritte: Zurverfügungstellen eines Foliensubstrats (4) mit einer Vorderseite (4a) und einer Rückseite (4b), wobei auf der Vorderseite (4a) mehrereA method for producing smart cards (1), comprising the steps of: providing a film substrate (4) having a front side (4a) and a back side (4b), wherein on the front side (4a) several
Kontaktlayouts (2) zur kontaktbehafteten Kommunikation der herzustellenden Chipkarten mit externen Kommunikationsgeräten und auf der Rückseite (4b) mehrere Kontaktlayouts (6) für den Anschluss jeweils mindestens eines Flip-Chips (7) vorhanden sind und wobei die mehreren Flip-Chip-Kontaktlayouts (6) mit jeweils einem der mehreren Kommunikations-Kontaktlayouts (2) elektrisch leitend verbunden sind, soweit die mehreren Flip-Chip-Kontaktlayouts (6) noch nicht mit Flip- Chips (7) bestückt sind, Montieren von Flip-Chips (7) auf die Flip- Chip-Kontaktlayouts (6),Contact layouts (2) for contact-based communication of the chip cards to be produced with external communication devices and on the back (4b) a plurality of contact layouts (6) for connecting at least one flip-chip (7) are provided and wherein the plurality of flip-chip contact layouts (6 ) are electrically connected to one of the plurality of communication contact layouts (2), as far as the plurality of flip-chip contact layouts (6) are not yet equipped with flip chips (7), mounting flip-chips (7) on the Flip-chip contact layouts (6),
Zurverfügungstellen einer Verstärkungsschicht (5; 5'), Verbinden des mit den Flip-Chips (7) bestückten Foliensubstrats (4) mit der Verstärkungsschicht (5, 5') zu einem Schichtverbund (12), und Heraustrennen einzelner Chipkarten (1) aus dem Schichtverbund (12) mit Chipkarten-Endproduktabmessungen.Providing a reinforcing layer (5, 5 '), connecting the film substrate (4) equipped with the flip chip (7) to the reinforcing layer (5, 5') to form a layer composite (12), and separating out individual chip cards (1) from the latter Layer composite (12) with chip card end product dimensions.
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass das Foliensubstrat (4) mit auf der Rückseite (4b) vorgesehenen Spulen (3, 3a), die mit den Flip-Chips (7) oder Flip-Chip-Kontaktlayouts (8) in Verbindung ste- hen oder in Verbindung gebracht wird, zur Verfügung gestellt wird oder dass eine solche Spule (3, 3a) auf der Rückseite (4b) des Foliensubstrats (4) vorgesehen wird. 2. The method according to claim 1, characterized in that the film substrate (4) provided on the back (4b) coils (3, 3a) with the flip-chips (7) or flip-chip contact layouts (8) in Connection is provided or is provided, or that such a coil (3, 3a) on the back (4b) of the film substrate (4) is provided.
3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Verstärkungsschicht als Verstärkungsfolie (5) zur Verfügung gestellt wird.3. The method according to claim 1 or 2, characterized in that the reinforcing layer is provided as a reinforcing sheet (5).
4. Verfahren nach Anspruch 3, dadurch gekennzeichnet, dass der Schichtverbund (12) nur aus den zwei genannten Folienschichten (4, 5) hergestellt wird.4. The method according to claim 3, characterized in that the layer composite (12) only from the two mentioned film layers (4, 5) is produced.
5. Verfahren nach Anspruch 3, gekennzeichnet durch die weiteren Schritte des Zurverfügungstellens einer Zwischenfolie (9) und Anordnens der Zwischenfolie zwischen dem Foliensubstrat (4) und der Verstärkungsfolie (5) vor dem Schritt des Verbindens zu dem Schichtverbund (12).5. The method according to claim 3, characterized by the further steps of providing an intermediate film (9) and arranging the intermediate film between the film substrate (4) and the reinforcing film (5) before the step of bonding to the laminate (12).
6. Verfahren nach Anspruch 5, dadurch gekennzeichnet, dass die Zwischenfolie (9) Aussparungen (10) zur Aufnahme der Flip-Chips (7) besitzt und so zwischen dem Foliensubstrat (4) und der Verstärkungsfolie (5) angeordnet wird, dass in den Aussparungen (10) jeweils ein Flip-Chip (7) zu liegen kommt.6. The method according to claim 5, characterized in that the intermediate film (9) has recesses (10) for receiving the flip-chips (7) and is arranged between the film substrate (4) and the reinforcing film (5) that in the Recesses (10) each a flip-chip (7) comes to rest.
7. Verfahren nach Anspruch 6, dadurch gekennzeichnet, dass die Tiefe der Aussparungen (10) der Zwischenfolie (9) so gewählt wird, dass sie der7. The method according to claim 6, characterized in that the depth of the recesses (10) of the intermediate foil (9) is selected so that they
Dicke der Flip-Chips (7) entspricht.Thickness of the flip chips (7) corresponds.
8. Verfahren nach Anspruch 6 oder 7, dadurch gekennzeichnet, dass als Zwischenfolie (9) eine solche zur Verfügung gestellt wird, bei der die Aus- sparungen (10) als durchgehende Öffnungen in der Zwischenfolie vorgesehen sind.8. The method according to claim 6 or 7, characterized in that as intermediate foil (9) is provided such, in which the recesses (10) are provided as through openings in the intermediate foil.
9. Verfahren nach Anspruch 5, dadurch gekennzeichnet, dass für die Zwischenfolie (9) ein Material gewählt wird, welches weicher ist als die Ma- terialien des Foliensubstrats (4) und der Verstärkungsfolie (5), wobei beim Schritt des Verbindens zu dem Schichtverbund (12) die Flip-Chips (7) in die Zwischenfolie (9) eingebettet werden.9. The method according to claim 5, characterized in that for the intermediate film (9) a material is chosen which is softer than the Ma Materials of the film substrate (4) and the reinforcing film (5), wherein in the step of connecting to the layer composite (12), the flip-chips (7) are embedded in the intermediate film (9).
10. Verfahren nach Anspruch 9, dadurch gekennzeichnet, dass als Material für die Zwischenfolie (9) ein Schaumstoffmaterial gewählt wird.10. The method according to claim 9, characterized in that a foam material is selected as the material for the intermediate film (9).
11. Verfahren nach einem der Ansprüche 5 bis 10, dadurch gekennzeichnet, dass der Folienverbund (12) nur aus den genannten drei Folienschichten (4, 5, 9) hergestellt wird.11. The method according to any one of claims 5 to 10, characterized in that the film composite (12) only from said three film layers (4, 5, 9) is produced.
12. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Verstärkungsschicht als Spritzgussmaterial (51) zur Verfügung gestellt wird, welches mit dem Foliensubstrat (4) durch Hinterspritzen des Foliensubstrats (4) verbunden wird.12. The method according to claim 1 or 2, characterized in that the reinforcing layer as injection molding material (5 1 ) is provided which is connected to the film substrate (4) by injection molding of the film substrate (4).
13. Verfahren nach einem der Ansprüche 1 bis 12, dadurch gekennzeichnet, dass der Schritt des Verbindens zu einem Schichrverbund (12) die Anwendung von Druck (p) und Temperatur (T) umfasst.13. The method according to any one of claims 1 to 12, characterized in that the step of connecting to a Schichrverbund (12) comprises the application of pressure (p) and temperature (T).
14. Verfahren nach einem der Ansprüche 1 bis 13, dadurch gekennzeichnet, dass die Dicke (D) des Schichtverbunds (12) so gewählt wird, dass sie der ISO-Dicke von ID-1-Chipkarten entspricht.14. The method according to any one of claims 1 to 13, characterized in that the thickness (D) of the layer composite (12) is selected so that it corresponds to the ISO thickness of ID-1 chip cards.
15. Verfahren nach einem der Ansprüche 1 bis 14, dadurch gekennzeichnet, dass die Chipkarten-Endproduktabmessungen den Abmessungen von Plug-In-SIMs oder ID-1-Chipkarten entsprechen. 15. The method according to any one of claims 1 to 14, characterized in that the chip card end product dimensions correspond to the dimensions of plug-in SIMs or ID-1 chip cards.
16. Verfahren nach einem der Ansprüche 1 bis 15, dadurch gekennzeichnet, dass die Chipkarten (1) aus dem Schichtverbund (12) in Gestalt von USB-Tokens (Fig. 6) herausgetrennt werden.16. The method according to any one of claims 1 to 15, characterized in that the chip cards (1) from the layer composite (12) in the form of USB tokens (Fig. 6) are separated out.
17. Verfahren nach einem der Ansprüche 1 bis 16, gekennzeichnet durch den weiteren Schritt des Personalisierens der Chipkarten (1).17. The method according to any one of claims 1 to 16, characterized by the further step of personalizing the chip cards (1).
18. Verfahren nach Anspruch 17, dadurch gekennzeichnet, dass das Personalisieren der Chipkarten (1) vor dem Heraustrennen der Chipkarten aus dem Schichtverbund (12) erfolgt.18. The method according to claim 17, characterized in that the personalization of the chip cards (1) takes place before the separation of the chip cards from the layer composite (12).
19. Verfahren nach einem der Ansprüche 1 bis 18, dadurch gekennzeichnet, dass das Foliensubstrat (4) als Bogen- oder Rollenmaterial zur Verfügung gestellt wird.19. The method according to any one of claims 1 to 18, characterized in that the film substrate (4) is provided as a sheet or roll material.
20. Chipkarte (1), umfassend einen Schichtverbund (12) mit zwei sich ü- ber die gesamte Chipkarte erstreckenden Schichten (4, 5; 4, 5'), von denen eine erste Schicht als Folienschicht (4) ausgebildet ist und eine nach außen weisende Vorderseite (4a) und eine nach innen weisende Rückseite (4b) be- sitzt, wobei auf der Vorderseite (4a) ein Kommunikations-Kontaktlayout (2) zur kontaktbehafteten Kommunikation der Chipkarte (1) mit externen Kommunikationsgeräten aufgebracht ist, das elektrisch leitend mit einem Flip-Chip-Kontaktlayout (6) auf der Rückseite (4b) verbunden ist, auf dem ein Flip-Chip (7) montiert ist.20. Chip card (1), comprising a layer composite (12) with two Ü over the entire chip card extending layers (4, 5, 4, 5 '), of which a first layer is formed as a film layer (4) and one after outside facing front side (4a) and an inwardly facing back (4b) sitting, wherein on the front side (4a) a communication contact layout (2) for contact-type communication of the smart card (1) is applied with external communication devices, the electrically conductive is connected to a flip-chip contact layout (6) on the back (4b), on which a flip-chip (7) is mounted.
21. Chipkarte nach Anspruch 20, dadurch gekennzeichnet, dass zumindest die Kontaktlayouts (2) auf der Vorderseite (4a) der ersten Schicht (4) als Metallisierung der ersten Schicht vorhanden sind. 21. Chip card according to claim 20, characterized in that at least the contact layouts (2) on the front side (4a) of the first layer (4) are present as metallization of the first layer.
22. Chipkarte nach einem der Ansprüche 20 oder 21, dadurch gekennzeichnet, dass auf der Rückseite (4b) der ersten Schicht (4) eine mit dem Flip- Chip-Kontaktlayout (6) oder mit dem Flip-Chip (7) in Verbindung stehende Spule (3, 3a) vorgesehen ist.22. Chip card according to one of claims 20 or 21, characterized in that on the back (4b) of the first layer (4) one with the flip-chip contact layout (6) or with the flip-chip (7) in connection standing Coil (3, 3a) is provided.
23. Chipkarte nach einem der Ansprüche 20 bis 22, dadurch gekennzeichnet, dass die zweite Schicht ebenfalls als Folienschicht (5) ausgebildet ist.23. Chip card according to one of claims 20 to 22, characterized in that the second layer is also formed as a film layer (5).
24. Chipkarte nach Anspruch 23, dadurch gekennzeichnet, dass der Schichtverbund (12) zweischichtig ist.24. Chip card according to claim 23, characterized in that the layer composite (12) is two-layered.
25. Chipkarte nach Anspruch 23, gekennzeichnet durch eine zwischen der ersten Schicht (4) und der zweiten Schicht (5) liegende Zwischenfolie (9).25. Chip card according to claim 23, characterized by an intermediate film (9) lying between the first layer (4) and the second layer (5).
26. Chipkarte nach Anspruch 25, dadurch gekennzeichnet, dass die Zwischenfolie (9) eine Aussparung (10) besitzt, in der der Flip-Chip (7) angeordnet ist.26. Chip card according to claim 25, characterized in that the intermediate foil (9) has a recess (10) in which the flip-chip (7) is arranged.
27. Chipkarte nach Anspruch 26, dadurch gekennzeichnet, dass die Aussparung (10) eine der Dicke des Flip-Chips (7) entsprechende Tiefe besitzt.27. Chip card according to claim 26, characterized in that the recess (10) has one of the thickness of the flip-chip (7) corresponding depth.
28. Chipkarte nach Anspruch 26 oder 27, dadurch gekennzeichnet, dass die Aussparung (10) als durchgehende Öffnung in der Zwischenfolie (9) vor- gesehen ist.28. Chip card according to claim 26 or 27, characterized in that the recess (10) is provided as a continuous opening in the intermediate foil (9).
29. Chipkarte nach Anspruch 25, dadurch gekennzeichnet, dass der Flip- Chip (7) in der Zwischenfolie (9) eingebettet ist. 29. Chip card according to claim 25, characterized in that the flip-chip (7) in the intermediate foil (9) is embedded.
30. Chipkarte nach einem der Ansprüche 25 bis 29, dadurch gekennzeichnet, dass der Schichtverbund (12) dreischichtig ist.30. Chip card according to one of claims 25 to 29, characterized in that the layer composite (12) is three-layered.
31. Chipkarte nach einem der Ansprüche 20 bis 22, dadurch gekenn- zeichnet, dass die zweite Schicht eine Spritzgussschicht (5') ist.31. Chip card according to one of claims 20 to 22, characterized in that the second layer is an injection-molded layer (5 ').
32. Chipkarte nach einem der Ansprüche 20 bis 31, dadurch gekennzeichnet, dass die Chipkarte (1) die Abmessungen eines Plug-In-SIMs oder einer ID-I -Chipkarte ist.32. Chip card according to one of claims 20 to 31, characterized in that the chip card (1) is the dimensions of a plug-in SIM or ID-I chip card.
33. Chipkarte nach einem der Ansprüche 20 bis 31, dadurch gekennzeichnet, dass die Chipkarte (1) ein USB-Token (Fig. 6) ist. 33. Chip card according to one of claims 20 to 31, characterized in that the chip card (1) is a USB token (Fig. 6).
EP09732963A 2008-04-18 2009-04-14 Chip card, and method for the production thereof Ceased EP2269168A1 (en)

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DE102008019571A DE102008019571A1 (en) 2008-04-18 2008-04-18 Chip card and method for its production
PCT/EP2009/002732 WO2009127395A1 (en) 2008-04-18 2009-04-14 Chip card, and method for the production thereof

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EP (1) EP2269168A1 (en)
CN (1) CN102007503B (en)
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US8313981B2 (en) 2012-11-20
CN102007503B (en) 2013-10-30
US8390132B2 (en) 2013-03-05
US20120112367A1 (en) 2012-05-10
DE102008019571A1 (en) 2009-10-22
US20110042830A1 (en) 2011-02-24
WO2009127395A1 (en) 2009-10-22

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