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EP1953783B1 - Elektromagnetisches Relais - Google Patents

Elektromagnetisches Relais Download PDF

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Publication number
EP1953783B1
EP1953783B1 EP20070002134 EP07002134A EP1953783B1 EP 1953783 B1 EP1953783 B1 EP 1953783B1 EP 20070002134 EP20070002134 EP 20070002134 EP 07002134 A EP07002134 A EP 07002134A EP 1953783 B1 EP1953783 B1 EP 1953783B1
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EP
European Patent Office
Prior art keywords
molded resin
surface side
holes
electromagnetic relay
resin cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP20070002134
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English (en)
French (fr)
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EP1953783A1 (de
Inventor
Yasuhisa Nishi
Hiromitsu Ito
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Tokin Corp
Original Assignee
NEC Tokin Corp
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Publication date
Application filed by NEC Tokin Corp filed Critical NEC Tokin Corp
Priority to DE200760008047 priority Critical patent/DE602007008047D1/de
Priority to EP20070002134 priority patent/EP1953783B1/de
Publication of EP1953783A1 publication Critical patent/EP1953783A1/de
Application granted granted Critical
Publication of EP1953783B1 publication Critical patent/EP1953783B1/de
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/02—Bases, casings, or covers
    • H01H9/04—Dustproof, splashproof, drip-proof, waterproof, or flameproof casings
    • H01H9/047—Dustproof, splashproof, drip-proof, waterproof, or flameproof casings provided with venting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/02—Bases; Casings; Covers
    • H01H50/023—Details concerning sealing, e.g. sealing casing with resin

Definitions

  • the present invention relates to an electromagnetic relay and more particularly to the electromagnetic relay that can be suitably used as vehicle-mounted electrical components.
  • a conventional electromagnetic relay having a switching function by opening and closing of electrical contacts and being used widely and commonly as a vehicle-mounted component includes electrical contacts and a molded resin material in which a molded resin base and an electromagnetic driving portion formed on the molded resin base are covered with a molded resin cover and is sealed with a thermosetting sealing resin.
  • an escape path for air formed inside the relay is shut and, therefore, hermeticity occurs readily due to a thermal stress caused by reflow heating especially at an interface between a metal and a resin each having a different thermal expansion coefficient or in a bonding portion between a molded resin and a sealing resin.
  • water, solvent, or a like invade from the outside, which causes an operational failure and a contacting failure of contact portions.
  • Figure 6 is an exploded perspective view of a conventional electromagnetic relay.
  • Figures 7A and 7B are cross-sectional views explaining a structure of a conventional molded resin cover of Figs. 6A and 6B
  • Fig. 7A is a vertical sectional view of a conventional unsealed- type of a through hole
  • Fig. 7B is a vertical sectional view of a conventional sealed-type through-hole.
  • an electromagnetic relay main body 3 assembled on a molded resin base 4 is covered with a molded resin cover 1 and is sealed with a sealing resin 5 and through-holes 2 are formed on a top surface of the molded resin cover 1.
  • two types of the through- holes 2 one is an unsealed type of the through-hole in which an unsealed-type portion 2a shown in Fig. 7A is not shut while a sealed-type portion 2b shown in Fig. 7B is shut by fusing a top portion of the through-hole 2 and using a thermal caulking process at its top portion so that the electromagnetic relay is hermetically sealed.
  • the above unsealed-type through-holes 2 (2a) are mainly used.
  • the through-holes 2 formed on the top of the molded resin cover 1 since conditions for shapes and diameters are to be satisfied by considering moldability and workability of thermal caulking and since its aperture portion is wide, there is a risk that all kinds of substances on an outside of the electromagnetic relay invade easily into the electromagnetic relay.
  • the electromagnetic relay when used as a vehicle-mounted component by performing the reflow heating, in some cases, a coating agent is applied to all surfaces of the electromagnetic relay after being mounted on a printed circuit board and, in this case, the application of the coating agent to the through-holes 2 should be avoided. If the through-holes 2 are shut by the coating agent, the coating agent invades inside of the electromagnetic relay in some cases, causes an operational failure and/or contacting failure at contact portions. Moreover, a whole cleaning method in which the electromagnetic relay together with the printed circuit board are soaked should be also avoided. Thus, the unsealed through-holes 2 (2a) which do not provide a sealed state have a remarkably high risk and a limitation is imposed on the execution of unsealing method.
  • Conventional technology discloses a method of increasing hermeticity in the electromagnetic relay in which the conventional sealing resin 5 is replaced with a new sealing resin 5 having high heat-resistance and a bonding characteristic being higher than those of the conventional molded resin cover 1 and molded resin base 4 as shown in Figs. 6A and 6B .
  • Patent Reference 1 Japanese Patent Application Laid-open No. Hei 5-242784
  • Patent Reference 2 Japanese Patent Application Laid-open No. Hei 11- 145667
  • polymerized monomers are applied which form air holes by adding radiation of an electromagnetic wave, ultraviolet rays, or a like.
  • the above-disclosed technology to increase heat-resistance and/or bonding characteristic of the sealing resin 5 are not sufficient to provide methods of improving bonding strength that can satisfy all conditions for diverse reflow heating.
  • the sealing resin 5 is vulnerable to changes by a coating condition, thermosetting condition, circumferential conditions such as an ambient temperature, humidity or a like and, therefore, its bonding characteristic is easy to change and it is impossible to keep its bonding strength constant in the manufacturing processes. As a result, the limit point causing the hermeticity failure changes.
  • Patent Reference 1 Each of the technology to apply porous filters (the Patent Reference 1) and the technology to apply polymerized monomers to form air holes has problems (Patent Reference 2) in that it is difficult to establish the method of the applications. Moreover, the heat stress in the reflow heating causes it difficult to keep the air holes constantly porous. Additionally, new problems of an increase of component counts, increased costs caused by the increase of component counts, and increased number of man-hours arise.
  • US-A-4 427 863 discloses an electromagnetic relay comprising: a main body comprising an electrical contact portion, an electromagnetic driving portion, and a molded resin base for mounting the electrical contact portion and the electromagnetic driving portion, wherein the main body is covered with a molded resin cover and is sealed with a sealing resin, wherein one or more through-holes are formed by applying a laser beam to desired positions from an inner surface side thereof so that the through-holes each are within a size range in which no invasion of water from the outside to the inner side occurs and wherein air permeability of the molded resin base can be maintained through the through-holes.
  • an object of the present invention to provide an electromagnetic relay which is capable of preventing an operational failure and a contacting failure at contact portions by maintaining air permeability and resistance to water (water invasion preventing property) even after being heated at a high temperature and by avoiding invasion of a coating agent. That is, the object of the present invention is to provide the electromagnetic relay which enables application of the coating agent even after being mounted on printed circuit boards having undergone reflow heating and water cleaning without causing an increase in component counts while maintaining air permeability and preventing the invasion of water.
  • the electromagnetic relay of the present invention has a method of forming stable air ventilating openings (air holes) on the molded resin even after being heated at high temperature, which ensures only high air permeability and resistance to water (water invasion preventing property) of the electromagnetic relay.
  • the size of each of the air ventilating openings is fine and its shape and dimension can be fully controlled and, as a result, it is possible to achieve high resistance to water while controlling air permeability. Additionally, it is made possible to avoid invasion of the coating agent, thereby preventing the operational failure and contacting failure at contact portions.
  • a diameter of each air ventilating opening falls within a range of 0.1 ⁇ m to 10 ⁇ m.
  • the diameter of each air ventilating opening is a size of an exit portion through which laser beam passes on a surface of a molded resin making up the electromagnetic relay.
  • the size of the laser-beam irradiating portion is changed to calibrate a diameter of the exit portion that allows laser beam to pass through.
  • each hole of 0.1 ⁇ m to 10 ⁇ m is a size range in which no invasion of water into an inside of the electromagnetic relay occurs and in which air permeability can be maintained when water is in contact with the surface of the molded resin and when a water contact angle to the molded resin to be used for the electromagnetic relays is taken into consideration in general. Moreover, resistance to water can be adjusted within the above size range.
  • any one of excimer laser, CO 2 laser, or YAG laser may be applied to the above processing.
  • a through-hole cannot be formed by one-time laser beam irradiation depending on a thickness of the molded resin.
  • the through-hole can be formed by applying laser beam a plurality of times to the same spot.
  • FIGs 1A and 1B are diagrams showing an electromagnetic relay according to a first embodiment of the present invention and Fig. 1A is a perspective view of a molded resin cover 1 with its aperture portion faced upward and Fig. 1B is an expanded diagram showing portions 6 (6a, 6b) where laser-beam irradiation was performed.
  • laser beam is applied surely from an inside of the molded resin cover 1, that is, from a face being opposite to a main body of the electromagnetic relay.
  • Such a technology of applying laser beam is provided by, for example, Shinozaki Manufacturing Co., Ltd (Japan).
  • Figure 5 is a cross-sectional view showing a relation between the diameter ⁇ A of the laser beam irradiated portion (laser beam coming-in side) and the diameter ⁇ B of the laser beam passing-through portion (laser beam going-out side) .
  • t denotes a thickness of molded resin
  • ⁇ denotes an angle related to focusing of the laser beam.
  • Figure 2 is a graph showing a relation between the diameter ⁇ A of the laser-beam irradiated portion 6a and the diameter ⁇ B of the laser beam passing-through portion 6b.
  • the thickness "t" is set to be 100 ⁇ m.
  • the size ⁇ B of the laser beam passing-through portion 6b is calibrated so as to be equal to an air ventilating opening size of 1 ⁇ m to 10 ⁇ m.
  • the laser-beam irradiated portions 6a are provided with pitches among central points of the irradiated portions each being longer than the diameter ⁇ A.
  • the molded resin cover 1 of the embodiment employs uses, as its material, resins which have been generally used by known electromagnetic relays. These resins obtained after being molded have a large water contact angle and, therefore, have high resistance to water. Moreover, the employed molded resin cover 1 has high heat resistance and, as a result, even if a reflow heating process is performed under temperature conditions to be applied to lead-less soldering melting or a like, no change in shapes of the processed air ventilating openings occurs due to heat.
  • a coating agent applicable to the embodiment it is preferable to select a coating agent having surface wettability to the molded resin cover 1 being equal or less than that of water, that is, having a contact angle of the coating agent to the molded resin cover 1 exceeding a contact angle of water to the molded resin cover 1.
  • Figs. 3A and 3B are diagrams illustrating an electromagnetic relay according to a second embodiment of the present invention.
  • Fig. 3A is a perspective view of a molded resin base 4 on which a main body of the electromagnetic relay is mounted and of portions 7 in which laser beam was applied
  • Fig. 3B is an expanded perspective view of portions 7 in which laser beam was applied.
  • laser beam is applied surely from an inside of a molded resin cover 1.
  • one or more through-holes are formed by applying laser beam to desired positions of the molded resin base 4 from an inner surface side thereof, the desired positions which are not covered with a sealing resin 5 on an outer surface side thereof.
  • the laser-beam irradiated portions 7a are provided with pitches among central points of the laser-beam irradiated portions each being longer than the diameter ⁇ A.
  • the molded resin base 4 of the embodiment employs, as its material, resins which have been generally used by known electromagnetic relays. These resins obtained after being molded have a large water contact angle, thus providing high resistance to water. Moreover, the employed molded resin base 4 has high heat resistance and, as a result, even if a reflow heating process is performed under temperature conditions to be applied to lead-less soldering melting or a like, no change in shapes of the processed air ventilating openings occurs due to heat.
  • a coating agent applicable to the second embodiment shown in Figs. 3A and 3B it is preferable to select a coating agent having surface wettability to the molded resin base 4 being equal or less than that of water, that is, having a contact angle of the coating agent to the molded resin base 4 exceeding a contact angle of water to the molded resin base 4.
  • Figure 4 is an expanded sectional view of a molded resin cover 1 made of a liquid crystal polymer 8 of the third embodiment which is applied to an electromagnetic relay shown in Figs. 6A and 6B . It is a characteristic of the liquid crystal polymer 8 that it becomes liquid crystal phase when being in a melted state.
  • the molded resin cover 1 is of a three-layered structure including a first skin layer 9 with identical orientation of the liquid crystal formed on a surface side, a second skin layer 9 with identical orientation of the liquid crystal formed on a rear side, and a core layer 10 with random orientation of the liquid crystal formed between the first and second skin layers 9.
  • the first and second skin layers 9 have identical orientation of the liquid crystal and ventilation is interrupted completely.
  • the core layer 10 has air permeability due to its random orientation of the liquid crystal and also has a function as a filter.
  • the diameters of laser-beam irradiated portions 11a and 12a are calibrated so that the hole size of each of laser beam passing-through portions 11b and 12b is 0.1 ⁇ m to 10 ⁇ m to form laser-beam applied portions 11 and 12.
  • the laser beam passing-through portions 11b and 12b formed respectively on a surface and a rear of the molded resin cover 1 are not allowed to face each other and their positions are shifted so that the distances for ventilation in the core layer 10 serving as a filter can be secured at its maximum.
  • Ventilation is obtained by the minute air ventilating openings formed on the surface and rear of the molded resin cover 1 made of the liquid crystal polymer 8 and by the filtering function of the core layer 10 serving the intermediate layer.
  • Large water contact angle of the liquid crystal polymer 8 maintains high resistance to water.
  • the liquid crystal polymer 8 has high heat-resistance enough to undergo lead-less soldering melting or a like, and no change in shapes of the processed air ventilating openings occurs due to heat.
  • any coating agent can be used without limitation.
  • the fourth embodiment is described by using Fig. 4 applied in the third embodiment. That is, in the fourth embodiment, a liquid crystal polymer 8 is used as a material for a molded resin base 4 shown in Figs. 6A and 6B . Shapes of air ventilating openings passing through only skin layers by laser beam irradiation are the same as obtained in the third embodiment. Moreover, the molded resin base 4 is coated with a sealing resin 5 from its bottom (outer surface) and laser beams are applied to portions not covered with the sealing resin 5. An electromagnetic relay of the fourth embodiment is assembled using the molded resin base 4 obtained as above and, as a result, the same effect as achieved in the third embodiment is realized. The use of the electromagnetic relay enables improved reliability of automatic parts or electrical components in particular. Besides, in other industrial fields, the present invention can be applied to an electromagnetic relay for application to measuring instruments and apparatus, which improves the reliability of contacting functions of contacts.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Switch Cases, Indication, And Locking (AREA)

Claims (8)

  1. Elektromagnetisches Relais mit: einem Hauptkörper (3) mit einem elektrischen Verbindungsteil, einem elektromagnetischen Treiberteil und einer gegossenen Harzbasis (4) zum Montieren des elektrischen Kontaktteils und des elektromagnetischen Treiberteils,
    wobei der Hauptkörper (3) mit einer gegossenen Harzabdeckung (1) abgedeckt ist und mit einem Dichtharz (5) abgedichtet ist und wobei ein oder mehrere Durchgangslöcher (6) durch Anwenden eines Laserstrahls an gewünschten Positionen der gegossenen Harzabdeckung (1) von ihrer Innenflächenseite (6a) so ausgebildet sind, dass die Durchgangslöcher (6) jeweils innerhalb eines Größenbereiches sind, in dem kein Eintritt von Wasser von einer Außenflächenseite (6b) der gegossenen Harzabdeckung (1) in ihre Innenflächenseite (6a) auftritt und wobei Luftdurchlässigkeit der gegossenen Harzabdeckung (1) durch die Durchgangslöcher (6) aufrecht erhalten werden kann, dadurch gekennzeichnet, dass der Fleckendurchmesser als Lochgröße auf der Außenflächenseite (6b) kleiner ist als auf der Innenflächenseite (6a).
  2. Elektromagnetisches Relais nach Anspruch 1, dadurch gekennzeichnet, dass jedes der Durchgangslöcher (6) innerhalb des Fleckendurchmessers von 0,1 µm bis 10 µm auf der Außenflächenseite der gegossenen Harzabdeckung (1) als Größenbereich eingestellt ist.
  3. Elektromagnetisches Relais mit einem Hauptkörper (3) mit einem elektrischen Kontaktteil, einem elektromagnetischen Treiberteil und einer gegossenen Harzbasis (4) zum Montieren des elektrischen Kontaktteils und des elektromagnetischen Treiberteils,
    wobei der Hauptkörper (3) mit einer gegossenen Harzabdeckung (1) abgedeckt ist und mit einem Dichtharz (5) abgedichtet ist und wobei eines oder mehrere Durchgangslöcher (7) durch Anwenden eines Laserstrahls an gewünschten Positionen der gegossenen Harzbasis (4) von ihrer Innenflächenseite (7a) ausgebildet sind, wobei die gewünschten Positionen nicht mit dem Dichtharz (5) auf einer Außenflächenseite (7b) derart abgedeckt sind, dass die Durchgangslöcher (7) jeweils innerhalb eines Größenbereiches eingestellt sind, in dem kein Eintritt von Wasser von der Außenflächenseite (7b) in ihre Innenflächenseite (7a) auftritt und wobei Luftdurchlässigkeit der gegossenen Harzbasis (4) durch die Durchgangslöcher (7) aufrechterhalten werden kann, dadurch gekennzeichnet, dass der Fleckendurchmesser als Lochgröße auf der Außenflächenseite (7b) geringer ist als der auf der Innenflächenseite (7a).
  4. Elektromagnetisches Relais nach Anspruch 3, dadurch gekennzeichnet, dass jedes der Durchgangslöcher (7) innerhalb des Fleckendurchmessers von 0,1 µm bis 10 µm auf der Außenflächenseite der gegossenen Harzbasis (4) als Größenbereich eingestellt ist.
  5. Elektromagnetisches Relais mit: einem Hauptkörper (3) mit einem elektrischen Kontaktteil, einem elektromagnetischen Treiberteil und einer gegossenen Harzbasis (4) zum Montieren des elektrischen Kontaktteils und des elektromagnetischen Treiberteils,
    wobei der Hauptkörper (3) mit einer gegossenen Harzabdeckung (1) abgedeckt ist und mit einem Dichtharz (5) abgedichtet ist, dadurch gekennzeichnet, dass die gegossene Harzabdeckung (1) ein Flüssigkristallpolymer (8) mit einer Hautschicht (9) mit identischer Orientierung aufweist, die auf beiden Seiten einer Kernschicht (10) in einer Zwischenposition zwischen den Hautschichten (9) ausgebildet ist,
    wobei die Kernschicht (10) eine statistische Orientierung des Flüssigkristallpolymers aufweist und aufgrund der statistischen Orientierung des Flüssigkristallpolymers Luftdurchlässigkeit aufweist, und
    dass Laserstrahlen an gewünschten Positionen der gegossenen Harzabdeckung (1) von sowohl ihrer Innen- als auch ihrer Außenseite angewendet werden, so dass der Laserstrahl durch nur die Hautschichten (9) dringt, wobei die Kernschicht (10) durch den Laserstrahl unbearbeitet bleibt, um eines oder mehrere Durchgangslöcher (10, 12) auf jeder der Hautschichten (9) zu bilden, die jeweils innerhalb eines Größenbereiches liegen, in dem kein Eindringen von Wasser von ihrer Außenflächenseite zu ihrer Innenflächenseite auftritt, und wobei Luftdurchlässigkeit der gegossenen Harzabdeckung (1) durch die Durchgangslöcher (11, 12) aufrechterhalten werden kann.
  6. Elektromagnetisches Relais nach Anspruch 5, dadurch gekennzeichnet, dass jedes Durchgangsloch (11, 12) innerhalb eines Fleckendurchmessers von 0,1 µm bis 10 µm an der Außenflächenseite der gegossenen Harzabdeckung (1) als Größenbereich ausgebildet ist.
  7. Elektromagnetisches Relais mit einem Hauptkörper (3) mit einem elektrischen Kontaktteil, einem elektrischen Treiberteil und einer gegossenen Harzbasis (4) zum Montieren des elektrischen Kontaktteils und des elektromagnetischen Treiberteils, wobei der Hauptkörper (3) mit einer gegossenen Harzabdeckung (1) abgedeckt ist und mit einem Dichtharz (5) abgedichtet ist, dadurch gekennzeichnet, dass die gegossene Harzabdeckung (1) ein Flüssigkristallpolymer (8) mit Hautschichten (9) mit identischer Orientierung aufweist, die auf beiden Seiten einer Kernschicht (9) ausgebildet sind, die in einer Zwischenposition zwischen den Hautschichten (9) liegt,
    dass die Kernschicht (10) eine statistische Orientierung des Flüssigkristallpolymers aufweist und aufgrund ihrer statistischen Orientierung des Flüssigkristallpolymers Luftdurchlässigkeit aufweist und
    dass Laserstrahlen in gewünschten Positionen der gegossenen Harzbasis (4) sowohl an ihrer Innen- als auch an ihrer Außenseite angewendet werden, wobei die gewünschten Positionen nicht mit dem Dichtharz (5) auf ihrer Außenflächenseite bedeckt sind, so dass die Laserstrahlen nur durch die Hautschichten (9) dringen, wobei die Kernschicht (10) durch die Laserstrahlen unbearbeitet bleibt, um eines oder mehrere Durchgangslöcher (11, 12) auf jeder der Hautschichten (9) zu bilden, die jeweils innerhalb eines Größenbereiches liegen, bei dem kein Eindringen von Wasser von ihrer Außenflächenseite in ihre Innenflächenseite auftritt, und wobei Luftdurchlässigkeit der gegossenen Harzbasis (4) durch die Durchgangslöcher (11, 12) aufrechterhalten werden kann.
  8. Elektromagnetisches Relais nach Anspruch 7, wobei das elektromagnetische Relais dadurch gekennzeichnet ist, dass die Durchgangslöcher (11, 12) jeweils innerhalb eines Fleckendurchmessers von 0,1 µm bis 10 µm an der Außenflächenseite der gegossenen Harzbasis (4) als Größenbereich eingestellt sind.
EP20070002134 2007-01-31 2007-01-31 Elektromagnetisches Relais Active EP1953783B1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE200760008047 DE602007008047D1 (de) 2007-01-31 2007-01-31 Elektromagnetisches Relais
EP20070002134 EP1953783B1 (de) 2007-01-31 2007-01-31 Elektromagnetisches Relais

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP20070002134 EP1953783B1 (de) 2007-01-31 2007-01-31 Elektromagnetisches Relais

Publications (2)

Publication Number Publication Date
EP1953783A1 EP1953783A1 (de) 2008-08-06
EP1953783B1 true EP1953783B1 (de) 2010-07-28

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113284766B (zh) * 2021-07-19 2021-10-08 深圳市森皓伟业制冷设备有限公司 一种继电器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7824507U1 (de) * 1978-08-17 1984-07-26 Robert Bosch Gmbh, 7000 Stuttgart Elektromagnetisches Relais
US4427863A (en) 1982-03-22 1984-01-24 Izumi Denki Corporation Small-sized relay and method for fabricating the same
DE19840761C1 (de) * 1998-09-07 2000-05-04 Daimler Chrysler Ag Verfahren zur Herstellung eines feuchtigkeitsundurchlässigen Druckausgleichselement für ein Gehäuse
FR2789512B1 (fr) * 1999-02-04 2001-04-27 Chauvin Arnoux Relais electromagnetique a capot enfermant la partie constitutive du relais
JP3338025B2 (ja) * 1999-10-05 2002-10-28 松下電器産業株式会社 液晶表示素子

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EP1953783A1 (de) 2008-08-06

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