EP1824638A4 - Pb free solder alloy - Google Patents

Pb free solder alloy

Info

Publication number: EP1824638A4
Authority: EP; European Patent Office
Prior art keywords: free solder; solder alloy; alloy; free; solder
Prior art date: 2004-11-13
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP05726536A

Other languages

German (de)

French (fr)

Other versions

EP1824638A1 (en

Inventor

Back Ki Sung

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Samsung Electronics Co Ltd

Original Assignee

Samsung Electronics Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2004-11-13

Filing date

2005-02-02

Publication date

2009-07-08

2005-02-02 Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd

2007-08-29 Publication of EP1824638A1 publication Critical patent/EP1824638A1/en

2009-07-08 Publication of EP1824638A4 publication Critical patent/EP1824638A4/en

Status Withdrawn legal-status Critical Current

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Chemical & Material Sciences (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)

EP05726536A 2004-11-13 2005-02-02 Pb free solder alloy Withdrawn EP1824638A4 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
KR1020040092857A KR20050030237A (en)	2004-11-13	2004-11-13	Pb free solder alloy
PCT/KR2005/000305 WO2006052049A1 (en)	2004-11-13	2005-02-02	Pb free solder alloy

Publications (2)

Publication Number	Publication Date
EP1824638A1 EP1824638A1 (en)	2007-08-29
EP1824638A4 true EP1824638A4 (en)	2009-07-08

Family

ID=36336697

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP05726536A Withdrawn EP1824638A4 (en)	2004-11-13	2005-02-02	Pb free solder alloy

Country Status (6)

Country	Link
US (1)	US20090129970A1 (en)
EP (1)	EP1824638A4 (en)
JP (1)	JP2008518791A (en)
KR (1)	KR20050030237A (en)
CN (1)	CN101048258A (en)
WO (1)	WO2006052049A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI465312B (en) *	2005-07-19	2014-12-21	Nihon Superior Co Ltd	A replenished lead-free solder and a control method for copper density and nickel density in a solder dipping bath
WO2007081775A2 (en) *	2006-01-10	2007-07-19	Illinois Tool Works Inc.	Lead-free solder with low copper dissolution
CN1803381A (en) *	2006-01-11	2006-07-19	黄守友	Leadless soldering material and its preparation method
WO2007081006A1 (en) *	2006-01-16	2007-07-19	Hitachi Metals, Ltd.	Solder alloy, solder ball and solder joint using same
JP5376553B2 (en) *	2006-06-26	2013-12-25	日立金属株式会社	Wiring conductor and terminal connection
JP5051633B2 (en) *	2006-10-12	2012-10-17	富士電機株式会社	Solder alloy
WO2009104271A1 (en) *	2008-02-22	2009-08-27	株式会社日本スペリア社	Method of regulating nickel concentration in lead-free solder containing nickel
JP2011044571A (en) *	2009-08-20	2011-03-03	Renesas Electronics Corp	Semiconductor device, external connection terminal, method of manufacturing semiconductor device, and method of manufacturing external connection terminal
EP2405469B1 (en) *	2010-07-05	2016-09-21	ATOTECH Deutschland GmbH	Method to form solder alloy deposits on substrates
CN106964917B (en) *	2012-06-30	2019-07-05	千住金属工业株式会社	Module substrate and welding method
CN103624415A (en) *	2012-08-22	2014-03-12	北京有色金属研究总院	Boron-containing stannum-based lead-free solder and manufacturing method thereof
CN105290640A (en) *	2015-11-30	2016-02-03	苏州龙腾万里化工科技有限公司	Lead-free soldering tin bar
JP7068370B2 (en) *	2020-03-19	2022-05-16	千住金属工業株式会社	Solder alloys, solder balls and solder fittings

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0847829A1 (en) *	1996-12-16	1998-06-17	Ford Motor Company	Lead-free solder composition
WO1998034755A1 (en) *	1997-02-10	1998-08-13	Iowa State University Research Foundation, Inc.	Lead-free solder
EP1088615A2 (en) *	1999-09-29	2001-04-04	Nec Corporation	Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH08215880A (en) *	1995-02-14	1996-08-27	Ishikawa Kinzoku Kk	Leadless solder
US6179935B1 (en) *	1997-04-16	2001-01-30	Fuji Electric Co., Ltd.	Solder alloys
JP3296289B2 (en) *	1997-07-16	2002-06-24	富士電機株式会社	Solder alloy
JP3575311B2 (en) *	1998-01-28	2004-10-13	株式会社村田製作所	Pb-free solder and soldering article
JP3786251B2 (en) *	2000-06-30	2006-06-14	日本アルミット株式会社	Lead-free solder alloy
JP3796181B2 (en) *	2002-02-14	2006-07-12	新日本製鐵株式会社	Electronic member having lead-free solder alloy, solder ball and solder bump
KR100445350B1 (en) *	2003-04-17	2004-08-26	희성금속 주식회사	Lead-free solder alloy

2004
- 2004-11-13 KR KR1020040092857A patent/KR20050030237A/en not_active Application Discontinuation
2005
- 2005-02-02 WO PCT/KR2005/000305 patent/WO2006052049A1/en active Application Filing
- 2005-02-02 US US11/577,927 patent/US20090129970A1/en not_active Abandoned
- 2005-02-02 JP JP2007540243A patent/JP2008518791A/en active Pending
- 2005-02-02 EP EP05726536A patent/EP1824638A4/en not_active Withdrawn
- 2005-02-02 CN CNA2005800372893A patent/CN101048258A/en active Pending

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0847829A1 (en) *	1996-12-16	1998-06-17	Ford Motor Company	Lead-free solder composition
WO1998034755A1 (en) *	1997-02-10	1998-08-13	Iowa State University Research Foundation, Inc.	Lead-free solder
EP1088615A2 (en) *	1999-09-29	2001-04-04	Nec Corporation	Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
KIM K S ET AL: "Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu", MICROELECTRONICS AND RELIABILITY, ELSEVIER SCIENCE LTD, GB, vol. 43, no. 2, 1 January 2003 (2003-01-01), pages 259 - 267, XP008067189, ISSN: 0026-2714 *
See also references of WO2006052049A1 *

Also Published As

Publication number	Publication date
JP2008518791A (en)	2008-06-05
KR20050030237A (en)	2005-03-29
EP1824638A1 (en)	2007-08-29
CN101048258A (en)	2007-10-03
WO2006052049A1 (en)	2006-05-18
US20090129970A1 (en)	2009-05-21

Publication	Publication Date	Title
GB2421030B (en)	2008-03-19	Solder alloy
EP1889684A4 (en)	2009-01-21	Lead-free solder alloy
TWI371499B (en)	2012-09-01	Copper alloy
EP1873266A4 (en)	2010-07-28	Copper alloy
EP1796155A4 (en)	2009-09-16	Bump forming method and solder bump
GB2433944B (en)	2008-12-24	Solder alloy
ZA200700825B (en)	2012-07-25	Antimicrobical silver compositions
TWI347243B (en)	2011-08-21	Solder alloy for bonding oxide
PL1922175T3 (en)	2020-03-31	Solder composition
EP1772225A4 (en)	2009-07-29	Lead-free solder alloy
EP1930117A4 (en)	2009-03-11	Lead-free low-temperature solder
EP1825011A4 (en)	2008-01-23	Lead-free solder alloy
ZA200803347B (en)	2009-01-28	Metal passivation
TWI346590B (en)	2011-08-11	Soldering method
TWI366497B (en)	2012-06-21	Pb-free solder alloy
EP1824638A4 (en)	2009-07-08	Pb free solder alloy
EP1777032A4 (en)	2009-03-04	Au-Sn ALLOY POWDER FOR SOLDER PASTE
GB0519254D0 (en)	2005-10-26	Silver alloy
EP1980355A4 (en)	2010-06-16	Lead-free solder alloy
GB2410965B (en)	2007-02-07	Connection Between Well Components
GB2431412B (en)	2009-10-07	Lead-free solder alloy
GB0408952D0 (en)	2004-05-26	Precious metal salts
GB2429115B (en)	2009-03-04	Metal complex
GB0407531D0 (en)	2004-05-05	An alloy
GB0513860D0 (en)	2005-08-10	Silver alloy

Legal Events

Date	Code	Title	Description
2007-07-27	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2007-08-29	17P	Request for examination filed	Effective date: 20070605
2007-08-29	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): DE GB NL
2008-02-20	DAX	Request for extension of the european patent (deleted)
2008-02-20	RBV	Designated contracting states (corrected)	Designated state(s): DE GB NL
2008-04-23	RBV	Designated contracting states (corrected)	Designated state(s): DE GB NL
2009-07-08	A4	Supplementary search report drawn up and despatched	Effective date: 20090608
2009-07-08	RIC1	Information provided on ipc code assigned before grant	Ipc: H05K 3/34 20060101ALI20090602BHEP Ipc: C22C 13/00 20060101ALI20090602BHEP Ipc: B23K 35/22 20060101AFI20060529BHEP
2010-02-19	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN
2010-03-24	18D	Application deemed to be withdrawn	Effective date: 20090908