EP1720384A3 - Plaque à circuit imprimé - Google Patents

Plaque à circuit imprimé Download PDF

Info

Publication number: EP1720384A3
Authority: EP; European Patent Office
Prior art keywords: ground lines; ground; another; circuit board; printed circuit
Prior art date: 2005-04-28
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP06252299A

Other languages

German (de)

English (en)

Other versions

EP1720384A2 (fr

EP1720384B1 (fr

Inventor

Mitsuru c/o Nitto Denko Corporation Honjo

Yuki c/o Nitto Denko Corporation Saitou

Yoshifumi c/o Nitto Denko Corporation Morita

Yoshifumi c/o Nitto Denko Corporation Yamamoto

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Nitto Denko Corp

Original Assignee

Nitto Denko Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2005-04-28

Filing date

2006-04-28

Publication date

2007-11-21

2006-04-28 Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp

2006-11-08 Publication of EP1720384A2 publication Critical patent/EP1720384A2/fr

2007-11-21 Publication of EP1720384A3 publication Critical patent/EP1720384A3/fr

2010-09-29 Application granted granted Critical

2010-09-29 Publication of EP1720384B1 publication Critical patent/EP1720384B1/fr

Status Not-in-force legal-status Critical Current

2026-04-28 Anticipated expiration legal-status Critical

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09681—Mesh conductors, e.g. as a ground plane
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Structure Of Printed Boards (AREA)
Manufacturing Of Printed Wiring (AREA)
Chemical And Physical Treatments For Wood And The Like (AREA)
Polysaccharides And Polysaccharide Derivatives (AREA)

EP06252299A 2005-04-28 2006-04-28 Plaque à circuit imprimé Not-in-force EP1720384B1 (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2005131308A JP3872084B2 (ja)	2005-04-28	2005-04-28	配線回路基板

Publications (3)

Publication Number	Publication Date
EP1720384A2 EP1720384A2 (fr)	2006-11-08
EP1720384A3 true EP1720384A3 (fr)	2007-11-21
EP1720384B1 EP1720384B1 (fr)	2010-09-29

Family

ID=36999884

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP06252299A Not-in-force EP1720384B1 (fr)	2005-04-28	2006-04-28	Plaque à circuit imprimé

Country Status (6)

Country	Link
US (1)	US7473854B2 (fr)
EP (1)	EP1720384B1 (fr)
JP (1)	JP3872084B2 (fr)
CN (1)	CN1856214B (fr)
AT (1)	ATE483352T1 (fr)
DE (1)	DE602006017141D1 (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2008124317A (ja) *	2006-11-14	2008-05-29	Toshiba Matsushita Display Technology Co Ltd	フレキシブルプリント基板
US8256111B2 (en) *	2006-12-22	2012-09-04	Hon Hai Precision Industry Co., Ltd.	Circuit board layout method
CN101207968B (zh) *	2006-12-22	2011-11-09	鸿富锦精密工业（深圳）有限公司	电路板
EP2112871B1 (fr) *	2008-04-22	2016-07-13	Hon Hai Precision Industry Co., Ltd.	Carte de circuit imprimé avec une couche de terre améliorée
CN101594732A (zh) *	2008-05-27	2009-12-02	鸿富锦精密工业（深圳）有限公司	电路板
JP4399019B1 (ja) *	2008-07-31	2010-01-13	株式会社東芝	電子機器、フレキシブルプリント配線板、およびフレキシブルプリント配線板の製造方法
CN102257684A (zh) *	2009-01-16	2011-11-23	株式会社藤仓	连接器以及线缆组件
WO2011007660A1 (fr)	2009-07-13	2011-01-20	株式会社村田製作所	Ligne de signal et carte de circuit imprimé
JP2012094646A (ja) *	2010-10-26	2012-05-17	Daisho Denshi Co Ltd	特性インピーダンスコントロール対応プリント配線基板
USD720310S1 (en) *	2011-06-17	2014-12-30	Soraa, Inc.	Triangular semiconductor die
KR20130033868A (ko) *	2011-09-27	2013-04-04	삼성전기주식회사	메쉬 패턴을 갖는 패키지 기판 및 그 제조방법
US8791371B2 (en)	2011-11-28	2014-07-29	International Business Machines Corporation	Mesh planes with alternating spaces for multi-layered ceramic packages
US8952263B2 (en) *	2012-08-10	2015-02-10	Eastman Kodak Company	Micro-wire electrode pattern
US20140216783A1 (en) *	2013-02-05	2014-08-07	David P. Trauernicht	Micro-wire pattern with offset intersections
US20140216790A1 (en) *	2013-02-05	2014-08-07	David P. Trauernicht	Conductive micro-wire structure with offset intersections
TWI457055B (zh) *	2013-02-20	2014-10-11	Novatek Microelectronics Corp	軟性電路板及其接地線結構
US9536848B2 (en) *	2014-10-16	2017-01-03	Globalfoundries Inc.	Bond pad structure for low temperature flip chip bonding
JP6745712B2 (ja)	2016-11-30	2020-08-26	日東電工株式会社	配線回路基板およびその製造方法
JP6987700B2 (ja) *	2018-05-29	2022-01-05	京セラ株式会社	印刷配線板
EP4329438A1 (fr) *	2021-08-05	2024-02-28	Samsung Electronics Co., Ltd.	Élément de connexion flexible et dispositif électronique comprenant celui-ci
CN114786328B (zh) *	2022-05-23	2024-04-30	西安易朴通讯技术有限公司	多层印制电路板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4855537A (en) *	1987-09-25	1989-08-08	Kabushiki Kaisha Toshiba	Wiring substrate having mesh-shaped earth line
JPH07302979A (ja) *	1994-05-10	1995-11-14	Toshiba Corp	多層配線基板
JPH09275251A (ja) *	1996-04-03	1997-10-21	Fujitsu Ltd	プリント配線板
US6184478B1 (en) *	1998-09-30	2001-02-06	Adtec Corporation	Printed wiring device with base layer having a grid pattern
US20020040807A1 (en) *	2000-09-29	2002-04-11	Doberenz Philip W.	Method of making higher impedance traces on low impedance circuit board

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH05152768A (ja)	1991-11-27	1993-06-18	Nec Corp	多層構造基板
JPH05343820A (ja)	1992-06-04	1993-12-24	Toshiba Corp	マルチチップモジュール用回路基板
JPH06326476A (ja)	1993-05-13	1994-11-25	Sony Corp	多層配線基板
JPH07202359A (ja)	1993-12-30	1995-08-04	Sony Corp	回路基板
JPH11298149A (ja)	1998-04-09	1999-10-29	Sumitomo Metal Ind Ltd	多層配線基板
TW476229B (en)	1998-08-24	2002-02-11	Adv Flexible Circuits Co Ltd	Circuit board having shielding plate with empty-hole opening pattern to control impedance and transmission time
JP2003133659A (ja)	2001-10-19	2003-05-09	Kazunori Aoki	屈曲性能を具備した高周波用フレキシブルプリント配線板

2005
- 2005-04-28 JP JP2005131308A patent/JP3872084B2/ja active Active
2006
- 2006-04-25 US US11/380,008 patent/US7473854B2/en active Active
- 2006-04-26 CN CN200610076164.8A patent/CN1856214B/zh not_active Expired - Fee Related
- 2006-04-28 AT AT06252299T patent/ATE483352T1/de not_active IP Right Cessation
- 2006-04-28 EP EP06252299A patent/EP1720384B1/fr not_active Not-in-force
- 2006-04-28 DE DE602006017141T patent/DE602006017141D1/de active Active

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4855537A (en) *	1987-09-25	1989-08-08	Kabushiki Kaisha Toshiba	Wiring substrate having mesh-shaped earth line
JPH07302979A (ja) *	1994-05-10	1995-11-14	Toshiba Corp	多層配線基板
JPH09275251A (ja) *	1996-04-03	1997-10-21	Fujitsu Ltd	プリント配線板
US6184478B1 (en) *	1998-09-30	2001-02-06	Adtec Corporation	Printed wiring device with base layer having a grid pattern
US20020040807A1 (en) *	2000-09-29	2002-04-11	Doberenz Philip W.	Method of making higher impedance traces on low impedance circuit board

Also Published As

Publication number	Publication date
EP1720384A2 (fr)	2006-11-08
US20060246268A1 (en)	2006-11-02
JP2006310545A (ja)	2006-11-09
CN1856214A (zh)	2006-11-01
JP3872084B2 (ja)	2007-01-24
US7473854B2 (en)	2009-01-06
CN1856214B (zh)	2010-09-01
EP1720384B1 (fr)	2010-09-29
DE602006017141D1 (de)	2010-11-11
ATE483352T1 (de)	2010-10-15

Publication	Publication Date	Title
EP1720384A3 (fr)	2007-11-21	Plaque à circuit imprimé
EP2759512A3 (fr)	2014-08-06	Ensemble de nanostructures induites par grandes zones
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EP2079289A3 (fr)	2010-05-19	Carte de circuit imprimé et dispositf comprenant un substrat imprimé
CA2462633A1 (fr)	2005-02-22	Range-tout
EP1494514A3 (fr)	2007-04-18	Panneau à circuit pourvu d'une résistance et son procédé de fabrication
EP2413673A3 (fr)	2012-02-29	Système de câblage
WO2007081928A3 (fr)	2007-09-20	Appareil d'emission de lumiere pouvant etre vu sur 360 degres
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EP1733889A3 (fr)	2006-12-27	Tête d'exposition
EP1631131A3 (fr)	2006-03-08	Structure d'un circuit imprimé de transmission, circuit imprimé de transmission et connecteur

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