EP1292985A2 - Leitfähige polymere mit hohem widerstand, insbesondere verwendbar für hocheffiziente organische elektronische anzeige mit mehreren bildelementen - Google Patents
Leitfähige polymere mit hohem widerstand, insbesondere verwendbar für hocheffiziente organische elektronische anzeige mit mehreren bildelementenInfo
- Publication number
- EP1292985A2 EP1292985A2 EP01946100A EP01946100A EP1292985A2 EP 1292985 A2 EP1292985 A2 EP 1292985A2 EP 01946100 A EP01946100 A EP 01946100A EP 01946100 A EP01946100 A EP 01946100A EP 1292985 A2 EP1292985 A2 EP 1292985A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- pani
- polymer
- paampsa
- polymers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229920001940 conductive polymer Polymers 0.000 title description 15
- 229920000642 polymer Polymers 0.000 claims abstract description 79
- 229920000620 organic polymer Polymers 0.000 claims abstract description 15
- 229920000767 polyaniline Polymers 0.000 claims description 94
- 238000000034 method Methods 0.000 claims description 20
- 238000000151 deposition Methods 0.000 claims description 11
- 239000011368 organic material Substances 0.000 claims description 11
- 229920000775 emeraldine polymer Polymers 0.000 claims description 6
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims description 5
- 150000003839 salts Chemical group 0.000 claims description 5
- 239000007864 aqueous solution Substances 0.000 claims description 4
- 239000000872 buffer Substances 0.000 abstract description 12
- 239000010410 layer Substances 0.000 description 146
- -1 poly(p-phenylene vinylene) Polymers 0.000 description 86
- 239000000203 mixture Substances 0.000 description 77
- 239000000463 material Substances 0.000 description 50
- 229920002401 polyacrylamide Polymers 0.000 description 42
- 239000000243 solution Substances 0.000 description 39
- 239000010408 film Substances 0.000 description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 29
- 125000000217 alkyl group Chemical group 0.000 description 24
- 229910052751 metal Inorganic materials 0.000 description 19
- 239000002184 metal Substances 0.000 description 19
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 18
- 239000000758 substrate Substances 0.000 description 18
- 229920000547 conjugated polymer Polymers 0.000 description 17
- 239000002253 acid Substances 0.000 description 15
- 238000002347 injection Methods 0.000 description 13
- 239000007924 injection Substances 0.000 description 13
- 125000003545 alkoxy group Chemical group 0.000 description 12
- 239000006185 dispersion Substances 0.000 description 12
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 11
- 125000004432 carbon atom Chemical group C* 0.000 description 11
- 150000001732 carboxylic acid derivatives Chemical group 0.000 description 11
- 150000002739 metals Chemical class 0.000 description 11
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 9
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 229920001577 copolymer Polymers 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 125000003118 aryl group Chemical group 0.000 description 8
- 125000000732 arylene group Chemical group 0.000 description 8
- 229910052736 halogen Inorganic materials 0.000 description 8
- 150000002367 halogens Chemical group 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 7
- 239000004743 Polypropylene Substances 0.000 description 7
- 150000007513 acids Chemical class 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 125000004093 cyano group Chemical group *C#N 0.000 description 7
- 229920001155 polypropylene Polymers 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 6
- 229920002125 Sokalan® Polymers 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Chemical group 0.000 description 5
- 125000003342 alkenyl group Chemical group 0.000 description 5
- 229910052791 calcium Inorganic materials 0.000 description 5
- 239000011575 calcium Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 238000009472 formulation Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 229920002223 polystyrene Polymers 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 4
- 239000011149 active material Substances 0.000 description 4
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 4
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 4
- 125000004644 alkyl sulfinyl group Chemical group 0.000 description 4
- 125000004390 alkyl sulfonyl group Chemical group 0.000 description 4
- 125000003710 aryl alkyl group Chemical group 0.000 description 4
- 229910052788 barium Inorganic materials 0.000 description 4
- 125000001589 carboacyl group Chemical group 0.000 description 4
- 230000001427 coherent effect Effects 0.000 description 4
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 description 4
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229920002857 polybutadiene Polymers 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 description 4
- 239000011541 reaction mixture Substances 0.000 description 4
- 125000000542 sulfonic acid group Chemical group 0.000 description 4
- 229910052717 sulfur Inorganic materials 0.000 description 4
- 239000011593 sulfur Substances 0.000 description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 4
- 229910001887 tin oxide Inorganic materials 0.000 description 4
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 125000004450 alkenylene group Chemical group 0.000 description 3
- 229920000109 alkoxy-substituted poly(p-phenylene vinylene) Polymers 0.000 description 3
- 125000002877 alkyl aryl group Chemical group 0.000 description 3
- 125000006350 alkyl thio alkyl group Chemical group 0.000 description 3
- 125000004414 alkyl thio group Chemical group 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 150000001448 anilines Chemical class 0.000 description 3
- 239000003125 aqueous solvent Substances 0.000 description 3
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 3
- 125000005135 aryl sulfinyl group Chemical group 0.000 description 3
- 125000004391 aryl sulfonyl group Chemical group 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N butadiene group Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 239000002322 conducting polymer Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 125000000392 cycloalkenyl group Chemical group 0.000 description 3
- 125000000753 cycloalkyl group Chemical group 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 125000005842 heteroatom Chemical group 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 229910003437 indium oxide Inorganic materials 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 229920001467 poly(styrenesulfonates) Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 229920000292 Polyquinoline Polymers 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- DZBUGLKDJFMEHC-UHFFFAOYSA-N acridine Chemical compound C1=CC=CC2=CC3=CC=CC=C3N=C21 DZBUGLKDJFMEHC-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 125000005110 aryl thio group Chemical group 0.000 description 2
- 125000004104 aryloxy group Chemical group 0.000 description 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 2
- DIKBFYAXUHHXCS-UHFFFAOYSA-N bromoform Chemical compound BrC(Br)Br DIKBFYAXUHHXCS-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- ZQBFAOFFOQMSGJ-UHFFFAOYSA-N hexafluorobenzene Chemical compound FC1=C(F)C(F)=C(F)C(F)=C1F ZQBFAOFFOQMSGJ-UHFFFAOYSA-N 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
- IVSZLXZYQVIEFR-UHFFFAOYSA-N m-xylene Chemical group CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 2
- 229910003455 mixed metal oxide Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000012454 non-polar solvent Substances 0.000 description 2
- BKIMMITUMNQMOS-UHFFFAOYSA-N nonane Chemical compound CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920002959 polymer blend Polymers 0.000 description 2
- 229920000123 polythiophene Polymers 0.000 description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
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- 239000011241 protective layer Substances 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 125000000475 sulfinyl group Chemical group [*:2]S([*:1])=O 0.000 description 2
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- ZPQOPVIELGIULI-UHFFFAOYSA-N 1,3-dichlorobenzene Chemical compound ClC1=CC=CC(Cl)=C1 ZPQOPVIELGIULI-UHFFFAOYSA-N 0.000 description 1
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- 125000004973 1-butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000006039 1-hexenyl group Chemical group 0.000 description 1
- 125000004066 1-hydroxyethyl group Chemical group [H]OC([H])([*])C([H])([H])[H] 0.000 description 1
- 125000006023 1-pentenyl group Chemical group 0.000 description 1
- 125000006017 1-propenyl group Chemical group 0.000 description 1
- SNTWKPAKVQFCCF-UHFFFAOYSA-N 2,3-dihydro-1h-triazole Chemical compound N1NC=CN1 SNTWKPAKVQFCCF-UHFFFAOYSA-N 0.000 description 1
- VEUMBMHMMCOFAG-UHFFFAOYSA-N 2,3-dihydrooxadiazole Chemical compound N1NC=CO1 VEUMBMHMMCOFAG-UHFFFAOYSA-N 0.000 description 1
- MQNZNTNCDRVGFD-UHFFFAOYSA-N 2,5-dichloroaniline 3-hexylaniline Chemical compound ClC1=C(N)C=C(C=C1)Cl.C(CCCCC)C=1C=C(N)C=CC1 MQNZNTNCDRVGFD-UHFFFAOYSA-N 0.000 description 1
- STTGYIUESPWXOW-UHFFFAOYSA-N 2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline Chemical compound C=12C=CC3=C(C=4C=CC=CC=4)C=C(C)N=C3C2=NC(C)=CC=1C1=CC=CC=C1 STTGYIUESPWXOW-UHFFFAOYSA-N 0.000 description 1
- XHZPRMZZQOIPDS-UHFFFAOYSA-N 2-Methyl-2-[(1-oxo-2-propenyl)amino]-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(C)(C)NC(=O)C=C XHZPRMZZQOIPDS-UHFFFAOYSA-N 0.000 description 1
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 1
- AOPBDRUWRLBSDB-UHFFFAOYSA-N 2-bromoaniline Chemical compound NC1=CC=CC=C1Br AOPBDRUWRLBSDB-UHFFFAOYSA-N 0.000 description 1
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 description 1
- CSSJQJWTYJODDJ-UHFFFAOYSA-N 3,10-dioxatricyclo[10.2.2.04,9]hexadeca-1(15),4,6,8,12(16),13-hexaene-2,11-dione Chemical compound O1C(=O)C(C=C2)=CC=C2C(=O)OC2=C1C=CC=C2 CSSJQJWTYJODDJ-UHFFFAOYSA-N 0.000 description 1
- WMIQWIJPGVVMII-UHFFFAOYSA-N 3-butylaniline Chemical compound CCCCC1=CC=CC(N)=C1 WMIQWIJPGVVMII-UHFFFAOYSA-N 0.000 description 1
- OBNZIMFKLILQCF-UHFFFAOYSA-N 3-octylaniline Chemical compound CCCCCCCCC1=CC=CC(N)=C1 OBNZIMFKLILQCF-UHFFFAOYSA-N 0.000 description 1
- DHDHJYNTEFLIHY-UHFFFAOYSA-N 4,7-diphenyl-1,10-phenanthroline Chemical compound C1=CC=CC=C1C1=CC=NC2=C1C=CC1=C(C=3C=CC=CC=3)C=CN=C21 DHDHJYNTEFLIHY-UHFFFAOYSA-N 0.000 description 1
- WDFQBORIUYODSI-UHFFFAOYSA-N 4-bromoaniline Chemical compound NC1=CC=C(Br)C=C1 WDFQBORIUYODSI-UHFFFAOYSA-N 0.000 description 1
- DWJXWSIJKSXJJA-UHFFFAOYSA-N 4-n-[4-(4-aminoanilino)phenyl]benzene-1,4-diamine Chemical compound C1=CC(N)=CC=C1NC(C=C1)=CC=C1NC1=CC=C(N)C=C1 DWJXWSIJKSXJJA-UHFFFAOYSA-N 0.000 description 1
- FILGCRVITUCSOH-UHFFFAOYSA-N 5-chloro-2-ethoxyaniline;4-phenoxyaniline Chemical compound CCOC1=CC=C(Cl)C=C1N.C1=CC(N)=CC=C1OC1=CC=CC=C1 FILGCRVITUCSOH-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/17—Carrier injection layers
- H10K50/171—Electron injection layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
Definitions
- This invention relates to the formulation of high resistivity conjugated polymers in conductive forms for use in high efficiency pixellated organic electronic devices, such as emissive displays.
- the high resisvitiy layer provides excellent hole injection, prevents electrical shorts, enhances the device lifetime and avoids inter-pixel current leakage. BACKGROUND OF THE INVENTION
- LEDs Light emitting diodes fabricated with conjugated organic polymer layers have attracted attention due to their potential for use in display technology [J. H. Burroughs, D.D.C. Bradley, A. R. Brown, R. N. Marks, K. Mackay, R.H. Friend, P.L. Burns, and A. B. Holmes, Nature 341, 539 (1990); D. Braun and A. J. Heeger, Appl. Phys. Lett. 58, 1982 ( 1991 )] .
- Patents covering polymer LEDs include the following: R.H. Friend, J.H. Burroughs and D.D. Bradley, U.S. Patent 5,247,190; A.J. Heegr and D. Braun, U.S.
- the low electrical resisitivity typical of PANI(ES) inhibits the use of PANI(ES) in pixelated displays.
- the PANI(ES) layer should have a high electrical sheet resistance, otherwise lateral conduction causes cross-talk between neighboring pixels. The resulting inter-pixel current leakage significantly reduces the power efficiency and limits both the resolution and the clarity of the display.
- the electrical resistivity of the PANI(ES) layer should be greater than or equal to 10 4 ohm-cm to avoid crosstalk and inter-pixel current leakage. Values in excess of 10 5 ohm-cm are preferred. Even at 10 5 ohm-cm, there is some residual current leakage and consequently some reduction in device efficiency. Thus, values of approximately 10 6 ohm-cm are even more preferred. Values greater than 10 7 ohm-cm will lead to a significant voltage drop across the injection/buffer layer and therefore should be avoided. To achieve high resistivity PANI(ES) materials with resitivities in the desired range requires reformulation of the PANT(ES).
- High resistivity conductive polymers such as PANI(ES) for use in high efficiency pixelated polymer emissive displays.
- Conductive polymers with resisitivity greater than 10 4 ohm-cm is preferred; more preferably in excess of 10 5 ohm-cm; and still more preferred in excess of 10 6 ohm-cm.
- the high resisitivity conductive polymer layer should give long lifetime without significant current leakage between neighboring pixels.
- One aspect of the invention relates to an electronic device having at least the following components: a layer of elecfroactive conjugated organic polymer bounded on one side by a hole-injecting anode and on the other by a electron-injecting cathode, and a layer of conductive organic polymer having a resistivity of at least about 10 4 ohms-cm between the anode and the layer of elecfroactive organic material.
- Another aspect of the invention relates to a method for preparing an electronic device, the steps involving at least the following steps: depositing a layer of elecfroactive conjugated organic polymer on a patterned hole-injecting anode and thereafter depositing a patterned electron-injecting cathode on the layer of elecfroactive conjugated organic polymer, and depositing a high resistivity layer of conductive organic polymer onto the anode before the layer of elecfroactive conjugated organic polymer is deposited, wherein the layer of conductive organic polymer has a resistivity of at least about 10 4 ohms-cm.
- the term "photoactive" organic material refers to any organic material that exhibits the electroactivity of electroluminescence and/or photosensitivity.
- charge when used to refer to charge injection/transport refers to one or both of hole and electron transport/injection, depending upon the context.
- conductivity and “bulk conductivity” are used interchangeably, the value of which is provided in the unit of Siemens per centimeter (S/cm).
- surface resistivity and “sheet resistance” are used interchangeably to refer to the resistance value that is a function of sheet thickness for a given material, the value of which is provided in the unit of ohm per square (ohm/sq).
- ohm/sq ohm/sq
- electrical resistivity are used interchangeably to refer to the resistivity that is a basic property of a specific materials (i.e., does not change with the dimension of the substance), the value of which provided in the unit of ohm-centimeter (ohm- cm). Electrical resistivity value is the inverse value of conductivity.
- Fig. 1 is a graph which shows the fraction of "leaky” pixels (in a 96 x 64 array) vs thickness of the PANI(ES) layer.
- Fig. 2 is a schematic diagram of the architecture of a passively addressed, pixelated, polymer LED display.
- Fig. 3 is a graph which shows the dependence of the conductivity of PANI(ES) polyblends on PANI(ES)-PAAMPSA content.
- Fig. 4 is a graph which shows the light output and external quantum efficiency for a device fabricated with the PANI(ES)-PAAMPSA buffer layer.
- Fig. 5 is a graph which shows the stress induced degradation of a device with PANI(ES)-PAAMPSA layer at 85°C.
- Fig. 6 is a graph which shows the stress induced degradation of devices with PANI(ES)-PAAMPSA buffer layer at room temperature.
- Fig. 7 is a graph which shows the stress induced degradation of a device with a PANI(ES) PAAMPSA blend (Example 9) as the buffer layer; the data were obtained with the device at 70°C.
- Fig. 8 shows photographs of three passively addressed displays (96 x 64) that were identical in every respect except that the display in Fig. 8a had a low resistance PEDT layer (resistivity is ⁇ 200 ohm-cm), while the display in Fig. 8b had a PANI(ES) polyblend layer (resistivity is ⁇ 4,000 ohm-cm), and the display in Fig. 8c a higher resistance PANI(ES) polyblend layer (resistivity is -50,000 ohm-cm).
- each individual pixel of an organice electronic device 100 includes an electron injecting (cathode) contact 106 made from a relatively low work function metal (for example, Ca, Ba or alloys comprising Ca or Ba) as one electrode on the front of a photoactive organic material 102 deposited on a substrate 108 which has been partially coated with a layer of transparent conducting material 110 with higher work function (high ionization potential) to serve as the second (transparent) electron-withdrawing (anode) electrode; i.e. a configuration that is well known for polymer LEDs (D. Braun and AJ. Heeger, Appl. Phys. Lett. 58, 1982 (1991).
- a relatively low work function metal for example, Ca, Ba or alloys comprising Ca or Ba
- a layer 112 containing at least high resistivity layer of conductivity polymer such as PANI(ES) is interposed between the luminescent polymer layer 102 and the high work function anode 110.
- Cathode 106 is electrically connected to contact pads 80
- anode 110 is electrically connected to contact pads 82.
- the layers 102, 106, 108, 110, and 112 are then isolated from the environment by a hermetic seal layer 114.
- the photophotoactive layer 102 can be a light-emitting layer that is activated by an applied voltage (such as in a light-emitting diode or light-emitting electrochemical cell), a layer of material that responds to radiant energy and generates a signal with or without an applied bias voltage (such as in a photodetector).
- an applied voltage such as in a light-emitting diode or light-emitting electrochemical cell
- a layer of material that responds to radiant energy and generates a signal with or without an applied bias voltage
- Examples of photodetectors include photoconductive cells, photoresistors, photoswitches, photofransistors, and phototubes, and photovoltaic cells, as these terms are describe in Markus, John, Electronics and Nucleonics Dictionary, 470 and 476
- Suitable active light-emitting materials include organic molecular materials such asanthracene, butadienes, coumarin derivatives, acridine, and stilbene derivatives, see, for example, Tang, U.S. Patent 4,356,429, Van Slyke et al., U.S. Patent 4,539,507, the relevant portions of which are incorporated herein by reference.
- such materials can be polymeric materials such as those described in Friend et al. (U.S. Patent 5,247,190), Heeger et al. (U.S.
- the electroluminescent polymer comprises at least one conjugated polymer or a co-polymer which contains segments of ⁇ -conjugated moieties.
- Conjugated polymers are well known in the art (see, e.g., Conjugated Polymers, J.-L. Bredas and R. Silbey edt., Kluwer Academic Press, Dordrecht, 1991). Representative classes of materials include, but are not limited to the following:
- poly(arylene vinylene) where the arylene may be such moieties as naphthalene, anthracene, furylene, thienylene, oxadiazole, and the like, or one of the moieties with functionalized substituents at various positions;
- poly(arylenes) and their derivatives substituted at various positions on the arylene moiety (viii) poly(arylenes) and their derivatives substituted at various positions on the arylene moiety; (ix) co-polymers of oligoarylenes with non-conjugated oligomers, and derivatives of such polymers substituted at various positions on the arylene moieties; (x) polyquinoline and its derivatives;
- rigid rod polymers such as poly(p-phenylene-2,6-benzobisthiazole), poly(p-phenylene-2,6-benzobisoxazole), poly(p-phenylene-2,6-benzimidazole), and their derivatives; and the like.
- the photoactive materials may include but are not limited to poly(phenylenevinylene), PPV, and alkoxy derivatives of PPV, such as for example, poly(2-methoxy-5-(2'-ethyl-hexyloxy)-p-phenylenevinylene) or "MEH-PPV" (United States Patent No. 5,189,136).
- BCHA-PPV is also an attractive active material.
- PPPV is also suitable.
- Luminescent conjugated polymer which are soluble in common organic solvents are preferred since they enable relatively simple device fabrication [A. Heeger and D. Braun, U.S. Patent 5,408,109 and 5,869,350].
- photoactive polymers and copolymers are the soluble PPV materials described in H. Becker et al., Adv. Mater. 12, 42 (2000) and referred to herein as C-PPV's. Blends of these and other semi-conducting polymers and copolymers which exhibit electroluminescence can be used.
- the photophotoactive layer 102 responds to radiant energy and produces a signal either with or without a biased voltage.
- Materials that respond to radiant energy and is capable of generating a signal with a biased voltage include, for example, many conjugated polymers and electroluminescent materials.
- Materials that respond to radiant energy and are capable of generating a signal without a biased voltage include materials that chemically react to light and thereby generate a signal.
- Such light-sensitive chemically reactive materials include for example, many conjugated polymers and electro- and photo-luminescent materials. Specific examples include, but are not limited to, MEH-PPV ("Optocoupler made from semiconducting polymers", G. Yu, K.
- the polymeric photoactive material or organic molecular photoactive material is present in the photophotoactive layer 102 in admixture from 0% to 75% (w, basis overall mixture) of carrier organic material (polymeric or organic molecular).
- carrier organic material polymeric or organic molecular.
- the criteria for the selection of the carrier organic material are as follows. The material should allow for the formation of mechanically coherent films, at low concentrations, and remain stable in solvents that are capable of dispersing, or dissolving the conjugated polymers for forming the film. Low concentrations of carrier materials are preferred in order to minimize processing difficulties, i.e., excessively high viscosity or the formation of gross in homogeneities; however the concentration of the carrier should be high enough to allow for formation of coherent structures.
- carrier polymers are high molecular weight (M.W. > 100,000) flexible chain polymers, such as polyethylene, isotactic polypropylene, polyethylene oxide, polystyrene, and the like.
- M.W. > 100,000 flexible chain polymers such as polyethylene, isotactic polypropylene, polyethylene oxide, polystyrene, and the like.
- these macromolecular materials enable the formation of coherent structures from a wide variety of liquids, including water, acids, and numerous polar and non-polar organic solvents. Films or sheets manufactured using these carrier polymers have sufficient mechanical strength at polymer concentrations as low as 1%, even as low as 0. 1%, by volume to enable the coating and subsequent processing as desired.
- Such coherent structures are those comprised of poly(vinyl alcohol), poly(ethylene oxide), poly-para (phenylene terephthalate), poly-para-benzamide, etc., and other suitable polymers.
- non-polar carrier structures are selected, such as those containing polyethylene, polypropylene, poly(butadiene), and the like.
- one electrode is transparent to enable light emission from the device or light reception by the device.
- the anode is the transparent electrode, although the present invention can also be used in an embodiment where the cathode is the transparent electrode.
- the anode 110 is preferably made of materials containing a metal, mixed metal, alloy, metal oxide or mixed-metal oxide. Suitable metals include the Group 11 metals, the metals in Groups 4, 5, and 6, and the Group 8-10 transition metals. If the anode is to be light-transmitting, mixed-metal oxides of Groups 12, 13 and 14 metals, such as indium-tin-oxide, are generally used.
- the IUPAC numbering system is used throughout, where the groups from the Periodic Table are numbered from left to right as 1-18 (CRC Handbook of Chemistry and
- the anode 110 may also comprise an organic material such as polyaniline as described in "Flexible light-emitting diodes made from soluble conducting polymer," Nature vol. 357, pp 477-479 (11 June 1992).
- Typical inorganic materials which serve as anodes include metals such as aluminum, silver, platinum, gold, palladium, tungsten, indium, copper, iron, nickel, zinc, lead and the like; metal oxides such as lead oxide, tin oxide, indium/tin-oxide and the like; graphite; doped inorganic semiconductors such as silicon, germanium, gallium arsenide, and the like.
- the anode layer When metals such as aluminum, silver, platinum, gold, palladium, tungsten, indium, copper, iron, nickel, zinc, lead and the like are used, the anode layer must be sufficiently thin to be semi-transparent. Metal oxides such as indium/tin-oxide are typically at least semitransparent.
- the term "fransparent” is defined to mean “capable of transmitting at least about 25%, and preferably at least about 50%, of the amount of light of a particular wavelength of interest". Thus a material is considered “transparent” even if its ability to transmit light varies as a function of wavelength but does meet the 25% or 50% criteria at a given wavelength of interest.
- the layers are thin enough, for example in the case of silver and gold below about 300 A, and especially from about 20 A to about 250 A with silver having a relatively colorless (uniform) transmittance and gold tending to favor the transmission of yellow to red wavelengths.
- the conductive metal-metal oxide mixtures can be transparent as well at thicknesses up to as high as 2500 A in some cases.
- the thicknesses of metal-metal oxide (or dielectric) layers is from about 25 to about 1200 A when transparency is desired.
- This layer is conductive and should be low resistance: preferably less than 300 ohms/square and more preferably less than 100 ohms/square.
- the Buffer Layer 112 A high resistivity buffer layer 112 is placed between the layer of active material 102 and anode 110.
- This layer should be a high resistivity layer and shall comprise conductive polyaniline (PANI) such as PANI(ES) or an equivalent conjugated conductive polymer, most commonly in a blend with one or more nonconductive host ' polymers.
- PANI conductive polyaniline
- Suitable conductive polymers are usually doped polymers and may include materials such as poly(ethylenedioxythiophene) "PEDT", polypyrolle, polythiophene and PANI, all in their conductive forms.
- PEDT poly(ethylenedioxythiophene)
- Polyaniline is particularly useful, particularly when it is in the emeraldine salt (ES) form.
- Useful conductive polyanilines include the homopolymer and derivatives usually as blends with bulk polymers. Examples of PANI are those disclosed in United States Patent
- the preferred PANI blend materials for this layer have a bulk resistivity of greater than 10 4 ohms-cm. More preferred PANI blends have a bulk resistivity of greater than 10 5 ohms-cm.
- polyaniline or PANI are used herein, they are used generically to include substituted and unsubstituted materials, as well as the other equivalent conjugated conductive polymers such as polypyrrole or polythiophene or PEDT, unless the context is clear that only the specific nonsubstituted form is intended. It is also used in a manner to include any accompanying dopants, particularly acidic materials used to render the polyaniline conductive.
- polyanilines are polymers and copolymers of film and fiber-forming molecular weight derived from the polymerization of unsubstituted and substituted anilines of the Formula I:
- n is an integer from 0 to 4
- m is an integer from 1 to 5 with the proviso that the sum of n and m is equal to 5;
- R is independently selected so as to be the same or different at each occurrence and is selected from the group consisting of alkyl, alkenyl, alkoxy, cycloalkyl, cycloalkenyl, alkanoyl, alkythio, aryloxy, alkylthioalkyl, alkylaryl, arylalkyl, amino, alkylamino, dialkylamino, aryl, alkylsulfinyl, alkoxyalkyl, alkylsulfonyl, arylthio, arylsulfinyl, alkoxycarbonyl, arylsulfonyl, carboxylic acid, halogen, cyano, or alkyl substituted with one or more sulfonic aid, carboxylic acid, halo, nitro, cyano or epoxy moieties; or carboxylic acid, halogen, nitro, cyano, or sulfonic acid moieties; or any two R groups together may
- polyanilines useful in the practice of this invention are those of the Formula II to V:
- n, m and R are as described above except that m is reduced by 1 as a hydrogen is replaced with a covalent bond in the polymerization and the sum of n plus m equals 4; y is an integer equal to or greater than 0; x is an integer equal to or greater than 1, with the proviso that the sum of x and y is greater than 1; and z is an integer equal to or greater than 1.
- R groups are alkyl, such as methyl, ethyl, octyl, nonyl, tert-butyl, neopentyl, isopropyl, sec-butyl, dodecyl and the like, alkenyl such as 1-propenyl, 1-butenyl, 1-pentenyl, 1-hexenyl, 1-heptenyl, 1-octenyl and the like; alkoxy such as propoxy, butoxy, methoxy, isopropoxy, pentoxy, nonoxy, ethoxy, octoxy, and the like, cycloalkenyl such as cyclohexenyl, cyclopentenyl and the like; alkanoyl such as butanoyl, pentanoyl, octanoyl, ethanoyl, propanoyl and the like; alkylsulfinyl, alkysulfonyl, alkylsulf
- R groups are divalent moieties formed from any two R groups such as moieties of the formula:
- n* is an integer from about 3 to about 7, as for example -(CH2)-4, -(CH 2 )-3 and -(CH 2 )-5, or such moieties which optionally include heteroatoms of oxygen and sulfur such as -CH 2 SCH 2 - and -CH 2 -O-CH2-.
- R groups are divalent alkenylene chains including 1 to about 3 conjugated double bond unsaturation such as divalent 1,3-butadiene and like moieties.
- n is an integer from 0 to about 2
- m is an integer from 2 to 4, with the proviso that the sum of n and m is equal to 4;
- R is alkyl or alkoxy having from 1 to about 12 carbon atoms, cyano, halogen, or alkyl substituted with carboxylic acid or sulfonic acid substituents; x is an integer equal to or greater than 1; y is an integer equal to or greater than 0, with the proviso that the sum of x and y is greater than about 4, and z is an integer equal to or greater than about 5.
- the polyaniline is derived from unsubstituted aniline, i.e., where n is 0 and m is 5 (monomer) or 4 (polymer). In general, the number of monomer repeat units is at least about 50.
- the polyaniline is rendered conductive by the presence of an oxidative or acidic species. Acidic species and particularly “functionalized protonic acids” are preferred in this role.
- a “functionalized protonic acid” is one in which the counter-ion has been functionalized preferably to be compatible with the other components of this layer.
- a “protonic acid” is an acid that protonates the polyaniline to form a complex with said polyaniline.
- A is sulfonic acid, selenic acid, phosphoric acid, boric acid or a carboxylic acid group; or hydrogen sulfate, hydrogen selenate, hydrogen phosphate; n is an integer from 1 to 5; R is alkyl, alkenyl, alkoxy, alkanoyl, alkylthio, alkylthioalkyl, having from
- 7 membered aromatic or alicyclic carbon ring which ring may include one or more divalent heteroatoms of nitrogen, sulfur, sulfinyl, sulfonyl or oxygen such as thiophenyl, pyrolyl, furanyl, pyridinyl.
- R can be a polymeric backbone from which depend a plurality of acid functions "A."
- polymeric acids include sulfonated polystyrene, sulfonated polyethylene and the like.
- the polymer backbone can be selected either to enhance solubility in nonpolar substrates or be soluble in more highly polar substrates in which materials such as polymers, polyacrylic acid or poly(vinylsulfonate), or the like, can be used.
- R' is the same or different at each occurrence and is alkyl, alkenyl, alkoxy, cycloalkyl, cycloalkenyl, alkanoyl, alkylthio, aryloxy, alkylthioalkyl, alkylaryl, arylalkyl, alkylsulfinyl, alkoxyalkyl, alkylsulfonyl, aryl, arylthio, arylsulfinyl, alkoxycarbonyl, arylsulfonyl, carboxylic acid, halogen, cyano, or alkyl substituted with one or more sulfonic acid, carboxylic acid, halogen, nitro, cyano, diazo or epoxy moieties; or any two R substituents taken together are an alkylene or alkenylene group completing a 3, 4, 5, 6 or 7 membered aromatic or alicyclic carbon ring or multiples thereof, which ring or rings may include one or more
- A is sulfonic acid, phosphoric acid or carboxylic acid; n is an integer from 1 to 3; R is alkyl, alkenyl, alkoxy, having from 6 to about 14 carbon atoms; or arylalkyl, where the alkyl or alkyl portion or alkoxy has from 4 to about 14 carbon atoms; or alkyl having from 6 to about 14 carbon atoms substituted with one or more, carboxylic acid, halogen, diazo, or epoxy moieties;
- R' is the same or different at each occurrence and is alkyl, alkoxy, alkylsulfonyl, having from 4 to 14 carbon atoms, or alkyl substituted with one or more halogen moieties again with from 4 to 14 carbons in the alkyl.
- R is alkyl or alkoxy, having from 6 to about 14 carbon atoms; or alkyl having from 6 to about 14 carbon atoms substituted with one or more halogen moieties; R' is alkyl or alkoxy, having from 4 to 14, especially 12 carbon atoms, or alkyl substituted with one or more halogen, moieties.
- Preferred functionalized protonic acids are organic sulfonic acids such as dodecylbenzene sulfonic acid and more preferably poly(2-acrylamido-2-methyl-l-propanesulfonic acid) (“PAAMPSA").
- the amount of functionalized protonic acid employed can vary depending on the degree of conductivity required. In general, sufficient functionalized protonic acid is added to the polyaniline-containing admixture to form a conducting material. Usually the amount of functionalized protonic acid employed is at least sufficient to give a conductive polymer (either in solution or in solid form).
- the polyaniline can be conveniently used in the practice of this invention in any of its physical forms. Illustrative of useful forms are those described in Green, A.G., and Woodhead, A. E., J. Chem. Soc, 101, 1117 (1912) and Kobayashi, et al., J. Electroanl. Chem., Ill, 281-91 (1984), which are hereby incorporated by reference.
- useful forms include leucoemeraldine, protoemeraldine, emeraldine, nigraniline and tolu-protoemeraldine forms, with the emeraldine form being preferred.
- Copending United States Patent Application Serial No. 60/168,856 of Cao, Y. and Zhang, C. discloses the formation of low conductivity blends of conjugated polymers with non-conductive polymers and is incorporated herein by reference.
- the particular bulk polymer or polymers added to the conjugated polymer can vary.
- the selection of materials can be based upon the nature of the conductive polymer, the method used to blend the polymers and the method used to deposit the layer in the device.
- the materials can be blended by dispersing one polymer in the other, either as a dispersion of small particles or as a solution of one polymer in the other.
- the polymer are typically admixed in a fluid phase and the layer is typically laid out of a fluid phase.
- the blend can be formed by dissolving or dispersing the two polymers in water and casting a layer from the solution or dispersion.
- Organic solvents can be used with organic-soluble or organic dispensable conjugated polymers and bulk polymers.
- blends can be formed using melts of the two polymers or by using a liquid prepolymer or monomer form of the bulk polymer which is subsequently polymerized or cured into the desired final material.
- the bulk polymer should be water soluble or water dispersible.
- it is selected from, for example polyacrylamides (PAM), poly(acrylic acid ) (PAA) poly(vinyl pyrrolidone) (PVPd), acrylamide copolymers, cellulose derivatives, carboxyvinyl polymer, poly(ethylene glycols), poly(ethylene oxide) (PEO), poly(vinyl alcohol) (PVA), poly(vinyl methyl ether), polyamines, polyimines, polyvinylpyridines, polysaccharides, and polyurethane dispersions.
- the bulk polymer may be selected from, for example liquefiable polyethylenes, isotactic polypropylene, polystyrene, poly(vinylalcohol), poly(ethylvinylacetate), polybutadienes, polyisoprenes, ' ethylenevinylene-copolymers, ethylene-propylene copolymers, poly(ethyleneterephthalate), poly(butyleneterephthalate) and nylons such as nylon 12, nylon 8, nylon 6, nylon 6.6 and the like, polyester materials, polyamides such as polyacrylamides and the like.
- the relative proportions of the polyaniline and bulk polymer or prepolymer can vary.
- Solvents for the materials used to cast this layer are selected to compliment the properties of the polymers.
- the PANI and bulk polymer are both water-soluble or water-dispersible and the solvent system is an aqueous solvent system such as water or a mixture of water with one or more polar organic materials such as lower oxyhydrocarbons for example lower alcohols, ketones and esters.
- These materials include, without limitation, water mixed with methanol, ethanol, isopropanol, acetone methyl ethyl ketone and the like. If desired, but generally not preferred, a solvent system of polar organic liquids could be used.
- nonpolar solvents are most commonly used.
- useful common nonpolar solvents are the following materials: substituted or unsubstituted aromatic hydrocarbons such as benzene, toluene, p-xylene, m-xylene, naphthalene, ethylbenzene, styrene, aniline and the like; higher alkanes such as pentane, hexane, heptane, octane, nonane, decane and the like; cyclic alkanes such as decahydronaphthalene; halogenated alkanes such as chloroform, bromoform, dichloromethane and the like; halogenated aromatic hydrocarbons such as chlorobenzene, o-dichlorobenzene, m-dichlorobenzene, p-dichloro
- the thickness of the conjugated polymer layer will be chosen with the properties of the diode in mind. In those situations where the composite anode is to be transparent, it is generally preferable to have the layer of PANI as thin as practically possible bearing in mind the failure problem noted in Fig. 1. Typical thicknesses range from about 100 A to about 5000 A. When transparency is desired, thicknesses of from about 100 A to about 3000 A are preferred and especially about 2000 A.
- the electrical resistivity of the PANI(ES) blend layer should be greater than or equal to 10 4 ohm-cm to avoid cross talk and inter-pixel current leakage. Values in excess of 10 5 ohm-cm are preferred. Even at 10 5 ohm-cm, there is some residual current leakage and consequently some reduction in device efficiency. Thus, values of approximately 10 5 to 10 8 ohm-cm are even more preferred. Values greater than 10 9 ohm-cm will lead to a significant voltage drop across the injection/buffer layer and therefore should be avoided.
- Suitable materials for use as cathode materials are any metal or nonmetal having a lower work function than the first electrical contact layer (in this case, an anode).
- Materials for the cathode layer 106 can be selected from alkali metals of Group 1 (e.g., Li, Cs), the Group 2 (alkaline earth) metals - - commonly calcium, barium, sfrontium, the Group 12 metals, the rare earths - commonly ytterbium, the lanthanides, and the actinides.
- Materials such as aluminum, indium and copper, silver, combinations thereof and combinations with calcium and/or barium, Li, magnesium, LiF can be used.
- Alloys of low work function metals such as for example alloys of magnesium in silver and alloys of lithium in aluminum, are also useful.
- the thickness of the electron-injecting cathode layer ranges from less than 15 A to as much as 5,000 A.
- This cathode layer 106 can be patterned to give a pixellated array or it can be continuous and overlaid with a layer of bulk conductor such as silver, copper or preferably aluminum which is, itself, patterned.
- the cathode layer may additionally include a second layer of a second metal added to give mechanical strength and durability.
- the diodes are prepared on a substrate.
- the substrate should be nonconducting. In those embodiments in which light passes through it, it is transparent.
- It can be a rigid material such as a rigid plastic including rigid acrylates, carbonates, and the like, rigid inorganic oxides such as glass, quartz, sapphire, and the like.
- It can also be a flexible transparent organic polymer such as polyester - for example poly(ethyleneterephthalate), flexible polycarbonate, poly (methyl methacrylate), poly(styrene) and the like. The thickness of this substrate is not critical.
- contact pads 80, 82 useful to connect the electrode of the device 100 to the power source can be used, including, for example, conductive metals such as gold (Au), silver (Ag), nickel (Ni), copper (Cu) or aluminum (Al).
- contact pads 80, 82 have a height (not shown) projected beyond the thickness of the high work function electrode lines 110 below the total thickness of layer.
- the dimensions of layers 102, 110, and 112 are such that contacts pads 80 are positioned on a section of the substrate 108 not covered by layers 102, 112 and 114.
- the dimensions of layer 106, 102, 110, and 112 are such that the entire length and width electrode lines 106 and electrode lines 110 have at least one layer 102, 112 intervening between the electrodes 106, 110, while electrical connection can be made between electrode 106 and contact pads 80.
- An optional layer including an electron injection/transport material may be provided between the photoactive layer 102 and the cathode 106.
- This optional layer can function both to facilitate electron injection/transport, and also serve as a buffer layer or confinement layer to prevent quenching reactions at layer interfaces. Preferably, this layer promotes electron mobility and reduces quenching reactions.
- electron transport materials for optional layer include metal chelated oxinoid compounds, such as tris(8-hydroxyquinolato)aluminum (Ak ⁇ ); phenanthroline-based compounds, such as 2,9-dimethyl-4,7-diphenyl- 1 , 10-phenanthroline (DDPA) or 4,7-diphenyl- 1,10-phenanthroline (DP A), and azole compounds such as 2-(4-biphenylyl)-5-(4-t- butylphenyl)-l,3,4-oxadiazole (PBD) and 3-(4-biphenylyl)-4-phenyl-5-(4-t- butylphenyl)-l,2,4-triazole (TAZ), polymers containing DDPA, DP A, PBD, and TAZ moiety and polymer blends thereof, polymer blends containing containing DDPA, DPA, PBD, and TAZ.
- metal chelated oxinoid compounds such as tris(8-
- anode layer 110 may be surface treated to increase charge carrier transport efficiency.
- the choice of materials for each of the component layers is preferably determined by balancing the goals of providing a device with high device efficiency.
- the various elements of the devices of the present invention may be fabricated by any of the techniques well known in the art, such as solution casting, screen printing, web coating, ink jet printing, sputtering, evaporation, precursor polymer processing, melt-processing, and the like, or any combination thereof.
- the diodes are built up by sequential deposit of layers upon a substrate.
- the inorganic contact 110 portion of the composite electrode is laid down first. This layer is commonly deposited by vacuum sputtering (RF or Magnetron), electron beam evaporation, thermal vapor deposition, chemical deposition or the like methods commonly used to form inorganic layers.
- the buffer layer 112 is laid down.
- This layer is usually most conveniently deposited as a layer from solution by spin casting or like technique.
- water is generally used as the spin-casting medium.
- a non-aqueous solvent such as toluene, xylenes, styrene, aniline, decahydronaphthalene, chloroform, dichloromethane, chlorobenzenes and morpholine.
- the photoactive layer 102 of conjugated polymer is deposited.
- the conjugated polymer can be deposited or cast directly from solution.
- the solvent employed is one which will dissolve the polymer and not interfere with its subsequent deposition. Depending upon the active polymer used the solvent can be non-aqueous or aqueous.
- non-aqueous solvents include halohydrocarbons such as methylene chloride, chloroform, and carbon tetrachloride, aromatic hydrocarbons such as xylene, benzene, toluene, other hydrocarbons such as decaline, and the like.
- Mixed solvents can be used, as well.
- Polar solvents such as water, acetone, acids and the like may be suitable.
- the solution can be relatively dilute, such as from 0.1 to 20% w in concentration, especially 0.2 to 5% w. Film thicknesses of 500-4000 and especially 1000-2000 A are typically used.
- the invention is based on the development of formulations of conductive conjugated polymers such as the emraldine salt (ES) of polyaniline, PANI(ES), which leads to high resistivity films for use in high efficiency pixelated polymer electronic devices such as emissive displays and a method has been developed for casting transparent thin films of the high resistivity conductive polymers onto pre-patterned ITO substrates.
- a method has been developed for depositing a thin transparent film of high resisitivity materials such as PANI(ES) from an aqueous dispersion onto a either pre-patterned ITO-on-glass substrates or ITO-on-plastic substrates.
- PANI-PAAMPS A was prepared using a procedure similar to that described in the reference Y. Cao, et al, Polymer, 30(1989) 2305, more specifically, as described below. HC1 in this reference was replaced by poly(2-acrylamido-2-methyl-l-propanesulfonic acid (PAAMPSA) (available from Aldrich, Milwaukee, WI 53201).
- PAAMPSA poly(2-acrylamido-2-methyl-l-propanesulfonic acid
- ES emeraldine salt
- 30.5 g (0.022 mole) of 15% PAAMPSA in water (Aldrich ) was diluted to 2.3% by adding 170 ml water.
- 2.2 g (0.022M) aniline was added into the PAAMPSA solution.
- 2.01 g (0.0088M) of ammonium persulfate in 10 ml water was added slowly into the aniline/PAAMPS A solution under vigorous stirring.
- the reaction mixture was stirred for 24 hours at room temperature.
- PANI-PAAMPS A 1000 ml of acetone was added into reaction mixture. Most of acetone/water was decanted and then the PANI-PAAMPSA precipitate was filtered.
- the resulting gum-like product was washed several times by acetone and dried at 40°C under dynamic vacuum for 24 hours.
- PANI-PAAMPSA powder as prepared in Example 1 was mixed with 100 g of deionized water in a plastic bottle. The mixture was rotated at room temperature for 48 hours. The solutions/dispersions were then filtered through 0.45 ⁇ m polypropylene filters. Different concentrations of PANI-PAAMPSA in water are routinely prepared by changing the quantity of PANI-PAAMPSA mixed into the water.
- a PANI-PAAMPSA film was drop-casted from 1% w/w) solution/dispersion in water.
- the film thickness was measured to be 650 nm by a surface profilometer (Alpha-Step 500) (available from KLA-Tencor, San Jose, CA 95134).
- a surface profilometer (Alpha-Step 500) (available from KLA-Tencor, San Jose, CA 95134).
- a wide-angle diffraction diagram WAXD was taken on the PANI-PAAMPSA film.
- the diffraction pattern showed no characteristic diffraction peaks; the data indicated that the film was amorphous.
- PAM polyacrylamide
- M.W. 5,000,000 - 6,000,000 available from Polysciences (Warrinton, PA 18976) was mixed with 400 ml deionized water in a plastic bottle. The mixture was rotated at room temperature for at least 48 hours. The solution/dispersion was then filtered through 1 ⁇ m polypropylene filters. Different concentrations of PAM are routinely prepared by changing the quantity of PAM dissolved.
- Example 2 was mixed with 20 g of 1% (w/w) PAM solution as prepared in Example 4 (mixed at room temperature for 24 hours). The solution was then filtered through 0.45 ⁇ m polypropylene filters. The PANI-PAAMPSA to PAM ratio was 1:2 in the blend solution. Different blend ratios of the PANI- PAAMPSA/PAM solutions were prepared by changing the concentrations of PANI-PAAMPSA and PAM in the starting solutions including the following: PANI-PAAMPSA PAM (w/w) at 2/1, and 1/1. This Example demonstrates that PAM-PAAMPSA/PAM blends can be prepared with a range of PAM concentrations, that these blends can be dissolved dispersed in water and that they can be filtered through a 0.45 ⁇ m.
- Example 5 was repeated, but PAAMPSA was used instead of PAM.
- the blend ratio of PANI-PAAMPS A7PAAMPS A (w/w) was, respectively, 1/0.1, 1/0.3,
- PANI-PAAMPSA/PAAMPSA blends can be prepared with a range of PAAMPSA concentrations, that these blends can be . dissolved/dispersed in water and that they can be filtered through a 0.45 ⁇ m filter.
- Example 5 was repeated, but PEO was used instead of PAM.
- the blend ratio of PANI-PAAMPSA/PEO (w/w) was 1/1.
- EXAMPLE 8 Glass substrates were prepared with patterned ITO electrodes. Using the blend solutions as prepared in Examples 5, 6 and 7, polyaniline blend layers were spin-cast on top of the patterned substrates and thereafter, baked at 90 °C in a vacuum oven for 0.5 hour. The resistance between ITO electrodes was measured using a high resistance Keithley 487 Picoammeter, from Keithley Instruments Inc., (Cleveland, Ohio 44139). Table 1 shows the conductivity of PANI(ES)-blend films with different blend compositions. As can be seen from Table, the conductivity can be controlled over a wide range.
- PAAMPSA PAAMPSA : PAM blend solutions are prepared by changing the concentrations in the starting solutions.
- Example 9 was repeated; the content of PANI-PAAMPSA is kept at
- EXAMPLE 11 30 g of a solution as prepared in Example 2 was mixed with 15 g of deionized water and 0.6 g of PAM (M.W. 5,000,000 - 6,000,000, available from Polysciences) under stirring at room temperature for 4 - 5 days. The ratio of PANI-PAAMPSA to PAM in the blend solution was 1/2. Blend solutions were also prepared in which the content of PANI-PAAMPSA was 0, 10, 25 and 40%, respectively.
- Example 8 The resistance measurements of Example 8 were repeated, but the PANI(ES) layer was spin-cast from the blend solutions prepared in Examples 11.
- Fig. 3 shows the conductivity of PANI(ES)-blend films with different blend compositions. As can be seen from the data, the conductivity can be controlled in wide range to meet display requirements. Conductivity values less than 10 "5 S/cm (electrical resistivity of greater than 10* ohm-cm), can be obtained. With higher concentrations of PAM in the blend, the conductivity dropped below 10 "6 S/cm (electrical resistivity of greater than 10 6 ohm-cm). .
- Example 8 The resistance measurements of Example 8 were repeated, but the PANI(ES) layer was spin-cast from the blend solutions as prepared in Examples 9 and 10.
- Table 2 shows the conductivity of polyblend films with different blend compositions; the conductivity can be controlled over a wide range of values.
- Ratio of polyaniline to total host polymer is l/2(w/w)
- Light emitting diodes were fabricated using poly(2-(3,7dimethyloctyloxy)- 5-methoxy-l,4-phenylenevinylene) (DMO-PPV) as the active semiconducting, luminescent polymer; the thickness of the DMO-PPV films were 500 -1000 A.
- Indium/tin oxide was used as the first layer ofthe bilayer anode.
- PANI- PAAMPSA (of Example 2) was spin-coated from 1 % solution/dispersion in water onto ITO with thicknesses ranging from 100 to 800 A, and thereafter, baked at 90 °C in vacuum oven for 0.5 hour.
- the device architecture was ITO/PANI(ES)- PAAMPSA DMO-PPV/metal.
- ITO/PANI-PAAMPSA bilayer was the anode and the hole-injecting contact.
- Devices were made with a layer of Ba as the cathode.
- the metal cathode film was fabricated on top of the DMO-PPV layer using vacuum vapor deposition at pressures below lxl 0 -6 Torr yielding an acting layer with area of 3 cm 2 .
- Fig. 4 shows the light output (curve 400) and external quantum efficiency (curve 410) of ITO/PANI(ES)- PAAMPSA/DMO- PPV/Ba device.
- the external efficiency of the device with bilayer PANI(ES)-PAAPMSA ITO anode is significantly higher than device with ITO anode.
- This Example demonstrates that high performance polymer LEDs can be fabricated using PANI-PAAMPSA as the second layer of the bilayer anode.
- Example 8 The resistance measurements of Example 8 were repeated using commercially available poly(ethylenedioxythiophene), PEDT, polyblend solutions available from Bayer AG (Pittsburgh, , PA 15205). Table 3 shows that the PANI(ES) blends prepared by this invention (see EXAMPLE 9) yield a layer with much lower conductivity than that obtained from PEDT. This Example demonstrates that the conductivity of PEDT is too high to be used in passively addressed pixelated displays; the inter-pixel leakage current will lead to cross-talk and to reduced efficiency.
- PEDT-PSS 600 2800 0.22 11.7 3.0xl0 -3 3.3xl0 2
- R* resistance between two adjacent ITO lines in 10x10 configuration (in mega ohms);
- Example 5 was repeated, but the host polymer was, respectively, poly(acrylic acid), PAM-carboxy, polyvinylpyrrolidone and polystyrene (aqueous emulsion) instead of PAM.
- PANI-PAAMPSA/host polymersolution/dispersion was prepared as indicated in Example 5. 5 EXAMPLE 17
- Table 4 shows the device performance of LEDs fabricated from polyblend films with different host polymers. 0 This Example demonstrates that the use of PANI-PAAMPSA blends can be used to fabricate polymer LEDs with significantly higher efficiency; this higher efficiency is obtained because inter-pixel current leakage has been significantly reduced by using the high resistance PANI(ES)-blend as the hole injection layer.
- Example 14 The device measurements summarized in Example 14 were repeated, but the PANI(ES) layer was spin-cast from the blend solutions with different PANI(ES)PAAMPSA/PAM ratios (see EXAMPLE 11).
- Table 5 shows the device performance of LEDs fabricated from polyblend films with different PANI-
- Example 14 The device measurements summarized in Example 14 were repeated, but poly[5-(4-(3,7-dimethyloctyloxy)phenyl)-phenylene-l,4-vinylene] (DMOP-PPV) and its random co-polymer with DMO-PPV were used instead of DMO-PPV.
- DMOP-PPV poly[5-(4-(3,7-dimethyloctyloxy)phenyl)-phenylene-l,4-vinylene]
- the device performance data are listed in Table 6.
- This EXAMPLE demonstrates that different color (e.g. red, green, orange etc) can be fabricated using PANI-PAAMPSA as the hole injection layer.
- Example 14 The device of Example 14 was encapsulated using a cover glass sandwiched by UV curable epoxy. The encapsulated devices were run at a constant current of 8.3 mA cm 2 in ambient atmosphere in an oven at temperatures
- FIG. 5 shows the light output (curve 510) and voltage increase (curve 512) during operation at 85 °C.
- the half life of the devices with the iTO/PAAMPSA bilayer exceeds 450 hours with a very low vohage increase (5 mV/hour).
- the temperature acceleration factor was estimated to be ca. 100.
- the extrapolated stress life at room temperature was determined to be approximately 40,000 hours.
- Fig. 6 shows the real time stress data at room temperature light output
- Fig. 7 shows the luminance (curve 700) and voltage (at constant current) (curve 710) vs time during stress at 16.5 mA/cm2 with the device at 70°C.
- Example 1 was repeated, but 1.1 g of PAM (Polysciences, M.W. 4-6M) was added into aniline-PAAMPSA-water mixture. After vigorous stirring and complete dissolution of PAM in the reaction mixture the oxidant was added into reaction mixture. All other steps were the same as Example 1.
- a PANI(ES)-blend with polyaniline to PAM ratio of 1 :2 was prepared directly from polymerization.
- Aqueous solutions/dispersions for example, 1 or 2% w/w
- the solution was filtered through a 0.45 ⁇ m filter.
- the bulk conductivity of a thin film spin-cast from the resulting aqueous dispersion was measured to be (approximately 10 -6 S/cm); i.e. three orders of magnitude lower than the film from Example 1 of same thickness; and one order of magnitude lower than that of blend prepared by mixing of aqueous dispersion from Example 1 and PAM solution in water (see Example 5).
- This Example demonstrates that the desired high resistance P ANI(ES)-
- PAAMPSA/PAM blend can be synthesized directly in a single process.
- Fig. 8a had a low resistance PEDT layer (resistivity approximately equal to 200 ohm-cm) such that the resistance between columns was approximately 20,000 ohms.
- the display in Fig. 8b had a PANI(ES) polyblend layer (resistivity approximately equal to 4,000 ohm-cm) such that the resistance between columns was approximately 400,000 ohms.
- the display in Fig. 8a had a low resistance PEDT layer (resistivity approximately equal to 200 ohm-cm) such that the resistance between columns was approximately 20,000 ohms.
- the display in Fig. 8b had a PANI(ES) polyblend layer (resistivity approximately equal to 4,000 ohm-cm) such that the resistance between columns was approximately 400,000 ohms.
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
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US21273600P | 2000-06-20 | 2000-06-20 | |
US212736P | 2000-06-20 | ||
PCT/US2001/018189 WO2001099192A2 (en) | 2000-06-20 | 2001-06-05 | High resistance conductive polymers for use in high efficiency pixellated organic electronic devices |
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EP01946100A Withdrawn EP1292985A2 (de) | 2000-06-20 | 2001-06-05 | Leitfähige polymere mit hohem widerstand, insbesondere verwendbar für hocheffiziente organische elektronische anzeige mit mehreren bildelementen |
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EP (1) | EP1292985A2 (de) |
JP (1) | JP2004501494A (de) |
KR (1) | KR20030036231A (de) |
CN (1) | CN1269220C (de) |
AU (1) | AU2001268187A1 (de) |
CA (1) | CA2410535A1 (de) |
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WO2004029128A2 (en) | 2002-09-24 | 2004-04-08 | E.I. Du Pont De Nemours And Company | Water dispersible polythiophenes made with polymeric acid colloids |
EP2341118A1 (de) * | 2002-09-24 | 2011-07-06 | E. I. du Pont de Nemours and Company | Elektrisch leitfähige Kompositwerkstoffe basierend auf organischen Polymeren und Nanoteilchen sowie deren Verwendung |
TW200502277A (en) | 2003-05-20 | 2005-01-16 | Nissan Chemical Ind Ltd | Charge-transporting varnish |
US7582707B2 (en) | 2004-01-12 | 2009-09-01 | Air Products And Chemicals, Inc. | Aqueous blends and films comprising a first electrically conducting conjugated polymer and a second electrically conducting conjugated polymer |
US7351358B2 (en) | 2004-03-17 | 2008-04-01 | E.I. Du Pont De Nemours And Company | Water dispersible polypyrroles made with polymeric acid colloids for electronics applications |
JP4747637B2 (ja) * | 2005-03-31 | 2011-08-17 | 凸版印刷株式会社 | 有機elディスプレイパネルの製造方法 |
WO2007002740A2 (en) | 2005-06-28 | 2007-01-04 | E. I. Du Pont De Nemours And Company | Buffer compositions |
KR101356296B1 (ko) | 2005-06-28 | 2014-02-06 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 높은 일 함수의 투명한 도체 |
JP4770492B2 (ja) * | 2006-02-02 | 2011-09-14 | セイコーエプソン株式会社 | 発光装置およびその製造方法 |
US20080191172A1 (en) | 2006-12-29 | 2008-08-14 | Che-Hsiung Hsu | High work-function and high conductivity compositions of electrically conducting polymers |
US20090236979A1 (en) * | 2008-03-24 | 2009-09-24 | Air Products And Chemicals, Inc. | Organic Electroluminescent Device and the Method of Making |
JP2013545293A (ja) * | 2010-10-20 | 2013-12-19 | ▲海▼洋王照明科技股▲ふん▼有限公司 | 有機電界発光素子及びその製造方法 |
CN106292118A (zh) * | 2016-08-31 | 2017-01-04 | 广州奥翼电子科技股份有限公司 | 电泳显示微单元、电子墨水、电泳显示膜片及电泳显示器 |
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US5798170A (en) * | 1996-02-29 | 1998-08-25 | Uniax Corporation | Long operating life for polymer light-emitting diodes |
GB9718393D0 (en) * | 1997-08-29 | 1997-11-05 | Cambridge Display Tech Ltd | Electroluminescent Device |
WO2000006665A1 (en) * | 1998-07-28 | 2000-02-10 | The Dow Chemical Company | Organic electroluminescent devices |
EP1234347A1 (de) * | 1999-12-02 | 2002-08-28 | DuPont Displays, Inc. | Polyanilin mit hohem widerstand, insbesondere verwendbar für hocheffiziente elektronische polymeranzeige mit mehreren bildelementen |
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- 2001-06-05 WO PCT/US2001/018189 patent/WO2001099192A2/en not_active Application Discontinuation
- 2001-06-05 KR KR1020027017251A patent/KR20030036231A/ko not_active Application Discontinuation
- 2001-06-05 CN CNB018115020A patent/CN1269220C/zh not_active Expired - Fee Related
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WO2001099192A3 (en) | 2003-01-16 |
AU2001268187A1 (en) | 2002-01-02 |
IL153062A0 (en) | 2003-06-24 |
CA2410535A1 (en) | 2001-12-27 |
KR20030036231A (ko) | 2003-05-09 |
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CN1269220C (zh) | 2006-08-09 |
CN1437766A (zh) | 2003-08-20 |
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