[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

EP0995135A2 - Dispositif transpondeur et son procede de production - Google Patents

Dispositif transpondeur et son procede de production

Info

Publication number
EP0995135A2
EP0995135A2 EP98941231A EP98941231A EP0995135A2 EP 0995135 A2 EP0995135 A2 EP 0995135A2 EP 98941231 A EP98941231 A EP 98941231A EP 98941231 A EP98941231 A EP 98941231A EP 0995135 A2 EP0995135 A2 EP 0995135A2
Authority
EP
European Patent Office
Prior art keywords
transponder
arrangement according
module
carrier
transponder arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP98941231A
Other languages
German (de)
English (en)
Inventor
Holm Baeger
Werner Bloch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AEG Identifikationssysteme GmbH
Original Assignee
AEG Identifikationssysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AEG Identifikationssysteme GmbH filed Critical AEG Identifikationssysteme GmbH
Publication of EP0995135A2 publication Critical patent/EP0995135A2/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
    • H01Q7/08—Ferrite rod or like elongated core

Definitions

  • the invention relates to a transponder arrangement and a method for its production.
  • Transponder arrangements are particularly important for the identification of objects by means of contactless signal exchange via electrical and / or preferably magnetic fields.
  • Transponder arrangements in check card pre-mat (GB 2133950 A) or elongated glass bodies are advantageously used as designs.
  • the present invention is based on the object of specifying a transponder arrangement which is simple to manufacture and handle, in particular also for fastening to metallic surfaces, and a method for producing such a transponder arrangement.
  • transponder arrangement according to the invention is specified in claim 1, the manufacturing method in claim 31.
  • the subclaims contain advantageous configurations and further developments.
  • the invention leads to a reliable and particularly stable transponder arrangement in use.
  • the transponder arrangement due to the full encapsulation very good passivation remain on an object even if it is exposed to aggressive influences, for example undergoes a cleaning process.
  • the transponder module and carrier module can be finished in separate, and therefore optimizable, previous manufacturing sections.
  • no electrical contacting is required any more during assembly, so that the transponder modules can finally be tested for functionality beforehand.
  • the carrier modules can be produced particularly inexpensively as shaped sheet metal parts and thereby combine several advantageous individual elements of the arrangement.
  • FIG. 2 shows a first side view of such a carrier module with a transponder module inserted
  • FIG. 3 shows a to FIG. 2 further side view rotated by 90 °.
  • FIG. 4 shows a to FIG. 3 alternative design.
  • FIG. 6 shows a schematic representation of an advantageous manufacturing method.
  • the FIG. 1 shows a top view of a preform of a carrier module in the preferred embodiment of a formed metal sheet.
  • the carrier module consists in one piece of essentially the elements base plate G, tabs L and Holding elements H and is carried out essentially flat at this stage.
  • the base plate G has spacer elements S in the form of bulges of the sheet on the transponder side. Furthermore, the base plate contains cutouts or openings D.
  • the tabs laterally lead away from the base plate and are later bent away essentially perpendicular to the plane of the base plate.
  • the holding elements H can lie in the plane of the base plate G or be slightly offset against it.
  • the holding elements can additionally be equipped with holes B in order to enable fastening by means of bolts, bolts or the like. Holes of this type are not required for fastening by soldering or welding, in particular spot welding.
  • the tabs only lead away on two opposite edges, which are referred to as longitudinal edges of the base plate for the description of the arrangement.
  • no tabs are provided on the two other edges of the base plate, which are referred to as end edges to distinguish them, but without excluding variants with tabs on these edges as well.
  • fixing elements F can be provided on the front edges of the base plate, for example in the form of bends or bulges, against which edges of the transponder module can rest.
  • the holding elements H fulfill a double function, on the one hand they determine the position of the base plate in the encapsulation during the encapsulation and on the other hand they serve as fastening elements for the finished transponder arrangement on an object.
  • the base plate G has approximately the same surface area as the transponder module provided for resting thereon.
  • the dotted line that surrounds the base plate indicates the outline of the potting body V of the transponder arrangement, which will later be cast, and makes it clear that the potting compound surrounds the entire transponder module and the base plate of the carrier module laterally, whereas the holding elements H protrude from the potting body.
  • FIG. 2 shows a section through a transponder arrangement parallel to the longitudinal edges of the base plate through the spacer elements and openings in side view.
  • the spacer elements S can be seen as bulges on the base plate, which ensure that the central region of the transponder module maintains a short distance from the base plate. This prevents damage to the coil winding around the coil carrier in this area.
  • the transponder module is secured against displacement in this direction by the fixing elements F on the front edges of the base plate G.
  • the potting compound completely surrounds the transponder module on all sides.
  • the base plate G forms part of one of the surfaces of the casting body assumed to be cuboid and thus closes it off to one side.
  • the spacing elements also fill the area between the transponder module and base plate with potting material.
  • a further anchoring of the carrier module, in particular its base plate, with the potting material can be achieved via the openings D.
  • Such anchoring can be further improved if the potting material can grip the edges of the openings, for example by slightly bulging the edges of the openings, as shown by RD in FIG. 2 indicated.
  • the coil carrier ST of the transponder module shows terminal coil-free areas W with which it rests on the spacer elements S. This reliably prevents damage to the coil.
  • the tabs are shown in the sketch according to FIG. 2 not hinted at for reasons of clarity of presentation.
  • FIG. 3 shows a sectional view through a transponder arrangement parallel to the front edges of the base plate.
  • This representation clearly shows the im tabs L bent essentially perpendicularly from the base plate to the transponder side and their function for gripping the transponder module TM in the carrier module.
  • the tabs can advantageously be provided approximately at the level of the upper edge of the transponder module with oblique contact surfaces P, via which the transponder module can be easily inserted into the carrier module by spreading the tabs and held by the resilient tabs and pressed slightly in the direction of the base plate. This enables the transponder module to be fixed in the correct position for the potting process in a simple and reliable manner.
  • the tabs can extend so far away from the base plate that their ends lie against the opposite wall when they are inserted into the casting mold and, under certain circumstances, are slightly deformed towards the base plate during the casting process. The ends of the tabs then appear as hardly visible points in the surface of the potting material.
  • the broken line again indicates the boundary of the potting body of the potted transponder arrangement and illustrates the complete encapsulation of the transponder module with holding elements H protruding beyond the potting body.
  • the arrangement of the in FIG. 4 outlined in this way differs from that in FIG. 3 outlined arrangement, when in this case the potting body also completely encloses the base plate and below the base plate, ie on the side facing away from the transponder module there is still a layer of potting material.
  • the openings in the base plate have an advantageous effect as material bridges which ensure a secure connection of the potting material present on both sides of the base plate.
  • the holding elements H are advantageously bent downwards offset with respect to the plane of the base plate and lie at least approximately in the plane of the interface of the potting body.
  • the tabs are in the in FIG. 4 sketched example not led to the surface of the casting body, so as not to press the base plate down in the casting mold.
  • FIG. 5 shows a basic outline of a preferred transponder module, in which a coil arrangement SP with a plurality of turns is wound on a coil carrier ST.
  • An electronic transponder circuit E which is electrically connected to the coil, is additionally arranged on a surface of the coil carrier T.
  • the transponder module is not contacted to the outside and forms a passive field-fed transponder.
  • the coil carrier ST is, for example, cuboid with height m width n and length o, preferably m being substantially smaller than n and o, in particular m ⁇ 5 mm.
  • the transponder module shows coil-free areas W on the coil support ST.
  • both the spacer elements E and the tabs L of the support module are advantageously located.
  • the main magnetic field direction of the coil arrangement runs parallel to the longitudinal direction of the coil carrier.
  • the coil carrier advantageously consists of ferrite material.
  • such a transponder module is particularly advantageous for arrangement on objects with a metallic surface. Due to the special suitability of the in FIG. 5 outlined transponder module for arrangement on metallic surfaces, the connection with a metallic carrier module is also particularly favorable when the magnetic field direction of the coil arrangement is oriented parallel to the base plate.
  • FIG. 6 schematically outlines an advantageous possibility of inexpensive production of transponder arrangements according to the invention. It is based on the specification of preforms of the carrier modules, such as in FIG. 1 outlined as a pre-cut tape with a large number of such preforms. If the belt is fed continuously or quasi-continuously, the tabs can be bent away from the plane of the base plates in a first step and the carrier modules can be equipped with transponder modules in a next step. For further processing, the bond can be kept in the band during the casting process and the cast arrangements can then be separated or the separation can be carried out before the casting.
  • SET BLADE encompasses all forms of treatment in which the carrier and transponder modules are surrounded by a pourable or sprayable or similar material, which can then be solidified, in particular also the so-called molding.
  • Another inexpensive manufacturing method is the so-called benefit manufacturing, in which a majority e.g. two-dimensionally connected carrier and transponder modules are simultaneously cast in a multiple mold and then separated. It is also common to specify a plurality of preforms as a flat or preferably strip-shaped composite for insertion into a cassette of an automatic processing machine and for successive processing.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Train Traffic Observation, Control, And Security (AREA)
  • Near-Field Transmission Systems (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

L'invention concerne un dispositif transpondeur présentant un module support (G, H, L) et un module transpondeur (TM) dans un corps de scellement (V). Ce dispositif est particulièrement facile à produire et extrêmement résistant à l'usage. Un mode de réalisation préféré de l'invention est particulièrement adapté pour être fixé sur des objets à surfaces métalliques. L'invention concerne également un procédé de production dudit dispositif.
EP98941231A 1997-07-14 1998-06-26 Dispositif transpondeur et son procede de production Ceased EP0995135A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19730166A DE19730166A1 (de) 1997-07-14 1997-07-14 Transponderanordnung und Verfahren zu deren Herstellung
DE19730166 1997-07-14
PCT/DE1998/001750 WO1999004295A2 (fr) 1997-07-14 1998-06-26 Dispositif transpondeur et son procede de production

Publications (1)

Publication Number Publication Date
EP0995135A2 true EP0995135A2 (fr) 2000-04-26

Family

ID=7835682

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98941231A Ceased EP0995135A2 (fr) 1997-07-14 1998-06-26 Dispositif transpondeur et son procede de production

Country Status (4)

Country Link
EP (1) EP0995135A2 (fr)
JP (1) JP2001510914A (fr)
DE (1) DE19730166A1 (fr)
WO (1) WO1999004295A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1947733A1 (fr) * 2004-08-13 2008-07-23 Fujitsu Ltd. Étiquette d'identification de radiofréquence (RFID) et procédé de fabrication correspondant

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3855253B2 (ja) * 2000-06-13 2006-12-06 アイシン精機株式会社 バーアンテナおよびその製造方法
WO2003083770A1 (fr) * 2002-04-01 2003-10-09 K-Ubique Id Corporation Dispositif de communication et son boitier
FR2884681B1 (fr) 2005-04-15 2007-06-22 St Microelectronics Sa Antenne pour etiquette electronique
DE102006017992A1 (de) * 2006-04-07 2007-10-18 Balluff Gmbh Datenträger-/Sendevorrichtung und Verfahren zur Herstellung einer Datenträger-/Sendevorrichtung
WO2008000848A1 (fr) * 2006-06-23 2008-01-03 Hispano Ferritas S.A. Dispositif d'identification par radiofréquence haute fréquence
JP6648830B2 (ja) * 2016-07-01 2020-02-14 株式会社村田製作所 コイルモジュール

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4605845A (en) * 1982-12-14 1986-08-12 Shigekazu Takeda Detectable card and entry and departure checking apparatus utilizing the same
US5211129A (en) * 1986-02-25 1993-05-18 Destron/Idi, Inc. Syringe-implantable identification transponder
DE3615037C2 (de) * 1986-05-03 1994-04-07 Johann Leonhard Huettlinger Verfahren zum Herstellen von Spulen für die SMD-Technik
DE3933795A1 (de) * 1989-10-11 1991-04-18 Ulrich Grass Vorrichtung zur mengenerfassung von hausmuell
US5025550A (en) * 1990-05-25 1991-06-25 Trovan Limited Automated method for the manufacture of small implantable transponder devices
WO1992015105A1 (fr) * 1991-02-25 1992-09-03 Ake Gustafson Procede de fixation d'un bobinage a un circuit electronique
DE4220194C2 (de) * 1992-06-19 1996-02-22 Herbert Stowasser Vorrichtung und Verfahren zur Herstellung eines Transponders, wobei Wickeldraht einer Spule mit den Anschlußflächen eines elektronischen Bauelementes (Chip) verbunden wird
DE69125839T2 (de) * 1991-12-30 1997-07-31 Texas Instruments Inc Eingebauter Chip-Transponder mit Antennenspule
GB9220409D0 (en) * 1992-09-28 1992-11-11 Texas Instruments Holland Shielded transponder
DE4238225C2 (de) * 1992-11-12 1996-01-25 Imes Logistik Systeme Gmbh Vorrichtung zur Befestigung eines elektrischen Bauteils an einem Gegenstand
DE4244850C2 (de) * 1992-11-12 1997-06-26 Imes Logistik Systeme Gmbh Vorrichtung zur Befestigung eines elektrischen Bauteils an einem Gegenstand
DE4411863C2 (de) * 1993-04-08 1997-01-23 Seitz Peter Hausmülltonne mit einem Transponder als Antwortgerät
FR2733104B1 (fr) * 1995-04-12 1997-06-06 Droz Francois Repondeur de petites dimensions et procede de fabrication de tels repondeurs
DE19523521A1 (de) * 1995-06-30 1997-01-02 Licentia Gmbh Transponder-Drahtspule
DE19527359A1 (de) * 1995-07-26 1997-02-13 Giesecke & Devrient Gmbh Schaltungseinheit und Verfahren zur Herstellung einer Schaltungseinheit
JPH0974307A (ja) * 1995-09-05 1997-03-18 Murata Mfg Co Ltd チップアンテナ
DE19534480C2 (de) * 1995-09-18 1999-11-11 David Finn IC-Kartenmodul zur Herstellung einer IC-Karte sowie IC-Karte mit einem IC-Kartenmodul
DE19536464C2 (de) * 1995-09-29 1998-06-04 Siemens Ag Transponder und Verfahren zu seiner Herstellung
DE19538917C2 (de) * 1995-10-19 1997-08-21 Junghans Uhren Gmbh Kontaktlose Chipkarte

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9904295A3 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1947733A1 (fr) * 2004-08-13 2008-07-23 Fujitsu Ltd. Étiquette d'identification de radiofréquence (RFID) et procédé de fabrication correspondant

Also Published As

Publication number Publication date
WO1999004295A2 (fr) 1999-01-28
WO1999004295A3 (fr) 1999-05-14
JP2001510914A (ja) 2001-08-07
DE19730166A1 (de) 1999-01-21

Similar Documents

Publication Publication Date Title
DE2159530C3 (de) Verfahren zum Herstellen einer Halbleiteranordnung
EP0537419A1 (fr) Dispositif comportant un senseur de champ magnétique intégré et premier et second concentrateur de flux magnétique, et procédé pour monter dans un boîtier en maitière synthétique une pluralité de ces dispositifs
DE3808971A1 (de) Zusammengesetztes bauelement
DE2234961B2 (de) Verfahren zur Herstellung von Steckern für Schaltplatten
DE19743537A1 (de) Halbleitergehäuse für Oberflächenmontage sowie Verfahren zu seiner Herstellung
DE3854437T2 (de) Chipkondensator.
DE69330249T2 (de) Leistungsverpackung mit hoher Zuverlässigkeit für eine elektronische Halbleiterschaltung
DE2619658A1 (de) Verfahren zum herstellen einer elektrischen verbindereinheit
DE69305633T2 (de) Verfahren und Vorrichtung, um Drähte zwischen einem Halbleiterchip und dem zugehörigen Leiterrahmen anzuschliessen
DE2217218B1 (de) Kontaktfedersatz fur ein elektro magnetisches Relais und Verfahren zur Herstellung desselben
EP0995135A2 (fr) Dispositif transpondeur et son procede de production
EP0654170B1 (fr) Dispositif thermique de securite et procede pour l'activer
DE2735143A1 (de) Vierseitiger elektrischer bauteil und verfahren zur herstellung
EP1880398B2 (fr) Composant electronique et procede de fixation
DE69319259T2 (de) Verbesserte Kontakte für den Anschluss von Spulenwicklungen
EP0860016B1 (fr) Dispositif de connexion
DE102009016160B4 (de) Verfahren zur Herstellung einer Kontaktvorrichtung und Kontaktvorrichtung
DE102008045408A1 (de) Befestigungsstruktur für eine elektronische Vorrichtung und Verfahren zum Herstellen derselben
DE3510638C1 (de) Induktives Miniatur-Bauelement, insbesondere Miniatur-Spule sowie Verfahren zur Herstellung eines solchen Bauelements
DE102008000371B4 (de) Elektronische Steuereinheit und Verfahren, diese herzustellen
DE2041110A1 (de) Befestigungsvorrichtung zum Befestigen der aeusseren Enden zweier Spiralfedern in zeithaltenden Instrumenten
DE9310630U1 (de) An einer Montagefläche befestigtes elektrisches Gerät
DE19851532C2 (de) Sicherungshalter
DE20105170U1 (de) Chipkarte
DE1499894C3 (de) Vorrichtung zur genauen Abstandshaltung der Einzelmagnete bei der Montage von Mehrspurmagnetköpfen

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): DE DK ES FR GB IT NL

17P Request for examination filed

Effective date: 20000214

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

17Q First examination report despatched

Effective date: 20010525

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED

18R Application refused

Effective date: 20011119