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EP0835523A1 - Procede de conditionnement d'un circuit electronique sensible a la pression dans un boitier protecteur etanche de tous les cotes - Google Patents

Procede de conditionnement d'un circuit electronique sensible a la pression dans un boitier protecteur etanche de tous les cotes

Info

Publication number
EP0835523A1
EP0835523A1 EP96917348A EP96917348A EP0835523A1 EP 0835523 A1 EP0835523 A1 EP 0835523A1 EP 96917348 A EP96917348 A EP 96917348A EP 96917348 A EP96917348 A EP 96917348A EP 0835523 A1 EP0835523 A1 EP 0835523A1
Authority
EP
European Patent Office
Prior art keywords
injection
plastic housing
molded part
molded
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP96917348A
Other languages
German (de)
English (en)
Inventor
Luc Jansseune
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0835523A1 publication Critical patent/EP0835523A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • B29C2045/1673—Making multilayered or multicoloured articles with an insert injecting the first layer, then feeding the insert, then injecting the second layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Definitions

  • the invention relates to a method for packaging a pressure-sensitive electronic circuit with an all-round sealing protective casing.
  • housings or packaging are generally known for hybrid circuits and for individual ICs.
  • a power semiconductor module it is known to insert an already assembled ceramic substrate as the housing base into a frame-shaped plastic housing and to glue it elastically.
  • the inside of the housing is then filled with a soft silicone rubber compound and / or with a hard potting compound made of epoxy resin up to the upper edge of the housing.
  • the hard potting compound gives the module mechanical stability and also fixes electrical connections protruding from the module.
  • individual ICs it has hitherto been customary to mount them on a leadframe and to connect them to this by bonding.
  • the object of the present invention is to create an improved method of the type specified at the outset, so that the packaged circuits produced in accordance therewith are protected on the one hand against environmental influences and the pressure-sensitive circuits are not exposed to any pressure or tension forces due to the protective casing itself.
  • a conductor carrier is encapsulated in a first injection mold with a plastic housing open on one side and then fitted with electronic components,
  • the unit obtained is brought into a second injection mold which can be assembled from a first and second half, the halves of which are successively individually included
  • Plastic injection material can be loaded and the second half of which can be approached and removed from the first half for successive injection processes
  • FIG. 4 shows a schematic side view of a moment in the process sequence according to the invention for conductor carriers guided on a production line
  • Figure 5 is a schematic plan view of an assembled and partially overmolded conductor carrier.
  • the production process begins with a lead frame or a lead frame being stamped as conductor carrier 1 and galvanized accordingly. Then this leadframe 1 is extrusion-coated with plastic and has, for example, the shape that is open on one side, as shown in FIG. If necessary, any electrical connections could already be disconnected.
  • the integrated circuit or several components are then attached to the leadframe 1 and connected by means of known technologies, for example bonding, soldering or printing.
  • the unit resulting after this first encapsulation with the IC 2, the bond wires 3, the lead frame 1 and the plastic housing 4 is shown again in another view in FIG. 5. In order to seal the components off from the environment and then seal them, the units 5 obtained, shown in FIG. 1, are again brought into a new injection mold.
  • This injection mold is constructed in a similar way to the known 2-component injection molding process, ie one half of the injection mold can be rotated or displaced after each cycle.
  • An embodiment with vertically superimposed injection mold halves is shown below, in which the upper, second half can be brought closer to the first half by lowering and removed again by lifting.
  • the unit 5 obtained according to FIG. 1 is first introduced into the lower first half of the injection mold, where a pre-molded part 6 is injected.
  • This injection mold as shown in FIG. 2, is selected so that the pre-molded part 6 is fitted into the opening 8 of the plastic housing 4 like a bottom. It is important that the spray material does not come into direct contact with the pressure-sensitive circuit structure, but that the pre-molded part is formed at a distance from the circuit, that is to say that a space 9 remains.
  • the finished molded part 7 shown in FIG. 3 is produced, for which purpose the second half of the injection mold is placed hat-like on the plastic housing 4 and the pre-molded part 6, which underneath it abuts the plastic housing 4. It is advantageous that the injection pressure presses the plastic housing 4 tightly onto the preform 6. This provides a good seal of the two parts 4 and 6 already during spraying.
  • the plastic flow from above into the second half of the injection mold is indicated by arrows.
  • FIG. 4 shows an exemplary embodiment with a double injection mold.
  • the overmolded and populated conductor carriers 1 are next to each other at a constant distance (Division) performed on a production line 10.
  • Four injection molds I, II, II and IV each consisting of two halves, are arranged next to one another at intervals of half a division.
  • two injection molds II, IV and I, III each separated by a division, are injection molded with two pre-molded parts or two pre-molded parts in a first cycle and two pre-molded parts or two pre-molded parts in a second " cycle.
  • the pre-molded parts 6 are injected in the injection molds II and IV, while in the same cycle, the pre-molded parts 7 are injected in the injection molds I and III ..
  • the production line is shifted by 2.5 divisions injected in the injection molds 1 and 3, and the pre-molded parts 7 in the injection molds 2 and 4. Then the production line is advanced by 1.5 divisions.
  • This cyclical production process reduces the cycle time by half, since otherwise in each individual cycle both the Injection molded part and then the finished injection molded part and cured
  • this process variant is also possible for parts that are not carried out on the assembly line, but by hand or with robots.
  • the result is a protective casing which seals on all sides and is essentially cuboid.
  • the plastic housing 4, which is open on one side, has an essentially U-shaped cross section, as shown in FIG.
  • the pre-molded part 7 itself likewise has a U-shaped cross section and surrounds the plastic housing 4 in a hat-like manner, its U legs extending beyond the boundary between the plastic housing 4 and the pre-molded part 6 and thus effecting the desired hermetic sealing of the circuit.
  • the electronic components can remain free in the hermetically sealed space.
  • the ICs or electronics are completely exposed, mechanical stresses cannot build up and influence the electrical parameters.
  • It is also advantageous that cheap plastics can be used to carry out the method. Electrically conductive, even ferromagnetic plastics, which are suitable for shielding or for guiding magnetic fields, can also be used. In the processing according to the invention, there is also no risk of damage to the bond wires.
  • micromechanical pressure and acceleration sensors can be packaged very simply without the moving parts being blocked.
  • protective enclosures almost any geometries, for example those with a plug collar, can be easily implemented.
  • the electrical test can possibly be carried out after the bonding.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

L'invention concerne un procédé de conditionnement d'un circuit électronique sensible à la pression dans un boîtier protecteur étanche de tous les côtés, procédé selon lequel on moule par injection sur une plaquette (1) de support de circuits imprimés un boîtier ouvert d'un côté et on équipe ensuite la plaquette (1). L'unité (5) ainsi obtenue est introduite dans un deuxième moule d'injection qui peut être constitué de deux moitiés que l'on peut remplir successivement et individuellement de matières plastiques de moulage par injection. Dans la première moitié de ce moule d'injection on moule, par injection, une préforme (6) qui ferme l'ouverture du boîtier en matière plastique (4) avec un certain écartement par rapport au circuit, puis on rapproche la deuxième moitié de la première moitié du moule et une pièce finie (7) est moulée par injection de façon à rendre étanche le boîtier en matière plastique (4) fermé par la préforme (6) moulée par injection.
EP96917348A 1995-06-30 1996-06-14 Procede de conditionnement d'un circuit electronique sensible a la pression dans un boitier protecteur etanche de tous les cotes Withdrawn EP0835523A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19524001 1995-06-30
DE1995124001 DE19524001A1 (de) 1995-06-30 1995-06-30 Verfahren zum Verpacken einer druckempfindlichen elektronischen Schaltung mit einer allseitig abdichtenden Schutzumhäusung
PCT/DE1996/001056 WO1997002601A1 (fr) 1995-06-30 1996-06-14 Procede de conditionnement d'un circuit electronique sensible a la pression dans un boitier protecteur etanche de tous les cotes

Publications (1)

Publication Number Publication Date
EP0835523A1 true EP0835523A1 (fr) 1998-04-15

Family

ID=7765763

Family Applications (1)

Application Number Title Priority Date Filing Date
EP96917348A Withdrawn EP0835523A1 (fr) 1995-06-30 1996-06-14 Procede de conditionnement d'un circuit electronique sensible a la pression dans un boitier protecteur etanche de tous les cotes

Country Status (3)

Country Link
EP (1) EP0835523A1 (fr)
DE (1) DE19524001A1 (fr)
WO (1) WO1997002601A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2137850B1 (es) * 1997-06-13 2000-08-16 Consejo Superior Investigacion Tecnica de encapsulacion para microsensores de presion entre ambientes humedos.
NL1018510C2 (nl) * 2001-07-11 2003-01-14 Fico Bv Werkwijze en inrichting voor het bewerken van een band met elektronische componenten en band met elektronische componenten.
DE10141889A1 (de) * 2001-08-28 2003-04-17 Bosch Gmbh Robert Vorrichtung
DE10156803A1 (de) * 2001-11-20 2003-05-28 Giesecke & Devrient Gmbh Verfahren, System und Werkzeug zur Herstellung eines elektronischen Datenträgers mit integrierter Spule
KR100428320B1 (ko) * 2002-04-12 2004-04-28 현대자동차주식회사 엘피아이 엔진이 채용된 차량의 시동성 제어방법
DE102014210843A1 (de) * 2014-06-06 2015-12-17 Robert Bosch Gmbh Gehäuse, Verfahren zum Herstellen eines Gehäuses und Spritzgießvorrichtung zum Herstellen eines Gehäuses

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Publication number Priority date Publication date Assignee Title
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
JPS5046485A (fr) * 1973-08-28 1975-04-25
DE2840972A1 (de) * 1978-09-20 1980-03-27 Siemens Ag Verfahren zur herstellung einer kunststoffkapselung fuer halbleiterbauelemente auf metallischen systemtraegern
GB2100521B (en) * 1981-05-13 1984-09-12 Plessey Co Plc Electrical device package
EP0157938A3 (fr) * 1984-03-23 1987-05-13 Siemens Aktiengesellschaft Boítier pour composants électriques
IT1221258B (it) * 1988-06-22 1990-06-27 Sgs Thomson Microelectronics Contenitore plastico a cavita' per dispositivi semiconduttore
JP2907914B2 (ja) * 1989-01-16 1999-06-21 シーメンス、アクチエンゲゼルシヤフト 電気又は電子デバイス又はモジユールの封止方法とパツケージ
JP2564707B2 (ja) * 1991-01-09 1996-12-18 ローム株式会社 電子部品用リードフレームにおけるモールド部のマルチ式成形方法及び成形装置

Non-Patent Citations (1)

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Title
See references of WO9702601A1 *

Also Published As

Publication number Publication date
WO1997002601A1 (fr) 1997-01-23
DE19524001A1 (de) 1997-03-06

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