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EP0843892A4 - Top loading socket for ball grid arrays - Google Patents

Top loading socket for ball grid arrays

Info

Publication number
EP0843892A4
EP0843892A4 EP96923548A EP96923548A EP0843892A4 EP 0843892 A4 EP0843892 A4 EP 0843892A4 EP 96923548 A EP96923548 A EP 96923548A EP 96923548 A EP96923548 A EP 96923548A EP 0843892 A4 EP0843892 A4 EP 0843892A4
Authority
EP
European Patent Office
Prior art keywords
ball grid
top loading
grid arrays
loading socket
socket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP96923548A
Other languages
German (de)
French (fr)
Other versions
EP0843892A1 (en
Inventor
James Michael Ramsey
Paul S Chinnock
Maria E Ryan
Jeffery Farnsworth
Patrick H Harper
Robert W Hooley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PCD Inc
Original Assignee
PCD Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/510,763 external-priority patent/US5578870A/en
Priority claimed from US08/657,517 external-priority patent/US5646447A/en
Application filed by PCD Inc filed Critical PCD Inc
Publication of EP0843892A1 publication Critical patent/EP0843892A1/en
Publication of EP0843892A4 publication Critical patent/EP0843892A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
EP96923548A 1995-07-10 1996-07-03 Top loading socket for ball grid arrays Withdrawn EP0843892A4 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US510763 1990-04-18
US101495P 1995-07-10 1995-07-10
US601014 1995-07-10
US08/510,763 US5578870A (en) 1995-08-03 1995-08-03 Top loading test socket for ball grid arrays
US657517 1996-06-03
US08/657,517 US5646447A (en) 1996-06-03 1996-06-03 Top loading cam activated test socket for ball grid arrays
PCT/US1996/011102 WO1997003467A1 (en) 1995-07-10 1996-07-03 Top loading socket for ball grid arrays

Publications (2)

Publication Number Publication Date
EP0843892A1 EP0843892A1 (en) 1998-05-27
EP0843892A4 true EP0843892A4 (en) 1998-09-16

Family

ID=27356798

Family Applications (1)

Application Number Title Priority Date Filing Date
EP96923548A Withdrawn EP0843892A4 (en) 1995-07-10 1996-07-03 Top loading socket for ball grid arrays

Country Status (5)

Country Link
EP (1) EP0843892A4 (en)
JP (1) JPH11509034A (en)
CN (1) CN1192825A (en)
CA (1) CA2226856A1 (en)
WO (1) WO1997003467A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11233216A (en) * 1998-02-16 1999-08-27 Nippon Denki Factory Engineering Kk Ic socket for test
KR100385876B1 (en) * 2000-12-20 2003-06-02 한미반도체 주식회사 Handler System For Cutting The Semiconductor Device
JP2005339894A (en) * 2004-05-25 2005-12-08 Three M Innovative Properties Co Socket for testing ball grid array integrated circuit
JP4729346B2 (en) * 2005-06-30 2011-07-20 株式会社エンプラス Socket for electrical parts
CN101063625B (en) * 2006-04-30 2010-08-11 中芯国际集成电路制造(上海)有限公司 BGA packaging retainer apparatus and method for testing BGA packaging
JP6548607B2 (en) * 2016-05-18 2019-07-24 三菱電機株式会社 Socket for electronic component and manufacturing method having evaluation process using the same
CN106785764A (en) * 2016-11-18 2017-05-31 珠海格力节能环保制冷技术研究中心有限公司 A kind of ball bar chip matrix deck and development board for circuit board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0613335A1 (en) * 1993-02-24 1994-08-31 Texas Instruments Incorporated Socket apparatus for IC package testing
US5419710A (en) * 1994-06-10 1995-05-30 Pfaff; Wayne K. Mounting apparatus for ball grid array device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4381131A (en) * 1981-05-04 1983-04-26 Burroughs Corporation Levered system connector for an integrated circuit package
US5006792A (en) * 1989-03-30 1991-04-09 Texas Instruments Incorporated Flip-chip test socket adaptor and method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0613335A1 (en) * 1993-02-24 1994-08-31 Texas Instruments Incorporated Socket apparatus for IC package testing
US5419710A (en) * 1994-06-10 1995-05-30 Pfaff; Wayne K. Mounting apparatus for ball grid array device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO9703467A1 *

Also Published As

Publication number Publication date
CN1192825A (en) 1998-09-09
EP0843892A1 (en) 1998-05-27
JPH11509034A (en) 1999-08-03
WO1997003467A1 (en) 1997-01-30
CA2226856A1 (en) 1997-01-30

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 19980204

AK Designated contracting states

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Designated state(s): DE ES FR GB IE IT PT

A4 Supplementary search report drawn up and despatched

Effective date: 19980803

AK Designated contracting states

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Designated state(s): DE ES FR GB IE IT PT

17Q First examination report despatched

Effective date: 20011213

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20020424