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EP0530209A1 - Ink-jet printing head for a liquid-jet printing device operating on the heat converter principle and process for making it. - Google Patents

Ink-jet printing head for a liquid-jet printing device operating on the heat converter principle and process for making it.

Info

Publication number
EP0530209A1
EP0530209A1 EP91907859A EP91907859A EP0530209A1 EP 0530209 A1 EP0530209 A1 EP 0530209A1 EP 91907859 A EP91907859 A EP 91907859A EP 91907859 A EP91907859 A EP 91907859A EP 0530209 A1 EP0530209 A1 EP 0530209A1
Authority
EP
European Patent Office
Prior art keywords
ink
elements
openings
ejection
outlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP91907859A
Other languages
German (de)
French (fr)
Other versions
EP0530209B1 (en
Inventor
Joachim Heinzl
Bernhard Hochwind
Hans W Poetzlberger
Helmut Dr Schlaak
Arno Dr Steckenborn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Kodak Co
Original Assignee
Mannesmann AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mannesmann AG filed Critical Mannesmann AG
Publication of EP0530209A1 publication Critical patent/EP0530209A1/en
Application granted granted Critical
Publication of EP0530209B1 publication Critical patent/EP0530209B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14024—Assembling head parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1606—Coating the nozzle area or the ink chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/1437—Back shooter

Definitions

  • the invention relates to an ink writing head for a liquid jet recording device operating according to the thermal transducer principle and to a method for its production in accordance with the features of patent claims 1 and 11.
  • Known recording heads which operate according to the thermal converter principle (bubble jet principle) have a large number of individual nozzles from which individual droplets of a defined size (in the range from 10 to 200 ⁇ m diameter) are produced and in a defined one under the action of an electronic control Patterns are ejected in the direction of a recording medium.
  • a defined size in the range from 10 to 200 ⁇ m diameter
  • the characters to be printed are generated by several drops of ink; the patterns for each character are defined in a so-called matrix.
  • a full column of such a matrix is expediently printed at the same time in order to meet the requirements for high printing speed and a uniform typeface.
  • An ink print head that is suitable for the described printing process must therefore combine several (identical) elements that are able to eject ink drops at the time of need ("drop-on-demand" principle).
  • a characteristic feature of this technology is that in a capillary filled with recording liquid, for example ink, in the vicinity of its opening as a Heating element trained electrical resistance is located. If a certain thermal energy is supplied to this heating element by means of a short current pulse, extremely rapid heat transfer to the ink liquid (film boiling) first creates a rapidly expanding ink vapor bubble, which then disappears after the supply of energy ceases after the ink liquid has cooled collapses relatively quickly. The pressure wave generated by the vapor bubble inside the capillaries causes an ink jet of limited mass to emerge from the nozzle opening onto the surface of a nearby recording medium.
  • An advantage of this bubble jet principle is that by utilizing the phase change liquid-gaseous-liquid of the ink liquid, the relatively large and rapid volume change necessary for ink ejection is obtained from a very small active transducer area (typically 0.01 mm 2 ).
  • the small transducer areas when using modern manufacturing processes, such as high-precision photolithographic processes in layer technology, permit a relatively simple and inexpensive construction of ink print heads which are distinguished by a high density of traces and small dimensions.
  • the invention is therefore based on the object of specifying measures for an ink writing head of the type mentioned at the outset which allow as many functional elements of such a writing head as possible, such as heating surfaces, ink channels, outlet openings, ink supply and control connections, and the exact assignment of these functional elements in planar Process steps can be carried out simultaneously on a large number of print heads in use, and as few exact fits as possible must be observed when assembling the individual chips and as few mechanical post-treatments are necessary.
  • the inventive arrangement of nozzle, cavity and heating element presents an ink print head which is characterized by simple and therefore inexpensive production steps.
  • all the fine processing steps can take place in planar form and are combined on one element, and the size of the drops from the same nozzle can be varied in a simple manner and the ink supply can be coupled in a very simple manner.
  • FIG. 1 and FIG. 2 basic representations of write heads according to the prior art (edge-shooting principle FIG. 1, side-shooting principle FIG. 2),
  • FIG. 3 shows a schematic perspective view of the write head assembly according to the invention
  • FIG. 4 shows a section through the chip of such a write head according to line I-I in FIG. 3, and FIG. 5 shows an enlarged detail from FIG. 4.
  • FIGS. 1 and 2 the principles of droplet ejection according to the prior art are shown in a schematic representation, FIG. 1 being a so-called edge shooter
  • FIG. 1 shows a side shooter (side spray arrangement).
  • the two principles differ essentially in the position of the heating element in the ink capillary with respect to the outlet opening.
  • FIGS. 1 and 2 function elements having the same effect are provided with the same reference symbols.
  • An ink capillary 1 is fed with ink liquid 8 in the ink supply 7 marked with the arrow symbol.
  • a heating element 4 in the form of an electrical resistance is arranged in the ink capillary 1 on a substrate 3, for example made of glass.
  • the heating element 4 is arranged in the ink capillary 1 in such a way that the direction of propagation of the ink vapor bubble 5 is essentially 90 * offset from * the ejection device of the ink droplets 6 (edge shooter).
  • the ink capillary 1 is closed at the top with a cover plate 2.
  • the heating element 4 is located directly below the ejection opening, so that the main direction of expansion of the ink vapor bubble 5 coincides with the ejection direction of the ink droplets 6 and, geometrically speaking, form a line.
  • the direction of the ink supply 7 into the ink capillary 1 takes place laterally offset from the position of the outlet opening.
  • the cover plate 2 assumes the function of a nozzle plate, which is preferably glued on and in which the nozzle openings are embedded.
  • FIG. 3 shows a perspective view of the structure of the ink writing head according to the invention.
  • This consists essentially of only two parts to be connected to each other, namely a chip that contains both the heating elements, the electrical supply lines and the contact points for the electrical connection as well as the discharge openings (nozzles) and is attached and contacted as a conclusion on a storage vessel.
  • the heating elements (not shown in this basic diagram), the electrical feed lines, the contact points 9 and the outlet openings 10 can be produced in a single chip 11, for example made of silicon, by planar processing steps.
  • the storage vessel 12 has a cuboid shape, into which a medium soaked with ink liquid, for example a sponge 13, is introduced.
  • foams such as melamine-formaldehyde foam (MF) or similar foams can also be used as the ink reservoir.
  • filter openings 14 are provided in the form of two supply channels 15. These supply channels 15 run parallel to one another in the longitudinal direction of the supply vessel 12 in such a way that when the chip 11 is mounted they are in fluid communication with the outlet openings 10 via cavities 16 to be described in more detail.
  • the assembly of the chip 11 on the storage vessel 12 takes place in a simple manner, without precise parts and an expensive adjustment being necessary, by means of mounting clamps 17 arranged on the long sides of the storage vessel 12, which serve both the mechanical connection and the contact ⁇ make 9 the electrical contact.
  • FIG. 4 shows a section through the chip 11 according to the section line I-I in FIG. 3.
  • the geometrical configuration of a cavity 16 can be seen here, which has parallel walls and inclined outlet zones 18.
  • FIG. 5 represents an enlarged section of FIG. 4.
  • Doped silicon is used as substrate material 19.
  • the cavity structure 16 is formed tzen by anisotropic A ', preferably wherein monocrystalline silicon is used in the orientation (110) as the substrate and is carried out, the masking during etching by an elongate opening with parallel side edges, such that cavities 16 are formed with parallel walls, from ( III) planes and inclined outlet zones 18 arise. This enables such cavities to be closely lined up.
  • a thin carrier layer (membrane) 20 which is necessary in order to guarantee the heat conduction from the heating element 4 to the ink-filled cavity 16, is simultaneously formed by doping the silicon 19 in a thin layer before the etching the etching process is stopped when the doped region is reached.
  • the substrate 19 is provided with a cavitation protection layer 21.
  • the heating element 4 is encapsulated by an Si0 2 protective layer 22. Silicon nitrite can be used for the cavitation layer 21, which is deposited, for example, by gas phase deposition.
  • the heating elements 4 are arranged on the outlet side of the substrate 19 next to the outlet openings 10 above the cavities 16, while the cavities 16 themselves are formed by anisotropic etching from the rear.
  • a so-called etching stop is used to limit the cavity depth, so that the cavity 16 is closed off on the exit side by the carrier layer (membrane) 20.
  • the etching stop can be realized either by a suitably doped silicon layer with good heat conduction or by an insulator of a suitable silicon-on-insulator (SOI) system. Systems of dielectric layers adapted to silicon are also suitable for the etching stop with regard to voltage compensation and thermal expansion.
  • a plurality of heating elements 4 can be assigned to one ejection nozzle, which have different geometrical dimensions for improved droplet volume modulation and are arranged on different sides of the ejection opening 10.
  • the heating elements 4 By arranging the heating elements 4 to the side of the outlet opening 10, the direction of expansion of the vapor bubble 5 is opposite to the direction of ink ejection (back-shooter principle).
  • the heating elements 4 can also be structured in order to achieve a homogeneous temperature distribution on the silicon tongue underneath.
  • the ejection side of the chip 11 is provided with a surface layer 23 which is difficult to wet, in order to prevent the formation of disruptive ink lakes on the outside of the ink print head.
  • the coating takes place before the nozzle opening 10 is etched through, thereby preventing the penetration of the dewetting layer into the cavity structure 16, which is a problem with conventional print heads.
  • the number of required ejection openings (nozzles) 10 for high-resolution printers is 50 ... 100 and a nozzle 10 may be. assigned several heating elements 4. As a result, up to a few hundred supply lines are usually required.
  • the space required for the supply lines and the contact areas plays a major role.
  • the space required for the feed lines and contacting areas is approximately 96% of the total area of the chip 11.
  • the number of contacts required can be reduced to a value of 2 x Y n 1 , where n is the number of heating elements to be controlled.
  • the space requirement for the feed lines can be reduced.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Ink Jet (AREA)

Abstract

Dans une tête d'impression à jet d'encre (24) à structure en couches et fonctionnant selon le principe Bubble Jet, aussi bien les éléments chauffants (4) que les conducteurs d'amenée électriques et les points de contact, de même que les orifices d'éjection (10) sont produits avantageusement dans la même puce (11) par des étapes de traitement planaires (principe back-shooter). A cet effet, les éléments chauffants (4) et les orifices d'éjection (10) sont disposés de manière à être décalés latéralement les uns par rapport aux autres de telle sorte que le sens d'expansion de la bulle de vapeur (5) soit opposé au sens d'éjection de l'encre. Etant donné que dans une telle disposition, toutes les étapes de finissage se font avantageusement de manière planaire et sont réunies sur un seul élément, il en résulte une fabrication simple et d'un prix avantageux de telles têtes d'impression à jet d'encre (24).In an inkjet print head (24) having a layered structure and operating according to the Bubble Jet principle, both the heating elements (4) as well as the electrical supply conductors and the contact points, as well as the ejection orifices (10) are advantageously produced in the same chip (11) by planar processing steps (back-shooter principle). For this purpose, the heating elements (4) and the ejection orifices (10) are arranged so as to be laterally offset with respect to each other so that the direction of expansion of the vapor bubble (5) is opposite to the ink ejection direction. Since in such an arrangement all the finishing steps are advantageously carried out in a planar manner and are united on a single element, this results in simple and inexpensive manufacture of such inkjet printheads. (24).

Description

Tintenschreibkopf für eine nach* dem Thermalwandlerprinzip arbeitende Flüssigkeitsstrahlaufzeichnungsvorrichtung und Verfahren zu seiner Herstellung Ink writing head for a liquid jet recording device operating according to the thermal converter principle and method for its production
Die Erfindung betrifft einen Tintenschreibkopf für eine nach dem Thermalwandlerprinzip arbeitende Flüssigkeitsstrahl- aufzeichnungsvorrichtung sowie ein Verfahren zu seiner Her- Stellung gemäß den Merkmalen der Patentansprüche 1 und 11.The invention relates to an ink writing head for a liquid jet recording device operating according to the thermal transducer principle and to a method for its production in accordance with the features of patent claims 1 and 11.
Bekannte Aufzeichnungsköpfe, die nach dem Thermalwandler¬ prinzip (Bubble-Jet-Prinzip) arbeiten, weisen eine Vielzahl von Einzeldüsen auf, aus denen unter Einwirkung einer elektronischen Steuerung Einzeltröpfchen definierter Größe (im Bereich von 10 bis 200 μm Durchmesser) erzeugt und in einem definierten Muster in Richtung eines Aufzeichnungsträ¬ gers ausgestoßen werden.Known recording heads which operate according to the thermal converter principle (bubble jet principle) have a large number of individual nozzles from which individual droplets of a defined size (in the range from 10 to 200 μm diameter) are produced and in a defined one under the action of an electronic control Patterns are ejected in the direction of a recording medium.
Die zu druckenden Zeichen (z.B. Buchstaben oder grafische Muster) werden durch jeweils mehrere Tintentropfen erzeugt; die Muster für jedes Zeichen sind in einer sog. Matrix fest¬ gelegt.The characters to be printed (e.g. letters or graphic patterns) are generated by several drops of ink; the patterns for each character are defined in a so-called matrix.
Zweckmäßigerweise druckt man eine volle Spalte einer solchen Matrix gleichzeitig, um die Forderungen nach hoher Druckge¬ schwindigkeit und gleichmäßigem Schriftbild zu erfüllen.A full column of such a matrix is expediently printed at the same time in order to meet the requirements for high printing speed and a uniform typeface.
Ein Tintendruckkopf, der sich für das geschilderte Druckver- fahren eignet, muß also mehrere (gleiche) Elemente vereinigen, die in der Lage sind, Tintentropfen im Bedarfszeitpunkt aus¬ zustoßen ("Drop-on-Demand"-Prinzip). Charakteristisches Merkmal dieser Technologie ist, daß sich in einer mit Auf¬ zeichnungsflüssigkeit, beispielsweise Tinte gefüllten Kapillaren, und zwar in der Nähe ihrer Öffnung ein als Heizelement ausgebildeter elektrischer Widerstand befindet. Wird diesem Heizelement bei Bedarf mittels eines kurzen Stromimpulses eine bestimmte Wärmeenergie zugeführt, ent¬ steht durch äußerst schnelle Wärmeübertragung auf die Tin- tenflüssigkeit (Filmsieden) zuerst eine sich rasch expan¬ dierende Tintendampfblase, die dann nach Wegfall der Ener¬ giezuführung nach Abkühlung der Tintenflüssigkeit relativ schnell in sich zusammenfällt. Die durch die Dampfblase im Inneren der Kapillaren entstehende Druckwelle läßt einen Tintenstrahl begrenzter Masse aus der Düsenöffnung auf die Oberfläche eines nahen Aufzeichnungsträgers austreten.An ink print head that is suitable for the described printing process must therefore combine several (identical) elements that are able to eject ink drops at the time of need ("drop-on-demand" principle). A characteristic feature of this technology is that in a capillary filled with recording liquid, for example ink, in the vicinity of its opening as a Heating element trained electrical resistance is located. If a certain thermal energy is supplied to this heating element by means of a short current pulse, extremely rapid heat transfer to the ink liquid (film boiling) first creates a rapidly expanding ink vapor bubble, which then disappears after the supply of energy ceases after the ink liquid has cooled collapses relatively quickly. The pressure wave generated by the vapor bubble inside the capillaries causes an ink jet of limited mass to emerge from the nozzle opening onto the surface of a nearby recording medium.
Ein Vorteil dieses Bubble-Jet-Prinzips ist der, daß durch Ausnutzung des Phasenwechsels flüssig-gasförmig-flüssig der Tintenflüssigkeit die zum Tintenausstoß notwendige, relativ große und schnelle Volumenänderung aus einer sehr kleinen aktiven Wandlerfläche (typisch 0,01 mm2) gewonnen wird. Die kleinen Wandlerflächen wiederum erlauben bei Anwendung moderner Herstellungsverfahren, wie hochpräzise fotolitho- grafische Verfahren in Schichttechnik, einen relativ ein¬ fachen und kostengünstigen Aufbau von Tintendruckköpfen, die sich durch hohe Schreibspurendichte und geringe Abmessungen auszeichnen.An advantage of this bubble jet principle is that by utilizing the phase change liquid-gaseous-liquid of the ink liquid, the relatively large and rapid volume change necessary for ink ejection is obtained from a very small active transducer area (typically 0.01 mm 2 ). The small transducer areas, in turn, when using modern manufacturing processes, such as high-precision photolithographic processes in layer technology, permit a relatively simple and inexpensive construction of ink print heads which are distinguished by a high density of traces and small dimensions.
Aus der DE 30 12 698 AI ist hierzu eine Anordnung bekannt, die nach dem sog. "Side shooting"-Prinzip (Seitenspritzan- ordnung) arbeitet. Bei einer solchen Anordnung sind die Heizflächen und die dafür notwendigen elektrischen Leitungen sowie die Kontaktstellen auf einem Substrat vereinigt. Die Kanalstruktur und die Zuordnungen zu den Ausstoßöffnungen, den Düsen, entstehen durch passungsgenaues Aufkleben einer Düsenplatte auf das Substrat.From DE 30 12 698 AI an arrangement is known for this, which works according to the so-called "side shooting" principle (side spray arrangement). With such an arrangement, the heating surfaces and the necessary electrical lines and the contact points are combined on a substrate. The channel structure and the assignments to the discharge openings, the nozzles, are created by precisely fitting a nozzle plate onto the substrate.
Eine weitere Basiskonfiguration für eine nach dem Bubble- Jet-Prinzip arbeitende Einrichtung ist in der DE 32 28 887 AI beschrieben. Bei der auch unter der Bezeichnung "Edge- shooter" bekannten Anordnung (Randspritzanordnung) sind ebenfalls die Heizflächen, die elektrischen Leitungen und Kontaktstellen auf einem Chip vereinigt. Die Kanalstruktur kann noch im Nutzen als Photoresiststruktur aufgebracht wer¬ den. Die Ausstoßöffnungen werden erst durch Abdecken der Kanalstruktur mit einem Deckblättchen erzielt, das gemein¬ sam mit dem Substrat und der Kanalstruktur bei jedem Chip einzeln einer mechanischen Feinstbearbeitung unterzogen wer- den muß, um die notwendige Oberflächenqualität und Kanten¬ schärfe an der Ausstoßöffnung zu erreichen. Erst nach dieser Bearbeitung kann eine Beschichtung der Austrittsfläche mit einer schwer benetzbaren Oberflächenschicht erfolgen. Eine Variation der Tropfengröße ist nur in begrenztem Maße durch Variation der Strukturimpulse an einem Heizelement möglich.Another basic configuration for a device operating on the bubble jet principle is in DE 32 28 887 AI described. In the arrangement also known under the name "edge shooter" (edge spray arrangement), the heating surfaces, the electrical lines and contact points are also combined on one chip. The channel structure can still be used as a photoresist structure. The ejection openings are only achieved by covering the channel structure with a cover sheet which, together with the substrate and the channel structure, has to be subjected to mechanical fine machining on each chip individually in order to achieve the necessary surface quality and edge sharpness at the ejection opening. Only after this processing can the exit surface be coated with a surface layer that is difficult to wet. The drop size can only be varied to a limited extent by varying the structural impulses on a heating element.
Der Erfindung liegt deshalb die Aufgabe zugrunde, für einen Tintenschreibkopf der eingangs genannten Art Maßnahmen anzu¬ geben, die es erlauben, daß möglichst viele Funktionselemente eines solchen Schreibkopfes, wie Heizflächen, Tintenkanäle, Austrittsöffnungen, Tintenzufuhr und Ansteueranschlüsse und die genaue Zuordnung dieser Funktionselemente in planaren Prozeßschritten an einer Vielzahl von Schreibköpfen im Nutzen gleichzeitig erfolgen kann und bei der Montage der einzelnen Chips möglichst wenig genaue Passungen einzuhalten und möglichst wenig mechanische Nachbehandlungen nötig sind.The invention is therefore based on the object of specifying measures for an ink writing head of the type mentioned at the outset which allow as many functional elements of such a writing head as possible, such as heating surfaces, ink channels, outlet openings, ink supply and control connections, and the exact assignment of these functional elements in planar Process steps can be carried out simultaneously on a large number of print heads in use, and as few exact fits as possible must be observed when assembling the individual chips and as few mechanical post-treatments are necessary.
Darüber hinaus soll die Größe der Tropfen, die aus ein und derselben Ausstoßöffnung ausgestoßen werden, mit einfachen Mitteln variiert werden können.In addition, it should be possible to vary the size of the drops which are ejected from one and the same ejection opening with simple means.
Diese Aufgabe wird gemäß den Merkmalen der Patentansprüche 1 und 11 gelöst. Vorteilhafte Ausgestaltungen sind in den Unteransprüchen angegeben. Durch die erfindungsgemäße Anordnung von Düse, Hohlraum und Heizelement wird ein Tintendruckkopf vorgestellt, der sich durch einfache und damit kostengünstige Herstellungsschritte auszeichnet. Insbesondere können sämtliche Feinbearbeitungs- schritte planar im Nutzen erfolgen und sind auf einem Ele¬ ment vereint, sowie die Größe der Tropfen aus der gleichen Düse kann auf einfache Weise variiert und die Tintenzufuhr kann auf sehr einfache Weise angekoppelt werden.This object is achieved according to the features of claims 1 and 11. Advantageous refinements are specified in the subclaims. The inventive arrangement of nozzle, cavity and heating element presents an ink print head which is characterized by simple and therefore inexpensive production steps. In particular, all the fine processing steps can take place in planar form and are combined on one element, and the size of the drops from the same nozzle can be varied in a simple manner and the ink supply can be coupled in a very simple manner.
Die Erfindung wird im folgenden anhand eines Ausführungsbei¬ spiels erläutert, wozu auf die Darstellungen verwiesen wird.The invention is explained below on the basis of an exemplary embodiment, for which reference is made to the illustrations.
Dort zeigenShow there
Figur 1 und Figur 2 Prinzipdarstellungen von Schreibköpfen nach dem Stand der Technik (Edge-shooting-Prinzip Figur 1, Side-shooting-Prinzip Figur 2),1 and FIG. 2 basic representations of write heads according to the prior art (edge-shooting principle FIG. 1, side-shooting principle FIG. 2),
Figur 3 in schematischer Weise eine perspektivische Ansicht des erfindungsgemäßen Schreibkopfaufbaus,FIG. 3 shows a schematic perspective view of the write head assembly according to the invention,
Figur 4 einen Schnitt durch den Chip eines solchen Schreib¬ kopfes gemäß der Linie I-I in Figur 3 und Figur 5 einen vergrößerten Ausschnitt von Figur 4.FIG. 4 shows a section through the chip of such a write head according to line I-I in FIG. 3, and FIG. 5 shows an enlarged detail from FIG. 4.
In den Figuren 1 und 2 sind in schematischer Darstellung die Prinzipien des Tröpfchenausstoßes gemäß dem Stand der Technik gezeigt, wobei in Figur 1 ein sog. Edge-shooterIn FIGS. 1 and 2, the principles of droplet ejection according to the prior art are shown in a schematic representation, FIG. 1 being a so-called edge shooter
(Randspritzanordnung) und Figur 2 ein Side-shooter (Seiten- spritzanordnung) dargestellt ist. Die beiden Prinzipien unterscheiden sich im wesentlichen durch die Lage des Heizelementes in der Tintenkapillare bezüglich der Aus- trittsöffnung. In den Figuren 1 und 2 sind gleichwirkende Funktionselemente mit gleichen Bezugszeichen versehen. Eine Tintenkapillare 1 wird in der mit dem Pfeilsymbol gekenn¬ zeichneten Tintenzufuhr 7 mit Tintenflüssigkeit 8 gespeist. Auf einem Substrat 3 z.B. aus Glas ist in der Tintenkapillare l ein Heizelement 4 in Form eines elektrischen Widerstandes angeordnet. Bei der Konfiguration nach Figur 1 ist das Heizelement 4 in der Tintenkapillare 1 derart angeordnet, daß die Ausbreitungsrichtung der Tintendampfblase 5 im wesentlichen um 90* versetzt zu* der Ausstoßvorrichtung der Tintentröpfchen 6 liegt (Edge-shooter) . Die Tintenkapillare 1 ist nach oben mit einer Deckplatte 2 abgeschlossen.(Edge spray arrangement) and FIG. 2 shows a side shooter (side spray arrangement). The two principles differ essentially in the position of the heating element in the ink capillary with respect to the outlet opening. In FIGS. 1 and 2, function elements having the same effect are provided with the same reference symbols. An ink capillary 1 is fed with ink liquid 8 in the ink supply 7 marked with the arrow symbol. A heating element 4 in the form of an electrical resistance is arranged in the ink capillary 1 on a substrate 3, for example made of glass. In the configuration according to FIG. 1, this is The heating element 4 is arranged in the ink capillary 1 in such a way that the direction of propagation of the ink vapor bubble 5 is essentially 90 * offset from * the ejection device of the ink droplets 6 (edge shooter). The ink capillary 1 is closed at the top with a cover plate 2.
Bei einer sog. Seitenspritzanordnung (Side-shooter) gemäß Figur 2 liegt das Heizelement 4 unmittelbar unter der Aus¬ stoßöffnung, so daß die Hauptausbreitungsrichtung der Tin¬ tendampfblase 5 mit der Ausstoßrichtung der Tintentrδpfchen 6 zusammenfällt und geometrisch gesehen eine Linie bilden. Die Richtung der Tintenzufuhr 7 in die Tintenkapillare 1 erfolgt hierbei seitlich versetzt zu der Lage der Austrittsöffnung. Die Deckplatte 2 übernimmt hierbei die Funktion einer Düsen¬ platte, die vorzugsweise aufgeklebt ist und in der die Düsen- Öffnungen eingelassen sind.In a so-called side-shooter arrangement according to FIG. 2, the heating element 4 is located directly below the ejection opening, so that the main direction of expansion of the ink vapor bubble 5 coincides with the ejection direction of the ink droplets 6 and, geometrically speaking, form a line. The direction of the ink supply 7 into the ink capillary 1 takes place laterally offset from the position of the outlet opening. The cover plate 2 assumes the function of a nozzle plate, which is preferably glued on and in which the nozzle openings are embedded.
Die Figur 3 zeigt in perspektivischer Darstellung den Aufbau des Tintenschreibkopfes gemäß der Erfindung. Dieser besteht im wesentlichen nur aus zwei miteinander zu verbindenden Teilen, nämlich einem Chip, der sowohl die Heizelemente, die elektrischen Zuleitungen und die Kontaktstellen für den elektrischen Anschluß als auch die Ausstoßöffnungen (Düsen) beinhaltet und als Abschluß auf ein Vorratsgefäß befestigt und kontaktiert wird. Die in diesem Prinzipbild nicht dar- gestellten Heizelemente, die elektrischen Zuleitungen, die Kontaktstellen 9 und die Auslaßöffnungen 10 können dabei in einem einzigen, beispielsweise aus Silizium bestehenden Chip 11 im Nutzen durch planare Bearbeitungsschritte erzeugt werden.FIG. 3 shows a perspective view of the structure of the ink writing head according to the invention. This consists essentially of only two parts to be connected to each other, namely a chip that contains both the heating elements, the electrical supply lines and the contact points for the electrical connection as well as the discharge openings (nozzles) and is attached and contacted as a conclusion on a storage vessel. The heating elements (not shown in this basic diagram), the electrical feed lines, the contact points 9 and the outlet openings 10 can be produced in a single chip 11, for example made of silicon, by planar processing steps.
Das Vorratsgefäß 12 weist eine quaderför ige Gestalt auf, in das ein mit Tintenflüssigkeit getränktes Medium, z.B. ein Schwamm 13 eingebracht ist. Als Tintenspeicher können aber auch Schäume, wie Melamin-Formaldehyd-Schaum (MF) oder ähn- liehe Schaumstoffe Verwendung finden. An der, dem Chip zugewandten Oberseite des Vorratsgefäßes 12 sind mit Filtern 14 versehene Auslaßöffnungen in Form von zwei Versorgungskanälen 15 vorgesehen. Diese Versor¬ gungskanäle 15 verlaufen parallel zueinander in Längsrich- tung des Versorgungsgefäßes 12 derart, daß sie bei montiertem Chip 11 über noch näher zu beschreibende Hohlräume 16 in Flie߬ verbindung mit den Austrittsöffnungen 10 stehen. Die Mon¬ tage des Chips 11 auf das Vorratsgefäß 12 geschieht auf einfache Weise, ohne daß passungsgenaue Teile und eine auf- wendige Justage notwendig werden, durch an den Längsseiten des Vorratsgefäßes 12 angeordnete Montageklammern 17, die sowohl die mechanische Verbindung als auch über die Kontakt¬ stellen 9 die elektrische Kontaktierung übernehmen.The storage vessel 12 has a cuboid shape, into which a medium soaked with ink liquid, for example a sponge 13, is introduced. However, foams such as melamine-formaldehyde foam (MF) or similar foams can also be used as the ink reservoir. On the upper side of the storage vessel 12 facing the chip, filter openings 14 are provided in the form of two supply channels 15. These supply channels 15 run parallel to one another in the longitudinal direction of the supply vessel 12 in such a way that when the chip 11 is mounted they are in fluid communication with the outlet openings 10 via cavities 16 to be described in more detail. The assembly of the chip 11 on the storage vessel 12 takes place in a simple manner, without precise parts and an expensive adjustment being necessary, by means of mounting clamps 17 arranged on the long sides of the storage vessel 12, which serve both the mechanical connection and the contact ¬ make 9 the electrical contact.
Die Figur 4 stellt einen Schnitt durch den Chip 11 gemäß der Schnittlinie I-I in Figur 3 dar. Insbesondere ist hier die geometrische Ausgestaltung eines Hohlraumes 16 zu erkennen, der parallele Wände und schräge Auslaufzonen 18 aufweist. Die Herstellung dieser Hohlräume 18 sowie der detaillierte Aufbau des Chip 11 wird nun anhand der Figur 5 erläutert, die einen vergrößerten Ausschnitt der Figur 4 darstellt.FIG. 4 shows a section through the chip 11 according to the section line I-I in FIG. 3. In particular, the geometrical configuration of a cavity 16 can be seen here, which has parallel walls and inclined outlet zones 18. The production of these cavities 18 and the detailed structure of the chip 11 will now be explained with reference to FIG. 5, which represents an enlarged section of FIG. 4.
Als Substratmaterial 19 wird dotiertes Silizium verwendet. Die Hohlraumstruktur 16 wird durch anisotropes A'tzen gebildet, wobei als Substrat vorzugsweise monokristallines Silizium in die Orientierung (110) benutzt wird und die Maskierung beim Ätzen durch eine langgestreckte Öffnung mit parallelen Seitenkanten erfolgt, so daß Hohlräume 16 mit parallelen Wänden, gebildet aus (lll)-Ebenen und schräge Auslaufzonen 18 entstehen. Dadurch wird eine enge Aneinanderreihung von solchen Hohlräumen ermöglicht. In diesem Ätzvorgang wird gleichzeitig eine dünne Trägerschicht (Membran) 20, die er¬ forderlich ist, um die Wärmeleitung vom Heizelement 4 zum tintengefüllten Hohlraum 16 zu garantieren, ausgebildet, in- dem das Silizium 19 vor dem Ätzen dünnschichtig so dotiert wird, daß der Ätzvorgang beim Erreichen des dotierten Bereichs gestoppt wird.Doped silicon is used as substrate material 19. The cavity structure 16 is formed tzen by anisotropic A ', preferably wherein monocrystalline silicon is used in the orientation (110) as the substrate and is carried out, the masking during etching by an elongate opening with parallel side edges, such that cavities 16 are formed with parallel walls, from ( III) planes and inclined outlet zones 18 arise. This enables such cavities to be closely lined up. In this etching process, a thin carrier layer (membrane) 20, which is necessary in order to guarantee the heat conduction from the heating element 4 to the ink-filled cavity 16, is simultaneously formed by doping the silicon 19 in a thin layer before the etching the etching process is stopped when the doped region is reached.
Zum Schutz des Siliziums vor chemischen Einflüssen der Tintenflüssigkeit und vor Kavitationsschäden durch den Ver¬ dampfungsvorgang ist das Substrat 19 mit einer Kavitations¬ schutzschicht 21 versehen. Das Heizelement 4 ist durch eine Si02-Schutzschicht 22 gekapselt. Für die Kavitationsschicht 21 kann Siliziumnitrit verwendet werden, das z.B. durch Gas- phasenabscheidung abgeschieden wird.To protect the silicon against chemical influences of the ink liquid and against cavitation damage caused by the evaporation process, the substrate 19 is provided with a cavitation protection layer 21. The heating element 4 is encapsulated by an Si0 2 protective layer 22. Silicon nitrite can be used for the cavitation layer 21, which is deposited, for example, by gas phase deposition.
Die Heizelemente 4 sind auf der Austrittsseite des Substrats 19 neben den Austrittsöffnungen 10 über den Hohlräumen 16 angeordnet, während die Hohlräume 16 selbst durch anisotropes Ätzen von der Rückseite ausgebildet werden. Zur Begrenzung der Hohlraumtiefe wird ein sog. Ätzstop eingesetzt, so daß der Hohlraum 16 zur Austrittsseite hin durch die Träger¬ schicht (Membran) 20 abgeschlossen ist. Der Ätzstop kann dabei entweder durch eine geeignet dotierte Siliziumschicht mit guter Wärmeleitung oder durch einen Isolator eines geeig¬ neten Silicon-On-Insulator (SOI) System realisiert sein. Auch eignet sich bezüglich Spannungskompensation und Wärme¬ ausdehnung an Silizium angepaßte Systeme aus dielektrischen Schichten für den Ätzstop. Ferner können einer Ausstoßdüse io mehrere Heizelemente 4 zugeordnet sein, die zur verbesser¬ ten Tropfenvolumen-Modulation unterschiedliche geometri¬ sche Ausmaße aufweisen und an verschiedenen Seiten der Ausstoßöffnung 10 angeordnet sind. Durch die Anordnung der Heizelemente 4 seitlich der Austrittsöffnung 10 ist die Ausbreitungsrichtung der Dampfblase 5 entgegengesetzt der Tintenausstoßrichtung (Back-shooter-Prinzip) . Es liegt auch im Rahmen der Erfindung, mehrere Einheiten aus Ausstoßöff¬ nungen 10 und Heizelementen 4 auf einem Chip 11 unterzu¬ bringen, z.B. mehrere versetzte Reihen von Düsenöffnungen für Tintenflüssigkeit einer Farbe oder Düsenreihen für ver- schieden eingefärbte Tintenflüssigkeiten. Die Heizelemente 4 können gemäß einer Weiterbildung auch strukturiert sein, um eine homogene Temperaturverteilung auf der darunterliegenden Siliziumzunge zu erreichen.The heating elements 4 are arranged on the outlet side of the substrate 19 next to the outlet openings 10 above the cavities 16, while the cavities 16 themselves are formed by anisotropic etching from the rear. A so-called etching stop is used to limit the cavity depth, so that the cavity 16 is closed off on the exit side by the carrier layer (membrane) 20. The etching stop can be realized either by a suitably doped silicon layer with good heat conduction or by an insulator of a suitable silicon-on-insulator (SOI) system. Systems of dielectric layers adapted to silicon are also suitable for the etching stop with regard to voltage compensation and thermal expansion. Furthermore, a plurality of heating elements 4 can be assigned to one ejection nozzle, which have different geometrical dimensions for improved droplet volume modulation and are arranged on different sides of the ejection opening 10. By arranging the heating elements 4 to the side of the outlet opening 10, the direction of expansion of the vapor bubble 5 is opposite to the direction of ink ejection (back-shooter principle). It is also within the scope of the invention to accommodate a plurality of units comprising ejection openings 10 and heating elements 4 on a chip 11, for example a plurality of staggered rows of nozzle openings for ink liquid of one color or rows of nozzles for different separated colored ink liquids. According to a further development, the heating elements 4 can also be structured in order to achieve a homogeneous temperature distribution on the silicon tongue underneath.
Die Ausstoßseite des Chips 11 ist mit einer schwer benetz¬ baren Oberflächenschicht 23 versehen, um der Bildung von störenden Tintenseen auf der Außenseite des Tintendruck¬ kopfes vorzubeugen. Die Beschichtung erfolgt noch vor der Durchätzung der Düsenöffnung 10, wodurch dem Eindringen der Entnetzungsschicht in die Hohlraumstruktur 16, das bei her¬ kömmlichen Druckköpfen ein Problem darstellt, vorgebeugt wird.The ejection side of the chip 11 is provided with a surface layer 23 which is difficult to wet, in order to prevent the formation of disruptive ink lakes on the outside of the ink print head. The coating takes place before the nozzle opening 10 is etched through, thereby preventing the penetration of the dewetting layer into the cavity structure 16, which is a problem with conventional print heads.
Die Anzahl der benötigten Ausstoßöffnungen (Düsen) 10 bei hochauflösenden Druckern beträgt 50...100 und einer Düse 10 sind u.U. mehrere Heizelemente 4 zugeordnet. Dadurch sind in der Regel bis zu einige Hundert Zuleitungen erforderlich.The number of required ejection openings (nozzles) 10 for high-resolution printers is 50 ... 100 and a nozzle 10 may be. assigned several heating elements 4. As a result, up to a few hundred supply lines are usually required.
Neben dem Aufwand für die elektrische Kontaktierung spielt der Platzbedarf für die Zuleitungen und die Kontaktflächen eine große Rolle. So beträgt beispielsweise bei einem hoch¬ auflösenden Druckkopf mit 50 Düsen der Platzbedarf für die Zuleitungen und Kontaktierungsflächen ca. 96 % der Gesamt- fläche des Chip 11. Durch eine auf dem Substrat integrierte, an sich bekannte Diodenschaltung (Koinzidenzschaltung) gemäß einer Weiterbildung der Erfindung läßt sich die Anzahl der erforderlichen Kontakte auf einen Wert von 2 x Y n1 reduzieren, wobei n gleich die Anzahl der anzusteuernden Heizelemente ist. Gleichzeitig läßt sich der Platzbedarf für die Zulei¬ tungen senken.In addition to the effort for the electrical contacting, the space required for the supply lines and the contact areas plays a major role. For example, in the case of a high-resolution printhead with 50 nozzles, the space required for the feed lines and contacting areas is approximately 96% of the total area of the chip 11. By means of a diode circuit (coincidence circuit) known per se, integrated on the substrate, according to a development of the invention the number of contacts required can be reduced to a value of 2 x Y n 1 , where n is the number of heating elements to be controlled. At the same time, the space requirement for the feed lines can be reduced.
Eine noch drastischere Reduzierung der elektrischen Kontakte und des Platzbedarfes bis auf zwei Versorgungs- und zwei oder drei Signalleitungen läßt sich erreichen, wenn auf dem Substrat Endverstärker und Elemente der Signalverarbeitung wie Serien-Parallel-Umsetzer und/oder ein Zeichengenerator integriert wird. An even more drastic reduction of the electrical contacts and the space requirement down to two supply lines and two or three signal lines can be achieved if power amplifiers and signal processing elements are on the substrate how series-parallel converter and / or a character generator is integrated.

Claims

Patentansprüche Claims
1. Tintenschreibkopf (24) für eine nach dem Thermalwandler¬ prinzip arbeitende Tintendruckeinrichtung mit einer Mehrzahl von Austrittsöffnungen (10), denen jeweils mindestens ein individuell ansteuerbares elektrothermisches Wandlerelement (4) zugeordnet ist, wobei im Druckbetrieb diese Wandlerele¬ mente (4) eine Tintenflüssigkeit lokal erhitzen und durch eine dabei entstehende Tintenda pfblase (5) Tintenflüssig- keit aus den Austrittsdüsen (10) ausgestoßen wird, mit einem Tintenflüssigkeit (8) speichernden Vorratsgefäß (12), daß über Versorgungsleitungen (15) mit den Ausstoßöffnungen (10) in Fließverbindung steht, d a d u r c h g e k e n n z e i c h n e t , daß die Heizelemente (4) in Ausstoßrichtung der Tintentropfen (6) gesehen seitlich versetzt zu den Ausstoßöffnungen (10) derart angeordnet sind, daß die Ausbreitungsrichtung der Tintendampfblase (5) der Tintenausstoßrichtung entgegengesetzt ist.1. Ink writing head (24) for an ink printing device working according to the thermal converter principle with a plurality of outlet openings (10), each of which is assigned at least one individually controllable electrothermal converter element (4), these converter elements (4) being an ink liquid in printing operation Heat locally and eject an ink liquid from the outlet nozzles (10) through a resulting ink bubble (5) with a storage vessel (12) that stores ink liquid (8) and that flows via supply lines (15) with the ejection openings (10) stands, characterized in that the heating elements (4), viewed in the direction of ejection of the ink drops (6), are arranged laterally offset from the ejection openings (10) in such a way that the direction of propagation of the ink vapor bubble (5) is opposite to the direction of ejection of the ink.
2. Schreibkopf nach Patentanspruch 1, d a d u r c h g e k e n n z e i c h n e t , daß die einer Ausstoßöffnung (10) zugeordneten Wandlerelemente (4) zur verbesserten Tropfenvolumen-Modulation unterschiedliche geometrische Abmessungen aufweisen.2. Writing head according to claim 1, so that the transducer elements (4) assigned to an ejection opening (10) have different geometrical dimensions for improved droplet volume modulation.
3. Schreibkopf nach Patentanspruch 1 oder 2, d a d u r c h g e k e n n z e i c h n e t , daß die Wand¬ lerelemente (4) an verschiedenen Seiten der Ausstoßöffnung (10) angeordnet sind.3. Writing head according to claim 1 or 2, so that the converter elements (4) are arranged on different sides of the discharge opening (10).
4. Schreibkopf nach Patentanspruch 1, d a d u r c h g e k e n n z e i c h n e t , daß mehrere Einheiten, bestehend aus Ausstoßöffnung (10) und Wandlerelementen (4) auf einem Chip (11) in mehreren zueinander versetzten Reihen für Austrittsöffnungen (10) einer Farbe und/oder Düsenreihen für verschiedenfarbige Tintenflüssigkeiten angeordnet sind. 4. write head according to claim 1, characterized in that several units, consisting of ejection opening (10) and transducer elements (4) on a chip (11) arranged in several mutually offset rows for outlet openings (10) of one color and / or rows of nozzles for differently colored ink liquids are.
5. Schreibkopf nach Patentanspruch 1, d a d u r c h g e k e n n z e i c h n e t , daß in den elektrischen Zu¬ leitungen für die Wandlerelemente (4) Dioden einer Koinzidenz-schaltung zur Reduzierung der erforderlichen elektrischen Kontakte angeordnet sind.5. write head according to claim 1, so that the diodes of a coincidence circuit are arranged in the electrical feed lines for the converter elements (4) to reduce the required electrical contacts.
6. Schreibkopf nach Patentanspruch 1, d a d u r c h g e k e n n z e i c h n e t , daß auf dem Chip Endverstärker und Elemente der Signalverarbeitung, insbesondere Serien- parallelumsetzer, Zeichengenerator und/oder Rastergenerator monolithisch integriert sind, wodurch die Anzahl der nach außen erforderlichen Kontakte reduziert wird.6. write head according to claim 1, d a d u r c h g e k e n n z e i c h n t that on the chip power amplifier and elements of signal processing, in particular serial parallel converter, character generator and / or raster generator are monolithically integrated, whereby the number of contacts required to the outside is reduced.
7. Schreibkopf nach Patentanspruch 1 bis 3, d a d u r c h g e k e n n z e i c h n e t , daß die Wandlerelemente (4) auf der Austrittsseite des als Grundmaterial für den Chip (11) dienenden Substrats (3) neben den Austrittsöffnungen (10) über Hohlräumen (16) angeordnet sind.7. write head according to claims 1 to 3, so that the transducer elements (4) on the outlet side of the substrate (3) serving as base material for the chip (11) are arranged next to the outlet openings (10) via cavities (16).
β. Schreibkopf nach Patentanspruch 1, d a d u r c h g e k e n n z e i c h n e t , daß die Wandlerelemente (4) zur Erreichung einer homogenen Temperaturverteilung auf dem darunterliegenden Siliziummaterial strukturiert sind.β. Write head according to claim 1, so that the transducer elements (4) are structured to achieve a homogeneous temperature distribution on the underlying silicon material in order to achieve a homogeneous temperature distribution.
9. Schreibkopf nach Patentanspruch 1, d a d u r c h g e k e n n z e i c h n e t , daß die Wandlerelemente (4) auf der Hohlraumseite mit einer Kavitationsschutzschicht (21) abgedeckt sind.9. write head according to claim 1, so that the converter elements (4) are covered on the cavity side with a cavitation protection layer (21).
ιo. Schreibkopf nach Patentanspruch 9, d a d u r c h g e k e n n z e i c h n e t , daß die Kavitationsschutz¬ schicht (21) aus Siliziumnitrit besteht, die durch Nieder- druck-Gasphasenabscheidung abgeschieden wird. ιo. Writing head according to claim 9, characterized in that the Kavitationsschutz¬ layer (21) consists of silicon nitride, which is deposited by low-pressure gas phase deposition.
11. Verfahren zur Herstellung eines nach dem Thermalwandler¬ prinzip arbeitenden Tintenschreibkopfes (24) mit einer Mehrzahl von Austrittsöffnungen (10) , denen jeweils mindestens ein individuell angesteuerbares elektrothermi- sches Wandlerelement zugeordnet ist, einem Tintenflüssigkeit (8) speichernden Vorratsgefäß (12), das über Versorgungs¬ leitungen (15) mit den Ausstoßöffnungen (10) in Fließverbin¬ dung bringbar ist, d a d u r c h g e k e n n z e i c h n e t , daß sowohl die elektrothermi- sehen Wandlerelemente (4), die elektrischen Zuleitungen für die Wandlerelemente (4) und deren Kontaktstellen (9), als auch die Auslaßöffnungen (10) im gleichen Chip (11) auf einem Substrat (3) im Nutzen durch planare Bearbeitungs¬ schritte erzeugt werden.11. A method for producing an ink writing head (24) working according to the thermal converter principle with a plurality of outlet openings (10), each of which is assigned at least one individually controllable electrothermal transducer element, a storage vessel (12) storing ink liquid (8) Can be brought into flow connection via supply lines (15) with the discharge openings (10), characterized in that both the electrothermal transducer elements (4), the electrical feed lines for the transducer elements (4) and their contact points (9), as the outlet openings (10) are also produced in the same chip (11) on a substrate (3) in use by planar processing steps.
12. Verfahren nach Patentanspruch 11, d a d u r c h g e k e n n z e i c h n e t , daß die elektrother ischen Wandlerelemente (4) auf der den Austrittsöffnungen (10) zugewandten Austrittsseite des Substrats (3) seitlich neben den Austrittsöffnungen (10) oberhalb Hohlräumen (16) erzeugt werden.12. The method according to claim 11, so that the electrothermal transducer elements (4) are produced on the outlet side of the substrate (3) facing the outlet openings (10) laterally next to the outlet openings (10) above cavities (16).
13. Verfahren nach Patentanspruch 12, d a d u r c h g e k e n n z e i c h n e t , daß die Hohlräume (16) durch anisotropes Ätzen erzeugt werden.13. The method according to claim 12, d a d u r c h g e k e n n z e i c h n e t that the cavities (16) are generated by anisotropic etching.
14. Verfahren nach Patentanspruch 11, d a d u r c h g e k e n n z e i c h n e t , daß als Substrat (3) mono¬ kristallines Silizium in der Orientierung (110) benutzt wird und die Maskierung durch eine langgestreckte Öffnung mit parallelen Seitenkanten erfolgt, so daß Hohlräume mit parallelen Wänden, gebildet aus (111) Ebenen und schrägen Auslaufzonen (18) entstehen. 14. The method according to claim 11, characterized in that mono¬ crystalline silicon is used as the substrate (3) in the orientation (110) and the masking takes place through an elongated opening with parallel side edges, so that cavities with parallel walls, formed from (111 ) Levels and inclined outlet zones (18) arise.
15. Verfahren nach Patentanspruch 13 oder 14, d a d u r c h g e k e n n z e i c h n e t , daß zur Begrenzung der Hohl¬ raumtiefe ein Ätzstop eingesetzt wird, so daß der Hohlraum (16) zur Austrittsseite hin durch eine Membran (20) abge- schlössen wird.15. The method according to claim 13 or 14, so that an etching stop is used to limit the cavity depth, so that the cavity (16) is closed off towards the outlet side by a membrane (20) to limit the cavity depth.
16. Verfahren nach Patentanspruch 15, d a d u r c h g e k e n n z e i c h n e t , daß der Ätzstop durch eine geeignet dotierte Siliziumschicht mit guter Wärmeleitung gebildet wird.16. The method according to claim 15, so that the etching stop is formed by a suitably doped silicon layer with good heat conduction.
17. Verfahren nach Patentanspruch 15, d a d u r c h g e k e n n z e i c h n e t , daß als Ätzstop der Isolator eines geeigneten Silicon-On-Insulator (SOI)-Systems eingesetzt wird.17. The method according to claim 15, so that the insulator of a suitable silicon-on-insulator (SOI) system is used as the etching stop.
18. Verfahren nach Patentanspruch 15, d a d u r c h g e k e n n z e i c h n e t , daß als Ätzstop bezüglich Spannungskompensation und Wärmeausdehnung an Silizium ange- paßte Systeme aus dielektrischen Schichten verwendet werden.18. The method according to claim 15, so that systems adapted from silicon layers are used as the etching stop with regard to voltage compensation and thermal expansion.
19. Verfahren nach Patentanspruch 15 bis 18, d a d u r c h g e k e n n z e i c h n e t , daß die durch den Ätzstop definierte Trägerschicht (Membran) (20) der elektrothermi- sehen Wandlerelemente (4) auf der Hohlraumseite (16) mit einer Kavitationsschutzschicht (21) belegt ist.19. The method according to claim 15 to 18, so that the support layer (membrane) (20) of the electrothermal transducer elements (4) defined on the cavity side (16) is covered with a cavitation protection layer (21).
20. Verfahren nach Patentanspruch 19, d a d u r c h g e k e n n z e i c h n e t , daß als Kavitationsschicht Siliziumnitrit verwendet wird, das durch Niederdruck-Gas- phasenabscheidung abgeschieden wird.20. The method according to claim 19, d a d u r c h g e k e n e z e i c h n e t that silicon nitrite is used as the cavitation layer, which is deposited by low-pressure gas phase deposition.
21. Verfahren nach Patentanspruch 11 bis 13, d a d u r c h g e k e n n z e i c h n e t, daß die Austrittsöffnungen (10) von der Austrittsseite des Chips (11) aus geätzt werden. 21. The method according to claim 11 to 13, characterized in that the outlet openings (10) from the outlet side of the chip (11) are etched.
22. Verfahren nach Patentanspruch 14, d a d u r c h g e k e n n z e i c h n e t , daß die Beschichtung bzw. die Oberflächenbehandlung der Austrittsseite des Substrats (3) mit einer schwer benetzbaren Oberflächenschicht (23) bereits vor dem Anätzen der Austrittsöffnungen (10) erfolgt. 22. The method according to claim 14, so that the coating or the surface treatment of the exit side of the substrate (3) with a difficult-to-wet surface layer (23) takes place before the etching of the exit openings (10).
EP91907859A 1990-05-21 1991-04-26 Ink-jet printing head for a liquid-jet printing device operating on the heat converter principle and process for making it Expired - Lifetime EP0530209B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4016356 1990-05-21
DE4016356 1990-05-21
PCT/DE1991/000364 WO1991017891A1 (en) 1990-05-21 1991-04-26 Ink-jet printing head for a liquid-jet printing device operating on the heat converter principle and process for making it

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EP0530209A1 true EP0530209A1 (en) 1993-03-10
EP0530209B1 EP0530209B1 (en) 1994-12-07

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US (1) US5760804A (en)
EP (1) EP0530209B1 (en)
JP (1) JPH05508815A (en)
DE (1) DE59103819D1 (en)
WO (1) WO1991017891A1 (en)

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US5760804A (en) 1998-06-02
EP0530209B1 (en) 1994-12-07
JPH05508815A (en) 1993-12-09
WO1991017891A1 (en) 1991-11-28
DE59103819D1 (en) 1995-01-19

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