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EP0367303A1 - Thermischer Tintenstrahldruckkopf - Google Patents

Thermischer Tintenstrahldruckkopf Download PDF

Info

Publication number
EP0367303A1
EP0367303A1 EP89123606A EP89123606A EP0367303A1 EP 0367303 A1 EP0367303 A1 EP 0367303A1 EP 89123606 A EP89123606 A EP 89123606A EP 89123606 A EP89123606 A EP 89123606A EP 0367303 A1 EP0367303 A1 EP 0367303A1
Authority
EP
European Patent Office
Prior art keywords
opening
layer
nozzle
barrier layer
orifice
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP89123606A
Other languages
English (en)
French (fr)
Inventor
Alfred I. Tsung Pan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of EP0367303A1 publication Critical patent/EP0367303A1/de
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B41J2/1412—Shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B41J2/14129—Layer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14145—Structure of the manifold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/03—Specific materials used
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/11—Embodiments of or processes related to ink-jet heads characterised by specific geometrical characteristics

Definitions

  • This invention concerns thermal ink jet (TIJ) printheads, and to methods for their manufacture.
  • TIJ thermal ink jet
  • TIJ printheads employ a liquid ink in a reservoir or well, the ink being fed via passages to a series of nozzles defined by a nozzle plate. Within each nozzle is a resistive heater which is independently energizable to evaporate the ink which emerges from the nozzle under pressure.
  • Difficulties which arise with known printheads include detachment or misalignment of the nozzle plate which has been glued in place after formation of the heater and the structure of the well and passages; restricted ink flow through the passages, thus slowing the rate of printing; and unrealiability due to destruction of the resistive heater by the flow of ink and the cavitation forces of the expelled vapour.
  • US Patent No. 4438191 proposes a new form of TIJ printhead which is an improvement on previous printheads.
  • the fabrication of this device presents additional problems: formation of ink holes, removal of dry film residue from the firing chambers and other locations, proper alignment of the nozzle, and various manufacturing problems.
  • the nozzles of the monolithic printhead do not diverge.
  • the present invention aims to reduce or avoid some or all the disadvantages mentioned above.
  • a monolithic ink jet printhead for ejecting a substance comprising a nozzle enclosing a heating chamber, means for storing the substance contiguous with the heating chamber, and a heating element for propelling the substance through the nozzle, characterised in that means is provided for flexibly supporting the heating element within the flow of the substance.
  • a monolithic printhead has the advantages of lower cost and increased precision.
  • An advantage of placing the heating element within the flow of the substance is that the substance (e.g. ink) buffers the heating element from cavitation forces that result from collapsing bubbles. These cavitation forces could otherwise destroy the heating element. Additionally, the supporting means can flex and absorb energy from the collapsing bubbles that would otherwise be absorbed by the heating element.
  • the storing means is brought directly adjacent the nozzle, and there is then no restriction on the rate of ink flow which permits an increased printing speed.
  • the nozzle and heating element are formed integrally on a substrate by deposition techniques. This ensures automatic alignment of the nozzle, and means the nozzle plate cannot be detached.
  • a method of producing a monolithic ink jet printhead comprising the steps of: using integrated circuit techniques to construct in a first part of a substrate a means for supporting a heating element, using integrated circuit techniques to form in a second part of the substrate a means for storing ink that is contiguous with the supporting means, using integrated circuit techniques to form a heating element on the supporting means, and using integrated circuit techniques to form nozzle on the substrate and over the heating element.
  • FIG. 1 A prior-art thermal ink jet printhead 2 is shown in Figure 1.
  • the advancement of thermal ink jet technology falls upon an assembly problem: detachment of the nozzle plate 1.
  • each nozzle plate 1 is individually attached with epoxy to the resistor structure 3 as shown in Figure 2A.
  • This costly procedure is problem-prone. For example, this procedure often misaligns the nozzle plate 1.
  • Figure 2A a simplified representation of the prior art, omits many of the details.
  • the differences in thermal expansion coefficients among different components of the printhead 2 tend to debond the nozzle plate 1 during the curing process of the glue. This adhesion problem limits the number of nozzles in the printhead 2.
  • prior-art TIJ print head 2 presents another problem. It limits the printing speed.
  • ink reaches the nozzle 6 after travelling through high friction channels 7 which restrict the ink flow.
  • a monolithic thermal ink jet printhead is proposed.
  • This monolithic structure makes page-width array thermal ink jet printheads possible.
  • the monolithic structure can be manufactured by standard integrated circuit and printed circuit processing techniques.
  • a nickel-plating process constructs a nozzle on top of resistors, thereby eliminating adhesion and alignment problems.
  • a rigid substrate supports a flexible cantilever beam upon which the resistors are constructed.
  • the monolithic printhead allows a smoother ink supply since the ink is fed directly from the backside past the resistor from a well in the thickness of the rigid substrate.
  • the orifice structure is constructed by a self-aligned, two-step plating process which results in compound bore shape nozzles.
  • Figure 3 shows a cross-section of the preferred embodiment of the invention, a monolithic thermal ink jet printhead with integrated nozzle 19 and ink well 11.
  • Figure 4 shows a top view of the monolithic printhead 20.
  • a well 11 Within the thickness of the substrate 10 a well 11 resides to hold ink.
  • the gaseous ink (water vapour, glycol, and ink pigment particles) migrates to the nozzle area 17.
  • the compound bore nozzle 19 directs the gaseous ink as it is expelled from the nozzle area 17 by pressure from the accumulated gaseous ink.
  • a thermal barrier, layer 21, prevents heat from flowing to nickel cantilever beams 12 which form part of the nickel deposit 40.
  • the beams 12 are formed by apertures which communicate between wall 11 and nozzle 17. Because of layer 21 heat from the resistive layer 15 heats the ink and is not wasted on the printhead 20.
  • a patterned conducting layer 23 shorts out the resistive layer 15 except on the cantilever beams 12.
  • a protective layer 25 prevents electrical shorts during the nickel plating process to form the nozzle 19. The protective layer 25 also protects layers from chemical and mechanical wear.
  • a conducting layer 27 is deposited during the manufacturing process to provide a surface upon which the nozzle 19 can be constructed.
  • Advantages of the present invention include the automatically-aligned nozzle 19, shown in Figure 3.
  • Prior-art processes misalign the nozzle plate 1 shown in Figure 1. This misalignment causes dot spread and slanted printing.
  • the new monolithic TIJ printhead 20 reduces resistor failure.
  • prior-art TIJ printheads shown in Figure 1 the collapsing bubble and refilling ink impact the resistor surface. The cavitation force eventually destroys the resistor.
  • the collapsing bubble collides with the refilling ink. The ink absorbs most of the cavitation forces.
  • the cantilever beams constructed from ductile nickel, lie in a reservoir of ink. The mechanical forces on resistors will be buffered by the flexibility of the cantilever beams as well as the ink itself.
  • printing speed is not limited by the ink refilling rate.
  • the ink well 11 is directly connected to the heating elements 15 as shown in Figure 3. This direct connection reduces resistance to ink flow.
  • printing speed is not limited by the ink refilling rate.
  • Figures 5 to 7 illustrate the process to manufacture monolithic thermal ink jet printheads 20 and involves several steps.
  • a conducting, layer 30 approximately 1000 A is deposited using a sputter deposition technique. By conducting electricity through the conducting layer 30, a surface is formed to which nickel plating can be attached.
  • a dry film mask 32 is laminated on the conducting layer 30 as shown in Figure 5B.
  • This mask 32 having a diameter of 50.8 to 76.2 ⁇ m (2 to 3 mils), defines the location of the cantilever beams 12 in Figure 3 as well as 13 in Figure 8.
  • Figure 5C shows the various shapes a mask 32 can have.
  • Mask 38 corresponds to the printhead 20 shown in Figure 4.
  • Mask 34 corresponds to printhead 60 shown in Figure 9.
  • an electroplating process deposits a nickel layer 40 from 25.4 to 38.1 um (1 to 1.5 mils) thick onto the exposed substrate 10.
  • cantilever beams 12 are formed.
  • removal of the dry film mask 38 exposes the cantilever beams 12 shown in Figure 6B.
  • the well 11 is formed through a multi-­step process.
  • a sputtering process deposits a protective metal layer 42. This layer is made of gold and has a thickness of 1000 ⁇ .
  • a mask 44 defines the well 11.
  • a wet chemical etching process such as KOH for silicon or HF for glass, forms the well 11.
  • the protective layer 42 and the mask layer 44 are removed, the device appears as shown in Figure 6C.
  • the thermal insulation layer 21 encourages the efficient operation of the resistor layer 15.
  • a resistive layer 15 made of a material such as tantalum-aluminium is deposited to a thickness of 1000 ⁇ to 3000 ⁇ , as shown in Figure 3.
  • a conducting layer 23 made of gold or aluminium to a thickness of 5000 ⁇ is selectively patterned on resistive layer 15 to short out portions of the resistive layer 15.
  • the conducting layer 23 is not present on the cantilever beam 12 so that the resistive layer 15 is operative there.
  • a protective layer 25 made of Si Carbide (SiC) and Si3N4 or other dielectric material is deposited using an LPCVD process. This layer protects the device from chemical and mechanical wear.
  • the conducting layer 27 provides a surface upon which the nozzle 19 can be formed with an electroplating process.
  • portions of the conducting layer 27 are etched away through a wet-­etching process, so that the only conducting layer 27 remaining is located where the nozzle will be constructed.
  • donut-shaped dry film blocks 52 are laminated onto the conducting layer 27. These blocks 52 form a frame for the construction of the nozzle 19.
  • the nozzle 19 is constructed in a two-step plating process. The results of the first step are shown in Figure 7A.
  • the base of nozzle 19 is formed by electroplating nickel onto the conducting layer 27 to a thickness of 38.1 to 5.08 ⁇ m (1.5 mil to 2.0 mil), which equals the height of the nozzle 19.
  • a glass slab or any other flat dielectric material 56 is pressed on the nozzle 19 as shown in Figure 7B. This slab 56 acts as a nozzle 19 mould for the second part of the nickel plating process.
  • Figure 7C the electroplating process is continued to form the nozzle 19. Now that the nozzle is completed, the slab 56 is removed.
  • the resulting product is the printhead 20 shown in Figure 3.
  • the nozzle 19 could be constructed by a one-­step plating process without the use of the slab 56.
  • Figures 8 and 9 show an alternative embodiment of the printhead 20.
  • a nozzle 19 having this shape is called a compound-bore nozzle 19. It controls the stream of ink ejected from the nozzle 19.
  • the ink stream ejected from a compound-bore nozzle has a narrow diameter and minimum spread.
  • the cantilever beams 13 protrude inward and the heating element 15 rests on top of the cantilever beam 13.
  • This embodiment of the printhead 20 would be formed in the same way as the printhead 20 shown in Figure 3.
  • the primary difference in the process would be in the type of mask 32 used when layer 40 is plated onto substrate 10.
  • a mask similar to mask 34 or 36 is used.
  • the printhead ejects ink.
  • This ink contains water, glycol, and pigment particles. However, it can be used to eject other substances.
  • the present invention a monolithic thermal ink jet printhead with integrated nozzle and ink well and a process for making it, solves the nozzle attachment and ink flow problems of prior-art printheads mentioned above. Also, the present invention reduces manufacturing costs and improves reliability. The reduced manufacturing costs are partially achieved through an automated manufacturing procedure. The increased reliability is partially achieved through longer resistor life and smoother ink flow in the printhead. With these improvements, page-width TIJ print arrays are possible.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
EP89123606A 1986-04-28 1987-04-28 Thermischer Tintenstrahldruckkopf Withdrawn EP0367303A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US85674086A 1986-04-28 1986-04-28
US856740 1986-04-28

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
EP87303785.7 Division 1987-04-28

Publications (1)

Publication Number Publication Date
EP0367303A1 true EP0367303A1 (de) 1990-05-09

Family

ID=25324393

Family Applications (2)

Application Number Title Priority Date Filing Date
EP89123606A Withdrawn EP0367303A1 (de) 1986-04-28 1987-04-28 Thermischer Tintenstrahldruckkopf
EP19870303785 Expired EP0244214B1 (de) 1986-04-28 1987-04-28 Thermischer Tintenstrahldruckkopf

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP19870303785 Expired EP0244214B1 (de) 1986-04-28 1987-04-28 Thermischer Tintenstrahldruckkopf

Country Status (3)

Country Link
EP (2) EP0367303A1 (de)
JP (2) JP2635043B2 (de)
DE (1) DE3771269D1 (de)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991017891A1 (de) * 1990-05-21 1991-11-28 Mannesmann Ag Tintenschreibkopf für eine nach dem thermalwandlerprinzip arbeitende flüssigkeitsstrahlaufzeichnungsvorrichtung und verfahren zu seiner herstellung
GB2267254A (en) * 1992-04-28 1993-12-01 Inkjet Systems Gmbh Co Kg Structure of single-integrated-chip ink-jet print head.
EP0594310A2 (de) * 1992-10-23 1994-04-27 Hewlett-Packard Company Farbstrahldruckkopf und Verfahren seiner Herstellung
EP0742102A2 (de) * 1995-05-12 1996-11-13 Lexmark International, Inc. Druckkopf und Verfahren zu seiner Herstellung durch einstufiges Spritzgiessen
US6508546B2 (en) 1998-10-16 2003-01-21 Silverbrook Research Pty Ltd Ink supply arrangement for a portable ink jet printer
WO2004048109A1 (en) * 2002-11-23 2004-06-10 Silverbrook Research Pty Ltd Thermal ink jet printhead with symmetric bubble formation
US6805435B2 (en) 1998-10-16 2004-10-19 Silverbrook Research Pty Ltd Printhead assembly with an ink distribution arrangement
EP1567353A1 (de) * 2002-11-23 2005-08-31 Silverbrook Research Pty. Limited Thermotintenstrahldruckkopfmit kavitationsspalt
EP1567350A1 (de) * 2002-11-23 2005-08-31 Silverbrook Research Pty. Limited Thermotintenstrahlmit durch cvd hergestellter düsenplatte
US7281782B2 (en) 2002-11-23 2007-10-16 Silverbrook Research Pty Ltd Thermal ink jet with thin nozzle plate
US7306326B2 (en) 2002-11-23 2007-12-11 Silverbrook Research Pty Ltd Thermal ink jet printhead with low heater mass
US7328978B2 (en) 2002-11-23 2008-02-12 Silverbrook Research Pty Ltd Printhead heaters with short pulse time
US7407271B2 (en) 2002-11-23 2008-08-05 Silverbrook Research Pty Ltd Self-cooling thermal ink jet printhead
US7431427B2 (en) 2002-06-13 2008-10-07 Silverbrook Research Pty Ltd Ink supply arrangement with improved ink flows
US7669980B2 (en) 2002-11-23 2010-03-02 Silverbrook Research Pty Ltd Printhead having low energy heater elements

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2824123B2 (ja) * 1989-05-30 1998-11-11 キヤノン株式会社 インクジェットヘッド及び該ヘッドを形成するために用いるインクジェットヘッド用基体
AU657720B2 (en) * 1991-01-30 1995-03-23 Canon Kabushiki Kaisha A bubblejet image reproducing apparatus
US6019457A (en) * 1991-01-30 2000-02-01 Canon Information Systems Research Australia Pty Ltd. Ink jet print device and print head or print apparatus using the same
DE69214853T2 (de) * 1991-01-30 1997-05-28 Canon Information Syst Res Strahldrucker mit Bläschen für Bildaufzeichnungsvorrichtung
EP0498291B1 (de) * 1991-01-30 1996-04-10 Canon Information Systems Research Australia Pty Ltd. Düsenstrukturen für Tintenstrahldrucker
US5815173A (en) * 1991-01-30 1998-09-29 Canon Kabushiki Kaisha Nozzle structures for bubblejet print devices
US5198834A (en) * 1991-04-02 1993-03-30 Hewlett-Packard Company Ink jet print head having two cured photoimaged barrier layers
EP0638424A3 (de) * 1993-08-09 1996-07-31 Hewlett Packard Co Thermo-Tintenstrahldruckkopf und Herstellungsverfahren.
AUPN234695A0 (en) * 1995-04-12 1995-05-04 Eastman Kodak Company Heater structure for monolithic lift print heads
EP0772525A1 (de) * 1995-04-12 1997-05-14 Eastman Kodak Company Verfahren zum bauen und herstellen von thermisch aktivierten druckköpfen
EP0771272A1 (de) * 1995-04-12 1997-05-07 Eastman Kodak Company Monolithische druckköpfe und verfahren zu deren herstellung
US5905517A (en) * 1995-04-12 1999-05-18 Eastman Kodak Company Heater structure and fabrication process for monolithic print heads
AUPN623895A0 (en) * 1995-10-30 1995-11-23 Eastman Kodak Company A manufacturing process for lift print heads with nozzle rim heaters
US6305790B1 (en) 1996-02-07 2001-10-23 Hewlett-Packard Company Fully integrated thermal inkjet printhead having multiple ink feed holes per nozzle
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DE3771269D1 (de) 1991-08-14
JPH08230192A (ja) 1996-09-10
JPS62259864A (ja) 1987-11-12
JP2716418B2 (ja) 1998-02-18
EP0244214A1 (de) 1987-11-04
JP2635043B2 (ja) 1997-07-30
EP0244214B1 (de) 1991-07-10

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