EP0234450A3 - Thermosetting resin and prepreg and laminate using the same - Google Patents
Thermosetting resin and prepreg and laminate using the sameInfo
- Publication number
- EP0234450A3 EP0234450A3 EP19870102069 EP87102069A EP0234450A3 EP 0234450 A3 EP0234450 A3 EP 0234450A3 EP 19870102069 EP19870102069 EP 19870102069 EP 87102069 A EP87102069 A EP 87102069A EP 0234450 A3 EP0234450 A3 EP 0234450A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- prepreg
- laminate
- same
- thermosetting resin
- thermosetting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F12/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F12/02—Monomers containing only one unsaturated aliphatic radical
- C08F12/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F12/14—Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing heteroatoms
- C08F12/22—Oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/12—Polymers provided for in subclasses C08C or C08F
- C08F290/124—Polymers of aromatic monomers as defined in group C08F12/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/08—Epoxidised polymerised polyenes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
- Y10T428/31696—Including polyene monomers [e.g., butadiene, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
- Y10T442/674—Nonwoven fabric with a preformed polymeric film or sheet
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Emergency Medicine (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3305086A JPH0680094B2 (en) | 1986-02-19 | 1986-02-19 | Flame-retardant resin composition |
JP33050/86 | 1986-02-19 | ||
JP61085966A JPS62243396A (en) | 1986-04-16 | 1986-04-16 | Multilayer printed circuit board |
JP85966/86 | 1986-04-16 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0234450A2 EP0234450A2 (en) | 1987-09-02 |
EP0234450A3 true EP0234450A3 (en) | 1988-10-05 |
EP0234450B1 EP0234450B1 (en) | 1994-10-12 |
Family
ID=26371687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19870102069 Expired - Lifetime EP0234450B1 (en) | 1986-02-19 | 1987-02-13 | Thermosetting resin and prepreg and laminate using the same |
Country Status (5)
Country | Link |
---|---|
US (2) | US4886858A (en) |
EP (1) | EP0234450B1 (en) |
KR (1) | KR900006327B1 (en) |
CN (2) | CN1007676B (en) |
DE (1) | DE3750641T2 (en) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0234450B1 (en) * | 1986-02-19 | 1994-10-12 | Hitachi, Ltd. | Thermosetting resin and prepreg and laminate using the same |
US6586533B1 (en) | 1987-05-14 | 2003-07-01 | World Properties, Inc. | Method of manufacture of polybutadiene and polyisoprene based thermosetting compositions |
US6415104B1 (en) | 1987-05-14 | 2002-07-02 | World Properties, Inc. | Heating elements comprising polybutadiene and polyisoprene based thermosetting compositions |
JPH072829B2 (en) * | 1987-11-04 | 1995-01-18 | 株式会社日立製作所 | Laminate |
GB8817664D0 (en) * | 1988-07-25 | 1988-09-01 | Ici Plc | Polymeric films |
US5045381A (en) * | 1988-09-30 | 1991-09-03 | Hitachi, Ltd. | Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board |
JP2773366B2 (en) * | 1990-03-19 | 1998-07-09 | 富士通株式会社 | Method of forming multilayer wiring board |
US5120793A (en) * | 1990-04-18 | 1992-06-09 | Hoechst Celanese Corp. | Process for preparing ether derivatives of polymers of p-hydroxystyrene |
US5316831A (en) * | 1991-05-08 | 1994-05-31 | Fuji Electric Co., Ltd. | Metallic printed board |
US5313015A (en) * | 1991-12-31 | 1994-05-17 | Schlegel Corporation | Ground plane shield |
CN1040797C (en) * | 1992-12-30 | 1998-11-18 | 华中理工大学 | Apparatus and method for quantitative test of defect in slender magnetic-conductive component |
US6048807A (en) * | 1998-08-12 | 2000-04-11 | World Properties, Inc. | Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture |
US5858887A (en) * | 1994-10-13 | 1999-01-12 | World Properties, Inc. | Single resin polybutadiene and polyisoprene thermosetting compositions and method of manufacture thereof |
US6071836A (en) * | 1994-10-13 | 2000-06-06 | World Properties, Inc. | Polybutadiene and polyisoprene thermosetting compositions and method of manufacture thereof |
US5571609A (en) * | 1994-10-13 | 1996-11-05 | Rogers Corporation | Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture thereof |
US6291374B1 (en) | 1994-10-13 | 2001-09-18 | World Properties, Inc. | Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture |
US5928767A (en) * | 1995-06-07 | 1999-07-27 | Dexter Corporation | Conductive film composite |
US5779836A (en) * | 1996-07-11 | 1998-07-14 | Advance Circuits Inc | Method for making a printed wiring board |
US5763060A (en) * | 1996-07-11 | 1998-06-09 | Advance Circuits, Inc. | Printed wiring board |
US5902838A (en) * | 1996-10-01 | 1999-05-11 | Loctite Corporation | Process for the assembly of glass devices subjected to high temperatures, compositions therefor and novel polymers for rheological control of such compositions |
AT405410B (en) * | 1997-05-21 | 1999-08-25 | Chemie Linz Gmbh | INTUMESCENT SEALING AND COVER PROFILES |
US6042936A (en) * | 1997-09-23 | 2000-03-28 | Fibermark, Inc. | Microsphere containing circuit board paper |
US6231714B1 (en) | 1998-11-24 | 2001-05-15 | Loctite Corporation | Allylic phenyl ether (meth)acrylate compositions and novel allylic phenyl ether (meth)acrylate monomers |
JP2000294922A (en) * | 1999-04-01 | 2000-10-20 | Victor Co Of Japan Ltd | Insulating resin composition for multilayer printed wiring board |
JP5176126B2 (en) * | 2006-10-06 | 2013-04-03 | 日立化成株式会社 | Polybutadiene resin composition with suppressed phase separation and printed circuit board using the same |
JP4706709B2 (en) * | 2008-03-07 | 2011-06-22 | オムロン株式会社 | One-part epoxy resin composition and use thereof |
CN101959374B (en) * | 2009-07-15 | 2013-03-20 | 三星电子株式会社 | Method for manufacturing multilayer printed circuit board |
CN101643565B (en) * | 2009-08-24 | 2010-07-21 | 广东生益科技股份有限公司 | Composite material, high frequency circuit board prepared from same and preparation method thereof |
CN202143291U (en) * | 2011-04-22 | 2012-02-08 | 中兴通讯股份有限公司 | Two-layer printed circuit board and mobile communication terminal |
JP5765161B2 (en) * | 2011-09-16 | 2015-08-19 | 日立金属株式会社 | Characteristic evaluation mechanism and characteristic evaluation method for differential signal transmission cable |
CN102504532B (en) * | 2011-10-18 | 2013-09-18 | 广东生益科技股份有限公司 | Halogen-free low dielectric resin composition and prepreg and copper clad laminate made of same |
CN109082021B (en) * | 2017-06-13 | 2021-01-01 | 广东生益科技股份有限公司 | Polymer resin composition and application thereof in high-frequency circuit board |
CN109082019B (en) * | 2017-06-13 | 2020-04-14 | 广东生益科技股份有限公司 | Polymer resin and application thereof in high-frequency circuit board |
CN109082020A (en) * | 2017-06-13 | 2018-12-25 | 广东生益科技股份有限公司 | Polymer resin composition and its application in high-frequency circuit board |
CN115772304B (en) * | 2022-12-16 | 2024-02-27 | 卡尔德线缆(东莞)有限公司 | High-flexibility and bending-resistant robot cable |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB691036A (en) * | 1948-11-24 | 1953-05-06 | British Resin Prod Ltd | Etherification of vinyl phenol polymers or copolymers |
EP0138609A2 (en) * | 1983-10-18 | 1985-04-24 | Nippon Oil Co. Ltd. | Resin compositions for laminated boards |
EP0202488A2 (en) * | 1985-04-23 | 1986-11-26 | Hitachi, Ltd. | Thermosetting resin composition and laminate and process for the production thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2915511A (en) * | 1956-11-27 | 1959-12-01 | Monsanto Chemicals | Hydroxylated polystyrenes |
JPS5229800B2 (en) * | 1972-11-01 | 1977-08-04 | ||
EP0234450B1 (en) * | 1986-02-19 | 1994-10-12 | Hitachi, Ltd. | Thermosetting resin and prepreg and laminate using the same |
JPH072829B2 (en) * | 1987-11-04 | 1995-01-18 | 株式会社日立製作所 | Laminate |
-
1987
- 1987-02-13 EP EP19870102069 patent/EP0234450B1/en not_active Expired - Lifetime
- 1987-02-13 DE DE3750641T patent/DE3750641T2/en not_active Expired - Fee Related
- 1987-02-16 KR KR1019870001264A patent/KR900006327B1/en not_active IP Right Cessation
- 1987-02-17 US US07/015,325 patent/US4886858A/en not_active Expired - Lifetime
- 1987-02-19 CN CN87100741A patent/CN1007676B/en not_active Expired
-
1989
- 1989-06-19 US US07/367,675 patent/US4933228A/en not_active Expired - Fee Related
- 1989-10-10 CN CN89107774A patent/CN1019537B/en not_active Expired
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB691036A (en) * | 1948-11-24 | 1953-05-06 | British Resin Prod Ltd | Etherification of vinyl phenol polymers or copolymers |
EP0138609A2 (en) * | 1983-10-18 | 1985-04-24 | Nippon Oil Co. Ltd. | Resin compositions for laminated boards |
EP0202488A2 (en) * | 1985-04-23 | 1986-11-26 | Hitachi, Ltd. | Thermosetting resin composition and laminate and process for the production thereof |
Non-Patent Citations (1)
Title |
---|
JOURNAL OF POLYMER SCIENCE, Polymer chemistry edition, vol. 12, no. 10, 1974, page 2453, John Wiley & Sons, Inc., New York, US; P. FERRUTI et al.: "1-methacryloylimidazole as methacrylating agent" * |
Also Published As
Publication number | Publication date |
---|---|
EP0234450B1 (en) | 1994-10-12 |
CN1041079A (en) | 1990-04-04 |
CN1007676B (en) | 1990-04-18 |
DE3750641D1 (en) | 1994-11-17 |
CN1019537B (en) | 1992-12-16 |
DE3750641T2 (en) | 1995-04-06 |
CN87100741A (en) | 1987-12-16 |
US4933228A (en) | 1990-06-12 |
EP0234450A2 (en) | 1987-09-02 |
KR900006327B1 (en) | 1990-08-28 |
US4886858A (en) | 1989-12-12 |
KR870007972A (en) | 1987-09-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0234450A3 (en) | Thermosetting resin and prepreg and laminate using the same | |
EP0265171A3 (en) | Thermoplastic resin laminate | |
EP0204324A3 (en) | Resin laminate | |
DE3465456D1 (en) | Plastic laminate structure and vessel | |
GB8607840D0 (en) | Thermosetting resin | |
EP0263915A3 (en) | Thermosetting resin composition | |
EP0171626A3 (en) | Adhesive resins and laminate articles | |
EP0236954A3 (en) | Bis-maleimide resin systems and structural composites prepared therefrom | |
PH24583A (en) | Fast curing phenolic resins and bonding methods employing the same | |
EP0202488A3 (en) | Thermosetting resin composition and laminate and process for the production thereof | |
EP0242235A3 (en) | Composite acrylic resin particles | |
SG50417A1 (en) | Polyhydric phenol and epoxy resin obtained using the same | |
EP0321957A3 (en) | Polyolefin type resin laminate | |
EP0449654A3 (en) | Resin laminates | |
GB8708431D0 (en) | Poly-1-caprolactone resin | |
EP0270020A3 (en) | Resin cure | |
EP0236933A3 (en) | Thermosetting resin composition | |
AU6915787A (en) | Thermoplastic/fibreglass laminates | |
GB2147850B (en) | }fibre - reinforced thermoplastic laminate | |
EP0480543A3 (en) | Thermosetting resin composition | |
EP0249226A3 (en) | Resin composite | |
GB8721966D0 (en) | Photocurable laminate | |
EP0326177A3 (en) | Epoxy resin composition and prepreg for composite materials using the same | |
GB8824435D0 (en) | Composite plastics film | |
ZA84938B (en) | Plastic laminate structure and vessel |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): DE FR GB |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): DE FR GB |
|
17P | Request for examination filed |
Effective date: 19890323 |
|
17Q | First examination report despatched |
Effective date: 19910412 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): DE FR GB |
|
REF | Corresponds to: |
Ref document number: 3750641 Country of ref document: DE Date of ref document: 19941117 |
|
ET | Fr: translation filed | ||
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed | ||
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20010123 Year of fee payment: 15 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20010125 Year of fee payment: 15 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20010330 Year of fee payment: 15 |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: IF02 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20020213 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20020903 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20020213 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20021031 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST |