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EP0124943B1 - Verre diélectrique pour circuits multicouches et circuits à couches épaisses qui en sont pourvus - Google Patents

Verre diélectrique pour circuits multicouches et circuits à couches épaisses qui en sont pourvus Download PDF

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Publication number
EP0124943B1
EP0124943B1 EP84200630A EP84200630A EP0124943B1 EP 0124943 B1 EP0124943 B1 EP 0124943B1 EP 84200630 A EP84200630 A EP 84200630A EP 84200630 A EP84200630 A EP 84200630A EP 0124943 B1 EP0124943 B1 EP 0124943B1
Authority
EP
European Patent Office
Prior art keywords
glass
dielectric glass
circuits
weight
dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP84200630A
Other languages
German (de)
English (en)
Other versions
EP0124943A1 (fr
Inventor
Hendrik Jacobus Maria Joormann
Alois Jozef Maria Van Gorp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV, Koninklijke Philips Electronics NV filed Critical Philips Gloeilampenfabrieken NV
Publication of EP0124943A1 publication Critical patent/EP0124943A1/fr
Application granted granted Critical
Publication of EP0124943B1 publication Critical patent/EP0124943B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/102—Glass compositions containing silica with 40% to 90% silica, by weight containing lead
    • C03C3/105—Glass compositions containing silica with 40% to 90% silica, by weight containing lead containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0054—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing PbO, SnO2, B2O3
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00—Compositions for glass with special properties
    • C03C4/16—Compositions for glass with special properties for dielectric glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y10T428/24331—Composite web or sheet including nonapertured component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Definitions

  • the invention relates to a dielectric glass and the glass ceramic obtained therefrom for separating intersecting conductors in multilayer circuits and to the thick film circuits provided therewith.
  • CA-A-842 293 describes a glass ceramic for such use.
  • This glass ceramic has a composition in% by weight which is within the following limit values: where Zn0 can be present up to a maximum of 25% by weight and, as is evident from the examples, is usually also present.
  • a number of additives are permitted up to certain maxima, namely PbF z , SrO, Zr0 2 , Ta Z 0 5 , W0 3 , CdO, Sn0 2 and Sb 2 0 3 .
  • a glass frit which, after milling, can be made into a screen printing paste. After the screen printing, the paste is burned out. Thereby nucleation takes place with a subsequent elimination from a crystalline phase on the nuclei.
  • the glass ceramic obtained in this way has a low dielectric constant, which prevents a capacitive coupling taking place between the mutually insulated circuit arrangements when AC voltage is used. Furthermore, the glass ceramic has low dielectric losses (a high Q value), which avoids dielectric heating thereof, has a low tendency to form pinholes and low gas evolution during firing.
  • the glass ceramic has a proportion of crystalline phase which is between 25 and 50% by weight. It has been found that the risk of porosity of the glass-ceramic substrate increases with a higher proportion of crystalline phase.
  • Conductor pastes based on gold are known as material for the conductor.
  • micropores are generally harmless; only when using silver-containing conductor pastes, for example AgPd, do these micropores cause silver migration during a wet test under electrical voltage, whereby the insulation resistance remains permanently low.
  • the invention now creates a glass and a glass ceramic obtained therefrom which does not have these disadvantages and can be used well in multilayer circuits in which silver-containing conductor pastes are used.
  • the glass ceramic according to the invention is characterized in that it has a composition in mol% and within the following limit values:
  • This glass which may contain non-interfering impurities below the permissible maximum values, is processed into a paste in a known manner.
  • the paste is processed in a multi-layer circuit using a screen printing process.
  • the multilayer circuit ultimately obtained is fired at a temperature of 840-900 ° C. for a period of 1 ⁇ 2 to 1 hour.
  • the temperature at which crystallization starts must be in a temperature range of around 750 - 800 ° C.
  • the crystalline phases that occur are Zn 2 Si0 4 , PbAISi 2 0 8 and Zn (AlO 2 ) 2 . If crystallization only began at a higher temperature, there would be a risk that the conductors would sink into the glass layer and break locally, due to the glass's viscosity being too low. A proportion of 10-20% by weight of crystalline phase is low enough to have a product which is without continuous micropores. On the other hand, the amount of crystalline phase is large enough to ensure such strength during firing that it is avoided that the conductor tracks sink into the layer of the glass-ceramic material and thereby have fractures locally. The material of the conductor tracks sinters from about 600 ° C into a rigid, rather brittle whole. In conclusion, it is advantageous that gas bubbles, if they occur in the composition of the invention or arise during burning, are extremely small and the tendency to enlarge them is avoided.
  • compositions that have a softening temperature between 750 and 800 ° C are limited as follows:
  • a maximum of 5% by weight of color oxides such as cobalt oxides, nickel oxides, copper oxides, vanadium oxides, chromium oxides etc., mixtures or aluminates of the oxides can be added to the compositions according to the invention.
  • the oxide can be added to the glass and paste.
  • the conductor tracks that are on the glass ceramic according to the invention after the manufacture of the circuit arrangement has been completed cannot be soldered. This is due to the fact that glass in the Production of the circuit pattern, ie during the firing, diffuses into the conductor layer. This is disadvantageous for some areas of application.
  • this disadvantage can be eliminated by using an oxide or an oxidic compound, which is poorly soluble in the glass or glass ceramic, in a finely divided form and in an amount of 20-40% by weight. depending on the specific weight.
  • examples of such poorly soluble oxides or oxidic compounds are Zr0 2 , zirconium aluminate, zirconium silicate and aluminum oxide.
  • the material filled in this way can be used as a dielectric separating layer, but it can also be used as an intermediate layer on an unfilled size.
  • the filled layer is mostly porous. In this case, the combination with an unfilled layer is required to avoid silver migration.
  • the conductor tracks on such a filled layer can be soldered. As a result, components can be arranged directly on the circuit arrangement, which is extremely advantageous.
  • Another way of avoiding silver migration is to add an oxide, such as zinc oxide or magnesium oxide, which initially dissolves in the glass, but which subsequently increases the amount of crystalline phase. In this case too, the combination with a layer of undoped glass is mostly necessary because of the porosity that occurs.
  • an oxide such as zinc oxide or magnesium oxide
  • An advantage of the glass compositions according to the invention is that B 2 0 3 , Na 2 0 and K 2 0 are missing in an amount greater than 1 mol%, and that fluorides, halides, sulfur compounds, phosphorus compounds, molybdenum oxides and tungsten oxides in an amount larger than 0.1 mol% are absent; Alkali code and boric acid would adversely affect the crystallization behavior.
  • the substances mentioned, all of which are more or less volatile at the firing temperature, can impair the properties of other circuit parts.
  • a conductor pattern is applied by screen printing to a substrate customary for thick film technology, for example consisting of 96% aluminum oxide, using a paste based on Ag-Pd, for example only 23% by weight Pd and 67% by weight Ag, the glass and Bi 2 0 3 are added in a total amount of 10% by weight.
  • a pattern of the glass ceramic according to the invention is also attached to it by screen printing, provided with openings, called "Via's", which have to make electrical connections between the conductors.
  • the glass powder of one of the six compositions in the table below a mixture of the oxides in question is melted, the melt is quenched and the frit obtained is ground to an average particle size of 2 ⁇ m.
  • the powder is processed in a three-roll mill into a screen printing paste, with the aid of a solution of 4.5% by weight ethyl cellulose in a mixture consisting of 23% by weight butyl diglycol acetate, 13% by weight dibutyl phthalate and 64% by weight.
  • Terpineol exists, the desired viscosity characteristic is achieved.
  • the paste contains 40% by weight of glass powder.
  • the insulating layer is applied in two steps, each with a layer thickness of 40-50 ⁇ m in the wet state with intermediate drying, and then, also by screen printing, a second conductor pattern based on Ag-Pd with a thickness of 40-50 ⁇ m, also in the wet Condition measured, attached.
  • a covering layer with a thickness of 40-50 ⁇ m of the same composition as the insulating layer is applied in order to avoid undesirable interactions between the layers and the whole is fired at a temperature between 840-900 ° C. This compresses to about 40% of the original thickness. It is also possible in the meantime to carry out one or more firing processes in the production of the multilayer circuit instead of just one firing process when all the layers have been applied and dried using the screen printing method.
  • the multi-layer circuit obtained in this way is exposed to a moist sample in air with a humidity of 95-98% and at a temperature of 45 ° C. under 30 V DC, a service life of at least 1000 hours is determined.
  • compositions 2 to 5 are within the above-defined area and meet the requirements.
  • the table shows the capacitance per mm 2 at 1 MHz, the loss angle (tgö), the resistance of the insulating layer, which is higher (+) or lower (-) than the value 10 4 M ⁇ / ⁇ and the silver migration that is low enough (+) or too high (-) and the softening temperature (ET) in ° C.
  • the properties are measured on a 35 ⁇ m thick fired layer on a standardized two-layer sample.
  • the silver migration is determined using a standard pattern, on which there are 104 crossings.
  • the circuitry is kept immersed in DC for 4 hours. It is visually judged whether the silver migration is small enough (+); then a maximum of 3 silver spots are visible. If there are more jobs, silver migration is judged to be too large.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Glass Compositions (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Conductive Materials (AREA)

Claims (8)

1. Verre diélectrique pour la réalisation de matière vitrocristalline pour la séparation de conducteurs qui se croisent dans des circuits multicouches, caractérisé en ce qu'il présente une composition, en % en moles, située entre les valeurs limites suivantes:
Figure imgb0009
2. Verre diélectrique pour la réalisation de matière vitrocristalline selon la revendication 1, caractérisé en ce que la composition, en % en moles, se situe entre les limites suivantes:
Figure imgb0010
3. Verre diélectrique selon la revendication 1 ou 2, caractérisé en ce qu'il contient en outre un ou plusieurs oxydes colorés dans une quantité d'au maximum 5% en poids.
4. Verre diélectrique selon l'une des revendications 1 à 3, caractérisé en ce qu'il contient en outre du matériau oxydique peu soluble sous forme finement divisée dans une quantité comprise entre 20 et 40% en poids.
5. Verre diélectrique selon la revendication 1 à 3, caractérisé en ce qu'il contient en outre du matériau oxydique qui se dissout dans le verre, mais qui augmente alors la quantité de phase cristalline dans le produit définitif.
6. Matière vitrocristalline réalisée à partir d'un verre selon l'une des revendications 1 à 5.
7. Circuit à couches épaisses multicouches, comprenant une matière vitrocristalline diélectrique pour la séparation de conducteurs qui se croisent selon la revendication 6 et, le cas échéant, une couche superficielle en réalisée.
EP84200630A 1983-05-06 1984-05-03 Verre diélectrique pour circuits multicouches et circuits à couches épaisses qui en sont pourvus Expired EP0124943B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8301604 1983-05-06
NL8301604A NL8301604A (nl) 1983-05-06 1983-05-06 Dielektrisch glas in meerlagenschakelingen en hiermee uitgeruste dikke filmschakelingen.

Publications (2)

Publication Number Publication Date
EP0124943A1 EP0124943A1 (fr) 1984-11-14
EP0124943B1 true EP0124943B1 (fr) 1986-10-29

Family

ID=19841815

Family Applications (1)

Application Number Title Priority Date Filing Date
EP84200630A Expired EP0124943B1 (fr) 1983-05-06 1984-05-03 Verre diélectrique pour circuits multicouches et circuits à couches épaisses qui en sont pourvus

Country Status (7)

Country Link
US (1) US4609582A (fr)
EP (1) EP0124943B1 (fr)
JP (1) JPS59207851A (fr)
KR (1) KR850000906A (fr)
CA (1) CA1223118A (fr)
DE (1) DE3461069D1 (fr)
NL (1) NL8301604A (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60254697A (ja) * 1984-05-31 1985-12-16 富士通株式会社 多層セラミック回路基板および製法
US4759965A (en) * 1985-08-06 1988-07-26 Canon Kabushiki Kaisha Ceramic, preparation thereof and electronic circuit substrate by use thereof
JPS6340397A (ja) * 1986-08-05 1988-02-20 富士通株式会社 ガラスセラミツク多層回路基板
JPH0772092B2 (ja) * 1988-02-10 1995-08-02 日本特殊陶業株式会社 低温焼成基板
US5066620A (en) * 1989-01-31 1991-11-19 Asahi Glass Company Ltd. Conductive paste compositions and ceramic substrates
US4985376A (en) * 1989-01-31 1991-01-15 Asahi Glass Company, Ltd. Conductive paste compositions and ceramic substrates
US5397830A (en) * 1994-01-24 1995-03-14 Ferro Corporation Dielectric materials
US5714246A (en) * 1994-05-13 1998-02-03 Ferro Corporation Conductive silver low temperature cofired metallic green tape
JP3327045B2 (ja) * 1995-04-28 2002-09-24 株式会社村田製作所 誘電体ペースト及びそれを用いた厚膜コンデンサ
US6007900A (en) * 1995-04-28 1999-12-28 Murata Manufacturing Co., Ltd. Dielectric paste and thick-film capacitor using same
CN109626815B (zh) * 2019-01-23 2021-10-01 成都光明光电股份有限公司 光学玻璃、玻璃预制件、光学元件及光学仪器

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL124928C (fr) * 1960-03-28
US3586522A (en) * 1967-06-01 1971-06-22 Du Pont Glass-ceramics containing baal2si208 crystalline phase
US3493405A (en) * 1967-08-07 1970-02-03 Gen Electric Semiconductor encapsulation glass
US3849097A (en) * 1970-10-07 1974-11-19 Corning Glass Works Method for continuously hot forming strong laminated bodies
US4029897A (en) * 1975-08-07 1977-06-14 Quality Hermetics Limited Glass seal
US4111708A (en) * 1978-01-06 1978-09-05 Corning Glass Works Machinable glasses
JPS5827643B2 (ja) * 1979-07-13 1983-06-10 株式会社日立製作所 非直線抵抗体およびその製法
JPS5832038A (ja) * 1981-08-14 1983-02-24 Hoya Corp フオトエツチングマスク用無アルカリガラス

Also Published As

Publication number Publication date
DE3461069D1 (en) 1986-12-04
NL8301604A (nl) 1984-12-03
EP0124943A1 (fr) 1984-11-14
CA1223118A (fr) 1987-06-23
KR850000906A (ko) 1985-03-09
JPS59207851A (ja) 1984-11-26
US4609582A (en) 1986-09-02
JPS6316345B2 (fr) 1988-04-08

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