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EP0050343B1 - Molybdenum coated with a noble metal and process for its production - Google Patents

Molybdenum coated with a noble metal and process for its production Download PDF

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Publication number
EP0050343B1
EP0050343B1 EP81108457A EP81108457A EP0050343B1 EP 0050343 B1 EP0050343 B1 EP 0050343B1 EP 81108457 A EP81108457 A EP 81108457A EP 81108457 A EP81108457 A EP 81108457A EP 0050343 B1 EP0050343 B1 EP 0050343B1
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EP
European Patent Office
Prior art keywords
duration
molybdenum
temperature
seconds
process according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP81108457A
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German (de)
French (fr)
Other versions
EP0050343A1 (en
Inventor
Wolfgang Ing.-Grad. Pikorz
Alois Dipl.-Phys. Sonntag
Hans Ing.-Grad. Scheuermann
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Licentia Patent Verwaltungs GmbH
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Licentia Patent Verwaltungs GmbH
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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/10Other heavy metals
    • C23G1/106Other heavy metals refractory metals
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals
    • C25D5/12Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34Pretreatment of metallic surfaces to be electroplated
    • C25D5/38Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48After-treatment of electroplated surfaces
    • C25D5/50After-treatment of electroplated surfaces by heat-treatment
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00Electrolytic etching or polishing
    • C25F3/02Etching
    • C25F3/08Etching of refractory metals
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/922Static electricity metal bleed-off metallic stock
    • Y10S428/923Physical dimension
    • Y10S428/924Composite
    • Y10S428/926Thickness of individual layer specified
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12229Intermediate article [e.g., blank, etc.]
    • Y10T428/12236Panel having nonrectangular perimeter
    • Y10T428/12243Disk
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12806Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826Group VIB metal-base component
    • Y10T428/12833Alternative to or next to each other
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12806Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826Group VIB metal-base component
    • Y10T428/12847Cr-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12861Group VIII or IB metal-base component
    • Y10T428/12875Platinum group metal-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12861Group VIII or IB metal-base component
    • Y10T428/12889Au-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12861Group VIII or IB metal-base component
    • Y10T428/12896Ag-base component

Definitions

  • the invention relates to molybdenum, which is coated with a noble metal, and a method for producing such a layer sequence.
  • Such layer sequences are widely used in semiconductor technology as contact material, because the thermal expansion coefficient of the silicon used as the semiconductor material and the thermal expansion coefficient of the molybdenum used as the contact material are similar to each other and therefore no or only low thermal stresses occur even at changing operating temperatures.
  • the molybdenum which is used in the form of disks with a disk thickness of approximately 0.5 to a few mm, is coated with a noble metal, whereby a favorable electrical contact resistance is achieved.
  • the noble metal protects the molybdenum contact against oxidation of the surface and against the attack of aggressive chemicals, which act on the semiconductor body in the course of further process steps during an etching treatment, the shape and properties of which develop, but must not damage the molybdenum contact during this etching treatment.
  • the thinnest possible coating is desirable; however, a certain minimum layer thickness of the precious metal must not be undercut, because otherwise sufficient etch resistance is no longer guaranteed.
  • gold as the coating material, for example, there is sufficient etching resistance only if the layer thickness is at least 1.5 to 3 ⁇ m. With layer thicknesses of less than 1.5 ⁇ m, pores occur, which means that attacks of the base material molybdenum cannot be avoided during etching. Therefore, in practice it has not been possible to do without a thicker gold layer.
  • thinner layer thicknesses of the coating material result in higher costs for the base material, because this has to be prepared better and more uniformly.
  • the high mechanical sensitivity of such thin layers is disadvantageous.
  • layer thicknesses of the noble metal are required. In the case of smaller disk diameters, for example diameters of approximately 6 mm, the noble metal layer thicknesses must be up to 10 ⁇ m.
  • a disadvantage of a coating with chromium is that poor and, above all, fluctuating contact resistances are then recorded, which preclude general use. These fluctuating transition resistances of chromium are probably due to surface oxidation processes that occur randomly and irregularly and cannot be influenced in a targeted manner.
  • temperatures of over 100 ° C occur during several work steps from the alloying of the diffused silicon body to the chromium-coated molybdenum wafer to the installation in a hermetically sealed housing, as a result of which the above-mentioned are evident Oxidation processes are promoted.
  • the object of the invention is to reduce the high need for noble metal in the coating of molybdenum, while maintaining the favorable contact resistance, the good adhesive strength and the known other advantages of the noble metals, but also the above-mentioned disadvantages of other materials and processes, such as lack Avoid etch resistance, more effort in preparing the base material, mechanical sensitivity, fluctuating contact resistance or inefficiency.
  • this object is achieved according to the invention in that the noble metal in a layer thickness of 0.02 ... 1.0 ⁇ m, preferably 0.1 wm, via an intermediate layer of chromium with a layer thickness of 0.5 ... 10.0 ⁇ m, preferably 1.5 ⁇ m, is applied to the molybdenum.
  • the layer sequence has excellent etching resistance despite the lower proportion of noble metal compared to the known etching solution mixtures of nitric acid, hydrofluoric acid, acetic acid and optionally phosphoric acid and shows surprisingly good and uniform contact resistances.
  • Another advantage of the chrome-gold layer sequence compared to pure precious metal coatings, for example gold coatings, is achieved by their better wear resistance.
  • the use of the layer sequence according to the invention is extremely economical and suitable for precious metals such as gold, silver, platinum, palladium, rhodium, ruthenium.
  • the excellent properties of the layer sequence according to the invention are based on a diffusion of the noble metal into the chromium surface, which is thereby stabilized against undesired oxidation processes.
  • the contact resistance is also reduced accordingly.
  • step c) It has proven advantageous to carry out process step c) in a solution of 1 part by volume of concentrated sulfuric acid, 1 part by volume of concentrated nitric acid and 3 parts by volume of concentrated phosphoric acid at room temperature for a period of 15 and the step g) at a current density of about 20 A / allow dm 2 to run at room temperature for a period of 30 s.
  • the applied coatings at a temperature of 500 ... 1 100 ° C, preferably for gold, platinum, palladium, rhodium and ruthenium at a temperature of about 750 ° C, preferably for silver at a temperature of about 950 ° C to anneal for a period of 10 min.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Description

Die Erfindung betrifft Molybdän, das mit einem Edelmetall beschichtet ist, und ein Verfahren, eine solche Schichtenfolge herzustellen.The invention relates to molybdenum, which is coated with a noble metal, and a method for producing such a layer sequence.

Derartige Schichtenfolgen finden in der Halbleitertechnologie vielfach Verwendung als Kontaktmaterial, weil der thermische Ausdehnungskoeffizient des als Halbleitermaterial verwendeten Siliziums und der thermische Ausdehnungskoeffizient des als Kontaktmaterial verwendeten Molybdäns einander ähnlich sind und daher auch bei wechselnden Betriebstemperaturen keine oder nur geringe Wärmespannungen auftreten. Üblicherweise wird das Molybdän, das etwa in Form von Scheiben mit einer Scheibendicke von ungefähr 0,5 bis einigen mm verwendet wird, mit einem Edelmetall beschichtet, wodurch einmal ein günstiger elektrischer Übergangswiderstand erzielt wird. Zum anderen schützt das Edelmetall den Molybdänkontakt vor einer Oxidation der Oberfläche und vor dem Angriff aggressiver Chemikalien, die im Verlauf weiterer Verfahrensschritte während einer Ätzbehandlung auf den Halbleiterkörper einwirken, dessen Form und Eigenschaften ausbilden, den Molybdän-Kontakt während dieser Ätzbehandlung jedoch nicht beschädigen dürfen.Such layer sequences are widely used in semiconductor technology as contact material, because the thermal expansion coefficient of the silicon used as the semiconductor material and the thermal expansion coefficient of the molybdenum used as the contact material are similar to each other and therefore no or only low thermal stresses occur even at changing operating temperatures. Usually, the molybdenum, which is used in the form of disks with a disk thickness of approximately 0.5 to a few mm, is coated with a noble metal, whereby a favorable electrical contact resistance is achieved. On the other hand, the noble metal protects the molybdenum contact against oxidation of the surface and against the attack of aggressive chemicals, which act on the semiconductor body in the course of further process steps during an etching treatment, the shape and properties of which develop, but must not damage the molybdenum contact during this etching treatment.

Wegen des hohen Preises der Edelmetalle ist eine möglichst dünne Beschichtung an sich erstrebenswert; doch darf eine gewisse Mindestschichtdicke des Edelmetalls nicht unterschritten werden, weil sonst keine hinreichende Ätzbeständigkeit mehr gewährleistet ist. So ist etwa bei Gold als Beschichtungsmaterial eine genügende Ätzbeständigkeit nur dann gegeben, wenn die Schichtdicke wenigstens 1,5 ... 3 µm beträgt. Bei Schichtdicken unter 1,5 jim treten Poren auf, wodurch sich beim Ätzen Angriffe des Basismaterials Molybdän nicht vermeiden lassen. Daher konnte bisher in der Praxis auf eine dickere Goldschicht nicht verzichtet werden. Hinzu kommt, daß durch dünnere Schichtdicken des Beschichtungsmaterials höhere Kosten beim Basismaterial entstehen, weil dieses besser und gleichmäßiger vorbereitet sein muß. Außerdem ist die hohe mechanische Empfindlichkeit solcher dünnen Schichten nachteilig. Wenn beispielsweise aus dem mit Gold beschichteten Molybdänblech Ronden gestanzt werden sollen, was zweckmäßig und daher allgemein üblich ist. sind wegen dieser mechanischen Empfindlichkeit sogar Schichtdicken des Edelmetalls von etwa 5 µm erforderlich. Bei kleineren Scheibendurchmessern, beispielsweise Durchmessern von etwa 6 mm, müssen die Edelmetallschichtdicken bis zu 10 µm betragen.Because of the high price of the precious metals, the thinnest possible coating is desirable; however, a certain minimum layer thickness of the precious metal must not be undercut, because otherwise sufficient etch resistance is no longer guaranteed. With gold as the coating material, for example, there is sufficient etching resistance only if the layer thickness is at least 1.5 to 3 μm. With layer thicknesses of less than 1.5 µm, pores occur, which means that attacks of the base material molybdenum cannot be avoided during etching. Therefore, in practice it has not been possible to do without a thicker gold layer. In addition, thinner layer thicknesses of the coating material result in higher costs for the base material, because this has to be prepared better and more uniformly. In addition, the high mechanical sensitivity of such thin layers is disadvantageous. If, for example, blanks are to be punched from the gold-coated molybdenum sheet, which is expedient and therefore generally customary. because of this mechanical sensitivity, layer thicknesses of the noble metal of about 5 µm are required. In the case of smaller disk diameters, for example diameters of approximately 6 mm, the noble metal layer thicknesses must be up to 10 µm.

Es sind Versuche bekannt geworden, Edelmetalle, wie etwa Gold, durch andere preiswerte Metalle zu ersetzen. Fast alle unedleren Metalle weisen jedoch eine viel zu geringe Ätzbeständigkeit auf und sind schon aus diesem Grunde ungeeignet. Geeignet erscheint allenfalls Chrom, das aufgedampft oder galvanisch aufgebracht wird und sowohl eine gute Haftfestigkeit als auch eine gute Ätzbeständigkeit zeigt.Attempts have been made to replace precious metals, such as gold, with other inexpensive metals. Almost all base metals, however, have a far too low etch resistance and are unsuitable for this reason alone. At most, chromium appears to be suitable, which is applied by vapor deposition or electroplating and shows both good adhesive strength and good resistance to etching.

Nachteilig bei einer Beschichtung mit Chrom ist jedoch, daß dann schlechte und vor allem schwankende Übergangswiderstände zu verzeichnen sind, die eine allgemeine Verwendung ausschließen. Diese schwankenden Übergangswiderstände des Chroms sind wahrscheinlich auf Oxidationsvorgänge an der Oberfläche zurückzuführen, die zufällig und unregelmäßig auftreten und nicht gezielt zu beeinflussen sind. Im Verlauf des Herstellungsverfahrens eines Halbleiterbauelementes, für das die Molybdänscheiben verwendet werden, treten nämlich vom Anlegieren des diffundierten Siliziumkörpers an die einseitig mit Chrom beschichtete Molybdänscheibe bis zum Einbau in ein hermetisch abgeschlossenes Gehäuse während mehrerer Arbeitsschritte Temperaturen über 100°C auf, wodurch offensichtlich die genannten Oxidationsvorgänge gefördert werden.A disadvantage of a coating with chromium, however, is that poor and, above all, fluctuating contact resistances are then recorded, which preclude general use. These fluctuating transition resistances of chromium are probably due to surface oxidation processes that occur randomly and irregularly and cannot be influenced in a targeted manner. In the course of the manufacturing process of a semiconductor component, for which the molybdenum wafers are used, temperatures of over 100 ° C occur during several work steps from the alloying of the diffused silicon body to the chromium-coated molybdenum wafer to the installation in a hermetically sealed housing, as a result of which the above-mentioned are evident Oxidation processes are promoted.

Die schlechten und schwankenden Übergangswiderstände werden besonders bei einer galvanischen Beschichtung des Chroms beobachtet, lassen sich aber auch bei aufgedampftem Chrom nicht vermeiden. Hinzu kommt, daß bei einer Beschichtung durch Aufdampfen ein umständliches und erheblich teureres Verfahren angewendet werden muß. Der Vorteil des gegenüber dem Edelmetall preislich günstigeren Chroms wird durch das unwirtschaftliche Beschichtungsverfahren mehr als aufgehoben. Aus den oben genannten Gründen hat daher auch das Chrom als Beschichtungsmaterial keinen Eingang in die Praxis finden und nicht die üblichen dickeren Edelmetallschichten ersetzen können.The poor and fluctuating contact resistances are observed particularly when the chromium is electroplated, but cannot be avoided even when the chromium is vapor-deposited. In addition, a cumbersome and considerably more expensive method must be used for a coating by vapor deposition. The advantage of chromium, which is cheaper than precious metals, is more than offset by the inefficient coating process. For the reasons mentioned above, therefore, the chromium as coating material has not found its way into practice and has not been able to replace the usual thicker precious metal layers.

Aufgabe der Erfindung ist es, den hohen Bedarf an Edelmetall bei der Beschichtung von Molybdän zu verringern, dabei den günstigen Übergangswiderstand, die gute Haftfestigkeit und die bekannten anderen Vorteile der Edelmetalle zu bewahren, außerdem aber die oben genannten Nachteile anderer Stoffe und Verfahren, wie mangelnde Ätzbeständigkeit, höheren Aufwand bei der Vorbereitung des Basismaterials, mechanische Empfindlichkeit, schwankende Übergangswiderstände oder Unwirtschaftlichkeit zu vermeiden.The object of the invention is to reduce the high need for noble metal in the coating of molybdenum, while maintaining the favorable contact resistance, the good adhesive strength and the known other advantages of the noble metals, but also the above-mentioned disadvantages of other materials and processes, such as lack Avoid etch resistance, more effort in preparing the base material, mechanical sensitivity, fluctuating contact resistance or inefficiency.

Diese Aufgabe wird bei Molybdän, das mit einem Edelmetall beschichtet ist, erfindungsgemäß dadurch gelöst, daß das Edelmetall in einer Schichtdicke von 0,02 ... 1,0 µm, vorzugsweise 0,1 wm, über eine Zwischenschicht aus Chrom mit einer Schichtdicke von 0,5 ... 10,0 µm, vorzugsweise 1,5 µm, auf das Molybdän aufgebracht ist.In the case of molybdenum which is coated with a noble metal, this object is achieved according to the invention in that the noble metal in a layer thickness of 0.02 ... 1.0 µm, preferably 0.1 wm, via an intermediate layer of chromium with a layer thickness of 0.5 ... 10.0 µm, preferably 1.5 µm, is applied to the molybdenum.

Mit der Erfindung wird erreicht, daß der Bedarf an Edelmetall bis auf einen fast um zwei Größenordnungen geringeren Betrag verringert werden kann, wobei der Anteil der Kosten des Edelmetalls am gesamten Verfahren nunmehr von untergeordneter Bedeutung ist. Zugleich weist die Schichtenfolge aber trotz des geringeren Edelmetallanteils eine ausgezeichnete Ätzbeständigkeit gegenüber den bekannten Ätzlösungsgemischen aus Salpetersäure, Flußsäure, Essigsäure und gegebenenfalls Phosphorsäure auf und zeigt überraschend gute und gleichmäßige Übergangswiderstände. Ein weiterer Vorteil der Chrom-Gold-Schichtenfolge gegenüber reinen Edelmetallbeschichtungen, zum Beispiel Goldbeschichtungen, wird durch ihre bessere Verschleißbeständigkeit erzielt. Da gleichzeitig bei der Herstellung der Schichtenfolge die bekannten Vorteile galvanischer Verfahren ausgenutzt und aufwendige Aufdampfverfahren vermieden werden können, ist die Anwendung der Schichtenfolge gemäß der Erfindung außerordentlich wirtschaftlich und für Edelmetalle, wie Gold, Silber, Platin, Palladium, Rhodium, Ruthenium, geeignet.With the invention it is achieved that the need for precious metal can be reduced to an amount that is almost two orders of magnitude less, the proportion of the cost of the precious metal in the entire process now being of minor importance. At the same time, the layer sequence has excellent etching resistance despite the lower proportion of noble metal compared to the known etching solution mixtures of nitric acid, hydrofluoric acid, acetic acid and optionally phosphoric acid and shows surprisingly good and uniform contact resistances. Another advantage of the chrome-gold layer sequence compared to pure precious metal coatings, for example gold coatings, is achieved by their better wear resistance. Since, at the same time, the known advantages of galvanic processes can be exploited in the production of the layer sequence and complex vapor deposition processes can be avoided, the use of the layer sequence according to the invention is extremely economical and suitable for precious metals such as gold, silver, platinum, palladium, rhodium, ruthenium.

Es kann vermutet werden, daß die ausgezeichneten Eigenschaften der Schichtenfolge nach der Erfindung auf einer Diffusion des Edelmetalls in die Chromoberfläche beruhen, die dadurch gegen unerwünschte Oxidationsvorgänge stabilisiert wird. Durch eine Herabsetzung der Elektronenaustrittsarbeit wird auch der Übergangswiderstand entsprechend verringert.It can be assumed that the excellent properties of the layer sequence according to the invention are based on a diffusion of the noble metal into the chromium surface, which is thereby stabilized against undesired oxidation processes. By reducing the electron work function, the contact resistance is also reduced accordingly.

Ein weiterer Teil der Erfindung wird in einem Verfahren gesehen, mit dem die Schichtenfolge aus Molybdän, Chrom und Edelmetall in vorteilhafter Weise hergestellt wird. Dieses Verfahren ist gekennzeichnet durch die Reihenfolge nachstehender - teilweise bekannter - Verfahrensschritte :

  • a) Vorentfettung des Molybdäns in einem organischen Lösungsmittel
  • b) Spülen in Wasser
  • c) Reinigungsätzen des Molybdäns
  • d) Spülen in Wasser
  • e) Wiederholen des Reinigungsätzens gemäß c)
  • f) Spülen in Wasser
  • g) Behandeln in einem alkalischen Entfettungsbad
  • h) Spülen in Wasser
  • i) Aktivierung der Molybdänoberfläche
  • j) Galvanisches Beschichten des Chroms
  • k) Spülen in Wasser
  • I) Kathodische Aktivierung der Chromschicht
  • m) Spülen in Wasser
  • n) Galvanisches Beschichten des Edelmetalls
  • o) Spülen in Wasser
  • p) Tempern der aufgebrachten Beschichtungen unter einem Wasserstoff-Schutzgas
Another part of the invention is seen in a method with which the layer sequence of molybdenum, chromium and noble metal is advantageously produced. This process is characterized by the sequence of the following - partly known - process steps:
  • a) Pre-degreasing the molybdenum in an organic solvent
  • b) Rinse in water
  • c) cleaning etching of the molybdenum
  • d) rinsing in water
  • e) repeating the cleaning etching according to c)
  • f) rinsing in water
  • g) Treat in an alkaline degreasing bath
  • h) Rinse in water
  • i) Activation of the molybdenum surface
  • j) Electroplating the chrome
  • k) Rinse in water
  • I) Cathodic activation of the chrome layer
  • m) rinsing in water
  • n) Electroplating the precious metal
  • o) Rinse in water
  • p) annealing the applied coatings under a hydrogen protective gas

Es hat sich als vorteilhaft erwiesen, den Verfahrensschritt c) in einer Lösung aus 1 Volumenteil konzentrierter Schwefelsäure, 1 Volumenteil konzentrierter Salpetersäure und 3 Volumenteilen konzentrierter Phosphorsäure bei Raumtemperatur während einer Dauer von 15 vorzunehmen und den Verfahrensschritt g) bei einer Stromdichte von etwa 20 A/dm2 bei Raumtemperatur während einer Dauer von 30 s ablaufen zu lassen. Ebenso ist es zweckmäßig, beim Verfahrensschritt i) die Molybdänoberfläche in konzentrierter Salzsäure bei Raumtemperatur während einer Dauer von etwa 15 s zu aktivieren; gemäß j) das Molybdän mit Chrom in einem Bad aus 400 g Cr203 und 4 g H2S04 je Liter bei einer Stromdichte von 15 A/dm2 bei einer Temperatur von 50 ± 5 °C während einer Dauer von 8 min zu beschichten ; gemäß 1) die Chromschicht in 1 ... 15 %iger Schwefelsäure, vorzugsweise 8 %iger Schwefelsäure, bei einer Stromdichte von 2 ... 40 A/dm2, vorzugsweise 20 A/dm2, bei Raumtemperatur während einer Dauer von 2 ... 60 s, vorzugsweise 20 s, kathodisch zu aktivieren ; gemäß n) die Chromschicht mit Gold in einem schwachsauren bis neutralen üblichen Goldbad bei einer Deckstromdichte von etwa 3 A/dm2 bei einer Temperatur von 50 ± 5 °C während einer Dauer von 10 s zu beschichten ; gemäß n) die Chromschicht mit Silber in einem cyanidischen Vorsilberbad bei einer Deckstromdichte von etwa 2 A/dm2 bei einer Temperatur von 20 ± 3 °C während einer Dauer von 20 s zu beschichten ; gemäß n) die Chromschicht mit Platin in einem sauren Bad bei einer Deckstromdichte von etwa 3 A/dm2 bei einer Temperatur von 50 ± 5 °C während einer Dauer von 15 s zu beschichten ; gemäß n) die Chromschicht mit Palladium in einem neutralen Bad bei einer Deckstromdichte von etwa 3 A/dm2 bei einer Temperatur von 45±5 °C während einer Dauer von 15 s zu beschichten; gemäß n) die Chromschicht mit Rhodium in einem sauren Bad bei einer Deckstromdichte von etwa 3 A/dm2 bei einer Temperatur von 50 ± 5 °C während einer Dauer von 25 s zu beschichten ; gemäß n) die Chromschicht mit Ruthenium in einem sauren Bad bei einer Deckstromdichte von etwa 3 A/dm2 bei einer Temperatur von 70 ± 5 °C während einer Dauer von 20 s zu beschichten ; gemäß p) die aufgebrachten Beschichtungen bei einer Temperatur von 500 ... 1 100 °C, vorzugsweise bei Gold, Platin, Palladium, Rhodium und Ruthenium bei einer Temperatur von etwa 750 °C, vorzugsweise bei Silber bei einer Temperatur von etwa 950 °C, während einer Dauer von 10 min zu tempern.It has proven advantageous to carry out process step c) in a solution of 1 part by volume of concentrated sulfuric acid, 1 part by volume of concentrated nitric acid and 3 parts by volume of concentrated phosphoric acid at room temperature for a period of 15 and the step g) at a current density of about 20 A / allow dm 2 to run at room temperature for a period of 30 s. It is also expedient in process step i) to activate the molybdenum surface in concentrated hydrochloric acid at room temperature for a period of about 15 s; according to j) the molybdenum with chromium in a bath of 400 g Cr 2 0 3 and 4 g H 2 S0 4 per liter at a current density of 15 A / dm 2 at a temperature of 50 ± 5 ° C for a period of 8 min to coat; 1) the chromium layer in 1 ... 15% sulfuric acid, preferably 8% sulfuric acid, at a current density of 2 ... 40 A / dm 2 , preferably 20 A / dm 2 , at room temperature for a period of 2. .. 60 s, preferably 20 s, to be activated cathodically; according to n) to coat the chrome layer with gold in a weakly acidic to neutral gold bath at a cover current density of about 3 A / dm 2 at a temperature of 50 ± 5 ° C. for a period of 10 s; according to n) to coat the chrome layer with silver in a cyanide pre-silver bath at a cover current density of about 2 A / dm 2 at a temperature of 20 ± 3 ° C for a period of 20 s; according to n) to coat the chrome layer with platinum in an acid bath at a cover current density of about 3 A / dm 2 at a temperature of 50 ± 5 ° C. for a period of 15 s; according to n) to coat the chromium layer with palladium in a neutral bath at a cover current density of about 3 A / dm 2 at a temperature of 45 ± 5 ° C. for a period of 15 s; according to n) coating the chromium layer with rhodium in an acid bath at a cover current density of about 3 A / dm 2 at a temperature of 50 ± 5 ° C. for a period of 25 s; according to n) coating the chromium layer with ruthenium in an acid bath at a cover current density of about 3 A / dm 2 at a temperature of 70 ± 5 ° C. for a period of 20 s; according to p) the applied coatings at a temperature of 500 ... 1 100 ° C, preferably for gold, platinum, palladium, rhodium and ruthenium at a temperature of about 750 ° C, preferably for silver at a temperature of about 950 ° C to anneal for a period of 10 min.

Claims (15)

1. Molybdenum coated with precious metal, characterised thereby, that the precious metal is applied onto the molybdenum in a layer thickness of 0.02 to 1.0 microns, preferably 0.1 microns, over an intermediate layer of chrome with a layer thickness of 0.5 to 10.0 microns, preferably 1.5 microns.
2. Molybdenum coated with precious metal according to claim 1, characterised thereby, that gold, silver, platinum, palladium, rhodium or ruthenium is used as precious metal.
3. Process for the electro-plating of molybdenum with a layer sequence according to claim 1 or 2 characterised by the sequence of the following, partially known process steps :
a) Preliminary degreasing of the molybdenum in an organic solvent,
b) rinsing in water,
c) etching clean of the molybdenum,
d) rinsing in water,
e) repeating the etching clean according to c),
f) rinsing in water,
g) treating in an alkaline degreasing bath,
h) rinsing in water,
i) activation of the molybdenum surface,
j) electro-plating with chrome,
k) rinsing in water,
I) cathodic activation of the chrome layer,
m) rinsing in water,
n) electro-plating with the precious metal,
o) rinsing in water and
p) heating of the applied coatings under a protective hydrogen gas.
4. Process according to claim 3, characterised thereby, that etching according to c) is done at room temperature for a duration of 15 seconds in a solution of 1 part by volume of concentrated sulfuric acid, 1 part by volume of concentrated nitric acid and 3 parts by volume of concentrated phosphoric acid.
5. Process according to claim 3, characterised thereby, that treating according to g) is done at room temperature for a duration of 30 seconds at a current density of about 20 amps per square decimetre.
6. Process according to claim 3, characterised thereby, that the molybdenum surface is activated according to i) in concentrated hydrochloric acid at room temperature for a duration of about 15 seconds.
7. Process according to claim 3, characterised thereby, that the molybdenum is coated according to j) with chrome in a bath of 400 grams of Cr03 and 4 grams of H2S04 per litre at a current density of 15 amps per square decimetre at a temperature of 50 ± 5 °C for a duration of 8 minutes.
8. Process according to claim 3, characterised thereby, that the chrome layer is cathodically activated according to 1) in 1 to 15 % sulfuric acid, preferably 8 % sulfuric acid, at a current density of 2 to 40 amps per square decimetre, preferably 20 amps per square decimetre, at room temperature for a duration of 2 to 60 seconds, preferably 20 seconds.
9. Process according to claim 3, characterised thereby, that the chrome layer is coated according to n) with gold in a slightly acidic to neutral usual gold bath at a surface current density of about 3 amps per square decimetre at a temperature of 50 ± 5 °C for a duration of 10 seconds.
10. Process according to claim 3, characterised thereby, that the chrome layer is coated according to n) with silver in a cyanidic preliminary silver bath at a surface current density of about 2 amps per square decimetre at a temperature of 20 ± 3 °C for a duration of 20 seconds.
11. Process according to claim 3, characterised thereby, that the chrome layer is coated according to n) with platinum in an acidic bath at a surface current density of about 3 amps per square decimetre at a temperature of 50 ± 5 °C for a duration of 15 seconds.
12. Process according to claim 3, characterised thereby, that the chrome layer is coated according to n) with palladium in a neutral bath at a surface current density of about 3 amps per square decimetre at a temperature of 45 ± 5 °C for a duration of 15 seconds.
13. Process according to claim 3, characterised thereby, that the chrome layer is coated according to n) with rhodium in an acidic bath at a surface current density of about 3 amps per square decimetre at a temperature of 50 ± 5 °C for a duration of 25 seconds.
14. Process according to claim 3, characterised thereby, that the chrome layer is coated according to n) with ruthenium in an acidic bath at a surface current density of about 3 amps per square decimetre at a temperature of 70 ± 5 °C for a duration of 20 seconds.
15. Process according to claim 3, characterised thereby, that the applied coatings are heated according to p) for a duration of 10 minutes at a temperature of 500 to 1 100 °C, preferably at a temperature of about 750 °C in the case of gold, platinum, palladium, rhodium and ruthenium and preferably at a temperature of about 950 °C in the case of silver.
EP81108457A 1980-10-21 1981-10-17 Molybdenum coated with a noble metal and process for its production Expired EP0050343B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3039658 1980-10-21
DE19803039658 DE3039658A1 (en) 1980-10-21 1980-10-21 MOLYBDAEN COATED WITH PRECIOUS METAL AND METHOD FOR THE PRODUCTION THEREOF

Publications (2)

Publication Number Publication Date
EP0050343A1 EP0050343A1 (en) 1982-04-28
EP0050343B1 true EP0050343B1 (en) 1984-01-18

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EP (1) EP0050343B1 (en)
JP (1) JPS5794594A (en)
DE (1) DE3039658A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3214989A1 (en) * 1982-04-22 1983-11-10 Doduco KG Dr. Eugen Dürrwächter, 7530 Pforzheim ELECTRIC CONTACT PIECE COATED WITH PRECIOUS METAL OR A PRECIOUS METAL ALLOY
GB2130602B (en) * 1982-11-24 1986-04-16 Stc Plc Electroplating electrical contacts
GB2168381B (en) * 1984-12-12 1988-03-09 Stc Plc Gold plated electrical contacts
US5093280A (en) * 1987-10-13 1992-03-03 Northrop Corporation Refractory metal ohmic contacts and method
GB9107364D0 (en) * 1991-04-08 1991-05-22 Skw Metals Uk Ltd Coated molybdenum parts and process for their production
US5367195A (en) * 1993-01-08 1994-11-22 International Business Machines Corporation Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2697130A (en) * 1950-12-30 1954-12-14 Westinghouse Electric Corp Protection of metal against oxidation
US2886499A (en) * 1957-01-07 1959-05-12 Glenn R Schaer Protective metal coatings for molybdenum
US2928169A (en) * 1957-01-07 1960-03-15 John G Beach Electroplated articles having molybdenum base metal
GB959748A (en) * 1961-07-20 1964-06-03 Westinghouse Electric Corp Semiconductor device
DE1283970B (en) * 1966-03-19 1968-11-28 Siemens Ag Metallic contact on a semiconductor component
FR2120037B1 (en) * 1970-12-29 1977-08-05 Licentia Gmbh
JPS5525619B2 (en) * 1974-02-13 1980-07-07
US4082622A (en) * 1977-04-20 1978-04-04 Gte Automatic Electric Laboratories Incorporated Electrodeposition of ruthenium
US4071417A (en) * 1977-06-29 1978-01-31 Bell Telephone Laboratories, Incorporated Process for decreasing the porosity of gold
US4212907A (en) * 1979-03-22 1980-07-15 The United States Of America As Represented By The United States Department Of Energy Pre-treatment for molybdenum or molybdenum-rich alloy articles to be plated

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US4464441A (en) 1984-08-07
EP0050343A1 (en) 1982-04-28
JPH0365438B2 (en) 1991-10-11
DE3039658C2 (en) 1988-07-14
JPS5794594A (en) 1982-06-12
DE3039658A1 (en) 1982-05-06

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