DK200100156U3 - Cooling element and cooling device - Google Patents
Cooling element and cooling deviceInfo
- Publication number
- DK200100156U3 DK200100156U3 DK200100156U DKBA200100156U DK200100156U3 DK 200100156 U3 DK200100156 U3 DK 200100156U3 DK 200100156 U DK200100156 U DK 200100156U DK BA200100156 U DKBA200100156 U DK BA200100156U DK 200100156 U3 DK200100156 U3 DK 200100156U3
- Authority
- DK
- Denmark
- Prior art keywords
- cooling
- cooling device
- cooling element
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE20010663U DE20010663U1 (en) | 2000-06-15 | 2000-06-15 | Cooling element and cooling device |
Publications (1)
Publication Number | Publication Date |
---|---|
DK200100156U3 true DK200100156U3 (en) | 2001-07-27 |
Family
ID=7942891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK200100156U DK200100156U3 (en) | 2000-06-15 | 2001-06-14 | Cooling element and cooling device |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE20010663U1 (en) |
DK (1) | DK200100156U3 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040000394A1 (en) * | 2002-07-01 | 2004-01-01 | Chin-Kuang Luo | Heat-dissipating device |
DE10315299A1 (en) * | 2003-04-04 | 2004-10-14 | Hella Kg Hueck & Co. | Housing for circuit board and power components, has deformable thermally-conductive medium arranged between circuit board and base of other half of housing |
DE20307472U1 (en) | 2003-05-14 | 2003-08-14 | Richard Wöhr GmbH, 75339 Höfen | Unit for cooling housings, equipment cabinets has multi-layer cooling body with metal base plate with higher coefficient of thermal conductivity than aluminum, side plate of e.g. aluminum |
DE10335197B4 (en) * | 2003-07-30 | 2005-10-27 | Kermi Gmbh | Cooling device for an electronic component, in particular for a microprocessor |
DE102005016098A1 (en) * | 2005-04-08 | 2006-10-12 | Tq-Components Gmbh | Passive cooling system for e.g. industrial computer, has heat distribution plate arranged on module of computer device and interlocked with cooling body, and heat generating component arranged on support unit |
DE102008004961A1 (en) * | 2008-01-18 | 2009-07-23 | Marquardt Gmbh | Cooling body for electrical switch of e.g. grinder, has area resting and/or assigned to heat source, and another area turned to cooling agent, where material for former area has heat conductivity higher than material for latter area |
DE102009056290A1 (en) * | 2009-11-30 | 2011-06-09 | Alphacool Gmbh | Device for cooling e.g. micro processor, arranged on printed circuit board i.e. graphic card, of computer, has connecting unit i.e. blind hole, cooperating with another connecting unit i.e. thread, for removable mounting of coolers |
DE102011078460A1 (en) * | 2011-06-30 | 2013-01-03 | Robert Bosch Gmbh | Electronic circuit for dissipation of heat loss components |
DE102013219369A1 (en) * | 2013-09-26 | 2015-03-26 | Osram Opto Semiconductors Gmbh | Electronic device and method for manufacturing an electronic device |
DE102015215570A1 (en) * | 2015-08-14 | 2017-02-16 | Siemens Aktiengesellschaft | Heat sink for an electronic component and method for its production |
DE102015215571A1 (en) * | 2015-08-14 | 2017-02-16 | Siemens Aktiengesellschaft | Heat sink for an electronic component and method for its production |
-
2000
- 2000-06-15 DE DE20010663U patent/DE20010663U1/en not_active Expired - Lifetime
-
2001
- 2001-06-14 DK DK200100156U patent/DK200100156U3/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE20010663U1 (en) | 2000-10-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
UBP | Utility model lapsed |