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DK153337C - Fremgangsmaade til toer sensibilisering af en isolerende overflade - Google Patents

Fremgangsmaade til toer sensibilisering af en isolerende overflade

Info

Publication number
DK153337C
DK153337C DK150779A DK150779A DK153337C DK 153337 C DK153337 C DK 153337C DK 150779 A DK150779 A DK 150779A DK 150779 A DK150779 A DK 150779A DK 153337 C DK153337 C DK 153337C
Authority
DK
Denmark
Prior art keywords
sensitization
trans
procedures
insulating surface
insulating
Prior art date
Application number
DK150779A
Other languages
English (en)
Other versions
DK150779A (da
DK153337B (da
Inventor
Leo Gulvad Svendsen
Gunnar Soerensen
Original Assignee
Platonec Aps
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Platonec Aps filed Critical Platonec Aps
Priority to DK150779A priority Critical patent/DK153337C/da
Priority to ZA00802121A priority patent/ZA802121B/xx
Priority to IL59807A priority patent/IL59807A/xx
Priority to IE732/80A priority patent/IE49192B1/en
Priority to CA000349530A priority patent/CA1162778A/en
Priority to IT67559/80A priority patent/IT1128410B/it
Priority to DE8080900719T priority patent/DE3067809D1/de
Priority to JP55500874A priority patent/JPH0210593B2/ja
Priority to PCT/DK1980/000023 priority patent/WO1980002222A1/en
Publication of DK150779A publication Critical patent/DK150779A/da
Priority to EP80900719A priority patent/EP0026211B1/en
Priority to NO80803710A priority patent/NO154370C/no
Priority to US06/389,934 priority patent/US4504529A/en
Publication of DK153337B publication Critical patent/DK153337B/da
Application granted granted Critical
Publication of DK153337C publication Critical patent/DK153337C/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/22—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20
    • G03G15/225—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 using contact-printing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/65—Apparatus which relate to the handling of copy material
    • G03G15/6582—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching
    • G03G15/6585—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching by using non-standard toners, e.g. transparent toner, gloss adding devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0517—Electrographic patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemically Coating (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DK150779A 1979-04-11 1979-04-11 Fremgangsmaade til toer sensibilisering af en isolerende overflade DK153337C (da)

Priority Applications (12)

Application Number Priority Date Filing Date Title
DK150779A DK153337C (da) 1979-04-11 1979-04-11 Fremgangsmaade til toer sensibilisering af en isolerende overflade
IL59807A IL59807A (en) 1979-04-11 1980-04-10 Method for dry sensitization of an insulating substrate surface and powder to be used in the method
IE732/80A IE49192B1 (en) 1979-04-11 1980-04-10 A process for dry sensitization of an insulating surface
CA000349530A CA1162778A (en) 1979-04-11 1980-04-10 Method for dry sensitization of an insulating surface and powder to be used in the method
IT67559/80A IT1128410B (it) 1979-04-11 1980-04-10 Procedimento e polvere per sensibilizzazione a secco di una superficie isolante ai fini della deposizione non elettrolitica di un rivestimento metallico
ZA00802121A ZA802121B (en) 1979-04-11 1980-04-10 Method for dry sensitization of an insulating surface and powder to be used in the method
DE8080900719T DE3067809D1 (en) 1979-04-11 1980-04-11 A method for dry sensitization of an insulating surface
JP55500874A JPH0210593B2 (da) 1979-04-11 1980-04-11
PCT/DK1980/000023 WO1980002222A1 (en) 1979-04-11 1980-04-11 A method for drysensitization of an insulating surface and a powder for use with the method
EP80900719A EP0026211B1 (en) 1979-04-11 1980-10-23 A method for dry sensitization of an insulating surface
NO80803710A NO154370C (no) 1979-04-11 1980-12-09 Fremgangsmaate til toerr, selektiv sensibilisering av et isolerende substrats overflate.
US06/389,934 US4504529A (en) 1979-04-11 1982-06-18 Xerographic method for dry sensitization and electroless coating of an insulating surface and a powder for use with the method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DK150779A DK153337C (da) 1979-04-11 1979-04-11 Fremgangsmaade til toer sensibilisering af en isolerende overflade
DK150779 1979-04-11

Publications (3)

Publication Number Publication Date
DK150779A DK150779A (da) 1980-10-12
DK153337B DK153337B (da) 1988-07-04
DK153337C true DK153337C (da) 1988-11-14

Family

ID=8105559

Family Applications (1)

Application Number Title Priority Date Filing Date
DK150779A DK153337C (da) 1979-04-11 1979-04-11 Fremgangsmaade til toer sensibilisering af en isolerende overflade

Country Status (12)

Country Link
US (1) US4504529A (da)
EP (1) EP0026211B1 (da)
JP (1) JPH0210593B2 (da)
CA (1) CA1162778A (da)
DE (1) DE3067809D1 (da)
DK (1) DK153337C (da)
IE (1) IE49192B1 (da)
IL (1) IL59807A (da)
IT (1) IT1128410B (da)
NO (1) NO154370C (da)
WO (1) WO1980002222A1 (da)
ZA (1) ZA802121B (da)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK427780A (da) * 1980-10-10 1982-04-11 Neselco As Pulver til brug ved toer sensibilisering for stroemloes metallisering
DK148327C (da) * 1981-07-24 1985-11-04 Neselco As Pulver til brug ved toer sensibilisering for stroemloes metallisering
DE3134507A1 (de) * 1981-09-01 1983-03-17 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt "verfahren zur selektiven chemischen metallabscheidung"
DK153572C (da) * 1982-02-18 1988-12-19 Platonec Aps Pulver til brug ved toer aktivering for stroemloes metallisering, fremgangsmaade til fremstilling deraf samt anvendelse deraf
IT1184408B (it) * 1985-04-09 1987-10-28 Telettra Lab Telefon Processo per la fabbricazione di piastre e circuiti stampati,e prodotti relativi
US5244525A (en) * 1987-11-02 1993-09-14 Kimberly-Clark Corporation Methods for bonding, cutting and printing polymeric materials using xerographic printing of IR absorbing material
US4851320A (en) * 1988-05-23 1989-07-25 Tektronix, Inc. Method of forming a pattern of conductor runs on a dielectric sheet
US5213850A (en) * 1989-03-24 1993-05-25 Nippon Paint Co., Ltd. Process for plating a metallic deposit between functional pattern lines on a substrate
JP3266633B2 (ja) 1990-11-19 2002-03-18 ロクタイト．コーポレイション 光硬化性シリコーン組成物
US5269980A (en) * 1991-08-05 1993-12-14 Northeastern University Production of polymer particles in powder form using an atomization technique
DE4142658A1 (de) * 1991-12-19 1993-06-24 Siemens Ag Verfahren zum aufbringen von lot auf eine leiterplatte
US5304447A (en) * 1992-02-11 1994-04-19 Elf Technologies, Inc. Plateable toner and method for producing the same
DE4319759A1 (de) * 1993-06-15 1994-12-22 Bayer Ag Pulvermischungen zum Metallisieren von Substratoberflächen
DE19731346C2 (de) * 1997-06-06 2003-09-25 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und ein Verfahren zu deren Herstellung
DE19942054A1 (de) * 1999-09-03 2001-12-06 Schott Glas Verfahren zur Herstellung einer gedruckten Schaltung
WO2002099162A2 (en) * 2001-06-04 2002-12-12 Qinetiq Limited Patterning method
GB2381274A (en) * 2001-10-29 2003-04-30 Qinetiq Ltd High resolution patterning method
GB2382798A (en) * 2001-12-04 2003-06-11 Qinetiq Ltd Inkjet printer which deposits at least two fluids on a substrate such that the fluids react chemically to form a product thereon
US20040265531A1 (en) * 2003-06-30 2004-12-30 Mckean Dennis R. Sliders bonded by a debondable silicon-based encapsulant
EP2003939A1 (en) * 2007-06-14 2008-12-17 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Method for preparing a pattern for a 3-dimensional electric circuit
KR20120127599A (ko) * 2010-01-14 2012-11-22 더 리젠츠 오브 더 유니버시티 오브 캘리포니아 전기 전도성 나노구조의 박막을 성장시키기 위한 일반적 해법
AU2013329013B2 (en) 2012-10-12 2017-06-15 The Regents Of The University Of California Polyaniline membranes, uses, and methods thereto
PT2996799T (pt) 2013-05-15 2021-10-15 Univ California Membranas de polianilina formadas por inversão de fase para aplicações de osmose direta
MX2016013262A (es) 2014-04-08 2017-05-01 Univ California Membranas de filtración hidrofílicas a base de polianilina resistentes al cloro.

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NL157659B (nl) * 1967-09-22 1978-08-15 Philips Nv Werkwijze voor het langs fotografische weg vervaardigen van elektrisch geleidende koperpatronen.
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DE2159467A1 (de) * 1970-12-02 1972-07-13 Minolta Camera Kk Verfahren zur Herstellung eines flüssigen Entwicklers für die Elektrophotographie
US3745045A (en) * 1971-01-06 1973-07-10 R Brenneman Electrical contact surface using an ink containing a plating catalyst
US3880689A (en) * 1971-09-30 1975-04-29 Eastman Kodak Co Magnetic developer containing an electroless plating sensitizer, and method of using same
BE789988A (fr) * 1971-10-12 1973-04-12 Xerox Corp Composition de revelateur et procede pour son emploi
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JPS5187042A (da) * 1975-01-29 1976-07-30 Hitachi Metals Ltd
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US4042730A (en) * 1976-03-29 1977-08-16 Bell Telephone Laboratories, Incorporated Process for electroless plating using separate sensitization and activation steps
JPS5841760B2 (ja) * 1976-05-29 1983-09-14 神崎製紙株式会社 呈色剤の製造方法
NL7704238A (nl) * 1977-04-19 1978-10-23 Philips Nv Werkwijze voor het additief vervaardigen van bedradingspatronen.
US4307168A (en) * 1977-05-05 1981-12-22 Eastman Kodak Company Amplification of developed electrographic image patterns
JPS54126959A (en) * 1978-03-25 1979-10-02 Nippon Mektron Kk Method of producing circuit board

Also Published As

Publication number Publication date
IE49192B1 (en) 1985-08-21
DE3067809D1 (en) 1984-06-20
US4504529A (en) 1985-03-12
IE800732L (en) 1980-10-11
ZA802121B (en) 1981-04-29
DK150779A (da) 1980-10-12
IT8067559A0 (it) 1980-04-10
IL59807A (en) 1983-11-30
NO803710L (no) 1980-12-09
WO1980002222A1 (en) 1980-10-16
NO154370B (no) 1986-05-26
DK153337B (da) 1988-07-04
NO154370C (no) 1986-09-03
EP0026211A1 (en) 1981-04-08
JPS56500435A (da) 1981-04-02
CA1162778A (en) 1984-02-28
IT1128410B (it) 1986-05-28
JPH0210593B2 (da) 1990-03-08
EP0026211B1 (en) 1984-05-16

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