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DK0620246T3 - Molded polystyrene foam body - Google Patents

Molded polystyrene foam body

Info

Publication number
DK0620246T3
DK0620246T3 DK94105521T DK94105521T DK0620246T3 DK 0620246 T3 DK0620246 T3 DK 0620246T3 DK 94105521 T DK94105521 T DK 94105521T DK 94105521 T DK94105521 T DK 94105521T DK 0620246 T3 DK0620246 T3 DK 0620246T3
Authority
DK
Denmark
Prior art keywords
polystyrene foam
thermal conductivity
density
foam
rigid polystyrene
Prior art date
Application number
DK94105521T
Other languages
Danish (da)
Original Assignee
Algostat Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Algostat Gmbh & Co Kg filed Critical Algostat Gmbh & Co Kg
Application granted granted Critical
Publication of DK0620246T3 publication Critical patent/DK0620246T3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/0066—Use of inorganic compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2205/00—Foams characterised by their properties
    • C08J2205/10—Rigid foams
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2325/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Derivatives of such polymers
    • C08J2325/02—Homopolymers or copolymers of hydrocarbons
    • C08J2325/04—Homopolymers or copolymers of styrene
    • C08J2325/06—Polystyrene

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Mouldings produced from rigid polystyrene foam or polystyrene particle foam are used for insulation purposes. It has been found that rigid polystyrene foam having a density of less than 20 kg/m<3> has a higher thermal conductivity than rigid polystyrene foam having a higher density. The invention has the object of providing a moulding made from rigid polystyrene foam which has a density of less than 20 kg/m<3> and a favourable thermal conductivity. This object is achieved according to the invention by providing the rigid polystyrene foam with an athermanous material. The consequence of this is that corresponding mouldings having a density of less than 20 kg/m<3> have a thermal conductivity which is no greater or not significantly greater than the thermal conductivity of rigid polystyrene foam having a density of about 40 kg/m<3> with relatively low thermal conductivity. The invention is particularly suitable for sheet-like mouldings made from polystyrene particle foam for insulation in the construction (building) sector.
DK94105521T 1993-04-13 1994-04-09 Molded polystyrene foam body DK0620246T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9305431U DE9305431U1 (en) 1993-04-13 1993-04-13 Molded body made of polystyrene rigid foam

Publications (1)

Publication Number Publication Date
DK0620246T3 true DK0620246T3 (en) 1999-09-13

Family

ID=6891866

Family Applications (1)

Application Number Title Priority Date Filing Date
DK94105521T DK0620246T3 (en) 1993-04-13 1994-04-09 Molded polystyrene foam body

Country Status (4)

Country Link
EP (1) EP0620246B1 (en)
AT (1) ATE176261T1 (en)
DE (2) DE9305431U1 (en)
DK (1) DK0620246T3 (en)

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DE102011056228A1 (en) 2011-12-09 2013-06-13 Eckart Gmbh Polystyrene rigid foam with aluminum pigments, process for producing the polystyrene rigid foam and use thereof
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WO2014111628A2 (en) 2013-01-18 2014-07-24 Styrochem Finland Oy Method of producing polystyrene beads having low moisture content
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DE102013107987B4 (en) * 2013-07-25 2025-01-30 Beck+Heun Gmbh Molded part made of graphite-filled polystyrene and process for its production
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Also Published As

Publication number Publication date
DE59407717D1 (en) 1999-03-11
DE9305431U1 (en) 1994-08-11
EP0620246B1 (en) 1999-01-27
EP0620246A1 (en) 1994-10-19
ATE176261T1 (en) 1999-02-15

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