DE8903986U1 - Circuit board for optimal decoupling of circuits with digital ICs - Google Patents

Description

Title: Circuit board for optimal decoupling of circuits with digital ICs

The invention relates to a circuit board for decoupling circuits with digital ICs.

When decoupling circuits with digital ICs, so-called "decoupling or blocking capacitors" must be placed in front of each IC component, whereby low inductance and decoupling are required in order to prevent voltage drops when switching ICs.

The increasing speed of ICs places greater demands on effective filtering and decoupling.

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&psgr; The higher inrush currents and faster response

^: i Rise times of the integrated circuits generate higher

re voltage peaks. The high voltage peaks can

the proper functioning of the systems significantly

and must therefore be reliably suppressed. Effective decoupling, mainly at higher frequencies, can only be achieved by reducing the supply line inductance. With conventional ig decoupling or blocking capacitors, (Ne Inductance)

5f . tivity can only be reduced slightly by careful layout of the ■f printed circuits. The noise level

of the decoupling capacitors conventionally used on circuit boards is approximately 310 mVpp.

The present invention is based on the object

i| an additional circuit board for optimal development

coupling of circuits with digital ICs,

which reliably prevents voltage drops and ensures optimal decoupling, thus ensuring extremely low inductance and adaptation to all existing precision contact closures.

! To solve the problem, a circuit board of the type mentioned at the beginning is proposed, which is characterized by a board provided with an SMD capacitor and two conductor tracks connected to it and leading to the contacts to be decoupled, which can be equipped with all existing precision contact connections.

According to a particular embodiment, the circuit board according to the invention is adapted to the shape of the IC or the IC socket and has two of the number of contacts

contact pins of the IC or the socket, with the number of holes corresponding to the SMD capacitor

The conductor tracks are relatively wide and lead to the connections of the points to be decoupled.

According to a further embodiment, contact connections are inserted into the board and pass through it, which are adapted to the corresponding IC as an IC socket, whereby the contact connections to be decoupled are connected to the conductor tracks for the SMD capacitor.

According to a special embodiment, the relatively wide conductor tracks for the SMD capacitor can be connected to the diagonally arranged connection strips of the power supply and the ground of the IC.

The circuit board according to the invention achieves several advantages. For example, the circuit board can serve as a carrier for IC components. It can also be used as an additional component for easily retrofitting IC sockets or IC components or for retrofitting IC components, IC sockets or wrap contact connections already mounted or plugged into the circuit board.

The circuit board can also be marked with a so-called "Wrap ID pin identifier" (address label) and can simultaneously be used as a practical and time-saving aid in wire-wrap wiring.

Finally, the use of the capacitor IC socket allows direct insertion into the same holes of the memory IC, which significantly simplifies the layout during the manufacture of circuit boards and reduces the costs for

- 6 PCB production can be reduced.

Since the capacitor board or the capacitor IC socket is inserted into the same holes as the IC, the placement does not need to be taken into account in the circuit board layout. This means that the circuit board according to the invention can be inserted on any existing circuit board without any layout changes and no additional circuit board area is required in favor of increased packing density of up to 30 % .

The circuit board according to the invention will be explained in more detail using the drawings as examples of preferred embodiments.

In the drawings

Fig. 1 shows an embodiment of the circuit board according to the invention in perspective view.

Fig. 2 shows another embodiment of the circuit board according to the invention as an IC socket.

Fig. 3 shows a first application of the

Circuit board in conjunction with an IC and a printed circuit board in an exploded, perspective view.

Fig. 4 shows a similar view as Fig. 3 with a circuit board according to Fig. 1.

Fig. 5 shows a similar arrangement to Fig. 3 with another embodiment of the circuit board according to the invention.

Finally, Fig. 6 shows another possible application of the circuit board according to the invention.

As can be seen from Fig. 1, the circuit board according to the invention consists of a rectangular board body 1, for example made of epoxy resin or another suitable material, in this rectangular board body several holes 2 corresponding to the distance and arrangement of the pin contacts of an IC are made. Two relatively wide conductor tracks 3, 4 are applied to the board in the usual arrangement, which lead to the diagonal holes 5, 6 and are later connected there to the connections of the IC. The two relatively wide conductor tracks 3, 4 lead to an SMD decoupling capacitor 7. The shape and the geometric design and arrangement of the conductor tracks 3 and 4 can be arbitrary.

Fig. 2 shows another possible embodiment of the circuit board according to the invention. In this case, contact connections 9 are inserted into a slightly thicker plate 8 corresponding to the contact pins of the IC to be used, which pass through the board as an IC socket, whereby the two conductor tracks 3 and 4, which are connected to the SMD capacitor 7, lead to the two outer, diametrically opposed contact connections.

Fig. 3 shows a possible application of the circuit board shown in Fig. 1 according to the invention. The IC 10 is plugged with its contact pins 11 into the contact terminals 9 of the circuit board of the slightly thicker plate 8 serving as an IC socket. The entire arrangement is then inserted into the plated-through holes 12 of the

Printed circuit board 13 is inserted and connected to it by soldering in the usual and known manner.

Fig. 4 shows a possibility of connecting the IC 10 to the contact pins 11, whereby these are plugged into the contact connections 14 of an IC socket 15. A circuit board, as shown in Fig. 1, is plugged onto the contact connections 14 of the IC socket 15 from below in such a way that the contact connections 14 with their lower pins penetrate the holes 2' of the circuit board 1. The two conductor tracks 3 and 4 are connected via the diametrically opposite connections 14, to which the supply voltage and ground are connected. The whole is then plugged into the holes 12 of the circuit board 13 and connected to it in a known manner, for example by soldering.

A simplified embodiment is shown in Fig. 5. Here, the IC 10 is plugged directly onto the circuit board 1 with its connection pins, whereby the connection pins 11 run through the holes 2 of the circuit board and the diametrically running pins 11 are connected via the conductor tracks 3, 4 via the decoupling capacitor 7. The IC is then plugged directly into the holes 12 of the circuit board 13 and is soldered thereto, for example.

A reverse possibility is shown in Fig. 6. There, the IC 10 with its connections 11 is inserted directly into the holes 12 of the circuit board 13 and is soldered to it. From below, the circuit board 1 with its holes 2 is placed on through-pins 16 and is connected to the diametrically opposite connection pins 14 by soldering.

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The circuit board according to the invention can be provided with 14, 16, 18, 20, 22, 24, 28, 30, 32, 36, 40, 42, 48 and 64-pin connections for standard DIP ICs with diagonally arranged power supply and ground connections. Of course, versions with other power supply and ground connections are also possible. The base material for the circuit board according to the invention can consist of epoxy resin with a thickness of 0.5 to 1.5 mm.

The circuit board according to the invention can also be used for other IC components, pin grid array sockets as well as PLCC and LCC sockets.

Claims (3)

PATENT ATTORNEYS '";··;"· { , ."..". T.Wb«C0722i>2 24 87 ZIPSE + HABERSÄCK ^: .. ^: T ' ^: .. ^: ."* ^T -&mdash;~ «&trade;»&trade; Tatax O7 813&Ogr;7 dpM d REPRESENTATIVES ARRANGED AT THE EUROPEAN PATENT OFFICE I&mdash;ni»«12 DIPL -ING. H.-J. HABERSACK. MÖNCHEN ' DIPL.·PHYS. E. ZIPSE. BADEN-BADEN D-757O BADEN-BADEN HALLER, Manfred and NAGEH, Wolfgang PROTECTION CLAIMS 1. Circuit board for the optimal decoupling of circuits with digital ICs, characterized by a board (1) provided with an SMD capacitor (7) and two conductor tracks connected to it and leading to the points to be decoupled (3, 4), which can be equipped with all existing precision contact connections. 2. Circuit board according to claim 1, characterized in that the board is adapted to the shape of the IC or the IC socket and has a number of holes (2) corresponding to the number of contact pins (11) of the IC (IO) or the contact terminals (14) of the IC socket (15), the conductor tracks leading to the SMD capacitor (7) being relatively wide and leading to the terminals of the points to be decoupled. 3. Circuit board according to claim 1, characterized &bull; · It's me » · I I < I I S > characterized in that the circuit board (8) is adapted to the IC (10) and is provided with contact connections (9) passing through the circuit board as an IC socket, wherein the contact connections (9) to be decoupled are connected to the conductor tracks (3, 4) leading to the SMD capacitor (7). Circuit board according to claim 1, 2 or 3, characterized in that the relatively wide conductor tracks (3, 4) for the SMD capacitor (7) are connected to the diametrically opposite terminals for the voltage supply and the ground.