DE8716103U1 - Measuring resistor for temperature measurements - Google Patents
Measuring resistor for temperature measurementsInfo
- Publication number
- DE8716103U1 DE8716103U1 DE8716103U DE8716103U DE8716103U1 DE 8716103 U1 DE8716103 U1 DE 8716103U1 DE 8716103 U DE8716103 U DE 8716103U DE 8716103 U DE8716103 U DE 8716103U DE 8716103 U1 DE8716103 U1 DE 8716103U1
- Authority
- DE
- Germany
- Prior art keywords
- measuring resistor
- temperature measurements
- contact surfaces
- resistance layer
- conductor tracks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000009529 body temperature measurement Methods 0.000 title claims description 7
- 239000004020 conductor Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/021—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient formed as one or more layers or coatings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
- G01K7/183—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer characterised by the use of the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Electromagnetism (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Description
Degussa Aktiengesellschaft 87 224 ETDegussa Aktiengesellschaft 87 224 ET
Weissfrauenstr.äftev'fcOOO: F.fajikfü'r.f'aim Main -,Weissfrauenstr.äftev'fcOOO: F.fajikfür'r.f'aim Main -,
Die Neuerung betrifft einen Heßwiderstand für Temperaturmessungen, bestehend aus einem aLs Träger dienenden KeramikpLättchen mit einem dünnen Metallüberzug als Widerstandsschicht und Kontaktflächen und &iacgr;-ner die Widerstandsschi ch'; schützenden Isolierschicht auf einer Lei terplati ne.The innovation concerns a heating resistor for temperature measurements, consisting of a ceramic plate serving as a carrier with a thin metal coating as a resistance layer and contact surfaces and an insulating layer protecting the resistance layer on a circuit board.
Plättchenförmige Meßwiderstände, bestehend aus einem Keramikp lättchen als Träger und einem dünnen Metallüberzug als Widerstandsschicht mit geeignet kontaktierten Anschlußdrähten sind an sich bekannt Cz. B. DE-PS 828 930, DE-OS 2 327 6562, DE-GM 7541295). Der Metallüberzug ist aufgeteilt in eine strukturierte Widerstandsschicht und daran anschließenden Kontaktflächen zum Anbringen der AnschLußdrähte . Die Verarbeitung der Meßwiderstände, besonders ihre Verlängerung mit Anschlußkabeln größeren Querschnitts, erfordert eine mechanische Entlastung der Verbindungsstellen zwischen der Widerstandsschicht b2w. Kontaktflächen und den Anschlußdrähten.Plate-shaped measuring resistors, consisting of a ceramic plate as a carrier and a thin metal coating as a resistance layer with suitably contacted connecting wires, are known per se (e.g. DE-PS 828 930, DE-OS 2 327 6562, DE-GM 7541295). The metal coating is divided into a structured resistance layer and adjoining contact surfaces for attaching the connecting wires. The processing of the measuring resistors, especially their extension with connecting cables with a larger cross-section, requires mechanical relief of the connection points between the resistance layer b2w. contact surfaces and the connecting wires.
Ein bekanntes Verfahren ist z. B. das überschmelzen der Bahnen einschließlich der Kontaktflächen und der Anschlußstellen der Drähte mit einer Glasur. Beim Abbiegen der Drähte z. B. senkrecht zur Oberfläche des Plä'ttchens bricht aber an der Austrittsstelle der Drähte die Glasur (Wegen der Kerb- und Schälwirkung der Drähte) nicht selten aus, so daß eine sichere Abstützung öer Drähte nicht gegeben ist.A well-known method is, for example, melting the tracks, including the contact surfaces and the connection points of the wires, with a glaze. When the wires are bent, for example perpendicular to the surface of the plate, the glaze often breaks off at the point where the wires exit (due to the notching and peeling effect of the wires), so that the wires are not securely supported.
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Il t > · ( I It > · ( I I
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'M <■■«·■■'M <■■«·■■
Es ist werter* bekannt, die mit Ansch lußdrähten versehenen Meßwiderstände auf einer Leiterplatine zu befestigen (Stecken/ !Klemmen, Kleben etc.) und die Anschlußdrähte auf Leiterbahnen anzulöten, an die später das Ansch luftkabel' ebenfalls gelötet wird. Die Verbindungsstelle der Widerstandsschicht bzw* der Kontaktflächen mit den Anscf.lußdrähten wird bei diesem Verfahren nur UhVoI Iständig mechanisch entlastet, weil bei aufgesteckten bzw. geklemmten Meßwiderständen durch thermische bzw. mechanische BeLastung Relativbewegungen zwischen Meßwiderstand und LeiterpLatine auftreten können, die wiederum die Verbindungsstelle belasten^ Darüberhinaus wird nicht selten beim Anlöten des Anschlußkabels d«r Anschlußdraht auf der Leiterbahn entlötet. Außerdem ist liese Methode umständlich und teuer.It is well known that the measuring resistors with connecting wires can be attached to a circuit board (plugging/clamping, gluing, etc.) and the connecting wires can be soldered onto conductor tracks to which the connecting cable is also later soldered. The connection point of the resistance layer or the contact surfaces with the connecting wires is only temporarily mechanically relieved with this method, because when plugged or clamped measuring resistors are attached, thermal or mechanical loading can cause relative movements between the measuring resistor and the circuit board, which in turn puts strain on the connection point. In addition, it is not uncommon for the connecting wire on the conductor track to be desoldered when the connecting cable is soldered on. This method is also complicated and expensive.
Aufgabe der vorliegenden Neuerung war es daher, einen Mefiwiderstand für Temperaturmessungen, bestehend aus einem als Träger dienenden Kermikplättchen mit einem dünnen Metallüberzug als Widerstandsschicht und Kontaktflächen und einer die Widerstandsschicht schützenden Isolierschicht auf einer Leiterplatine zu schaffen, bei dem eine sichere elektrische und mechanische Verbindung des Meßwiderstands mit einem Anschlußkabel gegeben ist und die Herstellung rait niedrigen Kosten und automatisierungsfreundlich möglich ist.The aim of this innovation was therefore to create a measuring resistor for temperature measurements, consisting of a ceramic plate serving as a carrier with a thin metal coating as a resistance layer and contact surfaces and an insulating layer protecting the resistance layer on a circuit board, which provides a secure electrical and mechanical connection of the measuring resistor to a connecting cable and which can be manufactured at low cost and in an automation-friendly manner.
die Kontaktflächen direkt elektrisch leitend und mechanisch fest mit Leiterbahnen der Leiterplatine verbunden sind.the contact surfaces are directly electrically conductive and mechanically firmly connected to the conductor tracks of the circuit board.
Vorzugsweise ist die Verbindung zwischen ders Kontaktflächen und den Leiterbahnen durch temperaturbeständige Leitkleber oder durch Lotpasten bzw. -pulver hergestellt.Preferably, the connection between the contact surfaces and the conductor tracks is made using temperature-resistant conductive adhesives or solder pastes or powders.
Die neuerungsgemäße Ausführung eines Dünnschicht-Meßwiderständes für Temperaturmessungen bringt den Vorteil/ daß die Widerstandsschicht über die KontaktfLachen elektrisch und mechanisch sicher mit der Leiterplatine verbunden ist, beim Anlöten des Arisch lußkabe L s diese Verbindung nicht gelöst Wird und die Herstellung einfach Und automatrsierungsfreundlich durchführbar ist.The innovative design of a thin-film measuring resistor for temperature measurements has the advantage that the resistance layer is electrically and mechanically securely connected to the circuit board via the contact surfaces, this connection is not broken when the Arisch flow cable is soldered on and the production is simple and easy to automate.
Bi e Abbildung zeigt scheinst isc'fi eine Be T§-ptei hafte Ausführungsform des neuerungsgemäßen Meßwiderstandes.The illustration shows what appears to be an advantageous embodiment of the new measuring resistor.
Das als träger dienende Kermikplättchen (1) ist mit einem dünnen Metallüberzug als Widerstandsschicht (7) und den beiden Kontaktflächen (2) versehen. Die Wicierstandsschi cht K7) ist mit einer Isolierschicht (3) abgedeckt. Die Verbindung (4) zwischen den Kontaktflächen (2) und den Leiterbahnen (5) der Leiterplatine (6) erfolgt mittels eines temperaturbeständigen Leitklebers.The ceramic plate (1) serving as a carrier is provided with a thin metal coating as a resistance layer (7) and the two contact surfaces (2). The resistance layer (K7) is covered with an insulating layer (3). The connection (4) between the contact surfaces (2) and the conductor tracks (5) of the circuit board (6) is made using a temperature-resistant conductive adhesive.
Claims (2)
dadurch gekennzeichnet,2. 'ratio resistor according to claim 1,
characterized,
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE8716103U DE8716103U1 (en) | 1987-12-05 | 1987-12-05 | Measuring resistor for temperature measurements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE8716103U DE8716103U1 (en) | 1987-12-05 | 1987-12-05 | Measuring resistor for temperature measurements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE8716103U1 true DE8716103U1 (en) | 1988-01-21 |
Family
ID=6814799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE8716103U Expired DE8716103U1 (en) | 1987-12-05 | 1987-12-05 | Measuring resistor for temperature measurements |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE8716103U1 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3939165C1 (en) * | 1989-11-27 | 1990-10-31 | Heraeus Sensor Gmbh, 6450 Hanau, De | Temp. sensor with measurement resistance - has ceramic disk with thin metallic coating as resistance layer, and plastic sheet conductor plate |
| WO1995008176A1 (en) * | 1993-09-15 | 1995-03-23 | Raychem Corporation | Electrical assembly comprising a ptc resistive element |
| WO1995031816A1 (en) * | 1994-05-16 | 1995-11-23 | Raychem Corporation | Electrical devices comprising a ptc resistive element |
| EP0809094A1 (en) * | 1996-05-24 | 1997-11-26 | Heraeus Sensor-Nite GmbH | Method for making a sensor device for temperature measurement |
| US5852397A (en) * | 1992-07-09 | 1998-12-22 | Raychem Corporation | Electrical devices |
| DE19640058C2 (en) * | 1996-09-30 | 1999-06-10 | Heraeus Sensor Nite Gmbh | Printed circuit board with strain relief for connection cables, processes for their manufacture and connection and their use |
| DE19750123C2 (en) * | 1997-11-13 | 2000-09-07 | Heraeus Electro Nite Int | Method for producing a sensor arrangement for temperature measurement |
| US6640420B1 (en) | 1999-09-14 | 2003-11-04 | Tyco Electronics Corporation | Process for manufacturing a composite polymeric circuit protection device |
| WO2008065093A2 (en) * | 2006-11-27 | 2008-06-05 | Endress+Hauser Wetzer Gmbh+Co. Kg | Device for determining and/or monitoring a process variable and method for contacting |
| DE102011103828A1 (en) | 2011-06-01 | 2012-12-06 | Heraeus Sensor Technology Gmbh | Method for manufacturing temperature sensor, involves providing strip conductor between contact field structures such that strip conductor is connected with printed circuit board through contact pad at which flip-chip is mounted |
| DE102011103827B4 (en) * | 2011-06-01 | 2014-12-24 | Heraeus Sensor Technology Gmbh | Method for producing a temperature sensor |
-
1987
- 1987-12-05 DE DE8716103U patent/DE8716103U1/en not_active Expired
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3939165C1 (en) * | 1989-11-27 | 1990-10-31 | Heraeus Sensor Gmbh, 6450 Hanau, De | Temp. sensor with measurement resistance - has ceramic disk with thin metallic coating as resistance layer, and plastic sheet conductor plate |
| US7355504B2 (en) | 1992-07-09 | 2008-04-08 | Tyco Electronics Corporation | Electrical devices |
| US6651315B1 (en) | 1992-07-09 | 2003-11-25 | Tyco Electronics Corporation | Electrical devices |
| US5852397A (en) * | 1992-07-09 | 1998-12-22 | Raychem Corporation | Electrical devices |
| EP1235233A2 (en) * | 1993-09-15 | 2002-08-28 | Tyco Electronics Corporation | Electrical devices |
| WO1995008176A1 (en) * | 1993-09-15 | 1995-03-23 | Raychem Corporation | Electrical assembly comprising a ptc resistive element |
| EP1235233A3 (en) * | 1993-09-15 | 2004-01-14 | Tyco Electronics Corporation | Electrical devices |
| US5831510A (en) * | 1994-05-16 | 1998-11-03 | Zhang; Michael | PTC electrical devices for installation on printed circuit boards |
| EP0853323A3 (en) * | 1994-05-16 | 1998-09-02 | Raychem Corporation | Electrical devices comprising a PTC resistive element |
| WO1995031816A1 (en) * | 1994-05-16 | 1995-11-23 | Raychem Corporation | Electrical devices comprising a ptc resistive element |
| US6292088B1 (en) | 1994-05-16 | 2001-09-18 | Tyco Electronics Corporation | PTC electrical devices for installation on printed circuit boards |
| US6082609A (en) * | 1996-05-24 | 2000-07-04 | Heraeus Electro-Nite International N.V. | Process for producing a sensor arrangement for measuring temperature |
| EP0809094A1 (en) * | 1996-05-24 | 1997-11-26 | Heraeus Sensor-Nite GmbH | Method for making a sensor device for temperature measurement |
| DE19640058C2 (en) * | 1996-09-30 | 1999-06-10 | Heraeus Sensor Nite Gmbh | Printed circuit board with strain relief for connection cables, processes for their manufacture and connection and their use |
| DE19750123C2 (en) * | 1997-11-13 | 2000-09-07 | Heraeus Electro Nite Int | Method for producing a sensor arrangement for temperature measurement |
| US6640420B1 (en) | 1999-09-14 | 2003-11-04 | Tyco Electronics Corporation | Process for manufacturing a composite polymeric circuit protection device |
| WO2008065093A2 (en) * | 2006-11-27 | 2008-06-05 | Endress+Hauser Wetzer Gmbh+Co. Kg | Device for determining and/or monitoring a process variable and method for contacting |
| WO2008065093A3 (en) * | 2006-11-27 | 2009-01-22 | Endress & Hauser Wetzer Gmbh | Device for determining and/or monitoring a process variable and method for contacting |
| DE102011103828A1 (en) | 2011-06-01 | 2012-12-06 | Heraeus Sensor Technology Gmbh | Method for manufacturing temperature sensor, involves providing strip conductor between contact field structures such that strip conductor is connected with printed circuit board through contact pad at which flip-chip is mounted |
| DE102011103827B4 (en) * | 2011-06-01 | 2014-12-24 | Heraeus Sensor Technology Gmbh | Method for producing a temperature sensor |
| DE102011103828B4 (en) * | 2011-06-01 | 2017-04-06 | Heraeus Sensor Technology Gmbh | Mass production of small temperature sensors with flip chips |
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