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DE69217810D1 - Verfahren zur Herstellung eines warmleitenden Materials - Google Patents

Verfahren zur Herstellung eines warmleitenden Materials

Info

Publication number
DE69217810D1
DE69217810D1 DE69217810T DE69217810T DE69217810D1 DE 69217810 D1 DE69217810 D1 DE 69217810D1 DE 69217810 T DE69217810 T DE 69217810T DE 69217810 T DE69217810 T DE 69217810T DE 69217810 D1 DE69217810 D1 DE 69217810D1
Authority
DE
Germany
Prior art keywords
production
conductive material
thermally conductive
thermally
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69217810T
Other languages
English (en)
Other versions
DE69217810T2 (de
Inventor
Yasuyuki Nakamura
Makoto Kawakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Sumitomo Special Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP29249591A external-priority patent/JPH05109947A/ja
Priority claimed from JP29249491A external-priority patent/JP3037485B2/ja
Application filed by Sumitomo Special Metals Co Ltd filed Critical Sumitomo Special Metals Co Ltd
Application granted granted Critical
Publication of DE69217810D1 publication Critical patent/DE69217810D1/de
Publication of DE69217810T2 publication Critical patent/DE69217810T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/227—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded with ferrous layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/12917—Next to Fe-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
DE69217810T 1991-10-12 1992-10-12 Verfahren zur Herstellung eines warmleitenden Materials Expired - Fee Related DE69217810T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP29249591A JPH05109947A (ja) 1991-10-12 1991-10-12 熱伝導材料とその製造方法
JP29249491A JP3037485B2 (ja) 1991-10-12 1991-10-12 熱伝導材料とその製造方法

Publications (2)

Publication Number Publication Date
DE69217810D1 true DE69217810D1 (de) 1997-04-10
DE69217810T2 DE69217810T2 (de) 1997-10-09

Family

ID=26559022

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69217810T Expired - Fee Related DE69217810T2 (de) 1991-10-12 1992-10-12 Verfahren zur Herstellung eines warmleitenden Materials

Country Status (3)

Country Link
US (1) US5358795A (de)
EP (1) EP0537965B1 (de)
DE (1) DE69217810T2 (de)

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* Cited by examiner, † Cited by third party
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US5681663A (en) * 1995-06-09 1997-10-28 Ford Motor Company Heatspreader carrier strip
WO1997012397A1 (en) * 1995-09-27 1997-04-03 Texas Instruments Incorporated Microelectronic assemblies including z-axis conductive films
JPH09312361A (ja) * 1996-05-22 1997-12-02 Hitachi Metals Ltd 電子部品用複合材料およびその製造方法
US6168873B1 (en) 1997-05-29 2001-01-02 Canon Kabushiki Kaisha Electrode substrate and recording medium
US6129993A (en) * 1998-02-13 2000-10-10 Hitachi Metals, Ltd. Heat spreader and method of making the same
DE19812729A1 (de) * 1998-03-24 1999-09-30 Bosch Gmbh Robert Elektromotor, insbesondere mit einem Lüfterrad zur Bildung eines Axial- oder Radiallüfters
US6326685B1 (en) * 1998-05-04 2001-12-04 Agere Systems Guardian Corp. Low thermal expansion composite comprising bodies of negative CTE material disposed within a positive CTE matrix
US6207294B1 (en) * 1999-04-30 2001-03-27 Philip A. Rutter Self-sharpening, laminated cutting tool and method for making the tool
JP2003064451A (ja) * 2001-06-11 2003-03-05 Hitachi Ltd 複合傾斜合金板とその製造方法およびこの複合傾斜合金板を用いたシャドウマスクを備えたカラー陰極線管
DE10137652C1 (de) * 2001-08-03 2003-03-20 Schleicher Walter Wärmeableitmittel zum Ableiten von Wärme einer Wärmequelle
JP4062994B2 (ja) * 2001-08-28 2008-03-19 株式会社豊田自動織機 放熱用基板材、複合材及びその製造方法
JP2003292908A (ja) * 2002-04-02 2003-10-15 Three M Innovative Properties Co 導電性及び熱伝導性を有する熱硬化型接着シート
JP4471646B2 (ja) * 2003-01-15 2010-06-02 株式会社豊田自動織機 複合材及びその製造方法
US7527090B2 (en) * 2003-06-30 2009-05-05 Intel Corporation Heat dissipating device with preselected designed interface for thermal interface materials
EP1524690B1 (de) * 2003-10-13 2009-03-11 Infineon Technologies AG Halbleitergehäuse mit Wärmeverteiler
US7416789B2 (en) * 2004-11-01 2008-08-26 H.C. Starck Inc. Refractory metal substrate with improved thermal conductivity
US7328508B2 (en) * 2005-07-05 2008-02-12 International Business Machines Corporation Anisotropic heat spreading apparatus and method for semiconductor devices
JP3862737B1 (ja) * 2005-10-18 2006-12-27 栄樹 津島 クラッド材およびその製造方法、クラッド材の成型方法、クラッド材を用いた放熱基板
WO2007105580A1 (ja) 2006-03-13 2007-09-20 Kabushiki Kaisha Toyota Jidoshokki パワーモジュール用ベース
US20080008216A1 (en) * 2006-07-07 2008-01-10 Newport Corporation Laser device including heat sink with insert to provide a tailored coefficient of thermal expansion
US20080008217A1 (en) * 2006-07-07 2008-01-10 Newport Corporation Laser device including heat sink with a tailored coefficient of thermal expansion
US20090208722A1 (en) * 2008-02-18 2009-08-20 John Francis Timmerman Oriented Members for Thermally Conductive Interface Structures
US7956446B2 (en) * 2008-05-13 2011-06-07 Infineon Technologies Ag Semiconductor device and method
JP5120284B2 (ja) * 2009-02-04 2013-01-16 株式会社豊田自動織機 半導体装置
US20110070459A1 (en) * 2009-09-18 2011-03-24 Irwin In Kim Thermal Management System
US9756764B2 (en) 2011-08-29 2017-09-05 Aerovironment, Inc. Thermal management system for an aircraft avionics bay
US9067287B2 (en) 2011-08-29 2015-06-30 Aerovironment, Inc. Method of manufacturing a heat transfer system for aircraft structures
US8995131B2 (en) 2011-08-29 2015-03-31 Aerovironment, Inc. Heat transfer system for aircraft structures
US9716055B2 (en) * 2012-06-13 2017-07-25 International Business Machines Corporation Thermal interface material (TIM) with thermally conductive integrated release layer
CN104703383B (zh) * 2013-12-10 2018-02-02 深南电路有限公司 加工印刷电路板的方法和印刷电路板
US10307861B2 (en) 2014-12-27 2019-06-04 Cooler Master Corp. Bonded aluminum-dissimilar metal structure and method of making same
CN107580377B (zh) * 2017-08-09 2024-07-09 东莞市瑞迪三维电子科技有限公司 一种改变电热膜片区域加热温度的方法及利用该方法生产的微型电热片

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4283464A (en) * 1979-05-08 1981-08-11 Norman Hascoe Prefabricated composite metallic heat-transmitting plate unit
US4427993A (en) * 1980-11-21 1984-01-24 General Electric Company Thermal stress relieving bimetallic plate
JPH01290245A (ja) * 1988-05-18 1989-11-22 Sumitomo Special Metals Co Ltd 放熱基板
CA1316303C (en) * 1988-12-23 1993-04-20 Thijs Eerkes Composite structure
JPH02113817U (de) * 1989-02-22 1990-09-12
JPH02231751A (ja) * 1989-03-03 1990-09-13 Sumitomo Special Metals Co Ltd リードフレーム用材料
EP0432867B1 (de) * 1989-12-12 1996-09-04 Sumitomo Special Metal Co., Ltd. Verfahren zur Herstellung eines wärmeleitenden Mischmaterial

Also Published As

Publication number Publication date
DE69217810T2 (de) 1997-10-09
EP0537965A3 (en) 1993-07-14
US5358795A (en) 1994-10-25
EP0537965B1 (de) 1997-03-05
EP0537965A2 (de) 1993-04-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: FEDER WALTER EBERT PATENTANWAELTE, 40237 DUESSELDO

8339 Ceased/non-payment of the annual fee