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DE69203745D1 - Kontakt in elektrischem Bauteilsockel. - Google Patents

Kontakt in elektrischem Bauteilsockel.

Info

Publication number
DE69203745D1
DE69203745D1 DE69203745T DE69203745T DE69203745D1 DE 69203745 D1 DE69203745 D1 DE 69203745D1 DE 69203745 T DE69203745 T DE 69203745T DE 69203745 T DE69203745 T DE 69203745T DE 69203745 D1 DE69203745 D1 DE 69203745D1
Authority
DE
Germany
Prior art keywords
contact
electrical component
component base
base
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69203745T
Other languages
English (en)
Inventor
Noriyuki Matsuoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaichi Electronics Co Ltd
Original Assignee
Yamaichi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaichi Electronics Co Ltd filed Critical Yamaichi Electronics Co Ltd
Application granted granted Critical
Publication of DE69203745D1 publication Critical patent/DE69203745D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/10—Sockets for co-operation with pins or blades
    • H01R13/11—Resilient sockets
    • H01R13/112—Resilient sockets forked sockets having two legs
DE69203745T 1991-02-19 1992-02-03 Kontakt in elektrischem Bauteilsockel. Expired - Lifetime DE69203745D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3103656A JPH07109780B2 (ja) 1991-02-19 1991-02-19 電気部品用ソケットにおけるコンタクト

Publications (1)

Publication Number Publication Date
DE69203745D1 true DE69203745D1 (de) 1995-09-07

Family

ID=14359826

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69203745T Expired - Lifetime DE69203745D1 (de) 1991-02-19 1992-02-03 Kontakt in elektrischem Bauteilsockel.

Country Status (7)

Country Link
US (1) US5286208A (de)
EP (1) EP0500227B1 (de)
JP (1) JPH07109780B2 (de)
KR (1) KR950009900B1 (de)
CA (1) CA2060632A1 (de)
DE (1) DE69203745D1 (de)
MY (1) MY108180A (de)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7063541B2 (en) 1997-03-17 2006-06-20 Formfactor, Inc. Composite microelectronic spring structure and method for making same
DE69908638T2 (de) * 1998-12-02 2004-04-29 Formfactor, Inc., Livermore Lithographische kontaktstrukturen
US6491968B1 (en) 1998-12-02 2002-12-10 Formfactor, Inc. Methods for making spring interconnect structures
US6672875B1 (en) * 1998-12-02 2004-01-06 Formfactor, Inc. Spring interconnect structures
US6056576A (en) * 1999-04-26 2000-05-02 Hon Hai Precision Ind. Co., Ltd. ZIF socket with top loading contacts
US6794890B1 (en) 1999-07-27 2004-09-21 Mitsubishi Denki Kabushiki Kaisha Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested
US6888362B2 (en) * 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US7189077B1 (en) 1999-07-30 2007-03-13 Formfactor, Inc. Lithographic type microelectronic spring structures with improved contours
US6780001B2 (en) * 1999-07-30 2004-08-24 Formfactor, Inc. Forming tool for forming a contoured microelectronic spring mold
US6939474B2 (en) * 1999-07-30 2005-09-06 Formfactor, Inc. Method for forming microelectronic spring structures on a substrate
US6672912B2 (en) * 2000-03-31 2004-01-06 Intel Corporation Discrete device socket and method of fabrication therefor
DE10027125A1 (de) * 2000-05-31 2001-12-06 Wabco Gmbh & Co Ohg Elektrischer Steckkontakt
US6501655B1 (en) 2000-11-20 2002-12-31 Intel Corporation High performance fin configuration for air cooled heat sinks
US6633484B1 (en) 2000-11-20 2003-10-14 Intel Corporation Heat-dissipating devices, systems, and methods with small footprint
AU2002236552A1 (en) * 2000-11-20 2002-05-27 Intel Corporation High performance heat sink configurations for use in high density packaging applications
US6388207B1 (en) 2000-12-29 2002-05-14 Intel Corporation Electronic assembly with trench structures and methods of manufacture
US6811406B2 (en) 2001-04-12 2004-11-02 Formfactor, Inc. Microelectronic spring with additional protruding member
US6671172B2 (en) * 2001-09-10 2003-12-30 Intel Corporation Electronic assemblies with high capacity curved fin heat sinks
US7265565B2 (en) 2003-02-04 2007-09-04 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
US10416192B2 (en) 2003-02-04 2019-09-17 Microfabrica Inc. Cantilever microprobes for contacting electronic components
US20080106280A1 (en) * 2003-02-04 2008-05-08 Microfabrica Inc. Vertical Microprobes for Contacting Electronic Components and Method for Making Such Probes
US7265562B2 (en) * 2003-02-04 2007-09-04 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
US7567089B2 (en) * 2003-02-04 2009-07-28 Microfabrica Inc. Two-part microprobes for contacting electronic components and methods for making such probes
WO2004102207A1 (ja) 2003-05-13 2004-11-25 Kabushiki Kaisha Nihon Micronics 通電試験用プローブ
TW200536039A (en) * 2003-12-31 2005-11-01 Microfabrica Inc Cantilever microprobes for contacting electronic components and methods for making such probes
JP4592292B2 (ja) * 2004-01-16 2010-12-01 株式会社日本マイクロニクス 電気的接続装置
CN2800519Y (zh) * 2005-04-28 2006-07-26 富士康(昆山)电脑接插件有限公司 电连接器
JP2008196914A (ja) * 2007-02-09 2008-08-28 Micronics Japan Co Ltd プローブおよびプローブ組立体
US20090009197A1 (en) * 2007-07-02 2009-01-08 Kabushiki Kaisha Nihon Micronics Probe for electrical test
US7589547B2 (en) * 2007-09-13 2009-09-15 Touchdown Technologies, Inc. Forked probe for testing semiconductor devices
DE102008023761B9 (de) * 2008-05-09 2012-11-08 Feinmetall Gmbh Elektrisches Kontaktelement zum Berührungskontaktieren von elektrischen Prüflingen sowie entsprechende Kontaktieranordnung
US8089294B2 (en) * 2008-08-05 2012-01-03 WinMENS Technologies Co., Ltd. MEMS probe fabrication on a reusable substrate for probe card application
US7737714B2 (en) * 2008-11-05 2010-06-15 Winmems Technologies Holdings Co., Ltd. Probe assembly arrangement
US7928751B2 (en) * 2009-02-18 2011-04-19 Winmems Technologies Holdings Co., Ltd. MEMS interconnection pins fabrication on a reusable substrate for probe card application
JP4883215B1 (ja) * 2010-10-29 2012-02-22 オムロン株式会社 端子およびこれを用いたコネクタ
JP4811530B1 (ja) * 2010-11-04 2011-11-09 オムロン株式会社 端子およびこれを用いたコネクタ
JP5083427B2 (ja) * 2011-03-14 2012-11-28 オムロン株式会社 端子およびこれを用いたコネクタ
JP5083426B2 (ja) * 2011-03-14 2012-11-28 オムロン株式会社 端子およびこれを用いたコネクタ
US9702904B2 (en) 2011-03-21 2017-07-11 Formfactor, Inc. Non-linear vertical leaf spring
US9052342B2 (en) 2011-09-30 2015-06-09 Formfactor, Inc. Probe with cantilevered beam having solid and hollow sections
JP2014013184A (ja) * 2012-07-04 2014-01-23 Micronics Japan Co Ltd カンチレバー型プローブ集合体とそれを備えるプローブカード又はプローブユニット
US9086433B2 (en) * 2012-12-19 2015-07-21 International Business Machines Corporation Rigid probe with compliant characteristics
DE102017209510A1 (de) * 2017-06-06 2018-12-06 Feinmetall Gmbh Kontaktelementsystem
EP3499653B1 (de) * 2017-12-12 2021-08-18 Rasco GmbH Schützfeder und schützbuchse
US11262383B1 (en) 2018-09-26 2022-03-01 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US11973301B2 (en) 2018-09-26 2024-04-30 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US12078657B2 (en) 2019-12-31 2024-09-03 Microfabrica Inc. Compliant pin probes with extension springs, methods for making, and methods for using
US12000865B2 (en) 2019-02-14 2024-06-04 Microfabrica Inc. Multi-beam vertical probes with independent arms formed of a high conductivity metal for enhancing current carrying capacity and methods for making such probes
US11768227B1 (en) 2019-02-22 2023-09-26 Microfabrica Inc. Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers
JP2021028603A (ja) * 2019-08-09 2021-02-25 株式会社日本マイクロニクス 電気的接触子及び電気的接続装置
JP7353859B2 (ja) * 2019-08-09 2023-10-02 株式会社日本マイクロニクス 電気的接触子及び電気的接続装置
US11867721B1 (en) 2019-12-31 2024-01-09 Microfabrica Inc. Probes with multiple springs, methods for making, and methods for using
US11761982B1 (en) 2019-12-31 2023-09-19 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
US11774467B1 (en) 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188085A (en) * 1978-09-27 1980-02-12 Burroughs Corporation High density solder tail connector assembly for leadless integrated circuit packages
US4362353A (en) * 1980-05-27 1982-12-07 Amp Incorporated Contact clip for connecting a ceramic substrate to a printed circuit board
US4370012A (en) * 1980-11-20 1983-01-25 Amp Incorporated Electrical connector for circuit board or substrate
JPS61150249A (ja) * 1984-12-24 1986-07-08 Toshiba Corp 半導体装置用ソケツトピン
US4832617A (en) * 1988-03-31 1989-05-23 Foxx Conn International, Inc. Circuit board socket, contact and method of manufacture
CA1303175C (en) * 1988-04-27 1992-06-09 Imants R. Lauks Static-free interrogating connector for electric components
JP2602551B2 (ja) * 1989-06-13 1997-04-23 山一電機工業株式会社 バイパス片を有するコンタクト
US4959029A (en) * 1989-08-18 1990-09-25 Amp Incorporated Electrical contact
US4995816A (en) * 1989-09-29 1991-02-26 Amp Incorporated Pivotal electrical contact
US5100338A (en) * 1990-08-31 1992-03-31 Foxconn International, Inc. Contact for circuit board socket

Also Published As

Publication number Publication date
JPH07109780B2 (ja) 1995-11-22
EP0500227A2 (de) 1992-08-26
EP0500227A3 (en) 1992-11-25
US5286208A (en) 1994-02-15
EP0500227B1 (de) 1995-08-02
KR950009900B1 (ko) 1995-09-01
KR920017301A (ko) 1992-09-26
JPH0594856A (ja) 1993-04-16
MY108180A (en) 1996-08-30
CA2060632A1 (en) 1992-08-20

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Legal Events

Date Code Title Description
8332 No legal effect for de